SN74LS240N - Texas Instruments

SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

SN74LS240, SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244

OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SDLS144C − APRIL 1985 − REVISED MAY 2010

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D3-State Outputs Drive Bus Lines or Buffer

Memory Address Registers

DPNP Inputs Reduce DC Loading

DHysteresis at Inputs Improves Noise

Margins

description

These octal buffers and line drivers are designed

specifically to improve both the performance and

density of three-state memory address drivers,

clock drivers, and bus-oriented receivers and

transmitters. The designer has a choice of

selected combinations of inverting and

noninverting outputs, symmetrical, active-low

output-control (G) inputs, and complementary

output-control (G and G) inputs. These devices

feature high fan-out, improved fan-in, and 400-mV

noise margin. The SN74LS’ and SN74S’ devices

can be used to drive terminated lines down to

133 Ω.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

GND

VCC

2G/2G†

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

2A1

SN54LS’, SN54S’ ...J OR W PACKAGE

SN74LS240, SN74LS244 . . . DB, DW, N, OR NS PACKAGE

SN74LS241 ...DW, N, OR NS PACKAGE

SN74S’ . . . DW OR N PACKAGE

(TOP VIEW)

3 2 1 20 19

910111213

1Y1

2A4

1Y2

2A3

1Y3

1A2

2Y3

1A3

2Y2

1A4

SN54LS’, SN54S’ . . . FK PACKAGE

(TOP VIEW)

2Y4

1A1

1Y4

2A2 2G/2G

2Y1

GND

2A1

†2G for ’LS241 and ’S241 or 2G for all other drivers.

†

On products compliant to MIL-PRF-38535, all parameters are tested

unless otherwise noted. On all other products, production

processing does not necessarily include testing of all parameters.

SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

SN74LS240, SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244

OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SDLS144C − APRIL 1985 − REVISED MAY 2010

2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ORDERING INFORMATION{

TAPACKAGE}ORDERABLE PART NUMBER TOP-SIDE MARKING

SN74LS240N SN74LS240N

SN74LS241N SN74LS241N

PDIP N

Tube

SN74LS244N SN74LS244N

PDIP − N Tube SN74S240N SN74S240N

SN74S241N SN74S241N

SN74S244N SN74S244N

Tube SN74LS240DW

LS240

Tape and reel SN74LS240DWR LS240

Tube SN74LS241DW

LS241

Tape and reel SN74LS241DWR LS241

Tube SN74LS244DW

LS244

0°C to 70°C

SOIC DW

Tape and reel SN74LS244DWR LS244

SOIC − DW Tube SN74S240DW

S240

Tape and reel SN74S240DWR S240

Tube SN74S241DW

S241

Tape and reel SN74S241DWR S241

Tube SN74S244DW

S244

Tape and reel SN74S244DWR S244

SN74LS240NSR 74LS240

SOP − NS Tape and reel SN74LS241NSR 74LS241

SOP

Tape

and

reel

SN74LS244NSR 74LS244

SSOP DB

Tape and reel

SN74LS240DBR LS240

SSOP − DB Tape and reel SN74LS244DBR LS244

†For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site

at www.ti.com.

‡Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

SN74LS240, SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244

OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SDLS144C − APRIL 1985 − REVISED MAY 2010

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ORDERING INFORMATION{ (CONTINUED)

