User's Manual ISL81601EVAL2Z User's Manual: Evaluation Board Industrial Analog and Power Rev.0.00 Mar 2018 USER'S MANUAL ISL81601EVAL2Z UG160 Rev.0.00 Mar 23, 2018 Evaluation Board 1. Overview The ISL81601EVAL2Z evaluation board (shown in Figure 5 on page 8) features the ISL81601, a 60V high voltage synchronous buck-boost controller that offers external soft-start, independent enable functions, and integrates UV/OV/OC/OT protection. Programmable switching frequency ranging from 100kHz to 600kHz helps to optimize inductor size while the strong gate driver delivers up to 20A for the buck-boost output. 1.1 Key Features * Wide input range: 32V to 60V * Bi-directional operation * High light-load efficiency in pulse skipping DEM operation * Programmable soft-start * Optional DEM/PWM operation * Optional CC/HICCUP OCP protection * Supports prebias output with soft-start * PGOOD indicator * OVP, OTP, and UVP protection 1.2 Specifications The ISL81601EVAL2Z evaluation board is designed for high current applications. The current rating of the ISL81601EVAL2Z is limited by the FETs and inductor selected. The ISL81601EVAL2Z electrical ratings of are shown in Table 1. Table 1. Electrical Rating Parameter Rating Input Voltage 32V to 60V Switching Frequency 200kHz Output Voltage 48V Output Current 5A OCP Set Point Minimum 5.5A at ambient room temperature 1.3 Ordering Information Part Number ISL81601EVAL2Z 1.4 Description High Voltage BUCK-BOOST Controller Evaluation Board Related Literature * For a full list of related documents, visit our website * ISL81601 product page UG160 Rev.0.00 Mar 23, 2018 Page 2 of 19 ISL81601EVAL2Z 1. Overview VDD CS- CS+/VINSEN VIN EN/UVLO FB_IN CLKEN BSTEN VIN VOUT VDD BOOT1 PGND UG1 VCC5V PHASE1 IMO N_IN ISL81601 LG1 PWM_MODE IMO N_OUT SGND LG2 OC_MODE PLL_COMP RT/SYNC PHASE2 SS/TRK UG2 COMP VDD ISEN+ BOOT2 ISEN- EXTBIAS PGO OD OV CLKOUT DITHER FB_OUT Figure 1. ISL81601EVAL2Z Block Diagram UG160 Rev.0.00 Mar 23, 2018 Page 3 of 19 ISL81601EVAL2Z 2. 2. Functional Description Functional Description The ISL81601VAL2Z is the same test board used by Renesas application engineers and IC designers to evaluate the performance of the ISL81601 HTSSOP IC. The board provides an easy and complete evaluation of all the IC and board functions. As shown in Figure 4 on page 6, 32V to 60V VIN is supplied to J1 (+) and J2 (-). The regulated 48V output on J4 (+) and J5 (-) can supply up to 5A to the load. Due to the high power efficiency, the evaluation board can run at 5A continuously without airflow at room temperature ambient conditions. Test points TP1 through TP28 provide easy access to the IC pin and external signal injection terminals. As shown in Table 2 on page 5, connector J8 provides selection of either Forced PWM mode (shorting Pin 1 and Pin 2) or DEM mode (shorting Pin 2 and Pin 3). Connector J9 provides selection of either constant current limit (shorting Pin 1 and Pin 2) or HICCUP OCP(shorting Pin 2 and Pin 3). Connector J3 provides an option to disable the converter by shorting its Pin 1 and Pin 2. 