TLP719
2007-10-01
1
Unit in mm
Weight0.26 g (typ.)
4.58±0.25
4.0 +0.25
0.20
9.7±0.3
6.8±0.25
0.4±0.1
1.27±0.2 1.25±0.25
7.62±0.25
3.65 +0.15
0.25
0.25±
1 2 3
6 5 4
11-5J1
TOSHIBA 11-5J1
0.05
+0.10
TOSHIBA PHOTOCOUPLER GaAAs IRED + PHOTOIC
TLP719
Digital logic ground isolation
Line receivers
Microprocessor system interfaces
Switching power supply feedback control
Transistor invertors
The TOSHIBA TLP719 consists of a GaAAs high-output light-emitting diode and a
high-speed detector.
This unit is a 6-lead SDIP. The TLP719 is 50% smaller than the 8-pin DIP and
meets the reinforced insulation class requirements of international safety standards.
Therefore the mounting area can be reduced in equipment requiring safety standard
certification.
The TLP719 has a Faraday shield integrated on the photodetector chip to provide
an effective common mode noise transient immunity. Therefore this product is
suitable for application in noisy environmental conditions.
Open collector
Package type : SDIP6
Isolation voltage : 5000 Vrms (min)
Common mode transient immunity : ±10 kV/us(min) @VCM = 400 V
Switching speed : tpHL/ tpLH = 0.8 μs (max)
@ IF = 16 mA , VCC = 5 V,
RL = 1.9 k , Ta = 25 °C
TTL compatible
Construction mechanical rating
7.62-mm pitch
standard type
10.16-mm pitch
TLPXXXF type
Creepage Distance
Clearance
Insulation Thickness
7.0 mm (min)
7.0 mm (min)
0.4 mm (min)
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
UL recognized : UL1577, File No. E67349
Option (D4)
TÜV approved : EN60747-5-2
Certificate No. R50033433
Maximum operating insulation voltage : 890 Vpk
Highest permissible over voltage : 8000 Vpk
( Note ) When a EN60747-5-2 approved type is needed,
please designate the “Option(D4)”
PIN CONFIGURATION (Top View)
SHIELD
1
34
5
6
2
1 : ANODE
2 : N.C.
3 : CATHODE
4 : EMITTER (GND)
5 : COLLECTOR (OUTPUT)
6 : VCC
SCHEMATIC
SHIELD
1
34
5
6
VF
IFICC
VCC
VO
GND
IO
A
0.1-μF bypass capacitor must be
connected between pins 4 and 6.
(See Note 7.)
TLP719
2007-10-01
2
Absolute Maximum Ratings (Ta = 25 °C)
Characteristic Symbol Rating Unit
Forward current (Note 1) IF 25 mA
Pulse forward current (Note 2) IFP 50 mA
Peak transient forward current (Note 3) IFPT 1 A
Reverse voltage VR 5 V
Diode power dissipation (Note 4) PD 45 mW
LED
Junction temperature Tj 125 °C
Output current IO 8 mA
Peak output current IOP 16 mA
Output voltage VO 0.5~20 V
Supply voltage VCC 0.5~30 V
Output power dissipation (Note 5) PO 100 mW
Detector
Junction Temperature Tj 125 °C
Operating temperature range Topr 55~100 °C
Storage temperature range Tstg 55~125 °C
Lead soldering temperature (10 s) Tsol 260 °C
Isolation voltage (AC, 1 minute, R.H. 60 %) (Note 6) BVS 5000 Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Derate 0.45 mA / °C above 70 °C.
Note 2: 50% duty cycle, 1 ms pulse width.
Derate 0.9 mA / °C above 70 °C.
Note 3: Pulse width 1 μs, 300 pps.
Note 4: Derate 0.8 mW / °C above 70 °C.
Note 5: Derate 1.8 mW / °C above 70 °C.
Note 6: Device considered a two-terminal device: pins 1, 2 and 3 paired with pins 4, 5 and 6 respectively.
