TGA2703-SM 3.5GHz WiMAX Driver / Power Amplifier Key Features * * * * * * * * * * 3.3-3.8 GHz Bandwidth 41 dBc IMR3 @ 21 dBm Pout/tone 24 dB Nominal Gain 30 dBm Nominal P1dB 2.5% EVM at 22 dBm output power 13 dB step attenuator function Power sample port -1.5V Vg voltage to shut down drain current Self bias: +6 V 770mA Package Dimensions: 5.0 x 5.0 x 0.9 mm QFN Primary Applications Preliminary Measured Data * Fixed Broadband Wireless * WiMAX Bias Conditions: Vd = +6 V Self Bias 30 General Description 25 S21 Demo boards are available. 15 10 5 0 -5 S11 -10 -15 S22 -20 3.3 3.4 3.5 3.6 3.7 3.8 Frequency (GHz) 35 34 Output Power (dBm) Lead-Free & RoHS compliant. S-Parameter (dB) 20 TGA2703-SM is a linear amplifier operating for 802.16 broadband wireless applications in 3.3 to 3.8 GHz frequency band. The PA delivers 24 dB of small-signal gain, 30dBm P1dB and 40 dBc IMR3 at 21 dBm output power per tone from a single +6V power supply. It has 2.5% EVM at 22 dBm output power. The TGA2703 incorporates a 13 dB step attenuator function and a power sampling port. The 50 ohm device requires minimum external components for operation, and is packaged in a low-cost, surface mount 5x5 QFN style package. 33 32 P2dB 31 P1dB 30 29 28 27 26 25 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 Frequency (GHz) Datasheet subject to change without notice TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 1 TGA2703-SM TABLE I MAXIMUM RATINGS 1/ SYMBOL Vd Vctrl PARAMETER VALUE NOTES Drain Voltage 7V 2/ Gain Control Voltage 7V Id Drain Current 1.1 A 2/ 3/ Ig Gate Current 6 mA 3/ PIN Input Continuous Wave Power PD Power Dissipation 7.7 W 2/ 4/ TCH Operating Channel Temperature 200 C 5/ Mounting Temperature (30 Seconds) 260 C TSTG 25 dBm Storage Temperature -65 to 150 C 1/ These ratings represent the maximum operable values for this device. 2/ Combinations of supply voltage, supply current, input power, and output power shall not exceed PD. 3/ Total current for the device. 4/ When operated at this bias condition with a base plate temperature of 85 C, the median life is 6.2E4. 5/ Junction operating temperature will directly affect the device median time to failure (Tm). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 2 TGA2703-SM TABLE II ELECTRICAL CHARACTERISTICS (Ta = 25 0C Nominal) Notes Response Frequency Band Drain Operating Voltage Small Signal Gain Input Return Loss Output Return Loss Control Gain Step Psat P1dB EVM Gain variation over temperature IMD3 TOI Units GHz V dB dB dB dB dBm dBm % dB/ oC dBc dBm Typical 3.3-3.8GHz 6 24 10 12 13 31.5 30 TBD 0.03 41 42 Pin at 11 dBm at 3.5 GHz, 23 dBm Pout at 21 dBm Pout/tone at 21 dBm Pout/tone TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 3 TGA2703-SM TABLE III THERMAL INFORMATION Parameter JC Thermal Resistance (channel to backside of package) Test Conditions Vd = 6V ID = 0.77 A Pdiss = 4.62 W TCH (C) JC (C/W) Tm (HRS) 145.5 13.1 3.8E+6 Note: Package backside soldered to carrier at 85 C baseplate temperature. Median Lifetime (Tm) vs. Channel Temperature TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 4 TGA2703-SM Measured Data Bias Conditions: Vd = 6 V, Id =770 mA Self Bias 30 S21 10 0 S11 -10 -20 S22 -30 2 2.5 3 3.5 4 4.5 5 Frequency (GHz) 35 34 Output Power (dBm) S Parameter (dB) 20 33 32 P2dB 31 P1dB 30 29 28 27 26 25 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 Frequency (GHz) TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 5 TGA2703-SM Measured Data Bias Conditions: Vd = 6 V, Id =770 mA Self Bias TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 6 TGA2703-SM Measured Data Bias Conditions: Vd = 6 V, Id =770 mA Self Bias 28 3.2GHz 24 3.3GHz PAE (%) 20 3.4GHz 16 3.5GHz 12 3.6GHz 3.7GHz 8 3.8GHz 4 0 -15 -10 -5 0 5 10 15 Pin (dBm) 1 Id (A) 0.9 0.8 0.7 3.2GHz 0.6 3.3GHZ 0.5 3.4GHz 0.4 3.5GHz 0.3 0.2 3.6GHz 0.1 3.8GHz 3.7GHz 0 -15 -10 -5 0 5 10 15 Pin (dBm) TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 7 TGA2703-SM Measured Data Bias Conditions: Vd = 6 V, Id =770 mA Self Bias TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 8 TGA2703-SM Package Layout Top View Bottom View TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 9 TGA2703-SM Package Pinout Diagram 22 28 21 1 GND 15 7 14 Top Side 8 Bottom Side Dot indicates Pin 1 Pin 1,2,3 4 5,6,7,8,9 10 11,13 12 15,16,17 Description NC RF Input NC Gain Control NC Gate Acess NC Pin 14 18 19,20,21 22 23,24,25 26 27,28 Description Power Sample RF Output NC Vd2 NC Vd1 NC TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 10 TGA2703-SM Mechanical Drawing (Bottom Side) 5.00 [0.197] 3.50 [0.138] 5.00 [0.197] 0.31 [0.012] 3.50 [0.138] 0.50 [0.02] 0.45 [0.02] Units: mm [Inch] Package tolerance: +/- 0.05 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 11 TGA2703-SM Recommended Board Layout Assembly 0.01uF 100pF * The evaluation board material is 20 mil thick RO4003 * 100 pF and 0.01 uF are required de-coupling capacitor TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 12 TGA2703-SM TGA2703 Bias Connection Self-biased mode 6V 4 inch or longer jumper Or 10nH inductor Connect gain control and Vg to ground. Apply +6V to Vd. Current will be ~770mA TGA2703 Bias Connection Gate control mode 6V Vg Connect gain control to ground. Apply negative voltage Vg. Apply +6V to Vd. Current will be ~770mA TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 13 TGA2703-SM TGA2703 Bias Connection Gain control mode 6V 6V 4 inch or longer jumper For 13 dB attenuation testing: or 10nH inductor Connect gain control to +6V and Vg to ground. Apply +6V to Vd. Current will be ~770mA 20 15 S-Parameter (dB) 10 5 0 -5 -10 -15 -20 -25 -30 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 Frequency (GHz) TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 14 TGA2703-SM Recommended Surface Mount Package Assembly Proper ESD precautions must be followed while handling packages. Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry. TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. Clean the assembly with alcohol. Typical Solder Reflow Profiles Reflow Profile SnPb Pb Free Ramp-up Rate 3 C/sec 3 C/sec Activation Time and Temperature 60 - 120 sec @ 140 - 160 C 60 - 180 sec @ 150 - 200 C Time above Melting Point 60 - 150 sec 60 - 150 sec Max Peak Temperature 240 C 260 C Time within 5 C of Peak Temperature 10 - 20 sec 10 - 20 sec Ramp-down Rate 4 - 6 C/sec 4 - 6 C/sec TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 15