HCC/HCF4008B
4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT
DESCRIPTION
.4 SUM OUTPUTS PLUS PARALLEL LOOK-
AHERDCARRY-OUTPUT
.HIGH-SPEED OPERATION-SUM IN-TO-SUM
OUT 160ns (typ.) : CARRY IN-TO-CARRYOUT
50ns (typ.) AT VDD = 10V, CL= 50pF
.QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
.INPUT CURRENTOF 100nA AT 18V AND 25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENTCURRENT
.5V, 10V, AND 15VPARAMETRIC RATING
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVESTANDARDN°13A,”STANDARDSPE-
CIFICATIONS FOR DESCRIPTION OF ”B”
SERIESCMOS DEVICES”
June1989
TheHCC4008B (extended temperature range) and
HCF4008B (intermediate temperature range) are
monolithic integrated circuits, available in 16-lead
dual in-line plastic or ceramic package and plastic
micropackage.
TheHCC/HCF4008Btypesconsist offourfulladder
stages with fast look ahead carry provision from
stage to stage.Circuitry isincluded toprovide a fast
”parallel-carry-out” to permit high-speed operation
in arithmetic sections using several HCC/HCF
4008B’s.
HCC/HCF4008B inputsinclude the four sets of bits
tobe added, A1to A4andB1toB4, inaddition to the
”Carry In” bit from a previous section.
HCC/HCF4008B outputs include the four sum bits,
S1toS4.Inaddition tothehighspeed”parallel-carry-
out” which may be utilized at a succeeding
HCC/HCF4008B section.
EY
(Plastic Package) F
(Ceramic Frit SealPackage)
C1
(Plastic Chip Carrier)
ORDERCODES :
HCC4008BF HCF4008BM1
HCF4008BEY HCF4008BC1
PIN CONNECTIONS
M1
(MicroPackage)
1/13
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VDD* Supply Voltage : HCC Types
HCF Types – 0.5 to + 20
– 0.5 to + 18 V
V
ViInput Voltage – 0.5 to VDD + 0.5 V
IIDC Input Current (any one input) ±10 mA
Ptot Total Power Dissipation (per package)
Dissipation per Output Transistor
for Top = Full Package-temperature Range
200
100
mW
mW
Top Operating Temperature : HCC Types
HCF Types –55to+125
–40to+85 °C
°C
T
stg Storage Temperature – 65 to + 150 °C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
VDD Supply Voltage : HCC Types
HCF Types 3to18
3to15 V
V
V
IInput Voltage 0 to VDD V
Top Operating Temperature : HCC Types
HCF Types – 55 to + 125
–40to+85 °C
°C
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sec-
tions of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device
reliability.
* All voltage values are referred to VSS pin voltage.
HCC/HCF4008B
2/13
LOGIC DIAGRAM
TRUTH TABLE
AiBiCI CO SUM
O
I
O
I
O
I
O
I
O
O
I
I
O
O
I
I
O
O
O
O
I
I
I
I
O
O
O
I
O
I
I
I
O
I
I
O
I
O
O
I
HCC/HCF4008B
3/13
STATIC ELECTRICAL CHARACTERISTICS(over recommended operating conditions)
Test Conditions Value
VIVO|IO|V
DD TLow*25°CT
High*
Symbol Parameter (V) (V) (µA) (V) Min. Max. Min. Typ. Max. Min. Max.
