74LCX04MTC_NL - FAIRCHILD SEMICONDUCTOR

September, 2014 − Rev. 10 Publication Order Number:

MC74LCX08/D

MC74LCX08

Low-Voltage CMOS Quad

2-Input AND Gate

With 5 V−Tolerant Inputs

The MC74LCX08 is a high performance, quad 2−input AND gate

operating from a 2.3 to 3.6 V supply. High impedance TTL compatible

inputs significantly reduce current loading to input drivers while TTL

compatible outputs of fer improved switching noise performance. A VI

specification of 5.5 V allows MC74LCX08 inputs to be safely driven

from 5.0 V devices.

Current drive capability is 24 mA at the outputs.

Features

•Designed for 2.3 V to 3.6 V VCC Operation

•5.0 V Tolerant Inputs − Interface Capability With 5.0 V TTL Logic

•LVTTL Compatible

•LVCMOS Compatible

•24 mA Balanced Output Sink and Source Capability

•Near Zero Static Supply Current (10 mA) Substantially Reduces

System Power Requirements

•Latchup Performance Exceeds 500 mA

•ESD Performance: Human Body Model >2000 V

Machine Model >200 V

•NLV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MARKING

DIAGRAMS

A = Assembly Location

L, WL = Wafer Lot

Y = Year

W, WW = Work Week

G or G= Pb−Free Package

(Note: Microdot may be in either location)

TSSOP−14

DT SUFFIX

CASE 948G

SOIC−14

D SUFFIX

CASE 751A

LCX08G

AWLYWW

See detailed ordering and shipping information in the packag

dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

http://onsemi.com

LCX

ALYWG

MC74LCX08

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Figure 1. Pinout: 14−Lead (Top V iew)

1314 12 11 10 9 8

21 34567

VCC A2 B2 O2 A3 B3 O3

A0 B0 O0 A1 B1 O1 GND

3O0

Figure 2. Logic Diagram

6O1

A1 5

11 O2

A2 12

8O3

A3 9

PIN NAMES

Pins Function

An, Bn Data Inputs

On Outputs

TRUTH TABLE

Inputs Outputs

An Bn On

L L L

L H L

H L L

H H H

H = High Voltage Level

L = Low Voltage Level

For ICC reasons, DO NOT FLOAT Inputs

MAXIMUM RATINGS

Symbol Parameter Value Condition Unit

VCC DC Supply Voltage −0.5 to +7.0 V

VIDC Input Voltage −0.5 ≤ VI ≤ +7.0 V

VODC Output Voltage −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V

IIK DC Input Diode Current −50 VI < GND mA

IOK DC Output Diode Current −50 VO < GND mA

+50 VO > VCC mA

IODC Output Source/Sink Current ±50 mA

ICC DC Supply Current Per Supply Pin ±100 mA

IGND DC Ground Current Per Ground Pin ±100 mA

TSTG Storage Temperature Range −65 to +150 °C

MSL Moisture Sensitivity Level 1

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

1. IO absolute maximum rating must be observed.

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RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Type Max Unit

VCC Supply Voltage Operating

Data Retention Only 2.0

1.5 2.5, 3.3

2.5, 3.3 3.6

3.6 V

VIInput Voltage 0 5.5 V

VOOutput Voltage (HIGH or LOW State)

(3−State) 0 VCC V

IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V

VCC = 2.7 V − 3.0 V

VCC = 2.3 V − 2.7 V

−24

−12

−8

IOL LOW Level Output Current VCC = 3.0 V − 3.6 V

VCC = 2.7 V − 3.0 V

VCC = 2.3 V − 2.7 V

+24

+12

TAOperating Free−Air Temperature −40 +85 °C

Dt/DVInput Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

DC ELECTRICAL CHARACTERISTICS

TA = −40°C to +85°C

Symbol Characteristic Condition Min Max Unit

VIH HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 1.7 V

2.7 V ≤ VCC ≤ 3.6 V 2.0

VIL LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 0.7 V

2.7 V ≤ VCC ≤ 3.6 V 0.8

VOH HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOH = −100 mAVCC − 0.2 V

VCC = 2.3 V; IOH = −8 mA 1.8

VCC = 2.7 V; IOH = −12 mA 2.2

VCC = 3.0 V; IOH = −18 mA 2.4

VCC = 3.0 V; IOH = −24 mA 2.2

VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA0.2 V

VCC = 2.3 V; IOL = 8 mA 0.6

VCC = 2.7 V; IOL = 12 mA 0.4

VCC = 3.0 V; IOL = 16 mA 0.4

VCC = 3.0 V; IOL = 24 mA 0.55

IOFF Power Off Leakage Current VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 mA

IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND ±5mA

ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND 10 mA

DICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 mA

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

2. These values of VI are used to test DC electrical characteristics only.

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AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 W)

Limits

TA = −40°C to +85°C

VCC = 3.3 V ± 0.3 V VCC = 2.7 V VCC = 2.5 V ± 0.2 V

CL = 50 pF CL = 50 pF CL = 30 pF

Symbol Parameter Waveform Min Max Min Max Min Max Unit

tPLH Propagation Delay Time 1 1.5 5.5 1.5 6.2 1.5 6.6 ns

tPHL Input to Output 1.5 5.5 1.5 6.2 1.5 6.6

tOSHL Output−to−Output Skew 1.0 ns

tOSLH (Note 3) 1.0

3. Skew is defined as the absolute value of the dif ference between the actual propagation delay for any two separate outputs of the same device.

The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter

guaranteed by design.

DYNAMIC SWITCHING CHARACTERISTICS

TA = +25°C

Symbol Characteristic Condition Min Typ Max Unit

VOLP Dynamic LOW Peak Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V

(Note 4) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.6 V

VOLV Dynamic LOW Valley Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V −0.8 V

(Note 4) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.6 V

4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is

measured in the LOW state.

CAPACITIVE CHARACTERISTICS

Symbol Parameter Condition Typical Unit

CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF

COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF

CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF

ORDERING INFORMATION

Device Package Shipping†

MC74LCX08DG SOIC−14

(Pb−Free) 55 Units / Rail

MC74LCX08DR2G SOIC−14

(Pb−Free) 2500 Tape & Reel

MC74LCX08DTG TSSOP−14

(Pb−Free) 96 Units / Rail

MC74LCX08DTR2G TSSOP−14

(Pb−Free) 2500 Tape & Reel

NLVLCX08DTR2G* TSSOP−14

(Pb−Free) 2500 Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP

Capable.

MC74LCX08

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WAVEFORM 1 − PROPAGATION DELAYS

tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns

Vcc

0 V

VOH

VOL

An, Bn

tPLH

tPHL

Vmi

Vmo

Vmi

Vmo

Vcc

Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V

Vmi 1.5 V 1.5 V Vcc/2

Vmo 1.5 V 1.5 V Vcc/2

Figure 3. AC Waveforms

PULSE

GENERATOR RT

DUT

VCC

CL= 50 pF at VCC = 3.3 + 0.3 V or equivalent (includes jig and probe capacitance)

CL= 30 pF at VCC = 2.5 + 0.2 V or equivalent (includes jig and probe capacitance)

RL= R1 = 500 W or equivalent

RT= ZOUT of pulse generator (typically 50 W)

Figure 4. Test Circuit

MC74LCX08

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PACKAGE DIMENSIONS

TSSOP−14

CASE 948G

ISSUE B

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A4.90 5.10 0.193 0.200

B4.30 4.50 0.169 0.177

C−−− 1.20 −−− 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.50 0.60 0.020 0.024

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

____

U0.15 (0.006) T

2X L/2

0.10 (0.004) V S

L−U−

SEATING

PLANE

0.10 (0.004)

−T−

ÇÇÇ

SECTION N−N

DETAIL E

JJ1

ÉÉÉ

DETAIL E

−W−

0.25 (0.010)

PIN 1

IDENT.

U0.15 (0.006) T

−V−

14X REFK

7.06

14X

0.36 14X

1.26

0.65

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MC74LCX08

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PACKAGE DIMENSIONS

SOIC−14 NB

CASE 751A−03

ISSUE K NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF AT

MAXIMUM MATERIAL CONDITION.

4. DIMENSIONS D AND E DO NOT INCLUDE

MOLD PROTRUSIONS.

5. MAXIMUM MOLD PROTRUSION 0.15 PER

SIDE.

14 8

0.25 B M

X 45

SEATING

PLANE

0.25 B S

13X

DET AIL A

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

D8.55 8.75 0.337 0.344

E3.80 4.00 0.150 0.157

A1.35 1.75 0.054 0.068

b0.35 0.49 0.014 0.019

L0.40 1.25 0.016 0.049

e1.27 BSC 0.050 BSC

A3 0.19 0.25 0.008 0.010

A1 0.10 0.25 0.004 0.010

M0 7 0 7

H5.80 6.20 0.228 0.244

h0.25 0.50 0.010 0.019

__ __

6.50

14X

0.58

14X

1.18

1.27

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

UBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MC74LCX08/D

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your loc

Sales Representative

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