ZIGBIT 900MHZ WIRELESS MODULES
ATZB-X0-256-4-0-CN
DATASHEET
Features
• Compact size (38.5 x 20.0mm)
• High RX sensitivity (-103dBm)
• Outperforming link budget (up to +112dB)
• Up to +9.0dBm output power
• Very low power consumption:
• 8.7mA in RX mode (1)
• 34.8mA in TX mode (1)
• 0.6µA in sleep mode (2)
• Ample memory resources (256KB In-System, Self-Programmable Flash memory,
4KB EEPROM, 16KB SRAM)
• Wide range of interfaces (both analog and digital)
• 4-wire SPI, TWI
• ISP, JTAG
• Two analog comparator input
• UART, USART
• Timer, PWM
• Four ADC lines
• External Clock Input, Internal Clock Output
• Up to 32 lines configurable as GPIO
• Preassigned Atmel® MAC address that can be used on end product
• Capability to use MAC address into the internal EEPROM
• IEEE® 802.15.4 compliant Transceiver
• 900MHz ISM band
• Serial bootloader
• High Performance Low Power Atmel AVR® XMEGA® 8- and 32-bit Microcontroller
• Rapid design-in with built-in Chip Antenna
• RF Test point using MS-147 RF connector
• Small physical footprint and low profile for optimum fit in very small application
boards
• Mesh networking capability
• Easy-to-use low cost development kit
• Single source of support for HW and SW
• Worldwide license-free operation
Notes: 1. MCU is in active state with 3V Supply, CPU clock @ 16MHz, RX RPC enabled (for RX current),
PHY_TX_PWR=0x0 (for TX current), all digital outputs pulled high.
2. Controller Sleep Mode: SLEEP_MODE_PWR_DOWN.
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Table of Contents
1. Introduction ........................................................................................ 3
1.1 Summary ........................................................................................................... 3
1.2 Applications ....................................................................................................... 3
1.3 Abbreviations and Acronyms ............................................................................ 3
1.4 Related Documents ........................................................................................... 4
2. ZigBit Module Overview ..................................................................... 5
2.1 Overview ........................................................................................................... 5
3. Specifications ..................................................................................... 7
3.1 Electrical Characteristics ................................................................................... 7
3.1.1 Absolute Maximum Ratings ................................................................ 7
3.1.2 Power Supply ...................................................................................... 7
3.1.3 RF Characteristics .............................................................................. 8
3.1.4 ATxmega256A3U Microcontroller Characteristics .............................. 9
3.1.5 Module Interfaces Characteristics ....................................................... 9
3.2 Physical/environmental Characteristics and Outline ......................................... 9
3.3 Pin Configuration ............................................................................................. 10
3.4 Antenna Orientation Recommendation ........................................................... 11
3.5 Mounting Information ...................................................................................... 11
3.6 Soldering Profile .............................................................................................. 14
3.7 Antenna Reference Designs ........................................................................... 14
4. Schematics ...................................................................................... 15
4.1 Handling Instructions ....................................................................................... 20
4.2 General Recommendations ............................................................................ 20
5. Persistence Memory ........................................................................ 21
6. Ordering Information ........................................................................ 22
7. Agency Certifications ....................................................................... 23
7.1 United States (FCC) ........................................................................................ 23
7.2 Industry Canada (IC) Compliance Statements ................................................ 23
8. Revision History ............................................................................... 25
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1. Introduction
1.1 Summary
ATZB-X0-256-4-0-CN ZigBit® is an ultra-compact and low-power 900MHz IEEE 802.15.4/ZigBee® OEM module from
Atmel. Based on the innovative mixed-signal hardware platform from Atmel, this module uses the ATxmega256A3U [1]
Microcontroller and AT86RF212B [5] 700/800/900MHz ISM band Transceiver. The radio transceiver provides high data
rates from 20kb/s up to 1Mb/s, frame handling, outstanding receiver sensitivity and high transmit output power enabling
a very robust wireless communication. The module is designed for wireless sensing, monitoring, control, data
acquisition applications, to name a few. This ZigBit module eliminates the need for costly and time-consuming RF
development, and shortens time-to-market for wireless applications.