TAPACKAGE}ORDERABLE PART NUMBER TOP-SIDE MARKING

SN54LS240J SN54LS240J

SNJ54LS240J SNJ54LS240J

SN54LS241J SN54LS241J

SNJ54LS241J SNJ54LS241J

SN54LS244J SN54LS244J

CDIP J

Tube

SNJ54LS244J SNJ54LS244J

CDIP − J Tube SN54S240J SN54S240J

SNJ54S240J SNJ54S240J

SN54S241J SN54S241J

SNJ54S241J SNJ54S241J

SN54S244J SN54S244J

55°C to 125°C

SNJ54S244J SNJ54S244J

−55°C to 125°CSNJ54LS240W SNJ54LS240W

SNJ54LS241W SNJ54LS241W

CFP W

Tube

SNJ54LS244W SNJ54LS244W

CFP − W Tube SNJ54S240W SNJ54S240W

SNJ54S241W SNJ54S241W

SNJ54S244W SNJ54S244W

SNJ54LS240FK SNJ54LS240FK

SNJ54LS241FK SNJ54LS241FK

LCCC FK

Tube

SNJ54LS244FK SNJ54LS244FK

LCCC − FK Tube SNJ54S240FK SNJ54S240FK

SNJ54S241FK SNJ54S241FK

SNJ54S244FK SNJ54S244FK

†For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site

at www.ti.com.

‡Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

SN74LS240, SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244

OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SDLS144C − APRIL 1985 − REVISED MAY 2010

4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

schematics of inputs and outputs

VCC

Output

TYPICAL OF ALL OUTPUTS

Req

VCC

Input

EQUIVALENT OF EACH INPUT

9 kΩ NOM

Input

VCC

’LS240. ’LS241, ’LS244: R = 50 Ω NOM

’S240, ‘S241, S244: R = 25 Ω NOM

GND

G and G inputs: Req = 2 kΩ NOM

A inputs: Req = 2.8 kΩ NOM

’LS240, ’LS241, ’LS244 ’S240, ’S241, ’S244

SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

SN74LS240, SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244

OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SDLS144C − APRIL 1985 − REVISED MAY 2010

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

logic diagram

17 3

1A1

1A2

1A3

1A4

1Y1

2A1

2A2

2A3

2A4

2Y1

1Y2

1Y3

1Y4

2Y2

2Y3

2Y4

’LS240, ’S240 ’LS241, ’S241

’LS244, ’S244

17 3

1A1

1A2

1A3

1A4

1Y1

2A1

2A2

2A3

2A4

2Y1

1Y2

1Y3

1Y4

2Y2

2Y3

2Y4

17 3

1A1

1A2

1A3

1A4

1Y1

2A1

2A2

2A3

2A4

2Y1

1Y2

1Y3

1Y4

2Y2

2Y3

2Y4

Pin numbers shown are for DB, DW, J, N, NS, and W packages.

SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

SN74LS240, SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244

OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SDLS144C − APRIL 1985 − REVISED MAY 2010

6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage, VCC (see Note 1) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage, VI: ’LS 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

’S 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Off-state output voltage 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance, θJA (see Note 2): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

N package 69°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. Voltage values are with respect to network ground terminal.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions

SN54LS’ SN74LS’

UNIT

MIN NOM MAX MIN NOM MAX UNIT

VCC Supply voltage (see Note 1) 4.5 5 5.5 4.75 5 5.25 V

VIH High-level input voltage 2 2 V

VIL Low-level input voltage 0.7 0.8 V

IOH High-level output current −12 −15 mA

IOL Low-level output current 12 24 mA

TAOperating free-air temperature −55 125 0 70 °C

NOTE 1: Voltage values are with respect to network ground terminal.

SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

SN74LS240, SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244

OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SDLS144C − APRIL 1985 − REVISED MAY 2010

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)

PARAMETER

TEST CONDITIONS†

SN54LS’ SN74LS’