2.1 Recommended Testing Equipment The following materials are recommended for testing: * 0V to 60V power supply with at least 10A source current capability * Electronic loads capable of sinking current up to 10A * Digital Multimeters (DMMs) * 100MHz quad-trace oscilloscope 2.2 Operating Range The input voltage range is from 32V to 60V for an output voltage of 48V. If the output voltage is set to a lower value, the minimum VIN can be reset to a lower value by changing the ratio of R2 and R3. The minimum EN threshold that VIN can be set to is 4.5V. The rated load current is 5A with the OCP point set at minimum 5.5A at ambient room temperature conditions. The operating temperature range of this board is from -40C to +85C. Note that airflow is needed for higher temperature ambient conditions. 2.3 Bi-Directional Operation Refer to Figure 2 for proper setup. Float the FBI pin (J7) and set the mode to PWM before powering on the board. The rated voltage of the super capacitor must be higher than 48V. (1) Adjust the input voltage higher than 36V. Switch on the input power source. (2) Switch off the input power source after the super capacitor is fully charged. VIN DC Load VOUT ISL81601EVAL2Z GND GND Figure 2. Proper Set-Up for Bi-Directional Operation UG160 Rev.0.00 Mar 23, 2018 Page 4 of 19 ISL81601EVAL2Z 2.4 2. Functional Description Quick Test Guide (1) Jumper J8 provides the option to select PWM or DEM. Jumper J9 provides the option to select Constant current limit or HICCUP. Refer to Table 2 for the operating options. Ensure that the circuit is correctly connected to the supply and electronic loads prior to applying any power. Refer to Figure 4 on page 6 for proper setup. (2) Turn on the power supply. (3) Adjust input voltage VIN within the specified range and observe the output voltage. The output voltage variation should be within 3%. (4) Adjust the load current within the specified range and observe the output voltage. The output voltage variation should be within 3%. (5) Use an oscilloscope to observe output voltage ripple and phase node ringing. For accurate measurement, refer to Figure 3 for proper test setup. Table 2. Operating Options Jumper Position 3 6 Function EN-GND Disable output EN Floating Enable output IIN Floating Enable input current limit IIN-VCC5 Disable input current limit 7 FBI-GND Disable VIN limit FBI Floating Enable VIN limit 8 Pin 1-2 PWM Pin 2-3 DEM 9 Pin 1-2 Constant current limit Pin 2-3 HICCUP Output Capacitor or MOSFET Figure 3. Proper Probe Set-Up to Measure Output Ripple and Phase Node Ringing UG160 Rev.0.00 Mar 23, 2018 Page 5 of 19 2. Functional Description - + VO A + + Load ISL81601EVAL2Z V VIN - + - A - Figure 4. Proper Test Setup UG160 Rev.0.00 Mar 23, 2018 Page 6 of 19 ISL81601EVAL2Z 3. 