The module has an MS-147 RF connector that can be used as an RF test port. The built-in chip antenna is designed
and tuned for the ZigBit design to enable quick integration of the ZigBit into any application.
1.2 Applications
The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing
mesh network, while optimizing network traffic and minimizing power consumption.
For detailed software support information, visit http://www.atmel.com/products/wireless.
The applications include, but are not limited to:
• Building automation and monitoring
• Lighting controls
• Wireless smoke- and CO-detectors
• Structural integrity monitoring
• HVAC monitoring and control
• Inventory management
• Environmental monitoring
• Security
• Water metering
• Industrial monitoring
• Machinery condition and performance monitoring
• Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity,
vibration, etc.
• Automated meter reading (AMR)
1.3 Abbreviations and Acronyms
ADC Analog-to-Digital Converter
API Application Programming Interface
DC Direct Current
DTR Data Terminal Ready
EEPROM Electrically Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
GPIO General Purpose Input/output
HAF High Frequency
HVAC Heating, Ventilating, and Air Conditioning
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HW Hardware
I2C Inter-Integrated Circuit
IEEE Institute of Electrical and Electronics Engineers
IRQ Interrupt Request
ISM Industrial, Scientific and Medical radio band
JTAG Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface
MAC Medium Access Control layer
MCU Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit
module
NRE Network layer
OEM Original Equipment Manufacturer
OTA Over-The-Air upgrade
PA Power Amplifier
PCB Printed Circuit Board
PER Package Error Ratio
RAM Random Access Memory
RF Radio Frequency
RPC Reduced Power Consumption
RTS/CTS Request to Send/ Clear to Send
RX Receiver
SMA Surface Mount Assembly
SoC System on Chip
SPI Serial Peripheral Interface
SW Software
TTM Time-To-Market
TX Transmitter
UART Universal Asynchronous Receiver/Transmitter
USART Universal Synchronous/Asynchronous Receiver/Transmitter
USB Universal Serial Bus
ZigBee, ZigBee PRO Wireless networking standards targeted at low-power applications
802.15.4 The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network
1.4 Related Documents
[1] ATXMEGA256A3U Datasheet in http://www.atmel.com/devices/ATXMEGA256A3U.aspx?tab=documents.
[2] MS-147 Series Interface RF Connector with Switch, 3.9mm High, DC to 6GHz
http://www.hirose.co.jp/cataloge_hp/e35801505.pdf.
[3] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs).
[4] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007.
[5] AT86RF212B Datasheet in http://www.atmel.com/devices/AT86RF212B.aspx?tab=documents.
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2. ZigBit Module Overview
2.1 Overview
The ATZB-X0-256-4-0-CN ZigBit is a compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module. Based
on a solid combination of the latest Atmel MCU Wireless hardware platform, 900MHz ISM band transceiver and Atmel
Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio performance, ultra-low power
consumption and exceptional ease of integration.
Figure 2-1. ATZB-X0-256-4-0-CN User Interface Diagram
This ZigBit module contains the Atmel ATxmegaA256A3U Microcontroller and AT86RF212B 900MHz ISM band
Transceiver for ZigBee and IEEE 802.15.4 [3]. The module features 256KB In-System Self-Programmable flash
memory, 16KB SRAM, and 4KB EEPROM.
The compact all-in-one board design of MCU and Radio Transceiver with very minimal components on the RF path to
Antenna dramatically improves the ZigBit’s compact size, range performance on signal transmission and increases its
sensitivity. This ensures stable connectivity within a larger coverage area, and helps develop applications on smaller
footprint. The MS-147 connector [2] can be used as an RF Test port.
ZigBit Module contains a complete RF/MCU design with all the necessary passive components included. The module
can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module
Evaluation kit containing the ZigBit Extension board for the Atmel Xplained PRO HW Evaluation platform can be used to
develop FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU
solution, a module-based solution offers considerable savings in development time and NRE cost per unit during the
HW/FW design, prototyping, and mass production phases of product development.
