American Microsystems, Inc. reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2.28.02
FS6244
FS6244FS6244
FS6244
Dual PLL Clock Generat or IC
Dual PLL Clock Generat or ICDual PLL Clock Generat or IC
Dual PLL Clock Generat or IC
ISO9001
ISO9001ISO9001
ISO9001
1.0 Features
Dual phase-locked loop (PLL) device with three out-
put clock frequencies
On-chip crystal oscillator for reference frequency
generation
3.3V or 5V supply voltage available
Small circuit board footprint (16-pin 0.150 SOIC)
Custom frequency selections available - contact your
local AMI Sales Representative for more information
Figure 1: Pin Configuration
116
2
3
4
5
6
7
8
15
14
13
12
11
10
9
n/c
XOUT
XIN
VDD
VSS
CLKA
n/c
n/c n/c
CLKC
VSS
n/c
VDD
CLKB
n/c
n/c
FS6244
16-pin (0.150) SOIC
2.0 Description
The FS6244 is a monolithic CMOS clock generator IC
designed to m inim ize cost a nd com ponen t count in digi tal
video/audio systems.
Two high-resolution phase-locked loops generate three
output clocks through an array of post-dividers. All fre-
quencies are ratiometrically derived from the crystal os-
cillator frequency. The locking of all the output frequen-
cies together can eliminate unpredictable artifacts in
video systems and reduce electromagnetic interference
(EMI) due to frequency harmonic stacking.
Table 1: Version Information
DEVICE VDD
(nom) FXIN
(MHz) CLKA
(MHz) CLKB
(MHz) CLKC
(MHz)
FS6244-03 5 27.000 11.2896
(+1.1 ppm) 3.6864 27.000
NOTE: Contact AMI for custom versions
Figure 2: Block Diagram
CRYSTAL
OSC.
FS6244
PLL
XOUT
XIN
CLKC
CLKA
DIVIDER
ARRAY
PLL
CLKB
22.28.02
FS6244
FS6244FS6244
FS6244
Dual PLL Clock Generat or IC
Dual PLL Clock Generat or ICDual PLL Clock Generat or IC
Dual PLL Clock Generat or IC
ISO9001
ISO9001ISO9001
ISO9001
Table 2: Pin Descriptions
Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DIU = Input with Internal Pull-Up; DID = Input with Internal Pull-Down; DIO = Digital Input/Output; DI-3 = Three-Level Digital Input,
DO = Digital Output; P = Power/Ground; # = Active Low pin
PIN TYPE NAME DESCRIPTION
1 - N/C No Connection
2 AO XOUT Crystal Oscillator Drive
3 AI XIN Crystal Oscillator Feedback
4 P VDD Power Supply (+3.3V or +5V)
5 P VSS Ground
6DOCLKAClock Output A
7 - N/C No Connection
8 - N/C No Connection
9 - N/C No Connection
10 DO CLKC Clock Output C
11 P VSS Ground
12 - N/C No Connection
13 P VDD Power Supply (+3.3V or +5V)
14 DO CLKB Clock Outp ut B
15 - N/C No Connection
16 - N/C No Connection
3.0 Functional Bl ock Descripti on
3.1 Phase-Locked Loop (PLL)
The on-chip PLLs are a standard frequency- and phase-
lock ed loop archi tec tur e. The PLL multip lies t he r ef er ence
oscillator to the desired frequency by a ratio of integers.
The frequency multiplication is exact with a zero synthe-
sis error unless otherwise indicated in the frequency ta-
ble.
3.2 Crystal Oscillator
The Crystal Oscillator provides a stable, low-jitter fre-
quenc y reference f or the rest of the FS62 44 system com -
ponents. L oading c apacitanc e for the cr ystal is inter nal to
the FS6244. No external components (other than the
resonator itself) are required for operation of the crystal
oscillator.