3. PCB Layout Guidelines PCB Layout Guidelines Careful attention to layout requirements is necessary for successful implementation of an ISL81601 based DC/DC converter. The ISL81601 switches at a very high frequency; therefore the switching times are very short. At these switching frequencies, even the shortest trace has significant impedance. The peak gate drive current also rises significantly in an extremely short time. Transition speed of the current from one device to another causes voltage spikes across the interconnecting impedances and parasitic circuit elements. These voltage spikes can degrade efficiency, generate EMI, and increase device voltage stress and ringing. Careful component selection and proper PC board layout minimizes the magnitude of these voltage spikes. Three sets of components are critical when using the ISL81601 DC/DC converter: * Controller * Switching power components * Small signal components The switching power components are the most critical to the layout because they switch a large amount of energy, which tends to generate a large amount of noise. The critical small signal components are those connected to sensitive nodes or those supplying critical bias currents. A multilayer printed circuit board is recommended. Complete the following steps to optimize the PCB layout. (1) The input capacitors, buck FETs, inductor, boost FETs, and output capacitor should be placed first. Isolate these power components on dedicated areas of the board with their ground terminals adjacent to one another. Place the input and output high frequency decoupling ceramic capacitors very close to the MOSFETs. (2) If signal components and the IC are placed separately from the power train, it is recommended to use full ground planes in the internal layers with shared SGND and PGND to simplify the layout design. Otherwise, use separate ground planes for the power ground and the small signal ground. Connect the SGND and PGND together close to the IC. DO NOT connect them together anywhere else. (3) The loop formed by the input capacitor, the buck top FET, and the buck bottom FET must be kept as small as possible. Also, the loop formed by the output capacitor, the boost top FET, and the boost bottom FET must also be kept as small as possible. (4) Ensure the current paths from the input capacitor to the buck FETs, the power inductor, the boost FETs, and the output capacitor are as short as possible with maximum allowable trace widths. (5) Place the PWM controller IC close to the lower FETs. The low-side FETs gate drive connections should be short and wide. The IC should be placed over a quiet ground area. Avoid switching ground loop currents in this area. (6) Place the VDD bypass capacitor very close to the VDD pin of the IC and connect its ground end to the PGND pin. Connect the PGND pin to the ground plane by a via. Do not connect the PGND pin directly to the SGND EPAD. (7) Place the gate drive components (BOOT diodes and BOOT capacitors) together near the controller IC. (8) Place the output capacitors as close to the load as possible. Use short, wide copper regions to connect output capacitors to the load to avoid inductance and resistance. (9) Use copper filled polygons or wide, short traces to connect the junction of the buck or boost upper FET, buck or boost lower FET, and output inductor. Keep the buck and boost PHASE nodes connection to the IC short. DO NOT unnecessarily oversize the copper islands for the PHASE nodes. Because the phase nodes are subjected to very