AFKC-9300D - Agilent / Hewlett-Packard

Agilent AFKC-xxxx

Pluggable DWDM Transceiver for

operation up to 2.7 Gb/s

Part of the Agilent METRAK family

Data Sheet

Description

The MSA compliant transceivers

are high performance, compact,

cost effective modules for serial

optical communications at data

rates up to 2.7 Gb/s. They are

designed to provide SONET/SDH

compliant links at 2.488 Gb/s.

They are also compatible with

other standard data rates such

as GbE. The optical power and

receiver sensitivity allow for an

optical power budget of 33 dB

and the dispersion performance

enables a range of link distances

up to 160 km. The full range of

C band wavelengths is available

on the ITU 100 GHz grid.

The benefits include the most

compact multisourced package

style available, hot pluggability

and integrated power,

wavelength and APD bias

control. Device monitoring is

provided via a 2-wire serial

interface. System monitoring is

via a loss of signal alarm.

The transmitter section contains

a cooled DFB laser and

wavelength locker and has IEC

825 Class 1M and CDRH Class 1

eye safety. The receiver section

uses an APD receiver for

excellent sensitivity across the

whole of C band.

Connectors

Optical Connector

Simplex LC optical connector

receptacles.

Electrical Connector

70 way two-row connector.

Applications

• DWDM optical interfaces up to

OC-48/STM-16 data rates with

FEC

• Optical transport platforms

• Multi-service provisioning

platform

• Optical add/drop multiplexers

• Optical switch and cross-connect

• Metro core and access networks

• Video Transport Systems

Features

• MSA Compliant

(http://www.hotplugdwdm.org)

• Low power dissipation <2 W

typical

• Controlled hot plugging

• Mountable either through the

front panel or directly on the host

PCB

• Integrated wavelength locker

• Data rates from 155 Mb/s to

2.7 Gb/s (no internal data re-

timing)

• Operation across C band on the

100 GHz ITU grid

• Link optical power budget of 33

dB minimum

• Dispersion performance allows

links of up to 160 km

• Compliant with SONET OC-48/

SDH STM-16

• Directly modulated, cooled,

InGaAsP MQW DFB laser

• High sensitivity APD based

receiver

• Automatic optical power control

• Automatic wavelength control

• Automatic internal APD bias

generation and control

• Received power monitor

• AC-coupled CML compatible

differential data input and output

• Simplex LC optical connector

receptacles

• 70 way two-row electrical

connector

• Single +3.3 V power supply

• Slow or fast TX_DISABLE

Transmitter

Sub-Assembly

Bias

APD Rx

Post

Amp

Micro

Controller

Laser

Driver

Tone Monitor Out

Tone In

Tx Disable

Tx Data In

Module Enable

Tx Alarm

Rx Alarm

Add [2:0]

SDA

SCL

Tone Out

Rx LOS

Rx Data Out

Module Sense

Slow Tx Disable

Functional Description

A simplified schematic diagram

of the transceiver is shown in

Figure 1. The transmitter

subassembly contains a directly

modulated DFB, a wavelength

locker, thermoelectric cooler

(TEC), optical power monitor

and thermistor. The micro-

controller compares readings

from the power monitor,

wavelength locker and

thermistor with factory-set

values and corrects for any

deviations over temperature and

through life. Similarly, the bias

voltage on the APD receiver is

controlled to optimize datasheet

performance.

Figure 1. Simplified Transceiver Schematic

Each transceiver can be

individually addressed over the

I2C bus (up to a limit of 8 per

bus). The micro-controller can

be interrogated and commands

issued over the I2C bus (SDA

and SCL lines). Alarms and

Loss of Signal (LOS) are flagged

by the appropriate pins (see

Figure 4).

Package

The package outline, pin out

(Figures 2, 3 and 4) and rail

system (AFKA-0001, AFKA-

0002) are compliant with the

multisource agreement

(www.hotplugdwdm.org). The

rail system for front panel or

inboard mounting provides

connection to chassis ground for

EMI purposes.

