ASMT-Mx6x & ASMT-MxHx
MoonstoneTM ½W Power LED Light Source
Data Sheet
Description
½W Power LED Light Source is a high performance energy
ecient device which can handle high thermal and high
driving current. The exposed pad design has excellent
heat transfer from the package to the motherboard. Op-
tion with electrically isolated metal slug is also available
The Cool White Power LED is available in various color
temperature ranging from 4000K to 10000K and Warm
White Power LED ranging from 2600K to 4000K.
The low prole package design is suitable for a wide vari-
ety of applications especially where height is a constraint.
The package is compatible with reow soldering. This will
give more freedom and exibility to the light source de-
signer.
Applications
x Sign backlight
x Safety, exit and emergency sign lightings
x Specialty lighting such as task lighting and reading
lights
x Retail display
x Commercial lighting
x Accent or marker lightings, strip or step lightings
Features
x Available in Cool White and Warm White color
x Available in diuse and non-diuse version
x Available in both electrical isolated and non-isolated
metal slug
x Energy ecient
x Exposed pad for excellent heat transfer
x Suitable for reow soldering process
x High current operation
x Long operation life
x Wide viewing angle
x Silicone encapsulation
x ESD HBM Class 3B, > 8000
x MSL 4 products
x High junction temperature of 145°C
Specications
x InGaN Technology
x 3.5V, 150mA (typical)
x 110 viewing angle
2
Package Dimensions
Notes:
1. All dimensions are in millimeters.
2. Unless otherwise stated, the tolerance for dimension is ±0.1mm.
3. Metal slug is connected to anode for electrically non-isolated option.
Metal Slug
Cathode
Anode1
2
3
10.00
8.50
3
12
8.50
Ø 5.26
Ø 8.00
5.08 0.81
2.00 5.25
1.30
10.60
1.27
3.30
Heat Sink
LED
ZENER
+
−
Device Selection Guide (Tj = 25°C)
Part Number Color
Luminous Flux, ΦV [1,2] (lm) Test Current
(mA)
Dice
Technology
Electrically
Isolated
Metal SlugMin. Typ. Max.
ASMT-MW60 Cool White 19.5 30.0 43.0 150 InGaN No
ASMT-MW62 Yes
ASMT-MY60 Warm White 15.0 25.0 33.0 150 InGaN No
ASMT-MY62 Yes
ASMT-MWH0 Cool White Diused 15.0 25.0 43.0 150 InGaN No
ASMT-MWH2 Yes
ASMT-MYH0 Warm White Diused 11.5 20.0 33.0 150 InGaN No
ASMT-MYH2 Yes
Notes:
1. ΦV is the total luminous ux output as measured with an integrating sphere at 25ms mono pulse condition.
2. Flux tolerance is ±10 %
3
Part Numbering System
Absolute Maximum Ratings at TA = 25°C
Parameter ASMT-Mx6x / ASMT-MxHx Units
DC Forward Current [1] 150 mA
Peak Pulsing Current [2] 300 mA
Power Dissipation 525 mW
LED Junction Temperature 145 °C
Operating Ambient Temperature Range -40 to +120 °C
Storage Temperature Range -40 to +120 °C
Notes:
1. DC forward current – derate linearly based on Figure 5.
2. Pulse condition duty factor = 10%, Frequency = 1kHz
Optical Characteristics (TA = 25°C)
Part Number Color
Correlated Color Temperature,
CCT (Kelvin)
Viewing Angle 2θ½ [1]
(Degrees)
Luminous Eciency
(lm/W)
Min Max Typ Typ
ASMT-MW6x Cool White 4000 10000 110 57
ASMT-MY6x Warm White 2600 4000 110 48
ASMT-MWHx Cool White Diused 4000 10000 120 48
ASMT-MYHx Warm White Diused 2600 4000 120 38
Notes:
1. T½ is the o-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic (TA = 25°C)
Dice Type
Forward Voltage VF
(Volts) @ IF = 150mA
Reverse Voltage VR
(Volts)
Thermal Resistance RTj-ms
(°C/W)[1]
Typ. Max. Max. Typ.
InGaN 3.5 4.0 5 27
Note:
