TC1262 500mA Fixed Output CMOS LDO 2 TC1262 1 3 3-Pin SOT-223 Tab is GND Front View Device Selection Table TC1262 Part Number Package Junction Temp. Range TC1262-xxVDB 3-Pin SOT-223 -40C to +125C TC1262-xxVAB 3-Pin TO-220 -40C to +125C TC1262-xxVEB 3-Pin DDPAK -40C to +125C NOTE: xx indicates output voltages. Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0. Other output voltages are available. Please contact Microchip Technology Inc. for details. 3 VOUT 2 GND 1 VIN 2 3 GND 1 Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers Tab is GND TC1262 VIN * * * * * * * Front View Tab is GND VOUT Applications 3-Pin DDPAK 3-Pin TO-220 VIN Very Low Dropout Voltage 500mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Over Current and Over Temperature Protection GND * * * * * Package Type VOUT Features General Description The TC1262 is a fixed output, high accuracy (typically 0.5%) CMOS low dropout regulator. Designed specifically for battery-operated systems, the TC1262's CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 80A at full load (20 to 60 times lower than in bipolar regulators). TC1262 key features include ultra low noise operation, very low dropout voltage (typically 350mV at full load), and fast response to step changes in load. The TC1262 incorporates both over temperature and over current protection. The TC1262 is stable with an output capacitor of only 1F and has a maximum output current of 500mA. It is available in 3-Pin SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages. Typical Application VIN VIN VOUT TC1262 VOUT + C1 1F GND 2002-2012 Microchip Technology Inc. DS21373C-page 1 TC1262 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Voltage.................. (VSS - 0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 6) Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V Operating Temperature Range...... -40C < TJ < 125C Storage Temperature..........................-65C to +150C *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1262 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT + 1V, IL = 100A, CL = 3.3F, TA = 25C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40C to +125C. Min Typ Max Units VIN Symbol Input Operating Voltage Parameter 2.7 -- 6.0 V IOUTMAX Maximum Output Current 500 -- -- mA VOUT Output Voltage -- -- VR 0.5% VR - 2.5% -- VR + 2.5% Test Conditions Note 7 V Note 1 Note 2 VOUT/T VOUT Temperature Coefficient -- 40 -- ppm/C VOUT/VIN Line Regulation -- .003 0.35 %/V VOUT/VOUT Load Regulation -- 0.002 0.01 %/mA VIN-VOUT Dropout Voltage -- -- -- 20 60 200 350 30 130 390 650 mV IDD Supply Current -- 80 130 A IL = 0 PSRR Power Supply Rejection Ratio -- 64 -- dB FRE 1kHz IOUTSC Output Short Circuit Current -- 1200 -- mA VOUT = 0V VOUT/PD Thermal Regulation -- 0.04 -- V/W Note 5 eN Output Noise -- 260 -- nV/Hz Note 1: 2: 3: 4: 5: 6: 7: (VR + 1V) VIN6V IL = 0.1mA to IOUTMAX (Note 3) IL = 100A IL = 100mA IL = 300mA IL = 500mA (Note 4) IL = IOUTMAX, FRE = 10kHz VR is the regulator output voltage setting. TC VOUT = (VOUTMAX - VOUTMIN) x 106 VOUT x T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to IOUTMAX. DS21373C-page 2 2002-2012 Microchip Technology Inc. TC1262 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (3-Pin SOT-223) (3-Pin TO-220) (3-Pin DDPAK) 3.0 Symbol Description Unregulated supply input. 1 VIN 2 GND Ground terminal. 3 VOUT Regulated voltage output. DETAILED DESCRIPTION 3.1 The TC1262 is a precision, fixed output LDO. Unlike bipolar regulators, the TC1262's supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to ILOADMAX load current range (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. FIGURE 3-1: TYPICAL APPLICATION CIRCUIT + + VIN C1 1F VOUT TC1262 Battery - + VOUT C2 1F Output Capacitor A 1F (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance greater than 0.1 and less than 5, and a resonant frequency above 1MHz. A 1F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. GND 2002-2012 Microchip Technology Inc. DS21373C-page 3 TC1262 4.0 THERMAL CONSIDERATIONS 4.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C. 4.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: EQUATION 4-1: PD (VINMAX - VOUTMIN)ILOADMAX Where: PD = Worst case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA). Table 4-1 and Table 4-2 show various values of JA for the TC1262 packages. THERMAL RESISTANCE GUIDELINES FOR TC1262 IN SOT-223 PACKAGE Board Area Thermal Resistance JA) 2500 sq mm 2500 sq mm 2500 sq mm 45C/W 1000 sq mm 2500 sq mm 2500 sq mm 45C/W 225 sq mm 2500 sq mm 2500 sq mm 53C/W 100 sq mm 2500 sq mm 2500 sq mm 59C/W 1000 sq mm 1000 sq mm 1000 sq mm 52C/W 1000 sq mm 55C/W 0 sq mm Board Area Thermal Resistance JA) 2500 sq mm 2500 sq mm 2500 sq mm 25C/W 1000 sq mm 2500 sq mm 2500 sq mm 27C/W 125 sq mm 35C/W 2500 sq mm 2500 sq mm *Tab of device attached to topside