All ZigBits are preloaded with a Bootloader when they are sold as Modules, either in Single units or T&R.
Depending on end-user design requirements, the ZigBit can operate as a self-contained sensor node, where it would
function as a single MCU, or it can be paired with a host processor driving the module over a serial interface.
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The MAC stack running on the host processor can then control data transmission and manages module peripherals.
Thus very minimal firmware customization is required for successful module design-in. Third-party sensors can then be
connected directly to the module, thus expanding the existing set of peripheral interfaces.
Every ZigBit Module come pre loaded with Atmel assigned 64-bit MAC address stored in the signature bytes of the
device. This unique IEEE MAC address can be used as the MAC address of the end product, so there is no need to buy
a MAC address separately for the product using the ZigBit.
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3. Specifications
3.1 Electrical Characteristics
3.1.1 Absolute Maximum Ratings
Table 3-1. Absolute Maximum Ratings (1)(2)
Parameter
Minimum
Maximum
Voltage on any pin, except RESET with respect to ground
-0.3V
3.6V (VDD max)
Input RF level
+10dBm
Current into VCC pins
200mA
Notes: 1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no
circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond those listed
under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated
in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2. Attention! ZigBit is an ESD-sensitive device. Precaution should be taken when handling the device in order to
prevent permanent damage.
3.1.2 Power Supply
Table 3-2. Test Conditions (unless otherwise stated), Vcc = 3V, Tamb = 25°C
Parameter
Range
Unit
Supply voltage, V
DD
1.8 to 3.6
V
Active Current consumption: RX mode + Max sensitivity
14.5
mA
Active Current consumption: RX mode + Least sensitivity
13.9
mA
Active Current consumption: RX mode + Max sensitivity, MCU Sleep (2)
9.3
mA
Active Current consumption: RX mode + Least sensitivity, MCU Sleep (2)
8.7
mA
Active Current consumption: TX mode (1) – BUSY_TX – Transmit state
34.8
mA
Current consumption: TRX_OFF, MCU Active
6.1
mA
Current consumption: TRX_OFF, MCU Sleep (2)
740
µA
Sleep Current consumption: TRX Sleep, MCU Sleep (2)
0.6
µA
Note 1: Output TX power (when measuring consumption in TX mode) is +9dBm.
Note 2:
a) All interfaces are set to the default state (see Table 3-8 ATZB-X0-256-4-0-CN Pinout Description).
b) JTAG is not connected.
c) CPU Clock configured when doing this measurement – 16MHz for all modes except Power save and Power down modes.
Current consumption depends on multiple factors, including but not limited to, the board design and materials, Protocol
settings, network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an
application.
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3.1.3 RF Characteristics
Table 3-3. RF Characteristics (3)
Parameter
Condition
Range
Unit
Frequency band – FCC and Industry Canada (2)
902 – 928
MHz
Numbers of channels (FCC and Industry Canada)
10
Channel spacing
2
MHz
Transmitter output power
Adjusted in 36 steps
-25 to +11
dBm
Receiver sensitivity
PER = 1%
-103
dBm
On-air data rate
20, up to 1000
Kbps
TX output/ RX input nominal impedance
For balanced
50
Ω
Range (1)
Open field, LoS, Elevated
1120
m
Notes: 1. Range measured is Line of Sight at 10ft elevation from Ground at different combinations of orientation of transmitter and receiver, with
special conditions were there is minimal or no RF interference from other sources. For best case orientation of the ZigBits to achieve
maximum range, refer to Section 3.4.
