JANSR2N7439 Data Sheet Formerly Available As FSL923A0R4, Radiation Hardened, SEGR Resistant, P-Channel Power MOSFETs The Discrete Products Operation of Intersil has developed a series of Radiation Hardened MOSFETs specifically designed for commercial and military space applications. Enhanced Power MOSFET immunity to Single Event Effects (SEE), Single Event Gate Rupture (SEGR) in particular, is combined with 100K RADS of total dose hardness to provide devices which are ideally suited to harsh space environments. The dose rate and neutron tolerance necessary for military applications have not been sacrificed. The Intersil portfolio of SEGR resistant radiation hardened MOSFETs includes N-Channel and P-Channel devices in a variety of voltage, current and on-resistance ratings. Numerous packaging options are also available. This MOSFET is an enhancement-mode silicon-gate power field-effect transistor of the vertical DMOS (VDMOS) structure. It is specially designed and processed to be radiation tolerant. The MOSFET is well suited for applications exposed to radiation environments such as switching regulation, switching converters, motor drives, relay drivers and drivers for high-power bipolar switching transistors requiring high speed and low gate drive power. This type can be operated directly from integrated circuits. Also available at other radiation and screening levels. See us on the web, Intersil' home page: http://www.semi.intersil.com. Contact your local Intersil Sales Office for additional information. JANSR2N7439 PACKAGE TO-205AF File Number 4639 Features * 5A, -200V, rDS(ON) = 0.670 * Total Dose - Meets Pre-RAD Specifications to 100K RAD (Si) * Single Event - Safe Operating Area Curve for Single Event Effects - SEE Immunity for LET of 36MeV/mg/cm2 with VDS up to 80% of Rated Breakdown and VGS of 10V Off-Bias * Dose Rate - Typically Survives 3E9 RAD (Si)/s at 80% BVDSS - Typically Survives 2E12 if Current Limited to IDM * Photo Current - 3.0nA Per-RAD(Si)/s Typically * Neutron - Maintain Pre-RAD Specifications for 1E13 Neutrons/cm2 - Usable to 1E14 Neutrons/cm2 Symbol D G S Packaging TO-205AF Ordering Information PART NUMBER January 1999 BRAND JANSR2N7439 Die Family TA17797. MIL-PRF-19500/658. D 4-1 G S CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999 JANSR2N7439 Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified Drain to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDS Drain to Gate Voltage (RGS = 20k) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Continuous Drain Current TC = 25oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID TC = 100oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Maximum Power Dissipation TC = 25oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT TC = 100oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Single Pulsed Avalanche Current, L = 100H, (See Test Figure) . . . . . . . . . . . . . . . . . . . . . .IAS Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IS Pulsed Source Current (Body Diode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ISM Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL (Distance >0.063in (1.6mm) from Case, 10s Max) Weight (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . JANSR2N7439 -200 -200 UNITS V V 5 3 15 20 A A A V 25 10 0.20 15 5 15 -55 to 150 300 W W W/oC A A A oC oC 1.0 g CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Specifications TC = 25oC, Unless Otherwise Specified PARAMETER Drain to Source Breakdown Voltage Gate Threshold Voltage SYMBOL BVDSS VGS(TH) Zero Gate Voltage Drain Current Gate to Source Leakage Current Drain to Source On-State Voltage Drain to Source On Resistance Turn-On Delay Time IDSS IGSS VDS(ON) Fall Time Total Gate Charge (Not on slash sheet) VGS = VDS, ID = 1mA VDS = -160V, VGS = 0V VGS = 20V TC = -55oC TC = 25oC TC = 125oC TC = 25oC TC = 125oC TC = 25oC TC = 125oC MAX UNITS -200 - - V - - -7.0 V -2.0 - -6.0 V -1.0 - - V - - 25 A - - 250 A - - 100 nA - - 200 nA - -3.7 V - 0.560 0.670 TC = 125oC - - 1.20 - - 30 ns - - 30 ns td(OFF) - - 60 ns tf - - 35 ns - - 60 nC - 36 40 nC - - 2.4 nC nC rDS(ON)12 VGS = -12V, ID = 5A TYP - tr Turn-Off Delay Time ID = 1mA, VGS = 0V MIN TC = 25oC td(ON) Rise Time TEST CONDITIONS ID = 3A, VGS = -12V VDD = -100V, ID = 5A, RL = 20, VGS = -12V, RGS = 7.5 Qg(TOT) VGS = 0V to -20V Gate Charge at 12V Qg(12) VGS = 0V to -12V Threshold Gate Charge (Not on slash sheet) Qg(TH) VGS = 0V to -2V VDD = -100V, ID = 5A Gate Charge Source Qgs - 6.0 7.6 Gate Charge Drain Qgd - 16 18 nC Thermal Resistance Junction to Case RJC - - 5 oC/W Thermal Resistance Junction to Ambient RJA - - 175 oC/W 4-2 JANSR2N7439 Source to Drain Diode Specifications PARAMETER SYMBOL Forward Voltage TEST CONDITIONS VSD Reverse Recovery Time ISD = 5A trr MIN TYP MAX -0.6 - -1.8 V - - 190 ns ISD = 5A,dISD/dt = 100A/s Electrical Specifications up to 100K RAD UNITS TC = 25oC, Unless Otherwise Specified PARAMETER SYMBOL TEST CONDITIONS MIN MAX UNITS Drain to Source Breakdown Volts (Note 3) BVDSS VGS = 0, ID = 1mA -200 - V Gate to Source Threshold Volts (Note 3) VGS(TH) VGS = VDS, ID = 1mA -2.0 -6.0 V Gate to Body Leakage (Notes 2, 3) IGSS VGS = 20V, VDS = 0V - 100 nA Zero Gate Leakage (Note 3) IDSS VGS = 0, VDS = -160V - 25 A Drain to Source On-State Volts (Notes 1, 3) VDS(ON) VGS = -12V, ID = 5A - -3.7 V Drain to Source On Resistance (Notes 1, 3) rDS(ON)12 VGS = -12V, ID = 3A - 0.670 NOTES: 1. Pulse test, 300s Max. 2. Absolute value. 3. Insitu Gamma bias must be sampled for both VGS = -12V, VDS = 0V and VGS = 0V, VDS = 80% BVDSS . Single Event Effects (SEB, SEGR) Note 4 ENVIRONMENT (NOTE 5) TEST SYMBOL Single Event Effects Safe Operating Area SEESOA ION SPECIES TYPICAL LET (MeV/mg/cm) TYPICAL RANGE () APPLIED VGS BIAS (V) (NOTE 6) MAXIMUM VDS BIAS (V) Ni 26 43 20 -200 Br 37 36 5 -200 Br 37 36 10 -160 Br 37 36 15 -100 Br 37 36 20 -40 NOTES: 4. Testing conducted at Brookhaven National Labs; sponsored by Naval Surface Warfare Center (NSWC), Crane, IN. 5. Fluence = 1E5 ions/cm2 (typical), TC = 25oC. 6. Does not exhibit Single Event Burnout (SEB) or Single Event Gate Rupture (SEGR). Typical Performance Curves Unless Otherwise Specified LET = 26MeV/mg/cm2, RANGE = 43 LET = 