NXP Semiconductors Data Sheet: Technical Data Document Number: MM912_637D1 Rev. 5.0, 8/2016 Intelligent integrated precision battery sensor MM912_637 The MM912I637 (96 kB) and MM912J637 (128 kB) are fully integrated LIN Battery monitoring devices, based on NXP SMARTMOS and S12 MCU Technology. Battery Monitoring System The device supports precise current measurement via an external shunt resistor, and precise battery voltage measurement via a series resistor directly at the battery plus pole. The integrated temperature sensor combined in the close proximity to the battery, allows battery temperature measurement. The integrated LIN 2.1 interface makes the sensor feedback available on the LIN Bus. Features * Battery voltage measurement * Battery current measurement in up to 8 ranges * On chip temperature measurement * Normal and two low-power modes * Current threshold detection and current averaging in standby => wake-up from low-power mode * Triggered wake-up from LIN and periodic wake-up * Signal low pass filtering (current, voltage) * PGA (programmable low-noise gain amplifier) with automatic gain control * Accurate internal oscillator (an external quartz oscillator may be used for extended accuracy) * Communication via a LIN 2.1, LIN2.0 bus interface * S12 microcontroller with 128 kByte flash, 6.0 kByte RAM, 4.0 kByte data flash * Background debug module * External temperature sensor option (TSUP, VTEMP) * Optional 2nd external voltage sense input (VOPT) * 4 x 5.0 V GPIO including one wake-up capable high voltage input (PTB3/L0) * 8 x MCU general purpose I/O including SPI functionality * Industry standard EMC compliance EP SUFFIX (WF-TYPE) 98ASA00343D 48-PIN QFN Applications * 12 V Lead-acid battery monitoring MM912_637 VDDA ADC Supply 2.5 V Supply 5.0 V Supply Digital Ground Reset 5.0 V Digital I/O Debug and External Oscillator MCU Test LIN AGND ADCGND VDDL VDDH VDDD2D VDDX VDDRX DGND VSSD2D VSSRX RESET RESET_A PA0/MISO PA1/MOSI PA2/SCK PA3/SS PA4 PA5 PA6 PA7 BKGD/MODC PE0/EXTAL PE1/XTAL TEST (optional) LGND Internal Temp Sense Module TSUP VTEMP Battery Positive Pole + VOPT VSENSE VSUP Battery Negative Pole _ ISENSEL Shunt ISENSEH Voltage sense Module Power Supply Current Sense Module -5.0 V GPI/O shared with TIMER, SCI and LIN -PTB3 high voltage WAKE capable PTB1 PTB2 PTB3/L0 4 TCLK TEST_A Figure 1. Simplified application diagram (c) 2016 NXP B.V. Optional Temp Sense Input and Supply Chassis Ground PTB0 GNDSUB LIN Interface Analog Test ELECTRICAL CHARACTERISTICS Table of Contents 1 2 3 4 5 6 7 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 MM912_637 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Recommended external components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Pin structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.4 Supply currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.5 Static electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.6 Dynamic electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.7 Thermal protection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.8 Electromagnetic compatibility (EMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Functional description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 4.2 MM912_637 - analog die overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 4.3 Analog die - power, clock and resets - PCR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 4.4 Interrupt module - IRQ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 4.5 Current measurement - ISENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 4.6 Voltage measurement - VSENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 4.7 Temperature measurement - TSENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 4.8 Channel acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 4.9 Window watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 4.10 Basic timer module - TIM (TIM16B4C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140 4.11 General purpose I/O - GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 4.12 LIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 4.13 Serial communication interface (S08SCIV4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171 4.14 Life time counter (LTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 4.15 Die to die interface - target . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 4.16 Embedded microcontroller - overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 4.17 MCU - port integration module (9S12I128PIMV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198 4.18 MCU - interrupt module (S12S9S12I128PIMV1V1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 4.19 Memory map control (S12PMMCV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210 4.20 MCU - debug module (9S12I128PIMV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222 4.21 MCU - security (S12XS9S12I128PIMV1V2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255 4.22 Background debug module (9S12I128PIMV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258 4.23 S12 clock, reset, and power management unit (9S12I128PIMV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 4.24 MCU - serial peripheral interface (S129S12I128PIMV1V5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305 4.25 128 kByte flash module (S12FTMRC128K1V1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 4.26 MCU - die-to-die initiator (9S12I128PIMV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 362 MM912_637 - trimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 374 5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 374 5.2 IFR trimming content and location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 374 5.3 Memory map and registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 378 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 384 6.1 Package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 384 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 391 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 1 Ordering information Table 1. Ordering information Device (1) Temperature range (TA) MM912I637AM2EP Package Maximum input voltage -40 C to 125 C MM912J637AM2EP 96 128 42 V -40 C to 105 C MM912J637AV1EP Flash (kB) 2 48 QFN-EP MM912I637AV1EP Analog option 96 1 128 Notes 1. To order parts in tape & reel, add the R2 suffix to the part number. Table 2. Analog options Feature Analog option 1 Analog option 2 Not Characterized or Tested Fully Characterized and Tested External Wake-up (PTB3/L0) No Yes External Temperature Sensor Option (VTEMP) No Yes Optional 2nd External Voltage Sense Input (VOPT) No Yes Cranking Mode MM912_637 25 NXP Semiconductors NXP Semiconductors ALU MISO MOSI SCK SS RAM 6k Byte SPI Dataflash 4k Bytes with ECC Flash 128k Bytes with ECC CPU Register M68HCS12 CPU Reset Generation and Test Entry VREG 1.8V Core 2.7V Flash Internal Bus PA0 PA1 PA2 PA3 PA4 PA5 Amplitude Controlled Low Power Pierce Osc. BKGD/MODC PLL with Freq. Modulation option OSC Clock Monitor PTE [1:0] RESET EST TAL TAL D2DI PC1 PD0 PD4 PD1 PD5 PD2 PD6 PD3 PD7 PC0 MCU Die Debug Module include 64 byte Trace Buffer RAM Interrupt Module Periodic Interrupt COP Watchdog Single-Wire Background Debug Module D2DCLK D2DINT D2DDAT0 D2DDAT4 D2DDAT1 D2DDAT5 D2DDAT2 D2DDAT6 D2DDAT3 D2DDAT7 Test Interface TEST_A Analog Die RESET_A BIAS Cascaded Voltage Regulators VDDH = 2.5V (D2D Buffer) VDDL = 2.5V (Internal Digital) VDDX = 5V (MCU Core) Die To Die Interface Interrupt Control Module Trimming / Calibration Reset Control Module TCLK PTA DDRA PA6 16 Bit - ADC 16 Bit - ADC LIN Physical Layer SCI 4 Channel Timer Wake Up Control Module (with Current Threshold and Current Averaging) Internal Chip Temp Sense with optional external input Current Sense Module (PGA with auto Gain Control) Low Pass Filter And Control VBAT / VOPT Sense Module Temp Sense Supply GPIO 16 Bit ADC ADC Regulator PTB0 PTB1 PTB2 PTB3 (L0) VTEMP ISENSEL ISENSEH ADCGND AGND VDDA VSENSE VOPT TSUP ELECTRICAL CHARACTERISTICS GNDSUB GNDSUB GNDSUB GNDSUB LGND LIN Internal Bus VSUP DGND VDDL VDDX VDDH VDDD2D VSSD2D VDDRX VSSRX PA7 Figure 2. Sample block diagram MM912_637 24 ELECTRICAL CHARACTERISTICS BKGD/MODC RESET RESET_A DGND TEST_A VDDL GNDSUB TCLK PTB0 PTB1 PTB2 Pin assignment PA7 2 48 47 46 45 44 43 42 41 40 39 38 37 PA6 1 36 PTB3 / L0 PTE0/EXTAL 2 35 VOPT PTE1/XTAL 3 34 VSENSE TEST 4 33 ADCGND PA5 5 32 ISENSEH PA4 6 31 ISENSEL EP PA3/SS 7 30 GNDSUB PA2/SCK 8 29 TSUP PA1/MOSI 9 28 VTEMP PA0/MISO 10 27 AGND VSSRX 11 26 VDDA VDDRX 12 25 NC 13 14 15 16 17 18 19 20 21 22 23 24 VSSD2D VDDD2D NC GNDSUB VDDX DGND VDDH GNDSUB VSUP LIN LGND NC (VFUSE) Figure 3. MM912_637 pin connections 2.1 MM912_637 pin description The following table gives a brief description of all available pins on the MM912_637 device. Refer to the highlighted chapter for detailed information Table 3. MM912_637 pin description (continued) Pin # Pin Name 1 PA6 2 3 PE0/EXTAL PE1/XTAL Formal Name Description MCU PA6 General purpose port A input or output pin 6. See Section 4.17, "MCU - port integration module (9S12I128PIMV1)". MCU Oscillator EXTAL in one of the optional crystal/resonator drivers and external clock pins, and the PE0 port may be used as a general purpose I/O. On reset, all the device clocks are derived from the internal reference clock. See Section 4.23, "S12 clock, reset, and power management unit (9S12I128PIMV1)". MCU Oscillator XTAL is one of the optional crystal/resonator drivers and external clock pins, and the PE1 port may be used as a general purpose I/O. On reset all the device clocks are derived from the internal reference clock. See Section 4.23, "S12 clock, reset, and power management unit (9S12I128PIMV1)". MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 3. MM912_637 pin description (continued) Pin # Pin Name Formal Name Description 4 TEST MCU Test This input only pin is reserved for test. This pin has a pull-down device. The TEST pin must be tied to VSSRX in user mode. 5 PA5 MCU PA5 General purpose port A input or output pin 5. See Section 4.17, "MCU - port integration module (9S12I128PIMV1)". 6 PA4 MCU PA4 General purpose port A input or output pin 4. See Section 4.17, "MCU - port integration module (9S12I128PIMV1)". 7 PA3 MCU PA3 / SS General purpose port A input or output pin 3, shared with the SS signal of the integrated SPI interface. See Section 4.17, "MCU - port integration module (9S12I128PIMV1)". 8 PA2 MCU PA2 / SCK General purpose port A input or output pin 2, shared with the SCLK signal of the integrated SPI interface. See Section 4.17, "MCU - port integration module (9S12I128PIMV1)". 9 PA1 MCU PA1 / MOSI General purpose port A input or output pin 1, shared with the MOSI signal of the integrated SPI interface. See Section 4.17, "MCU - port integration module (9S12I128PIMV1)". 10 PA0 MCU PA0 / MISO General purpose port A input or output pin 0, shared with the MISO signal of the integrated SPI interface. See Section 4.17, "MCU - port integration module (9S12I128PIMV1)". 11 VSSRX MCU 5.0 V Ground External ground for the MCU - VDDRX return path. 12 VDDRX MCU 5.0 V Supply 5.0 V MCU power supply. MCU core- (internal 1.8 V regulator) and flash (internal 2.7 V regulator) supply. This pin must be connected to VDDX. 13 VSSD2D MCU 2.5 V Ground External ground for the MCU - VDDD2D return path. 14 VDDD2D MCU 2.5 V Supply 2.5 V MCU power supply. Die to die buffer supply. This pin must be connected to VDDH. 15 NC Not connected This pin must be grounded in the application. 16 GNDSUB Substrate Ground Substrate ground connection to improve EMC behavior. 17 VDDX Voltage Regulator Output 5.0 V 5.0 V main voltage regulator output pin. An external capacitor (CVDDX) is needed. See Section 4.3, "Analog die - power, clock and resets - PCR". 18 DGND Digital Ground This pin is the device digital ground connection. See Section 4.3, "Analog die - power, clock and resets - PCR". 19 VDDH Voltage Regulator Output 2.5 V 2.5 V high power main voltage regulator output pin to be connected with the VDDD2D MCU pin. An external capacitor (CVDDH) is needed. See Section 4.3, "Analog die - power, clock and resets - PCR". 20 GNDSUB Substrate Ground Substrate ground connection to improve EMC behavior. 21 VSUP Power Supply This pin is the device power supply pin. A reverse battery protection diode is required. See Section 4.3, "Analog die - power, clock and resets - PCR". 22 LIN LIN Bus I/O This pin represents the single-wire bus transmitter and receiver. See Section 4.12, "LIN". 23 LGND LIN Ground Pin This pin is the device LIN ground connection. See Section 4.3, "Analog die - power, clock and resets - PCR". 24 NC Not connected (reserved) This pin must be grounded in the application. 25 NC Not connected This pin must be grounded in the application. 26 VDDA Analog Voltage Regulator Output Low power analog voltage regulator output pin, permanently supplies the analog front end. An external capacitor (CVDDA) is needed. See Section 4.3, "Analog die - power, clock and resets - PCR". 27 AGND Analog Ground This pin is the device analog voltage regulator and LP oscillator ground connection. See Section 4.3, "Analog die - power, clock and resets - PCR". 28 VTEMP Temperature Sensor Input External temperature sensor input. See Section 4.7, "Temperature measurement TSENSE". 29 TSUP Temperature Sensor Supply Output Supply for the external temperature sensor. TSUP frequency compensation option to allow capacitor CTSUP. See Section 4.7, "Temperature measurement - TSENSE". 30 GNDSUB Substrate Ground Substrate ground connection to improve EMC behavior. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 3. MM912_637 pin description (continued) Pin # Pin Name 31 ISENSEL Current Sense L Current sense input "Low". This pin is used in combination with ISENSEH to measure the voltage drop across a shunt resistor. See Section 4.5, "Current measurement - ISENSE". 32 ISENSEH Current Sense H Current sense input "high". This pin is used in combination with ISENSEL to measure the voltage drop across a shunt resistor. See Section 4.5, "Current measurement - ISENSE". 33 ADCGND Analog Digital Converter Ground Analog digital converter ground connection. See Section 4.3, "Analog die - power, clock and resets - PCR". Voltage Sense Precision battery voltage measurement input. This pin can be connected directly to the battery line for voltage measurements. The voltage preset at this input is scaled down by an internal voltage divider. The pin is self protected against reverse battery connections. An external resistor (RVSENSE) is needed for protection. See Section 4.6, "Voltage measurement - VSENSE". Optional Voltage Sense Optional voltage measurement input. See Section 4.6, "Voltage measurement - VSENSE". General Purpose Input 3 High Voltage Input 0 This is the high voltage general purpose input pin 3, based on VDDX with the following shared functions: * Internal clamping structure to operate as a high voltage input (L0). When used as high voltage input, a series resistor (RL0) and capacitor to GND (CL0) must be used to protect against automotive transients, when used to connect outside the PCB. * 5.0 V (VDDX) digital port input * Selectable internal pull-down resistor * Selectable wake-up input during low power mode. * Selectable timer channel input * Selectable connection to the LIN / SCI (Input only) See Section 4.11, "General purpose I/O - GPIO". General Purpose I/O 2 This is the general purpose I/O pin 2 based on VDDX with the following shared functions: * Bidirectional 5.0 V (VDDX) digital port I/O * Selectable internal pull-up resistor * Selectable timer channel input/output * Selectable connection to the LIN / SCI See Section 4.11, "General purpose I/O - GPIO". General Purpose I/O 1 This is the general purpose I/O pin 1, based on VDDX with the following shared functions: * Bidirectional 5.0 V (VDDX) digital port I/O * Selectable internal pull-up resistor * Selectable timer channel input/output * Selectable connection to the LIN / SCI See Section 4.11, "General purpose I/O - GPIO". 34 VSENSE 35 VOPT 36 37 38 PTB3 / L0 PTB2 PTB1 Formal Name Description 39 PTB0 General Purpose I/O 0 This is the general purpose I/O pin 0 based on VDDX with the following shared functions: * Bidirectional 5.0 V (VDDX) digital port I/O * Selectable internal pull-up resistor * Selectable timer channel input/output * Selectable connection to the LIN / SCI See Section 4.11, "General purpose I/O - GPIO". 40 TCLK Test Clock Input Test mode clock input pin for Test mode only. This pin must be grounded in user mode. 41 GNDSUB Substrate Ground Substrate ground connection to improve EMC behavior. 42 VDDL Low Power Voltage Regulator Output 2.5 V low power voltage regulator output pin. See Section 4.3, "Analog die - power, clock and resets - PCR". 43 TEST_A Test Mode Analog die Test mode pin for Test mode only. This pin must be grounded in user mode. 44 DGND Digital Ground This pin is the device digital ground connection. See Section 4.3, "Analog die - power, clock and resets - PCR". 45 RESET_A Reset I/O Reset output pin of the analog die in Normal mode. Bidirectional reset I/O of the analog die in Stop mode. Active low signal with internal pull-up to VDDX. This pin must be connected to RESET. See Section 4.3, "Analog die - power, clock and resets - PCR". MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 3. MM912_637 pin description (continued) Pin # Pin Name 46 RESET MCU Reset Bidirectional reset I/O pin of the MCU die. Active low signal with internal pull-up to VDDRX. This pin must be connected to RESETA. See Section 4.3, "Analog die - power, clock and resets - PCR". 47 BKGD MCU Background Debug and Mode The BKGD/MODC pin is used as a pseudo-open-drain pin for the background debug communication. It is used as an MCU operating mode select pin during reset. The state of this pin is latched to the MODC bit at the rising edge of RESET. The BKGD pin has a pull-up device. See Section 4.20, "MCU - debug module (9S12I128PIMV1)". 48 PA7 MCU PA7 General purpose port A input or output pin 7. See Section 4.17, "MCU - port integration module (9S12I128PIMV1)". 2.2 Formal Name Description Recommended external components Figure 4 and Table 4 list the required / recommended / optional external components for the application. Battery Plus Pole D1 RVOPT RVSENSE RISENSEL VSUP VDDL VDDD2D VDDH VDDRX ISENSEL CISENSEL RSHUNT CVBAT VSENSE VOPT Battery Minus Pole VDDX CISENSEHL RISENSEH CVDDX DGND ISENSEH RESET Chassis Ground CVDDH VSSD2D CISENSEH VSSRX RESETA VTEMP GNDSUB PTB3 / L0 GNDSUB LGND GNDSUB CLIN GNDSUB LIN Exposed Pad (EP) RVTEMP LIN TSUP VDDA CVDDA CTSUP AGND ADCGND RL0 CL0 Note: Module GND connected to Battery Minus or Chassis Ground - based on configuration. Figure 4. Required/recommended external components Table 4. Required/recommended external components Name Description Value Connection D1 Reverse Battery Diode n.a. VSUP-VBAT CVBAT Battery Blocking Capacitor 4.7 F/100 nF VSUP-GND RVSENSE VSENSE Current Limitation 2.2 k VSENSE-VBAT RVOPT VOPT Current Limitation 2.2 k VOPT-signal Comment Ceramic optional(2) MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 4. Required/recommended external components Name Description Value Connection Comment RSHUNT Current Shunt Resistor 100 ISENSEH-ISENSEL RISENSEL EMC Resistor 500 max select for best EMC performance RISENSEH EMC Resistor 500 max select for best EMC performance CISENSEL EMC Capacitor TBD select for best EMC performance CISENSEHL EMC Capacitor TBD select for best EMC performance CISENSEH EMC Capacitor TBD select for best EMC performance CVDDH Blocking Capacitor 1.0 F VDDH-GND CVDDX Blocking Capacitor 220 nF VDDX-GND CVDDA Blocking Capacitor 47 nF VDDA-GND CVDDL Blocking Capacitor n.a. VDDL-GND not required CLIN LIN Bus Filter n.a. LIN-LGND not required RL0 PTB3 / L0 Current Limitation 47 k L0 CL0 PTB3 / L0 ESD Protection 47 nF L0-GND CTSUP Blocking Capacitor 220 pF TSUP-GND not required(3) RVTEMP VTEMP Current Limitation 20 k VTEMP-signal optional(2) Notes 2. Required if extended EMC protection is needed 3. If an external temperature sensor is used, EMC compliance may require the addition of CTSUP. In this case the ECAP bit must be set to ensure the stability of the TSUP power supply circuit. See Section 4.7.1.2, "Block diagram". 2.3 Pin structure Table 5 documents the individual pin characteristic. Table 5. Pin type/structure Pin # Pin name Alternative pin function Power supply Structure 1 PA6 n.a. VDDRX n.a. 2 PE0 EXTAL VDDRX PUPEE / OSCPINS_EN 3 PE1 XTAL VDDRX PUPEE / OSCPINS_EN 4 TEST n.a. n.a. n.a. 5 PA5 n.a. VDDRX n.a. 6 PA4 n.a. VDDRX n.a. 7 PA3 SS VDDRX n.a. 8 PA2 SCK VDDRX n.a. 9 PA1 MOSI VDDRX n.a. 10 PA0 MISO VDDRX n.a. 11 VSSRX n.a. 12 VDDRX n.a. 13 VSSD2D n.a. GND GND MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 5. Pin type/structure Pin # Pin name Alternative pin function 14 VDDD2D n.a. 15 NC n.a. 16 GNDSUB n.a. 17 VDDX n.a. VDDX 18 DGND n.a. GND B2B-Diode to GNDSUB 19 VDDH n.a. VDDH Negative Clamp Diode, Dynamic ESD (transient protection) 20 GNDSUB n.a. GND GNDSUB 21 VSUP n.a. VSUP Negative Clamp Diode, >42 V ESD 22 LIN n.a. VSUP No Negative Clamping Diode (-40 V), >42 V ESD 23 LGND n.a. GND B2B-Diode to GNDSUB 24 NC n.a. n.a. Negative Clamp Diode, >15 V ESD 25 NC n.a. n.a. n.a. 26 VDDA n.a. VDDA Negative Clamp Diode, Dynamic ESD (transient protection) 27 AGND n.a. GND B2B-Diode to GNDSUB 28 VTEMP VDDA Negative Clamp Diode, >6.0 V ESD 29 TSUP TSUP Negative Clamp Diode, Dynamic ESD (transient protection) 30 GNDSUB GND GND 31 ISENSEL n.a. Negative Clamp Diode, 2nd Clamp Diode to VDDA 32 ISENSEH n.a. Negative Clamp Diode, 2nd Clamp Diode to VDDA 33 ADCGND GND B2B-Diode to GNDSUB 34 VSENSE n.a. No Negative Clamping Diode (-40 V), >42 V ESD 35 VOPT n.a. No Negative Clamping Diode (-40 V), >42 V ESD 36 PTB3 / L0 VDDRX Negative Clamp Diode, >6.0 V ESD 37 PTB2 VDDRX Negative Clamp, Dynamic 5.5 V ESD 38 PTB1 VDDRX Negative Clamp, Dynamic 5.5 V ESD 39 PTB0 VDDRX Negative Clamp, Dynamic 5.5 V ESD 40 TCLK VDDRX Negative Clamp, Dynamic 5.5 V ESD 41 GNDSUB GND GND 42 VDDL VDDL Negative Clamp Diode, Dynamic ESD (transient protection) 43 TEST_A VDDRX Negative Clamp, positive 10 V Clamp 44 DGND GND B2B-Diode to GNDSUB 45 RESET_A VDDRX Negative Clamp, positive 10 V Clamp 46 RESET VDDRX Pull-up Power supply Structure GND MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 5. Pin type/structure Pin # Pin name Alternative pin function Power supply Structure 47 BKGD MODC VDDRX BKPUE 48 PA7 VDDRX n.a. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 3 Electrical characteristics 3.1 General This section contains electrical information for the microcontroller, as well as the MM912_637 analog die. 3.2 Absolute maximum ratings Absolute maximum ratings are stress ratings only. A functional operation under or outside these maximums is not guaranteed. Stress beyond these limits may affect the reliability, or cause permanent damage of the device. This device contains circuitry protecting against damage due to high static voltage or electrical fields. However, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate voltage level. All voltages are with respect to ground, unless otherwise noted. Table 6. Absolute maximum electrical ratings - analog die Ratings Symbol Value Unit VVSUP -0.3 to 42 V VVSENSE -16 to 42 V VOPT pin voltage with 2.2 k serial resistor VVOPT -16 to 42 V VTEMP pin voltage VVTEMP -0.3 to VDDA+0.25 V ISENSEH and ISENSEL pin voltage VISENSE -0.5 to VDDA+0.25 V ISENSEH and ISENSEL pin current IISENSE -1 to 1 mA VBUS -33 to 42 V LIN pin current (internally limited) IBUSLIM on page 17 mA L0 pin voltage with RPTB3 VPTB3 -0.3 to 42 max. V Input / Output pins PTB[0:2] voltage VPTB0-2 -0.3 to VDDX+0.5 V Pin voltage at VDDX VDDX -0.3 to 5.75 V Pin voltage at VDDH VDDH -0.3 to 2.75 V VDDH output current IVDDH internally limited A VDDX output current IVDDX internally limited A TCLK pin voltage VTCLK -0.3 to VDDX+0.5 V VIN -0.3 to VDDX+0.5 V Symbol Value Unit 5.0 V supply voltage VDDRX -0.3 to 6.0 V 2.5 V supply voltage VDDD2D -0.3 to 3.6 V VIN -0.3 to 6.0 V VIN -0.3 to 2.16 V I -25 to 25 mA VSUP pin voltage VSENSE pin voltage with 2.2 k serial resistor (4) LIN pin voltage RESET_A pin voltage Notes 4. It has to be assured by the application circuit that these limits will not be exceeded, e.g. by ISO pulse 1. Table 7. Maximum electrical ratings - MCU die (continued) Ratings Digital I/O input voltage (PTA0...7) EXTAL, XTAL Instantaneous maximum current single pin limit for all digital I/O pins(5) D MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 7. Maximum electrical ratings - MCU die (continued) Ratings Symbol Value Unit IDL -25 to 25 mA Symbol Value Unit Storage temperature TSTG -55 to 150 C Package thermal resistance (6) RJA 25 typ. C/W Instantaneous maximum current single pin limit for EXTAL, XTAL Notes 5. All digital I/O pins are internally clamped to VSSRX and VDDRX. Table 8. Maximum thermal ratings Ratings Notes 6. RJA value is derived using a JEDEC 2s2p test board 3.3 Operating conditions This section describes the operating conditions of the device. Conditions apply to all the following data, unless otherwise noted. Table 9. Operating conditions (7) Ratings Symbol Value Unit Functional operating supply voltage - Device is fully functional. All features are operating. VSUP 3.5 to 28 V Extended range for RAM Content is guaranteed. Other device functionary is limited. With cranking mode enabled (seeSection 4.3.3.4, "Low-voltage operation - cranking mode device option"). VSUPL 2.5 to 3.5 V VSENSE 0 to 28 V Functional operating VOPT voltage VOPT 0 to 28 V External temperature sense input - VTEMP VTEMP 0 to 1.25 V VVSUP_LIN 7.0 to 18 V VISENSE -0.3 to 0.3 V MCU 5.0 V supply voltage VDDRX 3.13 to 5.5 V MCU 2.5 V supply voltage VDDD2D 2.25 to 3.6 V MCU oscillator fOSC 4.0 to 16 MHz MCU bus frequency fBUS max. 32.768 MHz TA -40 to 125 C Operating junction temperature - analog die TJ_A -40 to 150 C Operating junction temperature - MCU die TJ_M -40 to 150 C Functional operating VSENSE voltage (8) LIN output voltage range ISENSEH / ISENSEL terminal voltage Operating ambient temperature Notes 7. The parametric data are guaranteed while the pins are within Operating Conditions. Other conditions are presented at the top of the parametric tables or noted into parameters. 8. Values VSENSE > 28 V are flagged in the VSENSE MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 3.4 Supply currents This section describes the current consumption characteristics of the device, as well as the conditions for the measurements. 3.4.1 Measurement conditions All measurements are without output loads. The currents are measured in MCU special single chip mode, and the CPU code is executed from RAM, unless otherwise noted. For Run and Wait current measurements, PLL is on and the reference clock is the IRC1M, trimmed to 1.024 MHz. The bus frequency is 32.768 MHz and the CPU frequency is 65.536 MHz. Table 10 and Table 11 show the configuration of the CPMU module for Run, Wait, and Stop current measurements. Table 12 shows the configuration of the peripherals for run current measurements Table 10. CPUM configuration for run/wait and full stop current measurement CPMU register Bit settings/conditions CPMUSYNR VCOFRQ[1:0]=01,SYNDIV[5:0] = 32.768 MHz CPMUPOSTDIV POSTDIV[4:0]=0, CPMUCLKS PLLSEL=1 CPMUOSC OSCE=0, Reference clock for PLL is fREF=fIRC1M trimmed to 1.024 MHz Table 11. CPMU configuration for pseudo stop current measurements CPMU register Bit settings/conditions CPMUCLKS PLLSEL=0, PSTP=1, PRE=PCE=RTIOSCSEL=COPOSCSEL=1 CPMUOSC OSCE=1, External square wave on EXTAL fEXTAL=16 MHz, VIH= 1.8 V, VIL=0 V CPMURTI RTDEC=0, RTR[6:4]=111, RTR[3:0]=1111; CPMUCOP WCOP=1, CR[2:0]=111 Table 12. MCU peripheral configurations for run supply current measurements Peripheral Configuration SPI configured to master mode, continuously transmit data (0x55 or 0xAA) at 4.0 Mbit/s D2DI continuously read data COP COP Watchdog Rate 224 RTI enabled, RTI Control Register (RTICTL) set to $FF DBG The module is disabled. Table 13. Analog die configurations for normal mode supply current measurements Peripheral Configuration D2D maximum frequency (32.768 MHz) LIN enabled, 50% dominant, 50% recessive TIMER enabled, all channels active in output compare mode with minimum timeout LTC enabled, maximum timeout SCI continuously transmitting data (0x55 or 0xAA) with 19.2 kBit/s Acquisition Channels current/voltage: highest sampling rate (8.0 kHz), LPF enabled, chopper and compensation enabled, automatic gain adjustment enabled temperature: internal temperature measurement enabled, 1.0 kHz sampling rate MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 14. Supply currents(9) Ratings Symbol Min. Typ.(11) Max. Unit 25 mA MM912_637 combined consumption Normal mode current both dice IRUN Stop Mode current measured at VSUP Continuous base current (11) -40 C iSTOP_S 85 C (10) 125 C Pseudo Stop Current, RTI and COP enabled (11) -40 C iSTOP_S 85 C (10) 125 C Stop Current during Cranking Mode -40 C iSTOP_S 85 C (10) 125 C Current adder during current trigger event - (typ. 10 ms duration(13), temperature measurement = OFF) ISTOP Sleep Mode measured at VSUP -40 C iSTOP_S 85 C (10) 125 C Current adder during current trigger event - (typ. 10 ms duration (13), temperature measurement = OFF) ISLEEP - - - 100 105 106 120 190 230 - - - 410 450 520 490 520 590 - - - - 105 125 185 1500 130 230 270 1750 - - - - 60 60 80 1500 80 130 140 1750 A A Analog die contribution - excluding MCU and external load current, (3.5 V VSUP 28 V; -40 C TA 125 C) INORMAL 1.5 4.0 mA Run Current, TA = 125 C IRUN 13.5 18.8 mA Wait current, TA = 125 C IWAIT 7.0 8.8 mA Normal mode current measured at VSUP MCU die contribution, VDDRX = 5.5 V Notes 9. See Table 10, Table 11, Table 12, and Table 13 for conditions. Currents measured in Test mode with external loads (100 pF) and the external clock at 64 MHz. 10. Not tested in production, guaranteed by characterization 11. Typical values noted reflect the approximate parameter mean at TA = 25 C. 12. From VSUP 6.0 to 28 V 13. Duration based on channel configuration. 10ms typical for Decimation Factor = 512, Chopper = ON. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 3.5 Static electrical characteristics All characteristics noted under conditions 3.5 V VSUP 28 V, -40 C TA 125 C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted. 3.5.1 Static electrical characteristics analog die Table 15. Static electrical characteristics - power supply Ratings Symbol Min. Typ. Max. 1.75 1.9 2.1 1.85 2.1 2.35 1.0 1.3 1.7 Unit Low Voltage Reset L (POR) Assert (measured on VDDL) Cranking Mode Disabled VPORL Low Voltage Reset L (POR) Deassert (measured on VDDL) Cranking Mode Disabled V Low Voltage Reset L (POR) Assert (measured on VDDL) Cranking Mode Enabled(14) V Low Voltage Reset A (LVRA) Assert (measured on VDDA) VLVRAL 1.9 2.05 2.2 V Low Voltage Reset A (LVRA) Deassert (measured on VDDA) V 2.0 2.15 2.3 V Low Voltage Reset X (LVRX) Assert (measured on VDDX) V LVRXL 2.5 2.75 3.0 V Low Voltage Reset X (LVRX) Deassert (measured on VDDX) VLVRXH 2.7 2.95 3.25 V Low Voltage Reset H (LVRH) Assert (measured on VDDH) V LVRHL 1.9 2.075 2.2 V Low Voltage Reset H (LVRH) Deassert (measured on VDDH) V LVRHH 2.05 2.175 2.3 V Undervoltage Interrupt (UVI) Assert (measured on VSUP), Cranking Mode Disabled VUVIL 4.55 5.2 6.1 V Undervoltage Interrupt (UVI) Deassert (measured on VSUP), Cranking Mode Disabled V UVIH 4.7 5.4 6.2 V Undervoltage Cranking Interrupt (UVI) Assert (measured on VSUP) Cranking Mode Enabled V UVCIL 3.4 3.6 4.0 V Undervoltage Cranking Interrupt (UVI) Deassert (measured on VSUP) Cranking Mode Enabled VUVCIH 3.5 3.8 4.1 V VSENSE/VOPT High Voltage Warning Threshold Assert(15) Notes 14. Deassert with Cranking off = V PORH PORCL LVRAH V 28 TH V V V V PORH 15. 5.0 V < VSUP < 28 V, Digital Threshold at the end of channel chain (incl. compensation) Table 16. Static electrical characteristics - resets Ratings Low-state Output Voltage IOUT = 2.0 mA Pull-up Resistor Symbol Min. Typ. VOL RRPU 25 Low-state Input Voltage VIL High-state Input Voltage VIH 0.7VDDX Reset Release Voltage (VDDX) VRSTRV 0 RESET_A pin Current Limitation ILIMRST Max. Unit 0.8 V 50 k 0.3VDDX V V 0.02 1.0 V 10 mA MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 17. Static electrical characteristics - voltage regulator outputs Ratings Symbol Min. Typ. Max. Unit Output Voltage 1.0 mA IVDDA 1.5 mA VDDA 2.25 2.5 2.75 V Output Current Limitation IVDDA 10 mA Analog Voltage Regulator - VDDA(16) Low Power Digital Voltage Regulator - VDDL(16) VDDL 2.25 2.5 2.75 V Output Voltage 1.0 mA IVDDH 30 mA VDDH 2.4 2.5 2.75 V Output Current Limitation IVDDH 65 mA Output Voltage High Power Digital Voltage Regulator - VDDH (17) 5.0 V Voltage Regulator - VDDX(17) Output Voltage 1.0 mA IVDDX 30 mA VDDX 3.15 5.0 5.9 V Output Current Limitation IVDDX 45 60 80 mA Notes 16. No additional current must be taken from those outputs. 