high dv/dt voltages, the stray capacitor formed between these islands and the surrounding circuitry will tend to couple switching noise. (10) Route all high speed switching nodes away from the control circuitry. (11) Create a separate small analog ground plane near the IC. Connect the SGND pin to this plane. All small signal grounding paths including feedback resistors, current monitoring resistors and capacitors, soft-starting capacitors, loop compensation capacitors and resistors, and EN pull-down resistors should be connected to this SGND plane. (12) Use a pair of traces with minimum loop for the input or output current sensing connection. (13) Ensure the feedback connection to the output capacitor is short and direct. UG160 Rev.0.00 Mar 23, 2018 Page 7 of 19 ISL81601EVAL2Z 3.1 3. PCB Layout Guidelines ISL81601VAL2Z Evaluation Board Figure 5. ISL81601VAL2Z Evaluation Board (Top) Figure 6. ISL81601VAL2Z Evaluation Board (Bottom) UG160 Rev.0.00 Mar 23, 2018 Page 8 of 19 ISL81601EVAL2Z ISL81601VAL2Z Circuit Schematic - VIN 5 P LQSXW X9 X)9 X)9 & X9 X9 & & & X9 & 5 P X9 & 5 & X9 & & X9 & X9 - & 5 0HJ XY 5 ' 9 VOUT 5 73 5 N & Q QY & & & 5 N 73 Q FVS FVQ & Q SY N HQ SK 5 SK N & 5 N SY YFF & 5 ' 9 5 '13 '13 5 N FONHQ EVWHQ 5 N IEL & 9' LLQ & '13 XY YFF 9' & '13 5 N & Q & UW 5 N SOO SK SK & S & '13 5 '13 73 & '13 5 &21 5 5 N & Q VV FRPS IER '13 & S RY - -03 8* 1& 3+$6( (1B89/2 8 %227 ,6/B763 ,021B,1 1& &/.(1 /*3:0B02'( %67(1 3*1' )%B,1 9&&9 6*1' 576<1& 3//B&203 9'' /*2&B02'( 1& %227 3+$6( N N IEL 4 & & & %6&116 %6&116 '13 ' EW $9 GND X+ YFF OJ 4 4 4 4 '13 YFF & X9 %6&116 '13 5 OJ %6&116 5 '13 73 ' $9 EW 5 '13 YRXW '13 YFF 5 &/.287',7+(5 8* 5 SK 6675. 1& & &203 )%B287 3*22' 1& X 5 '13 XJ ,021B287 ,6(1 SJ 29 ,6(1 LVS 5 YFF & LVQ '13 5 5 & QY Q QY & Q 73 &21 5 '13 & '13 5 5 5 5 5 IER . '13 & 73 &21 '13 '13 73 &21 5 N 73 73 73 73 73 73 73 73 &21 &21 &21 &21 &21 &21 &21&21 Figure 7. Schematic FVQ LVS LVQ FVS H[W XJ SK EW OJ YFF OJ EW SK XJ SJ FRPS LRXW SOO YFF LLQ Page 9 of 19 VV OJ 5 N 73 73 73 73 73 73 73 73 73 73 73 73 73 &21 &21 &21 &21 &21 &21 &21 &21 &21 &21 &21 &21 &21 3. PCB Layout Guidelines 5 N - -03 OJ & - / & 5 X X)9 & X9 X9 X9 5 & XY 5 N & 5 N - -03 & X9 5 '13 5 '13 SK X9 X9 X9 5 '13 XJ X9 4 & 5 LLQ & & 5 '13 5 &6 X)9 & 4 & 5 YFF YFF 1& 4 '13 N LRXW - -03 &6 9' H[W Q 5 '13 5 P 9' (;7%,$6 YRXW FON & SY 9,1 '13 5 . & & 5 - 5 P 5 '13 9RXW 5 5 & '13 QY &21 &21 - (3$'B6*1' -03 GND UG160 Rev.0.00 Mar 23, 2018 3.2 ISL81601EVAL2Z 3.3 Bill of Materials Qty Reference Designator 1 3. PCB Layout Guidelines Description Manufacturer PWB-PCB, ISL81601EVAL2Z, IMAGINEERING INC REVA, ROHS Manufacturer Part ISL81601EVAL2ZREVAPCB 1 C33 CAP-AEC-Q200, SMD, 0603, 0.01F, 50V, 10%, X7R, ROHS TDK CGA3E2X7R1H103K080AE 16 C1, C2, C5, C6, C7, C8, C9, C10, C18, C19, C20, C21, C22, C23, C24, C25 CAP-AEC-Q200, SMD, 1210, TDK 4.7F, 100V, 10%, X7S, ROHS CGA6M3X7S2A475K200AE 1 C39 CAP-AEC-Q200, SMD, 0603, 0.022F, 25V, 10%, X7R, ROHS TDK CGJ3E2X7R1E223K080AA 1 C36 CAP-AEC-Q200, SMD, 0603, 0.033F, 25V, 10%, X7R, ROHS TDK CGJ3E2X7R1E333K080AA 2 C14, C45 CAP-AEC-Q200, SMD, 0603, 0.047F, 25V, 10%, X7R, ROHS