1. RTj-ms is Thermal Resistance from LED junction to metal slug.
ASMT – M x x x – N x1 x2 x3 x4
Packaging Option
0 – Tube
1 – Tape and Reel
Color Bin Selection
Maximum Flux Bin
Minimum Flux Bin
Heat Sink
0 – Electrically Non-isolated
2 – Electrically Isolated
Silicone Type
6 – Non-diffused
H – Diffused
Color
W – Cool White
Y – Warm White
4
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
COOL WHITE DIFFUSED
WARM WHITE DIFFUSED
COOL WHITE
WARM WHITE
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
1.10
1.20
1.30
0 20 40 60 80 100 120 140 160 180 200
MONO PULSE CURRENT - mA
RELATIVE LUMINOUS FLUX (Φv) - lm
0
25
50
75
100
125
150
175
200
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -70 -50 -30 -10 10 30 50 70 90
OFF-AXIS ANGLE(°)
RELATIVE INTENSITY
COOL WHITE DIFFUSED
WARM WHITE DIFFUSED
COOL WHITE
WARM WHITE
Figure 1. Relative Intensity vs. Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Luminous Flux vs. Mono Pulse Current Figure 4. Radiation Pattern
0
30
60
90
120
150
0102030405060708090
T
A
AMBIENT TEMPERATURE - °C
I
F
MAX FORWARD CURRENT - mA
R
JA
= 120°C/W
R
JA
= 100°C/W
R
JA
= 140°C/W
180
Figure 5. Maximum forward current vs. ambient temperature. Derated
based on TJMAX = 145°C, RTJA = 100°C/W, 120°C/W and 140°C/W
5
10.70 ± 0.10
17.00 ± 0.20
1.00 ± 0.10
5.08 ± 0.10
3.1 ± 0.10
8.40 ± 0.10
Figure 7. Recommended soldering land pattern
Figure 8. Temperature vs. relative forward voltage shift Figure 9. Relative LOP vs Junction Temperature for InGaN Devices
Flux Bin Limit[1] (For reference only) [X1 X2]
Bin
Flux (lm) at 150mA
Min Max
A 5.5 7.0
B 7.0 9.0
C 9.0 11.5
D 11.5 15.0
E 15.0 19.5
F 19.5 25.5
G 25.5 33.0
H 33.0 43.0
Tolerance for each bin limits is ±10 %
Figure 6. Recommended Reow Soldering
217 °C
200 °C
60 - 120 SEC.
-6°C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
(Acc. to J-STD-020C)
0
10
20
30
40
50
60
70
80
90
100
25 35 45 55 65 75 85 95 105 115 125 135 145
JUNCTION TEMPERATURE (°C)
RELATIVE LOP (%)
½W COOL WHITE
½W WARM WHITE
-300
-250
-200
-150
-100
-50
0
50
100
150
200
250
300
350
-40 -15 10 35 60 85
TEMPERATURE - °C
RELATIVE FORWARD VOLTAGE SHIFT (mV)
6
Color bin selection [x3]
Individual reel or tube will contain LEDs from one color bin only.
Cool White
Selection Bin
0 Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
G G only
H H only
L A and G only
M B and H only
N A and C only
P B and D only
Q E and C only
R F and D only
S G and H only
U E and F only
W C and D only
Z A and B only
1 A, B, C and D only
2 G, H, A and B only
4 C, D, E and F only
Warm White
Selection Bin
0 Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
N A and C only
P B and D only
Q E and C only
R F and D only
U E and F only
W C and D only
Z A and B only
1 A, B, C and D only
4 C, D, E and F only
7
Primary Color Binning
Cool White Color Limits (Chromaticity Coordinates)
Bin A X
Y
0.367
0.400
0.362
0.372
0.329
0.345
0.329
0.369
Bin B X
Y
0.362
0.372
0.356
0.330
0.329
0.302
0.329
0.302
Bin C X
Y
0.329
0.369
0.329
0.345
0.305
0.322
0.301
0.342
Bin D X
Y
0.329
0.345
0.329
0.302
0.311
0.285
0.305
0.322
Bin E X
Y
0.303
0.333
0.307
0.311
0.283
0.284
0.274
0.301
Bin F X
Y
0.307
0.311
0.311
0.285
0.290
0.265
0.283
0.284
Bin G X
Y
0.388
0.417
0.379
0.383
0.362
0.372
0.367
0.400
Bin H X
Y
0.379
0.383
0.369
0.343
0.356
0.330
0.362
0.372
Tolerances ± 0.01
Warm White Color Limits (Chromaticity Coordinates)
Bin A X
Y
0.452
0.434
0.488
0.447
0.470
0.414
0.438
0.403
Bin B X
Y
0.438
0.403
0.470
0.414
0.452
0.384
0.424
0.376
Bin C X
Y
0.407
0.393
0.418
0.422
0.452
0.434
0.438
0.403
Bin D X
Y
0.395
0.362
0.407
0.393
0.438
0.403
0.424
0.376
Bin E X
Y
0.381
0.377
0.387
0.404
0.418
0.422
0.407
0.393
Bin F X
Y
0.373
0.349
0.381
0.377
0.407
0.393
0.395
0.362
Tolerances ± 0.01
0.24
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
X - COORDINATE
Y - COORDINATE
C
ED
A
F
4.5k
7k
10k
4.0k
G
H
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52
X - COORDINATE
Y - COORDINATE
C
E
D
A
F
3.5k
4.0k
2.6k
Black Body Curve
Black Body Curve
5.6kB
B
3.0k