2. Appropriate FW (Register selection) must be used for operating this ZigBit in North America.
3. For detailed characteristics, refer to [2].
Table 3-4. TX Power Settings
PHY_TX_PWR 3:0 Register Value Power Register Setting [dBm] Output Power [dBm] (typical
values at RF connector)
C0
8.59
C1
8.14
80
7.43
82
5.85
83
4.97
84
4.1
40
3.58
86
2.12
00
1.4
01
0.42
02
-0.93
03
-2.09
04
-3.16
27
-4.29
91
-7.86
0D
-12.27
15 -18 -19.51
1D -25 -26.82
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3.1.4 ATxmega256A3U Microcontroller Characteristics
Table 3-5. ATxmega256A3U Characteristics
Parameter
Range
Unit
On-chip flash memory size
256K
Bytes
On-chip RAM size
16K
Bytes
On-chip EEPROM size
4K
Bytes
Operation frequency
16
MHz
3.1.5 Module Interfaces Characteristics
Table 3-6. Module Interfaces Characteristics (1)
Parameters
Condition
Range
Unit
UART maximum baud rate
115.2
Kbps
ADC conversion time (latency) (RES+2)/2+(GAIN !=0)
RES (Resolution) = 8 or 12
5-8 ClkADC cycles
ADC input resistance
Static load resistor of input signal
4.0
kΩ
ADC reference voltage (VREF)
1.0 to AVCC – 0.6
V
ADC input voltage
0 - AVDD
V
TWI maximum clock
400
kHz
GPIO High level input voltage
VCC = 2.7-3.6V
2 to VCC+0.3
V
GPIO Low level input voltage
VCC = 2.7-3.6V
-0.3 to 0.3 VDD
V
GPIO High level output voltage VOH
VCC = 3.0-3.6V
2.4 to 0.94VCC
V
GPIO Low level output voltage VOL VCC = 3.0-3.6V 0.05VCC typ.
Max. 0.4
V
Real-time oscillator frequency
32.768
kHz
Note 1: For detailed characteristics, refer to [1].
3.2 Physical/environmental Characteristics and Outline
Table 3-7. Physical Characteristics
Parameters
Value
Comments
Size
38.5 x 20.0mm
Operating temperature range
-40°C to +85°C
-40°C to +85°C operational
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3.3 Pin Configuration
Table 3-8. ATZB-X0-256-4-0-CN Pinout Description
Pin Out
Pin Descriptions
Function
1
AVSS
Analog Ground
2
AVSS
Analog Ground
3
DEVDD
Digital Power input pin
4
DEVDD
Digital Power input pin
5
RSET/PDI_CLOCK
RESET
6
PD4/SS
SPI
7
PD5/MOSI/XCK1
SPI
8
PD6/MISO/RXD1/D-
SPI
9
PD7/SCK/TXD1/D+
SPI
10
PA5
GPIO / ADC / Analog COMP+
11
PA4
GPIO/ADC/Analog Comp-
12
DVSS
Digital Ground
13
PD2/SYNC/ASYNC/OC0C/
UART
14
PD3/SYNC/TXD0/OC0D
UART
15
PD1/SCL/INT/OC0B
USART
16
PDI_DATA
PWM/TC
17
PA6
GPIO/ADC
18
PA7
GPIO/ADC
19
PB3
GPIO/ADC/DAC1
20
PB2
GPIO/ADC/DAC/intwkup
21
PF1/OC0B/INT/XCK0
INT/PWM/GPIO
22
PF2/OC0C/INT/RXD0
INT/PWM/GPIO
23
PF3/OC0D/INT/TXD0
INT/PWM/GPIO
24
PB0/IAREF/INT
ADC ref
25
PA0/ADC0/INT
ADC/ GPIO
26
PA1/ADC1/INT
ADC/ GPIO
27
PA2/ADC2/INT
ADC/ GPIO
28
PA3/ADC3/INT
ADC/ GPIO
29
DVSS
Digital Ground
30
PB6/TCK/INT
JTAG
31
PB4/TMS/INT
JTAG
32
PB7/TDO/INT
JTAG
33
PB5/TDI/INT
JTAG
34
PE3/TXD
GPIO/output counter
35
PE2/RXD
Wakeup INT
36
PE1/XCK
TWI/INT/GPIO
37
PE0
TWI/INT/GPIO
38
PE5/OC1B/INT
GPIO/TC
39
PE4/SYNC/OC1A
Master Clock out put
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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Pin Out
Pin Descriptions
Function
40
PF0
GPIO/Timer
41
DVSS
Digital Ground
42
DVSS
Digital Ground
NOTE: TXD, RXD of UART are crossed inside ZigBit Module. External UART devices connecting to ZigBit Module should follow straight
connection for UART.