TDK CGJ3E2X7R1E473K080AA 4 C12, C13, C41, C42 CAP-AEC-Q200, SMD, 0603, 0.01F, 100V, 10%, X7R, ROHS MURATA GCM188R72A103KA37D 2 C16, C46 CAP-BOARDFLEX, SMD, 0603, 0.1F, 100V, 10%, X7R, ROHS MURATA GRJ188R72A104KE11D 2 C31, C32 CAP, SMD, 0805, 10F, 16V, 10%, X7S, ROHS MURATA GRM21BC71C106KE11L 3 C11, C15, C43 CAP, SMD, 0603, 1000pF, 50V, 10%, X7R, ROHS AVX 06035C102KAT2A 1 C40 CAP, SMD, 0603, 220pF, 50V, 10%, X7R, ROHS MURATA GRM188R71H221KA01D 3 C29, C48, C53 CAP, SMD, 0603, 470pF, 100V, 5%, C0G, ROHS TDK C1608C0G2A471J 2 C30, C37 CAP, SMD, 0603, 0.47F, 25V, MURATA 10%, X7R, ROHS GRM188R71E474KA12D 1 C34 CAP, SMD, 0603, 820pF, 50V, 10%, X7R, ROHS KEMET C0603C821K5RACTU 0 C17, C28, C35, C38, C44, C47, C49, C50, C51, C52 CAP, SMD, 0603, DNP-PLACE HOLDER, ROHS 4 C3, C4, C26, C27 CAP, RADIAL, 12.5x26.5, 220F, 100V, 20%, ALUM.ELEC., 5mm, ROHS UNITED CHEMI-CON EKZN101ELL221MK25S 1 L1 COIL-PWR INDUCTOR, SMD, VISHAY 17.15mm, 22H, 20%, 12A, 21m, ROHS IHLP6767GZER220M11 27 TP1, TP2, TP4-TP28 CONN-COMPACT TEST PT, VERTICAL, WHT, ROHS KEYSTONE 5007 2 J3, J6 CONN-HEADER, 1x2, BRKAWY 1x36, 2.54mm, ROHS BERG/FCI 68000-236HLF UG160 Rev.0.00 Mar 23, 2018 Page 10 of 19 ISL81601EVAL2Z Qty Reference Designator 3. PCB Layout Guidelines Description Manufacturer Manufacturer Part 3 J7, J8, J9 CONN-HEADER, 1x3, BREAKAWY 1x36, 2.54mm, ROHS BERG/FCI 68000-236HLF 3 J7-Pins FBI-GND, J8-Pins PWM, J9-Pins CC CONN-JUMPER, SHORTING, 2PIN, BLACK, GOLD, ROHS SULLINS SPC02SYAN 2 D1, D2 DIODE-RECTIFIER, SMD, 2P, ON SEMICONDUCTOR S0D-123FL, 100V, 1A, ROHS 2 D3, D4 DIODE-ZENER, SMD, SOD-323, 4.7V, 6%, 300mW, ROHS DIODES, INC. MM3Z4V7T1G 1 U1 IC-60V 4-SWITCH PWM CONTROLLER, 38P, TSSOP, ROHS RENESAS ELECTRONICS AMERICA ISL81601FVEZ 4 Q2, Q3, Q5, Q8 TRANSIST-MOS, N-CHANNEL, SMD, 8P, PG-TDSON, 80V, 55A, ROHS INFINEON TECHNOLOGY BSC123N08NS3GATMA1 4 R8, R10, R35, R37 RES, SMD, 0603, 1, 1/10W, 1%, TF, ROHS PANASONIC ERJ-3RQF1R0V 1 R4 RES, SMD, 0603, 10, 1/10W, KOA 1%, TF, ROHS RK73H1JT10R0F 2 R9, R46 RES, SMD, 0603, 20, 1/10W, PANASONIC 1%, TF, ROHS ERJ-3EKF20R0V 2 R22, R28 RES, SMD, 0603, 2.2, 1/10W, 1%, TF, ROHS PANASONIC ERJ-3RQF2R2V 5 R11, R19, R20, R23, R29 RES, SMD, 0603, 0, 1/10W, TF, ROHS VENKEL CR0603-10W-000T 1 R54 RES, SMD, 0603, 1k, 1/10W, 1%, TF, ROHS PANASONIC ERJ-3EKF1001V 1 R36 RES, SMD, 0603, 10k, 1/10W, 1%, TF, ROHS VENKEL CR0603-10W-1002FT 1 R33 RES, SMD, 0603, 100k, 1/10W, 1%, TF, ROHS VENKEL CR0603-10W-1003FT 2 R40, R42 RES, SMD, 0603, 15k, 1/10W, 1%, TF, ROHS PANASONIC ERJ-3EKF1502V 1 R25 RES, SMD, 0603, 169k, 1/10W, 1%, TF, ROHS VENKEL CR0603-10W-1693FT 1 R53 RES, SMD, 0603, 200, 1/10W, 1%, TF, ROHS VENKEL CR0603-10W-2000FT 1 R26 RES, SMD, 0603, 2.7k, 1/10W, VENKEL 1%, TF, ROHS CR0603-10W-2701FT 2 R21, R44 RES, SMD, 0603, 3.48k, 1/10W, 1%, TF, ROHS PANASONIC ERJ-3EKF3481V 2 R12, R18 RES, SMD, 0603, 40.2k, 1/10W, 1%, TF, ROHS YAGEO RC0603FR-0740K2L 1 R7 RES, SMD, 0603, 41.2k, 1/10W, 1%, TF, ROHS VENKEL CR0603-10W-4122FT 1 R39 RES, SMD, 0603, 44.2k, 1/10W, 1%, TF, ROHS VENKEL CR0603-10W-4422FT 2 R5, R38 RES, SMD, 0603, 5.1k, 1/10W, VENKEL 1%, TF, ROHS CR0603-10W-5101FT UG160 Rev.0.00 