ASMT-Mx6x & ASMT-MxHx MoonstoneTM 1/2W Power LED Light Source Data Sheet Description Features 1/2W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. Option with electrically isolated metal slug is also available x Available in Cool White and Warm White color The Cool White Power LED is available in various color temperature ranging from 4000K to 10000K and Warm White Power LED ranging from 2600K to 4000K. x Available in diffuse and non-diffuse version x Available in both electrical isolated and non-isolated metal slug x Energy efficient x Exposed pad for excellent heat transfer x Suitable for reflow soldering process The low profile package design is suitable for a wide variety of applications especially where height is a constraint. x High current operation The package is compatible with reflow soldering. This will give more freedom and flexibility to the light source designer. x Wide viewing angle Applications x MSL 4 products x Long operation life x Silicone encapsulation x ESD HBM Class 3B, > 8000 x Sign backlight x High junction temperature of 145C x Safety, exit and emergency sign lightings Specifications x Specialty lighting such as task lighting and reading lights x Retail display x Commercial lighting x Accent or marker lightings, strip or step lightings x InGaN Technology x 3.5V, 150mA (typical) x 110 viewing angle Package Dimensions 10.00 1 Anode 2 Cathode 3 Heat Sink 3.30 8.50 1.27 Metal Slug 3 O 5.26 10.60 LED + - 8.50 ZENER O 8.00 2.00 5.25 1.30 2 1 5.08 0.81 Notes: 1. All dimensions are in millimeters. 2. Unless otherwise stated, the tolerance for dimension is 0.1mm. 3. Metal slug is connected to anode for electrically non-isolated option. Device Selection Guide (Tj = 25C) Luminous Flux, V [1,2] (lm) Dice Technology Electrically Isolated Metal Slug No Part Number Color Min. Typ. Max. Test Current (mA) ASMT-MW60 Cool White 19.5 30.0 43.0 150 InGaN Warm White 15.0 25.0 33.0 150 InGaN ASMT-MW62 ASMT-MY60 Yes ASMT-MY62 ASMT-MWH0 Yes Cool White Diffused 15.0 25.0 43.0 150 InGaN ASMT-MWH2 ASMT-MYH0 No Yes Warm White Diffused 11.5 20.0 33.0 150 ASMT-MYH2 Notes: 1. V is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux tolerance is 10 % 2 No InGaN No Yes Part Numbering System ASMT - M x x x - N x1 x2 x3 x4 Packaging Option 0 - Tube 1 - Tape and Reel Color Bin Selection Maximum Flux Bin Minimum Flux Bin Heat Sink 0 - Electrically Non-isolated 2 - Electrically Isolated Silicone Type 6 - Non-diffused H - Diffused Color W - Cool White Y - Warm White Absolute Maximum Ratings at TA = 25C Parameter ASMT-Mx6x / ASMT-MxHx Units DC Forward Current [1] 150 mA Peak Pulsing Current [2] 300 mA Power Dissipation 525 mW LED Junction Temperature 145 C Operating Ambient Temperature Range -40 to +120 C Storage Temperature Range -40 to +120 C Notes: 1. DC forward current - derate linearly based on Figure 5. 2. Pulse condition duty factor = 10%, Frequency = 1kHz Optical Characteristics (TA = 25C) Correlated Color Temperature, CCT (Kelvin) Viewing Angle 21/2 [1] (Degrees) Luminous Efficiency (lm/W) Part Number Color Min Max Typ Typ ASMT-MW6x Cool White 4000 10000 110 57 ASMT-MY6x Warm White 2600 4000 110 48 ASMT-MWHx Cool White Diffused 4000 10000 120 48 ASMT-MYHx Warm White Diffused 2600 4000 120 38 Notes: 1. T1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristic (TA = 25C) Forward Voltage VF (Volts) @ IF = 150mA Reverse Voltage VR (Volts) Thermal Resistance RTj-ms (C/W)[1] Dice Type Typ. Max. Max. Typ. InGaN 3.5 4.0 5 27 Note: 1. RTj-ms is Thermal Resistance from LED junction to metal slug. 3 200 COOL WHITE DIFFUSED WARM WHITE DIFFUSED COOL WHITE WARM WHITE 0.9 RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 