Definition of datums

Figure 2. Mechanical Drawing

Figure 3. Detail Drawings

Datum Description Module

AModule Base

C Centre vertical plane of module

D Back surface of module bezel, safety

hard stop

E Top surface of customer's PCB

H Leading edge of module PCB

L Vertical face of module hard stop,

hard stop on rail

Figure 4. Electrical Pad Layout and Pin Description

BOTTOM SIDE

Pin Sequence Description

70 1 GROUND (TX)

69 1 GROUND (TX)

68 3 NC

67 3 NC

66 1 GROUND (TX)

65 3 RESERVED

64 3 RESERVED

63 1 GROUND (TX)

62 3 RESERVED

61 3 RESERVED

60 1 GROUND (TX)

59 3 RESERVED

58 3 RESERVED

57 1 GROUND (TX)

56 3 TX DATA (-ve)

55 3 TX DATA (+ve)

54 1 GROUND (TX)

53 1 GROUND (TX)

52 1 GROUND (RX)

51 3 RESERVED

50 3 RESERVED

49 1 GROUND (RX)

48 3 RESERVED

47 3 RESERVED

46 1 GROUND (RX)

45 3 RESERVED

44 3 RESERVED

43 1 GROUND (RX)

42 3 RX DATA (-ve)

41 3 RX DATA (+ve)

40 1 GROUND (RX)

39 3 NC

38 3 NC

37 1 GROUND (RX)

36 1 GROUND (RX)

Top of the module PCB

TOP SIDE

Pin Sequence Description

12V

CC (TEC)

22V

CC (TEC)

32V

CC (TEC)

72V

CC (TX)

82V

CC (TX)

9 1 GROUND (DIGITAL)

10 3 SDA

11 3 SCL

12 3 MODULE ENABLE

13 2 VCC (DIGITAL)

14 1 GROUND (DIGITAL)

15 3 TX DISABLE

16 3 TX ALARM

17 3 TONE INPUT

18 3 TONE OUTPUT

19 3 RX ALARM

20 3 RX LOS

21 3 SLA-AD2

22 3 SLA-AD1

23 3 SLA-AD0

24 3 RESERVED

25 3 RESERVED

26 3 RESERVED

27 3 SLOW TX DISABLE

28 3 TONE MONITOR OUTPUT

29 3 MODULE SENSE

30 2 VCC (RX)

31 2 VCC (RX)

32 2 VCC (RX BIAS)

33 1 GROUND (RX BIAS)

34 1 GROUND (RX BIAS)

35 1 GROUND (RX)

Underside of the module PCB as viewed through top of module

41GROUND (TEC)

51GROUND (TEC)

61GROUND (TEC)

NOTE:

NC = NOT CONNECTED INTERNALLY

RESERVED = RESERVED FOR FUTURE EXPANSION (THESE ARE "NO USER CONNECT")

Table 1. Pin Descriptions

Pin No Pin Name Pin Description

1:3 VCC (TEC) Supply for TEC circuit, 3.3V±5%.

4:6 Gnd (TEC) TEC ground.

7:8 VCC (Tx) Supply for analogue Tx electronics, 3.3V±5%.

9 Gnd (Digital) Connection to the (Digital) ground plane. Gnd (Digital) is common with Gnd (Tx) inside the module, this is

ac coupled to the chassis ground with a capacitance of 100nF.1

10 SDA 2 wire (I2C) serial data signal. The physical layer of the interface complies with the Philips specification

9397-750-00954 'The I2C Bus Specification.' The module is designed to operate in the standard data

transfer mode.

11 SCL 2 wire (I2C) serial clock signal. The physical layer of the interface complies with the Philips specification

9397-750-00954 'The I2C Bus Specification.' The module is designed to operate in the standard data

transfer mode.

12 Module Enable With the module plugged in the microcontroller is powered on by default, and always accessible. Connect

Module Enable to +3.3V TTL logic high to enable the remaining on board electronics, and connect to TTL

logic low to disable. For detailed operation see the truth tables in the Applications Note. LVTTL interface

internally pulled down to ground via 100kW.