32.28.02
FS6244
FS6244FS6244
FS6244
Dual VCXO Clock Generat or IC
Dual VCXO Clock Generat or ICDual VCXO Clock Generat or IC
Dual VCXO Clock Generat or IC
ISO9001
ISO9001ISO9001
ISO9001
4.0 Electrical Specifications
Table 3: Absolute Maximum Ratings
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at
these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance,
functionality, and reliability.
PARAMETER SYMBOL MIN. MAX. UNITS
Supply Voltage (VSS = ground) VDD VSS-0.5 7 V
Input Voltage, dc VIVSS-0.5 VDD+0.5 V
Output Voltage, dc VOVSS-0.5 VDD+0.5 V
Input Clamp Current, dc (V I < 0 or VI > V DD)I
IK -50 50 mA
Output Clamp Current, dc (VI < 0 or VI > VDD)I
OK -50 50 mA
Storage Temperature Range (non-condensing) TS-65 150 °C
Ambient Temperature Range, Under Bias TA-55 125 °C
Junction Temperature TJ125 °C
Lead Temperature (soldering, 10s) 260 °C
Input Static Disc harge Voltage Protection (MIL-STD 883E, Method 3015.7) 2 kV
CAUTION: ELECTROSTATIC SENSITIVE DEVICE
Permanent damage res ulting in a loss of functi onality or performance may occur if this devic e is subjected to a high-energy elec-
trostatic discharge.
Table 4: Operating Conditions
PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS
Supply Voltage (3.3 volt system) VDD SEE NOTE 1 3.0 3.3 3.6 V
Supply Voltage (5.0 volt system) VDD SEE NOTE 1 4.5 5.0 5.5 V
Ambient Operating Temperature Range TASEE NOTE 1 0 70 °C
Crystal Resonator Frequency fXTAL Fundam ental Mode 5 27 MHz
NOTE 1: These specifications represent generic FS6244 device capability. Device specifications for a particular version (i.e. FS6244-xx) are guaranteed only with the operating voltage and refer-
ence frequency specified in Version Information.
42.28.02
FS6244
FS6244FS6244
FS6244
Dual PLL Clock Generat or IC
Dual PLL Clock Generat or ICDual PLL Clock Generat or IC
Dual PLL Clock Generat or IC
ISO9001
ISO9001ISO9001
ISO9001
Table 5: DC Electrical Specifications (VDD = 3.3V nominal)
Unless otherwise stated, VDD = 3.3V ± 10%, no load on any output, and ambient temperature range TA = 0°C to 70°C. Parameters denoted with an asterisk ( * ) represent nominal characterization
data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are ± 3σ from typical. Negative currents indicate current flows out of the device.
PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS
Overall
Supply Current, Dynamic, with Loaded
Outputs IDD fXTAL = 27MHz; CL = 10pF, VDD = 3.3V
(depends on output frequenci es) 15 mA
Crystal Oscillator
Crystal Loadi ng Capaci tance CL(xtal) As seen by a crystal connected to XIN and
XOUT 17 pF
Crystal Dri ve Level RXTAL=20;200 uW
Crystal Oscillator Feedback (XIN)
Threshold Bias Voltage VTH 860 mV
High-Level Input Current IIH 34 µA
Low-Level Input Current IIL -21 µA
Crystal Oscillator Drive (XOUT)
High-Level Output Sourc e Current I OH V(XIN) = 0V, VO = 0V -0.5 mA
Low-Level Output Sink Current IOL V(XIN) = 3.3V, VO = 3.3V 15 mA
Clock Outputs (CLKx)
High-Level Output Sourc e Current * IOH VO = 2.0V -40 mA
Low-Level Output Sink Current * IOL VO = 0.4V 17 mA
Short Circuit S ource Current * IOSH VO = 0V; shorted for 30s, max. -55 mA
Short Circuit S i nk Current * IOSL VO = 3.3V; shorted for 30s, max. 55 mA
52.28.02
FS6244
FS6244FS6244
FS6244
Dual VCXO Clock Generat or IC
Dual VCXO Clock Generat or ICDual VCXO Clock Generat or IC
Dual VCXO Clock Generat or IC
ISO9001
ISO9001ISO9001
ISO9001
Table 6: DC Electrical Specifications (VDD = 5V nominal)
Unless otherwise stated, VDD = 5.0V ± 10%, no load on any output, and ambient temperature range TA = 0°C to 70°C. Parameters denoted with an asterisk ( * ) represent nominal characterization
data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are ± 3σ from typical. Negative currents indicate current flows out of the device.
PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS
Overall
Supply Current, Dynamic, with Loaded
Outputs IDD fXTAL = 27MHz; CL = 10pF, VDD = 5.0V
(-03 version) 25 mA
Crystal Oscillator
Crystal Loadi ng Capaci tance CL(xtal) As seen by a crystal connected to XIN and
XOUT 17 pF
Crystal Dri ve Level RXTAL=20;300 uW
Crystal Oscillator Feedback (XIN)
Threshold Bias Voltage VTH 950 mV
High-Level Input Current IIH 50 µA
Low-Level Input Current IIL -21 µA
Crystal Oscillator Drive (XOUT)
High-Level Output Sourc e Current I OH V(XIN) = 0V, VO = 0V -1 mA
Low-Level Output Sink Current IOL V(XIN) = 5V, VO = 5V 20 mA
Clock Outputs (CLKx)
High-Level Output Sourc e Current * IOH VO = VDD –0.4V -25 mA
Low-Level Output Sink Current * IOL VO = 0.4V 25 mA
Short Circuit S ource Current * IOSH VO = 0V; shorted for 30s, max. -80 mA
Short Circuit S i nk Current * IOSL VO = 5V; shorted for 30s, max. 80 mA
62.28.02
FS6244
FS6244FS6244
FS6244
Dual PLL Clock Generat or IC
Dual PLL Clock Generat or ICDual PLL Clock Generat or IC
Dual PLL Clock Generat or IC
ISO9001
ISO9001ISO9001
ISO9001
Table 7: AC Timing Specifications (VDD = 3.3V nominal)
Unless otherwise stated, VDD = 3.3V ± 10%, no load on any output, and ambient temperature range TA = 0°C to 70°C. Parameters denoted with an asterisk ( * ) represent nominal characterization
data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are ± 3σ from typical.
PARAMETER SYMBOL CONDITIONS/DESCRIPTION CLOCK
(MHz) MIN. TYP. MAX. UNITS
Overall
Synthesis Error (unless otherwise noted in Frequency Table) 0 ppm
Clock Output (CLKx)
Duty Cycle * Ratio of high pulse width (as measured from rising edge
to next falling edge at VDD/2) to one clock period 45 55 %
Jitter, Period (peak-peak) * tj(P) From rising edge to next rising edge at
VDD/2, CL = 10pF 390 ps
Jitter, Long Term (σy(τ)) * tj(LT) From 0-500µs at VDD/2, CL = 10pF
compared to ideal clock source 155 ps
Rise Time * trVDD = 3.3V; VO = 0.3V to 3.0V; CL = 10pF 1.7 ns
Fall Time * tfVDD = 3.3V; VO = 3.0V to 0.3V; CL = 10pF 1.7 ns
Table 8: AC Timing Specifications (VDD = 5V nominal)
Unless otherwise stated, VDD = 3.3V ± 10%, no load on any output, and ambient temperature range TA = 0°C to 70°C. Parameters denoted with an asterisk ( * ) represent nominal characterization
data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are ± 3σ from typical.
