10 3.43 Leap (0.5) | (PITCH) 0.7 pa 1.6 | 0.17 Pe LOCK PORTION Ow FAR DETAIL 2.83 4.3 H Oy RL FAK NO LOCK PORTION ESC NOTES: Me MATERIAL _ INDYUTI2 LCP ORERKUIV) . ASA _ mE. UL9AV-O HOUSING: ide fo CRYSTAL POLYMER),GLASS FILLED,BLACK,UL94V-O 2 Mae (t=O. 15) Tenis COPPER ALLOY(+=0. I5) mae (t=O. 2) Nall L BpoE ALLOY(F=0.2) 2. Aye PLATING = imabs xt O. 26VY77OX-b/ LAE. CONTACT AREA:GOLD 0.25 MICROMETER MINIMUM. +AU: BXvE O. 4V17OXbILEAP. SOLDER TAIL AREA:GOLD 0.4 MICROMETER MAXMUM. Mbxy eS yTILXYs 1. SVIIOXP ILE UNDER PLATING:NICKEL 1.5 MICROMETER MINIMUM. RIL NAIL EXY= 3. OYTIOXFILELE, Sn-Pb 3.0 MICROMETER MINIMUM. Pious sXe 1. OVTIOXbILELE. UNDER LATING: cu ee MICROMETER MINIMUM. Teen S Qe CBR Rp ate TILERT ILE GFRETE TAIL Sb ANABITY, 79 BE 0.08 MAXMUM.TAILS AND NAILS COPLANARITY TO BE 0.1 MAXMUM. Ale: 54363 2k 2k 2 ok o MATED CONN.:54363-*+#* 30.55 31.75] 29.5 |32.75| 55201-1208 95201-1201 120 12 13 .05 14.25} 12 |15.25| 55201-0508 95201-0501 50 20 10.55] 11.75] 9.5 [12.75] 55201-0408 55201-0401 40 30 8.0519.25| 7 110.25) 55201-0308 5520 |-030| 30 20 5.55/6.75|4.5 | 7.75| 55201-0208 95201-0201 20 Ow FR LOCKS TU RA aa aes cy} 8B FUBOSSED TAPE PACKAGING | MATERIAL NO. A hae CIRCUITS SCALE N q REVISED EC NO: J2009-0259 2008/08/07 2008/08/07 2008/12/47 DESCRIPTION CHKD:THARUYAMA APPR:NUKITA GENERAL TOLERANCES (UNLESS SPECIFIED) DIMENSION STYLE SCALE DESIGN UNITS MM ONLY Oc] THIRD. ANGLE 10:1 METRIC PROJECTION DRAWN BY DATE 10 UNDER 0.2 0.5 MM PITCH B/B CONN, PLUG HSG ASSY(H=2MM) H.SHIMOYAMA = '98/06/24 CHECKED BY DATE 10 OVER 30 UNDER +0.25 M. SASAQ "98/06/24 EITH FITTING NAIL 3 QOveER +0.3 APPROVED BY DATE iKESUGI 98/06/24 Hole ~MOLEX INCORPORATED ANGULAR +3 3 MATERIAL NO. DOCUMENT NO. SHEET NO. TIDRWN:YOSHIDAM REV DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS SEE TABLE SD-55201-007 1_OF 2 SIZE! THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX AS INCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION Rev. E 2006/04/15 b_frame_A3_J_ME_S 5 4 | 3 | 2 | EN-o2JA(02)10 9 8 7 6 5 4 3 2 1 lf (FLAT) c 77540.) B+0.05 1.77540. 1 |.3+0.05 Y) TYP. Yj 0.840.05 eho TYP. 0,540.05 0.340.05,_| _ pt fy TZ ; (PITCH) TYP. 3 oO 0.5 | | (3.3) | | 0.5 Wi settee (FLAT) | = FLAT) 7 ~-- SUITE CHIE, DUSTED Wy -- -- = ------ 4 Lo DETAIL FOR SOLDERING AND VACUUM AREA > S RO.5+0.| _ Ss 5+0, : i Ln TYP. a ie) = RECOMMENDED PCB PATTERN LAYOUT (SCALE:5- I) Tanera DETAIL T ss = GENERAL TOLERANCES DIMENSION STYLE SCALE DESIGN UNITS THIRD ANGLE seo (UNLESS SPECIFIED) MM ONLY 20:1 METRIC | Cl PROJECTION Ss s s DRAWN BY DATE TITLE a ~*S1 2) 4 UNDER +02 H.SHIMOYAMA 98/06/24 0.5 MM PITCH B/B CONN. a. |E OVER UNDER T. CHECKED BY DATE PLUG HSG ASSY (H=2MM) azs [5 10 30 +0.25 M.SASAO "98/06/24 WITH FITTING NAIL ot WW APPROVED BY DATE OR 52 = (30% +03 WH IKESUG! "98/06/24 iKoldx MOLEX INCORPORATED Y S = e| [ANGULAR +3 MATERIAL NO. DOCUMENT NO. SHEET NO. no2=t DRAFT WHERE APPLICABLE SEE TABLE SD-55201-007 2 OF 2 Pi OO = _ MUST REMAIN SIZE] THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX F iB WITHIN DIMENSIONS A SJINCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION to rane ASHES 5 3 7 6 | 5 4 3 | 2 | EN-o2JA(02)