17. The specified current ranges does include the current for the MCU die. No external loads recommended. Table 18. Static electrical characteristics - LIN physical layer interface - LIN Ratings Current Limitation for Driver dominant state. VBUS = 18 V Symbol Min. Typ. Max. Unit IBUSLIM 40 120 200 mA Input Leakage Current at the Receiver incl. Pull-up Resistor RSLAVE; Driver OFF; VBUS = 0 V; VBAT = 12 V IBUS_PAS_DOM Input Leakage Current at the Receiver incl. Pull-up Resistor RSLAVE; Driver OFF; 8.0 V < VBAT < 18 V; 8.0 V < VBUS < 18 V; VBUS VBAT IBUS_PAS_REC Input Leakage Current; GND Disconnected; GNDDEVICE = VSUP; 0 < VBUS < 18 V; VBAT = 12 V IBUS_NO_GND Input Leakage Current; VBAT disconnected; VSUP_DEVICE = GND; 0 < VBUS < 18 V IBUS_NO_BAT -1.0 -1.0 Receiver Input Voltage; Receiver Dominant State VBUSDOM Receiver Input Voltage; Receiver Recessive State VBUSREC 0.6 Receiver Threshold Center (VTH_DOM + VTH_REC)/2 VBUS_CNT 0.475 Receiver Threshold Hysteresis (VTH_REC - VTH_DOM) VBUS_HYS Voltage Drop at the serial Diode DSER_INT 0.3 RSLAVE 20 LIN Pull-up Resistor mA 20 A 1.0 mA 100 A 0.4 VSUP VSUP 0.5 0.525 VSUP 0.175 VSUP 0.7 1.0 V 30 60 k 0.3 VSUP Low Level Output Voltage, IBUS=40 mA VDOM High Level Output Voltage, IBUS=-10 A, RL=33 k VREC VSUP-1 J2602 Detection Deassert Threshold for VSUP level VJ2602H 5.9 6.3 6.7 V J2602 Detection Assert Threshold for VSUP level VJ2602L 5.8 6.2 6.6 V VJ2602HYS 70 190 250 mV VLINWUP 4.0 5.25 6.0 V J2602 Detection Hysteresis BUS Wake-up Threshold V MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 19. Static electrical characteristics - high voltage input - PTB3 / L0 Ratings Symbol Min. Typ. Max. Unit VWTHR 1.3 2.6 3.4 V Input High Voltage (digital Input) VIH 0.7VDDX VDDX+0.3 V Input Low Voltage (digital Input) VIL VSS-0.3 0.35VDDX V VHYS 50 140 200 mV VL0CLMP 4.9 6.0 7.0 V 1.1 mA Wake-up Threshold - Rising Edge Input Hysteresis Internal Clamp Voltage IIN Input Current PTB3 / L0 (VIN = 42 V; RL0=47 k) Internal pull-down resistance (18) PTB3 / L0 Series Resistor PTB3 / L0 Capacitor RPD 50 100 200 k RPTB3 42.3 47 51.7 k CL0 42.3 47 51.7 nF Max. Unit Notes 18. Disabled by default. Table 20. Static electrical characteristics - general purpose I/O - PTB[0...2] Ratings Symbol Min. Input High Voltage VIH 0.7VDDX VDDX+0.3 V Input Low Voltage VIL VSS-0.3 0.35VDDX V VHYS 50 200 mV 1.0 A Input Hysteresis Input Leakage Current (pins in high-impedance input mode) (VIN = VDDX or VSSX) IIN Output High Voltage (pins in output mode) Full drive IOH = -5.0 mA VOH Output Low Voltage (pins in output mode) Full drive IOL = 5.0 mA VOL Internal Pull-up Resistance (VIH min. > Input voltage > VIL max)(19) RPUL Maximum Current All PTB Combined(20) IBMAX Output Drive strength at 10 MHz COUT 140 -1.0 VDDX-0.8 25 CIN Input Capacitance Typ. V 37.5 0.8 V 50 k 6.0 -17 pF 17 mA 100 pF Notes 19. Disabled by default. 20. Overall VDDR Regulator capability to be considered. Table 21. Static electrical characteristics - current sense module(21) (continued) Ratings Gain Error with temperature based gain compensation adjustment(22), (23) Offset Error(24),(25) Symbol IGAINERR Typ. Max. Unit -0.5 +/-0.1 0.5 % 0.5 V IOFFSETERR Resolution IRES ISENSEH, ISENSEL terminal voltage differential signal voltage range VINC VIND Differential Leakage Current: differential voltage between ISENSEH/ ISENSEL, 200 mV Min. ISENSE_DLC 0.1 V -300 -200 300 200 mV -2.0 2.0 nA MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 21. Static electrical characteristics - current sense module(21) (continued) Ratings Symbol Wake-up Current Threshold Resolution IRESWAKE Resistor Threshold for OPEN Detection ROPEN Min. Typ. Max. Unit 0.2 0.8 V 1.25 1.8 M Notes 21. 3.5 V VSUP 28 V, after applying default trimming values - see Section 5, "MM912_637 - trimming". 22. Gain Compensation adjustment on calibration request interrupt with TCALSTEP 23. 0.65%, including lifetime drift for gain 256 and 512 24. Chopper Mode = ON, Gain with automatic gain control enabled 25. Parameter not tested. Guaranteed by design and characterization Table 22. Static electrical characteristics - voltage sense module(26) Ratings (27) Symbol Min. Typ. Max. -0.5 -0.25 -0.15 0.1 0.1 0.1 0.5 0.25 0.15 Unit VGAINERR Gain Error 18 V < VIN 28 V 3.5 V VIN < 5.0 V(28) 5.0 V VIN 18 V(28),(30) Offset Error(29),(31) VOFFSETERR Resolution with RVSENSE = 2.2 k -1.5 VRES % 1.5 mV 0.5 mV Max. Unit Notes 26. 3.5 V VSUP 28 V, after applying default trimming values - see Section 5, "MM912_637 - trimming". 27. Including resistor mismatch drift 28. Gain Compensation adjustment on calibration request interrupt with TCALSTEP 29. Chopper Mode = ON. 30. 0.2%, including lifetime drift 31. Parameter not tested. Guaranteed by design and characterization. Table 23. Static electrical characteristics - temperature sense module(32) Ratings Measurement Range Symbol Min. Typ. TRANGE -40 150 C -2.0 -3.0 2.0 3.0 K Accuracy -40 C TA 60 C(33) -40 C TA 150 C TACC Resolution TRES TSUP Voltage Output, 10 A ITSUP 100 A VTSUP 1.1875 1.25 1.3125 V TSUP Capacitor with ECAP = 1 CTSUP 209 220 231 pF TCALSTEP -25 25 K Max Calibration Request Interrupt Temperature Step 8.0 mK Notes 32. 3.5 V VSUP 28 V, after applying default trimming values - see Section 5, "MM912_637 - trimming". 33. Temperature not tested in production. Guaranteed by design and characterization. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 3.5.2 Static electrical characteristics MCU die Table 24. Static electrical characteristics - MCU Ratings Symbol Min. Typ. Max. Unit PORA 0.6 0.9 - V PORD - 0.95 1.6 V 2.97 3.06 - V - 3.09 3.3 V Power On Reset Assert (measured on VDDRX) V Power On Reset Deassert (measured on VDDRX) V Low Voltage Reset Assert (measured on VDDRX) VLVRA Low Voltage Reset Deassert (measured on VDDRX) V Low Voltage Interrupt Assert (measured on VDDRX) V LVIA 4.06 4.21 4.36 V Low Voltage Interrupt Deassert (measured on VDDRX) VLVID 4.19 4.34 4.49 V LVRD Table 25. Static electrical characteristics - oscillator (OSCLCP) Ratings Symbol Min. Startup Current iOSC 100 Input Capacitance (EXTAL, XTAL pins) CIN EXTAL Pin Input Hysteresis EXTAL Pin oscillation amplitude (loop controlled Pierce) Typ. Max. Unit A 7.0 pF VHYS,EXTAL -- 180 -- mV VPP,EXTAL -- 0.9 -- V Table 26. 5.0 V I/O characteristics for all I/O pins except EXTAL, XTAL, TEST, D2DI, and supply pins (4.5 V < VDDRX < 5.5 V; TJ: -40 C to +150 C, unless otherwise noted) (continued) Ratings Symbol Min. Typ. Max. Unit 0.65*VDDRX -- -- V Input High Voltage V Input High Voltage VIH -- -- VDDRX+0.3 V Input Low Voltage VIL -- -- 0.35*VDDRX V Input Low Voltage VIL VSSRX-0.3 -- -- V 250 -- mV -- 1.00 Input Hysteresis Input Leakage Current (pins in high-impedance input mode)(34) VIN = VDDRX or VSSRX Input Leakage Current (pins in high-impedance input mode)(35) VIN = VDDX or VSSX TA = -40 C TA = 25 C TA = 70 C TA = 85 C TA = 105 C TA = 110 C TA = 120 C TA = 125 C TA = 130 C TA = 150 C VHYS IIN I -1.00 1.0 1.0 8.0 14 26 32 40 60 74 92 240 IN Output High Voltage (pins in output mode), IOH = -4.0 mA V Output Low Voltage (pins in output mode), IOL = 4.0 mA V Internal Pull-up Current, VIH min > input voltage > VIL max Internal Pull-down Current, VIH min > input voltage > VIL max Input Capacitance IH A nA VDDRX - 0.8 -- -- V -- -- 0.8 V IPUL -10 -- -130 A IPDH 10 -- 130 A Cin -- 7 -- pF OH OL MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 26. 5.0 V I/O characteristics for all I/O pins except EXTAL, XTAL, TEST, D2DI, and supply pins (4.5 V < VDDRX < 5.5 V; TJ: -40 C to +150 C, unless otherwise noted) (continued) Ratings Symbol Min. Typ. Max. Unit IICS IICP -2.5 -25 -- 2.5 25 mA Injection Current(36) Single pin limit Total device Limit, sum of all injected currents Notes 34. Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each 8.0 C to 12 C in the temperature range from 50 C to 125 C. 35. Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each 8.0 C to 12 C in the temperature range from 50 C to 125 C. 36. Refer to Section 3.5.2.1, "Current injection" for more details 3.5.2.1 Current injection The power supply must maintain regulation within the VDDX operating range during instantaneous and operating maximum current conditions. If positive injection current (VIN > VDDX) is greater than IDDX, the injection current may flow out of VDDX and could result in the external power supply going out of regulation. Ensure that the external VDDX load will shunt current greater than the maximum injection current. This will be the greatest risk when the MCU is not consuming power; e.g., if no system clock is present, or if the clock rate is very low, which would reduce overall power consumption. 3.6 Dynamic electrical characteristics Dynamic characteristics noted under conditions 3.5 V VSUP 28 V, -40 C TA 125 C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted. 3.6.1 Dynamic electrical characteristics analog die Table 27. Dynamic electrical characteristics - modes of operation Ratings Symbol Min. Typ. Max. Unit Low Power Oscillator Frequency fOSCL -- 512 -- kHz Low Power Oscillator Tolerance over full temperature range Analog Option 2 Analog Option 1 fTOL_A -4.0 -5.0 -- -- 4.0 5.0 % Low Power Oscillator Tolerance - synchronized ALFCLK(37) ALF clock cycle = 1.0 ms ALF clock cycle = 2.0 ms ALF clock cycle = 4.0 ms ALF clock cycle = 8.0 ms fTOLC_A fTOL fTOL+0.2 fTOL+0.1 fTOL+0.05 fTOL+0.025 fTOL-0.2 fTOL-0.1 fTOL-0.05 fTOL-0.025 % Notes 37. Parameter not tested. Guaranteed by design and characterization. Table 28. Dynamic electrical characteristics - die to die interface - D2D Ratings Operating Frequency (D2DCLK, D2D[0:3]) Symbol Min. Typ. Max. Unit fD2D -- -- 32.768 MHz MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 29. Dynamic electrical characteristics - resets Ratings Symbol Min. Typ. Max. Unit Reset Deglitch Filter Time tRSTDF 1.0 2.0 3.2 s Reset Time for watchdog and Hardware Reset (RESETA pin set low) tRSTRT -- 32 -- s Symbol Min. Typ. Max. Unit tWAKEUP ALFCLK -- TIM4CH ms tSTEP ALFCLK -- 16Bit ms Min. Typ. Max. Unit Table 30. Dynamic electrical characteristics - wake-up / cyclic sense Ratings Cyclic Wake-up Time (38) Cyclic Current Measurement Step Width(39) Notes 38. Cyclic wake-up on ALFCLK clock based 16 Bit TIMER with maximum 128x prescaler (min 1x) 39. Cyclic wake-up on ALFCLK clock with 16 Bit programmable counter Table 31. Dynamic electrical characteristics - window watchdog Ratings Initial Non-window Watchdog Timeout Symbol tIWDTO see Figure 39 ms Table 32. Dynamic electrical characteristics - LIN physical layer interface - LIN (continued) Ratings Symbol Min. Typ. Max. Unit Bus Wake-up Deglitcher (Sleep and Stop Mode) tPROPWL 60 80 100 s Fast Bit Rate (Programming Mode) BRFAST -- -- 100 kBit/s Propagation delay of receiver tRX_PD -- -- 6.0 s tRX_SYM -2.0 -- 2.0 s 0.396 -- -- -- -- 0.581 0.417 -- -- -- -- 0.590 Symmetry of receiver propagation delay rising edge w.r.t. falling edge LIN driver - 20.0 kBit/s; bus load conditions (CBUS; RBUS): 1.0 nF; 1.0 k / 6,8 nF;660 / 10 nF;500 Duty Cycle 1: THREC(MAX) = 0.744 x VSUP THDOM(MAX) = 0.581 x VSUP 7.0 V VSUP 18 V; tBIT = 50 s; D1 = tBUS_REC(MIN)/(2 x tBIT) D1 Duty Cycle 2: THREC(MIN) = 0.422 x VSUP THDOM(MIN) = 0.284 x VSUP 7.6 V VSUP 18 V; tBit = 50 s D2 = tBUS_REC(MAX)/(2 x tBIT) D2 LIN driver - 10.0 kBit/s; bus load conditions (CBUS; RBUS): 1.0 nF; 1.0 k / 6,8 nF;660 / 10 nF;500 Duty Cycle 3: THREC(MAX) = 0.778 x VSUP THDOM(MAX) = 0.616 x VSUP 7.0 V VSUP 18 V; tBit = 96 s D3 = tBUS_REC(MIN)/(2 x tBIT) D3 Duty Cycle 4: THREC(MIN) = 0.389 x VSUP THDOM(MIN) = 0.251 x VSUP 7.6 V VSUP 18 V; tBIT = 96 s D4 = tBUS_REC(MAX)/(2 x tBIT) D4 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 32. Dynamic electrical characteristics - LIN physical layer interface - LIN (continued) Ratings Symbol Min. Typ. Max. Unit -7.25 0 7.25 s Typ. Max. Unit LIN Transmitter Timing, (VSUP from 7.0 to 18 V) - See Figure 5 tTRAN_SYM Transmitter Symmetry tTRAN_SYM < MAX(ttran_sym60%, tTRAN_SYM40%) tTRAN_SYM60% = tTRAN_PDF60% - tTRAN_PDR60% tTRAN_SYM40% = tTRAN_PDF40% - tTRAN_PDR40% TX BUS 60% 40% ttran_pdf60% ttran_pdr40% ttran_pdf40% ttran_pdr60% Figure 5. LIN transmitter timing Table 33. Dynamic electrical characteristics - general purpose I/O - PTB3 / L0] Ratings Symbol Min. tWUPF Wake-up Glitch Filter Time 20 s Table 34. Dynamic electrical characteristics - general purpose I/O - PTB[0...2] Ratings Max. Unit fPTB 10 MHz tPDr 20 ns tRISE 17.5 ns Propagation Delay - Falling Edge(40) tPDf 20 ns Rise Time - Falling Edge(40) tFALL 17.5 ns GPIO Digital Frequency (40) Propagation Delay - Rising Edge Rise Time - Rising Edge(40) Symbol Min. Typ. Notes 40. Load PTBx = 100 pF MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 35. Dynamic Electrical Characteristics - Current Sense Module Ratings Symbol Frequency Attenuation(41),(42) <100 Hz (fPASS) >500 Hz (fSTOP) Min Typ 3.0 40 Signal Update Rate(43) fIUPDATE Signal Path Match with Voltage Channel fIVMATCH Gain Change Duration (Automatic GCB active)(44) Max 0.5 8.0 2.0 tGC Unit dB kHz s 14 s Max. Unit Notes 41. Characteristics identical to Voltage Sense Module 42. With default LPF coefficients 43. After passing decimation filter 44. Parameter not tested. Guaranteed by design and characterization. Table 36. Dynamic electrical characteristics - voltage sense module Ratings Symbol Min. Typ. attenuation(45),(46) Frequency 95...105 Hz (fPASS) >500 Hz (fSTOP) 3.0 40 Signal update rate(47) fVUPDATE Signal path match with Current Channel(48) fIVMATCH 0.5 8.0 2.0 dB kHz s Notes 45. Characteristics identical to Voltage Sense Module 46. With default LPF coefficients 47. After passing decimation filter 48. Parameter not tested. Guaranteed by design and characterization. Table 37. Dynamic electrical characteristics - temperature sense module Ratings Signal Update Rate(49) Symbol Min. fTUPDATE 1.0 Typ. Max. Unit 4.0 kHz Notes 49. 1.0 kHz with Chopper Enabled, 4.0 kHz with Chopper Disabled (fixed decimeter = 128) 3.6.2 3.6.2.1 3.6.2.1.1 Dynamic electrical characteristics MCU die NVM Timing parameters The time base for all NVM program or erase operations is derived from the bus clock using the FCLKDIV register. The frequency of this derived clock must be set within the limits specified as fNVMOP. The NVM module does not have any means to monitor the frequency, and will not prevent program or erase operations at frequencies above or below the specified minimum. When attempting to program or erase the NVM module at a lower frequency, a full program or erase transition is not assured. The following sections provide equations which can be used to determine the time required to execute specific flash commands. All timing parameters are a function of the bus clock frequency, fNVMBUS. All program and erase times are also a function of the NVM operating frequency, fNVMOP. A summary of key timing parameters can be found in Table 38. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 3.6.2.1.1.1 Erase verify all blocks (blank check) (FCMD=0x01) The time required to perform a blank check on all blocks is dependent on the location of the first non-blank word starting at relative address zero. It takes one bus cycle per phrase to verify, plus a setup of the command. Assuming that no non-blank location is found, then the time to erase verify all blocks is given by: 1 t check = 35500 -------------------f NVMBUS 3.6.2.1.1.2 Erase verify block (blank check) (FCMD=0x02) The time required to perform a blank check is dependent on the location of the first non-blank word starting at relative address zero. It takes one bus cycle per phrase to verify, plus a setup of the command. Assuming that no non-blank location is found, then the time to erase verify a P-Flash block is given by: 1 t pcheck = 33500 -------------------f NVMBUS Assuming that no non-blank location is found, then the time to erase verify a D-Flash block is given by: 1 t dcheck = 2800 ------------------f NVMBUS 3.6.2.1.1.3 Erase verify p-flash section (FCMD=0x03) The maximum time to erase verify a section of P-Flash depends on the number of phrases being verified (NVP) and is given by: 1 t ( 450 + N VP ) ------------------f NVMBUS 3.6.2.1.1.4 Read once (FCMD=0x04) The maximum read once time is given by: 1 t = 400 -------------------f NVMBUS 3.6.2.1.1.5 Program p-flash (FCMD=0x06) The programming time for a single phrase of four P-Flash words and the two seven-bit ECC fields is dependent on the bus frequency, fNVMBUS, as well as on the NVM operating frequency, fNVMOP. The typical phrase programming time is given by: 1 1 t ppgm 164 ----------------- + 2000 ------------------f NVMOP f NVMBUS The maximum phrase programming time is given by: 1 1 t ppgm 164 ----------------- + 2500 -------------------f NVMOP f NVMBUS 3.6.2.1.1.6 Program once (FCMD=0x07) The maximum time required to program a P-Flash Program Once field is given by: 1 1 t 164 ----------------- + 2150 -------------------f NVMOP f NVMBUS 3.6.2.1.1.7 Erase all blocks (FCMD=0x08) The time required to erase all blocks is given by: MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 1 1 t mass 100100 ----------------- + 70000 ------------------f NVMOP f NVMBUS 3.6.2.1.1.8 Erase p-flash block (FCMD=0x09) The time required to erase the P-Flash block is given by: 1 1 t pmass 100100 ----------------- + 67000 ------------------f NVMOP f NVMBUS 3.6.2.1.1.9 Erase p-flash sector (FCMD=0x0A) The typical time to erase a 512-byte P-Flash sector is given by: 1 1 t pera 20020 ----------------- + 700 -------------------f NVMOP f NVMBUS The maximum time to erase a 512-byte P-Flash sector is given by: 1 1 t pera 20020 ----------------- + 1400 -------------------f NVMOP f NVMBUS 3.6.2.1.1.10 Unsecure flash (FCMD=0x0B) The maximum time required to erase and unsecure the Flash is given by: (for 128 kByte P-Flash and 4.0 kByte D-Flash) 1 1 t uns 100100 ----------------- + 70000 ------------------f NVMOP f NVMBUS 3.6.2.1.1.11 Verify backdoor access key (FCMD=0x0C) The maximum verify back door access key time is given by: 1 t = 400 ------------------f NVMBUS 3.6.2.1.1.12 Set user margin level (FCMD=0x0D) The maximum set user margin level time is given by: 1 t = 350 ------------------f NVMBUS 3.6.2.1.1.13 Set field margin level (FCMD=0x0E) The maximum set field margin level time is given by: 1 t = 350 -------------------f NVMBUS 3.6.2.1.1.14 Erase verify d-flash section (FCMD=0x10) The time required to Erase Verify D-Flash for a given number of words NW is given by: 1 t dcheck ( 450 + N W ) -------------------f NVMBUS MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 3.6.2.1.1.15 Program d-flash (FCMD=0x11) D-Flash programming time is dependent on the number of words being programmed and their location with respect to a row boundary, since programming across a row boundary requires extra steps. The D-Flash programming time is specified for different cases: 1,2,3,4 words and 4 words across a row boundary. The typical D-Flash programming time is given by the following equation, where NW denotes the number of words; BC=0 if no row boundary is crossed and BC=1, if a row boundary is crossed: 1 1 t dpgm ( 14 + ( 54 N W ) + ( 14 BC ) ) ----------------- + ( 500 + ( 525 N W ) + ( 100 BC ) ) -------------------- f NVMOP f NVMBUS The maximum D-Flash programming time is given by: 1 1 t dpgm ( 14 + ( 54 N W ) + ( 14 BC ) ) ----------------- + ( 500 + ( 750 N W ) + ( 100 BC ) ) -------------------- f NVMOP f NVMBUS 3.6.2.1.1.16 Erase d-flash sector (FCMD=0x12) Typical D-Flash sector erase times, expected on a new device where no margin verify fails occur, is given by: 1 1 t dera 5025 ----------------- + 700 -------------------f NVMOP f NVMBUS Maximum D-Flash sector erase times is given by: 1 1 t dera 20100 ----------------- + 3400 -------------------f NVMOP f NVMBUS The D-Flash sector erase time is ~5.0 ms on a new device and can extend to ~20 ms as the flash is cycled. Table 38. NVM timing characteristics (FTMRC) Symbol Min. Typ.(50) Max.(51) Unit(52) Bus Frequency fNVMBUS 1.0 -- 32.768 MHz Operating Frequency fNVMOP 0.8 1.0 1.05 MHz Erase All Blocks (mass erase) Time tMASS -- 100 130 ms Erase Verify All Blocks (blank check) Time tCHECK -- -- 35500 tCYC tUNS -- 100 130 ms P-flash Block Erase Time tPMASS -- 100 130 ms P-flash Erase Verify (blank check) Time tPCHECK -- -- 33500 tCYC P-flash Sector Erase Time tPERA -- 20 26 ms P-flash Phrase Programming Time tPPGM -- 226 285 s tDERA -- (53) 26 ms D-flash Erase Verify (blank check) Time tDCHECK -- -- 2800 tCYC D-flash One Word Programming Time tDPGM1 -- 100 107 s D-flash Two Word Programming Time tDPGM2 -- 170 185 s D-flash Three Word Programming Time tDPGM3 -- 241 262 s D-flash Four Word Programming Time tDPGM4 -- 311 339 s D-flash Four Word Programming Time Crossing Row Boundary tDPGM4C -- 328 357 s Rating Unsecure Flash Time D-flash Sector Erase Time 5 Notes 50. Typical program and erase times are based on typical fNVMOP and maximum fNVMBUS 51. Maximum program and erase times are based on minimum fNVMOP and maximum fNVMBUS 52. tCYC = 1 / fNVMBUS 53. Typical value for a new device MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 3.6.2.1.2 NVM reliability parameters The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process monitors, and burn-in to screen early life failures. The data retention and program/erase cycling failure rates are specified at the operating conditions noted. The program/erase cycle count on the sector is incremented every time a sector or mass erase event is executed. Table 39. NVM reliability characteristics(54) Rating Symbol Min. Typ. Max. Unit tNVMRET 20 100(56) -- Years nFLPE 10 K 100 K(57) -- Cycles tNVMRET 5.0 100(56) -- Years Data retention at an average junction temperature of TJAVG = 85 C(54) after up to 10,000 program/erase cycles tNVMRET 10 100(56) -- Years Data retention at an average junction temperature of TJAVG = 85 C(54) after less than 100 program/erase cycles tNVMRET 20 100(56) -- Years nFLPE 50 K 500 K(57) -- Cycles Data retention at an average junction temperature of TJAVG = 85 C(54) after up to 10,000 program/erase cycles Program Flash number of program/erase cycles (-40 C TJ 150 C) (54) Data retention at an average junction temperature of TJAVG = 85 C 50,000 program/erase cycles after up to Data Flash number of program/erase cycles (-40 C TJ 150C) Notes 54. Conditions are shown in Table 9, unless otherwise noted 55. TJAVG does not exceed 85 C in a typical temperature profile over the lifetime of a consumer, industrial, or automotive application. 56. Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to 25C using the Arrhenius equation. For additional information on how NXP defines Typical Data Retention, refer to Engineering Bulletin EB618 57. Spec table quotes typical endurance evaluated at 25C for this product family. For additional information on how NXP defines Typical Endurance, refer to Engineering Bulletin EB619. 3.6.2.2 Phase locked loop 3.6.2.2.1 Jitter definitions With each transition of the feedback clock, the deviation from the reference clock is measured and input voltage to the VCO is adjusted accordingly.The adjustment is done continuously with no abrupt changes in the VCOCLK frequency. Noise, voltage, temperature, and other factors, cause slight variations in the control loop resulting in a clock jitter. This jitter affects the real minimum and maximum clock periods as illustrated in Figure 6. 1 0 2 3 N-1 N tmin1 tnom tmax1 tminN tmaxN Figure 6. Jitter definitions The relative deviation of tNOM is at its maximum for one clock period, and decreases towards zero for larger number of clock periods (N). MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Defining the jitter as: t (N) t (N) max min J ( N ) = max 1 - ----------------------- , 1 - ----------------------- Nt Nt nom nom For N < 100, the following equation is a good fit for the maximum jitter: j 1 J ( N ) = -------N J(N) 1 5 10 20 Figure 7. Maximum bus clock jitter approximation N NOTE On timers and serial modules a prescaler will eliminate the effect of the jitter to a large extent. 3.6.2.2.2 Electrical characteristics for the PLL Table 40. PLL characteristics Rating Max Unit 8 32 MHz fVCO 32.768 65.536 MHz Lock Detection |LOCK| 0 1.5 %(58) Un-lock Detection |UNL| 0.5 2.5 %(58) tLOCK 150 + 256/fREF s j1 1.2 % VCO Frequency During System Reset VCO Locking Range Time to Lock (59) Jitter Fit Parameter 1 Symbol Min fVCORST Typ Notes 58. % deviation from target frequency 59. fREF = 1.024 MHz, fBUS = 32.768 MHz equivalent fPLL = 65.536 MHz, REFRQ=00, SYNDIV=$1F, VCOFRQ=01, POSTDIV=$00 MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 3.6.2.3 Reset, oscillator and internal clock generation Table 41. Dynamic electrical characteristics - MCU clock generator Ratings Symbol Min. Typ. Max. Unit fBUS -- -- 32.768 MHz fIRC1M_TRIM -- 1.024 -- MHz fTOL -1.0 -1.2 -- -- 1.0 1.2 % tTOLEXT -0.5 0.5 % fOSC 4.0 16 MHz Oscillator Start-up Time (LCP, 4.0 MHz)(63) tUPOSC -- 2.0 10 ms Oscillator Start-up Time (LCP, 8.0 MHz)(63) tUPOSC -- 1.6 8.0 ms Oscillator Start-up Time (LCP, 16 MHz) tUPOSC -- 1.0 5.0 ms Clock Monitor Failure Assert Frequency fCMFA 200 400 1000 kHz Bus Frequency Internal Reference Frequency Internal Clock Frequency Tolerance(60),(61) Analog Option 2 Analog Option 1 Clock Frequency Tolerance with External Oscillator(62) Crystal Oscillator Range (63) Notes 60. -40 C TA 125 C 61. 1.3%, including lifetime drift 62. Dependent on the external OSC 63. These values apply for carefully designed PCB layouts with capacitors that match the crystal/resonator requirements 3.6.2.4 Reset characteristics Table 42. Reset and stop characteristics(64) Rating Reset Input Pulse Width, minimum input time Startup from Reset STOP Recovery Time Symbol Min. PWRSTL 2.0 Typ. Max. Unit tVCORST nRST 768 tVCORST tSTP_REC 50 s Notes 64. Conditions are shown in Table 9 unless otherwise noted 3.6.2.5 SPI timing This section provides electrical parameters and ratings for the SPI. The measurement conditions are listed in Table 43. Table 43. Measurement conditions Description Drive mode Load capacitance CLOAD(65), on all outputs Value Unit Full drive mode -- 50 pF Notes 65. Conditions are shown in Table 9 unless otherwise noted MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 3.6.2.5.1 Master mode The timing diagram for master mode with transmission format CPHA = 0 is depicted in Figure 8. SS (Output) 2 1 SCK (CPOL = 0) (Output) 12 13 12 13 3 4 4 SCK (CPOL = 1) (Output) 5 MISO (Input) 6 Bit MSB-1... 1 MSB IN2 10 MOSI (Output) LSB IN 9 11 Bit MSB-1... 1 MSB OUT2 LSB OUT 1. If configured as an output. 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, bit 2... MSB. Figure 8. SPI master timing (CPHA = 0) The timing diagram for master mode with transmission format CPHA=1 is depicted in Figure 9. SS (Output) 1 2 SCK (CPOL = 0) (Output) 4 SCK (CPOL = 1) (Output) 4 5 MISO (Input) MSB IN2 Port Data 13 12 13 3 6 Bit MSB-1... 1 LSB IN 11 9 MOSI (Output) 12 Master MSB OUT2 Bit MSB-1... 1 Master LSB OUT Port Data 1.If configured as output 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1,bit 2... MSB. Figure 9. SPI master timing (CPHA = 1) The timing characteristics for master mode are listed in Table 44. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 44. SPI master mode timing characteristics Num C 1 D 1 Symbol Min. Typ. Max. Unit SCK Frequency fSCK 1/2048 -- 1/2 fBUS D SCK Period tSCK 2.0 -- 2048 tBUS 2 D Enable Lead Time tLEAD -- 1/2 -- tSCK 3 D Enable Lag Time tLAG -- 1/2 -- tSCK 4 D Clock (SCK) High or Low Time tWSCK -- 1/2 -- tSCK 5 D Data Setup Time (inputs) tSU 8.0 -- -- ns 6 D Data Hold Time (inputs) tHI 8.0 -- -- ns 9 D Data Valid After SCK Edge tVSCK -- -- 29 ns 10 D Data Valid After SS Fall (CPHA = 0) tVSS -- -- 15 ns 11 D Data Hold Time (outputs) tHO 20 -- -- ns 12 D Rise and Fall Time Inputs tRFI -- -- 8.0 ns 13 D Rise and Fall Time Outputs tRFO -- -- 8.0 ns 3.6.2.5.2 Characteristic Slave mode The timing diagram for slave mode with transmission format CPHA = 0 is depicted in Figure 10. SS (Input) 1 12 13 3 12 13 SCK (CPOL = 0) (Input) 4 2 SCK (CPOL = 1) (Input) 10 4 8 7 MISO (Output) 9 See Note Slave MSB 5 MOSI (Input) Bit MSB-1... 1 11 11 Slave LSB OUT See Note 6 MSB IN Bit MSB-1... 1 LSB IN NOTE: Not defined Figure 10. SPI slave timing (CPHA = 0) The timing diagram for slave mode with transmission format CPHA = 1 is depicted in Figure 11. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS SS (Input) 3 1 2 SCK (CPOL = 0) (Input) 4 SCK (CPOL = 1) (Input) 4 See Note Slave 7 MSB OUT 5 MOSI (Input) 13 12 13 11 9 MISO (Output) 12 8 Bit MSB-1... 1 Slave LSB OUT 6 MSB IN Bit MSB-1... 1 LSB IN NOTE: Not defined Figure 11. SPI slave timing (CPHA = 1) The timing characteristics for slave mode are listed in Table 45. Table 45. SPI slave mode timing characteristics Num C 1 D 1 Characteristic Symbol Min. Typ. Max. Unit SCK Frequency fSCK DC -- 1/4 fBUS D SCK Period tSCK 4.0 -- fBUS 2 D Enable Lead Time tLEAD 4.0 -- -- fBUS 3 D Enable Lag Time tLAG 4.0 -- -- fBUS 4 D Clock (SCK) High or Low Time tWSCK 4.0 -- -- fBUS 5 D Data Setup Time (inputs) tSU 8.0 -- -- ns 6 D Data Hold Time (inputs) tHI 8.0 -- -- ns 7 D Slave Access Time (time to data active) tA -- -- 20 ns 8 D Slave MISO Disable Time tDIS -- -- 22 ns (66) ns 9 D Data Valid After SCK Edge tVSCK -- -- 29 + 0.5 tBUS 10 D Data Valid After SS Fall tVSS -- -- 29 + 0.5 tBUS(66) ns 11 D Data Hold Time (outputs) tHO 20 -- -- ns 12 D Rise and Fall Time Inputs tRFI -- -- 8.0 ns 13 D Rise and Fall Time Outputs tRFO -- -- 8.0 ns Notes 66. 0.5 tBUS added due to internal synchronization delay MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 3.7 Thermal protection characteristics Characteristics noted under conditions 3.5 V VSUP 28 V, -40 C TA 125 C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted. Table 46. Thermal characteristics Ratings Symbol Min Typ Max Unit VDDH/VDDA/VDDX High Temperature Warning (HTI) Threshold Hysteresis THTI THTI_H 110 125 10 140 C VDDH/VDDA/VDDX Overtemperature Shutdown Threshold Hysteresis TSD TSD_H 155 165 10 180 C LIN Overtemperature Shutdown TLINSD 150 165 180 C TLINSD_HYS LIN Overtemperature Shutdown Hysteresis 3.8 20 C Electromagnetic compatibility (EMC) All ESD testing is in conformity with the CDF-AEC-Q100 stress test qualification for automotive grade integrated circuits. During the device qualification, ESD stresses are performed for the Human Body Model (HBM), Machine Model (MM), Charge Device Model (CDM), as well as LIN transceiver specific specifications. A device will be defined as a failure, if after exposure to ESD pulses, the device no longer meets the device specification. Complete DC parametric and functional testing is performed per the applicable device specification at room temperature, followed by hot temperature, unless specified otherwise in the device specification. The immunity against transients for the LIN, PTB3/L0, VSENSE, ISENSEH, ISENSEL, and VSUP, is specified according to the LIN Conformance Test Specification - Section LIN EMC Test Specification (ISO7637-2), refer to the LIN Conformance Test Certification Report - available as separate document. Table 47. Electromagnetic compatibility Ratings Symbol Value/limit Unit ESD - Human Body Model (HBM) following AEC-Q100 / JESD22-A114 (CZAP = 100 pF, RZAP = 1500 ) - LIN (all GNDs shorted) - All other Pins VHBM ESD - Charged Device Model (CDM) following AEC-Q100 Corner Pins All other Pins VCDM 750 500 V ESD - Machine Model (MM) following AEC-Q100 (CZAP = 200 pF, RZAP = 0 ), All Pins VMM 200 V Latch-up current at TA = 125 C(67) ILAT 100 mA ESD GUN - LIN Conformance Test Specification , unpowered, contact discharge. (CZAP= 150 pF, RZAP = 330 ); LIN (no bus filter CBUS); VSENSE with serial RVSENSE; VSUP with CVSUP; PTB3 with serial RPTB3 6000 V ESD GUN - IEC 61000-4-2 Test Specification(69), unpowered, contact discharge. (CZAP= 150 pF, RZAP = 330 ); LIN (no bus filter CBUS); VSENSE with serial RVSENSE; VSUP with CVSUP; PTB3 with serial RPTB3 6000 V ESD GUN - ISO10605(69), unpowered, contact discharge, CZAP= 150 pF, RZAP = 2.0 k; LIN (no bus filter CBUS); VSENSE with serial RVSENSE; VSUP with CVSUP; PTB3 with serial RPTB3 8000 V ESD GUN - ISO10605(69), powered, contact discharge, CZAP= 330 pF, RZAP = 2.0 k; LIN (no bus filter CBUS); VSENSE with serial RVSENSE; VSUP with CVSUP; PTB3 with serial RPTB3 8000 V 8.0 2.0 kV (68) Notes 67. Input Voltage Limit = -2.5 to 7.5 V 68. Certification available on request 69. Tested internally only, following the reference document test procedure. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4 Functional description and application information This chapter describes the MM912_637 dual die device functions on a block by block base. The following symbols are shown on all module cover pages to distinguish between the module location being the MCU die or the analog die: The documented module is physically located on the Analog die. This applies to Section 4.2, "MM912_637 - analog die overview" through Section 4.15, "Die to die interface - target". MCU ANALOG The documented module is physically located on the Microcontroller die. This applies to Section 4.2, "MM912_637 - analog die overview" through Section 4.26, "MCU - die-to-die initiator (9S12I128PIMV1)". Sections concerning both die or the complete device will not have a specific indication (e.g. Section 5, "MM912_637 - trimming"). 