(Winbond 28SGI- Vanil3334 W24257 8GENERAL DESCRIPTION The W24257 is a slow speed, low power CMOS static RAM organized as 32768 x 8 bits that operates on a single 5-voit power supply. This device is manufactured using Winbond's high performance CMOS technology. FEATURES Low power consumption: ~ Active: 400 mW (max.) - Standby: 250 pW (max) (LL-version) 500 wW (max.) (L-version) + Access time: 70/100 nS (max.) Single +5V power supply Fully static operation 32K x 8 CMOS STATIC RAM * Allinputs and outputs directly TTL compatible Three-state outputs Battery back-up operation capability Data retention voltage: 2V (min ) + Available packages: 28-pin 600 mil DIP, 330 mil SOP, 300 mil skinny DIP and SOJ PIN CONFIGURATION BLOCK DIAGRAM Von Als Cf 1 U 4] C] Voo mw [ook az (| 2 za) we pect a ae a Es m= [] as awa: | ARRAY as CI 6 "] ; a ([}e a [] noms Le a e a oe : "DATA SO C 2 rt We . eal voa SS C 7 z ) OE vei a [|e a [7] ato a [] e as [7] os PIN DESCRIPTION aa [] 1 * 1] SYMBOL DESCRIPTION vi [] 0 1 OT) 7 AQ-A14 Address Inputs ve [] 2 17 "1 yos /O1-1/08 Data Inputs/Outputs ws [Tn 1] ws cs Chip Select Input q We Write Enable Input Vex 4 45 UH p OE Output Enable input Voo Power Supply Vss Ground Publication Release Date: April 1997 Reviston AllTrsst Bost'rr s Wd4d Janl3334 W24257 Winbond TRUTH TABLE ts OE WE MODE O1-VO8 Von CURRENT H x X Not Selected High Z isp, tse . L H H Output Disable High Z loo L L H Read Data Out IDp L x L Write Data In loo DC CHARACTERISTICS Absolute Maximum Ratings PARAMETER RATING UNIT Supply Voltage to Vss Potential -0.5 to +7.0 Vv Input/Output to Vss Potential -0.5 to Von +0.5 Vv Allowable Power Dissipation 1.0 Ww Storage Temperature -65 to +150 C Operating Temperature 0 to +70 C vom Exposure ta conditions beyond these listed under Absolute Maximum Ratings may adversely affect the Hfe and reliability of the evice Operating Characteristics ' (Voo = SV +10%, Vss = OV, Ta = Oto 70C) PARAMETER SYM. TEST CONDITIONS MIN. | TYP. MAX. | UNIT Input Low Voltage VIL - -0.5 +0.8 Vv input High Voltage VIH +2.2 Voo+0.5; V Input Leakage Current | iu VIN = Vss$ to Vop -2 +2 LA Output Leakage ILO | Wo = Vss to Voo, CS = Vin 2 +2 WA Current (min.) or OE = Vin (min.) or WE = Vit (max.) Output Low Voltage Vo. | loL=+4.0 mA - 0.4 Vv Output High Voktage VOH | IOH =-1.0 mA 2.4 - V Operating Power loo | CS = Vii (min.), 70 - 0 mA YVOzOmA Suoply Current Cycle = min., 100 - 70 mA Duty = 100% Standby Power Is8 | GS = Vin (min.) - 3 mA Supply Current Cycle = min., Duty = 100% Is81_ | CS > Von -0.2V lho] - 50 yA L - 100 HA Nate: Typical characteristics are at Von = SV, Ta = 25C,ny d Trsst Seat pi 6a WOd4d J3Nr3zag4 W24257 Winbond = ine Corn, GAPACITANCE (Von = 5V, Ta = 25 C, f= 1 MHz) PARAMETER SYM. CONDITIONS MAX. UNIT Input Capacitance : CIN Vin = OV 6 pF Input/Output Capacitance Cio VouT = OV 8 pF Note: These parameters are sampled but not 100% tested. AC CHARACTERISTICS AC Test Conditions PARAMETER CONDITIONS input Pulse Levels 0.8V to 2.4V Input Rise and Fall Times 5nS Input and Output Timing Reference Level 4.5V Output Load CL = 100 pF, loH/loL = -1 MA/4 MA AC Test Loads and Waveform R1 1006 ohm R1 1000 chm Sy ea ! ees re. " | OUTPUT 4 OUTPUT - oF - LO PF 4 ; . 