Mar 23, 2018 MBR1H100SFT3G Page 11 of 19 ISL81601EVAL2Z Qty Reference Designator 3. PCB Layout Guidelines Description Manufacturer Manufacturer Part 2 R41, R43 RES, SMD, 0603, 51k, 1/10W, 1%, TF, ROHS YAGEO RC0603FR-0751KL 1 R3 RES, SMD, 0603, 62k, 1/10W, 1%, TF, ROHS YAGEO RC0603FR-0762KL 0 R14, R15, R16, R24, R27, R30, R31, R32, R47, R48, R49, R50, R55 RES, SMD, 0603, DNP-PLACE HOLDER, ROHS 2 R51, R57 RES, SMD, 1206, 10, 1/4W, 1%, TF, ROHS VENKEL CR1206-4W-10R0FT 1 R2 RES, SMD, 1206, 1M, 1/4W, 1%, TF, ROHS VENKEL CR1206-4W-1004FT 1 R17 RES, SMD, 1206, 154k, 1/4W, 1%, TF, ROHS YAGEO RC1206FR-07154KL 1 R45 RES, SMD, 1206, 205k, 1/4W, 1%, TF, ROHS YAGEO RC1206FR-07205KL 0 R52, R56 RES, SMD, 1206, DNP, DNP, DNP, TF, ROHS 4 R1, R6, R58, R59 RES-AEC-Q200, SMD, 1206, 0.012, 3/4W, 1%, ROHS SUSUMU CO., LTD KRL1632E-M-R012-F-T5 4 Four corners SCREW, 4-40X1/4in, PHILLIPS, PANHEAD, STAINLESS, ROHS BUILDING FASTENERS PMSSS 440 0025 PH 4 Four corners STANDOFF, 4-40X3/4in, F/F, HEX, ALUMINUM, 0.25 OD, ROHS KEYSTONE 2204 4 J1, J2, J4, J5 HDWARE, TERMINAL, M4 METRIC SCREW, TH, 4P, SNAP-FIT, ROHS KEYSTONE 7795 0 Q1, Q4, Q6, Q7 DO NOT POPULATE OR PURCHASE 0 TP3 DO NOT POPULATE OR PURCHASE UG160 Rev.0.00 Mar 23, 2018 Page 12 of 19 ISL81601EVAL2Z 3.4 3. PCB Layout Guidelines Board Layout Figure 8. Silkscreen Top Figure 9. Top Layer Figure 10. Second Layer (Solid Ground) Figure 11. Third Layer Figure 12. Bottom Layer Figure 13. Silkscreen Bottom UG160 Rev.0.00 Mar 23, 2018 Page 13 of 19 ISL81601EVAL2Z 4. 4. Typical Performance Curves Typical Performance Curves 100 100 95 95 90 90 Efficiency (%) Efficiency (%) VIN = 48V, unless otherwise noted. 85 80 85 80 75 75 Vin = 36V 70 Vin = 48V Vin = 60V 70 Vin = 36V Vin = 48V 65 65 0 1 2 3 4 0 5 1 2 3 4 5 IOUT (A) IOUT (A) Figure 14. Efficiency, CCM Figure 15. Efficiency, DEM 48.00 48.00 47.95 47.95 47.90 47.90 47.85 47.85 47.80 47.80 VOUT (V) VOUT (V) Vin = 60V 47.75 47.70 47.75 47.70 47.65 47.65 47.60 47.60 Vin = 36V 47.55 Vin = 48V Vin = 60V 47.55 Vin = 36V Vin = 48V Vin = 60V 47.50 47.50 0 1 2 3 4 5 0 1 2 3 4 5 IOUT (A) IOUT (A) Figure 17. Load Regulation, DEM Figure 16. Load Regulation, CCM Phase 1 50V/Div Phase 1 50V/Div Phase 2 50V/Div Phase 2 50V/Div VOUT 200mV/Div VOUT 200mV/Div IL 5A/Div IL 5A/Div 10s/Div 10s/Div Figure 18. Phase 1, Phase 2, VOUT and Inductor Current, VIN = 36V IOUT = 5A Figure 19. Phase 1, Phase 2, VOUT and Inductor Current, VIN = 48V IOUT = 5A UG160 Rev.0.00 Mar 23, 2018 Page 14 of 19 ISL81601EVAL2Z 4. Typical Performance Curves VIN = 48V, unless otherwise noted. (Continued) Phase 1 50V/Div VOUT 500mV/Div Phase 2 50V/Div VOUT 200mV/Div IL 5A/Div IOUT 2A/Div 10s/Div 2ms/Div Figure 20. Phase 1, Phase 2, VOUT and Inductor Current, VIN = 60V IOUT = 5A Figure 21. Load Transient, VIN = 36V IOUT = 0A to 5A 2.5A/s, CCM VOUT 500mV/Div VOUT 500mV/Div IOUT 2A/Div IL 2A/Div 2ms/Div 2ms/Div Figure 22. Load Transient, VIN = 48V IOUT = 0A to 5A 2.5A/s, CCM Figure 23. Load Transient, VIN = 60V IOUT = 0A to 5A 2.5A/s, CCM Phase 1 50V/Div Phase 1 50V/Div Phase 2 50V/Div Phase 2 50V/Div VOUT 50V/Div VOUT 50V/Div IL 10A/Div IL 10A/Div 