4.1 Introduction Many types of electronic control units (ECUs) are connected to and supplied from the main car battery in modern cars. Depending on the cars mode of operation (drive, start, stop, standby), the battery must deliver different currents to the different ECUs. The vehicle power management has several sub-functions, like control of the set-point value of the power generator, dynamic load management during drive, start, stop, and standby mode. The Application Specific Integrated Circuit (ASIC) allows for two application circuits, depending on whether the bias current of the MM912_637 itself shall be included into the current measurement. Battery Plus Pole CBAT RSENSE RSHUNT ISENSEH VSUP LIN LIN GND ISENSEL VSENSE Battery Minus Pole CLIN Chassis Ground Figure 12. Typical IBS application (device GND = chassis GND) Battery Plus Pole CBAT RSENSE ISENSEH VSUP LIN LIN GND ISENSEL RSHUNT VSENSE Battery Minus Pole CLIN Chassis Ground Figure 13. Typical IBS application (device GND = battery minus) MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS The vehicle power system needs actual measurement data from the battery, mainly voltage, current, and temperature. Out of these measurement data, it needs calculated characteristics, such as dynamic internal battery resistance. Therefore, an intelligent battery sensor (IBS) module is required. To efficiently measure the battery voltage, current, and temperature, the IBS module is directly connected to and supplied from the battery. It is located directly on the negative pole of the battery; the supply of the IBS module comes from 'KL30'. The battery current is measured via a low-ohmic shunt resistor, connected between the negative pole of the battery and the chassis ground of the car. The battery voltage is measured at 'KL30'. The data communication between the IBS module and the higher level ECU is done via a LIN interface. The MM912_637 is able to measure its junction temperature. That temperature is the basis for a model in software that calculates the battery temperature out of the junction temperature. An optional external temperature sense input is provided as well. 4.1.1 Device register map Table 48 shows the device register memory map overview. Table 48. Device register memory map overview Address Module Size (Bytes) 0x0000-0x0003 PIM (port integration module) 4 0x0004-0x0009 Reserved 6 0x000A-0x000B MMC (memory map control) 2 0x000C-0x000D PIM (port integration module) 2 0x000E-0x000F Reserved 2 0x0010-0x0015 MMC (memory map control) 8 0x0016-0x0019 Reserved 2 0x001A-0x001B Device ID register 2 0x001C-0x001E Reserved 4 0x001F INT (interrupt module) 1 0x0020-0x002F DBG (debug module) 16 0x0030-0x0033 Reserved 4 0x0034-0x003F CPMU (clock and power management) 12 0x0040-0x00D7 Reserved 152 0x00D8-0x00DF D2DI (die 2 die initiator) 8 0x00E0-0x00E7 Reserved 32 0x00E8-0x00EF SPI (serial peripheral interface) 8 0x00F0-0x00FF Reserved 32 0x0100-0x0113 FTMRC control registers 20 0x0114-0x011F Reserved 12 0x0120-0x017F PIM (port integration module) 96 0x0180-0x01EF Reserved 112 0x01F0-0x01FC CPMU (clock and power management) 13 0x01FD-0x01FF Reserved 3 0x0200-0x02FF D2DI (die 2 die initiator, blocking access window) 256 0x0300-0x03FF D2DI (die 2 die initiator, non-blocking write window) 256 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS NOTE The reserved register space shown in Table 48 is not allocated to any module. This register space is reserved for future use. Writing to these locations has no effect. Read access to these locations returns a zero. 4.1.2 Detailed module register map Table 49 to Table 62 show the detailed module maps of the MM912_637. Table 49. 0x0000-0x0009 port integration module (PIM) 1 of 3 Address Name 0x0000 PTA 0x0001 PTE 0x0002 DDRA 0x0003 DDRE 0x0004-0x 0009 Reserved R W R Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 0 0 0 0 0 0 PE1 PE0 DDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0 0 0 0 0 0 0 DDRE1 DDRE0 0 0 0 0 0 0 0 0 W R W R W R W Table 50. 0x000A-0x000B memory map control (MMC) 1 of 2 Address Name 0x000A Reserved 0x000B MODE R Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 RDRD RDRC 0 0 W R W MODC Table 51. 0x000C-0x000F port integration module (PIM) map 2 of 3 Address Name 0x000C PUCR 0x000D RDRIV 0x000E-0x 000F Reserved Bit 7 R 0 W R Bit 6 BKPUE 0 0 0 0 0 0 0 0 W R PDPEE 0 0 0 0 0 W MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 52. 0x0010-0x0019 memory map control (MMC) 2 of 2 Address Name 0x0010 Reserved 0x0011 DIRECT 0x0012-0x 0014 Reserved 0x0015 PPAGE 0x0016-0x 0019 Reserved R Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 DP15 DP14 DP13 DP12 DP11 DP10 DP9 DP8 0 0 0 0 0 0 0 0 0 0 0 0 PIX3 PIX2 PIX1 PIX0 0 0 0 0 0 0 0 0 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 Bit 2 Bit 1 Bit 0 W R W R W R W R W Table 53. 0x001A-0x001E miscellaneous peripheral Address Name 0x001A PARTIDH 0x001B PARTIDL 0x001C-0x 001E Reserved Bit 7 Bit 6 R PARTIDH W R PARTIDL W R 0 0 0 0 0 W Table 54. 0x001F interrupt module (S12SINT) 0x001F IVBR R IVB_ADDR[7:0] W Table 55. 0x0020-0x002F debug module (S12XDBG) Address Name 0x0020 DBGC1 0x0021 DBGSR 0x0022 DBGTCR 0x0023 DBGC2 0x0024 DBGTBH 0x0025 DBGTBL Bit 7 R W R ARM TBF(70) Bit 6 Bit 5 Bit 4 Bit 3 0 0 BDM DBGBRK 0 0 0 0 0 TRIG 0 0 SSF2 COMRV SSF1 SSF0 W R 0 W R TSOURCE 0 TRCMOD 0 0 0 0 0 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ABCM W R TALIGN W R W MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 55. 0x0020-0x002F debug module (S12XDBG) (continued) Address Name 0x0026 DBGCNT 0x0027 DBGSCRX 0x0027 DBGMFR 0x0028(71) DBGACTL 0x0028(72) DBGBCTL 0x0028(73) DBGCCTL 0x0029 DBGXAH 0x002A DBGXAM 0x002B DBGXAL 0x002C DBGADH 0x002D DBGADL 0x002E DBGADHM 0x002F DBGADLM Bit 7 R (70) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 SC3 SC2 SC1 SC0 TBF 0 CNT 0 0 0 0 0 0 0 0 0 MC2 MC1 MC0 SZE SZ TAG BRK RW RWE NDB COMPE SZE SZ TAG BRK RW RWE 0 0 TAG BRK RW RWE 0 0 0 0 0 0 Bit 15 14 13 12 11 Bit 7 6 5 4 Bit 15 14 13 Bit 7 6 Bit 15 Bit 7 W R W R W R W R W R W R W R W R W R W R W R W 0 COMPE COMPE Bit 17 Bit 16 10 9 Bit 8 3 2 1 Bit 0 12 11 10 9 Bit 8 5 4 3 2 1 Bit 0 14 13 12 11 10 9 Bit 8 6 5 4 3 2 1 Bit 0 Bit 3 Bit 2 Bit 1 Bit 0 W R 0 Notes 70. This bit is visible at DBGCNT[7] and DBGSR[7] 71. This represents the contents if the Comparator A control register is blended into this address. 72. This represents the contents if the Comparator B control register is blended into this address. 73. This represents the contents if the Comparator C control register is blended into this address. Table 56. 0x0034-0x003F Clock and Power Management (CPMU) 1 of 2 Address Name Bit 7 0x0034 CPMU SYNR R 0x0035 CPMU REFDIV R W W Bit 6 Bit 5 Bit 4 VCOFRQ[1:0] REFFRQ[1:0] SYNDIV[5:0] 0 0 REFDIV[3:0] MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 56. 0x0034-0x003F Clock and Power Management (CPMU) 1 of 2 (continued) Address Name 0x0036 CPMU POSTDIV 0x0037 CPMUFLG 0x0038 CPMUINT 0x0039 CPMUCLKS 0x003A CPMUPLL 0x003B CPMURTI 0x003C CPMUCOP 0x003D Reserved 0x003E Reserved 0x003F CPMU ARMCOP R Bit 7 Bit 6 Bit 5 0 0 0 RTIF PORF LVRF 0 0 Bit 4 Bit 3 W R W R RTIE 0 PRE PCE RTI OSCSEL COP OSCSEL 0 0 0 0 RTR2 RTR1 RTR0 CR2 CR1 CR0 OSCIE 0 RTR3 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 WCOP RSBCK 0 0 0 R W R 0 LOCKIE RTR4 RTR6 W UPOSC RTR5 RTDEC W R OSCIF FM0 0 W ILAF FM1 0 R LOCK LOCKIF 0 PSTP R Bit 0 0 PLLSEL W Bit 1 POSTDIV[4:0] W R Bit 2 WRTMASK W R W Table 57. 0x00D8-0x00DF Die 2 Die Initiator (D2DI) 1 of 3 Address Name 0x00D8 D2DCTL0 0x00D9 D2DCTL1 0x00DA D2DSTAT0 0x00DB D2DSTAT1 0x00DC D2DADRHI 0x000D D2DADRLO 0x00DE D2DDATAHI R W R W R W R Bit 7 Bit 6 Bit 5 D2DEN D2DCW D2DSWAI 0 0 0 ACKERF CNCLF TIMEF TERRF PARF PAR1 PAR0 D2DIF D2DBSY 0 0 0 0 0 0 RWB SZ8 0 NBLK 0 0 0 0 D2DIE ERRIF D2DCLKDIV[1:0] TIMOUT[3:0] W R W R ADR[7:0] W R DATA[15:8] W MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 57. 0x00D8-0x00DF Die 2 Die Initiator (D2DI) 1 of 3 (continued) 0x00DF D2DDATALO R DATA[7:0] W Table 58. 0x00E8-0x00EF serial peripheral interface (SPI) Address Name 0x00E8 SPICR1 0x00E9 SPICR2 0x00EA SPIBR 0x00EB SPISR 0x00EC SPIDRH 0x00ED SPIDRL 0x00EE Reserved 0x00EF Reserved R W R Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE MODFEN BIDIROE SPISWAI SPC0 SPR2 SPR1 SPR0 0 W R 0 XFRW 0 0 0 SPPR2 SPPR1 SPPR0 SPIF 0 SPTEF MODF 0 0 0 0 R R15 R14 R13 R12 R11 R10 R9 R8 W T15 T14 T13 T12 T11 T10 T9 T8 R R7 R6 R5 R4 R3 R2 R1 R0 W T7 T6 T5 T4 T3 T2 T1 T0 R 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W W R W Table 59. 0x0100-0x0113 flash control & status register FTMRC Address Name 0x0100 FCLKDIV 0x0101 FSEC 0x0102 FCCOBIX 0x0103 Reserved 0x0104 FCNFG 0x0105 FERCNFG 0x0106 FSTAT Bit 7 R Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0 KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0 0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0 0 0 0 0 0 0 0 0 0 0 0 0 FDFD FSFD 0 0 0 0 0 DFDIE SFDIE ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0 FDIVLD W R W R W R W R W R CCIE 0 IGNSF W R W CCIF 0 MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 59. 0x0100-0x0113 flash control & status register FTMRC (continued) 0x0107 FERSTAT 0x0108 FPROT 0x0109 DFPROT 0x010A FCCOBHI 0x010B FCCOBLO 0x010C-0x 010F Reserved 0x0110 FOPT 0x01110x0113 Reserved R 0 0 0 0 0 0 FPHDIS FPHS1 FPHS0 0 0 0 CCOB15 CCOB14 CCOB13 CCOB7 CCOB6 0 DFDIF SFDIF FPLDIS FPLS1 FPLS0 DPS3 DPS2 DPS1 DPS0 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 0 0 0 0 0 0 0 NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0 0 0 0 0 0 0 0 0 W R W R W R W R W R FPOPEN DPOPEN RNV6 W R W R W Table 60. 0x0120 port integration module (PIM) 2 of 2 Address Name 0x0120 PTIA 0x0121 PTIE 0x01220x017F Reserved R W R Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 PTIA7 PTIA6 PTIA5 PTIA4 PTIA3 PTIA2 PTIA1 PTIA0 0 0 0 0 0 0 PTIE1 PTIE0 0 0 0 0 0 0 0 0 W R W Table 61. 0x01F0-0x01FF clock and power management (CPMU) 2of 2 Address Name 0x01F0 Reserved 0x01F1 CPMU LVCTL 0x01F20x01F7 Reserved 0x01F8 CPMU IRCTRIMH R 0x01F9 CPMU IRCTRIML R R Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 0 0 0 0 0 LVDS LVIE LVIF 0 0 0 0 0 0 0 0 0 0 W R W R W W W TCTRIM[3:0] IRCTRIM[9:8] IRCTRIM[7:0] MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 61. 0x01F0-0x01FF clock and power management (CPMU) 2of 2 (continued) 0x01FA CPMUOSC R OSCPINS_ EN OSCE OSCBW OSCFILT[4:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W 0x01FB CPMUPROT 0x01FC Reserved R PROT W R 0 W Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 Offset(74) 0x00 R 15 7 0 14 6 0 13 5 0 12 4 0 W HTIEM UVIEM HWRM 0 HTIE UVIE 0 0 HWR 0 HTF UVF HWRF WDRF Name PCR_CTL PCR Control Register R W 0x02 0x03 PCR_SR (hi) R PCR Status Register W PCR_SR (lo) R PCR Status Register W 11 3 0 10 2 0 9 1 0 8 0 0 PFM[1:0] OPMM[1:0] PF[1:0] OPM[1:0] HVRF LVRF WULTCF WLPMF WUPTB2 F WUPTB1 F WUPTB0 F Write 1 will clear the flags WUAHTH F WUCTHF WUCALF WULINF WUPTB3 F Write 1 will clear the flags R 0x04 PCR_PRESC PCR 1.0 ms prescaler W PRESC[15:0] R W 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C PCR_WUE (hi) R Wake-up Enable Register W PCR_WUE (lo) R Wake-up Enable Register W INT_SRC (hi) R Interrupt source register W INT_SRC (lo) R Interrupt source register W INT_VECT R Interrupt vector register W Reserved R WUAHTH WUCTH WUCAL WULIN WUPTB3 WUPTB2 WUPTB1 WUPTB0 0 0 0 0 0 0 0 TOV CH3 CH2 CH1 CH0 LTI HTI UVI 0 0 CAL LTC CVMI RX TX ERR 0 0 0 0 0 0 0 0 0 0 0 0 TOVM CH3M CH2M CH1M CH0M LTIM HTIM UVIM WULTC IRQ[3:0] W INT_MSK (hi) R Interrupt mask register W MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) 0x0D 0x0E 0x0F 0x10 Name INT_MSK (lo) R Interrupt mask register W TRIM_ALF (hi) R Trim for accurate 1.0 ms low freq clock W TRIM_ALF (lo) R Trim for accurate 1.0 ms low freq clock W WD_CTL Watchdog control register 0x14 R W R Watchdog rearm register W 0x16 Reserved 0x17 Reserved 0x19 0x1A 0x1B 0x1C 0x1D 12 4 11 3 10 2 9 1 8 0 CALM LTCM CVMM RXM TXM ERRM 0 0 0 APRESC[12:8] 0 0 0 0 0 WDTOM[2:0] 0 0 0 0 0 0 0 0 0 0 WDOFF WDWO 0 0 0 0 0 0 0 0 Reserved WDTO[2:0] W WD_RR Reserved 0x18 R 13 5 APRESC[7:0] Reserved Watchdog status register 0x15 0 W R Reserved PRDF 0 WD_SR 0x13 14 6 0 R W 0x12 15 7 0 R WDR[7:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 LBKDIE RXEDGIE SBR12 SBR11 SBR10 SBR9 SBR8 SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0 RSRC M ILT PE PT W R W R W SCIBD (hi) R SCI Baud Rate Register W SCIBD (lo) R SCI Baud Rate Register W SCIC1 R SCI Control Register 1 W SCIC2 R SCI Control Register 2 W SCIS1 R SCI Status Register 1 W SCIS2 R SCI Status Register 2 W LOOPS 0 0 0 TIE TCIE RIE ILIE TE RE RWU SBK TDRE TC RDRF IDLE OR NF FE PF LBKDIF RXEDGIF RXINV RWUID BRK13 LBKDE 0 RAF MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) 0x1E 0x1F 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2A 0x2B 0x2C 0x2D Name 15 7 R8 14 6 13 5 12 4 11 3 10 2 9 1 8 0 T8 TXDIR TXINV ORIE NEIE FEIE PEIE SCIC3 R SCI Control Register 3 W SCID R R7 R6 R5 R4 R3 R2 R1 R0 SCI Data Register W T7 T6 T5 T4 T3 T2 T1 T0 TIOS R 0 0 0 0 Timer Input Capture/Output Compare Select W IOS3 IOS2 IOS1 IOS0 CFORC R 0 0 0 0 Timer Compare Force Register W FOC3 FOC2 FOC1 FOC0 OC3M R OC3M3 OC3M2 OC3M1 OC3M0 OC3D3 OC3D2 OC3D1 OC3D0 0 0 0 0 TOV3 TOV2 TOV1 TOV0 0 0 0 0 0 0 0 0 0 0 0 0 Output Compare 3 Mask Register W OC3D R Output Compare 3 Data Register W TCNT (hi) R Timer Count Register W TCNT (lo) R Timer Count Register W TSCR1 R Timer System Control Register 1 W TTOV R Timer Toggle Overflow Register W TCTL1 R Timer Control Register 1 W TCTL2 R Timer Control Register 2 W TIE R Timer Interrupt Enable Register W TSCR2 R Timer System Control Register 2 W TFLG1 R Main Timer Interrupt Flag 1 W TFLG2 R Main Timer Interrupt Flag 2 W TCNT[15:0] 0 0 0 0 0 0 OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0 EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A 0 0 0 0 C3I C2I C1I C0I 0 0 0 TCRE PR2 PR1 PR0 0 0 0 C3F C2F C1F C0F 0 0 0 0 0 0 0 TEN TOI 0 TOF TFFCA MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) 0x2E 0x2F 0x30 0x31 0x32 0x33 0x34 0x35 0x36 TC0 (hi) R Timer Input Capture/Output Compare Register 0 W TC0 (lo) R Timer Input Capture/Output Compare Register 0 W TC1 (hi) R Timer Input Capture/Output Compare Register 1 W TC1 (lo) R Timer Input Capture/Output Compare Register 1 W TC2 (hi) R Timer Input Capture/Output Compare Register 2 W TC2 (lo) R Timer Input Capture/Output Compare Register 2 W TC3 (hi) R Timer Input Capture/Output Compare Register 3 W TC3 (lo) R Timer Input Capture/Output Compare Register 3 W TIMTST R Timer Test Register W 0x37 0x38 0x39 0x3A 15 7 Name Reserved LTC_CTL (hi) R R R Life Time Counter control register W LTC_SR 11 3 10 2 9 1 8 0 TC1[15:0] TC2[15:0] TC3[15:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 TCBYP LTCIEM LTCIE LTCOF Life Time Counter status register W 1 will clr Reserved 12 4 TC0[15:0] R 0x3B 13 5 0 W Life Time Counter control register W LTC_CTL (lo) 14 6 R 0 LTCEM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 LTCE W R 0x3C LTC_CNT1 Life Time Counter Register W R LTC[31:16] W MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) 15 7 Name 14 6 13 5 12 4 11 3 10 2 9 1 8 0 R 0x3E LTC_CNT0 Life Time Counter Register W LTC[15:0] R W R 0x40 GPIO_CTL GPIO control register 0 0 0 0 0 0 0 0 DIR2M DIR1M DIR0M PE3M PE2M PE1M PE0M DIR2 DIR1 DIR0 PE3 PE2 PE1 PE0 0 0 0 0 PDE3 PUE2 PUE1 PUE0 0 0 0 0 PD3 PD2 PD1 PD0 TCAP3 TCAP2 TCAP1 TCAP0 SCIRX LINTX TCOMP3 TCOMP2 TCOMP1 TCOMP0 SCITX LINRX TCAP3 TCAP2 TCAP1 TCAP0 SCIRX LINTX TCOMP3 TCOMP2 TCOMP1 TCOMP0 SCITX LINRX TCAP3 TCAP2 TCAP1 TCAP0 SCIRX LINTX WKUP TCOMP3 TCOMP2 TCOMP1 TCOMP0 SCITX LINRX PTWU PTWU TCAP3 TCAP2 TCAP1 TCAP0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R 0 W 0x42 0x43 0x44 0x45 0x46 0x47 0x48 0x49 0x4A GPIO_PUC R GPIO pull up/down configuration W GPIO_DATA R GPIO port data register W GPIO_IN0 R Port 0 input configuration W GPIO_OUT0 R Port 0 output configuration W GPIO_IN1 R Port 1 input configuration W GPIO_OUT1 R Port 1 output configuration W GPIO_IN2 R Port 2 input configuration W GPIO_OUT2 R Port 2 output configuration W GPIO_IN3 R Port 3 input configuration W 0x4B Reserved 0x4C Reserved 0x4D Reserved 0x4E Reserved 0x4F Reserved R 0 WKUP 0 WKUP 0 0 0 PTBX0 0 0 PTBX1 0 0 PTBX2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W R W R W MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) 0x50 R 15 7 0 W OTIEM Name LIN_CTL LIN control register R W 0x52 0x53 0x54 0x55 LIN_SR (hi) R LIN status register W LIN_SR (lo) R LIN status register W LIN_TX R LIN transmit line definition W LIN_RX R LIN receive line definition W 0x61 8 0 0 TXDM LVSDM ENM SRSM[1:0] TXD LVSD EN SRS[1:0] 0 UV 0 0 0 RX TX FROMPT B FROMSCI TOPTB TOSCI Write 1 will clear the flags 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R 0 0 0 0 0 0 0 0 W AHCRM OPTEM OPENEM CVMIEM ETMENM ITMENM VMENM CMENM R 0 W AHCR OPTE OPENE CVMIE ETMEN ITMEN VMEN CMEN ACQ_SR (hi) R AVRF PGAG VMOW CMOW ETM ITM VM CM Acquisition status register W ACQ_SR (lo) R Acquisition status register W ACQ_CTL Acquisition control register ACQ_ACC1 Acquisition chain control 1 R W R W ACQ_ACC0 Acquisition chain control 0 Write 1 will clear the flags OPEN 0 0 VTH ETCHOP ITCHOP VCHOP CCHOP R 0 0 0 0 0 0 0 0 W TCOMPM LPFENM ETCHOP M ITCHOPM CVCHOP M AGENM R VCOMPM CCOMPM TCOMP VCOMP CCOMP LPFEN ETCHOP ITCHOP CVCHOP AGEN R 0 0 0 0 0 0 0 0 W ZEROM ECAPM TADCGM VADCGM CADCGM TDENM VDENM CDENM ZERO ECAP TADCG VADCG CADCG TDEN VDEN CDEN 0 0 0 0 0 0 0 R W 0x60 HF 9 1 0 0 W 0x5E 0 10 2 0 0 Reserved 0x5C 0 11 3 0 0 0x57 0x5B 0 12 4 0 0 Reserved 0x5A OT 13 5 0 RDY 0x56 0x58 OTIE 14 6 0 ACQ_DEC R Decimation rate W ACQ_BGC R BandGap control W BGADC[1:0] BGLDO DEC[2:0] BG3EN BG2EN BG1EN MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) 0x62 0x63 0x64 0x65 0x66 Name ACQ_GAIN R PGA gain W ACQ_GCB R GCB threshold W ACQ_ITEMP (hi) R Internal temperature measurement W ACQ_ITEMP (lo) R Internal temperature measurement W ACQ_ETEMP (hi) R External temperature measurement W ACQ_ETEMP (lo) R 0x67 External temperature measurement W 0x68 Reserved 0x69 R 15 7 0 14 6 0 13 5 0 10 2 9 1 8 0 IGAIN[2:0] ITEMP[15:8] ITEMP[7:0] EEMP[15:8] EEMP[7:0] 0 0 0 0 0 0 0 0 0 0 W ACQ_CURR1 R Current measurement W ACQ_CURR0 Current measurement 11 3 0 D[7:0] CURR[23:16] R 0x6A 12 4 0 CURR[15:8] W R CURR[7:0] W R 0x6C ACQ_VOLT Voltage measurement VOLT[15:8] W R VOLT[7:0] W 0x6E 0x6F ACQ_LPFC R 0 0 0 0 0 0 0 0 LPFC[3:0] Low pass filter coefficient number W Reserved R 0 0 W R 0x70 ACQ_TCMP Low power trigger current measurement period W R TCMP[15:0] W MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) 0x72 ACQ_THF R Low power current threshold filtering period W 0x73 0x74 0x75 0x76 Reserved 0x79 0x7A 0x7B 0x7C 0x7D 0x7E 0x7F 0x80 0x81 0x82 0x83 R R I and V chopper control register W ACQ_CVCR (lo) R I and V chopper control register W ACQ_CTH R Low power current threshold W Reserved 14 6 13 5 12 4 11 3 10 2 9 1 8 0 THF[7:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W ACQ_CVCR (hi) 0x77 0x78 15 7 Name R 0 0 DBTM[1:0] IIRCM[2:0] PGAFM DBT[1:0] IIRC[2:0] PGAF CTH[7:0] 0 0 0 0 0 0 0 0 W ACQ_AHTH1 (hi) R Low power Ah counter threshold W ACQ_AHTH1 (lo) R Low power Ah counter threshold W ACQ_AHTH0 (hi) R Low power Ah counter threshold W ACQ_AHTH0 (lo) R Low power Ah counter threshold W ACQ_AHC1 (hi) R Low power Ah counter W ACQ_AHC1 (lo) R Low power Ah counter W ACQ_AHC0 (hi) R Low power Ah counter W ACQ_AHC0 (lo) R Low power Ah counter W LPF_A0 (hi) R A0 filter coefficient W LPF_A0 (lo) R A0 filter coefficient W LPF_A1 (hi) R A1 filter coefficient W LPF_A1 (lo) R A1 filter coefficient W 0 AHTH[30:16] AHTH[15:0] AHC[31:24] AHC[23:16] AHC[15:8] AHC[7:0] A0[15:0] A1[15:0] MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) 0x84 0x85 0x86 0x87 0x88 0x89 0x8A 0x8B 0x8C 0x8D 0x8E 0x8F 0x90 0x91 0x92 0x93 0x94 0x95 15 7 Name LPF_A2 (hi) R A2 filter coefficient W LPF_A2 (lo) R A2 filter coefficient W LPF_A3 (hi) R A3 filter coefficient W LPF_A3 (lo) R A3 filter coefficient W LPF_A4 (hi) R A4 filter coefficient W LPF_A4 (lo) R A4 filter coefficient W LPF_A5 (hi) R A5 filter coefficient W LPF_A5 (lo) R A5 filter coefficient W LPF_A6 (hi) R A6 filter coefficient W LPF_A6 (lo) R A6 filter coefficient W LPF_A7 (hi) R A7 filter coefficient W LPF_A7 (lo) R A7 filter coefficient W LPF_A8 (hi) R A8 filter coefficient W LPF_A8 (lo) R A8 filter coefficient W LPF_A9 (hi) R A9 filter coefficient W LPF_A9 (lo) R A9 filter coefficient W LPF_A10 (hi) R A10 filter coefficient W LPF_A10 (lo) R A10 filter coefficient W 14 6 13 5 12 4 11 3 10 2 9 1 8 0 A2[15:0] A3[15:0] A4[15:0] A5[15:0] A6[15:0] A7[15:0] A8[15:0] A9[15:0] A10[15:0] MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) 0x96 0x97 0x98 0x99 0x9A 0x9B 0x9C 0x9D 0x9E 0x9F 0xA0 15 7 Name LPF_A11 (hi) R A11 filter coefficient W LPF_A11 (lo) R A11 filter coefficient W LPF_A12 (hi) R A12 filter coefficient W LPF_A12 (lo) R A12 filter coefficient W LPF_A13 (hi) R A13 filter coefficient W LPF_A13 (lo) R A13 filter coefficient W LPF_A14 (hi) R A14 filter coefficient W LPF_A14 (lo) R A14 filter coefficient W LPF_A15 (hi) R A15 filter coefficient W LPF_A15 (lo) R A15 filter coefficient W COMP_CTL Compensation control register 0xA2 0xA3 R Compensation status register W COMP_TF R Temperature filtering period W 11 3 10 2 9 1 8 0 A13[15:0] A14[15:0] A15[15:0] W COMP_SR 12 4 A12[15:0] 0 W 13 5 A11[15:0] R R 14 6 0 0 0 0 0 BGCALM[1:0] PGAZM PGAOM DIAGVM DIAGIM CALIEM BGCAL[1:0] PGAZ PGAO DIAGV DIAGI 0 PGAOF 0 0 0 0 BGRF CALIE 0 CALF Write 1 will clear the flags 0 0 0 0 0 TMF[2:0] R 0xA4 COMP_TMAX Max temp before recalibration W R TCMAX[15:0] W R 0xA6 COMP_TMIN Min temp before recalibration W R TCMIN[15:0] W MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) Name 0xA8 Reserved 0xA9 Reserved 0xAA 0xAB R R 13 5 0 12 4 0 11 3 0 10 2 0 9 1 0 8 0 0 0 0 0 0 0 0 0 0 0 0 W R Offset voltage compensation W COMP_IO R Offset current compensation W R 0xAC 14 6 0 W COMP_VO COMP_VSG Gain voltage compensation vsense channel 15 7 0 VOC[7:0] COC[7:0] 0 0 0 0 R VSGC[7:0] W 0xAE Reserved 0xAF Reserved R 0xB0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R COMP_IG4 Gain current compensation 4 W R R 0xB2 0 0 0 0 W R 0xB4 COMP_IG16 Gain current compensation 16 0 0 0 0 W R 0xB6 COMP_IG32 Gain current compensation 32 0 0 0 0 W R 0xB8 COMP_IG64 Gain current compensation 64 0 0 0 0 W R W IGC32[9:8] IGC32[7:0] W R IGC16[9:8] IGC16[7:0] W R IGC8[9:8] IGC8[7:0] W R IGC4[9:8] IGC4[7:0] W COMP_IG8 Gain current compensation 8 VSGC[9:8] W IGC64[9:8] IGC64[7:0] MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) Name R 0xBA COMP_IG128 Gain current compensation 128 15 7 0 14 6 0 13 5 0 R R 0xBC 0 0 0 R 0xC0 0 0 0 R 0xC2 0 0 0 R 0xC4 0 0 0 R 0 0 0 R 0xC8 0 0 0 R 0xCA 0 0 0 0 0 0 0 0 0 0 0 W R R W IGC512[9:8] PGAOC4[10:8] PGAOC8[10:8] PGAOC16[10:8] PGAOC32[10:8] PGAOC64[10:8] PGAOC64[7:0] 0 0 0 0 0 W R 0 PGAOC32[7:0] W COMP_PGAO128 Offset PGA compensation 128 0 W R IGC256[9:8] PGAOC16[7:0] W COMP_PGAO64 Offset PGA compensation 64 0 W R 0xC6 0 PGAOC8[7:0] W COMP_PGAO32 Offset PGA compensation 32 0 W R IGC128[9:8] PGAOC4[7:0] W COMP_PGAO16 Offset PGA compensation 16 0 W R 8 0 IGC512[7:0] W COMP_PGAO8 Offset PGA compensation 8 0 W R 9 1 IGC256[7:0] W COMP_PGAO4 Offset PGA compensation 4 0 W R 0xBE 10 2 0 IGC128[7:0] W COMP_IG512 Gain current compensation 512 11 3 0 W W COMP_IG256 Gain current compensation 256 12 4 0 PGAOC128[10:8] PGAOC128[7:0] MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) Name R 0xCC COMP_PGAO256 Offset PGA compensation 256 15 7 0 14 6 0 13 5 0 R R 0xCE 0xD1 0xD2 0xD3 0 0 0 R R Internal temp. offset compensation W COMP_ITG R 0 R External temp. offset compensation W COMP_ETG R External temp. gain compensation W Reserved 0xD5 Reserved 0xD6 Reserved 0xD7 Reserved 0xD8 Reserved 0xD9 Reserved 0xDA Reserved 0xDB Reserved 0xDC Reserved R 8 0 0 PGAOC512[10:8] PGAOC512[7:0] ITOC[7:0] ITGC[7:0] Internal temp. gain compensation W COMP_ETO 9 1 PGAOC256[10:8] W COMP_ITO 0xD4 10 2 PGAOC256[7:0] W 0xD0 11 3 0 W W COMP_PGAO512 Offset PGA compensation 512 12 4 0 ETOC[7:0] ETGC[7:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W R W R W R W R W R W R W MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) Name 0xDD Reserved 0xDE Reserved 0xDF Reserved 0xE0 0xE1 0xE2 0xE3 0xE4 0xE5 0xE8 0xE9 R R W TRIM_BG0 (lo) R Trim bandgap 0 W TRIM_BG1 (hi) R Trim bandgap 1 W TRIM_BG1 (lo) R Trim bandgap 1 W TRIM_BG2 (hi) R Trim bandgap 2 W TRIM_BG2 (lo) R Trim bandgap 2 W TRIM_LIN R Trim LIN W TRIM_LVT R Trim low voltage threshold W TRIM_OSC (hi) R Trim LP oscillator W TRIM_OSC (lo) R Trim LP oscillator W 0xEB Reserved 0xEC Reserved 0xED Reserved 0xEE Reserved 12 4 0 11 3 0 10 2 0 9 1 0 8 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 UBG3 DBG3 0 0 W Trim bandgap 0 Reserved 13 5 0 W R 0xEA 14 6 0 W TRIM_BG0 (hi) 0xE6 0xE7 R 15 7 0 R 0 TCIBG2[2:0] TCIBG1[2:0] IBG2[2:0] IBG1[2:0] TCBG2[2:0] TCBG1[2:0] 0 0 SLPBG[2:0] V1P2BG2[3:0] V1P2BG1[3:0] V2P5BG2[3:0] V2P5BG1[3:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 LIN LVT LPOSC[12:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W R W R W MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 62. Analog die registers - 0x0200-0x02FF D2D blocking access (D2DI) 2 of 3/0x0300-0x03FF D2D non blocking access (D2DI) 3 of 3 (continued) Offset(74) Name 0xEF Reserved 0xF0 Reserved 0xF1 Reserved 0xF2 Reserved 0xF3 Reserved 0xF4 Reserved 0xF5 Reserved 0xF6 Reserved 0xF7 Reserved 0xF8 Reserved 0xF9 Reserved 0xFA Reserved 0xFB Reserved 0xFC Reserved 0xFD Reserved 0xFE Reserved 0xFF Reserved R 15 7 0 14 6 0 13 5 0 12 4 0 11 3 0 10 2 0 9 1 0 8 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Notes 74. Register Offset with the "lo" address value not shown have to be accessed in 16-Bit mode. 8-Bit access will not function. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.2 MM912_637 - analog die overview 4.2.1 Introduction VDDL DGND VDDH VDDX PTB3 PTB2 PTB1 PTB0 The MM912_637 analog die implements all system base functionality to operate the integrated microcontroller, and delivers application specific input capturing. Analog VSUP Watchdog GPIO Digital Bias Regulator(s) VDDA GNDA MMC Oscillator SCI LIN LIN LGND D2DDAT0..7 MCU Die D2D Interface Internal Bus D2DCLK D2DINT Wake Up / Power Down Timer Fuse Box VFUSE GNDSUB Temperature Measurement ADCGND TSUP VTEMP Battery Voltage Battery Current Measurement Measurement VSENSE TEST_A Test Interface ISENSEH TCLK Gain and offset compensation ISENSEL RESET_A Gain and offset compensation Prog. Low pass filter DECV DECC VOPT Interrupt Control Figure 14. Analog die block overview The following chapters describe the analog die functionality on a module by module basis. 4.2.2 Analog die options NOTE This document describes the features and functions of Analog Option 2 (all modules available and tested). Beyond this chapter, there will be no additional note or differentiation between the different implementations. The following section describes the differences between analog die options 1 and 2. Table 63. Analog options Feature Analog option 1 Analog option 2 Not Characterized or Tested Fully Characterized and Tested External Wake-up (PTB3/L0) No Yes External Temperature Sensor Option (VTEMP) No Yes Optional 2nd External Voltage Sense Input (VOPT) No Yes Cranking Mode MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.2.2.1 Cranking mode For devices with Analog Option 1 (Cranking mode not characterized), the following considerations are to be made: 4.2.2.1.1 Data sheet considerations In Analog Option 1 devices, Operation in Cranking mode is neither characterized not tested. All data sheet parameters and descriptions relating to Cranking mode operation apply to Analog Option 2 devices only. 4.2.2.2 External wake-up (PTB3/L0) For devices with Analog Option 1 (External Wake-up not available), the following considerations are to be made: 4.2.2.2.1 Register considerations Table 64. Wake-up enable register (PCR_WUE (hi)) Offset (75) 0x06 Access: User read/write R W Reset 7 6 5 4 3 2 1 0 WUAHTH WUCTH WUCAL WULIN WUPTB3 WUPTB2 WUPTB1 WUPTB0 0 0 0 0 0 0 0 0 Notes 75. Offset related to 0x0200 for blocking access and 0x300 for non-blocking access within the global address space. For Analog Option 1 devices, WUPTB3 must be set to 0 (wake-up on a GPIO 3 event disabled). 4.2.2.3 External temperature sensor option (VTEMP) For devices with Analog Option 1 (External Temperature Sensor Option not available), the following considerations are to be made: 4.2.2.3.1 Pinout considerations Pin Pin name for option 2 Pin name for option 1 Comment 28 VTEMP NC NC pin should be connected to GND 29 TSUP NC Pin should be left unconnected 4.2.2.3.2 Register considerations Table 65. Acquisition control register (ACQ_CTL) Offset (76),(77) 0x58 Access: User read/write 15 14 13 12 11 10 9 8 R 0 0 0 0 0 0 0 0 W AHCRM OPTEM OPENEM CVMIEM ETMENM ITMENM VMENM CMENM Reset 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 OPTE OPENE CVMIE ETMEN ITMEN VMEN CMEN R 0 W AHCR MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 65. Acquisition control register (ACQ_CTL) (continued) Offset (76),(77) 0x58 Access: User read/write Reset 0 0 0 0 0 0 0 0 Notes 76. Offset related to 0x0200 for blocking access and 0x300 for non-blocking access within the global address space. 77. This register is 16-bit access only. For Analog Option 1 devices, ETMEN must be set to 0 (external temperature measurement disabled). 4.2.2.4 Optional 2nd external voltage sense input (VOPT) For devices with Analog Option 1 (Optional 2nd External Voltage Sense Input not available), the following considerations are to be made: 4.2.2.4.1 Pinout considerations Pin Pin name for option 2 Pin name for option 1 Comment 28 VOPT NC NC pin should be connected to GND 4.2.2.4.2 Register considerations Table 66. Acquisition control register (ACQ_CTL) Offset (78),(79) 0x58 Access: User read/write 15 14 13 12 11 10 9 8 R 0 0 0 0 0 0 0 0 W AHCRM OPTEM OPENEM CVMIEM ETMENM ITMENM VMENM CMENM Reset 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 OPTE OPENE CVMIE ETMEN ITMEN VMEN CMEN 0 0 0 0 0 0 0 R 0 W AHCR Reset 0 Notes 78. Offset related to 0x0200 for blocking access and 0x300 for non-blocking access within the global address space. 79. This register is 16-bit access only. For Analog Option 1 devices, OPTE must be set to 0 (VSENSE routed to ADC). 4.3 4.3.1 Analog die - power, clock and resets - PCR Introduction The following chapter describes the MM912_637's system base functionality primary location on the analog die. The chapter is divided in the following sections: 1. 4.3.2, "Device operating modes" 2. 4.3.3, "Power management" 3. 4.3.4, "Wake-up sources" 4. 4.3.5, "Device clock tree" 5. 4.3.6, "System resets" 6. 4.3.7, "PCR - memory map and registers" MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.3.2 Device operating modes The MM912_637 features three main operation modes: normal operation, stop mode, and sleep mode. The full signal conditioning and measurements are permanently running in normal operation mode. The total current consumption of the MM912_637 is reduced in the two low power modes. The analog die of the MM912_637 is still partially active and able to monitor the battery current, temperature, activities on the LIN interface and L0 terminal, during both low power modes. 4.3.2.1 * * * * * * * Operating mode overview Normal Mode -- All device modules active -- Microcontroller fully supplied -- D2DCLK active analog die clock source -- Window watchdog clocked by the low power oscillator (LPCLK) to operate on independent clock Stop Mode -- MCU in low power mode, MCU regulator supply (VDDX) with reduced current capability -- D2D interface supply disabled (VDDH=OFF) -- Unused analog blocks disabled -- Watchdogs = OFF -- LIN wake-up, calibration request wake-up, cyclic wake-up, external wake-up, current threshold wake-up, and lifetime counter wake-up optional -- Current Measurement / current averaging and temperature measurement optional Sleep Mode -- MCU powered down (VDDH and VDDX = OFF) -- Unused Analog Blocks disabled -- Watchdogs = OFF -- LIN wake-up, calibration request wake-up, cyclic wake-up, external wake-up, current threshold wake-up, and lifetime counter wake-up optional -- Current measurement / current averaging and temperature measurement optional Intermediate Mode -- Every transition from Stop or Sleep into Normal mode will go through an intermediate mode where the analog die clock is not yet switched to the D2D clock. If required, the MM912_637 analog die can be put back to low power mode without changing the frequency domain. Reset Mode -- Every reset source within the analog die will bring the system into a Reset state Power On Reset Mode -- For both low voltage thresholds are defined to indicate a loss of internal state. Cranking Mode(80) -- Special Mode implemented to guarantee the RAM content being valid though very low power conditions. Notes 80. Not available on all device derivatives 4.3.2.2 Operating mode transitions The device operating modes are controlled by the microcontroller, as well as external and internal wake-up sources. Figure 15 shows the basic principal. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS POR ANALOG: VDDL > VPORH MCU: VDDRX>VPORD ANALOG: VDDL < VPORL MCU: VDDRX<VPORA ANALOG: VDDL < VPORL MCU: VDDRX<VPORA RESET RESET Event Cranking Event Reset Event Reset Event gone Cranking Event Cranking Mode1 MCU Intermediate Mode Intermediate Mode Wake-up Event MCU IRQ RESET Event Cranking Event gone Cranking Event Intermediate Mode Normal Mode MCU MCU MCU Wake-up Event (MCU Power On) MCU Stop Mode Sleep Mode 1 ) Cranking Mode not available on all device derivatives Figure 15. Modes of operation - transitions 4.3.2.3 Power on reset - POR During system startup, or in any other case when MCU_VDD drops below VPORA (MCU), or VDDL drops below VPORL (analog die), a Power On Reset (POR) condition is reached. The MCU (PORF) / analog die (LVRF) will indicate this state, setting the corresponding power on reset flag. The primary consequence of entering POR is that the RAM or analog register content can no longer be guaranteed. 4.3.2.4 RESET - mode If any of the analog die reset conditions are present, the MM912_637 analog die will enter Reset mode. During that mode, the analog die will issue the RESET_A pin to be pulled down to reset the microcontroller die. Entering Reset mode will reset the analog die registers to their default values. The cause of the last reset is flagged in the PCR status register (PCR_SR (hi)). 4.3.2.5 Normal mode During Normal mode operation, all modules are operating and the microcontroller is fully supplied. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.3.2.6 Cranking mode(81) A specific power down behavior has been implemented to allow the MCU memory (RAM) content to be guaranteed during very low supply voltage conditions. The difference between the device behavior, with or without the cranking mode feature enabled, is described in Section 4.3.3.3, "Power up/power down behavior". Notes 81. Not available on all device derivatives 4.3.2.7 Intermediate mode As the channel acquisition and the timer modules are switched to the LPCLK, while the MM912_637 is operating in one of the two low power modes, the Intermediate mode has been implemented, to be able to go back to low power mode without the transition into the D2D Clock domain. NOTE The flag indicating the last wake-up source must be cleared before re-entering low power mode! Once awakened, the MCU instructs the analog die to transit to Normal mode by writing "00" to the OPM bits in the PCR Control Register. See Figure 16 for details. "01" STOP MODE VDDH = OFF VDDX = Limited TIM / AQ = LPCLK MCU = STOP SLEEP MODE VDDH & VDDX = OFF TIM / AQ = LPCLK MCU = OFF Wake-up Event Wake-up Event INTERMEDIATE MODE 1. VDDH = ON 2. VDDX = Full 3. MCU => IRQ INTERMEDIATE MODE 1. VDDH & VDDX = ON 2. MCU => Power On "10" MCU can access D2D (82) TIM / AQ are still on LPCLK domain (e.g. check Wake-up source) Write OPM[1:0] Bits in the PCR Control Register "00" NORMAL MODE TIM / AQ = based on D2D Clock Notes 82. As the Life Time Counter has to be configured into normal mode (no access to LTC_CNT[1..0] is possible during intermediate mode), if not reconfigured it will continue to increment starting from 0. Figure 16. Low power mode to normal mode transition through the intermediate mode 4.3.2.8 Low-power modes In low power mode, the MM912_637 is still active to monitor the battery current (triggered current measurement for current threshold detection and current accumulator function), and activities on the LIN interface and wake-up inputs. A cyclic wake-up using timer module is implemented for timed wake-up. Temperature measurements are optional to detect an out of calibration condition. The Life Time counter is also incremented during Low Power mode, to issue a Wake-up on overflow. See Section 4.14, "Life time counter (LTC)" for additional details. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS The average current consumption is reduced, and based on the actual low power mode, the active modules, and the wake-up timing. NOTE To avoid any lock condition, no analog die interrupt should be enabled or pending when entering LPM. To accomplish that condition, the analog die interrupts should be masked and served before writing the PCR_CTL register. The MCU interrupts should be enabled right before the STOP command, to avoid any interrupt to be handled in between. A wake-up from any of the low power modes will reset the window watchdog equal to a standard reset. 4.3.2.8.1 Sleep mode Writing the PCR Control Register (PCR_CTL) with OPM=10, the MM912_637 will enter Sleep mode with the configured wake-up sources (see Section 4.3.4, "Wake-up sources"). NOTE The power supply to the MCU will be turned off during Sleep mode. To safely approach this condition, the MCU should be put into a safe state (e.g STOP). During Sleep mode, the only active voltage regulator is VDDL, supplying the low power oscillator (LPOSC), and the permanently supplied digital blocks. When an enabled wake-up condition occurs, the shutdown voltage regulators are re-enabled, and once their outputs are above reset threshold, the RESET_A signal is released, and the microcontroller will start its normal operation. The wake-up source is flagged in the PCR Status Register (PCR_SR (hi)). The microcontroller has to move from intermediate mode to Normal mode, by writing the OPM=00, to allow a controlled transition into the D2D Clock domain. 4.3.2.8.2 Stop mode Writing the PCR Control Register (PCR_CTL) with OPM=01, the MM912_637 analog die will enter Stop mode with the configured wake-up sources (see Section 4.3.4, "Wake-up sources"), after the D2DCLK signal has been stopped by the MCU die entering Stop. NOTE After writing the PCR Control Register (PCR_CTL) with OPM=01, the register content of the SCI (S08SCIV4) and TIMER (TIM16B4C) module registers are read only until Normal mode is entered again. This is important in case the MCU does not effectively enter STOP, due to an IRQ pending from one of the two blocks. (Having any analog die IRQ allowed when entering Low Power mode is not recommended). During Stop mode, the MM912_637 has the same behavior as during Sleep mode, except VDDX is still powered by the internal Clamp_5v, to supply the MCU STOP mode current. As this current is limited, the MCU die must be switched into STOP mode after sending the Stop command for the analog die. If any enabled wake up condition occurs, the shutdown voltage regulators are re-enabled, and once their outputs are above the reset threshold, VDDX is switched to the main regulator, an D2D interrupt (D2DINT) is issued to wake-up the MCU, and the microcontroller will continue its normal operation. The wake-up source is flagged in the PCR Status Register (PCR_SR (hi)). The microcontroller has to acknowledge the Normal mode by writing the OPM=00. This allows a controlled transition into the D2D Clock domain. If the clock domain transition is not required, the microcontroller may issue a sleep / stop mode entry instead (see Section 4.3.5, "Device clock tree" for details on the limitations during the intermediate state). At start up or after wake-up, it is required to wait to ensure the PLL is locked, if the PLL is enabled previous to accessing the analog die through the D2D interface. NOTE After writing the PCR Control Register (PCR_CTL) with OPM=01, writing OPM=00 (Normal mode) is allowed to wake-up the analog die. The reduced current capability of the MCU regulator supply (VDDX) has to be considered. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.3.3 Power management To support the various operating modes and modules in the MM912_637, the following power management architecture has been implemented. POR VPORH / VPORL VDDL Flash VDDL LVRA VLVRAH / VLVRAL VDDF Clamp5v VDDA VDDA VDDX VDDX LVR VLVRA / VLVRD VDDRX LVI VLVIA / VLVID VLVRXH / VLVRXL VDD POR VSUP LVRX D2D VDDH VDDD2D VDDH VPORA / VPORD UVI VUVIH / VUVIL LVRH Core VLVRHH / VLVRHL MCU Analog Die Figure 17. System voltage monitoring 4.3.3.1 Detailed power block description See recommended external components under Section 2.2, "Recommended external components"". 4.3.3.1.1 VSUP VSUP is the system power supply input, and must be reverse battery protected by an external diode. VSUP is monitored for undervoltage conditions (UVI). Once VSUP drops below VUVIL an undervoltage interrupt (LVI) is issued. NOTE If the device has the cranking mode feature enabled, the undervoltage threshold would be VUVCIL instead of VUVIL. 4.3.3.1.2 VDDL VDDL is the low power 2.5 V digital supply voltage, supplying the permanently active blocks. It is based on the internal Clamp5v voltage and always on. It is available externally, but must not be connected to any load. 4.3.3.1.3 VDDX VDDX is the Normal mode 5.0 V regulator output, suppling the LIN block and the microcontroller via the VDDX pin. During STOP and SLEEP mode operation, the VDDX regulator is shut down (Clamp5v does supply the MCU during STOP mode). 4.3.3.1.4 VDDH VDDH is the Normal mode 2.5 V regulator output, suppling only active blocks during Normal mode and the MCU Die to Die Interface, via the VDDH terminal. The VDDH regulator is shut down during both low power modes. 4.3.3.1.5 VDDA VDDA is the 2.5 V analog supply voltage, active during Normal mode and I/T acquisitions. No external load must be connected to the VDDA terminal. 4.3.3.2 Power supply by module The following table summarized the active regulators vs. module for the different operating modes. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 67. Power supply by module Module/block VDDH VDDA X X Gain Control Block (GCB)(83) Programmable Gain Amplifier (PGA) I/T - ADC (84) VDDX X X X Converters(84) X V - ADC Converters(83) X Temperature Sensor(84) X LIN(83) D2D(83) X LPOSC(85) X Permanent Digital(85) Normal Mode VDDL X Digital(83) X Notes 83. Enabled in Normal Mode only 84. Enabled when a measuring in Low Power mode and always in Normal mode 85. Permanently enabled 4.3.3.3 Power up/power down behavior Several system voltage monitors have been implemented in both die, to guarantee a defined power up and power down system behavior. See Figure 17 for the various sensing points. The individual threshold levels are specified in Table 15 for the analog die, and Table 24 for the microcontroller. NOTE To differentiate between the MCU and analog die thresholds, the following symbol scheme is defined: VxxxxA - MCU Assert Level (lower threshold for low voltage events) VxxxxD - MCU Deassert Level (higher threshold for low voltage events) VxxxxH - Analog Die High Threshold Level (deassert threshold for low voltage events) VxxxxL - Analog Die Low Threshold Level (assert threshold for low voltage events) 4.3.3.4 Low-voltage operation - cranking mode device option Based on the device option ("Cranking" or "Non-cranking"), the MM912_637 will behave different during "Loss of Power" conditions. The "Cranking" option is an option, allowing lower voltage operations to guarantee the MCU memory content during a standard cranking situation. As illustrated in Figure 18, the cranking mode is introduced to maintain both die in a STOP mode alike state. The MCU die will remain in STOP with the RAM content being guaranteed until the PORA level is reached for the VDDRX supply. The analog die will enter "Cranking Mode" upon the MCU command out of Normal Mode, or when it reaches VUVCIL during STOP Mode, with the LVT bit set in the TRIM_LVT register. NOTE Executing STOP with VSUP < VUVCIL and LVT = 1, the MM912_637 will immediately enter Cranking Mode. During Cranking Mode, the analog die will gate its internal oscillator to stop all ongoing acquisitions during the low power condition. Returning from Cranking mode will appear as a wake-up from undervoltage interrupt (UVI=1). The analog die will be in Intermediate mode after wake-up, and could be sent into Normal mode (Stop, Sleep), by writing the OPM bits. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Device with Cranking Mode Enabled Stop / Sleep Mode Normal / Intermediate Mode Stop / Sleep Mode High Precision Comparator always on in Normal / Intermediate Mode High Precision Comparator => ON VUVIL Under Voltage IRQ (UVI) issued. Inactive during Stop / Sleep Handle IRQ, prepare for Cranking Mode Inactive during Stop / Sleep VLVIA Handle IRQ, prepare for Cranking Mode Inactive during Stop / Sleep Under Voltage IRQ (UVI) issued. Cranking Mode Entry without MCU interaction. MCU will stay in STOP mode or turned off. VUVCIL Inactive for Non Cranking Mode Device Option Inactive for Non Cranking Mode Device Option MCU in LVR, Analog Die remains in Low Power Mode Inactive during Stop / Sleep MCU initiates rapid shutdown to Cranking Mode (OPM=11) and enters STOP. CRANKING MODE (MCU = Stop or Off, Analog = Cranking Mode LPOSC gated => operation stopped) VSUP Decrease Normal / Intermediate Mode Device with Cranking Mode Disabled Inactive during Cranking Mode VLVRA Inactive during Cranking Mode VLVRXL LOW VOLTAGE RESET at VDDX => Analog Die + MCU in Reset Mode Inactive during Cranking Mode VLVRHL VLVRAL System remains in Reset Mode MCU POR, RAM invalid, Analog Die Remains in Cranking Mode VPORA MCU POR, RAM invalid, Both Dice Remain in Reset Mode Inactive for Cranking Mode Device Option VPORL Analog Die Power On Reset Analog Die Power On Reset VPORCL Inactive for Non - Cranking Mode Device Option Figure 18. Power down sequence MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.3.4 Wake-up sources Several wake-up sources have been implemented in the MM912_637, to exit from Sleep or Stop mode. Figure 19 shows the wake-up sources and the corresponding configuration and status bits. To indicate the internal wake-up signal, a routing of the internal wake-up signal to the PTBx output (WKUP) is implemented. See Section 4.11, "General purpose I/O - GPIO", for additional details on the required configuration. GPIO TIM4CH WKUP TCOMP3..0 PTB0 I/O Output Compare CH3 WUPTB0 TCOMP3..0 Output Compare CH2 PTB1 I/O Output Compare CH1 Output Compare CH0 Sytem Wake Up WUPTB1 TCOMP3..0 PTB2 I/O WUPTB2 =1 WLPMF WUPTB0F PTB3 I/O PTWU WUPTB1F L0 WUPTB3 WUPTB2F WUPTB3F WULINF LIN WULIN WUAHTHF WUCTHF LIN Wake Up detected WUCALF Current Trigger Current Accumulator Threshold reached Current Threshold reached Calibration Request Life Time Counter WUAHTH WULTCF WUCTH WUCAL WULTC Life Time Counter Overflow Figure 19. Wake-up sources 4.3.4.1 4.3.4.1.1 Wake-up source details Cyclic current acquisition/calibration temperature check A configurable (ACQ_TCMP) independent low power mode counter/trigger, based on the ALFCLK, has been implemented to trigger a cyclic current measurement during the low power modes. To validate that the temperature is still within the calibration range, the temperature measurement can be enabled during this event as well. As a result of the cyclic conversions, three wake-up conditions are implemented. * Current Threshold Wake-up * Current Averaging Wake-up * Calibration Request Wake-up The configuration of the counter and the cyclic measurements is part of the acquisition paragraph (see Section 4.8, "Channel acquisition"). The actual cyclic measurement does not wake-up the microcontroller unless one of the three wake-up conditions become valid. 4.3.4.1.1.1 Current threshold wake-up Every cyclic current measurement result (absolute content of the ADC result I_CURR register) is compared with a programmable unsigned current threshold (CTH in the ACQ_CTH register). MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS The comparison is done with the CTH content left - shifted by 1, as shown in Table 68. Table 68. Current Threshold Comparison 2 3 2 2 2 1 2 0 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 1 1 1 0 9 CTH[7:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 ABS(CURR[23:0]) X 8 7 6 5 4 CTH[7:0] 3 2 1 0 0 ABS(CURR[23:0]) If the absolute result is greater or equal to the programmed and shifted threshold, a filter counter is incremented (decremented if below). If the filter counter (8-Bit) reaches the programmable low power current threshold filtering period (ACQ_THF), a wake-up initiated if the Current Threshold Wake-up is enabled (WUCTH). The filter counter is reset every time a low power mode is entered. The implementation is shown in Figure 20. The wake-up source is flagged with the WUCTHF Bit. Figure 20. Current threshold - wake-up counter 4.3.4.1.1.2 Current ampere hour threshold wake-up As shown in Figure 21, every cyclic current measurement (signed content of the ADC result ACQ_CURR register) is added to the 32-Bit (signed) current accumulator (ACQ_AHC) (both in two's complement format). If the absolute accumulator value reaches (|ACQ_AHC| ACQ_AHTH), the absolute programmable 31-Bit current threshold (ACQ_AHTH), a wake-up is initiated if the Current AH Threshold Wake-up is enabled (WUAHTH). The accumulator could be reset by writing 1 into the AHCR register. The Ampere Hour Counter is counting after wake-up. In normal mode, the accumulator register ACQ_AHC can be read out anytime. The wake-up source is flagged with the WUAHTHF Bit. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Ah counter Accu threshold (progr.) actual measured current measurement interval uC wake-up t start low-power mode = reset of Ah counter Figure 21. Ah counter function 4.3.4.1.1.3 Calibration request wake-up Once the temperature measured during the cyclic sense is indicating a potential "out of calibration" situation, a wake-up is issued if the Calibration Request Wake-up is enabled (WUCAL). For additional details, refer to Section 4.8.5, "Calibration". The wake-up source is flagged with the WUCALF Bit. 4.3.4.1.2 Timed wake-up To generate a programmable wake-up timer, the integrated 4 Channel Timer Module is supplied, during both low power modes and running on the ALFCLK clock. To wake-up from one of the low power modes, the output compare signal (OC) of any of the 4 channels can be routed to the PTB[2:0] logic (standard feature also in Normal mode). Enabling the corresponding Wake-up Enable Bit (WUPTBx) will generate the wake up, once the timer output compare becomes active. NOTE Only the internal GPIO logic is active during the low power modes. The Port I/O structures will not be active. To allow an accurate wake-up configuration during the clock transition, the timer should be configured before entering one of the low power modes, without the Timer Enable Bit (TEN) being set. Setting the Timer Wake-up Enable Bit (WUPTB) will enable the TIMER interrupts as wake-up sources, and cause the Timer Enable Bit (TEN) to be set, once the timer clock domain was changed to the ALFCLK clock supplied by LPOSC. During low-power mode, only current and temperature measurements are performed, so only the current measurement channel is active with the temperature channel being optional - the voltage measurement channel is inactive. To reduce further the power consumption, only triggered current measurements are done. For this purpose, an independent Timer Module is used to periodically start a current measurement after a programmable time (ACQ_TCMP). 4.3.4.1.3 Wake-up from LIN During Low Power mode, operation of the transmitter of the physical layer is disabled. The receiver remain, active and able to detect wake-up events on the LIN bus line. For further details, refer to Section 4.12, "LIN". A dominant level longer than tWUPF followed by a rising edge, will generate a wake-up event if the WULIN is enabled. The wake-up source is flagged with the WULINF Bit. NOTE If the LIN module is disabled (LIN_CTL:EN=0), no wake-up will be issued after the dominant to recessive transition, when the device goes to low power mode, while the LIN bus is in the DOMINANT STATE. If the LIN module is enabled (LIN_CTL:EN=1), the device will wake-up after the dominant to recessive transition, when the device goes to low power mode, while the LIN bus is in the DOMINANT STATE. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS A full dominant -> recessive -> dominant sequence, during low power mode, will wake-up the device in both cases. 4.3.4.1.4 Wake-up on wake-up pin high level Once a Wake-up signal (high level) is detected on the PTB3/L0 input, with the Wake-up Enable Bit (WUPTB3) and the port configuration bit (PTWU) set, a wake-up is issued. The wake-up source is flagged with the WUPTB3F Bit. 4.3.4.1.5 Wake-up on life time counter overflow The life time counter continues to run during low power mode, if configured. Once the counter overflows with the life time counter wake-up enabled (WULTC=1), a wake-up is issued. The wake-up source is flagged with the WULTC Bit. Life Time Counter has to be configured in Normal mode only. 4.3.4.1.6 General wake-up indicator To indicate the system has been awakened after power up, the WLPMF flag will be set. 4.3.5 4.3.5.1 Device clock tree Clock scheme overview There are two system oscillators implemented. The low power oscillator is located on the analog die, and is supplied permanently and has a nominal frequency of fOSCL (512 kHz), providing a LPCLK clock signal. It is primarily used in low power mode, and as an independent clock source for the watchdog during Normal mode. The high power oscillator is basically the internal or external microcontroller oscillator (active only during normal mode). The high power oscillator is distributed to the analog die via the D2DCLK (via configurable MCU prescalers), and there it's divided into two clocks (D2DSCLK and D2DFCLK), based on the PRESC[15:0] prescaler. For the D2DSCLK, an additional 2 Bit divider PF[1:0] is implemented (86) . During Normal mode, D2DSCLK is continuously synchronizing the LPCLK, to create the accurate ALFCLK (See Section 4.3.5.2, "ALFCLK calibration"), D2DCLK is the clock source of the TIM16B4C (Timer), and S08SCIV4 (SCI) module with a fixed by 4 divider. Notes 86. PF[1:0] is not implemented as a simple divider. To accomplish a D2DSCLK period ranging from 1.0 ms to 8.0 ms, the following scheme is used: 00 1; 01 - 2; 10 - 4; 11 - 8. D2DSCLK - D2D Slow Clock (1... 0.125 kHz) Eqn. 1 D2DCLK D2DSCLK = ------------------------------------------------------------------------ PF [ 1, 0 ] (2 ) x ( PRESC [ 15, 0 ] ) D2DFCLK - D2D Fast Clock (512 kHz) Eqn. 2 D2DCLK D2DFCLK = -------------------------------------------------------------------------------------- 2 x ( PRESC [ 15, 10 ] + PRESC [ 9 ] ) During low power mode, D2DCLK is not available. The low power oscillator is the only system clock. Figure 22 and Figure 23 show the different clock sources for normal and low power mode. NOTE D2DFCLK has to be set to match 512 kHz, resulting in D2DSCLK being 1.0, 2.0, 4.0, or 8.0 kHz, based on PF[1:0] The minimum value for PRESC[15:0] has to be 0x0400. Any value lower than 0x0400 will result in faulty behavior and is not recommended. Values of 0x0003 or less are not stored by the internal logic. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS LPOSC (fOSCL) LPCLK LP CLK Synch D2DSCLK trim_lposc WDTO[2:0]=100 tIWDTO WDTO[2:0] tWDTO ALFCLK Life Time Counter PF[1:0] D2DFCLK D2D Interface Window Watchdog Channel Acquisition PRESC[15:0] D2DCLK [15:10] TIM16B4C (Timer) [9:0] DIV4 S08SCIV4 (SCI) Figure 22. Clock tree overview - normal mode LPOSC LPCLK LP CLK Synch ALFCLK Life Time Counter TIM16B4C (Timer) trim_lposc Current Trigger Channel Acquisition Figure 23. Clock tree overview - low power modes 4.3.5.2 ALFCLK calibration To increase the accuracy of the 1.0 kHz (or 2.0, 4.0, 8.0 kHz based on PF[1:0]) system clock (ALFCLK), the low power oscillator (LPCLK) is synchronized to the more precise D2DCLK, via the D2DSCLK signal. The "Calibrated Low Power Clock" (ALFCLK) could be trimmed to the D2DCLK accuracy plus a maximum error adder of 1 LPCLK period, by internally counting the number of periods of the LPCLK (512 kHz) during a D2DSCLK period. The APRESC[12:0] register will represent the calculated internal prescaler. The PRDF bit (Prescaler Ready flag) will indicate the synchronization complete after a power up or prescaler (PRESC/PF) change. The adjustment is continuously performed during Normal mode. During low power mode (STOP or SLEEP), the last adjustment factor would be used. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS D2DCLK PRESC[15:0]+PF[1:0] Counter based ms clock (D2DSCLK) period LPCLK 1 2 3 4 5 6 7 APRESC[12:0] 0x0200 (512d) default PRDF 0 8 9 0x0009 (9d) 1 Synch Start Synch Finished Figure 24. ALF clock calibration procedure during normal mode 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 LPCLK PRDF APRESC[12:0] 0 1 ? 0x0009 (9d) ALFCLK Figure 25. ALFCLK after calibration 4.3.5.3 Recommended clock settings Considering the system is running on the internal oscillator, Table 69 shows the recommended clock settings to achieve the optimal 512 kHz D2DFCLK. For details on the MCU divider settings, including POSTDIV and SYNDIV, see Section 4.23, "S12 clock, reset, and power management unit (9S12I128PIMV1)". The D2D initiator module includes D2DCLKDIV see Section 4.26, "MCU - die-to-die initiator (9S12I128PIMV1)". 30.720 15.360 10.240 14.336 7.168 9.216 13.312 0 0 0 15=32.768 16=34.816 17=36.864 18=38.912 19=40.960 20=43.008 21=45.056 22=47.104 23=49.152 24=51.200 25=53.248 0 27.648 26.624 26=55.296 0 29.696 28.672 27=57.344 0 PRESC[15:9] (dec)(87) 31.744 28=59.392 0 29=61.440 8.192 30=63.488 31=65.536 16.384 POSTDIV for (SYNDIV=fVCO in MHz) D2DCLKDIV=4 D2DCLKDIV=2 32.768 D2DCLKDIV=3 D2DCLKDIV=1 (fBUS) fD2D / MHz Divider for(87) D2DFCLK=512kHz Table 69. Recommended clock settings 64 63;64 62 61;62 60 59;60 58 57;58 56 55;56 54 53;54 52 51;52 MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 24.576 12.288 8.192 6.144 11.264 7.168 10.240 5.120 0 0 9.216 6.144 0 0 8.192 15.360 14.336 4.096 1 5.120 0 1 7.168 1 13.312 12.288 1 6.144 4.096 3.072 1 11.264 10.240 1 5.120 9.216 8.192 2 4.096 2 2.048 1 3 2 1 3 3.072 2.048 2 4 5.120 4.096 1 3.072 7.168 6.144 15=32.768 0 17.408 16.384 16=34.816 17=36.864 0 19.456 18.432 18=38.912 19=40.960 20=43.008 0 21.504 20.480 21=45.056 0 23.552 22.528 22=47.104 23=49.152 0 3 5 2.048 7 3.072 4 6 9 2.048 15 14 2 5 8 13 3 4 7 12 11 6 10 3 5 9 8 7 PRESC[15:9] (dec)(87) 25.600 24=51.200 25=53.248 26=55.296 27=57.344 28=59.392 29=61.440 30=63.488 31=65.536 POSTDIV for (SYNDIV=fVCO in MHz) D2DCLKDIV=4 D2DCLKDIV=3 D2DCLKDIV=2 D2DCLKDIV=1 (fBUS) fD2D / MHz Divider for(87) D2DFCLK=512kHz Table 69. Recommended clock settings (continued) 50 49;50 48 47;48 46 45;46 44 43;44 42 41;42 40 39;40 48 47;48 36 35;36 34 33;34 32 31;32 30 29;30 28 27;28 26 25;26 24 23;24 22 21;22 20 19;20 18 17;18 16 15;16 14 13;14 12 11;12 10 9;10 8 7;8 6 5;6 4 4 Notes 87. For D2DCLKDIV=1 4.3.6 System resets To guarantee safe operation, several RESET sources have been implemented in the MM912_637 device. Both the MCU and the analog die are designed to initiate reset events on internal sources and the MCU is capable of being reset by external events including the analog die reset output. The analog die can be reset through RESETA in stop and cranking mode only. In normal mode, the MCU can reset the analog die only by writing 1 into HWR bit (remind the mask bit HWRM). MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.3.6.1 Device reset overview RESET RESET_A The MM912_637 reset concept includes two external reset signals, RESET (MCU) and RESET_A (analog Die). Figure 26 illustrates the general configuration. Reset Module Low Voltage Reset (LVR) Reset Module Power-On Reset (POR) External pin RESET Illegal Address Reset Clock monitor reset Hardware Reset Watchdog Reset Low Voltage Reset Thermal Shutdown Reset COP watchdog reset MCU Analog Die Figure 26. Device reset overview Both RESET and RESET_A signals are low active I/Os, based on the 5.0 V supply (VDDRX for RESET and VDDX for RESET_A). 4.3.6.2 Analog die reset implementation There are 7 internal reset sources implemented in the analog die of the MM912_637 that causing the internal analog die status to be reset to default (Internal analog RST), and to trigger an external reset, activating the RESET_A pin. In addition, during stop and cranking mode, an external reset at the RESET_A pin will also reset the analog die. VDDLR VDDHR 1 0 RESET_A 0 1 WDR tRSTRT HWR TSDR VDDXR VDDAR LPM Cranking Mode 1 0 Measure during LPM LPM = Low Power Mode Figure 27. Analog die reset implementation MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS The WDR and HWR will issue a reset on the RESET_A pin during tRSTRT (see Table 29). The other reset VDDLR, VDDHR, VDDXR, VDDAR, and TSDR will drive the RESET_A pin as long as the condition is present. During cranking mode (88), only the VDDLR is active. During Low Power modes, only VDDXR and VDDAR are active reset sources. VDDAR is only active during active measurement in LPM. VDDXR and VDDAR are not active in Normal mode. Notes 88. Not available on all device derivatives 4.3.6.3 * * * * * Reset source summary HWR - Hardware Reset -- Forced internal reset caused by writing the HWR bit in the PCR_CTL register. The source will be indicated by the HWRF bit. WDR - Watchdog Reset -- Window watchdog failure. The source will be indicated by the WDRF bit. LVR - Low Voltage Reset -- The Voltage at the VDDL, VDDH, VDDX, or VDDA has dropped below its reset threshold level. The source will be indicated for the VDDL by the LVRF + HVRF, for the VDDA by the AVRF, and for the VDDH by the HVRF bit. VDDX resets are not indicated via individual reset flags. See Figure 27 for dependencies. TSDR - Temperature Shutdown Reset -- The critical shutdown temperature threshold has been reached. VDDA, VDDX, and VDDH will be disabled as long as the overtemperature condition is pending(89) and the reset source is indicated by the HTF bit. External Reset -- During stop and cranking(89) mode, a low signal at the RESET_A pin will reset the analog die. Since this condition can only be initiated by the microcontroller, no specific indicator flag is implemented. Notes 89. Resulting in a VDDH Low Voltage Reset taking over the reset after the 2 LPCLK reset pulse TSDR HTF WDR WDRF HWR HWRF VDDHR HVRF VDDLR LVRF VDDAR AVRF VDDXR No Flag Indicator Figure 28. Reset status information 4.3.7 4.3.7.1 PCR - memory map and registers Overview This section provides a detailed description of the memory map and registers. 4.3.7.2 Module memory map The memory map for the Analog Die - Power, Clock and Resets - PCR module is given in Table 62 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 70. Module Memory Map Offset Name (90),(91) 0x00 PCR_CTL PCR Control Register 7 6 5 4 3 2 1 0 R 0 0 0 0 0 0 0 0 W HTIEM UVIEM HWRM 0 0 0 HWR 0 WDRF R W 0x02 0x03 PCR_SR (hi) R PCR Status Register W PCR_SR (lo) R PCR Status Register W HTIE UVIE HTF UVF HWRF WUAHTHF WUCTHF WUCALF PFM[1:0] OPMM[1:0] PF[1:0] OPM[1:0] HVRF LVRF WULTCF WLPMF WUPTB2F WUPTB1F WUPTB0F Write 1 will clear the flags WULINF WUPTB3F Write 1 will clear the flags R 0x04 PCR_PRESC PCR 1.0 ms prescaler W PRESC[15:0] R W 0x06 0x07 0x0E 0x0F PCR_WUE (hi) R Wake-up Enable Register W PCR_WUE (lo) R Wake-up Enable Register W TRIM_ALF (hi) R Trim for accurate 1.0 ms low freq clock W TRIM_ALF (lo) R Trim for accurate 1.0 ms low freq clock W WUAHTH WUCTH WUCAL WULIN WUPTB3 WUPTB2 WUPTB1 WUPTB0 0 0 0 0 0 0 0 0 0 WULTC PRDF APRESC[12:8] APRESC[7:0] Notes 90. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 91. Register Offset with the "lo" address value not shown have to be accessed in 16-Bit mode. 8-Bit access will not function. 4.3.7.3 Register descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. 4.3.7.3.1 PCR control register (PCR_CTL) Table 71. PCR control register (PCR_CTL) Offset , 0x00 (92) (93) Access: User read/write 15 14 13 12 11 10 9 8 R 0 0 0 0 0 0 0 0 W HTIEM UVIEM HWRM 0 Reset 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 HTIE UVIE 0 0 HWR 0 0 0 0 0 R W Reset PFM[1:0] OPMM[1:0] PF[1:0] 0 OPM[1:0] 0 0 0 Notes 92. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 93. Register Offset with the "lo" address value not shown have to be accessed in 16-Bit mode. 8-Bit access will not function. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 72. PCR control register (PCR_CTL) - register field descriptions Field Description 15 HTIEM High temperature interrupt enable mask 0 - writing the HTIE bit will have no effect 1 - writing the HTIE bit will be effective 14 UVIEM Supply undervoltage interrupt enable mask 0 - writing the UVIE bit will have no effect 1 - writing the UVIE bit will be effective 13 HWRM Hardware reset mask 0 - writing the HWR bit will have no effect 1 - writing the HWR bit will be effective 12 Reserved Reserved. Must remain "0" 11-10 PFM[1:0] Prescaler factor mask 00,01,10 - writing the PF bits will have no effect 1 - writing the PF bits will be effective 9-8 OPMM[1:0] Operation mode mask 00,01,10 - writing the OPM bits will have no effect 11 - writing the OPM bits will be effective 7 HTIE High Temperature Interrupt enable. Writing only effective with corresponding mask bit HTIEM set. 0 - High temperature interrupt (HTI) enabled 1 - High temperature interrupt (HTI) disabled 6 UVIE Low supply voltage interrupt enable. Writing only effective with corresponding mask bit UVIEM set. 0 - Low supply voltage interrupt (UVI) enabled 1 - Low supply voltage interrupt (UVI) disabled 5 HWR Hardware Reset. Writing only effective with corresponding mask bit HWRM set. Write only. 0 - No effect 1 - All analog die digital logic is reset and external reset (RESET_A) is set to reset the MCU. 4 Reserved 3-2 PF[1:0] 1-0 OPM[1:0] Reserved. Must remain "0" 1.0 ms Prescaler. Writing only effective with corresponding mask bits PFM set to 11. 00 - 1 01 - 2 10 - 4 11 - 8 Operation mode select. Writing only effective with "11" mask bits OPMM set to 11. 00 - Normal mode 01 - Stop mode 10 - Sleep mode 11 with Cranking feature disabled - same effect as 01 (STOP mode) 11 with Cranking feature enabled - Cranking mode MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.3.7.3.2 PCR status register (PCR_SR (hi)) Table 73. PCR status register (PCR_SR (hi)) Offset(94) 0x02 R Access: User read/write 7 6 5 4 3 2 1 0 HTF UVF HWRF WDRF HVRF LVRF WULTCF WLPMF 0/1 0 0 W Reset Write 1 will clear the 0 0 0/1 flags(95) 0/1 0/1 Notes 94. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 95. HTF and UVF represent the current status and cannot be cleared. Writing 1 to HTF / UVF will clear the Interrupt flag in the Interrupt Source Register and Interrupt Vector Register instead. Table 74. PCR status register (PCR_SR (hi)) - register field descriptions Field Description 7 HTF High Temperature Condition Flag. This bit is set once a temperature warning is detected, or the last reset being caused by a temperature shutdown event (TSDR). Writing HTF=1 will clear the flag and the interrupt flag in the Interrupt Source Register and Interrupt Vector Register, if the condition is gone. 0 - No High Temperature condition detected. 1 - High Temperature condition detected or last reset = TSDR. 6 UVF Supply Undervoltage Condition Flag. This bit is set once a undervoltage warning is detected. Writing UVF=1 will clear the flag and the Interrupt flag in the Interrupt Source Register and Interrupt Vector Register, if the condition is gone (UVF=0). 0 - No undervoltage condition detected. 1 - Undervoltage condition detected. 5 HWRF Hardware Reset Flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Last reset was caused by a HWR command. 4 WDRF Watchdog Reset Flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Last reset was caused by the analog die window watchdog. 3 HVRF VDDH Low Voltage Reset Flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Last reset was caused by a low voltage condition at the VDDH regulator. (LVRF = 0) 1 - Last reset was caused by a low voltage condition at the VDDL regulator. (LVRF = 1) 2 LVRF VDDL Low Voltage (POR) Reset Flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Last reset was caused by a low voltage condition at the VDDL regulator. (Power on Reset - POR) 1 WULTCF Life Time Counter Wake-up Flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Last Wake-up was caused by a life time counter overflow 0 WLPMF Wake-up after Low Power Mode Flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Indicates wake-up after Low Power mode. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.3.7.3.3 PCR status register (PCR_SR (lo)) Table 75. PCR status register (PCR_SR (lo)) Offset(96) 0x03 R Access: User read/write 7 6 5 4 3 2 1 0 WUAHTHF WUCTHF WUCALF WULINF WUPTB3F WUPTB2F WUPTB1F WUPTB0F 0 0 0 W Reset Write 1 will clear the flags 0 0 0 0 0 Notes 96. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 76. PCR status register (PCR_SR (lo)) - register field descriptions Field 7 WUAHTHF Description Wake-up on Ah counter threshold Flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Indicates wake-up after Ah counter threshold reached. 6 WUCTHF Wake-up on current threshold Flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Indicates wake-up after current threshold reached. 5 WUCALF Wake-up on calibration request flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Indicates wake-up after calibration request. 4 WULINF Wake-up on LIN flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Indicates wake-up after LIN wake-up detected 3 WUPTB3F Wake-up on GPIO 3 event (L0 external wake-up) flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Indicates wake-up after GPIO 3 event 2 WUPTB2F Wake-up on GPIO 2 event (TIMER output compare) flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Indicates wake-up after GPIO 2 event 1 WUPTB1F Wake-up on GPIO 1 event (TIMER output compare) flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Indicates wake-up after GPIO 1 event 0 WUPTB0F Wake-up on GPIO 0 event (TIMER output compare) flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Indicates wake-up after GPIO 0 event MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.3.7.3.4 PCR 1.0 ms prescaler (PCR_PRESC) Table 77. PCR 1.0 ms Prescaler (PCR_PRESC) Offset (97),(98) Access: User read/write 0x04 15 14 13 12 R 11 10 9 8 PRESC[15:8] W Reset 0 1 1 1 1 1 0 1 7 6 5 4 3 2 1 0 0 0 0 0 R PRESC[7:0] W Reset 0 0 0 0 Notes 97. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 98. This Register is 16 Bit access only. Table 78. PCR 1.0 ms prescaler (PCR_PRESC) - register field descriptions Field 15-0 PRESC[15:0] Description 1.0 ms Prescaler, used to derive D2DSCLK and D2DFCLK from the D2DCLK signal. See 4.3.5, "Device clock tree" for details. 4.3.7.3.5 Wake-up enable register (PCR_WUE (hi)) Table 79. Wake-up enable register (PCR_WUE (hi)) Offset(99) 0x06 R W Reset Access: User read/write 7 6 5 4 3 2 1 0 WUAHTH WUCTH WUCAL WULIN WUPTB3 WUPTB2 WUPTB1 WUPTB0 0 0 0 0 0 0 0 0 Notes 99. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 80. Wake-up enable register (PCR_WUE (hi)) - register field descriptions Field 7 WUAHTH Description 0 - Wake-up on Ah counter disabled 1 - Wake-up on Ah counter enabled 6 WUCTH 0 - Wake-up on current threshold disabled 1 - Wake-up on current threshold enabled 5 WUCAL 0 - Wake-up on calibration request disabled 1 - Wake-up on calibration request enabled 4 WULIN 0 - Wake-up on LIN disabled 1 - Wake-up on LIN enabled 3 WUPTB3 0 - Wake-up on GPIO 3 event disabled 1 - Wake-up on GPIO 3 event enabled MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 80. Wake-up enable register (PCR_WUE (hi)) - register field descriptions (continued) Field Description 2 WUPTB2 0 - Wake-up on GPIO 2 event disabled 1 - Wake-up on GPIO 2 event enabled 1 WUPTB1 0 - Wake-up on GPIO 1 event disabled 1 - Wake-up on GPIO 1 event enabled 0 WUPTB0 0 - Wake-up on GPIO 0 event disabled 1 - Wake-up on GPIO 0 event enabled 4.3.7.3.6 Wake-up enable register (PCR_WUE (lo)) Table 81. Wake-up enable register (PCR_WUE (lo)) Offset(100) 0x07 Access: User read/write 7 R W WULTC Reset 0 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Notes 100. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 82. Wake-up enable register (PCR_WUE (lo)) - register field descriptions Field 7 WULTC Description 0 - Wake-up on Life Timer Counter Overflow disabled 1 - Wake-up on Life Timer Counter Overflow enabled 4.3.7.3.7 Trim for accurate 1.0 ms low freq clock (TRIM_ALF (hi)) Table 83. Trim for accurate 1.0 ms low freq clock (TRIM_ALF (hi)) Offset(101) 0x0E R Access: User read 15 14 13 PRDF 0 0 12 11 10 9 8 APRESC[12:8] W Notes 101. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 4.3.7.3.8 Trim for accurate 1.0 ms low freq clock (TRIM_ALF (lo)) Table 84. Trim for accurate 1.0 ms low freq clock (TRIM_ALF (lo)) Offset(102) 0x0F Access: User read 7 R 6 5 4 3 2 1 0 APRESC[7:0] W Notes 102. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 85. Trim for accurate 1.0 ms low freq clock (TRIM_ALF (lo)) - register field descriptions Field Description ALFCLK Prescaler ready Flag 0 - The ALFCLK synchronization after power up or PRESC[15:0] / PF[1:0] change is not completed. 1 - The ALFCLK synchronization is complete. The ALFCLK signal is synchronized to the D2DCLK. 15 PRDF 12-0 APRESC[12:0] 4.4 ALFCLK Prescaler This read only value represents the current ALFCLK prescaler value. With the synchronization complete (PRDF=1), the prescaler is used to create the calibrated clock for the Life Time Counter (Normal mode and Low Power mode), and Timer and Current trigger (Low Power Mode only), based on the low power oscillator. After Power Up, the APRESC register is reset to 0x0200 (512dec) until the first synchronization is complete. This will initialize the ALFCLK to 1.0 kHz. Interrupt module - IRQ 4.4.1 Introduction Several interrupt sources are implemented on the analog die to indicate important system conditions. Those Interrupt events are signalized via the D2DINT signal to the microcontroller. See Section 4.18, "MCU - interrupt module (S12S9S12I128PIMV1V1)". 4.4.2 Interrupt source identification Once an Interrupt is signalized, there are two options to identify the corresponding source(s). NOTE The following Interrupt source registers (Interrupt Source Mirror and Interrupt Vector Emulation by Priority) are indicators only. After identifying the interrupt source, the acknowledgement of the interrupt has to be performed in the corresponding block. 4.4.2.1 Interrupt source mirror All Interrupt sources in the MM912_637 analog die are mirrored to a special Interrupt Source Register (INT_SRC). This register is read only and will indicate all currently pending Interrupts. Reading this register will not acknowledge any interrupt. An additional D2D access is necessary to serve the specific module. 4.4.2.2 Interrupt vector emulation by priority To allow a vector based interrupt handling by the MCU, the number of the highest prioritized interrupt pending is returned in the Interrupt Vector Register (INT_VECT). Reading this register will not acknowledge an interrupt. An additional D2D access is necessary to serve the specific module. 4.4.3 Interrupt global mask The Global Interrupt mask registers INT_MSK (hi) and INT_MSK (lo) are implemented to allow a global enable / disable of all analog die Interrupt sources. The individual blocks mask registers should be used to control the individual sources. 4.4.4 Interrupt sources The following Interrupt sources are implemented on the analog die. Table 86. Interrupt sources IRQ Description UVI Undervoltage Interrupt (or wake-up from Cranking mode) HTI High Temperature Interrupt MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 86. Interrupt sources IRQ LTI Description LIN Driver Overtemperature Interrupt CH0 TIM Channel 0 Interrupt CH1 TIM Channel 1 Interrupt CH2 TIM Channel 2 Interrupt CH3 TIM Channel 3 Interrupt TOV TIM Timer Overflow Interrupt ERR SCI Error Interrupt TX SCI Transmit Interrupt RX SCI Receive Interrupt CVMI Current / Voltage Measurement Interrupt LTC Lifetime Counter Interrupt CAL Calibration Request Interrupt 4.4.4.1 Undervoltage interrupt (UVI) This maskable interrupt signalizes a undervoltage condition on the VSUP supply input. Acknowledge the interrupt by writing a 1 into the UVF Bit in the PCR Status Register (PCR_SR (hi)). The flag cannot be cleared as long as the condition is present. To issue a new interrupt, the condition has to vanish and occur again. The UVF Bit represents the current condition, and might not be set after an interrupt was signalized by the interrupt source registers. See Section 4.3, "Analog die - power, clock and resets - PCR" for details on the PCR Status Register (PCR_SR (hi)), including masking information. NOTE The undervoltage interrupt is not active in devices with the Cranking mode enabled. For those devices, the undervoltage threshold is used to enable the high precision low voltage threshold during Stop/Sleep mode. Once the device wakes up from cranking mode, the UVI flag is indicating the wake-up source. 4.4.4.2 High temperature interrupt (HTI) This maskable interrupt signalizes a high temperature condition on the analog die. The sensing element is located close to the major thermal contributors, the system voltage regulators. Acknowledge the interrupt by writing a 1 into the HTF Bit in the PCR Status Register (PCR_SR (hi)). The flag cannot be cleared as long as the condition is present. To issue a new interrupt, the condition has to vanish and occur again. The HTF Bit represents the current condition and might not be set after an interrupt was signalized by the interrupt source registers. See Section 4.3, "Analog die - power, clock and resets - PCR" for details on the PCR Status Register (PCR_SR (hi)), including masking information. 4.4.4.3 LIN driver overtemperature interrupt (LTI) Acknowledge the interrupt by reading the LIN Register - LINR. The flag cannot be cleared as long as the condition is present. To issue a new interrupt, the condition has to vanish and occur again. See Section 4.12, "LIN" for details on the LIN Register, including masking information. 4.4.4.4 TIM channel 0 interrupt (CH0) See Section 4.10, "Basic timer module - TIM (TIM16B4C)". 4.4.4.5 TIM channel 1 interrupt (CH1) See Section 4.10, "Basic timer module - TIM (TIM16B4C)". MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.4.4.6 TIM channel 2 interrupt (CH2) See Section 4.10, "Basic timer module - TIM (TIM16B4C)". 4.4.4.7 TIM channel 3 interrupt (CH3) See Section 4.10, "Basic timer module - TIM (TIM16B4C)". 4.4.4.8 TIM timer overflow interrupt (TOV) See Section 4.10, "Basic timer module - TIM (TIM16B4C)". 4.4.4.9 SCI error interrupt (ERR) See Section 4.13, "Serial communication interface (S08SCIV4)". 4.4.4.10 SCI transmit interrupt (TX) See Section 4.13, "Serial communication interface (S08SCIV4)". 4.4.4.11 SCI receive interrupt (RX) See Section 4.13, "Serial communication interface (S08SCIV4)". 4.4.4.12 Current/voltage measurement interrupt (CVMI) Indicates the current or voltage measurement finished (VM or CM bit set). See Section 4.8, "Channel acquisition". 4.4.4.13 Life time counter interrupt (LTC) In case a Life Time Counter overflow occurs with the corresponding interrupt enabled, the LTC interrupt is issued. See Section 4.14, "Life time counter (LTC)". 4.4.4.14 Calibration request interrupt (CAL) Once a request for re-calibration is present (Temperature out of pre-set range), the Calibration Interrupt is issued. After a calibration wake-up, the reading of ACQ_ITEMP must be done after waiting for the latency of the temperature acquisition chain. Then ACQ_ITEMP is valid to adjust the compensation over temperature. See full documentation on the interrupt source inSection 4.8, "Channel acquisition". 4.4.5 4.4.5.1 IRQ - memory map and registers Overview This section provides a detailed description of the memory map and registers. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.4.5.2 Module memory map The memory map for the IRQ module is given in Table 62 Table 87. Module memory map Offset(103) Name 0x08 0x09 0x0A INT_SRC (hi) R Interrupt source register W INT_SRC (lo) R Interrupt source register W INT_VECT R Interrupt vector register W 0x0B 0x0C 0x0D 7 6 4 3 2 1 0 TOV CH3 CH2 CH1 CH0 LTI HTI UVI 0 0 CAL LTC CVMI RX TX ERR 0 0 0 0 0 0 0 0 0 0 0 0 TOVM CH3M CH2M CH1M CH0M LTIM HTIM UVIM 0 0 CALM LTCM CVMM RXM TXM ERRM R Reserved 5 IRQ[3:0] W INT_MSK (hi) R Interrupt mask register W INT_MSK (lo) R Interrupt mask register W Notes 103. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 4.4.5.3 Register descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. 4.4.5.3.1 Interrupt source register (INT_SRC (hi)) Table 88. Interrupt source register (INT_SRC (hi)) Offset(104) 0x08 R Access: User read 7 6 5 4 3 2 1 0 TOV CH3 CH2 CH1 CH0 LTI HTI UVI W Notes 104. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 89. Interrupt Source Register (INT_SRC (hi)) - register field descriptions Field Description 7 TOV TIM16B4C - Timer overflow interrupt status 0 - No timer overflow interrupt pending 1 - Timer overflow interrupt pending 6 CH3 TIM16B4C - TIM channel 3 interrupt status 0 - No channel 3 interrupt pending 1 - Channel 3 interrupt pending MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 89. Interrupt Source Register (INT_SRC (hi)) - register field descriptions (continued) Field Description 5 CH2 TIM16B4C - TIM channel 2 interrupt status 0 - No channel 2 interrupt pending 1 - Channel 2 interrupt pending 4 CH1 TIM16B4C - TIM channel 1 interrupt status 0 - No channel 1 interrupt pending 1 - Channel 1 interrupt pending 3 CH0 TIM16B4C - TIM channel 0 interrupt status 0 - No channel 0 interrupt pending 1 - Channel 0 interrupt pending 2 LTI LIN Driver overtemperature interrupt status 0 - No LIN driver overtemperature interrupt 1 - LIN driver overtemperature interrupt 1 HTI High temperature interrupt status 0 - No high temperature interrupt pending 1 - High temperature interrupt pending 0 UVI Undervoltage interrupt pending or wake-up from Cranking mode status 0 - No undervoltage Interrupt pending or wake-up from Cranking mode 1 - Undervoltage interrupt pending or wake-up from Cranking mode 4.4.5.3.2 Interrupt source register (INT_SRC (lo)) Table 90. Interrupt source register (INT_SRC (lo)) Offset(105) 0x09 R Access: User read 7 6 5 4 3 2 1 0 0 0 CAL LTC CVMI RX TX ERR W Notes 105. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 91. Interrupt source register (INT_SRC (lo)) - register field descriptions Field Description 5 CAL Calibration request interrupt status 0 - No calibration request interrupt pending 1 - Calibration request interrupt pending 4 LTC Life time counter interrupt status 0 - No life time counter interrupt pending 1 - Life time counter interrupt pending 3 CVMI 2 RX Current / Voltage measurement interrupt status 0 - No Current / Voltage measurement interrupt pending 1 - Current / Voltage measurement interrupt pending SCI receive interrupt status 0 - No SCI receive interrupt pending 1 - SCI receive interrupt pending MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 91. Interrupt source register (INT_SRC (lo)) - register field descriptions (continued) Field Description 1 TX SCI transmit interrupt status 0 - No SCI transmit interrupt pending 1 - SCI transmit interrupt pending 0 ERR SCI error interrupt status 0 - No SCI transmit interrupt pending 1 - SCI transmit interrupt pending 4.4.5.3.3 Interrupt vector register (INT_VECT) Table 92. Interrupt vector register (INT_VECT) Offset(106) 0x0A R Access: User read 7 6 5 4 0 0 0 0 3 2 1 0 IRQ W Notes 106. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 93. Interrupt vector register (INT_VECT) - register field descriptions Field 4-0 IRQ Description Represents the highest prioritized interrupt pending. See Table 94. If no interrupt is pending, the result will be 0. Table 94. Interrupt vector/priority IRQ IRQ Priority No interrupt pending or wake-up from Stop mode 0x00 - UVI Undervoltage interrupt or wake-up from Cranking mode 0x01 1 (highest) HTI High temperature interrupt 0x02 2 LTI LIN driver overtemperature interrupt 0x03 3 CH0 TIM channel 0 interrupt 0x04 4 CH1 TIM channel 1 interrupt 0x05 5 CH2 TIM channel 2 interrupt 0x06 6 CH3 TIM channel 3 interrupt 0x07 7 TOV TIM timer overflow interrupt 0x08 8 ERR SCI error interrupt 0x09 9 TX SCI transmit interrupt 0x0A 10 RX SCI receive interrupt 0x0B 11 CVMI Acquisition interrupt 0x0C 12 LTC Life time counter interrupt 0x0D 13 CAL Calibration request interrupt 0x0E 14 (lowest) - Description MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.4.5.3.4 Interrupt mask register (INT_MSK (hi)) Table 95. Interrupt mask register (INT_MSK (hi)) Offset(107) 0x0C R W Access: User read/write 7 6 5 4 3 2 1 0 TOVM CH3M CH2M CH1M CH0M LTIM HTIM UVIM 0 0 0 0 0 0 0 0 Reset Notes 107. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 96. Interrupt mask register (INT_MSK (hi)) - register field descriptions Field Description 7 TOVM Timer overflow interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 6 CH3M Timer channel 3 interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 5 CH2M Timer channel 2 interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 4 CH1M Timer channel 1 interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 3 CH0M Timer channel 1 interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 2 LTIM LIN driver overtemperature interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 1 HTIM High temperature interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 0 UVIM Undervoltage interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 4.4.5.3.5 Interrupt mask register (INT_MSK (lo)) Table 97. Interrupt mask register (INT_MSK (lo)) Offset(108) 0x0D R Access: User read/write 7 6 0 0 0 0 W Reset 5 4 3 2 1 0 CALM LTCM CVMM RXM TXM ERRM 0 0 0 0 0 0 Notes 108. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 98. Interrupt mask register (INT_MSK (lo)) - register field descriptions Field Description 5 CALM Calibration request interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 4 LTCM Life time counter interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 3 CVMM Current / Voltage measurement interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 2 RXM SCI receive interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 1 TXM SCI transmit interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled 0 ERRM 4.5 SCI error interrupt mask 0 - Interrupt enabled 1 - Interrupt disabled Current measurement - ISENSE 4.5.1 Introduction This chapter only gives a summary of the current sense module. Refer to Section 4.8, "Channel acquisition" for the complete description of all acquisition channels, including the current measurement channel. 4.5.1.1 * * * * * * * * * * * Features Dedicated 16 Bit Sigma Delta () ADC Programmable Gain Amplifier (PGA) with 8 programmable gain factors Gain Control Block (GCB) for automatic gain adjustment Simultaneous Sampling with Voltage Channel Programmable Gain and Offset Compensation Optional Chopper Mode with moving average SINC3 + IIR Stage Calibration mode to compute compensation buffers Programmable Low Pass Filter (LPF), configuration shared with the Voltage Measurement Channel Optional Shunt resistor sensing feature Triggered Sampling during Low Power Mode with programmable wake-up conditions MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.5.1.2 Block diagram PGA Auto Zero Battery Minus Pole ESD Input Swap ISENSEL RSHUNT PGA Compensation Decimation with IIR LPF 24Bit ESD ISENSEH GCB Chassis Ground Vref Digital Chopper Figure 29. Current measurement channel The battery current is measured by measuring the voltage drop VDROP over an external shunt resistor, connected to ISENSEH and ISENSEL. VDROP, and is defined as the differential voltage between the ISENSEL and ISENSEH inputs (VDROP=ISENSEL-ISENSEH). A positive voltage drop means a positive current is flowing, and vice versa. If the GND pin of the module is connected to ISENSEH, the measured current includes the supply current of the MM912_637 (current flows back to negative battery pole). If the GND pin is connected to the ISENSEL input, the supply current of the MM912_637 is not measured. However, the voltage at the ISENSEH input could go below GND (see max ratings). In this case, the current measurement still functions as specified. 4.6 Voltage measurement - VSENSE 4.6.1 Introduction This chapter only gives a summary of the voltage sense module. Refer to Section 4.8, "Channel acquisition" for the complete description of all acquisition channels, including the voltage measurement channel. 4.6.1.1 * * * * * * * * * Features Dedicated 16 Bit Sigma Delta () ADC Fixed High Precision Divider Optional External Voltage Input "VOPT" Simultaneous Sampling with Current Channel Programmable Gain and Offset Compensation Calibration mode to compute compensation buffers Optional Chopper mode with moving average SINC3 + IIR Stage Programmable Low Pass Filter (LPF), Configuration shared with Current Measurement Channel MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.6.1.2 Block diagram VOPT Input Swap ESD DIV28 MUX Compensation DIV28 VSENSE Decimator with IIR LPF 16Bit ESD Vref Digital Chopper Figure 30. Voltage Measurement Channel The battery voltage is measured by default, via the VSENSE input. A high precision divider stage scales down the battery voltage by a fixed factor K =1/28, to a voltage below the internal reference voltage of the Sigma Delta ADC (VSENSE*K < VREF). If an optional external voltage is measured, the multiplexer (MUX) is selected to feed the VOPT input to the buffer. 4.7 Temperature measurement - TSENSE 4.7.1 Introduction This chapter only gives a summary of the temperature sense module. Refer to Section 4.8, "Channel acquisition" for the complete description of all acquisition channels, including the temperature measurement channel. 4.7.1.1 * * * * * * Features Internal on chip Temperature Sensor Optional External Temperature Sensor Input (VTEMP) Dedicated 16-Bit Sigma Delta ADC Programmable Gain and Offset Compensation Optional External Sensor Supply (TSUP) with selectable capacitor Optional Measurement during Low Power mode to trigger recalibration 4.7.1.2 Block diagram TSUP internal TempSense R1 Input Swap TSUP MUX Compensation Decimation 16Bit VTEMP ESD CTSUP RVTEMP Vref R2 Digital Chopper AGND Figure 31. Temperature measurement channel NOTE To minimize ground shift effects while using the external sensor option, R2 must be placed as close to the AGND pin as possible. CTSUP is optional. The supply output must be configured to operate with the capacitor. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.8 Channel acquisition 4.8.1 Introduction This chapter documents the current, voltage, and temperature acquisition flow. The chapter is structured in the following sections. * Section 4.8.2, "Channel structure overview" * Section 4.8.3, "Current and voltage measurement" -- Section 4.8.3.1, "Shunt sense, PGA, and GCB (current channel only)" -- Section 4.8.3.2, "Voltage sense multiplexer (voltage channel only)" -- Section 4.8.3.3, "Sigma delta converter" -- Section 4.8.3.4, "Compensation" -- Section 4.8.3.5, "IIR/decimation/chopping stage" -- Section 4.8.3.6, "Low pass filter" -- Section 4.8.3.7, "Format and clamping" * Section 4.8.4, "Temperature measurement channel" -- Section 4.8.4.1, "Compensation" * Section 4.8.5, "Calibration" * Section 4.8.6, "Memory map and registers" 4.8.2 Channel structure overview The MM912_637 offers three parallel measurement channels. Current, Voltage, and Temperature. The Voltage Channel is shared between the VSENSE and VOPT voltage source, the Temperature channel between ETEMP and ITEMP. I V T PGA SD SD SD 1 10 8 Gain (IGCx) Offset (COC) 1 10 8 Gain (VSGC) Offset (VOC) SINC3 +IIR SINC1 LPF Format & Clamp SINC3 +IIR SINC1 LPF Format & Clamp SINC1 Format & Clamp SINC3 1 8 Gain (ITGC/ ETGC) 24 16 16 8 Offset (ITOC/ ETOC) Figure 32. Simplified measurement channel Figure 33 shows an overview of the detailed dependencies between the control and status registers and the channels. Refer to the following sections of this chapter for details. MM912_637 25 NXP Semiconductors ESD ESD ESD ESD VSENSE VTEMP TSUP ESD ISENSEH VOPT ESD ISENSEL ECAP(M) Internal TEMP Sensor DIAGI(M) VMEN(M) TSUP ETEMP ITEMP OPTE(M) DIV28 DIV28 PGAO(M) PGAZ(M) OPEN OPENE(M) Open Test PGAF(M) R/W R R/W R/W R/W R/W R/W R/W ITMEN(M) ETMEN(M) PGA Offset Cal. Cal Ref Diag R/W R/W CDEN(M) CADCG(M) PGAG MUX MUX VADCG(M) DIAGV(M) Cal Ref ITCHOP(M) ETCHOP(M) TDEN(M) TADCG(M) VDEN(M) ZERO(M) PGAOF PGAOC4..512[10:0] PGA G C B R/W R/W Short R/W R/W R/W R/W 000 R R R/W R/W R/W Diag D R/W R/W R/W R/W R/W Short Short R/W R/W Chopper Control ADC Ref Chopper Control ADC Ref 1 Bit 1 Bit R/W R/W 200 ETCHOP ITCHOP 80 80 IIRC(M)[2:0] DBT(M)[1:0] 00 R/W R/W Voltage Measurement Control Temperature Measurement Control 00 R/W R/W R/W 00 R/W SINC1 L=2 16 Bit DEC[2:0] SINC1 L=4 ITM Calibration Request ITEMP[15:0] SINC1 L=4 ETEMP[15:0] ETM TMF[2:0] TCMIN[15:0] TCMAX[15:0] Format & Clamp Gain and Offset Compensation, Sinc 3 Filter, and IIR Filter Block 00 Gain and Offset Compensation and Sinc 3 Filter 200 R/W Gain and Offset Compensation, Sinc 3 Filter, and IIR Filter Block R/W R/W VCHOP CVCHOP(M) R 1 Bit R/W R R/W R/W AGEN(M) ITGC[7:0] A7[15:0] A6[15:0] A5[15:0] A4[15:0] A3[15:0] A2[15:0] A1[15:0] A0[15:0] LPFEN(M) 0 1 R/W LPF R/W 24 Bit 16 Bit PRESC[15:0] PF[1:0] Clock Control BGCAL(M)[1:0] BGLDO BGADC[1:0] VM AHTH[30:0] TCMP[15:0] Low Power Current measurement result AHCR(M) THF[7:0] CTH[7:0] AHC[31:0] Current Threshold Wake Up AH Threshold Wake Up Calibration Wake Up PRDF AVRF BGRF BG1EN BG2EN BG3EN =1 APRESC[12:0] VMOW VTH VOLT[15:0] =? CMOW CM CURR[23:0] BG Control Format & Clamp 0xDAC0 Format & Clamp R Wake Up Control (low power mode only) Cal Ref ADC Ref A15[15:0] A14[15:0] A13[15:0] A12[15:0] A11[15:0] A10[15:0] A9[15:0] A8[15:0] LPFC[3:0] Calibration Interrupt CALF LPF R/W R/W R/W R/W R/W R/W R/W R/W 00B 041 0A4 0E3 0212 0812 1021 5 B 4 5 IGAIN[2:0] ETGC[7:0] R ETOC[7:0] R COC4..512[7:0] VOC[7:0] IGC4..512[9:0] VSGC[9:0] TCOMP(M) ITOC[7:0] CCOMP(M) VCOMP(M) 0A4 041 00B 0812 0212 4 B 5 10E 0E3 1021 4 5 CCHOP 0000 0000 R/W R R CALIE(M) Chopper Control R R 0000 W R/W R/W R/W R/W R/W R R R/W R/W R/W R/W R/W R/W R/W R/W R/W R R R R/W R/W R R R/W R R R R R R R R R/W R/W R/W R/W Current Measurement Control 0 1 CVMIE(M) NXP Semiconductors R/W CMEN(M) ELECTRICAL CHARACTERISTICS Figure 33. Channel complete overview MM912_637 24 ELECTRICAL CHARACTERISTICS 4.8.3 Current and voltage measurement To guarantee synchronous voltage and current acquisition, both channels are implemented equal in terms of digital signal conditioning and timing. The analog signal conditioning, before the Sigma Delta Converter, is different to match the different sources. 4.8.3.1 Shunt sense, PGA, and GCB (current channel only) Current Channel specific analog signal conditioning. 4.8.3.1.1 Shunt sense An optional current sense feature is implemented to sense the presence of the current shunt resistor. Setting the OPEN bit (ACQ_CTL register), will activate the feature. The OPEN bit (ACQ_SR register) will indicate the shunt resistor open. The sense feature will detect an open condition for a shunt resistance RSHUNT > ROPEN. 4.8.3.1.2 Programmable gain amplifier (PGA) To allow a wide range of current levels to be measured, a programmable gain amplifier is implemented. Following the input chopper (see Section 4.8.3.5, "IIR/decimation/chopping stage"), the differential voltage is amplified by one of the 8 gains controlled by the Gain Control Block. The PGA has an internal offset compensation feature - see Section 4.8.4.1, "Compensation" and Section 4.8.5, "Calibration" for details. 4.8.3.1.3 Gain control block (GCB) To allow a transparent Gain adjustment with minimum MCU load, an automatic gain control has been implemented. The absolute output of the PGA is constantly compared with a programmable up and down threshold (ACQ_GCB register). The threshold is a D/A output according Table 99. Table 99. Gain control block - register ACQ_GCB D[7:0] GCB high (up) threshold ACQ_GCB D[7:0] GCB low (down) threshold 0000xxxx 1/16 VREF xxxx0000 0 0001xxxx 2/16 VREF xxxx0001 1/16 VREF 0010xxxx 3/16 VREF xxxx0010 2/16 VREF 0011xxxx 4/16 VREF xxxx0011 3/16 VREF 0100xxxx 5/16 VREF xxxx0100 4/16 VREF 0101xxxx 6/16 VREF xxxx0101 5/16 VREF 0110xxxx 7/16 VREF xxxx0110 6/16 VREF 0111xxxx 8/16 VREF xxxx0111 7/16 VREF 1000xxxx 9/16 VREF xxxx1000 8/16 VREF 1001xxxx 10/16 VREF xxxx1001 9/16 VREF 1010xxxx 11/16 VREF xxxx1010 10/16 VREF 1011xxxx 12/16 VREF xxxx1011 11/16 VREF 1100xxxx 13/16 VREF xxxx1100 12/16 VREF 1101xxxx 14/16 VREF xxxx1101 13/16 VREF 1110xxxx 15/16 VREF xxxx1110 14/16 VREF 1111xxxx 16/16 VREF xxxx1111 15/16 VREF Once the programmed threshold is reached, the gain is adjusted to the next level. The currently active gain setting can be read in the IGAIN[2:0] register. Once the gain has been adjusted by the GCB, the PGAG bit will be set. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS The automatic Gain Control can be disabled by clearing the AGEN bit. In this case, writing the IGAIN[2:0] register will allow manual gain control. NOTE The IGAIN[2:0] register content does determine the offset compensation register access, as there are 8 individual offset register buffers implemented, accessed through the same COC[7:0] register. 4.8.3.2 Voltage sense multiplexer (voltage channel only) A multiplexer has been implemented to select between the VSENSE or VOPT voltage input. The OPTE bit controls the multiplexer. Both input signals are divided by a fixed DIV28 divider. NOTE There is no further state machine separation of the two voltage channels. The software has to assure all compensation registers are configured properly after changing the multiplexer. Both voltage source conversion results will be stored in the same result register. The divided and multiplexed voltages will be routed through the optional chopper (see Section 4.8.3.5, "IIR/decimation/chopping stage") before entering the Sigma Delta converter stage. 4.8.3.3 Sigma delta converter 4.8.3.3.1 Overview A high resolution ADC is needed for current and battery voltage measurements of the MM912_637. A second order sigma delta modulator based architecture is chosen. 4.8.3.4 Compensation Following the optional chopper stage, the sigma delta bit stream is first gain and then offset compensated using the compensation registers. The compensation stages for both channels can be completely bypassed by clearing the CCOMP / VCOMP bits. 4.8.3.4.1 Gain compensation Table 100 shows the gain compensation register for the current and voltage channel. At system startup, the factory trimmed values have to be copied into the VSGC and IGCx registers (see Section 5.2, "IFR trimming content and location"). NOTE There are 8 individual Gain compensation registers for the current measurement channels different PGA gains with 8 individual gain trim values present in the IFR trimming flash. Based on the voltage channel multiplexer configuration, a different trim gain compensation value has to be used in the compensation register. The compensation register content has to be updated when changing the multiplexer setting. Table 100. Gain compensation - voltage and current channel VSGC[9:0] IGCx[9:0] Voltage channel gain Current channel gain 0x3FF 1.3174 1.7832 0x3FE 1.3169 1.7822 0x3FD 1.3164 1.7812 . . . . . . 0x203 1.0694 1.2872 0x202 1.0689 1.2862 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 100. Gain compensation - voltage and current channel (continued) VSGC[9:0] IGCx[9:0] Voltage channel gain Current channel gain 0x201 1.0684 1.2852 0x200 (default) 1.0679 1.2842 0x1FF 1.0674 1.2832 0x1FE 1.0669 1.2822 0x1FD 1.0664 1.2812 . . . . . . 0x002 0.8189 0.7862 0x001 0.8184 0.7852 0x000 0.8179 0.7842 4.8.3.4.2 Offset compensation Table 101 shows the offset compensation register for the current and voltage channel. At system startup, the factory trimmed values have to be copied into the VOC and COC registers (see Section 5.2, "IFR trimming content and location"). NOTE Based on the voltage channel multiplexer and copper configuration, a different trim offset compensation value has to be used in the compensation register. The compensation register content has to be updated when changing the multiplexer setting. While there is only one offset compensation register VOC[7:0] for the voltage channel, there are 8 individual offset compensation registers for the current channel. The access happens through the COC[7:0] register mapped, based on the IGAIN[2:0] register content. Table 101. Offset compensation - voltage and current channel VOC[7:0] COC[7:0] Voltage channel offset(109) Current channel offset(109) 0x7F +9.073 +15.092 0x7E +9.002 +14.974 0x7D +8.93 +14.855 . . . . . . 0x03 0.214 +0.357 0x02 0.143 +0.238 0x01 0.071 +0.119 0x00 (default) 0 0 0xFF -0.071 -0.119 0xFE -0.143 -0.238 0xFD -0.214 -0.357 . . . . . . 0x82 -9.002 -14.974 MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 101. Offset compensation - voltage and current channel (continued) VOC[7:0] COC[7:0] Voltage channel offset(109) Current channel offset(109) 0x81 -9.073 -15.092 0x80 -9.145 -15.211 Notes 109. SD input related (mV) 4.8.3.5 4.8.3.5.1 IIR/decimation/chopping stage Functional description The chopper frequency is set to one eighth of the decimator frequency (512 kHz typ). On each phase, four decimation cycles are necessary to get a steady signal. The equation of the IIR is yn+1=.xn+(1-).yn. The parameter can be configured by the IIRC[2:0] register. See Section 4.8.6.3.18, "I and V chopper control register (ACQ_CVCR (lo))". The decimation process is then completed by a programmable (DEC[2:0]) sinc3 filter, which outputs a 0.5...8 kS/s signal. The modulated noise is removed by an averaging filter (SINC1; L=4), which has an infinite rejection at the chopping frequency. 4.8.3.5.2 * * Latency and throughput The throughput is 512 kHz/DF with DF configurable from 64 to 1024. The latency is given by (4+3*IIR+3*Avger+N_LPF)*DF/512 kHz where: -- IIR=1 if IIR is enabled (0 otherwise), -- Avger=1 if the chopper mode is activated (0 otherwise), -- N_LPF is the LPF coefficient number. 