Unit
ILQuiescent
Current HCC
Types
0/ 5 5 5 0.04 5 150
µA
0/10 10 10 0.04 10 300
0/15 15 20 0.04 20 600
0/20 20 100 0.08 100 3000
HCF
Types
0/ 5 5 20 0.04 20 150
0/10 10 40 0.04 40 300
0/15 15 80 0.04 80 600
VOH Output High
Voltage 0/ 5 < 1 5 4.95 4.95 4.95 V
0/10 < 1 10 9.95 9.95 9.95
0/15 < 1 15 14.95 14.95 14.95
VOL Output Low
Voltage 5/0 < 1 5 0.05 0.05 0.05 V
V
10/0 < 1 10 0.05 0.05 0.05
15/0 < 1 15 0.05 0.05 0.05
VIH Input High
Voltage 0.5/4.5 < 1 5 3.5 3.5 3.5
1/9 < 1 10 7 7 7
1.5/13.5 < 1 15 11 11 11
VIL Input Low
Voltage 4.5/0.5 < 1 5 1.5 1.5 1.5 V
9/1 < 1 10 3 3 3
13.5/1.5 < 1 15 4 4 4
IOH Output
Drive
Current HCC
Types
0/ 5 2.5 5 – 2 – 1.6 – 3.2 – 1.15
mA
0/ 5 4.6 5 – 0.64 – 0.51 – 1 – 0.36
0/10 9.5 10 – 1.6 – 1.3 – 2.6 – 0.9
0/15 13.5 15 – 4.2 – 3.4 – 6.8 – 2.4
HCF
Types
0/ 5 2.5 5 – 1.53 – 1.36 – 3.2 – 1.1
0/ 5 4.6 5 – 0.52 – 0.44 – 1 – 0.36
0/10 9.5 10 – 1.3 – 1.1 – 2.6 – 0.9
0/15 13.5 15 – 3.6 – 3.0 – 6.8 – 2.4
IOL Output
Sink
Current HCC
Types
0/ 5 0.4 5 0.64 0.51 1 0.36
mA
0/10 0.5 10 1.6 1.3 2.6 0.9
0/15 1.5 15 4.2 3.4 6.8 2.4
HCF
Types
0/ 5 0.4 5 0.52 0.44 1 0.36
0/10 0.5 10 1.3 1.1 2.6 0.9
0/15 1.5 15 3.6 3.0 6.8 2.4
IIH,I
IL Input
Leakage
Current
HCC
Types 0/18
Any Input
18 ±0.1 ±10–5 ±0.1 ±1
µA
HCF
Types 0/15 15 ±0.3 ±10–5 ±0.3 ±1
CIInput Capacitance Any Input 5 7.5 pF
*T
Low=–55°CforHCC device : – 40°CforHCF device.
*T
High= + 125°CforHCC device : + 85°CforHCF device.
TheNoiseMarginfor both”1” and”0” level is : 1V min.with VDD = 5V,2V min. withVDD =10V, 2.5 V min. withVDD = 15V.
HCC/HCF4008B
4/13
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb =25°C, CL= 50 pF, RL= 200 kΩ,
typical temperature coefficient for all VDD values is 0.3 %/°C, all input rise and fall times = 20 ns)
Value
Symbol Parameter Test Conditions VDD (V) Min. Typ. Max. Unit
tPLH,t
PHL Propagation Delay
Time Sum In to
Sum Out 5400800
ns
10 160 320
15 115 230
Carry In to
Sum Out 5370740
10 155 310
15 115 230
Sum In to
Carry Out 5200400
10 90 180
15 65 130
Carry In to
Carry Out 5100200
10 50 100
15 40 80
tTHL,t
TLH Transition Time 5 100 200 ns
10 50 100
15 40 80
Minimum Output Low(sink) Current Charac-
teristics.
Typical Output Low (sink) Current.
HCC/HCF4008B
5/13
Typical Output High (source) Current Charac-
teristics. Minimum Output High (source) Current Charac-
teristics.
Typical Sum-in to SumOut Propagation Delay
vs. Load Capacitance. Typical Carry-in to Carry-Out Propagation Delay
vs. Load Capacitance.
Typical Sum-in to Carry-Out Propagation Delay
Timevs. Load Capacitance.
Typical Carry-in to Sum OutPropagation Delay
Time vs.Load Capacitance.
HCC/HCF4008B
6/13
Typical Dynamic Power Dissipation/Package vs.
Frequency.
TYPICAL APPLICATIONS
SPEEDCHARACTERISTICS OF A 16-BIT ADDER.
Notes :All ”A” and ”B” input bits occurat t= 0.
Allsums settled at t = 345ns.
CL= 50pF, Tamb =25°C, VDD-VSS =10V.
HCC/HCF4008B
7/13
Input Voltage.
TEST CIRCUITS
Quiescent Device Current.
Input Current.
HCC/HCF4008B
8/13
Plastic DIP16 (0.25) MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
P001C
HCC/HCF4008B
9/13
Ceramic DIP16/1 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787
B 7 0.276
D 3.3 0.130
E 0.38 0.015
e3 17.78 0.700
F 2.29 2.79 0.090 0.110
G 0.4 0.55 0.016 0.022
H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012
M 0.51 1.27 0.020 0.050
N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
P053D
HCC/HCF4008B
10/13
SO16 (Narrow) MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068
a1 0.1 0.2 0.004 0.007
a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45°(typ.)
D 9.8 10 0.385 0.393
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.62 0.024
S8°(max.)
P013H
HCC/HCF4008B
11/13
PLCC20 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180
d1 2.54 0.100
d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015
G 0.101 0.004
M 1.27 0.050
M1 1.14 0.045
P027A
HCC/HCF4008B
12/13
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents orother rights of third partieswhich may results from its use. No
license is granted by implication or otherwiseunder any patentor patent rights ofSGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to change without notice. This publication supersedes andreplaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorized foruse ascritical componentsin life supportdevices orsystems withoutexpress
written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics- All RightsReserved
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HCC/HCF4008B
13/13