UNIT

PARAMETER TEST CONDITIONS†

MIN TYP‡MAX MIN TYP‡MAX UNIT

VIK VCC = MIN, II = −18 mA −1.5 −1.5 V

Hysteresis

(VT+ − VT−)VCC = MIN 0.2 0.4 0.2 0.4 V

VCC = MIN,

IOH = −3 mA VIH = 2 V, VIL = MAX, 2.4 3.4 2.4 3.4

VOH VCC = MIN,

IOH = MAX VIH = 2 V, VIL = 0.5 V, 2 2

= MIN,

V2V

IOL = 12 mA 0.4 0.4

VOL

VCC

MIN

VIL = MAX VIH = 2 V, IOL = 24 mA 0.5 V

IOZH

VCC = MAX,

VIL = MAX VIH = 2 V, VO = 2.7 V 20 20 µA

IOZL

VCC = MAX,

VIL = MAX VIH = 2 V, VO = 0.4 V −20 −20 µA

IIVCC = MAX, VI = 7 V 0.1 0.1 mA

IIH VCC = MAX, VI = 2.7 V 20 20 µA

IIL VCC = MAX, VIL = 0.4 V −0.2 −0.2 mA

IOS§VCC = MAX, −40 −225 −40 −225 mA

Outputs high All 17 27 17 27

VMAX

Outputs low

’LS240 26 44 26 44

ICC

VCC = MAX,

Output open

Outputs low ’LS241, ’LS244 27 46 27 46 mA

ICC

open

Outputs disabled

’LS240 29 50 29 50

Outputs disabled ’LS241, ’LS244 32 54 32 54

†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.

‡All typical values are at VCC = 5 V, TA = 25°C.

§Not more than one output should be shorted at a time, and duration of the short-circuit should not exceed one second.

switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1)

PARAMETER

TEST CONDITIONS

’LS240 ’LS241, ’LS244

UNIT

PARAMETER TEST CONDITIONS MIN TYP MAX MIN TYP MAX UNIT

tPLH

R667 Ω

C45 pF

9 14 12 18

tPHL

RL = 667 Ω, CL = 45 pF 12 18 12 18 ns

tPZL

R667 Ω

C45 F

20 30 20 30

tPZH

RL = 667 Ω, CL = 45 pF 15 23 15 23 ns

tPLZ

R667 Ω

C5pF

10 20 10 20

tPHZ

RL = 667 Ω, CL = 5 pF 15 25 15 25 ns

SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

SN74LS240, SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244

OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SDLS144C − APRIL 1985 − REVISED MAY 2010

8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

recommended operating conditions

SN54S’ SN74S’

UNIT

MIN NOM MAX MIN NOM MAX UNIT

VCC Supply voltage (see Note 1) 4.5 5 5.5 4.75 5 5.25 V

VIH High-level input voltage 2 2 V

VIL Low-level input voltage 0.8 0.8 V

IOH High-level output current −12 −15 mA

IOL Low-level output current 48 64 mA

External resistance between any input and VCC or ground 40 40 kΩ

TAOperating free-air temperature (see Note 3) −55 125 0 70 °C

NOTES: 1. Voltage values are with respect to network ground terminal.

3. An SN54S241J operating at free-air temperature above 116°C requires a heat sink that provides a thermal resistance from case

to free air, RθCA, of not more that 40°C/W.

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)

PARAMETER

TEST CONDITIONS†

SN54S’ SN74S’