UART_TXD_external_device <-> UART_TXD
UART_RXD_external_device <-> UART_RXD
3.4 Antenna Orientation Recommendation
The Antenna in this module is designed to provide the best possible LoS range in the direction indicated in this
illustration.
3.5 Mounting Information
Figure 3-1 shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on the
PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded via
several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and
losses.
Figure 3-1. ATZB-X0-256-4-0-CN Dimensions
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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Figure 3-2. ATZB-X0-256-4-0-CN Pinout
Figure 3-3. ATZB-X0-256-4-0-CN Foot Print Dimensions
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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Figure 3-4. ATZB-X0-256-4-0-CN Mounting Information (preferred placement)
Figure 3-5. ATZB-X0-256-4-0-CN Mounting Information (alternative placement)
The ZigBit’s location and orientation on the carrier board is illustrated in the above PCB Land pattern and Mounting
information drawing. The Recommended placement of ZigBit on Carrier Board needs to be accurately followed to
ensure performance on the end application.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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3.6 Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-9.
Table 3-9. Soldering profile (1)
Profile Feature
Green Package
Average ramp-up rate (217°C to peak)
3°C/s max.
Preheat temperature 175°C ±25°C
180s max.
Temperature maintained above 217°C
60s to 150s
Time within 5°C of actual peak temperature
20s to 40s
Peak temperature range
260°C
Ramp-down rate
6°C/s max.
Time within 25°C to peak temperature
8 minutes
Note: 1. The package is backward compatible with PB/Sn soldering profile.
3.7 Antenna Reference Designs
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board
material and thickness, shields, the material used for enclosure, the board neighborhood, and other components
adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit.
General Recommendations:
• Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
• Placing high profile components next to antenna should be avoided
• Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern
• ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band
frequency
The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of
high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna
pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.
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4. Schematics
The following schematic drawings for the ATZB-X0-256-4-0-CN are in the following order:
• Top level schematics
• Connector schematics
• ATxmega256A3U schematics
• AT86RF212B schematics
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
D D
C C
B B
A A
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ATZB-X0-256-4-0-CN
ATMEL Chennai
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1
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A08-1567
Xmega_212B_Connector.SchDoc
2408-Jul-14 4:02:24 PM
ATZB-X0-256-4-0-CN
ATMEL Norway
Vestre Rosten 79
N-7075 TILLER
NORWAY
PAGE: of
TITLE:
Document number: Revision: 5
Date:
OJS
MSK
*
3$B$'&B,17
3%B7&.B,17
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7
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8
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9
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10
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11
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12
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14
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15