880 ohm ; neluding j | Including 86 860 ohm Jig and { a and i v = Scope z = Scope = (For Tez, Touz, Tenz, Tonz, Twuz, Tow) jpeenrnce 3.0N 90% 190% i \ f10% 10% Sasi + =} 5a Publication Release Date: April 1997 Revision Al]ZIsGT abet PT 6a WOd4 Tanrgo34 | W24257 Winbond AC Characterishes, continued (Wop = SV 210%, Vss = OV, TA =O ta APC) Read Cycle PARAMETER SYM. W24257-70 W24257-10 UNIT MIN. MAX. MIN. MAX. Read Cycle Time TRG 70 : 100 - as Address Access Time TAA - 70 - 100 ns Chip Select Access Time TAcS - 70 - 100 ns Output Enable to Output Valid TAOE - 35 - 50 ns Chip Selection to Output in Low Z Te.z* 10 - 10 - ns Output Enable to Output in Low Z ToLz* 5 - 5 - ns Chip Deselection to Output in High Z TcHz* - 30 - 35 ns Output Disable to Output in High 2 ToHz" - 30 - 35 ns Output Hold from Address Change TOH 10 - 10 - ns These parameters are sampled but not 100% tested Write Cycle PARAMETER SYM. W24257-70 W24267-10 UNIT MIN. MAX. MIN. MAX. Write Cycle Time Twe 70 - 100 - ns Chip Selection to End of Wrte Tow 60 - 80 - ns Address Valid to End of Write TAW 60 - 80 - ns Address Setup Time Tas 0 - 0 - ns Write Pulse Width Twp 45 - 60 - ns Write Recovery Time CS, WE | TWR 0 - 0 - ns Data Valic to End of Write TOW 30 - 40 - ns Data Hold from End of Write TOH 0 - 0 - ns Write to Output in High Z TWH2" - 30 - 30 ns Output Disable to Output in High Z ToHz* - 30 - 30 ns Output Active from End of Write Tow 0 - a : ns + These parameters are sampled but not 100% testedS d TTist S66T'et 6a WOdd JaAnI3g334 W24257 Winbond TIMING WAVEFORMS Read Cycle 1 (Address Controlled) Padres, Soe : Qout > K | Read Cycle 2 (Chip Select Controlled) = W777. i to | ~ XXXX | Read Cycle 3 (Output Enable Controlied) pannee TRC Address x SC be TRA * @ \AAAARAA SALLLL LLL L to TAGE hy Tow ween ss \ \ \ N N \ [rou | t- es a eae TOHE mo You Publication Release Date: April 1997 ~j5- Revision AllCVinbond Timing Waveforms, continued Write Cycte 1 2Tist s66 tr t's6ea WO43 JT3nl3334 W24257 Addret& m | KAAAAAN al ANAS ZZZZLLZZ. TAN Al ww =6UCSSSSSSSS ON C0 OOOO Write Cycle 2 (OE = Vi Fixed) TWe ___+ Address v MX _ Tew _* TWR_'4_ # \AXAAAA LLLLLLLLL vemeenaanreens TAN ; WE on Tae \ \ i Twe eal Tey wot Dour \V SS SS TOON fn Tew CNR ZLLLLLL LLLS | a, wa TOW pla TOH ~ - CXXXXX Notes: 1. During this period, 1/0 pins are in the output state, so Input signals of opposite phase to the outputs should not be applied. 2. The data output from Oour are the same as the data written to Oin during the write cycle 3. Dour provides the read data for the next address. 