UNIT

PARAMETER TEST CONDITIONS†

MIN TYP‡MAX MIN TYP‡MAX UNIT

VIK VCC = MIN, II = −18 mA −1.2 −1.2 V

Hysteresis

(VT+ − VT−)VCC = MIN 0.2 0.4 0.2 0.4 V

VCC = MIN

IOH = −1 mA

VIH = 2 V, VIL = 0.8 V, 2.7

VOH

VCC = MIN,

IOH = −3 mA

VIH = 2 V, VIL = 0.8 V, 2.4 3.4 2.4 3.4 V

VCC = MIN,

IOH = MAX

VIH = 2 V, VIL = 0.5 V, 2 2

VOL

VCC = MIN,

IOL = MAX

VIH = 2 V, VIL = 0.8 V, 0.55 0.55 V

IOZH

VCC = MAX,

VIL = 0.8 V

VIH = 2 V, VO = 2.4 V 50 50 µA

IOZL

VCC = MAX,

VIL = 0.8 V

VIH = 2 V, VO = 0.5 V −50 −50 µA

IIVCC = MAX, VI = 5.5 V 1 1 mA

IIH VCC = MAX, VI = 2.7 V 50 50 µA

VMAX

V05V

Any A −400 −400 µA

IIL VCC = MAX, VI = 0.5 V Any G −2 −2 mA

IOS§VCC = MAX −50 −225 −50 −225 mA

Outputs high

’S240 80 123 80 135

Outputs high ’S241,’S244 95 147 95 160

= MAX,

Outputs low

’S240 100 145 100 150

ICC

VCC

MAX

Output open Outputs low ’S241, ’S244 120 170 120 180 mA

Outputs disabled

’S240 100 145 100 150

Outputs disabled ’S241, ’S244 120 170 120 180

†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.

‡All typical values are at VCC = 5 V, TA = 25°C.

§Not more than one output should be shorted at a time, and duration of the short-circuit should not exceed one second.

SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

SN74LS240, SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244

OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SDLS144C − APRIL 1985 − REVISED MAY 2010

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

switching characteristics, VCC = 5 V, TA = 25°C (see Figure 2)

PARAMETER

TEST CONDITIONS

’S240 ’S241, ’S244

UNIT

PARAMETER TEST CONDITIONS MIN TYP MAX MIN TYP MAX UNIT

tPLH

R90 Ω

C50 F

4.5 7 6 9

tPHL

RL = 90 Ω, CL = 50 pF 4.5 7 6 9 ns

tPZL

R90 Ω

C50 F

10 15 10 15

tPZH

RL = 90 Ω, CL = 50 pF 6.5 10 8 12 ns

tPLZ

R90 Ω

C5pF

10 15 10 15

tPHZ

RL = 90 Ω, CL = 5 pF 6 9 6 9 ns

SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

SN74LS240, SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244

OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SDLS144C − APRIL 1985 − REVISED MAY 2010

10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PARAMETER MEASUREMENT INFORMATION

SERIES 54LS/74LS DEVICES

tPHL tPLH

tPLH tPHL

LOAD CIRCUIT

FOR 3-STATE OUTPUTS

High-Level

Pulse

Low-Level

Pulse

VOLTAGE WAVEFORMS

PULSE DURATIONS

Input

Out-of-Phase

Output

(see Note D)

3 V

0 V

VOL

VOH

VOL

In-Phase

Output

(see Note D)

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES

VCC

Test

Point

From Output

Under Test

(see Note A)

LOAD CIRCUIT

FOR OPEN-COLLECTOR OUTPUTS

LOAD CIRCUIT

FOR 2-STATE TOTEM-POLE OUTPUTS

(see Note B)

VCC

From Output

Under Test

(see Note A)

Test

Point

(see Note B)

VCC

From Output

Under Test

(see Note A)

Test

Point

5 kΩ

NOTES: A. CL includes probe and jig capacitance.

B. All diodes are 1N3064 or equivalent.

C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.

D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL.

E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.

F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 15 ns, tf ≤ 6 ns.

G. The outputs are measured one at a time with one input transition per measurement.

tPHZ

tPLZ

tPZL

tPZH

3 V

0 V

tsu

VOLTAGE WAVEFORMS

SETUP AND HOLD TIMES

Timing

Input

Data

Input

3 V

0 V

Output

Control

(low-level

enabling)

Waveform 1

(see Notes C

and D)

Waveform 2

(see Notes C

and D) ≈1.5 V

VOH − 0.3 V

VOL + 0.3 V

≈1.5 V

VOLTAGE WAVEFORMS

ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS

1.3 V 1.3 V

1.3 V

1.3 V 1.3 V

1.3 V

1.3 V 1.3 V

VOL

VOH

Figure 1. Load Circuits and Voltage Waveforms

SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

SN74LS240, SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244

OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SDLS144C − APRIL 1985 − REVISED MAY 2010

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PARAMETER MEASUREMENT INFORMATION