37MeV/mg/cm2, RANGE = 36 LIMITING INDUCTANCE (HENRY) 1E-3 FLUENCE = 1E5 IONS/cm2 (TYPICAL) -200 VDS (V) -160 -120 -80 -40 TEMP = 25oC 0 0 5 1E-4 ILM = 10A 30A 1E-5 100A 300A 1E-6 1E-7 10 15 20 25 VGS (V) FIGURE 1. SINGLE EVENT EFFECTS SAFE OPERATING AREA 4-3 -10 -30 -100 -300 DRAIN SUPPLY (V) FIGURE 2. DRAIN INDUCTANCE REQUIRED TO LIMIT GAMMA DOT CURRENT TO IAS -1000 JANSR2N7439 Typical Performance Curves Unless Otherwise Specified (Continued) 7 50 TC = 25oC ID , DRAIN CURRENT (A) 6 ID , DRAIN (A) 5 4 3 2 10 100s 1ms 1 10ms OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON) 1 0.1 -1 0 -50 0 50 100 150 100ms -10 TC , CASE TEMPERATURE (oC) -500 -100 VDS , DRAIN-TO-SOURCE VOLTAGE (V) FIGURE 3. MAXIMUM CONTINUOUS DRAIN CURRENT vs TEMPERATURE FIGURE 4. FORWARD BIAS SAFE OPERATING AREA 2.5 NORMALIZED rDS(ON) PULSE DURATION = 250ms, VGS = -12V, ID = 3A QG -12V QGD QGS VG 2.0 1.5 1.0 0.5 0.0 -80 CHARGE -40 0 40 80 120 160 TJ , JUNCTION TEMPERATURE (oC) FIGURE 5. BASIC GATE CHARGE WAVEFORM FIGURE 6. NORMALIZED rDS(ON) vs JUNCTION TEMPERATURE THERMAL RESPONSE (ZJC) 10 1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 PDM 0.01 SINGLE PULSE 0.001 10-5 10-4 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC + TC 10-3 10-2 t1 t2 10-1 100 t, RECTANGULAR PULSE DURATION (s) FIGURE 7. NORMALIZED MAXIMUM TRANSIENT THERMAL RESPONSE 4-4 101 JANSR2N7439 Typical Performance Curves Unless Otherwise Specified (Continued) IAS , AVALANCHE CURRENT (A) 30 STARTING TJ = 25oC 10 STARTING TJ = 150oC IF R = 0 tAV = (L) (IAS) / (1.3 RATED BVDSS - VDD) IF R 0 tAV = (L/R) ln [(IAS*R) / (1.3 RATED BVDSS - VDD) + 1] 1 0.01 0.1 1 tAV, TIME IN AVALANCHE (ms) 10 FIGURE 8. UNCLAMPED INDUCTIVE SWITCHING Test Circuits and Waveforms ELECTRONIC SWITCH OPENS WHEN IAS IS REACHED VDS L BVDSS + CURRENT I TRANSFORMER AS tP - VARY tP TO OBTAIN REQUIRED PEAK IAS 0V VDS IAS VDD + 50 - tP VDD 50V-150V DUT 50 VGS 20V tAV FIGURE 9. UNCLAMPED ENERGY TEST CIRCUIT FIGURE 10. UNCLAMPED ENERGY WAVEFORMS tON VDD tOFF td(ON) td(OFF) tr RL VDS tf 90% 90% VDS 0V 10% DUT 10% 90% VGS = -12V RGS 50% VGS 50% PULSE WIDTH 10% FIGURE 11. RESISTIVE SWITCHING TEST CIRCUIT 4-5 FIGURE 12. RESISTIVE SWITCHING WAVEFORMS JANSR2N7439 Screening Information Screening is performed in accordance with the latest revision in effect of MIL-S-19500, (Screening Information Table) Delta Tests and Limits (JANS) TC = 25oC, Unless Otherwise Specified PARAMETER SYMBOL TEST CONDITIONS MAX UNITS Gate to Source Leakage Current IGSS VGS = 20V 20 (Note 7) nA Zero Gate Voltage Drain Current IDSS VDS = 80% Rated Value Drain to Source On Resistance rDS(ON) TC = 25oC at Rated ID Gate Threshold Voltage VGS(TH) ID = 1.0mA 25 (Note 7) A 20% (Note 8) 20% (Note 8) V NOTES: 7. Or 100% of Initial Reading (whichever is greater). 