PDI_DATA
16
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17
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18
PB3
19
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20
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21 PF2/OC0C/INT/RXD0 22
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PB0/IAREF/INT 24
PA0/ADC0/INT 25
PA1/ADC1/INT 26
PA2/ADC2/INT 27
PA3/ADC3/INT 28
PB6/TCK/INT 30
PB4/TMS/INT 31
PB7/TDO/INT 32
PB5/TDI/INT 33
PE3 34
PE2/ASYNC 35
PE1/SCL 36
PE0/SDA 37
PE5/OC1B/INT 38
GND 41
GND 29
PE4/SYNC/OC1A 39
GND 42
PF0 40
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A08-1567
Xmega_212B_MCU.SchDoc
3408-Jul-14 4:02:24 PM
ATZB-X0-256-4-0-CN
ATMEL India
RMZ Millenia
MGR Road
Chennai
PAGE: of
TITLE:
Document number: Revision: 5
Date:
OJS
MSK
*
VCC_3V3
GND
GND GND
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VCC_3V3
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5
PB0(ADCB0/ACB0/AREFB)
6
PB1(ADCB1/ACB1)
7
PB2(ADCB2/ACB2/DACB0)
8
PB3(ADCB3/ACB3/DACB1)
9
PB4(ADCB4/ACB4/TMS)
10
PC4(SS/OC1A/OC0CLS)
20
PC5(XCK1/MOSI/OC1B/OC0CHS)
21
PC6(RXD1/MISO/OC0DLS)
22
PC7(TXD1/SCK/OC0DHS)
23
PD1(XCK0/OC0B)
27 PD0(OC0A)
26
PD3(TXD0/OC0D)
29
PD4(SS/OC1A)
30
PD5(MOSI/XCK1/OC1B)
31
PD6(MISO/RXD1/D-)
32
(D+/TXD1/SCK)PD7 33
GND
24
VCC
25
(OC0A)PF0 46
(OC0B/XCK0)PF1 47
(OC0C/RXD0)PF2 48
(OC0D/TXD0)PF3 49
(OC0A)PF4 50
PF5 51
PF6 54
PF7 55
VCC 45
GND 44
(ACA2/ADCA2)PA2 64
(ACA1/ADCA1)PA1 63
(AREFA/ACA0/ADCA0)PA0 62
AVCC 61
GND 60
(XTAL1)PR1 59
(XTAL2)PR0 58
PDI_CLK/RESET 57
PA3(ADCA3/ACA3)
1
PA4(ADCA4/ACA4)
2
PA5(ADCA5/ACA5)
3
PA6(ADCA6/ACA6)
4
PB5(ADCB5/ACB5/TDI)
11
PB6(ADCB6/ACB6/TCK)
12
PB7(ADCB7/ACB7/TDO)
13
GND
14
VCC
15
PC0(SDA/OC0A/OC0ALS)
16
PC1(SCL/XCK0/OC0B/OC0AHS)
17
PC2(RXD0/OC0C/OC0BLS)
18
PC3(TXD0/OC0D/OC0BHS)
19
GND 34
VCC 35
PD2(RXD0/OC0C)
28
(OC0A/SDA)PE0 36
(OC0B/XCK0/SCL)PE1 37
(OC0C/RXD0)PE2 38
(OC0D/TXD0)PE3 39
(OC1A)PE4 40
(OC1B)PE5 41
PE6 42
PE7 43
VCC 53
GND 52
PDI_DATA 56
PAD_GND 65
$7[PHJD$80+
8
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3%B7',B,17
3%B7&.B,17
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JTAG
INT/PWM/GPIO
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86%'B3
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3$B$'&B,17
3$B$'&B,17
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3%
3%
3$
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GPIO/ADC/DAC
GPIO/ADC
SPI INTERFACE
Q567
3%B$5()B,17
3%B$5()B,17
3)
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CLKM
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3(
7:,
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3(B$6<1&
3(B*3,2
TWI
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3'
8$5786$57
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3'B5;'
3'B7;'
UART/USART
3(B6<1&B2&$
3(B2&%B,17
3)
3',B'$7$
3)
3',
3(
3(
3',*3,2 PDI/GPIO
3(B6'$
3(B6&/
3(B$6<1&
3(B*3,2
3'B;&.
3'B5;'
3'B7;'
S)&
S)&
3ODFH[WDOFLUFXLWFORVHU
WR0&8,VRODWHIURP
GLJLWDOVLJQDOV
3ODFHGHFRXSOLQJFORVHU
WR0&8 3ODFHX)FORVHUWR
9FFLQSXWIRUPRGXOH
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268C−WIRELESS−02/2015
20
4.1 Handling Instructions
The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is
galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection
coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this
should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying
the coating to rest of the ZigBit carrier board. To protect ZigBit from humidity, the housing of the product should ensure
suitable Ingress Protection standards are complied with.
The MS-147 connector should never be exposed to Varnish / similar conformal coating material which will affect
electrical connection on the surfaces of connector.