SERIES 54S/74S DEVICES

tPHL tPLH

tPLH tPHL

LOAD CIRCUIT

FOR 3-STATE OUTPUTS

High-Level

Pulse

Low-Level

Pulse

VOLTAGE WAVEFORMS

PULSE DURATIONS

Input

Out-of-Phase

Output

(see Note D)

3 V

0 V

VOL

VOH

VOL

In-Phase

Output

(see Note D)

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES

VCC

Test

Point

From Output

Under Test

(see Note A)

LOAD CIRCUIT

FOR OPEN-COLLECTOR OUTPUTS

LOAD CIRCUIT

FOR 2-STATE TOTEM-POLE OUTPUTS

(see Note B)

VCC

From Output

Under Test

(see Note A)

Test

Point

(see Note B)

VCC

From Output

Under Test

(see Note A)

Test

Point

1 kΩ

NOTES: A. CL includes probe and jig capacitance.

B. All diodes are 1N3064 or equivalent.

C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.

D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL.

E. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω; tr and tf ≤ 7 ns for Series

54/74 devices and tr and tf ≤ 2.5 ns for Series 54S/74S devices.

F. The outputs are measured one at a time with one input transition per measurement.

tPHZ

tPLZ

tPZL

tPZH

3 V

0 V

tsu

VOLTAGE WAVEFORMS

SETUP AND HOLD TIMES

Timing

Input

Data

Input

3 V

0 V

Output

Control

(low-level

enabling)

Waveform 1

(see Notes C

and D)

Waveform 2

(see Notes C

and D) ≈1.5 V

VOH − 0.5 V

VOL + 0.5 V

≈1.5 V

VOLTAGE WAVEFORMS

ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS

1.5 V 1.5 V

1.5 V

1.5 V 1.5 V

1.5 V

1.5 V 1.5 V

VOH

VOL

Figure 2. Load Circuits and Voltage Waveforms

SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

SN74LS240, SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244

OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SDLS144C − APRIL 1985 − REVISED MAY 2010

12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

APPLICATION INFORMATION

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

5962-7801201VRA ACTIVE CDIP J 20 20 TBD A42 N / A for Pkg Type

5962-7801201VSA ACTIVE CFP W 20 25 TBD Call TI N / A for Pkg Type

7705701RA ACTIVE CDIP J 20 1 TBD Call TI Call TI

7705701SA ACTIVE CFP W 20 1 TBD Call TI Call TI

78012012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI

7801201RA ACTIVE CDIP J 20 1 TBD Call TI Call TI

7801201SA ACTIVE CFP W 20 1 TBD Call TI Call TI

JM38510/32401B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

JM38510/32401BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

JM38510/32401BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

JM38510/32402B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

JM38510/32402BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

JM38510/32402BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

JM38510/32403B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

JM38510/32403BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

JM38510/32403BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

JM38510/32403SRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

JM38510/32403SSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

M38510/32401B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

M38510/32401BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

M38510/32401BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

M38510/32402B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

M38510/32402BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

M38510/32402BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

M38510/32403B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

M38510/32403BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

M38510/32403BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

M38510/32403SRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

M38510/32403SSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

SN54LS240J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2012

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SN54LS241J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SN54LS244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SN54S240J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SN54S241J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SN54S244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SN74LS240DW ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS240DWG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS240DWR ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS240DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS240DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS240J OBSOLETE CDIP J 20 TBD Call TI Call TI

SN74LS240N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

SN74LS240N3 OBSOLETE PDIP N 20 TBD Call TI Call TI

SN74LS240NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

SN74LS240NSR ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS240NSRE4 ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS240NSRG4 ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS241DW ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS241DWE4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS241DWG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS241DWR ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS241DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2012

Addendum-Page 3

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SN74LS241DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS241J OBSOLETE CDIP J 20 TBD Call TI Call TI

