MOTOROLA CMOS LOGIC DATA 1
MC14582B
  
The MC14582B is a CMOS look–ahead carry generator capable of
anticipating a carry across four binary adders or groups of adders. The
device is cascadable to perform full look–ahead across n–bit adders. Carry,
generate–carry, and propagate–carry functions are provided as enumerated
in the pin designation table shown below.
Expandable to any Number of Bits
All Buffered Outputs
Low Power Dissipation
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–Power
Schottky TTL Load over the Rated Temperature Range
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol Parameter Value Unit
VDD DC Supply Voltage – 0.5 to + 18.0 V
Vin, Vout Input or Output Voltage (DC or Transient) – 0.5 to VDD + 0.5 V
Iin, Iout Input or Output Current (DC or Transient),
per Pin ± 10 mA
PDPower Dissipation, per Package† 500 mW
Tstg Storage Temperature – 65 to + 150
_
C
TLLead Temperature (8–Second Soldering) 260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/
_
C From 65
_
C To 125
_
C
Ceramic “L” Packages: – 12 mW/
_
C From 100
_
C To 125
_
C
LOGIC EQUATIONS
Cn+x = G0 + (P0
Cn)
Cn+y = G1 + (P1
G0) + (P1
P0
Cn)
Cn+z = G2 + (P2
G1) + (P2
P1 G0) + (P2
P1
P0
Cn)
G = G3 + (P3
G2) + (P3
P2
G1) + (P1
P2
P3
G0)
P = P3
P2
P1
P0
PIN DESIGNATIONS
Designation Pin No’s Function
G0, G1, G2, G3 3, 1, 14, 5 Active–Low
Carry–Generate Inputs
P0, P1, P2, P3 4, 2, 15, 6 Active–Low
Carry–Propagate Inputs
Cn13 Carry Input
Cn+x, Cn+y
Cn+z 12, 11, 9 Carry Outputs
G 10 Active–Low Group
Carry–Generate Output
P 7 Active–Low Group
Carry–Propagate Output

SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3
1/94

L SUFFIX
CERAMIC
CASE 620
ORDERING INFORMATION
MC14XXXBCP Plastic
MC14XXXBCL Ceramic
MC14XXXBD SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
Cn+x
Cin
G2
P2
VDD
Cn+z
G
Cn+y
P0
G0
P1
G1
VSS
P
P3
G3
MOTOROLA CMOS LOGIC DATAMC14582B
2
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Symbol
VDD
Vdc
– 55
_
C 25
_
C 125
_
C
Unit
Characteristic
Symbol
DD
Vdc
Min Max Min Typ # Max Min Max
Unit
Output Voltage “0” Level
Vin = VDD or 0 VOL 5.0
10
15
0.05
0.05
0.05
0
0
0
0.05
0.05
0.05
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or VDD VOH 5.0
10
15
4.95
9.95
14.95
4.95
9.95
14.95
5.0
10
15
4.95
9.95
14.95
Vdc
Input Voltage “0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL 5.0
10
15
1.5
3.0
4.0
2.25
4.50
6.75
1.5
3.0
4.0
1.5
3.0
4.0
Vdc
“1” Level
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH 5.0
10
15
3.5
7.0
11
3.5
7.0
11
2.75
5.50
8.25
3.5
7.0
11
Vdc
Output Drive Current
(VOH = 2.5 Vdc) Source
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
IOH 5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
– 1.7
– 0.36
– 0.9
– 2.4
mAdc
(VOL = 0.4 Vdc) Sink
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
IOL 5.0
10
15
0.64
1.6
4.2
0.51
1.3
3.4
0.88
2.25
8.8
0.36
0.9
2.4
mAdc
Input Current Iin 15 ±0.1 ±0.00001 ±0.1 ±1.0 µAdc
Input Capacitance
(Vin = 0) Cin 5.0 7.5 pF
Quiescent Current
(Per Package) IDD 5.0
10
15
5.0
10
20
0.005
0.010
0.015
5.0
10
20
150
300
600
µAdc
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT5.0
10
15
IT = (1.4 µA/kHz) f + IDD
IT = (2.8 µA/kHz) f + IDD
IT = (4.3 µA/kHz) f + IDD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
**
ā
The formulas given are for the typical characteristics only at 25
_
C.
To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.005.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However ,
precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance
circuit. For proper operation, Vin and Vout should be constrained to the range VSS (Vin or Vout) VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must
be left open.
MOTOROLA CMOS LOGIC DATA 3
MC14582B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25
_
C)
Characteristic Symbol VDD Min Typ # Max Unit
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL 5.0
10
15
100
50
40
200
100
80
ns
Propagation Delay Time
tPLH, tPHL = (1.7 ns/pF) CL + 260 ns
tPLH, tPHL = (0.66 ns/pF) CL + 107 ns
tPLH, tPHL = (0.5 ns/pF) CL + 85 ns
tPLH,
tPHL 5.0
10
15
345
140
110
690
280
220
ns
*The formulas given are for the typical characteristics only at 25
_
C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Figure 1. Dynamic Power Dissipation
Test Circuit and Waveform
20 ns
Vin VDD
VSS
10%
90%
50%
20 ns
VARIABLE
WIDTH
Vin
Cin
CL
VDD
G0
G1
G2
G3
P0
P1
P2
P3
CL
CL
CL
CL
Cn+x
Cn+y
Cn+z
P
G
PULSE
GENERATOR
Figure 2. Source Current Test Circuit Figure 3. Sink Current Test Circuit
Cin
VDD
G0
G1
G2
G3
P0
P1
P2
P3
Cn+x
Cn+y
Cn+z
P
G
Cin
VDD
G0
G1
G2
G3
P0
P1
P2
P3
Cn + x
Cn + y
Cn + z
P
G
VSS
8EXTERNAL
POWER
SUPPLY
VSS
8EXTERNAL
POWER
SUPPLY
16 16
IOH IOL
Vout = VOH Vout = VOL
MOTOROLA CMOS LOGIC DATAMC14582B
4
Figure 4. Switching Time Test Circuit and Waveforms
AC Paths DC Data
Input Output To VSS To VDD
P0 P Remaining G’s
P’s, Cn
G0 G P’s, CnRemaining
G’s
CnCn+x, Cn+y, P’s G’s
Cn+z
TEST TABLE
Vout
Cin
CL
VDD
G0
G1
G2
G3
P0
P1
P2
P3
Cn+x
Cn+y
Cn+z
P
G
PULSE
GENERATOR
VSS
SEE
TEST
TABLE 20 ns
Vin VDD
VSS
10%
90%
50%
20 ns
VOH
VOL
Vout
tPLH tPHL
tTLH tTHL
TYPICAL APPLICATIONS
CnCn+4 CnCn+4 CnCn+4 CnCn+4
CnCnCnCnCn+4
G P G P G P G P
G0 P0 Cn+x G1 P1 Cn+y G2 P2 Cn+z G3 P3
G P
CnMC14582B
MC14581B
MC14581B
16–BIT ALU, TWO LEVEL LOOK–AHEAD
16–BIT ALU, RIPPLE CARRY
CnCnCnCnCn+4
G P G P G P G P
G0 P0 Cn+x G1 P1 Cn+y G2 P2 Cn+z G3 P3
G P
CnMC14582B
CnCnCnCnCn+4
G P G P G P G P
G0 P0 Cn+x G1 P1 Cn+y G2 P2 Cn+z G3 P3
G P
CnMC14582B
32–BIT ALU, TWO LEVEL LOOK–AHEAD OVER 16–BIT GROUPS
MC14581B
CnCnCnCnCn+4
G P G P G P G P
G0 P0 Cn+x G1 P1 Cn+y G2 P2 Cn+z G3 P3
G P
CnMC14582B
CnCnCn
G P G P
G0 P0 Cn+x G1 P1 Cn+y
CnMC14582B
COMBINED TWO–LEVEL LOOK–AHEAD AND RIPPLE CARRY ALU
MC14581B
Cn+4
CnCnCnCn
G P G P G P G P
G0 P0 Cn+x G1 P1 Cn+y G2 P2 Cn+z G3 P3
G P
CnMC14582B
CnCnCnCnCn+4
G P G P G P G P
G0 P0 Cn+x G1 P1 Cn+y G2 P2 Cn+z G3 P3
G P
CnMC14582B
64–BIT ALU, FULL–CARRY LOOK–AHEAD IN THREE LEVELS.
MC14581B
CnCn+4 Cn+4
G0 P0 Cn+x
CnMC14582B
G0 P0 Cn+x G1 P1 Cn+y
CnMC14582B
A AND B INPUTS AND F OUTPUTS ARE NOT SHOWN (MC14581B).
CnG P
MOTOROLA CMOS LOGIC DATA 5
MC14582B
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
1 8
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
FE
G
NK
C
SEATING
PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C––– 0.200 ––– 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
_ _ _ _
16 9
1 8
MOTOROLA CMOS LOGIC DATAMC14582B
6
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1 8
16 9
SEATING
PLANE
F
J
M
RX 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
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MC14582B/D
*MC14582B/D*