4ms/Div Figure 24. Start-Up Waveform, VIN = 36V IOUT = 5A, CCM UG160 Rev.0.00 Mar 23, 2018 4ms/Div Figure 25. Start-Up Waveform, VIN = 48V IOUT = 5A, CCM Page 15 of 19 ISL81601EVAL2Z 4. Typical Performance Curves VIN = 48V, unless otherwise noted. (Continued) Phase 1 50V/Div Phase 1 50V/Div Phase 2 50V/Div Phase 2 50V/Div VOUT 50V/Div VOUT 50V/Div IL 10A/Div IL 10A/Div 4ms/Div 100ms/Div Figure 26. Start-Up Waveform, VIN = 60V, IOUT = 5A, CCM Figure 27. Short-Circuit Waveform VIN 20V/Div VIN 20V/Div VOUT 20V/Div VOUT 1V/Div IL 10A/Div IL 10A/Div 4ms/Div 4ms/Div Figure 28. Bi-Direction Operation, VIN = 48V, Vin_limit = 36V, IIN = 1A Figure 29. Line Transient, VIN = 36V to 60V, 1V/ms, IOUT = 0A VIN 20V/Div VOUT 1V/Div IL 10A/Div 4ms/Div Figure 30. Line Transient, VIN = 60V to 36V, 1V/ms, IOUT = 0A UG160 Rev.0.00 Mar 23, 2018 Page 16 of 19 ISL81601EVAL2Z 5. 5. Revision History Revision History Rev. Date 0.00 Mar 23, 2018 UG160 Rev.0.00 Mar 23, 2018 Description Initial release Page 17 of 19 Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information. 2. 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Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions. 10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document. 11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. (Rev.4.0-1 November 2017) http://www.renesas.com SALES OFFICES Refer to "http://www.renesas.com/" for the latest and detailed information. Renesas Electronics America Inc. 1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A. Tel: +1-408-432-8888, Fax: +1-408-434-5351 Renesas Electronics Canada Limited 9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3 Tel: +1-905-237-2004 Renesas Electronics Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K Tel: +44-1628-651-700, Fax: +44-1628-651-804 Renesas Electronics Europe GmbH Arcadiastrasse 10, 40472 Dusseldorf, Germany Tel: +49-211-6503-0, Fax: +49-211-6503-1327 Renesas Electronics (China) Co., Ltd. Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China Tel: +86-10-8235-1155, Fax: +86-10-8235-7679 Renesas Electronics (Shanghai) Co., Ltd. Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China Tel: +86-21-2226-0888, Fax: +86-21-2226-0999 Renesas Electronics Hong Kong Limited Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong Tel: +852-2265-6688, Fax: +852 2886-9022 Renesas Electronics Taiwan Co., Ltd. 13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan Tel: +886-2-8175-9600, Fax: +886 2-8175-9670 Renesas Electronics Singapore Pte. Ltd. 80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949 Tel: +65-6213-0200, Fax: +65-6213-0300 Renesas Electronics Malaysia Sdn.Bhd. Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: +60-3-7955-9390, Fax: +60-3-7955-9510 Renesas Electronics India Pvt. Ltd. No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India Tel: +91-80-67208700, Fax: +91-80-67208777 Renesas Electronics Korea Co., Ltd. 17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea Tel: +82-2-558-3737, Fax: +82-2-558-5338 (c) 2018 Renesas Electronics Corporation. All rights reserved. Colophon 7.0 ISL81601EVAL2Z UG160