Figure 10. Color bins (Cool White) Figure 11. Color bins (Warm White)
8
Sub-Color Binning
(Only Applicable for Color Bin A to Bin D and Bin G to Bin H)
Color Limits
Cool White Color Limits (Chromaticity Coordinates)
Bin A1 X
Y
0.364
0.383
0.367
0.400
0.348
0.385
0.347
0.372
Bin A2 X
Y
0.364
0.383
0.362
0.372
0.346
0.359
0.347
0.372
Bin A3 X
Y
0.329
0.357
0.329
0.369
0.348
0.385
0.347
0.372
Bin A4 X
Y
0.329
0.345
0.329
0.357
0.347
0.372
0.346
0.359
Bin B1 X
Y
0.362
0.372
0.360
0.357
0.344
0.344
0.346
0.359
Bin B2 X
Y
0.360
0.357
0.358
0.343
0.343
0.331
0.344
0.344
Bin B3 X
Y
0.358
0.343
0.356
0.330
0.341
0.314
0.343
0.331
Bin B4 X
Y
0.329
0.331
0.329
0.345
0.346
0.359
0.344
0.344
Bin B5 X
Y
0.329
0.331
0.344
0.344
0.343
0.331
0.329
0.320
Bin B6 X
Y
0.343
0.331
0.341
0.314
0.329
0.302
0.329
0.320
Bin C1 X
Y
0.329
0.369
0.329
0.357
0.315
0.344
0.314
0.355
Bin C2 X
Y
0.329
0.357
0.329
0.345
0.316
0.333
0.315
0.344
Bin C3 X
Y
0.314
0.355
0.315
0.344
0.303
0.333
0.301
0.342
Bin C4 X
Y
0.315
0.344
0.316
0.333
0.305
0.322
0.303
0.333
Tolerances ± 0.01
Cool White Color Limits (Chromaticity Coordinates)
Bin D1 X
Y
0.329
0.345
0.329
0.331
0.317
0.320
0.316
0.333
Bin D2 X
Y
0.329
0.331
0.329
0.320
0.318
0.310
0.317
0.320
Bin D3 X
Y
0.329
0.320
0.329
0.302
0.320
0.293
0.318
0.310
Bin D4 X
Y
0.316
0.333
0.317
0.320
0.307
0.311
0.305
0.322
Bin D5 X
Y
0.317
0.320
0.318
0.310
0.309
0.300
0.307
0.311
Bin D6 X
Y
0.318
0.310
0.320
0.293
0.311
0.285
0.309
0.300
Bin G1 X
Y
0.392
0.421
0.386
0.400
0.364
0.383
0.367
0.400
Bin G2 X
Y
0.386
0.400
0.382
0.385
0.362
0.372
0.364
0.383
Bin H1 X
Y
0.382
0.385
0.378
0.370
0.360
0.357
0.362
0.372
Bin H2 X
Y
0.378
0.370
0.375
0.358
0.358
0.343
0.360
0.357
Bin H3 X
Y
0.375
0.358
0.371
0.344
0.356
0.330
0.358
0.343
Figure 12. Sub-color bins (Cool White)
0.24
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
X - COORDINATE
Y - COORDINATE
4.5k
5.6k
7k
10k
4.0k
A1
A2A3
A4 B1
B2
B3
B4
B5
B6
C1
C2
C3
C4 D1
D2
D3
D4
D5
D6
G1
G2
H1
H2
H3
Black Body Curve
9
Package Tube – Option 0
Tape & Reel – Option 1
Dim Value
Ao 8.80±0.10
Bo 16.45±0.10
Ko 3.60±0.10
W 24.0±0.10
P 16.0±0.10
Qty/Reel 250EA
Unit: mm
535.00
1.00
5.45
5.80
4.65
5.50
10.10
37.00
8.30
FRONT VIEW
TOP VIEW
A
A
B
Ao
B
P
SECTION B
SECTION A
Ko
W
F
E
Bo
2.5
Figure 13. Tube dimensions
Figure 14. Carrier tape dimensions
10
END
MINIMUM OF 160 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
MOUNTED WITH
COMPONENTS
MINIMUM OF 390 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
START
*Note: Tape & Reel Packaging only applicable as per this datasheet only.
Figure 15. Carrier tape leader and trailer dimensions
Reel Dimension
R10.00
60.0º
268.00
330.00 ± 1.00
99.50 ± 1.00
2.30 2.30
24.0+1.00
−0.00
13.50 ± 0.50
2.50 ± 0.50
R10.50 ± 0.50
120.0º
Figure 16. Reel dimensions
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHO-
RIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR
DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY
RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE,
EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1319EN - September 28, 2010
Handling Precaution
The encapsulation material of the product is made of sili-
cone for better reliability of the product. As silicone is a
soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly or
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail infor-
mation.
Moisture Sensitivity
This product is qualied as Moisture Sensitive Level 4 per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reow the LEDs per the original MSL
rating.
– It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 72 hours.
C. Control for unnished reel
– For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembly boards
– If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their
oor life of 72 hours.
E. Baking is required if
– HIC “10%” indicator is not blue and “5%” indicator is
pink.
– The LEDs are exposed to condition of >30°C/60% RH
at any time.
– The LEDs oor life exceeded 72hrs.
Recommended baking condition: 60±5°C for 20hrs.