4, Tranattion is measured +500 mV from steady state with C. = 5 pF. This parameter is guaranteed but not 100% tested.Frist s6on tpt "6a Wood 4 W24257 Winbond = lectromics Corn DATA RETENTION CHARACTERISTICS (Ta = Oto 70" C) PARAMETER SYM. | TESTCONDITIONS | MIN. | TYP.| MAX, | UNIT Vop for Data Retention VOR |GS 2 Vop -0.2V 2.0] - - V Data Retention Current loonR | CS > Voo -0.2V Lit - - 20 | yA Vdd = 3V L - - 50 | yA Chip Deselect to Data Retention Time} TcoR | See data retention 0 - - ns Operation Recovery Time TR waveform Tre*| - - ns Tre* = Read Cycle Time DATA RETENTION WAVEFORM DATA RETENTION MODE v " 45V VOR 3 2V 4iN Toor TR ~ as Vin 81 2 Yoo 0 av Vi | ORDERING INFORMATION PART NO. ACCESS OPERATING STANDBY PACKAGE TIME (nS} CURRENT CURRENT MAX. (mA) MAX. (mA) W24257-70LL 70 80 50 800 mil DIP W24257-70L 70 80 100 600 mil DIP W24257-10L 100 70 100 600 mil DIP W242575-70LL 70 80 50 330 mil SOP W242578-70L 70 80 100 330 mil SOP W24257S-10L 400 70 100 330 mil SOP W24257K-70LL 70 80 50 300 mil Skinny W24257K-70L 70 80 100 300 mil Skinny W24257K-10L 700 70 100 300 mil Skinny W24287-79LL 70 80 50 300 mil SOU W24267J-70L 70 80 100 300 mil SOJ W24257J-190L 100 70 100 300 mil SOV Notes: 1. Winbond reserves the right to maka changes to its products without prior notice. 2. Purchasers are responsible for performing appropnate quality assurance testing on products intended for use In applications where personal injury might occur as a consequence of product fallure, Publication Release Date: April 1997 f= Revision AT] Vania33a4BI d CHinbond Package Dimensions, continued 28-pin SO Wide Body Woad W24257 Janta334 Cromeina & iehes!__ Om taco Symbot yan, Worm] Stax | won Tom] wax A =f loml ne By joo | | jsf Bs (9008 [0000 forax fam [2a | 282 Bolo ja0te Joo fom var [art . Ss. Gana {9G f00:0 | om | aZ5 Tose | 279 fone ant fee] 0398 [oss jos fom fast [as fe oo [oom fom ri [1a | ter | fie 19499 [oans [onze ftie1 foret t2 42 L O02 foow foom | gr oa ard ike e060 luce? juom fim fa ig z _ 20a? _ 11% Yn 7 | = [sow j | [ow a =) on Pe Ty Notes 1. Comension OD Max. & 8 inckade fond tash or te ber burs Fees hat incucde camber Protervirines > BORO recone 4 Contreiing dimensiory inches 4 Sr ere sent ahead be baaed on fired Wausl ingpecbon spec, 28-pin Small Outline J Band " , E a oS Oa Se { { a Ws) Few e So eae t or oy 7 fee 4 Craension in inches! Cam new = Min. | Nar, Me | wen | |@om, Max. | A _ jane _ _ poe Ay [oar |) ~ | fom fie Aa [20% form [ots faa fan | 37 be [ace fous joow Tom ton Tsar] 5 b Gow loom fouo fuas | onn Loe c boon iow foo foo fom jaw | Pp [ara jrzso Ff fey bay Ba: Jaw ose tan [te | Tis _ el Gnu ton jaoss tis [iz } v42 a OME jor 1926 162 fares jax He )037 fossy lua beat tam en] L vorr jong? [coor fiw [oa tae 8 pj sous | [tte yo ool a fom f Poe Qo few ig ew Notes 4 rarer D Max &Sindude metd tag ohebe 2 Dimension & does nef Indus dente Prefrustortrinidicn, 3 Dimension 0 & Eindude mold mismatch ore determined at tie metd parting fine t Garng der Pere Sr ee gee sna be bane * ie eae ~fQ.B66T rT 8B Winbond = Pyectrontes Corp. PACKAGE DIMENSIONS 28-pin P-DIP WOdd W24257 Aa er eb O O o AR Set ne Be ae Bd eel el Oe In inatroe | Bi mes fymbd | Min | Nom, Stax. | Min {Nom!) Baw A. | tom] ) {535 BO verre ibe ele A, [St jos ais p3at | Awe 1406 | 208 [acm ino foes Joes joe Be oma [ates foo jar jis | ie tow [aow juow [92 [ass [om D tea 1470 | tees [a7 Fate [oem ano trem [3a jtsa0 FE, {00 fous ass [11 fom a7 e L a Ba Taeesih verbo van roo ? aim jom avo jae [sa0 | 4 of{i ao Tei | oan foo 190m (18H FIG htrwe 5 | tm! ] 2 Notes. 4 Simereacn D Mex & Sincide mdd tesh Ge bar tazre, 2. Oimersion 24 does net indutie intettend flash 5 a, peed Ee mee . 4. Cimension 6 & 64 ince mod msredch and ae hy BREUER EO Bese Pane i a Seren Bt does nat hedete Gomer SOEUR EEL sere : rave, ss! it ; , Qaniraing dmension, inches, a penne eed 6 Gervral ened be based on fre . fral wad mapedtion spec 28-pin P-DIP Skinny 1 in tctran nm BvD an [Nom | iam | fin [Nom | Gaz A io ae foam fo jaa aA jolt [- fos fo]: A, [uns [oi fom [aw fan pra a [dow loos [oan [oa fom fom Go 2 Oe [nom [oom | ia? fais jim Rees Poe er < aco [ont lonte (o90 fom lax | = | D fiws [tam | boa farm | Co oO g [eae [soe [ese [rap 7a pod 9 5, coms [pzan [ois | 7te | 782 | faa Dd at Gd ge het hl ye bal Gl hal Got bot ig 2, lem [aim fae [oa Saw ton , * L pata 1h1 jae 16 a Ag ee ee en [ome jose [osm [aa fan [seo s Fu | foass | ? [eee , Notes: * Gunercion D en 6 S mrduaie mold ash or be burs. | 2 Dimenvion E11 does not tnotude Interiead tach. Te 1 exp Porm ws i fal 3 Dimension O & F1 inciuds mold mbsmatoh and a r FT TUT al rr are determined at the maid parting line. ry cL 4. Dunencion B17 does not incude dambar | if 4 Profusavinousen. y Low Mounting Pare : 5 Controding dimension inches. awe . 1. 1 @ Gerard! 2ppearsnes oper. cheutd be ba tad on % fois fina! Visual Wisnecton Bpec. Publication Release Date. April 1997 -9- Revision All Qanlai34pt ist Sesto rt 6a Woda W24257 Winbond = tes Conn. BONDING PAD DIAGRAM CHA GOOKEAAAABA a Fi 3 1 -127.08 2785.05 Fy" CONES NE NS MMS a 2 377.73 2785.05 s = 3 628,38 2785.05 4 -879.03 2785.05 5 -1129.68 2785.05 6 -1380.33 2785.05 ? -1686.51 2640.06 8 -1682.01 -2645.91 ' 9 ~1448.10 -2802.51 10 -1090.80 -2802.51 , 11 -877.32 -2807 28 12 ~627.84 -2807.28 | 13 ~349.56 -2807.28 148-1 ~155.52 -2781.00 148-2 ~7.02 -2771.64 15 249.21 -2807.28 16 498.69 -2807.28 [F i 3) 17 776.97 -2807.28 i . 18 1026.45 -2807.28 at OGG a Vas ali os 19 1304.73 -2807.28 - 20 1689.30 2802.51 21 1686.51 -2520.90 22 1686.51 2644.74 23 1459.17 2785.05 24 1208.52 2785.05 25 957.87 2785.05 26 707.22 2785.05 27 456.57 2785.05 285-1 205.92 2771.55 288-2 21.42 2780.91 Note: For bare chip form (C.O B ) applications, the substrate must be connected to Von or left floating in the PCS layout. Vanl35354