175 150 FORWARD CURRENT - mA 1.0 100 75 50 0.2 0.1 25 0.0 380 430 480 530 580 630 WAVELENGTH - nm 680 730 0.50 1.00 4.00 70 90 RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 COOL WHITE DIFFUSED WARM WHITE DIFFUSED COOL WHITE WARM WHITE 0.3 0.2 0.1 0 20 40 60 80 100 120 140 160 180 200 0.0 -90 -70 -50 Figure 4. Radiation Pattern 150 R JA = 140C/W 120 R JA = 120C/W R JA = 100C/W 90 60 30 0 10 20 -30 -10 10 OFF-AXIS ANGLE() 180 IF MAX FORWARD CURRENT - mA 3.50 0.9 Figure 3. Relative Luminous Flux vs. Mono Pulse Current 30 40 50 60 TA AMBIENT TEMPERATURE - C 70 80 90 Figure 5. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 145C, RTJA = 100C/W, 120C/W and 140C/W 4 3.00 1.0 MONO PULSE CURRENT - mA 0 1.50 2.00 2.50 FORWARD VOLTAGE - V Figure 2. Forward Current vs Forward Voltage 1.30 1.20 1.10 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 0 0.00 780 Figure 1. Relative Intensity vs. Wavelength RELATIVE LUMINOUS FLUX (v) - lm 125 30 50 10.70 0.10 TEMPERATURE 10 to 30 SEC. 217 C 200 C 255 - 260 C 3C/SEC. MAX. 8.40 0.10 -6C/SEC. MAX. 150 C 17.00 0.20 3 C/SEC. MAX. 1.00 0.10 100 SEC. MAX. 60 - 120 SEC. 3.1 0.10 TIME (Acc. to J-STD-020C) 5.08 0.10 Figure 7. Recommended soldering land pattern 350 100 300 250 200 150 100 50 0 90 -50 -100 -150 -200 -250 -300 -40 80 RELATIVE LOP (%) RELATIVE FORWARD VOLTAGE SHIFT (mV) Figure 6. Recommended Reflow Soldering 60 50 40 30 1/2W COOL WHITE 20 1/2W WARM WHITE 10 -15 10 35 TEMPERATURE - C Figure 8. Temperature vs. relative forward voltage shift Flux Bin Limit[1] (For reference only) [X1 X2] Flux (lm) at 150mA Bin Min Max A 5.5 7.0 B 7.0 9.0 C 9.0 11.5 D 11.5 15.0 E 15.0 19.5 F 19.5 25.5 G 25.5 33.0 H 33.0 43.0 Tolerance for each bin limits is 10 % 5 70 60 85 0 25 35 45 55 65 75 85 95 105 JUNCTION TEMPERATURE (C) 115 125 Figure 9. Relative LOP vs Junction Temperature for InGaN Devices 135 145 Color bin selection [x3] Individual reel or tube will contain LEDs from one color bin only. Cool White Warm White Selection Bin Selection Bin 0 Full Distribution 0 Full Distribution A A only A A only B B only B B only C C only C C only D D only D D only E E only E E only F F only F F only G G only N A and C only H H only P B and D only L A and G only Q E and C only M B and H only R F and D only N A and C only U E and F only P B and D only W C and D only Q E and C only Z A and B only R F and D only 1 A, B, C and D only S G and H only 4 C, D, E and F only U E and F only W C and D only Z A and B only 1 A, B, C and D only 2 G, H, A and B only 4 C, D, E and F only 6 Primary Color Binning Cool White Color Limits (Chromaticity Coordinates) Bin A X Y 0.367 0.400 0.362 0.372 0.329 0.345 0.329 0.369 Warm White Color Limits (Chromaticity Coordinates) Bin A X Y 0.452 0.434 0.488 0.447 0.470 0.414 0.438 0.403 Bin B X Y 0.362 0.372 0.356 0.330 0.329 0.302 0.329 0.302 Bin B X Y 0.438 0.403 0.470 0.414 0.452 0.384 0.424 0.376 Bin C X Y 0.329 0.369 0.329 0.345 0.305 0.322 0.301 0.342 Bin C X Y 0.407 0.393 0.418 0.422 0.452 0.434 0.438 0.403 Bin D X Y 0.329 0.345 0.329 0.302 0.311 0.285 0.305 0.322 Bin D X Y 0.395 0.362 0.407 0.393 0.438 0.403 0.424 0.376 Bin E X Y 0.303 0.333 0.307 0.311 0.283 0.284 0.274 0.301 Bin E X Y 0.381 0.377 0.387 0.404 0.418 0.422 0.407 0.393 Bin F X Y 0.307 0.311 0.311 0.285 0.290 0.265 0.283 0.284 Bin F X Y 0.373 0.349 0.381 0.377 0.407 0.393 0.395 0.362 Bin G X Y 0.388 0.417 0.379 0.383 0.362 0.372 0.367 0.400 Bin H X Y 0.379 0.383 0.369 0.343 0.356 0.330 0.362 0.372 Tolerances 0.01 Tolerances 0.01 0.46 G 0.38 A 4.0k 0.36 4.5k C H B 0.34 5.6k 0.32 Black Body Curve 7k D E 0.30 F 10k 0.28 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 X - COORDINATE Figure 10. Color bins (Cool White) 7 0.48 0.44 Y - COORDINATE Y - COORDINATE 0.44 0.42 0.40 A 0.42 C 0.40 0.38 0.36 E 4.0k 3.5k D F 3.0k B 2.6k Black Body Curve 0.34 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 X - COORDINATE Figure 11. Color bins (Warm White) Sub-Color Binning (Only Applicable for Color Bin A to Bin D and Bin G to Bin H) Color Limits Cool White Color Limits (Chromaticity Coordinates) Bin A1 X Y 0.364 0.383 0.367 0.400 0.348 0.385 Bin A2 X Y 0.364 0.383 0.362 0.372 Bin A3 X Y 0.329 0.357 Bin A4 X Y Bin B1 Cool White Color Limits (Chromaticity Coordinates) 0.347 0.372 Bin D1 X Y 0.329 0.345 0.329 0.331 0.317 0.320 0.316 0.333 0.346 0.359 0.347 0.372 Bin D2 X Y 0.329 0.331 0.329 0.320 0.318 0.310 0.317 0.320 0.329 0.369 0.348 0.385 0.347 0.372 Bin D3 X Y 0.329 0.320 0.329 0.302 0.320 0.293 0.318 0.310 0.329 0.345 0.329 0.357 0.347 0.372 0.346 0.359 Bin D4 X Y 0.316 0.333 0.317 0.320 0.307 0.311 0.305 0.322 X Y 0.362 0.372 0.360 0.357 0.344 0.344 0.346 0.359 Bin D5 X Y 0.317 0.320 0.318 0.310 0.309 0.300 0.307 0.311 Bin B2 X Y 0.360 0.357 0.358 0.343 0.343 0.331 0.344 0.344 Bin D6 X Y 0.318 0.310 0.320 0.293 0.311 0.285 0.309 0.300 Bin B3 X Y 0.358 0.343 0.356 0.330 0.341 0.314 0.343 0.331 Bin G1 X Y 0.392 0.421 0.386 0.400 0.364 0.383 0.367 0.400 Bin B4 X Y 0.329 0.331 0.329 0.345 0.346 0.359 0.344 0.344 Bin G2 X Y 0.386 0.400 0.382 0.385 0.362 0.372 0.364 0.383 Bin B5 X Y 0.329 0.331 0.344 0.344 0.343 0.331 0.329 0.320 Bin H1 X Y 0.382 0.385 0.378 0.370 0.360 0.357 0.362 0.372 Bin B6 X Y 0.343 0.331 0.341 0.314 0.329 0.302 0.329 0.320 Bin H2 X Y 0.378 0.370 0.375 0.358 0.358 0.343 0.360 0.357 Bin C1 X Y 0.329 0.369 0.329 0.357 0.315 0.344 0.314 0.355 Bin H3 X Y 0.375 0.358 0.371 0.344 0.356 0.330 0.358 0.343 Bin C2 X Y 0.329 0.357 0.329 0.345 0.316 0.333 0.315 0.344 Bin C3 X Y 0.314 0.355 0.315 0.344 0.303 0.333 0.301 0.342 Bin C4 X Y 0.315 0.344 0.316 0.333 0.305 0.322 0.303 0.333 Tolerances 0.01 0.44 0.42 0.40 G1 0.38 Y - COORDINATE G2 A1 A3 0.36 C3 0.34 C4 0.32 7k A4 C2 B4 5.6k B5 D1 D2 D4 0.30 C1 D5 H1 A2 B1 B2 4.5k 4.0k H2 H3 Black Body Curve B3 B6 D3 D6 10k 0.28 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 X - COORDINATE Figure 12. Sub-color bins (Cool White) 8 0.36 0.38 0.40 0.42 0.44 Package Tube - Option 0 1.00 5.80 4.65 5.50 37.00 5.45 10.10 8.30 535.00 TOP VIEW FRONT VIEW Figure 13. Tube dimensions Tape & Reel - Option 1 B Bo W F E A 2.5 B A Ko P SECTION A Ao SECTION B Figure 14. Carrier tape dimensions 9 Dim Value Ao 8.800.10 Bo 16.450.10 Ko 3.600.10 W 24.00.10 P 16.00.10 Qty/Reel 250EA Unit: mm END START MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS MINIMUM OF 390 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. *Note: Tape & Reel Packaging only applicable as per this datasheet only. Figure 15. Carrier tape leader and trailer dimensions Reel Dimension +1.00 24.0 -0.00 2.30 2.30 0 2.50 0.50 0 60. 99.50 1.00 R10.0 .50 268.00 R10 13.50 330.00 1.00 120.0 Figure 16. Reel dimensions 10 0 0.5 0.50 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C/60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 72 hours. C. Control for unfinished reel Moisture Sensitivity This product is qualified as Moisture Sensitive Level 4 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). - For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembly boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 72 hours. E. Baking is required if - HIC "10%" indicator is not blue and "5%" indicator is pink. - The LEDs are exposed to condition of >30C/60% RH at any time. - The LEDs floor life exceeded 72hrs. Recommended baking condition: 605C for 20hrs. 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