copper Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.3V 10% VOUTMIN = 2.7V 0.5% ILOADMAX = 275mA TJMAX = 125C TAMAX = 95C JA = 59C/W (SOT-223) Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: = 260mW Where all terms are previously defined. Copper Area (Backside) Copper Area (Backside) = [(3.3 x 1.1) - (2.7 x .995)]275 x 10-3 PDMAX = (TJMAX - TAMAX) JA Copper Area (Topside)* Copper Area (Topside)* THERMAL RESISTANCE GUIDELINES FOR TC1262 IN 3-PIN DDPAK/TO-220 PACKAGE PD (VINMAX - VOUTMIN)ILOADMAX EQUATION 4-2: TABLE 4-1: TABLE 4-2: 1000 sq mm Maximum allowable power dissipation: PDMAX = (TJMAX - TAMAX) JA = (125 - 95) 59 = 508mW In this example, the TC1262 dissipates a maximum of 260mW; below the allowable limit of 508mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN, is found by sustituting the maximum allowable power dissipation of 508mW into Equation 4-1, from which VINMAX = 4.6V. *Tab of device attached to topside copper DS21373C-page 4 2002-2012 Microchip Technology Inc. TC1262 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Line Regulation vs. Temperature Output Noise vs. Frequency 0.020 RLOAD = 50 COUT = 1F 0.018 0.0090 0.016 0.014 NOISE (V/Hz) LINE REGULATION (%) Load Regulation vs. Temperature 0.0100 10.0 LOAD REGULATION (%/mA) 5.0 0.012 0.010 0.008 0.006 1.0 0.1 0.004 0.002 0.000 -40C 0.0 0C 25C 70C 85C 125C 0.01 0.01 TEMPERATURE (C) 1 100 1000 0.0070 0.0060 0.0050 0.0040 IDD vs. Temperature 1mA to 500mA 2.5V 0.0030 0.0020 1mA to 500mA 5V 0.0010 0.0100 -40C 0C 5V 45 30 85C 0.40 DROPOUT VOLTAGE (V) 2.5V 75 DROPOUT VOLTAGE (V) 105 60 70C 25C 0.30 125C 125C 0C 0.20 -40C 0.10 0.40 85C 0.30 70C 25C 0.20 0C 0.10 -40C 15 0 -40C 0.00 0C 25C 70C 85C 125C 0.00 0 100 TEMPERATURE (C) 2.5V VOUT vs. Temperature IL = 0.1mA 2.50 VOUT (V) 2.30 IL = 300mA A IL = 500mA A 5.20 5.10 5.00 4.90 4.80 4.70 4.60 4.40 4.30 1.70 4.20 4.10 4.00 -40C 0C 25C 70C 85C 125C TEMPERATURE (C) 2002-2012 Microchip Technology Inc. 500 0 100 200 300 400 ILOAD (mA) 500 IL = 0.1mA IL IL 4.50 1.90 1.50 -40C 300 400 ILOAD (mA) 5.0V VOUT vs. Temperature 2.70 VOUT (V) 85C LOAD 0.50 125C 120 90 70C 2.5V Dropout Voltage vs. ILOAD 0.50 135 2.10 25C TEMPERATURE (C) FREQUENCY (kHz) 150 IDD (A) 10 0.0080 0C 25C 70C 85C 125C TEMPERATURE (C) DS21373C-page 5 TC1262 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Package marking data not available at this time. 6.2 Taping Form Component Taping Orientation for 3-Pin SOT-223 Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package 3-Pin SOT-223 Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 4000 13 in Component Taping Orientation for 3-Pin DDPAK Devices PIN 1 User Direction of Feed Device Marking W P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package 3-Pin DDPAK DS21373C-page 6 Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 24 mm 16 mm 750 13 in 2002-2012 Microchip Technology Inc. TC1262 6.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 3-Pin SOT-223 .264 (6.70) .248 (6.30) .122 (3.10) .114 (2.90) .287 (7.30) .146 (3.70) .264 (6.70) .130 (3.30) .041 (1.04) .033 (0.84) PIN 1 .091 (2.30) TYP. .031 (0.80) .024 (0.60) .071 (1.80) MAX. .013 (0.33) .009 (0.24) 10 MAX. .004 (0.10) .001 (0.02) .181 (4.60) TYP. .036 (0.91) MIN. Dimensions: inches (mm) 2002-2012 Microchip Technology Inc. DS21373C-page 7 TC1262 Package Dimensions (Continued) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 3-Pin TO-220 .185 (4.70) .165 (4.19) .113 (2.87) .103 (2.62) .410 (10.41) .357 (9.06) .156 (3.96) .146 (3.71) DIA. .055 (1.40) .045 (1.14) .258 (6.55) .230 (5.84) 3 - 7.5 5 PLCS. .594 (15.09) .569 (14.45) .244 (6.20) .234 (5.94) .560 (14.22) .518 (13.16) .055 (1.40) .045 (1.14) .020 (0.51) .012 (0.30) .037 (0.94) .027 (0.69) .105 (2.67) .095 (2.41) PIN 1 .115 (2.92) .095 (2.41) .205 (5.21) .195 (4.95) Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 3-Pin DDPAK .183 (4.65) .170 (4.32) .410 (10.41) .385 (9.78) .067 (1.70) .045 (1.14) .055 (1.40) .045 (1.14) 3 - 7 (5x) .370 (9.40) .330 (8.38) .605 (15.37) .549 (13.95) .010 (0.25) .000 (0.00) .051 (1.30) .049 (1.24) .026 (0.66) .014 (0.36) .110 (2.79) .068 (1.72) .037 (0.94) .026 (0.66) PIN 1 .100 (2.54) TYP. 8 MAX. Dimensions: inches (mm) DS21373C-page 8 2002-2012 Microchip Technology Inc. TC1262 7.0 REVISION HISTORY Revision C (November 2012) Added a note to each package outline drawing. 2002-2012 Microchip Technology Inc. DS21373C-page 9 TC1262 NOTES: DS21373C-page 10 2002-2012 Microchip Technology Inc. TC1262 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002-2012 Microchip Technology Inc. DS21373C-page11 TC1262 NOTES: DS21373C-page12 2002-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767788 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2002-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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