PARAMETER SYMBOL CONDITIONS/DESCRIPTION CLOCK
(MHz) MIN. TYP. MAX. UNITS
Overall
Synthesis Error (unless otherwise noted in Frequency Table) 0 ppm
Clock Output (CLKx)
Duty Cycle * Ratio of high pulse width (as measured from rising edge
to next falling edge at VDD/2) to one clock period 45 55 %
Jitter, Period (peak-peak) * tj(P) From rising edge to next rising edge at
VDD/2, CL = 10pF 390 ps
Jitter, Long Term (σy(τ)) * tj(LT) From 0-500µs at VDD/2, CL = 10pF
compared to ideal clock source 155 ps
Rise Time * trVDD = 5V; VO = 0.5V to 4.5V; CL = 10pF 1.0 ns
Fall Time * tfVDD = 5V; VO = 4.5V to 0.5V; CL = 10pF 1.0 ns
72.28.02
FS6244
FS6244FS6244
FS6244
Dual VCXO Clock Generat or IC
Dual VCXO Clock Generat or ICDual VCXO Clock Generat or IC
Dual VCXO Clock Generat or IC
ISO9001
ISO9001ISO9001
ISO9001
5.0 Package Information
Table 9: 16-pin SOIC (0.150") Package Dimensions
DIMENSIONS
INCHES MILLIMETERS
MIN. MAX. MIN. MAX.
A 0.061 0.068 1.55 1.73
A1 0.004 0.0098 0.102 0.249
A2 0.055 0.061 1.40 1.55
B 0.013 0.019 0.33 0.49
C 0.0075 0.0098 0.191 0.249
D 0.386 0.393 9.80 9.98
E 0.150 0.157 3.81 3.99
e 0.050 BSC 1.27 BSC
H 0.230 0.244 5.84 6.20
h 0.010 0.016 0.25 0.41
L 0.016 0.035 0.41 0.89
Θ0°8°0°8°
Be
DA
1
SEATING PLANE
HE
16
1ALL RADII:
0.005" TO 0.01"
BASE PLANE
A
2
C
L
θ
7° typ.h x 45°
A
AMERICAN MICROSYSTEMS, INC.
R
Table 10: 16-pin SOIC (0.150") Package Characteristics
PARAMETER SYMBOL CONDITIONS/DESCRIPTION TYP. UNITS
Thermal Impedance, Junction to Free-Air
16-pin 0.150” SOIC ΘJA Air flow = 0 m/s 109 °C/W
Corner lead 4.0
Lead Inductanc e, Self L11 Center lead 3.0 nH
Lead Inductanc e, Mutual L12 Any lead to any adjacent l ead 0.4 nH
Lead Capacitance, Bulk C11 Any lead to VSS 0.5 pF
82.28.02
FS6244
FS6244FS6244
FS6244
Dual PLL Clock Generat or IC
Dual PLL Clock Generat or ICDual PLL Clock Generat or IC
Dual PLL Clock Generat or IC
ISO9001
ISO9001ISO9001
ISO9001
6.0 Ordering Information
Table 11: Device Ordering Codes
ORDERING CODE DEVICE NUM BER P ACKAGE TYPE OPERATING
TEMPERATURE R ANGE SHIPPING
CONFIGURATION
11640-821 FS6244-03 16-pin (0.150”) S OIC
(Small Outl i ne Package) 0°C to 70°C (Commercial) Tape and Reel
11640-831 FS6244-03 16-pin (0.150”) S OIC
(Small Outl i ne Package) 0°C to 70°C (Commercial) Tubes
7.0 Revision Information
DATE PAGE DESCRIPTION
4/24/00 5, 7 Fixed formatti ng errors
Copyright © 1999, 2000 American Microsystems, Inc.
Devices sold by AMI are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMI
makes no warranty, express, statutory implied or by description, regarding the information set forth herein or regarding the freedom
of the described devices from patent infringement. AMI makes no warranty of merchantability or fitness for any purposes. AMI re-
serves the right to discontinue production and change specifications and prices at any time and without notice. AMI’s products are
intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental require-
ments, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recom-
mended without additional processing by AMI for such applications.
American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, ID 83201, (208) 233-4690, FAX (208) 234-6796,
WWW Address: http://www.amis.com E-mail: tgp@amis.com