8. Of Initial Reading. Screening Information TEST JANS Gate Stress VGS = -30V, t = 250s Pind Required Pre Burn-In Tests (Note 9) MIL-S-19500 Group A, Subgroup 2 (All Static Tests at 25oC) Steady State Gate Bias (Gate Stress) MIL-STD-750, Method 1042, Condition B VGS = 80% of Rated Value, TA = 150oC, Time = 48 hours Interim Electrical Tests (Note 9) All Delta Parameters Listed in the Delta Tests and Limits Table Steady State Reverse Bias (Drain Stress) MIL-STD-750, Method 1042, Condition A VDS = 80% of Rated Value, TA = 150oC, Time = 240 hours PDA 5% Final Electrical Tests (Note 9) MIL-S-19500, Group A, Subgroups 2 and 3 NOTE: 9. Test limits are identical pre and post burn-in. Additional Screening Tests PARAMETER SYMBOL Safe Operating Area SOA Unclamped Inductive Switching TEST CONDITIONS VDS = -160V, t = 10ms MAX UNITS 0.71 A IAS VGS(PEAK) = -15V, L = 0.1mH 15 A Thermal Response VSD tH = 10ms; VH = -25V; IH = 1A 60 mV Thermal Impedance VSD tH = 500ms; VH = -25V; IH = 1A 230 mV 4-6 JANSR2N7439 Rad Hard Data Packages - Intersil Power Transistors 1. JANS Rad Hard - Standard Data Package A. Certificate of Compliance B. Serialization Records C. Assembly Flow Chart D. SEM Photos and Report E. Preconditioning - Attributes Data Sheet - Hi-Rel Lot Traveler - HTRB - Hi Temp Gate Stress Post Reverse Bias Data and Delta Data - HTRB - Hi Temp Drain Stress Post Reverse Bias Delta Data F. Group A - Attributes Data Sheet G. Group B - Attributes Data Sheet H. Group C - Attributes Data Sheet I. Group D - Attributes Data Sheet 2. JANS Rad Hard - Optional Data Package A. Certificate of Compliance B. Serialization Records C. Assembly Flow Chart D. SEM Photos and Report E. Preconditioning - Attributes Data Sheet - Hi-Rel Lot Traveler - HTRB - Hi Temp Gate Stress Post Reverse Bias Data and Delta Data - HTRB - Hi Temp Drain Stress Post Reverse Bias Delta Data - X-Ray and X-Ray Report F. Group A - Attributes Data Sheet - Hi-Rel Lot Traveler - Subgroups A2, A3, A4, A5 and A7 Data G. Group B - Attributes Data Sheet - Hi-Rel Lot Traveler - Subgroups B1, B3, B4, B5 and B6 Data H. Group C - Attributes Data Sheet - Hi-Rel Lot Traveler - Subgroups C1, C2, C3 and C6 Data I. Group D - Attributes Data Sheet - Hi-Rel Lot Traveler - Pre and Post Radiation Data 4-7 JANSR2N7439 TO-205AF 3 LEAD JEDEC TO-205AF HERMETIC METAL CAN PACKAGE INCHES OD OD1 SYMBOL P A SEATING PLANE h L Ob e e1 2 e2 1 90o 3 45o j k MIN MILLIMETERS MAX MIN MAX NOTES A 0.160 0.180 4.07 4.57 - Ob 0.016 0.021 0.41 0.53 2, 3 OD 0.350 0.370 8.89 9.39 - OD1 0.315 0.335 8.01 8.50 - e 0.095 0.105 2.42 2.66 4 e1 0.190 0.210 4.83 5.33 4 e2 0.095 0.105 2.42 2.66 4 h 0.010 0.020 0.26 0.50 - j 0.028 0.034 0.72 0.86 - k 0.029 0.045 0.74 1.14 - L 0.500 0.560 12.70 14.22 3 P 0.075 - 1.91 - 5 NOTES: 1. These dimensions are within allowable dimensions of Rev. E of JEDEC TO-205AF outline dated 11-82. 2. Lead dimension (without solder). 3. Solder coating may vary along lead length, add typically 0.002 inches (0.05mm) for solder coating. 4. Position of lead to be measured 0.100 inches (2.54mm) from bottom of seating plane. 5. This zone controlled for automatic handling. The variation in actual diameter within this zone shall not exceed 0.010 inches (0.254mm). 6. Lead no. 3 butt welded to stem base. 7. Controlling dimension: Inch. 8. Revision 3 dated 6-94. All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 4-8 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029