13 VCC (Digital) Supply for digital electronics, 3.3V±5%

14 Gnd (Digital) Connection to the (Digital) ground plane. Gnd (Digital) is common with Gnd (Tx) inside the module, this is

ac coupled to the chassis ground with a capacitance of 100nF.1

15 TX_Disable Connect Tx Disable to +3.3V TTL logic high to disable the transmitter optical output and connect it to TTL

logic low to enable. For detailed operation see the truth tables in the Applications Note. LVTTL interface

internally pulled up to Vcc via 100kW.

16 TX_Alarm Tx Alarm is flagged when an Alarm or Warning condition associated with the transmitter is encountered.

In normal operation Tx Alarm is at TTL logic low, in a fault condition it is at +3.3V TTL logic high. For

detailed operation see the truth tables in the Applications Note.

17 Tone Input Low frequency tone injection input. Internally ac coupled, with a 10kW input impedance. If unused this

input should be connected to ground. See the Applications Note for further description.

18 Tone Output Low frequency tone recovery output. Internally ac coupled designed to drive a high impedance input,

minimum 1kW. The output signal is dependent on received power and modulation depth.

19 RX_Alarm Rx Alarm is flagged when an alarm or warning condition associated with the receiver is encountered. In

normal operation Rx Alarm is at TTL logic low, in a fault condition it is at +3.3V TTL logic high. For

detailed operation see the truth tables in the Applications Note.

20 RX_LOS LOS is a loss of power warning. On a modulated signal the LOS warning is asserted and de-asserted at

the power levels specified in this data sheet. When asserted LOS will be at +3.3 V TTL logic high, when

de-asserted it will be at TTL logic low..

21:23 SLA-AD2

SLA-AD1

SLA-AD0

Slave address bits that define the address of the module on the I2C Bus. Configured external to the

module by the customer using +3.3V TTL logic levels.

24:26 Vendor Reserved Reserved for vendor specific functions. Do not connect

27 Slow TX_Disable Connect Tx Disable to +3.3V TTL logic high to disable the transmitter optical output and connect it to TTL

logic low to enable. For detailed operation see the truth tables in the Applications Note. LVTTL interface

internally pulled down to ground via 100kW. Slow TX_Disable can be used to switch off the laser with the

power reducing from 90% to 10% of its operational value in >150 µs and <1 ms.

28 Tone Monitor Output The tone monitor output provides a DC voltage proportional to the laser modulation current and an AC pk-

pk signal proportional to the tone current. This pin can be used to control the signal applied to the tone

input and so maintain the modulation depth at the desired level.

Table 1. Pin Descriptions (continued)

Note:

Refer to relevant section of Applications note for recommended filter circuits and control and monitor functions truth table.

1. By maintaining separate signal and chassis grounds inside the module the user has maximum flexibility to couple the ground planes outside the

module as appropriate to their system. If signal and chassis ground are required to be kept separate then the pins attaching the rail mechanism to

the PCB should not be connected to signal ground.

Pin No Pin Name Pin Description

29 Module Sense Internally pulled to ground via 1kW. Can be used by the customer to identify that a module has been

plugged into the socket.

30:31 VCC (Rx) Supply for the receiver analogue electronics, 3.3V±5%

32 VCC (Rx Bias) Supply for the APD bias generator, 3.3V±5%.

33:34 Gnd (Rx Bias) Connection to the (Rx Bias) ground plane. This is an independent ground plane inside the module.1

35:37 Gnd (Rx) Connection to the (Rx) ground plane. This is an independent ground plane inside the module.1

38:39 NC Not connected internally.

40 Gnd (Rx) Connection to the (Rx) ground plane. This is an independent ground plane inside the module.1

41 Rx Data (+ve) Received data output +Internally ac coupled data outputs. CML compatible.

42 Rx Data (-ve) Received data output -Internally ac coupled data outputs. CML compatible.

43 Gnd (Rx) Connection to the (Rx) ground plane. This is an independent ground plane inside the module.1

44:45 Reserved Reserved for future functions, do not connect.