SN74LS241N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

SN74LS241N3 OBSOLETE PDIP N 20 TBD Call TI Call TI

SN74LS241NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

SN74LS241NSR ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS241NSRE4 ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS241NSRG4 ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS244DBR ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS244DW ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS244DWE4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS244DWR ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS244DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS244J OBSOLETE CDIP J 20 TBD Call TI Call TI

SN74LS244N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

SN74LS244N3 OBSOLETE PDIP N 20 TBD Call TI Call TI

SN74LS244NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2012

Addendum-Page 4

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SN74LS244NSR ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS244NSRE4 ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S240DW ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S240DWE4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S240DWG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S240DWR ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S240DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S240DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S240N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

SN74S240N3 OBSOLETE PDIP N 20 TBD Call TI Call TI

SN74S240NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

SN74S241DW ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S241DWE4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S241DWG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S241DWR ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S241DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S241DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S241J OBSOLETE CDIP J 20 TBD Call TI Call TI

SN74S241N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2012

Addendum-Page 5

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SN74S241N3 OBSOLETE PDIP N 20 TBD Call TI Call TI

SN74S241NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

SN74S244DW ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S244DWE4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S244DWR ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S244DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74S244J OBSOLETE CDIP J 20 TBD Call TI Call TI

SN74S244N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

SN74S244N3 OBSOLETE PDIP N 20 TBD Call TI Call TI

SN74S244NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

SNJ54LS240FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

SNJ54LS240J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SNJ54LS240W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

SNJ54LS241FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

SNJ54LS241J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SNJ54LS241W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

SNJ54LS244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

SNJ54LS244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SNJ54LS244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

SNJ54S240FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

SNJ54S240J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SNJ54S240W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

SNJ54S241FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

SNJ54S241J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SNJ54S241W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2012

Addendum-Page 6

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SNJ54S244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

SNJ54S244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SNJ54S244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54LS240, SN54LS240-SP, SN54LS241, SN54LS244, SN54LS244-SP, SN54S240, SN54S241, SN54S244, SN74LS240,

SN74LS241, SN74LS244, SN74S240, SN74S241, SN74S244 :

•Catalog: SN74LS240, SN54LS240, SN74LS241, SN74LS244, SN54LS244, SN74S240, SN74S241, SN74S244

•Military: SN54LS240, SN54LS241, SN54LS244, SN54S240, SN54S241, SN54S244

•Space: SN54LS240-SP, SN54LS244-SP

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2012

Addendum-Page 7

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Military - QML certified for Military and Defense Applications

•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

SN74LS240DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1

SN74LS240NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1

SN74LS241DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1

SN74LS241NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1

SN74LS244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1

SN74LS244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1

SN74LS244NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1

SN74S240DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1

SN74S241DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1

SN74S244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74LS240DWR SOIC DW 20 2000 367.0 367.0 45.0

SN74LS240NSR SO NS 20 2000 367.0 367.0 45.0

SN74LS241DWR SOIC DW 20 2000 367.0 367.0 45.0

SN74LS241NSR SO NS 20 2000 367.0 367.0 45.0

SN74LS244DBR SSOP DB 20 2000 367.0 367.0 38.0

SN74LS244DWR SOIC DW 20 2000 367.0 367.0 45.0

SN74LS244NSR SO NS 20 2000 367.0 367.0 45.0

SN74S240DWR SOIC DW 20 2000 367.0 367.0 45.0

SN74S241DWR SOIC DW 20 2000 367.0 367.0 45.0

SN74S244DWR SOIC DW 20 2000 367.0 367.0 45.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

4040065 /E 12/01

28 PINS SHOWN

Gage Plane

8,20

7,40

0,55

0,95

0,25

12,90

12,30

10,50

8,50

Seating Plane

9,907,90

10,50

9,90

0,38

5,60

5,00

0,22

2016

6,50

0,05 MIN

5,905,90

DIM

A MAX

A MIN

PINS **

2,00 MAX

6,90

7,50

0,65 M

0,15

0°–ā8°

0,10

0,09

0,25

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which

have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such

components to meet such requirements.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265