The in-built chip antenna has been tuned for the particular design.
4.2 General Recommendations
• Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
• Placing high profile components next to antenna should be avoided
• Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern
• ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit's RF
frequency band
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268C−WIRELESS−02/2015
21
5. Persistence Memory
A dedicated memory space is allocated to store product specific information and called the Persistence Memory. The
organization of the persistence memory is as follows:
Table 5-1. Persistence Memory
Data
Size
Structure Revision
2 bytes
MAC address(1)
8 bytes
Board information overall
49 bytes
Board information – PCBA Name
30 bytes
Board information – PCBA Serial number 10 bytes
Board information – PCBA Atmel Part Number 8 bytes
Board information – PCBA Revision 1 byte
Reserved 3 bytes
XTAL Calibration Value
1 byte
Reserved
7 bytes
Reserved
4 bytes
CRC
1 byte
In ATZB-X0-256-4-0-CN, the persistence memory is stored in User Signature Row of ATxmega256A3U Microcontroller
starting from address 0x0000. This section is not erased by chip erase and requires a dedicated erase command.
The user signature row is a separate memory section that is fully accessible (read and write) from application software
and external programmers. See section “Read User Signature Row / Production Signature Row” under section “NVM
Flash Commands” in XMEGA AU manual [1] for details in reading the user signature data from application software.
Note: 1. The MAC address stored inside the MCU is a uniquely assigned ID for each ZigBit and owned by Atmel. User of the
ZigBit application can use this unique MAC ID to address the ZigBit in end-applications. The MAC ID can be read
from the ZigBit using the Performance Analyzer Application that is supplied through Atmel Studio Gallery Extension.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268C−WIRELESS−02/2015
22
6. Ordering Information
Table 6-1. Ordering Information
Part Number
Description
ATZB-X0-256-4-0-CN 900 MHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and
AT86RF212B Transceiver with MS-147 test connector and chip antenna, Single unit
ATZB-X0-256-4-0-CNR 900 MHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and
AT86RF212B Transceiver with MS-147 test connector and chip antenna, Tape & Reel
Note: Tape & Reel quantity: 200.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268C−WIRELESS−02/2015
23
7. Agency Certifications
7.1 United States (FCC)
This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an
OEM manufacturer must comply with the following regulations:
1. The ATZB-X0-256-4-0-CN modular transmitter must be labeled with its own FCC ID number, and, if the FCC
ID is not visible when the module is installed inside another device, then the outside of the device into which
the module is installed must also display a label referring to the enclosed module. This exterior label can use
wording such as the following:
IMPORTANT: Contains FCC ID: VW4A091745. This equipment complies with Part 15 of the FCC Rules. Operation
is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired operation (FCC 15.19).
The internal antenna used for this mobile transmitter must provide a separation distance of at least 20cm from all
persons and must not be collocated or operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF
exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may
only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment
authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this
equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and
can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense
(FCC section 15.105).
7.2 Industry Canada (IC) Compliance Statements
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two
conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268C−WIRELESS−02/2015
24
This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm between the device and
the user or bystanders.
Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20cm de distance entre le
dispositif et l'utilisateur ou des tiers.
CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
This Module is labelled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another
device, then the device should display the label on it referring the enclosed module. In that case, the final end product
must be labelled in a visible area with the following:
“Contains Transmitter Module IC: 11019A-091745”
OR
“Contains IC: 11019A-091745”
Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à
l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans ce cas, le
produit final doit être étiqueté dans un endroit visible par le texte suivant:
“Contains Transmitter Module IC: 11019A-091745”
OR
“Contains IC: 11019A-091745”
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268C−WIRELESS−02/2015
25
8. Revision History
Doc. Rev.
Date
Comments
42268C
02/2015
Former Section 7.2 “European Union (ETSI)” has been removed
42268B
07/2014
Updated schematics pages 16 to 19
42268A
04/2014
Initial document release
Atmel Corporation
1600 Technology Drive
San Jose, CA 95110
USA
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