Note 7: A ceramic capacitor (0.1 μF) should be connected from pin 6 to pin 4 to stabilize the operation of the
high-gain linear amplifier. Failure to provide the bypassing may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
TLP719
2007-10-01
3
Electrical Characteristics (Ta = 25 °C)
Characteristic Symbol Test Condition Min. Typ. Max. Unit
Forward voltage VF IF = 16 mA 1.65 1.85 V
Forward voltage
Temperature coefficient ΔVF / ΔTa IF = 16 mA 2 mV / °C
Reverse current IR VR = 5 V 10 μA
LED
Capacitance between terminals CT V
F = 0 V , f = 1 MHz 45 pF
IOH (1) IF = 0 mA ,VCC = VO = 5.5 V 3 500 nA
IOH (2)
IF = 0 mA ,VCC = 30 V
VO = 20 V 5
HIGH-level output current
IOH
IF = 0 mA ,VCC = 30 V
VO = 20 V,Ta = 70 °C 50
μA
HIGH-level supply current ICCH IF = 0 mA ,VCC = 30 V 0.01 1 μA
Supply voltage VCC ICC = 0.01 mA 30 V
Detector
Output voltage VO IO = 0.5 mA 20 V
Coupled Electrical Characteristics (Ta = 25 °C)
Characteristic Symbol Test Condition Min. Typ. Max. Unit
Current transfer ratio IO / IF
IF = 16 mA ,VCC = 4.5 V
VO = 0.4 V 20 %
LOW-level output voltage VOL
IF = 16 mA, VCC = 4.5 V
IO = 2.4 mA 0.4 V
Isolation Characteristics (Ta = 25 °C)
Characteristic Symbol Test Condition Min. Typ. Max. Unit
Capacitance input to output CS V = 0 V , f = 1 MHz (Note 6) 0.8 pF
Isolation resistance RS
R.H. 60% ,VS = 500 V
(Note 6) 1×1012 1014
AC, 1 minute 5000
AC, 1 second , in oil 10000 Vrms
Isolation voltage BVS
DC, 1 minute , in oil 10000 Vdc
TLP719
2007-10-01
4
Switching Characteristics (Ta = 25 °C, VCC = 5 V)
Characteristic Symbol
Test
Cir-
cuit Test Condition Min. Typ. Max. Unit
Propagation delay time (H L) tpHL
IF = 0 16 mA
RL = 1.9k 0.8 μs
Propagation delay time (L H) tpLH
Fig1 IF = 16 0 mA
RL = 1.9k 0.8 μs
Common mode transient
immunity at logic HIGH output
(Note 8)
CMH
IF = 0 mA
VCM = 400 Vpp
RL = 1.9k
10000 V / μs
Common mode transient
immunity at logic LOW output
(Note 8)
CML
Fig2 IF = 16 mA
VCM = 400 Vpp
RL = 1.9 k
10000
V / μs
Note 8 : CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic
LOW state (VO < 0.8 V).
CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic
HIGH state (VO >2 V).
Figure 1. Switching Time Test Circuit
Figure 2. Common Mode Noise Immunity Test Circuit.
MONITORING NODE
VCC = 5 V
VO
RL
1
2
3
5
4
6
IF MONITORING NODE
PULSE INPUT
( PW = 100 μs
Duty = 10%)
0.1 μF
IF
10%
tr
90%
tf
CMH
2 V
0.8 V
V
OL
SW:A (IF = 16 mA)
400 V
VCM 0 V
V
OH
SW:B (IF= 0 mA)
CML
CMH = tr (μs)
320 (V)
CML = tf (μs)
320 (V)
tpLH
tpHL
5V
1.5V
VO
IF
VOL
RL=1.9kΩ
VO
VCC=5V
VCM
0.1
μ
F
1
2
3
5
4
6
+
SW
B
A
IF
SHIELD
SHIELD
TLP719
2007-10-01
5
ΔVF / ΔTa IF
Forward current IF (mA)
Forward voltage temperature coefficient
Δvf / Δta (mV / °C)
2.6
1.4
0.1 30
2.2
2.0
1.8
1.6
3 5 10 0.3 0.5 1
2.4
IOH(1) – Ta
Ambient temperature Ta (°C)
High level output current
IOH(1) (nA)
1
300
30
100
50
160
3
10
5
120 40 80 0
IF – VF
Forward voltage VF (V)
Forward current IF (mA)
100
0.01
1.0
0.5
0.1
0.03
1.2 1.4 1.6 2.0
10
1.8
1
0.3
0.05
3
5
30
50 Ta = 25° C
Forward current IF (mA)
IO – IF
Output current IO (mA)
3
1
10
0.01
5
0.3
0.03
0.1
1 10 300
0.1 3 30
0.3 100
0.05
0.5
5 50
0.5
VCC = 5 V
VO = 0.4 V
Ta = 25° C
IO / IF – IF
Forward current IF (mA)
Current transfer ratio IO / IF (%)
100
1 1
30
10
3
0.3 0.5 3 30 5 50
50
5
10
VCC = 5 V
VO = 0.4 V
Ta = 25°C
25°C
100°C
Ambient temperature Ta (°C)
IO / IF – Ta
Normalized IO / IF
-20 0 20 40 100
0.8
0.6
0.4
1.2
0
-40
1.0
60 80
0.2
Normalized to
I
F = 16 mA
V
CC = 4.5 V
V
O = 0.4 V
TLP719
2007-10-01
6
Load resistance R  (kΩ
I =16mA
V =5V
Ta=25℃
tpHL
53
3
5
0.3
0.5
tpHL, tpLH - R
tpLH
F
CC
L
L
Propagation delay time
tpHL, tpLHs)
10 100
130 50
1
0.1
Ambient temperature Ta (℃
Propagation delay time
 tpHL, tpLH (μs)
I =16mA
V =5V
R =1.9kΩ
3
5
0.3
0.5
tpHL , tpLH - Ta
F
CC
tpHL
tpLH
L
-40-200 20406080100
0.1
1
Output voltage VO (V)
IO – VO
Output current IO (mA)
1 2 3 4 7
8
6
4
0
0
10
5 6
2
VCC = 5 V
Ta = 25° C
IF = 5mA
10mA
15mA
20mA
25mA
30mA
Forward current IF (mA)
VO – IF
Output voltage VO (V)
4 8
12 16 24
3
2
1
5
00
4
20
RL = 2 k
3.9 k
10 k
IF
RL
VCC = 5V
Vo
Ta = 25°C
TLP719
2007-10-01
7
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.