46 Gnd (Rx) Connection to the (Rx) ground plane. This is an independent ground plane inside the module.1

47:48 Reserved Reserved for future functions, do not connect.

49 Gnd (Rx) Connection to the (Rx) ground plane. This is an independent ground plane inside the module.1

50:51 Reserved Reserved for future functions, do not connect.

52 Gnd (Rx) Connection to the (Rx) ground plane. This is an independent ground plane inside the module.1

53:54 Gnd (Tx) Connection to the (Tx) ground plane. Gnd (Tx) is common with Gnd (Digital) inside the module, this is ac

coupled to the chassis ground with a capacitance of 100nF.1

55 Tx data (+ve) Transmit data + Internally ac coupled and terminated. CML compatible.

56 Tx data (-ve) Transmit data - Internally ac coupled and terminated. CML compatible.

57 Gnd (Tx) Connection to the (Tx) ground plane. Gnd (Tx) is common with Gnd (Digital) inside the module, this is ac

coupled to the chassis ground with a capacitance of 100nF.1

58:59 Reserved Reserved for future functions, do not connect.

60 Gnd (Tx) Connection to the (Tx) ground plane. Gnd (Tx) is common with Gnd (Digital) inside the module, this is ac

coupled to the chassis ground with a capacitance of 100nF.1

61:62 Reserved Reserved for future functions, do not connect.

63 Gnd (Tx) Connection to the (Tx) ground plane. Gnd (Tx) is common with Gnd (Digital) inside the module, this is ac

coupled to the chassis ground with a capacitance of 100nF.1

64:65 Reserved Reserved for future functions, do not connect.

66 Gnd (Tx) Connection to the (Tx) ground plane. Gnd (Tx) is common with Gnd (Digital) inside the module, this is ac

coupled to the chassis ground with a capacitance of 100nF.1

67:68 NC Not connected internally.

69:70 Gnd (Tx) Connection to the (Tx) ground plane. Gnd (Tx) is common with Gnd (Digital) inside the module, this is ac

coupled to the chassis ground with a capacitance of 100nF.1

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each

parameter in isolation, all other parameters having values within the recommended operating conditions. It should not be

assumed that limiting values of more than one parameter can be applied to the product at the same time. Exposure to the

absolute maximum ratings for extended periods can adversely affect device reliability.

Recommended Operating Conditions

Transmitter Electrical Characteristics (Note 7)

Notes:

1. Duration of exposure to be less than 24 hours.

2. For details of recommended air flow and ambient temperature refer to Application Note.

3. See drawing for maximum case temperature point.

4. Between 10 Hz and 1 MHz and with required filter.

5. Laser is switched off when TX Disable is high.

6. For input current < 100 µA.

7. Over specified case temperature range, power supply voltage range at end of life @ OC-48.

8. Maximum current during warm-up, assuming max case temperature. Maximum steady-state current is 600 mA.

9. Typical power dissipation is defined at start of life, with average component dissipation values and +25 °C case temperature. Maximum power

dissipation is defined as worst case end of life, with maximum dissipation for every component and +70 °C case temperature.

10. Internally ac coupled and terminated (100 W).

11. Disable assert time is time taken to go from 90% to 10% of operational TX optical power.

Parameter Symbol Minimum Typical Maximum Units Notes

Storage temperature TS-40 +85 °C

Relative humidity

(Non-condensing)

RH 0 85 %

Power supply voltage VCC -0.5 3.6 V

Data input voltage VI-0.5 VCC V

Receiver optical input power PMAX +8 dBm 1

Parameter Symbol Minimum Typical Maximum Units Notes

Case temperature TC-5 +70 °C 2,3

Power supply voltage VCC 3.135 3.3 3.465 V

Power supply noise tolerance PSNT 100 mVPP 4

Slow TX + TX disable input voltage - low 0.15 VCC V5, 6

Slow TX + TX disable input voltage - high 0.8 VCC V5, 6

Module enable input voltage - low 0.15 VCC V6

Module enable input voltage - high 0.8 VCC V6

Parameter Symbol Minimum Typical Maximum Units Notes

TX supply current (VCC TX) ICC TX 170 mA

TEC supply current (VCC TEC) ICC TEC 1200 mA 8

Digital supply current (VCC DIGITAL) ICC DIGITAL 15 mA

Power dissipation PDISS 1.1 2.7 W 9

TX Data input voltage (differential) VID 400 1000 mVPP 10

TX ALARM output voltage - low 0.25 V 6

TX ALARM output voltage - high VCC - 0.5 V 6

TX disable assert time 10 µs 11

Slow TX Disable assert time 150 1000 µs 11

Receiver Electrical Characteristics (Note 7)

Transmitter Optical Characteristics (Note 7)

Notes:

12. Data outputs are internally ac coupled and require external termination at the inputs of the receiving equipment via a 100 W differential load.

13. LOS is LVTTL compatible. For multirate applications LOS may be detected for long ”all-zeros” patterns.

14. For output current <2.5 mA,

15. Information on operation at 9 data rates below 155 Mb/s available on request.

16. Measured in the frequency range 100 MHz to 3 GHz.

17. ITU grid, i from 0 to 4.

18. Measured with 223-1 PRBS, 10-10 BER at 2.48832 Gb/s for link distances up to 100 km (AFKC-xxxxD) and 160 km (AFKC-xxxxE), over standard single

mode fiber with maximum dispersion as defined in ITU-T G.957, Fig A.2 for G.652 fiber.

19. With no degradation of BER.

20. With TX disable asserted and/or module enable de-asserted.

Parameter Symbol Minimum Typical Maximum Units Notes

RX supply current (VCC RX) ICC RX 320 mA

APD supply current (VCC RX BIAS) ICC RX BIAS 70 mA

Power dissipation PDISS 0.75 1.4 W 9

RX DATA (CML differential) VDIFF 640 800 1000 mV 12

RX DATA (CML single ended) VSE 320 400 500 mV 12

Data output

Rise and fall time (20% to 80%)

Tr/Tf150 ps 12

LOS low LOSD0.25 V 13, 14

LOS high (asserted) LOSAVCC - 0.5 V 13, 14

LOS assert time

Logic low to high

tALOS 2.3 100 us

LOS deassert time

Logic high to low

tDLOS 100 us

Parameter Symbol Minimum Typical Maximum Units Notes

Data rate 155 2700 Mb/s 15

Average optical output power PAVG 34.56dBm

Optical extinction ratio ER8.2 9.0 dB

Spectral side mode

suppression ratio

SMSR 30 dB

Relative intensity noise RIN -140 dB/Hz 16

Optical output eye diagram Compliant with eye mask Telcordia GR-253-CORE and ITU-T G.957

Central frequency f0196.1-0.1 iTHz 17

Channel spacing Df100 GHz

Deviation from central frequency ±6 GHz

Spectral characteristics under modulation

( –20 dB line width)

Dl20 0.2 0.4 nm

Jitter generation pk to pk 70 mUI

RMS 7 mUI

Dispersion penalty DP2dB18

Back reflection sensitivity -24 dB 19

Optical output power in 'off' state -40 dBm 20

Receiver Optical Characteristics (Note 7)

Tone

Serial Interface

The physical layer of the interface complies with the Philips I2C Bus Specification. Addressing,

command structure, static data, diagnostic monitoring, alarms and warnings are all MSA compliant.

Electrical Characteristics

Monitor Functions available over the Serial Interface

Parameter Monitor Warning Alarm Alarm Action

Laser temperature Yes

Module temperature Yes If low/high If low/high Shut down Tx and Rx

Laser bias current Yes If high

Laser modulation current Yes

TEC current If high

Tx optical power Yes If low/high Shut down Tx only

Rx optical power Yes

(Note 30)

If high

APD bias voltage Yes If high Shut down Rx only

LOS Yes

Wavelength If outside normal operating limits If >50 GHz from ITU frequency Shut down Tx only

Start-up time-out Note 31 If start time high Shut down Tx only

Parameter Symbol Minimum Typical Maximum Units Notes

Data rate 155 2700 Mb/s 21

Optical input power PR-30 -6 dBm 22

LOS Deassert PD-33 dBm

LOS Assert PA-45 dBm

LOS Hysteresis PD - PA0.5 4 dB

Receiver optical reflectance ROR -27 dB

Wavelength range 1500 1580 nm 23

Parameter Symbol Minimum Typical Maximum Units Notes

Input Voltage 0 2.0 VPP 24

Output Voltage 0 2.5 VPP 25

Modulation Frequency 50 500 kHz 26

Monitor Output 0 2.0 V 27

Tone Pen a l ty 0.5 dB 28

Parameter Symbol Minimum Typical Maximum Units Notes

I2C interface

(SCL and SDA)

VIL 00.3 V

CC V29

VIH 0.7 VCC VCC V29

I2C interface

(SDA output)

VOL 00.5V29

VOH VCC - 0.5 VCC V29

Notes:

21. Operation at 2.7 Gb/s and at data rates below 155 Mb/s at reduced sensitivity. Information available on request.

22. At 2.48832 Gb/s and 10-10 error rate with a PRBS 223-1 input, with a TX source ER of 8.2 dB.

23. Results up to 1610 nm available on request.

24. 1 volt pk-pk input produces approximately 12% mod depth. Mod depth is defined at the optical output as 100*(pk-pk tone /average output power).

25. Tone output voltage. Output swing is dependent on level of optical input. Under fixed optical input conditions the output variation due to mod depth

is linear.

26. Modulation frequency. –3 dB bandwidth.

27. The monitor output gives a DC voltage proportional to the modulation current and an AC pk-pk signal proportional to the tone current. Eg if DC level

is 1 volt and AC signal is 120 mV then the tone is 12% of the modulation current. This pin is used by the customer to control the signal applied to the

tone input and thereby adjust the mod depth to the desired level.

28. For modulation depth of 6% or less, at 2.48832 Gb/s and 10-10 error rate with a PRBS 223-1 input..

29. 2-wire serial interfaces each require an external 4.7 k to 10 k pull up resistor to VCC.

30. Accurate to within ±1.5 dB.

31. TX ALARM signal is high throughout the module’s start up sequence.

Ordering Information

DWDM Transceiver

AFKC-x x x x x

Code Link Distance (km)

D100

E160

Code Frequency

(THz)

Wavelength

(nm)

Code Frequency

(THz)

Wavelength

(nm)

9610 196.10 1,528.77 9360 193.60 1,548.51

9600 196.00 1,529.55 9350 193.50 1,549.32

9590 195.90 1,530.33 9340 193.40 1,550.12

9580 195.80 1,531.12 9330 193.30 1,550.92

9570 195.70 1,531.90 9320 193.20 1,551.72

9560 195.60 1,532.68 9310 193.10 1,552.52

9550 195.50 1,533.47 9300 193.00 1,553.33

9540 195.40 1,534.25 9290 192.90 1,554.13

9530 195.30 1,535.04 9280 192.80 1,554.94

9520 195.20 1,535.82 9270 192.70 1,555.75

9510 195.10 1,536.61 9260 192.60 1,556.55

9500 195.00 1,537.40 9250 192.50 1,557.36

9490 194.90 1,538.19 9240 192.40 1,558.17

9480 194.80 1,538.98 9230 192.30 1,558.98

9470 194.70 1,539.77 9220 192.20 1,559.79

9460 194.60 1,540.56 9210 192.10 1,560.61

9450 194.50 1,541.35 9200 192.00 1,561.42

9440 194.40 1,542.14 9190 191.90 1,562.23

9430 194.30 1,542.94 9180 191.80 1,563.05

9420 194.20 1,543.73 9170 191.70 1,563.86

9410 194.10 1,544.53 9160 191.60 1,564.68

9400 194.00 1,545.32 9150 191.50 1,565.50

9390 193.90 1,546.12 9140 191.40 1,566.31

9380 193.80 1,546.92 9130 191.30 1,567.13

9370 193.70 1,547.72 9120 191.20 1,567.95