4.8.3.6 Low pass filter To achieve the required attenuation of the measured voltage and current signals in the frequency domain, a programmable low-pass filter following the SINC3+IIR filter, is implemented for both channels with shared configuration registers to deliver the equivalent filtering. The following filter characteristic is implemented: * FPASS = 100 Hz (Att100 Hz) * FSTOPP = 500 Hz (Att500 Hz) The number of filter coefficients used can be programmed in the ACQ_LPFC[3:0] register. The filter can be bypassed completely clearing the LPFEN bit. The filter uses an algorithmic and logic unit (ALU) for calculating the filtered output data, depending on the incoming data stream at "DATA IN" and the low-pass coefficients (A0...15) at the input "COEFF", 16-bit width of each coefficient (See 4.8.6.3.22, "Low pass filter coefficient Ax (LPF_Ax (hi))"). The filter structure calculates during one cycle (Tcyc=1/Fadc) the filtered data output. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Y(n) + + + a0 a1 a2 Z-1 Z-1 ...... ...... Z-1 Z-1 + + + a13 a14 a15 Z-1 Z-1 ...... Z-1 Z-1 Z-1 Z-1 X(n) y(n) = a0.x(n)+a1.x(n-1)+a2.x(n-2)+a3.x(n-3)+a4.x(n-4)+a5.x(n-5)+a6.x(n-6)+a7.x(n-7) +a8.x(n-8)+a9.x(n-9)+a10.x(n-10)+a11.x(n-11)+a12.x(n-12)+a13.x(n-13)+a14.x(n-14)+a15.x(n-15) Figure 34. FIR structure Z-1 Unit delay is done at a programmable frequency, depending on the decimation factor programmed in the DEC[2:0] register. See Table 119. NOTE There is no decimation from SINC3 to the LPF output, LPF uses same output rate than decimator. It's therefore possible to select an output update rate independent of the filter characteristic and bandwidth. The coefficient vector consists of 16*16-bit elements and is free programmable, the maximum response time for 16 coefficients structure is 16*1/output rate. The following filter function can be realized. M H LP ( z ) = ai * z -i i =0 LP filter function Eqn. 3 The coefficients aj are the elements of the coefficient vector and determine the filter function. M <= 16. It's possible to realize FIR filter functions. A typical total frequency response of the decimator and the programmable LP filter is given in Figure 35. 0 0 20 40 Gto t ( f) 60 80 - 100 1 00 10 10 1 .10 1 00 f 3 1 .1 0 4 1 0000 Figure 35. Typical total filter response Sinc3 (D=128), LP filter (FIR type with 15 coefficients used) MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.8.3.7 Format and clamping The output data stream is formatted into its final size for both channels (16-Bit for Voltage and 24-Bit for Current). The current result will contain the gain information as part of the result. See Section 4.8.6.3.12, "Current measurement result (ACQ_CURR1 / ACQ_CURR0)" and Section 4.8.6.3.13, "Voltage measurement result (ACQ_VOLT)". Both results are written into the corresponding result registers and will issue an IRQ if enabled. The internal voltage measurement results (no compensation active) are clamped to maximum and minimum values of 0xFFFF and 0x0000 respectively. Terminal voltages outside this range will result in the respective max or min clamped values. The internal current measurement results (no compensation active) are clamped to maximum and minimum values of 0x0FFFF and 0x10000 respectively. Terminal voltages outside this range will result in the respective max or min clamped values. NOTE Both channels will perform synchronized conversions when enabled with a single write to the ACQ_CTL register. As the voltage channel is not active during low power mode, the synchronicity might not be given after wake-up, and has to be re-established by restarting both channels. Entering low power mode with the current / temperature channel enabled will have the channel(s) remain active during low power mode. 4.8.4 Temperature measurement channel The MM912_637 can measure the temperature from an internal built-in temperature sensor, or from an external temperature sensor connected to the VTEMP pin. The external temperature sensor is supplied via the TSUP pin. The measurement channel is the same for the internal and external temperature sensor. The temperature measurement channel uses the same Sigma Delta (SD) converter implementation as the current and voltage channel, followed by a fixed decimation (L=128). A selectable chopper mode is implemented to compensate for offset errors. Once the chopper is enabled, an average (sinc1, L=2) is active. Once the measurement is enabled, the temperature result registers are updated with the channel update rate. When both measurements are enabled, both temperature sensors are measured successively where the measurement is started with the internal sensor. The internal temperature measurement result (no compensation active) of 0x0000 represents 0K, the maximum 0xFFFF = 523K (typ). The result data is stored into the result registers ACQ_ITEMP and ACQ_ETEMP (both 16-bit). During an over range event, the ADC is limited to the maximum value. The result of the internal temperature measurement is utilized to generate the calibration request. See Section 4.8.5, "Calibration". 4.8.4.1 Compensation The compensation for the temperature channels is implemented similar to the current and voltage channel. Table 102. Gain compensation - temperature channel ITGC[7:0] ETGC[7:0] Temperature channel gain compensation 0xFF 1.124 0xFE 1.123 0xFD 1.122 . . . . 0x83 1.003 0x82 1.002 0x81 1.001 0x80 (default) 1.000 0x7F 0.999 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 102. Gain compensation - temperature channel (continued) ITGC[7:0] ETGC[7:0] Temperature channel gain compensation 0x7E 0.998 0x7D 0.997 . . . . 0x02 0.877 0x01 0.876 0x00 0.875 Table 103. Offset compensation - temperature channel(110) ITOC[7:0] ETOC[7:0] Temperature channel offset compensation(111) 0x7F +9.689 0x7E +9.613 0x7D +9.537 . . . . 0x03 +0.229 0x02 +0.153 0x01 +0.076 0x00 (default) 0 0xFF -0.076 0xFE -0.153 0xFD -0.229 . . . . 0x82 -9.613 0x81 -9.689 0x80 -9.766 Notes 110. Typical values based on default gain setting 111. SD input related (mV) NOTE Factory trimmed compensation values are only available for the internal temperature channel. 4.8.5 Calibration To ensure the maximum precision of the current and voltage sense module, several stages of calibration are implemented to compensate temperature effects. The calibration concept combines the availability of FLASH and the temperature information to guarantee the measurement accuracy under all functional conditions. The trimming and calibration procedures are split in three different categories: Power On-, Calibration Request-, and Optional Verification Procedures. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.8.5.1 System power on procedure Several device parameters are guaranteed with full precision after system trimming only. During final test of the device, trim values are computed, verified, and stored into the system FLASH memory. To ensure optimum system performance, the following power on procedure has to be performed during power on. As the device is typically constantly powered during its operation, this operation has to be performed typically one time only. During a system power loss or low power reset condition, the application software has to ensure the procedure executes again. Power On Procedure (One time only) Startup Trimming Bandgap Trim (BG1,2,3) LIN Slope Trim LVT Trim LPOSC Trim Build Gain Compensation Reference Table Build Current Channel GC Look Up table Build VSENSE Channel GC Look Up table Build VOpt Channel GC Look Up table Startup Calibration VSENSE / VOPT Channel Offset Compensation1 ITEMP Channel Offset Compensation ITEMP Channel Gain Compensation PGA Auto Zero Sequence Current / Voltage Channel Gain Comp. based on ITEMP and LookUp Table Current Channel Offset Compensation procedure2 Program Calibration IRQ Temperature Thresholds 1 : Based on first channel used 2 : In case copper mode is not used Figure 36. Power on procedure 4.8.5.1.1 Startup trimming To ensure all analog die modules are being trimmed properly, the following FLASH information (located in the MCU IFR from 0x01_80D0 to 0x01_80D9) has to be copied to the analog die register 0xE0 to 0xE9. This trimming includes the Band Gap Reference adjustment for the 3 system Band Gap circuits, The LIN slope adjustment (TRIM_LIN), the Low Voltage Threshold (TRIM_LVT), and the Low Power Oscillator (TRIM_OSC). See Section 5, "MM912_637 - trimming". MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS NOTE The LPOSC[12:0] trim will adjust the low power oscillator to its specified accuracy. This will result in the dependent Watchdog timing to be accurate after writing the trimming information. 4.8.5.1.2 Gain compensation look up table In order to prepare the system for the optional calibration interrupt service during operation, it is be beneficial to create a look up table for the voltage and current channel gain compensation over temperature. For all current and voltage channel gain buffers, there are corresponding ROOM temperature optimum trim values stored in the IFR FLASH. For HOT (125 C) and COLD (-40 C) temperature, the adjustment towards the ROOM value is stored. Table 104. Gain compensation buffer optimum OFFSET Byte description Global address HEX DEC 0x01_80C0 00 00 0x01_80C1 01 01 0x01_80C2 02 02 0x01_80C3 03 03 0x01_80C4 04 04 0x01_80C5 05 05 0x01_80C6 06 06 0x01_80C7 07 07 0x01_80C8 08 08 0x01_80C9 09 09 0x01_80CA 0A 10 0x01_80CB 0B 11 0x01_80CC 0C 12 0x01_80CD 0D 13 0x01_80CE 0E 14 0x01_80CF 0F 15 0x01_80DE 1E 30 0x01_80DF 1F 31 0x01_80E0 20 32 0x01_80E1 21 33 VOGC[7:0] 0x01_80EC 2C 44 COMP_VSG_COLD[7:0] VSENSE Channel Gain Compensation - COLD Temp(112) 0x01_80ED 2D 45 COMP_VSG_HOT[7:0] VSENSE Channel Gain Compensation - HOT Temp(112) 0x01_80EE 2E 46 COMP_VOG_COLD[7:0] VOPT Channel Gain Compensation - COLD Temp(112) 0x01_80EF 2F 47 COMP_VOG_HOT[7:0] VOPT Channel Gain Compensation - HOT Temp(112) 0x01_80F0 30 48 IGC4_COLD[7:0] Current Channel Gain (4) Compensation - COLD Temp(112) 0x01_80F1 31 49 IGC4_HOT[7:0] Current Channel Gain (4) Compensation - HOT Temp(112) 7 6 5 4 3 2 1 0 IGC4[9:8] IGC4[7:0] IGC8[9:8] IGC8[7:0] IGC16[9:8] IGC16[7:0] IGC32[9:8] IGC32[7:0] IGC64[9:8] IGC64[7:0] IGC128[9:8] IGC128[7:0] Content Current Channel Gain (4) Compensation - Room Temp Current Channel Gain (8) Compensation - Room Temp Current Channel Gain (16) Compensation - Room Temp Current Channel Gain (32) Compensation - Room Temp Current Channel Gain (64) Compensation - Room Temp Current Channel Gain (128) Compensation - Room Temp IGC256[9:8] Current Channel Gain (256) Compensation - Room Temp IGC512[9:8] Current Channel Gain (512) Compensation - Room Temp IGC256[7:0] IGC512[7:0] VSGC[9:8] VSGC[7:0] VOGC[9:8] VSENSE Channel Gain Compensation - Room Temp VOPT Channel Gain Compensation - Room Temp MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 104. Gain compensation buffer optimum (continued) OFFSET Byte description Global address HEX DEC 0x01_80F2 32 50 IGC8_COLD[7:0] Current Channel Gain (8) Compensation - COLD Temp(112) 0x01_80F3 33 51 IGC8_HOT[7:0] Current Channel Gain (8) Compensation - HOT Temp(112) 0x01_80F4 34 52 IGC16_COLD[7:0] Current Channel Gain (16) Compensation - COLD Temp(112) 0x01_80F5 35 53 IGC16_HOT[7:0] Current Channel Gain (16) Compensation - HOT Temp(112) 0x01_80F6 36 54 IGC32_COLD[7:0] Current Channel Gain (32) Compensation - COLD Temp(112) 0x01_80F7 37 55 IGC32_HOT[7:0] Current Channel Gain (32) Compensation - HOT Temp(112) 0x01_80F8 38 56 IGC64_COLD[7:0] Current Channel Gain (64) Compensation - COLD Temp(112) 0x01_80F9 39 57 IGC64_HOT[7:0] Current Channel Gain (64) Compensation - HOT Temp(112) 0x01_80FA 3A 58 IGC128_COLD[7:0] Current Channel Gain (128) Compensation - COLD Temp(112) 0x01_80FB 3B 59 IGC128_HOT[7:0] Current Channel Gain (128) Compensation - HOT Temp(112) 0x01_80FC 3C 60 IGC256_COLD[7:0] Current Channel Gain (256) Compensation - COLD Temp(112) 0x01_80FD 3D 61 IGC256_HOT[7:0] Current Channel Gain (256) Compensation - HOT Temp(112) 0x01_80FE 3E 62 IGC512_COLD[7:0] Current Channel Gain (512) Compensation - COLD Temp(112) 0x01_80FF 3F 63 IGC512_HOT[7:0] Current Channel Gain (512) Compensation - HOT Temp(112) 7 6 5 4 3 2 1 0 Content Notes 112. 7-Bit character with bit 7 (MSB) as sign (0 = "+"; 1 = "-") with the difference to the corresponding room temperature value (e.g. 10000010 = "-2"). To create the look up table, a linear interpolation of the gain adjustment has to be done between the three given temperatures, based on the temperature step width specified (TCALSTEP). MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS HOT +x +2 +1 ROOM 0 -1 -2 COLD -x Figure 37. Look up table creation 4.8.5.1.3 Startup calibration The power on trimming / calibration procedure is finalized by performing the start up calibration. 4.8.5.1.3.1 VSENSE/VOPT channel offset compensation and ITEMP channel gain/offset compensation Copying the default compensation values, according to Table 105, will establish the optimum offset compensation for the VSENSE and VOPT channels, as well as the optimum gain and offset compensation for the internal temperature sensor. Table 105. Voltage/temp trim OFFSET Global Address HEX DEC 0x01_80DA 1A 26 0x01_80DB 1B 0x01_80DC Byte description 7 6 5 4 3 Target register 2 1 0 Name Offset VOC_S[7:0] COMP_VO 0xAA(113) 27 VOC_O[7:0] COMP_VO 0xAA(113) 1C 28 VOC_S_CHOP[7:0] (Chopper Mode) COMP_VO 0xAA(113) 0x01_80DD 1D 29 VOC_O_CHOP[7:0] (Chopper Mode) COMP_VO 0xAA(113) 0x01_80E2 22 34 ITO[7:0] COMP_ITO 0xD0 0x01_80E3 23 35 ITG[7:0] COMP_ITG 0xD1 Notes 113. Based on the selection of the voltage measurement source (VSENSE or VOPT) and the activation of chopper mode. VOC_S is for VSENSE with Chopper mode OFF, VOC_O for VOPT with Chopper mode OFF, VOC_S_CHOP for VSENSE with Chopper mode ON, VOC_O_CHOP for VOPT with Chopper mode ON. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.8.5.1.3.2 PGA auto zero sequence The following procedure has to be performed for the PGA (Programmable Gain Amplifier) Auto Zero (AZ). 1. Write a "1" to the PGAO bit and its mask in the COMP_CTL register (0xA0) 2. Approximately 6.5 ms later, PGAOF will become set at to "1" (Flag needs to be polled) 3. Exit the PGAO mode by writing "0" in PGA0 and its mask being a "1" 4. Clear the PGAOF flag by writing "1" NOTE The new offset compensation data can be observed in the (PGAOC4...512[10:0]) registers. The sequence will require 3352 clock cycles of the D2DFCLK (512kHz), typically 6.5 ms. 4.8.5.1.3.3 Current and voltage channel gain compensation based on ITEMP from look up table After the first reading of the temperature channel measurement, the current and voltage channel gain compensation buffers must be written with the corresponding look up table value (see Section 4.8.5.1.2, "Gain compensation look up table"). 4.8.5.1.3.4 Current channel offset compensation procedure (chopper off only) If the chopper feature is not used for the current measurement channel, the offset should be compensated using the following procedure with the highest decimation selected and the LPF active. Short PGA inputs PGAZ(M) = 1 Start regular SD Current Channel Conversion with Compensation disabled (CCOMP(M) = 0) Wait for conversion complete IRQ and adjust offset compensation buffers with result. Figure 38. Current channel offset compensation sequence 4.8.5.1.3.5 Program calibration IRQ temperature thresholds To finalize the startup sequence, the new temperature limits must be programmed into the Calibration Temperature Limits (TCMAX[15:0] and TCMIN[15:0]), and the Calibration Request interrupt must be enabled. 4.8.5.2 Calibration request procedure During normal system operation (in Normal and Low Power mode), a calibration request interrupt / wake-up will indicate the device temperature changed outside the range for the programmed Current and Voltage Channel Gain Compensation. During a calibration request interrupt (wake-up), the Current and Voltage Channel Gain Compensation buffers have to be updated with the corresponding values stored in the look up table created upon system start up (see Section 4.8.5.1.2, "Gain compensation look up table"). The the new temperature limits must be programmed into the Calibration Temperature Limits (TCMAX[15:0] and TCMIN[15:0]) before leaving the interrupt service routine. 4.8.5.3 Verification procedures As an optional feature, upon application requirement, the proper function of the current and voltage measurement channels can be verified by connecting a special calibration reference to the input of the channels. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Connect Calibration Reference to Channel Inputs (DIAGI(M) = DIAGV(M) = 1) Start regular SD Conversion. Wait for conversion complete IRQ. Verify result based on the reference measurements Disconnect Calibration Reference to Channel Inputs (DIAGI(M) = DIAGV(M) = 0) Table 106 shows the location of the diagnostic reference measurements. Note: This table is unpopulated for Analog Option 1 devices. Table 106. Diagnostic measurement flash location OFFSET Global Address HEX DEC 0x01_80E4 24 36 0x01_80E5 25 37 0x01_80E6 26 38 0x01_80E7 27 39 0x01_80E8 28 40 0x01_80E9 29 41 0x01_80EA 2A 42 4.8.6 4.8.6.1 Byte description 7 6 5 4 3 2 1 0 BG3 diag measurement from Vsense channel after cal at room BG3 diag measurement from Vopt channel after cal at room BG3 diag measurement from I channel (gain4) at room Memory map and registers Overview This section provides a detailed description of the memory map and registers. 4.8.6.2 Module memory map The memory map for the Acquisition, Compensation, and LPF module is given in Table 62. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 107. Module memory map Offset Name 7 6 5 4 3 2 1 0 R 0 0 0 0 0 0 0 0 W AHCRM OPTEM OPENEM CVMIEM ETMENM ITMENM VMENM CMENM R 0 W AHCR OPTE OPENE CVMIE ETMEN ITMEN VMEN CMEN ACQ_SR (hi) R AVRF PGAG VMOW CMOW ETM ITM VM CM Acquisition status register W ACQ_SR (lo) R OPEN 0 0 VTH ETCHOP ITCHOP VCHOP CCHOP Acquisition status register W R 0 0 0 0 0 0 0 0 W TCOMPM VCOMPM CCOMPM LPFENM ETCHOP M ITCHOPM CVCHOP M AGENM TCOMP VCOMP CCOMP LPFEN ETCHOP ITCHOP CVCHOP AGEN (114)(115) 0x58 0x5A 0x5B 0x5C ACQ_CTL Acquisition control register ACQ_ACC1 Acquisition chain control 1 R W 0x5E ACQ_ACC0 Acquisition chain control 0 R 0 0 0 0 0 0 0 0 W ZEROM ECAPM TADCGM VADCGM CADCGM TDENM VDENM CDENM ZERO ECAP TADCG VADCG CADCG TDEN VDEN CDEN 0 0 0 0 0 0 0 0 0 R W 0x60 0x61 0x62 0x63 0x64 0x65 0x66 ACQ_DEC R Decimation Rate W ACQ_BGC R BandGap control W ACQ_GAIN R PGA gain W ACQ_GCB R GCB threshold W ACQ_ITEMP (hi) R 0 BGLDO 0 BG3EN 0 BG2EN BG1EN IGAIN[2:0] D[7:0] ITEMP[15:8] ACQ_ITEMP (lo) R ITEMP[7:0] Internal temp. measurement result W ACQ_ETEMP (hi) R External temp. measurement result W ACQ_ETEMP (lo) R External temp. measurement result W 0x68 Reserved R EEMP[15:8] EEMP[7:0] 0 0 0 0 0 0 0 0 W ACQ_CURR1 R Current measurement result W ACQ_CURR0 Current measurement result W R 0x6A BGADC[1:0] DEC[2:0] Internal temp. measurement result W 0x67 0x69 Write 1 will clear the flags R CURR[23:16] CURR[15:8] CURR[7:0] W MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 107. Module memory map (continued) Offset Name (114)(115) 7 6 5 4 R ACQ_VOLT Voltage measurement result 0x6C 3 2 1 0 0 0 0 VOLT[15:8] W R VOLT[7:0] W 0x6E ACQ_LPFC R Low pass filter coefficient number W 0x6F Reserved 0x70 ACQ_TCMP Low power trigger current measurement period R 0 0 0 0 0 0 0 0 LPFC[3:0] 0 W R W TCMP[15:0] R W ACQ_THF R 0x72 Low power current threshold filtering period W 0x73 Reserved 0x74 0x75 0x76 0x77 0x78 0x79 0x7A 0x7B R R I and V chopper control register W ACQ_CVCR (lo) R I and V chopper control register W ACQ_CTH R Low power current threshold W R R Low power Ah counter threshold W ACQ_AHTH1 (lo) R Low power Ah counter threshold W ACQ_AHTH0 (hi) R Low power Ah counter threshold W ACQ_AHTH0 (lo) R Low power Ah counter threshold W ACQ_AHC1 (hi) R Low power Ah counter W ACQ_AHC1 (lo) R Low power Ah counter W ACQ_AHC0 (hi) R Low power Ah counter W ACQ_AHC0 (lo) R Low power Ah counter W LPF_A0 (hi) R A0 filter coeff W LPF_A0 (lo) R A0 filter coeff W 0x7D 0x7E 0x7F 0x80 0x81 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 DBTM[1:0] IIRCM[2:0] PGAFM DBT[1:0] IIRC[2:0] PGAF CTH[7:0] 0 0 0 0 0 0 0 0 W ACQ_AHTH1 (hi) 0x7C 0 W ACQ_CVCR (hi) Reserved THF[7:0] 0 AHTH[30:16] AHTH[15:0] AHC[31:24] AHC[23:16] AHC[15:8] AHC[7:0] A0[15:0] MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 107. Module memory map (continued) Offset Name (114)(115) 0x82 0x83 0x84 0x85 0x86 0x87 0x88 0x89 0x8A 0x8B 0x8C 0x8D 0x8E 0x8F 0x90 0x91 0x92 0x93 0x94 0x95 0x96 0x97 7 LPF_A1 (hi) R A1 filter coeff W LPF_A1 (lo) R A1 filter coeff W LPF_A2 (hi) R A2 filter coeff W LPF_A2 (lo) R A2 filter coeff W LPF_A3 (hi) R A3 filter coeff W LPF_A3 (lo) R A3 filter coeff W LPF_A4 (hi) R A4 filter coeff W LPF_A4 (lo) R A4 filter coeff W LPF_A5 (hi) R A5 filter coeff W LPF_A5 (lo) R A5 filter coeff W LPF_A6 (hi) R A6 filter coeff W LPF_A6 (lo) R A6 filter coeff W LPF_A7 (hi) R A7 filter coeff W LPF_A7 (lo) R A7 filter coeff W LPF_A8 (hi) R A8 filter coeff W LPF_A8 (lo) R A8 filter coeff W LPF_A9 (hi) R A9 filter coeff W LPF_A9 (lo) R A9 filter coeff W LPF_A10 (hi) R A10 filter coeff W LPF_A10 (lo) R A10 filter coeff W LPF_A11 (hi) R A11 filter coeff W LPF_A11 (lo) R A11 filter coeff W 6 5 4 3 2 1 0 A1[15:0] A2[15:0] A3[15:0] A4[15:0] A5[15:0] A6[15:0] A7[15:0] A8[15:0] A9[15:0] A10[15:0] A11[15:0] MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 107. Module memory map (continued) Offset (114)(115) 0x98 0x99 0x9A 0x9B 0x9C 0x9D 0x9E 0x9F 0xA0 Name 7 LPF_A12 (hi) R A12 filter coeff W LPF_A12 (lo) R A12 filter coeff W LPF_A13 (hi) R A13 filter coeff W LPF_A13 (lo) R A13 filter coeff W LPF_A14 (hi) R A14 filter coeff W LPF_A14 (lo) R A14 filter coeff W 0xA3 5 4 3 2 1 0 A12[15:0] A13[15:0] A14[15:0] LPF_A15 (hi) R A15 filter coeff W LPF_A15 (lo) R A15 filter coeff W R 0 0 0 0 0 0 COMP_CTL Compensation control register W BGCALM[1:0] PGAZM PGAOM DIAGVM DIAGIM CALIEM BGCAL[1:0] PGAZ PGAO DIAGV DIAGI PGAOF 0 0 R W 0xA2 6 COMP_SR R Compensation status register W COMP_TF R Temperature filtering period W COMP_TMAX Max temp before recalibration W A15[15:0] 0 0 BGRF 0 CALIE 0 CALF Write 1 will clear the flags 0 0 0 0 0 TMF[2:0] R 0xA4 TCMAX[15:0] R W R 0xA6 COMP_TMIN Min temp before recalibration W TCMIN[15:0] R W 0xA8 Reserved 0xA9 Reserved 0xAA 0xAB R R COMP_VO R W COMP_IO R Offset current compensation window W R 0xAC 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Offset voltage compensation COMP_VSG Gain voltage comp. vsense channel 0 W VOC[7:0] COC[7:0] 0 0 0 0 W R W VSGC[9:8] VSGC[7:0] MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 107. Module memory map (continued) Offset Name 0xAE Reserved 0xAF Reserved (114)(115) R 0xB0 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R COMP_IG4 Gain current compensation 4 7 W R IGC4[7:0] W R 0xB2 COMP_IG8 Gain current compensation 8 0 0 0 0 W R 0xB4 COMP_IG16 Gain current compensation 16 0 0 0 0 W R 0xB6 COMP_IG32 Gain current compensation 32 0 0 0 0 W R 0xB8 COMP_IG64 Gain current compensation 64 0 0 0 0 W R 0xBA COMP_IG128 Gain current compensation 128 0 0 0 R 0xBC 0 0 0 R 0xBE 0 0 0 R R 0xC0 0 0 0 0 0 0 W R R 0xC2 0 R 0 IGC512[9:8] PGAOC4[10:8] PGAOC4[7:0] 0 0 0 0 0 W W IGC256[9:8] IGC512[7:0] W COMP_PGAO8 Offset PGA compensation 8 0 W W COMP_PGAO4 Offset PGA compensation 4 0 IGC256[7:0] W COMP_IG512 Gain current compensation 512 0 W R IGC128[9:8] IGC128[7:0] W COMP_IG256 Gain current compensation 256 0 W R IGC64[9:8] IGC64[7:0] W R IGC32[9:8] IGC32[7:0] W R IGC16[9:8] IGC16[7:0] W R IGC8[9:8] IGC8[7:0] W R IGC4[9:8] PGAOC8[10:8] PGAOC8[7:0] MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 107. Module memory map (continued) Offset Name (114)(115) R COMP_PGAO16 Offset PGA compensation 16 0xC4 7 6 5 4 3 0 0 0 0 0 R R 0xC6 0 0 0 R 0xC8 0 0 0 R R 0xCA 0 0 0 R 0 0 0 R 0xD1 COMP_ITO 0 0 0 R R W COMP_ETO R External temp. offset compensation W COMP_ETG R Reserved 0xD6 Reserved 0xD7 Reserved PGAOC256[10:8] 0 PGAOC512[10:8] PGAOC512[7:0] ITOC[7:0] ITGC[7:0] ETOC[7:0] ETGC[7:0] External temp. gain compensation W 0xD5 0 0 R COMP_ITG Reserved PGAOC128[10:8] W Internal temp. gain compensation 0xD4 0 0 Internal temp. offset compensation W 0xD2 0xD3 0 PGAOC256[7:0] W 0xD0 PGAOC64[10:8] W R 0xCE 0 PGAOC128[7:0] W COMP_PGAO512 Offset PGA compensation 512 0 W R 0xCC PGAOC32[10:8] PGAOC64[7:0] W COMP_PGAO256 Offset PGA compensation 256 0 W W COMP_PGAO128 Offset PGA compensation 128 0 PGAOC32[7:0] W COMP_PGAO64 Offset PGA compensation 64 R 0 PGAOC16[7:0] W R 1 PGAOC16[10:8] W W COMP_PGAO32 Offset PGA compensation 32 2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W R W Notes 114. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 115. Register Offset with the "lo" address value not shown have to be accessed in 16Bit mode. 8 Bit access will not function. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.8.6.3 Register descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. 4.8.6.3.1 Acquisition control register (ACQ_CTL) Table 108. Acquisition control register (ACQ_CTL) Offset (116),(117) Access: User read/write 0x58 15 14 13 12 11 10 9 8 R 0 0 0 0 0 0 0 0 W AHCRM OPTEM OPENEM CVMIEM ETMENM ITMENM VMENM CMENM Reset 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 OPTE OPENE CVMIE ETMEN ITMEN VMEN CMEN 0 0 0 0 0 0 0 R 0 W AHCR Reset 0 Notes 116. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 117. This Register is 16-Bit access only. Table 109. Acquisition control register (ACQ_CTL) - register field descriptions Field Description 15 AHCRM Ampere Hour Counter Reset - Mask 0 - writing the AHCR Bit will have no effect 1 - writing the AHCR Bit will be effective 14 OPTEM Optional Voltage Sense Enable - Mask 0 - writing the OPTE Bit will have no effect 1 - writing the OPTE Bit will be effective 13 OPENEM Enable Shunt Resistor Open Detection - Mask 0 - writing the OPENE Bit will have no effect 1 - writing the OPENE Bit will be effective 12 CVMIEM Current / Voltage Measurement Interrupt Enable - Mask 0 - writing the CVMIE Bit will have no effect 1 - writing the CVMIE Bit will be effective 11 ETMENM External Temperature Measurement Enable - Mask 0 - writing the ETMEN Bit will have no effect 1 - writing the ETMEN Bit will be effective 10 ITMENM Internal Temperature Measurement Enable - Mask 0 - writing the ITMEN Bit will have no effect 1 - writing the ITMEN Bit will be effective 9 VMENM Voltage Measurement Enable - Mask 0 - writing the VMEN Bit will have no effect 1 - writing the VMEN Bit will be effective 8 CMENM Current Measurement Enable - Mask 0 - writing the CMEN Bit will have no effect 1 - writing the CMEN Bit will be effective MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 109. Acquisition control register (ACQ_CTL) - register field descriptions (continued) Field Description 7 AHCR Ampere Hour Counter Reset, this write only bit will reset the ACQ_AHC register. 0 - no effect 1 - ACQ_AHC reset to 0x00000000 6 OPTE Optional Voltage Sense Enable (Voltage Channel Multiplexer Control) 0 - VSENSE routed to ADC 1 - VOPT routed to ADC 5 OPENE Enable Shunt Resistor Open Detection 0 - Shunt resistor open detection disabled, the OPEN bit must be ignored 1 - Shunt resistor open detection enabled, OPEN bit will indicate status 4 CVMIE Current / Voltage Measurement Interrupt Enable 0 - current and voltage measurement interrupt disabled 1 - current and voltage measurement interrupt enabled 3 ETMEN External Temperature Measurement Enable 0 - external temperature measurement disabled 1 - external temperature measurement enabled 2 ITMEN Internal Temperature Measurement Enable 0 - internal temperature measurement disabled 1 - internal temperature measurement enabled 1 VMEN Voltage Measurement Enable 0 - voltage measurement disabled 1 - voltage measurement enabled 0 CMEN Current Measurement Enable 0 - current measurement disabled 1 - current measurement enabled 4.8.6.3.2 Acquisition status register (ACQ_SR (hi)) Table 110. Acquisition status register (ACQ_SR (hi)) Offset(118) 0x5A R Access: User read/write 7 6 5 4 3 2 1 0 AVRF PGAG VMOW CMOW ETM ITM VM CM 0 0 0 W Reset Write 1 will clear the flags 0 0 0 0 0 Notes 118. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 111. Acquisition status register (ACQ_SR (hi)) - register field descriptions Field Description 7 AVRF VDDA Low Voltage Reset Flag. Writing this bit to logic 1 will clear the flag. 0 - n.a. 1 - Last reset was caused by a low voltage condition at the VDDA regulator. 6 PGAG PGA Gain Change Flag(119). Writing this bit to logic 1 will clear the flag. 0 - PGA gain has not changed since last flag clear 1 - PGA gain has changed since last flag clear 5 VMOW Voltage Measurement Result Overwritten(119). Writing this bit to logic 1 will clear the flag. 0 - Voltage measurement result register VOLT[15:0] not overwritten(120) since last VMOW flag clear 1 - Voltage measurement result register VOLT[15:0] overwritten(120) since last VMOW flag clear MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 111. Acquisition status register (ACQ_SR (hi)) - register field descriptions (continued) Field Description (119) Current Measurement Result Overwritten . Writing this bit to logic 1 will clear the flag. 0 - Current measurement result register CURR[15:0] not overwritten(120) since last CMOW flag clear 1 - Current measurement result register CURR[15:0] overwritten(120) since last CMOW flag clear 4 CMOW 3 ETM End of Measurement - External Temperature(119). Writing this bit to logic 1 will clear the flag. 0 - No external temperature measurement completed since last ETM clear 1 - External temperature measurement completed since last ETM clear 2 ITM End of Measurement - Internal Temperature(119). Writing this bit to logic 1 will clear the flag. 0 - No internal temperature measurement completed since last ITM clear 1 - Internal temperature measurement completed since last ITM clear 1 VM End of Measurement - Voltage. Writing this bit to logic 1 will clear the flag. 0 - No voltage measurement completed since last VM clear 1 - Voltage measurement completed since last VM clear 0 CM End of Measurement - Current. Writing this bit to logic 1 will clear the flag. 0 - No current measurement completed since last CM clear 1 - Current measurement completed since last CM clear Notes 119. No Interrupts issued for those flags 120. Overwritten - new result latched before previous result was read 4.8.6.3.3 Acquisition status register (ACQ_SR (lo)) Table 112. Acquisition status register (ACQ_SR (lo)) Offset(121) 0x5B R Access: User read 7 6 5 4 3 2 1 0 OPEN 0 0 VTH ETCHOP ITCHOP VCHOP CCHOP W Notes 121. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 113. Acquisition status register (ACQ_SR (lo)) - register field descriptions Field 7 OPEN 4 VTH Description Shunt Resistor Open Detection Status (Normal mode only, only functional if OPENE=1) 0 - Shunt resistor detected 1 - Shunt resistor disconnected Digital Voltage High Threshold Reached 0 - Voltage measurement result for VSENSE / VOPT below VTH (0xDAC0: equivalent to 28 V at 0.5 mV LSB weighing) 1 - Voltage measurement result for VSENSE / VOPT above or equal VTH (0xDAC0: equivalent to 28 V at 0.5 mV LSB weighing) 3 ETCHOP Chopping Active Status - External Temperature 0 - Chopper for external temperature measurement disabled 1 - Chopper for external temperature measurement enabled 2 ITCHOP Chopping Active Status - Internal Temperature 0 - Chopper for internal temperature measurement disabled 1 - Chopper for internal temperature measurement enabled MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 113. Acquisition status register (ACQ_SR (lo)) - register field descriptions (continued) Field Description 1 VCHOP Chopping Active Status - Voltage 0 - Chopper for voltage measurement disabled 1 - Chopper for voltage measurement enabled 0 CCHOP Chopping Active Status - Current 0 - Chopper for current measurement disabled 1 - Chopper for current measurement enabled 4.8.6.3.4 Acquisition chain control 1 (ACQ_ACC1) Table 114. Acquisition chain control 1 (ACQ_ACC1) Offset (122)(123) Access: User read/write 0x5C 15 14 13 12 11 10 9 8 R 0 0 0 0 0 0 0 0 W TCOMPM VCOMPM CCOMPM LPFENM ETCHOPM ITCHOPM CVCHOPM AGENM Reset 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 TCOMP VCOMP CCOMP LPFEN ETCHOP ITCHOP CVCHOP AGEN 1 1 1 0 0 0 0 1 R W Reset Notes 122. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 123. This Register is 16 Bit access only. Table 115. Acquisition chain control 1 (ACQ_ACC1) - register field descriptions Field Description 15 TCOMPM Temperature Measurement Channel - Compensation Enable - Mask 0 - writing the TCOMP bit will have no effect 1 - writing the TCOMP bit will be effective 14 VCOMPM Voltage Measurement Channel - Compensation Enable - Mask 0 - writing the VCOMP bit will have no effect 1 - writing the VCOMP bit will be effective 13 CCOMPM Current Measurement Channel - Compensation Enable - Mask 0 - writing the CCOMP bit will have no effect 1 - writing the CCOMP bit will be effective 12 LPFENM LPF Enable - Mask 0 - writing the LPFEN bit will have no effect 1 - writing the LPFEN bit will be effective 11 ETCHOPM Chopping Enable - External Temperature Measurement Channel - Mask 0 - writing the ETCHOP bit will have no effect 1 - writing the ETCHOP bit will be effective 10 ITCHOPM Chopping Enable - Internal Temperature Measurement Channel - Mask 0 - writing the ITCHOP bit will have no effect 1 - writing the ITCHOP bit will be effective MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 115. Acquisition chain control 1 (ACQ_ACC1) - register field descriptions (continued) Field Description Chopping Enable - Voltage Measurement Channel - Mask 0 - writing the CVCHOP bit will have no effect 1 - writing the CVCHOP bit will be effective 9 CVCHOPM 8 AGENM Automatic Gain Control Enable - Mask 0 - writing the AGEN bit will have no effect 1 - writing the AGEN bit will be effective 7 TCOMP Temperature Measurement Channel - Compensation Enable 0 - Temperature measurement channel offset and gain compensation disabled 1 - Temperature measurement channel offset and gain compensation enabled 6 VCOMP Voltage Compensation Enable 0 - Voltage measurement channel offset and gain compensation disabled 1 - Voltage measurement channel offset and gain compensation enabled 5 CCOMP Current Compensation Enable 0 - Current measurement channel offset and gain compensation disabled 1 - Current measurement channel offset and gain compensation enabled 4 LPFEN LPF Enable 0 - Low pass filter for current and voltage channel disabled 1 - Low pass filter for current and voltage channel enabled 3 ETCHOP Chopping Enable - External Temperature 0 - Chopper mode for external temperature measurement disabled 1 - Chopper mode for external temperature measurement enabled 2 ITCHOP Chopping Enable - Internal Temperature 0 - Chopper mode for internal temperature measurement disabled 1 - Chopper mode for internal temperature measurement enabled 1 CVCHOP Chopping Enable - Voltage 0 - Chopper mode for voltage and current measurement disabled 1 - Chopper mode for voltage and current measurement enabled Automatic Gain Control Enable 0 - Automatic gain control disabled (manual gain control via IGAIN[2:0]) 1 - Automatic gain control enabled 0 AGEN 4.8.6.3.5 Acquisition chain control 0 (ACQ_ACC0) Table 116. Acquisition chain control 0 (ACQ_ACC0) Offset (124),(125) Access: User read/write 0x5E 15 14 13 12 11 10 9 8 R 0 0 0 0 0 0 0 0 W ZEROM ECAPM TADCGM VADCGM CADCGM TDENM VDENM CDENM Reset 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 ZERO ECAP TADCG VADCG CADCG TDEN VDEN CDEN 0 0 1 1 1 0 0 0 R W Reset Notes 124. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 125. This Register is 16 Bit access only. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 117. Acquisition chain control 0 (ACQ_ACC0) - register field descriptions Field Description 15 ZEROM Current and Voltage Sigma Delta Input Short - Mask 0 - writing the ZERO bit will have no effect 1 - writing the ZERO bit will be effective 14 ECAPM TSUP External Capacitor - Mask 0 - writing the ECAP bit will have no effect 1 - writing the ECAP bit will be effective 13 TADCGM Temperature ADC Gain Select - Mask 0 - writing the TADCG bit will have no effect 1 - writing the TADCG bit will be effective 12 VADCGM Voltage ADC Gain Select - Mask 0 - writing the VADCG bit will have no effect 1 - writing the VADCG bit will be effective 11 CADCGM Current ADC Gain Select - Mask 0 - writing the CADCG bit will have no effect 1 - writing the CADCG bit will be effective 10 TDENM 100ns Clock delay - Internal Temperature - Mask 0 - writing the TDEN bit will have no effect 1 - writing the TDEN bit will be effective 9 VDENM 100ns Clock delay - Voltage - Mask 0 - writing the VDEN bit will have no effect 1 - writing the VDEN bit will be effective 8 CDENM 100ns Clock delay - Current - Mask 0 - writing the CDEN bit will have no effect 1 - writing the CDEN bit will be effective 7 ZERO Current and Voltage Sigma Delta Input Short (to perform Offset Compensation measurement) 0 - Sigma delta inputs not shorted 1 - Current and voltage sigma delta inputs shorted 6 ECAP TSUP External Capacitor select 0 - TSUP frequency compensation disabled. No capacitor at pin. 0 - TSUP frequency compensation enabled. Capacitor CTSUP allowed at pin. 5 TADCG Temperature ADC Gain Select; Test purpose only, Default value (1) must be used 0 - Temperature ADC - gain adjustment 1 - Temperature ADC - standard gain (default) 4 VADCG Voltage ADC Gain Select; Test purpose only; Default value (1) must be used 0 - Voltage ADC - gain adjustment 1 - Voltage ADC - standard gain (default) 3 CADCG Current ADC Gain Select; Test purpose only; Default value (1) must be used 0 - Current ADC - gain adjustment 1 - Current ADC - standard gain (default) 2 TDEN Timing delay - Temperature 0 - standard timing for temperature measurement channel 1 - additional SD converter input delay (typ. 100 ns) for temperature measurement channel 1 VDEN Timing delay - Voltage 0 - standard timing for Voltage measurement channel 1 - additional SD converter input delay (typ. 100 ns) for voltage measurement channel 0 CDEN Timing delay - Current 0 - standard timing for current measurement channel 1 - additional SD converter input delay (typ. 100 ns) for current measurement channel MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.8.6.3.6 Decimation rate (ACQ_DEC) Table 118. Decimation rate (ACQ_DEC) Offset(126) 0x60 R Access: User read/write 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 DEC[2:0] W Reset 1 1 0 0 Notes 126. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 119. Decimation rate (ACQ_DEC) - register field descriptions Field 2-0 DEC[2:0] Description Decimation Rate Selection (Combined decimation rate of first and second sinc3 decimator; Fist decimator is fixed to D=8) 000 - D = 512 (Channel Output Rate = 1.0 kHz) 001 - D = 64 (Channel Output Rate = 8.0 kHz) 010 - D = 128 (Channel Output Rate = 4.0 kHz) 011 - D = 256 (Channel Output Rate = 2.0 kHz) 100 - D = 512 (Channel Output Rate = 1.0 kHz), (default) 101 - D = 1024 (Channel Output Rate = 500 Hz) 110 - D = 512 (Channel Output Rate = 1.0 kHz) 111 - D = 512 (Channel Output Rate = 1.0 kHz) 4.8.6.3.7 BandGap control (ACQ_BGC) Table 120. BandGap control (ACQ_BGC) Offset(127) 0x61 R Access: User read/write 7 6 0 0 0 0 5 3 BGADC W Reset 4 0 BGLDO 1 1 2 1 0 BG3EN BG2EN BG1EN 0 0 0 Notes 127. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 121. BandGap control (ACQ_BGC) - register field descriptions Field Description 5-4 BGADC ADC Bandgap select 00 - n.a. (not allowed - VDDA Reset) 01 - BG1 reference selected for the AD converters (default) 10 - BG2 reference selected for the AD converters 11 - BG3 reference selected for the AD converters 3 BGLDO LDO (Low Dropout Regulator) Bandgap select 0 - BG2 selected as voltage regulator reference 1 - BG1 selected as voltage regulator reference (default) 2 BG3EN Bandgap 3 Status 0 - Bandgap 3 disabled 1 - Bandgap 3 enabled MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 121. BandGap control (ACQ_BGC) - register field descriptions Field Description 1 BG2EN Bandgap 2 Status 0 - Bandgap 2 disabled 1 - Bandgap 2 enabled 0 BG1EN Bandgap 1 Status 0 - Bandgap 1 disabled 1 - Bandgap 1 enabled 4.8.6.3.8 PGA gain (ACQ_GAIN) Table 122. PGA gain (ACQ_GAIN) Offset(128) 0x62 R Access: User read/write 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 1 IGAIN[2:0] W Reset 0 0 0 0 Notes 128. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 123. PGA gain (ACQ_GAIN) - register field descriptions Field Description 2-0 IGAIN[2:0] PGA Gain Register - Writing will select (manually override) the PGA gain if the automatic gain control is disabled (AGEN=0). Reading will return current gain setting (including the auto gain). The register content will also determine the current channel offset compensation buffer accessed through the COC[7:0] register. 000 - PGA Gain = 4 001 - PGA Gain = 8 010 - PGA Gain = 16 011 - PGA Gain = 32 100 - PGA Gain = 64 101 - PGA Gain = 128 110 - PGA Gain = 256 111 - PGA Gain = 512 4.8.6.3.9 GCB threshold (ACQ_GCB) Table 124. GCB threshold (ACQ_GCB) Offset(129) 0x63 Access: User read/write 7 6 R 4 3 2 D (hi) W Reset 5 0 0 1 0 0 0 D (lo) 0 0 0 0 Notes 129. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 125. GCB threshold (ACQ_GCB) - register field descriptions Field Description 7-4 D[7:4] Gain Control Block (GCB) - 4 Bit Gain "Up" Threshold. See Section 4.8.3.1.3, "Gain control block (GCB)". 3-0 D[3:0] Gain Control Block (GCB) - 4 Bit Gain "Down" Threshold. See Section 4.8.3.1.3, "Gain control block (GCB)". 4.8.6.3.10 Internal temp. measurement result (ACQ_ITEMP (hi) / ACQ_ITEMP (lo)) Table 126. Internal temp. measurement result (ACQ_ITEMP (hi) / ACQ_ITEMP (lo)) Offset(130) 0x64 / 0x65 7 Access: User read 6 5 4 R 3 2 1 0 ITEMP[15:8] W R ITEMP[7:0] W Notes 130. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 127. Internal Temp. Measurement Result (ACQ_ITEMP (hi) / ACQ_ITEMP (lo)) - Register Field Descriptions Field 15-0 ITEMP[15:0] 4.8.6.3.11 Description Internal Temperature Measurement - 16 Bit ADC Result Register (unsigned Integer) External temp. measurement result (ACQ_ETEMP (hi) / ACQ_ETEMP (lo)) Table 128. External temp. measurement result (ACQ_ETEMP (hi) / ACQ_ETEMP (lo)) Offset(131) 0x66 / 0x67 7 R Access: User read 6 5 4 3 2 1 0 ETEMP[15:8] W R ETEMP[7:0] W Notes 131. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 129. External temp. measurement result (ACQ_ETEMP (hi) / ACQ_ETEMP (lo)) - register field descriptions Field 15-0 ETEMP[15:0] Description External Temperature Measurement - 16 Bit ADC Result Register (unsigned Integer) MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.8.6.3.12 Current measurement result (ACQ_CURR1 / ACQ_CURR0) Table 130. Current measurement result (ACQ_CURR1 / ACQ_CURR0) Offset(132) 0x69(133) / 0x6A(134) 7 Access: User read 6 5 4 R 3 2 1 0 CURR[23:16] W R CURR[15:8] W R CURR[7:0] W Notes 132. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 133. 0x69 for 8-Bit access. 0x68 for 16-Bit access. 134. This Register is 16-Bit access only. Table 131. Current measurement result (ACQ_CURR1 / ACQ_CURR0) - register field descriptions Field Description CURR[23:0] 23-16 CURR[23:16] 15-0 CURR[15:0] Two's complement 24-Bit signed integer result register for the current measurement channel. Current Measurement - High Byte Result Register, 8 or 16-Bit read operation. Current Measurement - Low Word Result Register, 16-Bit read operation only. 4.8.6.3.13 Voltage measurement result (ACQ_VOLT) Table 132. Voltage measurement result (ACQ_VOLT) Offset (135)(136) Access: User read 0x6C 7 R 6 5 4 3 2 1 0 VOLT[15:8] W R VOLT[7:0] W Notes 135. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 136. This Register is 16-Bit access only. Table 133. Voltage measurement result (ACQ_VOLT) - register field descriptions Field 15-0 VOLT[15:0] Description Unsigned 16-Bit integer result register for the voltage measurement channel. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.8.6.3.14 Low pass filter coefficient number (ACQ_LPFC) Table 134. Low pass filter coefficient number (ACQ_LPFC) Offset(137) 0x6E R Access: User read/write 7 6 5 4 0 0 0 0 0 0 0 0 3 2 0 1 0 LPFC[3:0] W Reset 1 1 1 Notes 137. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 135. Low pass filter coefficient number (ACQ_LPFC) - register field descriptions Field Description 3-0 LPFC[3:0] 4.8.6.3.15 Low Pass Filter Coefficient Number. Defines the highest coefficient Number used. 0000 - LPF used with Coefficient A0 0001 - LPF used with Coefficient A0...A1 .... 1111 - LPF used with Coefficient A0...A15 Low power trigger current measurement period (ACQ_TCMP) Table 136. Low power trigger current measurement period (ACQ_TCMP) Offset (138)(139) Access: User read / write 0x70 7 6 5 4 R 0 0 0 0 R 1 0 0 0 0 0 0 0 0 0 TCMP[7:0] W Reset 2 TCMP[15:8] W Reset 3 0 0 0 0 Notes 138. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 139. This Register is 16-Bit access only. Table 137. Low power trigger current measurement period (ACQ_TCMP) - register field descriptions Field 15-0 TCMP[15:0] Description Low power trigger current measurement period (Trigger counter based on ALFCLK). See Section 4.3.4.1.1, "Cyclic current acquisition/calibration temperature check". NOTE The cyclic acquisition period must be greater than the acquisition time. See Section 4.8.3.5.2, "Latency and throughput"" for estimation. A continuous acquisition is still possible by using TCMP=0. The Low Power Trigger Current counter is an up counting counter starting at 0. It is increment according to the Low Power Clock. In Low Power mode, when Low Power Trigger Current counter is equal to the Low Power Trigger Currrent Measurement Period, the device will start a current and temperature acquisition according to the setting of the current and internal temperature acquisition channels. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.8.6.3.16 Low power current threshold filtering period (ACQ_THF) Table 138. Low power current threshold filtering period (ACQ_THF) Offset(140) 0x72 Access: User read / write 7 6 5 4 R 3 2 1 0 0 0 0 0 THF[7:0] W Reset 0 0 0 0 Notes 140. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 139. Low power current threshold filtering period (ACQ_THF) - register field descriptions Field Description 7-0 THF[7:0] Low power current threshold wake up filtering period. See Section 4.3.4.1.1, "Cyclic current acquisition/calibration temperature check". 4.8.6.3.17 I and V chopper control register (ACQ_CVCR (hi)) Table 140. I and V chopper control register (ACQ_CVCR (hi)) Offset(141) 0x74 R Access: User write 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 W Reset DBTM 0 0 0 IIRCM 0 0 0 PGAFM 0 0 Notes 141. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 141. I and V chopper control register (ACQ_CVCR (hi)) - register field descriptions Field Description 5-4 DBTM[1:0] Hold Time After Chopper Swap - Mask 0 - writing the DBT bits will have no effect 1 - writing the DBT bits will be effective 3-1 IIRCM[2:0] IIR Low Pass Filter Configuration - Mask 0 - writing the IIRC bits will have no effect 1 - writing the IIRC bits will be effective 0 PGAFM PGA fast mode enable - Mask 0 - writing the PGAF bit will have no effect 1 - writing the PGAF bit will be effective MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.8.6.3.18 I and V chopper control register (ACQ_CVCR (lo)) Table 142. I and V chopper control register (ACQ_CVCR (lo)) Offset(142) 0x75 R Access: User write 7 6 0 0 0 0 5 3 DBT W Reset 4 0 2 1 IIRC 0 1 1 0 PGAF 1 1 Notes 142. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 143. I and V chopper control register (ACQ_CVCR (lo)) - register field descriptions Field Description 5-4 DBT[1:0] Hold Time After Chopper Swap 00 - Hold after swap disabled 01 - 3 x 64 kHz cycles hold time for the SINC3-L8 10 - 4 x 64 kHz cycles hold time for the SINC3-L8 11 - 5 x 64 kHz cycles hold time for the SINC3-L8 3-1 IIRC[2:0] IIR Low Pass Filter Coefficient () 000 - 1/8 001 - 1/16 010 - 1/32 011 - 1/64 100 - 1/128 101 - IIR disabled 110 - IIR disabled 111 - IIR disabled 0 PGAF PGA fast mode enable 0 - PGA capacitor swap disabled (slow mode). 1 - PGA capacitors swapped during chopper NOTE During Low Power mode: 0x15; (00010101b) is recommend for ACQ_CVCR (DBT =01, IIRC = 010, PGAF = 1) 4.8.6.3.19 Low power current threshold (ACQ_CTH) Table 144. Low power current threshold (ACQ_CTH Offset(143) 0x76 Access: User read / write 7 6 5 4 R 2 1 0 0 0 0 0 CTH[7:0] W Reset 3 0 0 0 0 Notes 143. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 145. Low power current threshold (ACQ_CTH - register field descriptions Field 7-0 CTH[7:0] 4.8.6.3.20 Description Low power current threshold See Section 4.3.4.1.1.1, "Current threshold wake-up" for details. Low power Ah counter threshold (ACQ_AHTH1 (hi) / ACQ_AHTH1 (lo) / ACQ_AHTH0 (hi) / ACQ_AHTH0 (lo)) Table 146. Low power Ah counter threshold (ACQ_AHTH1 (hi) / ACQ_AHTH1 (lo) / ACQ_AHTH0 (hi) / ACQ_AHTH0 (lo)) Offset(144) 0x78 / 0x79 / 0x7A / 0x7B 7 R 6 Access: User read / write 5 4 3 2 1 0 0 0 0 0 0 W R W AHTH[30:0] R W R W Reset 0 0 0 0 Notes 144. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 147. Low power Ah counter threshold (ACQ_AHTH1 (hi) / ACQ_AHTH1 (lo) / ACQ_AHTH0 (hi) / ACQ_AHTH0 (lo)) - register field descriptions Field Description 30-0 AHTH[30:0] Low power Ah counter threshold. Absolute (unsigned) 31-Bit integer. Reading one 16-Bit part of the register will buffer the second. Reading the second will unlock the buffer. See Section 4.3.4.1.1.2, "Current ampere hour threshold wake-up". for details on the Register. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.8.6.3.21 Low power Ah counter (ACQ_AHC1 (hi) / ACQ_AHC1 (lo) / ACQ_AHC0 (hi) / ACQ_AHC0 (lo)) Table 148. Low power Ah counter (ACQ_AHC1 (hi) / ACQ_AHC1 (lo) / ACQ_AHC0 (hi) / ACQ_AHC0 (lo)) Offset(145) 0x7C / 0x7D / 0x7E / 0x7F 7 6 Access: User read 5 4 3 R 2 1 0 AHC[31:0] W R AHC[23:16] W R AHC[15:8] W R AHC[7:0] W Notes 145. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 149. Low power Ah counter (ACQ_AHC1 (hi) / ACQ_AHC1 (lo) / ACQ_AHC0 (hi) / ACQ_AHC0 (lo)) - register field descriptions Field Description 31-0 AHC[31:0] Low power Ah counter (32-Bit signed integer, two's complement). Reading one 16-Bit part of the register will buffer the second. Reading the second will unlock the buffer. See Section 4.3.4.1.1.2, "Current ampere hour threshold wake-up". 4.8.6.3.22 Low pass filter coefficient Ax (LPF_Ax (hi)) Table 150. Low pass filter coefficient Ax (LPF_Ax (hi)) Offset(146) 0x80...0x9E 7 Access: User read/write 6 5 4 R 3 2 1 0 Ax[15:8] W Reset see Table 153 Notes 146. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 4.8.6.3.23 Low pass filter coefficient Ax (LPF_Ax (lo)) Table 151. Low pass filter coefficient Ax (LPF_Ax (lo)) Offset(147) 0x81...0x9F 7 R W Reset Access: User read/write 6 5 4 3 2 1 0 Ax[7:0] see Table 153 Notes 147. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 152. Low pass filter coefficient Ax - register field descriptions Field Description 15-0 Ax[15:0] Low Pass Filter Coefficient Value. x = 0...15. Data Format: MSB = Sign ("1" minus). [14:0] integer. Table 153. Low pass filter coefficient Ax - reset values Field Reset Value Field Reset Value A0 0x00F5 A8 0x1021 A1 0x0312 A9 0x0E35 A2 0x051F A10 0x0B44 A3 0x0852 A11 0x0852 A4 0x0B44 A12 0x051F A5 0x0E35 A13 0x0312 A6 0x1021 A14 0x00F5 A7 0x10E5 A15 0x0000 4.8.6.3.24 Compensation control register (COMP_CTL) Table 154. Compensation control register (COMP_CTL) Offset (148)(149) Access: User read/write 0xA0 R 15 14 13 12 11 10 9 8 0 0 0 0 0 0 0 0 PGAZM PGAOM DIAGVM DIAGIM W Reset BGCALM 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 PGAZ PGAO DIAGV DIAGI 0 0 0 0 R BGCAL W Reset CALIEM 1 0 0 0 CALIE 0 Notes 148. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 149. This Register is 16-Bit access only. Table 155. Compensation control register (COMP_CTL) - register field descriptions Field 15-14 BGCALM Description Calibration Band Gap Select - Mask 0 - writing the corresponding BGCAL bits will have no effect 1 - writing the corresponding BGCAL bits will be effective 13 PGAZM PGA Input Zero - Mask 0 - writing the PGAZ bit will have no effect 1 - writing the PGAZ bit will be effective 12 PGAOM PGA Offset Calibration - Mask 0 - writing the PGAO bit will have no effect 1 - writing the PGAO bit will be effective MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 155. Compensation control register (COMP_CTL) - register field descriptions (continued) Field Description 11 DIAGVM Diagnostic Mode Voltage Channel - Mask 0 - writing the DIAGV bit will have no effect 1 - writing the DIAGV bit will be effective 10 DIAGIM Diagnostic Mode Current Channel - Mask 0 - writing the DIAGI bit will have no effect 1 - writing the DIAGI bit will be effective 8 CALIEM Calibration IRQ Enable - Mask 0 - writing the CALIE bit will have no effect 1 - writing the CALIE bit will be effective 7-6 BGCAL Calibration Band Gap Select 00 - Bandgap disconnected from calibration 01 - BG1 selected as calibration reference 10 - BG2 selected as calibration reference (default) 11 - BG3 selected as calibration reference 5 PGAZ PGA Input Zero 0 - Programmable gain amplifier inputs in normal operation 1 - Programmable gain amplifier inputs shorted for Calibration 4 PGAO PGA Offset Calibration Start 0 - PGA normal operation 1 - PGA internal offset calibration start (PGAOF will indicate calibration complete). PGAZ has to be set to 1 during calibration. The bit will remain set after the calibration is complete. It has to be cleared by writing 0 before it can be set to start the next calibration. The current measurement channel has to be enabled (ACQ_CTL[CMEN]=1) in order to perform the PGA offset compensation. 3 DIAGV Diagnostic Mode Voltage Channel 0 - Calibration reference disconnected from the voltage channel input 1 - Calibration reference connected to the voltage channel input for calibration. Manual conversion needed to measure reference 2 DIAGI Diagnostic Mode Current Channel 0 - Calibration reference disconnected from the current channel input 1 - Calibration reference connected to the current channel input for calibration. Manual conversion needed to measure reference 0 CALIE Calibration IRQ Enable 0 - Calibration request interrupt disabled 1 - Calibration request interrupt enabled. A temperature "out of calibration range" will cause a calibration interrupt request 4.8.6.3.25 Compensation status register (COMP_SR) Table 156. Compensation status register (COMP_SR) Offset(150) 0xA2 R Access: User read/write 7 6 5 4 3 2 1 0 0 BGRF 0 PGAOF 0 0 0 CALF 0 0 W Reset Write 1 will clear the flags and will start next calibration steps 0 0 0 0 0 0 Notes 150. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 157. Compensation status register (COMP_SR) - register field descriptions Field Description Band Gap Reference Status Flag 0 - Indicates the reference bandgap has not been set / applied 1 - Reference bandgap has been set. Writing 1 will clear the flag 6 BGRF PGA Internal Offset Compensation Complete Flag 0 - PGA offset compensation ongoing or not started since last flag clear 1 - PGA offset compensation finished since last flag clear. Writing 1 will clear the flag 4 PGAOF Calibration Request Status Flag 0 - No Temperature out of range condition detected 1 - Temperature out of range condition detected. Writing 1 will clear the flag 0 CALF 4.8.6.3.26 Temperature filtering period (COMP_TF) Table 158. Temperature filtering period (COMP_TF) Offset(151) 0xA3 R Access: User read / write 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 TMF[2:0] W Reset 1 0 0 0 Notes 151. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 159. Temperature filtering period (COMP_TF) - register field descriptions Field Description 2-0 TMF[2:0] 4.8.6.3.27 Recalibration Temperature Filtering period. Defines the number of measurements above / below the Max / Min thresholds that are required before a calibration request is detected. Max. temp. before recalibration (COMP_TMAX) Table 160. Max. temp. before recalibration (COMP_TMAX) Offset (152)(153) Access: User read/write 0xA4 15 14 13 12 R 9 8 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 0 0 0 0 R TCMAX[7:0] W Reset 10 TCMAX[15:8] W Reset 11 0 0 0 0 Notes 152. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 153. This Register is 16 Bit access only. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 161. Max. temp. before recalibration (COMP_TMAX) - register field descriptions Field Description 15-0 TCMAX[15:0] Maximum Temperature before recalibration. Once the internal temperature measurement result is above or equal to TCMAX, the TMF filter counter is increased, if below, the counter is decreased. 4.8.6.3.28 Min.temp. before recalibration (COMP_TMIN) Table 162. Min. temp. before recalibration (COMP_TMIN) Offset (154)(155) Access: User read/write 0xA6 15 14 13 12 R 11 10 9 8 TCMIN[15:8] W Reset 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 0 0 0 0 R TCMIN[7:0] W Reset 0 0 0 0 Notes 154. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 155. This Register is 16-Bit access only. Table 163. Min. Temp. before recalibration (COMP_TMIN) - register field descriptions Field Description 15-0 TCMIN[15:0] Minimum Temperature before recalibration. Once the internal temperature measurement result is below TCMIN, the TMF filter counter is increased, if above or equal, the counter is decreased. 4.8.6.3.29 Offset voltage compensation (COMP_VO) Table 164. Offset voltage compensation (COMP_VO) Offset(156) 0xAA Access: User read/write 7 6 5 4 R 2 1 0 0 0 0 0 VOC[7:0] W Reset 3 0 0 0 0 Notes 156. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 165. Offset voltage compensation (COMP_VO) - register field descriptions Field 7-0 VOC[7:0] Description Voltage Offset Compensation Buffer. This register contains the voltage channel offset compensation as an 8-bit signed char (two complement). 0x7F = max, 0x80 =min. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.8.6.3.30 Offset current compensation window (COMP_IO) Table 166. Offset current compensation window (COMP_IO) Offset(157) 0xAB Access: User read/write 7 6 5 4 R 3 2 1 0 0 0 0 0 COC[7:0] W Reset 0 0 0 0 Notes 157. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 167. Offset current compensation window (COMP_IO) - register field descriptions Field Description 7-0 COC[7:0] Current Offset Compensation Buffer window for the 8 current compensation values stored. The content of the IGAIN[2:0] register will determine the compensation buffer accessed through the COC[7:0] register. This register contains the current channel offset compensation as 8-bit signed char (two complement). 0x7F = max, 0x80 =min. 4.8.6.3.31 Gain voltage comp. VSENSE channel (COMP_VSG) Table 168. Gain voltage comp. VSENSE channel (COMP_VSG) Offset (158)(159) Access: User read/write 0xAC R 15 14 13 12 11 10 9 0 0 0 0 0 0 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 0 0 0 0 VSGC[9:8] W Reset R VSGC[7:0] W Reset 8 0 0 0 0 Notes 158. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 159. This Register is 16 Bit access only. Table 169. Gain voltage comp. VSENSE channel (COMP_VSG) - register field descriptions Field 9-0 VSGC[9:0] Description Voltage Channel Gain Compensation Buffer. This register contains the voltage channel gain compensation as 10-bit special coded value. Refer to Section 4.8.3.4, "Compensation" for details. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.8.6.3.32 8 x gain current compensation 4...512 (COMP_IG4... COMP_IG512) Table 170. 8 x Gain current compensation 4...512 (COMP_IG4... COMP_IG512) Offset (160)(161) Access: User read/write 0xB0... 0xBE R 15 14 13 12 11 10 9 0 0 0 0 0 0 0 0 0 0 0 0 1 0 7 6 5 4 3 2 1 0 0 0 0 IGC4...512 (hi) [9:8] W Reset R 8 IGC4...512 (lo) [7:0] W Reset 0 0 0 0 0 Notes 160. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 161. This Register is 16 Bit access only. Table 171. 8 x gain current compensation 4...512 (COMP_IG4... COMP_IG512) - register field descriptions Field Description 9-0 IGC4[9:0] IGC8[9:0] IGC16[9:0] IGC32[9:0] IGC64[9:0] IGC128[9:0] IGC256[9:0] IGC512[9:0] 4.8.6.3.33 Individual Current Gain Compensation Buffers for the 8 Gain configurations. Those registers contain the current channel gain compensation as 10-bit special coded value. Refer to Section 4.8.3.4, "Compensation" for details. 8 x offset PGA compensation (COMP_PGAO4...COMP_PGAO512) Table 172. 8 x offset PGA compensation (COMP_PGAO4... COMP_PGAO512) Offset (162)(163) R Access: User read/write 0xC0... 0xCE 15 14 13 12 11 10 0 0 0 0 0 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 0 0 0 R PGAOC4...512 (lo) [7:0] W Reset 8 PGAOC4...512 (hi) [10:8] W Reset 9 0 0 0 0 0 Notes 162. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 163. This Register is 16 Bit access only. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 173. 8 x offset PGA compensation (COMP_PGAO4...COMP_PGAO512) - register field descriptions Field Description 10-0 PGAOC4[10:0] PGAOC8[10:0] PGAOC16[10:0] PGAOC32[10:0] PGAOC64[10:0] PGAOC128[10:0] PGAOC256[10:0] PGAOC512[10:0] Individual PGA Offset Compensation Buffers for the 8 Gain configurations. Those registers contain the PGA Offset compensation as 11-bit special coded value. Refer to Section 4.8.3.4, "Compensation" for details. 4.8.6.3.34 Internal temp. offset compensation (COMP_ITO) Table 174. Internal temp. offset compensation (COMP_ITO) Offset(164) 0xD0 Access: User read/write 7 6 5 4 R 3 2 1 0 0 0 0 0 ITOC[7:0] W Reset 0 0 0 0 Notes 164. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 175. Internal temp. offset compensation (COMP_ITO) - register field descriptions Field Description 7-0 ITOC[7:0] Internal Temperature Offset Compensation Buffer. This register contains the Internal Temperature Offset compensation as 8-bit signed char (two complement). Refer to Section 4.8.3.4, "Compensation" for details. 4.8.6.3.35 Internal temp. gain compensation (COMP_ITG) Table 176. Internal temp. gain compensation (COMP_ITG) Offset(165) 0xD1 Access: User read/write 7 6 5 4 R 3 2 1 0 0 0 0 0 ITGC[7:0] W Reset 1 0 0 0 Notes 165. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 177. Internal temp. gain compensation (COMP_ITG) - register field descriptions Field 7-0 ITGC[7:0] Description Internal Temperature Gain Compensation Buffer. This register contains the Internal Temperature Gain compensation as 8-bit special coded value. Refer to Section 4.8.3.4, "Compensation" for details. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.8.6.3.36 External temp. offset compensation (COMP_ETO) Table 178. External temp. offset compensation (COMP_ETO) Offset(166) 0xD2 Access: User read/write 7 6 5 4 R 3 2 1 0 0 0 0 0 ETOC[7:0] W Reset 0 0 0 0 Notes 166. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 179. External temp. offset compensation (COMP_ETO) - register field descriptions Field Description 7-0 ETOC[7:0] External Temperature Offset Compensation Buffer. This register contains the External Temperature Offset compensation as 8-bit signed char (two complement). Refer to Section 4.8.3.4, "Compensation" for details. 4.8.6.3.37 External temp. gain compensation (COMP_ETG) Table 180. External temp. gain compensation (COMP_ETG) Offset(167) 0xD3 Access: User read/write 7 6 5 4 R 3 2 1 0 0 0 0 0 ETGC[7:0] W Reset 1 0 0 0 Notes 167. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 181. External temp. gain compensation (COMP_ETG) - register field descriptions Field Description 7-0 ETGC[7:0] External Temperature Gain Compensation Buffer. This register contains the External Temperature Gain compensation as 8-bit special coded value. Refer to Section 4.8.3.4, "Compensation" for details. 4.9 Window watchdog The MM912_637 analog die includes a configurable window watchdog which is active in Normal mode. The watchdog module is based on the Low Power Oscillator (LPCLK) to operate independently from the MCU based D2DCLK clock. The watchdog timeout (tWDTO) can be configured between 4.0 ms and 2048 ms using the watchdog control register (WD_CTL). NOTE As the watchdog timing is based on the LPCLK, its accuracy is based on the trimming applied to the TRIM_OSC register. The given timeout values are typical values only. During Low Power mode, the watchdog feature is not active, a D2D read during Stop mode will have the WDOFF bit set. After wake-up and transition to Normal mode, the watchdog is reset to the same state as when following a Power-On-Reset (POR). To clear the watchdog counter, a alternating write has to be performed to the watchdog rearm register (WD_RR). The first write after the wake-up or RESET_A has been released has to be 0xAA, the next one has to be 0x55. After the wake-up or RESET_A has been released, there will be a standard (non window) watchdog active with a fixed timeout of tIWDTO (tWDTO = b100 = 256 ms). The Watchdog Window Open (WDWO) bit is set during that time. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS WD Register WRITE = 0xAA (to be continued) Window WD timing (tWDTO) tWDTO / 2 tWDTO / 2 RESET_A release WD Register WRITE = 0x55 Initial WD Reg. WRITE = 0xAA Window Watch Dog Window Closed Window Watch Dog Window Closed Window Watch Dog Window Open Window Watch Dog Window Open Standard Initial Watch Dog (no window) t tIWDTO Figure 39. MM912_637 Analog die watchdog operation To change from the standard initial watchdog to the window watchdog, the initial counter reset has to be performed by writing 0xAA to the Watchdog rearm register (WD_RR) before tIWDTO is reached. NOTE An immediate trimming of the low power oscillator after reset release assures tIWDTO being at the maximum accuracy. See chapter 5.2.2.5, "Low power oscillator trimming (TRIM_OSC)". If the tIWDTO timeout is reached with no counter reset or a value different from 0xAA written to the WD_RR, a watchdog reset will occur. Once entering window watchdog mode, the first half of the time, tWDTO is forbidden for a counter reset. To reset the watchdog counter, an alternating write of 0x55 and 0xAA has to be performed within the second half of the tWDTO. A Window Open (WDWO) flag will indicate the current status of the window. A timeout or wrong value written to the WD_RR will force a watchdog reset. If the first write to the WD_CTL register is 000 (WD OFF), the WD will be disabled(168). If a different cycle time is written or the WD is refreshed with the default Window (100) unchanged, no further "000" write will be effective (a change of cycle time would still be possible). Notes 168. The Watchdog can be enabled any time later. 4.9.1 4.9.1.1 Memory map and registers Overview This section provides a detailed description of the memory map and registers. 4.9.1.2 Module memory map The memory map for the Watchdog module is given in Table 62 Table 182. Module memory map Offset (169),(170) 0x10 Name WD_CTL Watchdog control register 7 6 5 4 3 2 1 0 R 0 0 0 0 0 0 0 0 W Reserved R W 0x12 WD_SR R Watchdog status register W Reserved 0 WDTOM[2:0] 0 0 0 0 0 0 0 0 WDTO[2:0] 0 WDOFF WDWO MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 182. Module memory map (continued) Offset Name 0x13 Reserved (169),(170) 0x14 R R Watchdog rearm register W Reserved 0x16 Reserved 0x17 Reserved 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 W WD_RR 0x15 7 R WDR[7:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W Notes 169. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 170. Register Offset with the "lo" address value not shown have to be accessed in 16-Bit mode. 8-Bit access will not function. 4.9.1.3 Register descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bits and field function follow the register diagrams, in bit order. 4.9.1.3.1 Watchdog control register (WD_CTL) Table 183. Watchdog control register (WD_CTL) Offset (171),(172) Access: User write 0x10 15 14 13 12 11 10 9 8 R 0 0 0 0 0 0 0 0 W Reserved Reset 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 R W Reset Reserved 1 WDTOM WDTO 1 0 0 Notes 171. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 172. This Register is 16 Bit access only. Table 184. Watchdog control register (WD_CTL) - register field descriptions Field 15 Reserved 10-8 WDTOM[2:0] Description This reserved bit is used for test purpose. Software has to write a 0 into this bit. Watchdog Timeout - Mask any setting other than 111 - writing the WDTO bits will have no effect 111 - writing the WDTO bits will be effective MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 184. Watchdog control register (WD_CTL) - register field descriptions (continued) Field 7 Reserved 2-0 WDTO[2:0] Description This reserved bit is used for test purpose. Software has to write a 0 into this bit. Watchdog Timeout Configuration - configuring the watchdog timeout duration tWDTO. 000 - Watchdog OFF 001 - 4.0 ms 010 - 16.0 ms 011 - 64.0 ms 100 - 256 ms (default) 101 - 512 ms 110 - 1024 ms 111 - 2048 ms 4.9.1.3.2 Watchdog status register (WD_SR) Table 185. Watchdog status register (WD_SR) Offset(173) 0x12 R Access: User read 7 6 5 4 3 2 1 0 0 0 0 0 0 0 WDOFF WDWO W Notes 173. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 186. Watchdog status register (WD_SR) - register field descriptions Field Description 1 WDOFF Watchdog Status - Indicating the watchdog module being enabled/disabled 1 - Watchdog Off 0 - Watchdog Active 0 WDWO Watchdog Window Status 1 - Open - Indicating the watchdog window is currently open for counter reset. 0 - Closed - Indicating the watchdog window is currently closed for counter reset. Resetting the watchdog with the window closed will cause a watchdog - reset. 4.9.1.3.3 Watchdog rearm register (WD_RR) Table 187. Watchdog rearm register (WD_RR) Offset(174) 0x14 Access: User read/write 7 6 5 4 R 2 1 0 0 0 0 0 WDR W Reset 3 0 0 0 0 Notes 174. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 188. Watchdog rearm register (WD_RR) - register field descriptions Field Description 7-0 WDR[7:0] 4.10 Watchdog rearm register- Writing this register with the correct value (0xAA alternating 0x55) while the window is open will reset the watchdog counter. Writing the register while the watchdog is disabled will have no effect. Basic timer module - TIM (TIM16B4C) 4.10.1 4.10.1.1 Introduction Overview The basic timer consists of a 16-bit, software-programmable counter driven by a seven stage programmable prescaler. This timer can be used for many purposes, including input waveform measurements while simultaneously generating an output waveform. Pulse widths can vary from microseconds to many seconds. This timer contains four complete input capture/output compare channels [IOC 3:0]. The input capture function is used to detect a selected transition edge and record the time. The output compare function is used for generating output signals or for timer software delays. Full access for the counter registers or the input capture/output compare registers should take place in a16-bit word access. Accessing high bytes and low bytes separately for all of these registers may not yield the same result as accessing them in one word. 4.10.1.2 Features The TIM16B4C includes these distinctive features: * Four input capture/output compare channels. * Clock prescaler * 16-bit counter * Timer counter reset on Output Compare 3 4.10.1.3 Modes of operation The TIM16B4C is driven by the D2DCLK / 4 during Normal mode and the ALFCLK during Low Power mode. 4.10.1.4 Block diagram D2DCLK / 4 or ALFCLK Prescaler Timer overflow interrupt 16-bit Counter Channel 1 Input capture Output compare Channel 2 Input capture Output compare Timer channel 0 interrupt Registers Timer channel 3 interrupt Channel 0 Input capture Output compare Channel 3 Input capture Output compare IOC0 IOC1 IOC2 IOC3 Figure 40. Timer block diagram For more information on the respective functional descriptions see Section 4.10.4, "Functional description" of this chapter. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.10.2 Signal description 4.10.2.1 Overview The TIM16B4C module can be used as regular time base, or can be internally routed to the PTB and LIN module. Refer to the corresponding sections for further details, see Section 4.12, "LIN" and Section 4.11, "General purpose I/O - GPIO". In addition, the TIM16B4C module is used during Low Power mode to determine the cyclic wake-up and current measurement timing (Section 4.3, "Analog die - power, clock and resets - PCR") 4.10.2.2 Detailed signal descriptions 4.10.2.2.1 IOC3 - input capture and output compare channel 3 This pin serves as the input capture or output compare for channel 3. 4.10.2.2.2 IOC2 - input capture and output compare channel 2 This pin serves as the input capture or output compare for channel 2. 4.10.2.2.3 IOC1 - input capture and output compare channel 1 This pin serves as the input capture or output compare for channel 1. 4.10.2.2.4 IOC0 - input capture and output compare channel 0 This pin serves as the input capture or output compare for channel 0. 4.10.3 Memory map and registers 4.10.3.1 Overview This section provides a detailed description of all memory and registers. 4.10.3.2 Module memory map The memory map for the TIM16B4C module is given in Table 62. Table 189. Module memory map Offset Name (175) TIOS R Timer Input Capture/Output Compare Select W CFORC R Timer Compare Force Register W OC3M R Output Compare 3 Mask Register W OC3D R Output Compare 3 Data Register W 0x20 0x21 (176) 0x22 0x23 7 6 5 4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 3 2 1 0 IOS3 IOS2 IOS1 IOS0 0 0 0 0 FOC3 FOC2 FOC1 FOC0 OC3M3 OC3M2 OC3M1 OC3M0 OC3D3 OC3D2 OC3D1 OC3D0 MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 189. Module memory map (continued) Offset Name (175) 0x24 (177) 0x25 (177) 0x26 0x27 0x28 0x29 0x2A 0x2B 0x2C 0x2D 0x2E (178) 0x2F (178) 0x30 (178) 0x31 (178) 0x32 (178) 0x33 (178) 7 TCNT (hi) R Timer Count Register W TCNT (lo) R Timer Count Register W TSCR1 R Timer System Control Register 1 W TTOV R Timer Toggle Overflow Register W TCTL1 R Timer Control Register 1 W TCTL2 R Timer Control Register 2 W TIE R Timer Interrupt Enable Register W TSCR2 R Timer System Control Register 2 W TFLG1 R Main Timer Interrupt Flag 1 W TFLG2 R Main Timer Interrupt Flag 2 W TC0 (hi) R Timer Input Capture/Output Compare Register 0 W TC0 (lo) R Timer Input Capture/Output Compare Register 0 W TC1 (hi) R Timer Input Capture/Output Compare Register 1 W TC1 (lo) R Timer Input Capture/Output Compare Register 1 W TC2 (hi) R Timer Input Capture/Output Compare Register 2 W TC2 (lo) R Timer Input Capture/Output Compare Register 2 W 6 5 4 3 2 1 0 0 0 0 0 TOV3 TOV2 TOV1 TOV0 TCNT 0 0 0 0 0 0 OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0 EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A 0 0 0 0 C3I C2I C1I C0I 0 0 0 TCRE PR2 PR1 PR0 0 0 0 C3F C2F C1F C0F 0 0 0 0 0 0 0 TEN TOI 0 TOF TFFCA TC0 TC1 TC2 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 189. Module memory map (continued) Offset Name (175) 0x34 (178) 0x35 (178) 7 TC3 (hi) R Timer Input Capture/Output Compare Register 3 W TC3 (lo) R Timer Input Capture/Output Compare Register 3 W TIMTST R Timer Test Register W 0x36 (177) 6 5 4 3 2 0 0 1 0 TC3 0 0 0 0 0 TCBYP Notes 175. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 176. Always reads $00. 177. Only writable in special modes. (Refer to the SOC Guide for different modes). 178. A write to these registers has no meaning or effect during input capture. 4.10.3.3 Register descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. 4.10.3.3.1 Timer input capture/output compare select (TIOS) Table 190. Timer input capture/output compare select (TIOS) Offset(179) 0x20 R Access: User read/write 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 1 0 IOS3 IOS2 IOS1 IOS0 0 0 0 0 Notes 179. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 191. TIOS - register field descriptions Field 3-0 IOS[3-0] Description Input Capture or Output Compare Channel Configuration 0 - The corresponding channel acts as an input capture. 1 - The corresponding channel acts as an output compare. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.10.3.3.2 Timer compare force register (CFORC) Table 192. Timer compare force register (CFORC) Offset(180) 0x21 Access: User write R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 FOC3 FOC2 FOC1 FOC0 0 0 0 0 W Reset 0 0 0 0 Notes 180. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 193. CFORC - register field descriptions Field Description Force Output Compare Action for Channel 3-0 0 - Force output compare action disabled. Input capture or output compare channel configuration 1 - Force output compare action enabled 3-0 FOC[3-0] A write to this register with the corresponding (FOC 3:0) data bit(s) set causes the action programmed for output compare on channel "n" to occur immediately.The action taken is the same as if a successful comparison had just taken place with the TCn register, except the interrupt flag does not get set. NOTE A successful channel 3 output compare overrides any channel 2:0 compare. If a forced output compare on any channel occurs at the same time as the successful output compare, then a forced output compare action will take precedence and the interrupt flag will not get set. 4.10.3.3.3 Output compare 3 mask register (OC3M) Table 194. Output compare 3 mask register (OC3M) Offset(181) 0x22 R Access: User read/write 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 1 0 OC3M3 OC3M2 OC3M1 OC3M0 0 0 0 0 Notes 181. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 195. OC3M - register field descriptions Field 3-0 OC3M[3-0] Description Output Compare 3 Mask "n" Channel bit 0 - Does not set the corresponding port to be an output port 1 - Sets the corresponding port to be an output port when this corresponding TIOS bit is set to be an output compare Setting the OC3Mn (n ranges from 0 to 2) will set the corresponding port to be an output port when the corresponding TIOSn (n ranges from 0 to 2) bit is set to be an output compare. NOTE A successful channel 3 output compare overrides any channel 2:0 compares. For each OC3M bit that is set, the output compare action reflects the corresponding OC3D bit. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.10.3.3.4 Output compare 3 data register (OC3D) Table 196. Output compare 3 data register (OC3D) Offset(182) 0x23 R Access: User read/write 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 1 0 OC3D3 OC3D2 OC3D1 OC3D0 0 0 0 0 Notes 182. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 197. OC3D - register field descriptions Field Description 3 OC3D3 Output Compare 3 Data for Channel 3 2 OC3D2 Output Compare 3 Data for Channel 2 1 OC3D1 Output Compare 3 Data for Channel 1 0 OC3D0 Output Compare 3 Data for Channel 0 NOTE A channel 3 output compare will cause bits in the output compare 3 data register to transfer to the timer port data register if the corresponding output compare 3 mask register bits are set. 4.10.3.3.5 Timer count register (TCNT) Table 198. Timer count register (TCNT) Offset(183) 0x24, 0x25 R W Reset R W Reset Access: User read (anytime)/write (special mode) 15 14 13 12 11 10 9 8 tcnt15 tcnt14 tcnt13 tcnt12 tcnt11 tcnt10 tcnt9 tcnt8 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 tcnt7 tcnt6 tcnt5 tcnt4 tcnt3 tcnt2 tcnt1 tcnt0 0 0 0 0 0 0 0 0 Notes 183. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 199. TCNT - register field descriptions Field 15-0 tcnt[15-0] Description 16-Bit Timer Count Register MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS NOTE The 16-bit main timer is an up counter. Full access to the counter register should take place in one clock cycle. A separate read/write for high bytes and low bytes will give a different result than accessing them as a word. The period of the first count after a write to the TCNT registers may be a different length, because the write is not synchronized with the prescaler clock. 4.10.3.3.6 Timer system control register 1 (TSCR1) Table 200. Timer system control register 1 (TSCR1) Offset(184) 0x26 Access: User read/write 7 R TEN W Reset 0 6 5 0 0 0 0 4 TFFCA 0 3 2 1 0 0 0 0 0 0 0 0 0 Notes 184. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 201. TSCR1 - register field descriptions Field 7 TEN 4 TFFCA Description Timer Enable 1 = Enables the timer. 0 = Disables the timer. (Used for reducing power consumption). Timer Fast Flag Clear All 1 = For TFLG1 register, a read from an input capture or a write to the output compare channel [TC 3:0] causes the corresponding channel flag, CnF, to be cleared. For TFLG2 register, any access to the TCNT register clears the TOF flag. This has the advantage of eliminating software overhead in a separate clear sequence. Extra care is required to avoid accidental flag clearing due to unintended accesses. 0 = Allows the timer flag clearing. 4.10.3.3.7 Timer toggle on overflow register 1 (TTOV) Table 202. Timer toggle on overflow register 1 (TTOV) Offset(185) 0x27 R Access: User read/write 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 1 0 TOV3 TOV2 TOV1 TOV0 0 0 0 0 Notes 185. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 203. TTOV - register field descriptions Field 3-0 TOV[3-0] Description Toggle On Overflow Bits 1 = Toggle output compare pin on overflow feature enabled. 0 = Toggle output compare pin on overflow feature disabled. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS NOTE TOVn toggles the output compare pin on overflow. This feature only takes effect when the corresponding channel is configured for an output compare mode. When set, an overflow toggle on the output compare pin takes precedence over forced output compare events. 4.10.3.3.8 Timer control register 1 (TCTL1) Table 204. Timer control register 1 (TCTL1) Offset(186) 0x28 R W Reset Access: User read/write 7 6 5 4 3 2 1 0 OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0 0 0 0 0 0 0 0 0 Notes 186. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 205. TCTL1 - register field descriptions Field Description 7,5,3,1 OMn Output Mode bit 6,4,2,0 OLn Output Level bit NOTE These four pairs of control bits are encoded to specify the output action to be taken as a result of a successful Output Compare on "n" channel. When either OMn or OLn, the pin associated with the corresponding channel becomes an output tied to its IOC. To enable output action by the OMn and OLn bits on a timer port, the corresponding bit in OC3M should be cleared. Table 206. Compare result output action OMn OLn Action 0 0 Timer disconnected from output pin logic 0 1 Toggle OCn output line 1 0 Clear OCn output line to zero 1 1 Set OCn output line to one 4.10.3.3.9 Timer control register 2 (TCTL2) Table 207. Timer control register 2 (TCTL2) Offset(187) 0x29 R W Reset Access: User read/write 7 6 5 4 3 2 1 0 EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A 0 0 0 0 0 0 0 0 Notes 187. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 208. TCTL2 - register field descriptions Field EDGnB,EDGn A Description Input Capture Edge Control These four pairs of control bits configure the input capture edge detector circuits. Table 209. Edge detector circuit configuration EDGnB EDGnA Configuration 0 0 Capture disabled 0 1 Capture on rising edges only 1 0 Capture on falling edges only 1 1 Capture on any edge (rising or falling) 4.10.3.3.10 Timer interrupt enable register (TIE) Table 210. Timer interrupt enable register (TIE) Offset(188) 0x2A R Access: User read/write 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 1 0 C3I C2I C1I C0I 0 0 0 0 Notes 188. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 211. TIE - register field descriptions Field 3-0 C[3-0]I Description Input Capture/Output Compare Interrupt Enable. 1 = Enables corresponding Interrupt flag (CnF of TFLG1 register) to cause a hardware interrupt 0 = Disables corresponding Interrupt flag (CnF of TFLG1 register) from causing a hardware interrupt 4.10.3.3.11 Timer system control register 2 (TSCR2) Table 212. Timer system control register 2 (TSCR2) Offset(189) 0x2B Access: User read/write 7 R W Reset TOI 0 6 5 4 0 0 0 0 0 0 3 2 1 0 TCRE PR2 PR1 PR0 0 0 0 0 Notes 189. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 213. TIE - register field descriptions Field 7 TOI 3 TCRE 3-0 PR[2:0] Description Timer Overflow Interrupt Enable 1 = Hardware interrupt requested when TOF flag set in TFLG2 register. 0 = Hardware Interrupt request inhibited. TCRE -- Timer Counter Reset Enable 1 = Enables timer counter reset by a successful output compare on channel 3 0 = Inhibits timer counter reset and counter continues to run. Timer Prescaler Select These three bits select the frequency of the timer prescaler clock derived from the bus clock as shown in Table 214. NOTE This mode of operation is similar to an up-counting modulus counter. If register TC3 = $0000 and TCRE = 1, the timer counter register (TCNT) will stay at $0000 continuously. If register TC3 = $FFFF and TCRE = 1, TOF will not be set when the timer counter register (TCNT) is reset from $FFFF to $0000. The newly selected prescale factor will not take effect until the next synchronized edge, where all prescale counter stages equal zero. Table 214. Timer clock selection PR2 PR1 PR0 Timer Clock(190) 0 0 0 TimerClk / 1 0 0 1 TimerClk / 2 0 1 0 TimerClk / 4 0 1 1 TimerClk / 8 1 0 0 TimerClk / 16 1 0 1 TimerClk / 32 1 1 0 TimerClk / 64 1 1 1 TimerClk / 128 Notes 190. TimerClk = D2DCLK/4 or ALFCLK 4.10.3.3.12 Main timer interrupt flag 1 (TFLG1) Table 215. Main timer interrupt flag 1 (TFLG1) Offset(191) 0x2C R Access: User read/write 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 1 0 C3F C2F C1F C0F 0 0 0 0 Notes 191. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 216. TFLG1 - register field descriptions Field 3-0 C[3:0]F Description Input Capture/Output Compare Channel Flag. 1 = Input capture or output compare event occurred 0 = No event (input capture or output compare event) occurred. NOTE These flags are set when an input capture or output compare event occurs. Flag set on a particular channel is cleared by writing a one to that corresponding CnF bit. Writing a zero to CnF bit has no effect on its status. When TFFCA bit in TSCR register is set, a read from an input capture or a write into an output compare channel will cause the corresponding channel flag CnF to be cleared. 4.10.3.3.13 Main timer interrupt flag 2 (TFLG2) Table 217. Main timer interrupt flag 2 (TFLG2) Offset(192) 0x2D Access: User read/write 7 R W Reset TOF 0 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Notes 192. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 218. TFLG2 - register field descriptions Field 7 TOF Description Timer Overflow Flag 1 = Indicates that an interrupt has occurred (Set when 16-bit free-running timer counter overflows from $FFFF to $0000) 0 = Flag indicates an interrupt has not occurred. NOTE The TFLG2 register indicates when an interrupt has occurred. Writing a one to the TOF bit will clear it. Any access to TCNT will clear TOF bit of TFLG2 register if the TFFCA bit in TSCR register is set. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.10.3.3.14 Timer input capture/output compare registers (TC3 - TC0) Table 219. Timer input capture/output compare register 0 (TC0) Offset(193) 0x2E, 0x2F R W Reset R W Reset Access: User read/write 15 14 13 12 11 10 9 8 tc0_15 tc0_14 tc0_13 tc0_12 tc0_11 tc0_10 tc0_9 tc0_8 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 tc0_7 tc0_6 tc0_5 tc0_4 tc0_3 tc0_2 tc0_1 tc0_0 0 0 0 0 0 0 0 0 Notes 193. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 220. Timer input capture/output compare register 1(TC1) Offset(194) 0x30, 0x31 R W Reset R W Reset Access: User read/write 15 14 13 12 11 10 9 8 tc1_15 tc1_14 tc1_13 tc1_12 tc1_11 tc1_10 tc1_9 tc1_8 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 tc1_7 tc1_6 tc1_5 tc1_4 tc1_3 tc1_2 tc1_1 tc1_0 0 0 0 0 0 0 0 0 Notes 194. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 221. Timer input capture/output compare register 2(TC2) Offset(195) 0x32, 0x33 R W Reset R W Reset Access: User read/write 15 14 13 12 11 10 9 8 tc2_15 tc2_14 tc2_13 tc2_12 tc2_11 tc2_10 tc2_9 tc2_8 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 tc2_7 tc2_6 tc2_5 tc2_4 tc2_3 tc2_2 tc2_1 tc2_0 0 0 0 0 0 0 0 0 Notes 195. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 222. Timer input capture/output compare register 3(TC3) Offset(196) 0x34, 0x35 R W Reset R W Reset Access: User read/write 15 14 13 12 11 10 9 8 tc3_15 tc3_14 tc3_13 tc3_12 tc3_11 tc3_10 tc3_9 tc3_8 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 tc3_7 tc3_6 tc3_5 tc3_4 tc3_3 tc3_2 tc3_1 tc3_0 0 0 0 0 0 0 0 0 Notes 196. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 223. TCn - register field descriptions Field 15-0 tcn[15-0] Description 16 Timer Input Capture/Output Compare Registers NOTE TRead anytime. Write anytime for output compare function. Writes to these registers have no effect during input capture. Depending on the TIOS bit for the corresponding channel, these registers are used to latch the value of the free-running counter when a defined transition is sensed by the corresponding input capture edge detector or to trigger an output action for output compare. Read/Write access in byte mode for high byte should takes place before low byte otherwise it will give a different result. 4.10.4 4.10.4.1 Functional description general This section provides a complete functional description of the timer TIM16B4C block. Refer to the detailed timer block diagram in Figure 41 as necessary. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS D2D Clock / 4 or ALFCLK channel 3 output compare PR[2:1:0] TCRE PRESCALER CxI TCNT(hi):TCNT(lo) CxF CLEAR COUNTER 16-BIT COUNTER TOF INTERRUPT LOGIC TOI TE TOF CHANNEL 0 16-BIT COMPARATOR C0F TC0 EDG0A EDG0B EDGE DETECT C0F OM:OL0 CH. 0 CAPTURE IOC0 PIN LOGIC CH. 0 COMPARE TOV0 IOC0 PIN IOC0 CHANNEL3 16-BIT COMPARATOR TC3 EDG3A EDG3B C3F C3F EDGE DETECT CH.3 CAPTURE IOC3 PIN LOGIC CH.3 COMPARE OM:OL3 TOV3 IOC3 PIN IOC3 Figure 41. Detailed timer block diagram 4.10.4.2 Prescaler The prescaler divides the bus clock by 1, 2, 4, 8,16, 32, 64, or 128. The prescaler select bits, PR[2:0], select the prescaler divisor. PR[2:0] are in the timer system control register 2 (TSCR2). 4.10.4.3 Input capture Clearing the I/O (input/output) select bit, IOSn, configures channel n as an input capture channel. The input capture function captures the time at which an external event occurs. When an active edge occurs on the pin of an input capture channel, the timer transfers the value in the timer counter into the timer channel registers, TCn. The minimum pulse width for the input capture input is greater than two bus clocks. An input capture on channel n sets the CnF flag. The CnI bit enables the CnF flag to generate interrupt requests. 4.10.4.4 Output compare Setting the I/O select bit, IOSn, configures channel n as an output compare channel. The output compare function can generate a periodic pulse with a programmable polarity, duration, and frequency. When the timer counter reaches the value in the channel registers of an output compare channel, the timer can set, clear, or toggle the channel pin. An output compare on channel n sets the CnF flag. The CnI bit enables the CnF flag to generate interrupt requests. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS The output mode and level bits, OMn and OLn, select set, clear, toggle on output compare. Clearing both OMn and OLn disconnects the pin from the output logic. Setting a force output compare bit, FOCn, causes an output compare on channel n. A forced output compare does not set the channel flag. A successful output compare on channel 3 overrides output compares on all other output compare channels. The output compare 3 mask register masks the bits in the output compare 3 data register. The timer counter reset enable bit, TCRE, enables channel 3 output compares to reset the timer counter.Writing to the timer port bit of an output compare pin does not affect the pin state. The value written is stored in an internal latch. When the pin becomes available for general-purpose output, the last value written to the bit appears at the pin. 4.10.5 Resets 4.10.5.1 General The reset state of each individual bit is listed within the Register Description Section 4.10.3, "Memory map and registers", which details the registers and their bit-fields. 4.10.6 Interrupts 4.10.6.1 General This section describes interrupts originated by the TIM16B4C block. Table 224 lists the interrupts generated by the TIM16B4C to communicate with the MCU. Table 224. TIM16B4C interrupts Interrupt Offset Vector Priority Source Description C[3:0]F - - - Timer Channel 3-0 Active high timer channel interrupts 3-0 TOF - - - Timer Overflow Timer Overflow interrupt 4.10.6.2 Description of interrupt operation The TIM16B4C uses a total of 5 interrupt vectors. The interrupt vector offsets and interrupt numbers are chip dependent. More information on interrupt vector offsets and interrupt numbers can be found in Section 4.4, "Interrupt module - IRQ". Channel [3:0] Interrupt These active high outputs is asserted by the module to request a timer channel 3 - 0 interrupt following an input capture or output compare event on these channels [3-0]. For the interrupt to be asserted on a specific channel, the enable, CnI bit of TIE register should be set. These interrupts are serviced by the system controller. 4.10.6.2.1 Timer overflow interrupt (TOF) This active high output will be asserted by the module to request a timer overflow interrupt, following the timer counter overflow when the overflow enable bit (TOI) bit of TFLG2 register is set. This interrupt is serviced by the system controller. 4.11 4.11.1 General purpose I/O - GPIO Introduction The 3 General Purpose I/Os (PTB0...2) are multipurpose ports, making internal signals available externally and providing digital inputs. L0 (PTB3) offers an additional wake-up on rising edge during low power mode. Additional routing options allow connections to the LIN, TIMER, and SCI module. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.11.2 * * * * * * Features Internal Clamping Structure to operate as High Voltage Input (PTB3/L0 only). 5.0 V (VDDX) digital port Input/Output (PTB3/L0 only as Input) Selectable internal pull-up (PTB3/L0 pull-down) resistor Selectable Wake-up Input during Low Power mode (PTB3/L0 - rising edge only). Selectable Timer Channel Input / Output Selectable connection to LIN / SCI Block diagram PE3 4.11.3 0 Z PTB3 / L0 PD3 1 PDE3 PTWU Wake-up Detection TCAP3..0 VDDX =1 PTBXx LINRX TX LIN RX SCITX PUEx TCOMP3..0 Z IC TIMER3..0 OC PTBx WKUP PTB0..PTB2 (x = 2..0) PEx Internal Wake-up DIRx (M) PDx TCAP3..0 TX SCI RX SCIRX LINTX Figure 42. General purpose I/O - block diagram MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.11.4 High voltage wake-up input - PTB3 / L0 To offer robust high voltage wake-up capabilities, the following structure is implemented for PTB3/L0. 47k 47n 2k 1k ESD 6V clamp External components 100k ESD / clamp 1p Input buffer Figure 43. L0 / PTB3 input structure (typical values indicated) NOTE Due the different implementation of the L0/PTB3, the PTWU bit needs to be set in the GPIO_IN3 register, to read the port status PD3 during Normal mode. 4.11.4.1 Modes of operation The full GPIO functionality is only available during Normal mode. The only features in available in both low power modes is the PTB3/L0 external wake-up and the wake-up routing of the timer output compare. NOTE TCOMP3...0 needs to be configured to allow timer output compare interrupts to generate a system wake-up. 4.11.5 4.11.5.1 Memory map and registers Overview This section provides a detailed description of the memory map and registers. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.11.5.2 Module memory map The memory map for the GPIO module is given in Table 62 Table 225. Module memory map Offset (197), (198) Name R 0x40 GPIO_CTL GPIO control register 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 DIR2M DIR1M DIR0M PE3M PE2M PE1M PE0M DIR2 DIR1 DIR0 PE3 PE2 PE1 PE0 0 0 0 0 PDE3 PUE2 PUE1 PUE0 0 0 0 0 PD3 PD2 PD1 PD0 TCAP3 TCAP2 TCAP1 TCAP0 SCIRX LINTX TCOMP3 TCOMP2 TCOMP1 TCOMP0 SCITX LINRX TCAP3 TCAP2 TCAP1 TCAP0 SCIRX LINTX TCOMP3 TCOMP2 TCOMP1 TCOMP0 SCITX LINRX TCAP3 TCAP2 TCAP1 TCAP0 SCIRX LINTX WKUP TCOMP3 TCOMP2 TCOMP1 TCOMP0 SCITX LINRX PTWU PTWU TCAP3 TCAP2 TCAP1 TCAP0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R 0 W 0x42 0x43 0x44 0x45 0x46 0x47 0x48 0x49 0x4A GPIO_PUC R GPIO pull up configuration W GPIO_DATA R GPIO port data register W GPIO_IN0 R Port 0 input configuration W GPIO_OUT0 R Port 0 output configuration W GPIO_IN1 R Port 1 input configuration W GPIO_OUT1 R Port 1 output configuration W GPIO_IN2 R Port 2 input configuration W GPIO_OUT2 R Port 2 output configuration W GPIO_IN3 R Port 3 input configuration W 0x4B Reserved 0x4C Reserved 0x4D Reserved 0x4E Reserved 0x4F Reserved R 0 WKUP 0 WKUP 0 0 0 PTBX0 0 0 PTBX1 0 0 PTBX2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W R W R W Notes 197. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 198. Register Offset with the "lo" address value not shown have to be accessed in 16-Bit mode. 8-Bit access will not function. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.11.5.3 Register descriptions 4.11.5.3.1 GPIO control register (GPIO_CTL) Table 226. GPIO control register (GPIO_CTL) Offset (199),(200) R Access: User read/write 0x40 15 14 13 12 11 10 9 8 0 0 0 0 0 0 0 0 DIR2M DIR1M DIR0M PE3M PE2M PE1M PE0M 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 DIR2 DIR1 DIR0 PE3 PE2 PE1 PE0 0 0 0 0 0 0 0 W Reset R 0 W Reset 0 Notes 199. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 200. Those Registers are 16-Bit access only. Table 227. GPIO control register (GPIO_CTL) Field Description 14 DIR2M Data Direction PTB2 - Mask 0 - writing the DIR2 bit will have no effect 1 - writing the DIR2 bit will be effective 13 DIR1M Data Direction PTB1 - Mask 0 - writing the DIR1 bit will have no effect 1 - writing the DIR1 bit will be effective 12 DIR0M Data Direction PTB0 - Mask 0 - writing the DIR0 bit will have no effect 1 - writing the DIR0 bit will be effective 11 PE3M Port 3 Enable - Mask 0 - writing the PE3 bit will have no effect 1 - writing the PE3 bit will be effective 10 PE2M Port 2 Enable - Mask 0 - writing the PE2 bit will have no effect 1 - writing the PE2 bit will be effective 9 PE1M Port 1 Enable - Mask 0 - writing the PE1 bit will have no effect 1 - writing the PE1 bit will be effective 8 PE0M Port 0 Enable - Mask 0 - writing the PE0 bit will have no effect 1 - writing the PE0 bit will be effective 6 DIR2 Data Direction PTB2 0 - PTB2 configured as Input 1 - PTB2 configured as Output 5 DIR1 Data Direction PTB1 0 - PTB1 configured as Input 1 - PTB1 configured as Output MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 227. GPIO control register (GPIO_CTL) (continued) Field Description 4 DIR0 Data Direction PTB0 0 - PTB0 configured as Input 1 - PTB0 configured as Output 3 PE3 Port 3 Enable(201) 0 - PTB3 Disabled (Z state) 1 - PTB3 Enabled (I) 2 PE2 Port 2 Enable(201) 0 - PTB2 disabled (Z state) 1 - PTB2 enabled (I/O) 1 PE1 Port 1 Enable(201) 0 - PTB1 disabled (Z state) 1 - PTB1 enabled (I/O) 0 PE0 Port 0 Enable(201) 0 - PTB0 disabled (Z state) 1 - PTB0 enabled (I/O) Notes 201. The port logic is always enabled. Setting PEx will connect the logic to the port I/O buffers. 4.11.5.3.2 GPIO pull-up configuration (GPIO_PUC) Table 228. GPIO pull-up configuration (GPIO_PUC) Offset(202) 0x42 R Access: User read/write 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 1 0 PDE3 PUE2 PUE1 PUE0 0 0 0 0 Notes 202. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 229. GPIO pull-up configuration (GPIO_PUC) Field Description 3 PDE3 PTB3 Pull-down Enable 0 - PTB3 pull-down disabled 1 - PTB3 pull-down enabled 2 PUE2 PTB2 Pull-up Enable 0 - PTB2 pull-up disabled 1 - PTB2 pull-up enabled 1 PUE1 PTB1 Pull-up Enable 0 - PTB1 pull-up disabled 1 - PTB1 pull-up enabled 0 PUE0 PTB0 Pull-up Enable 0 - PTB0 pull-up disabled 1 - PTB0 pull-up enabled MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.11.5.3.3 GPIO port data register (GPIO_DATA) Table 230. GPIO port data register (GPIO_DATA) Offset(203) 0x43 Access: User read 7 R 0 6 0 5 0 4 3 2 1 0 0 PD3(204) PD2 PD1 PD0 W Notes 203. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 204. Due the different implementation of the L0/PTB3, PTWU needs to be set in the GPIO_IN3 to read the PD3 port status during normal mode. Table 231. GPIO port data register (GPIO_DATA) Field Description 3 PD3 PTB3 Data Register A read returns the value of the PTB3 buffer. 2 PD2 PTB2 Data Register A read returns the value of the PTB2 buffer. 1 PD1 PTB1 Data Register A read returns the value of the PTB1 buffer. 0 PD0 PTB0 Data Register A read returns the value of the PTB0 buffer. 4.11.5.3.4 Port 0 input configuration (GPIO_IN0) Table 232. Port 0 input configuration (GPIO_IN0) Offset(205) 0x44 Access: User read/write 7 R 0 W Reset 0 6 5 4 3 2 1 TCAP3 TCAP2 TCAP1 TCAP0 SCIRX LINTX 0 0 0 0 0 0 0 0 0 Notes 205. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 233. Port 0 input configuration (GPIO_IN0) Field Description 6 TCAP3 PTB0 - Timer Input Capture Channel 3 0 - PTB0 Input buffer disconnected from Timer Channel 3 - Input Capture 1 - PTB0 Input buffer routed to Timer Channel 3 - Input Capture 5 TCAP2 PTB0 - Timer Input Capture Channel 2 0 - PTB0 Input buffer disconnected from Timer Channel 2 - Input Capture 1 - PTB0 Input buffer routed to Timer Channel 2 - Input Capture 4 TCAP1 PTB0 - Timer Input Capture Channel 1 0 - PTB0 Input buffer disconnected from Timer Channel 1 - Input Capture 1 - PTB0 Input buffer routed to Timer Channel 1 - Input Capture 3 TCAP0 PTB0 - Timer Input Capture Channel 0 0 - PTB0 Input buffer disconnected from Timer Channel 0 - Input Capture 1 - PTB0 Input buffer routed to Timer Channel 0 - Input Capture MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 233. Port 0 input configuration (GPIO_IN0) (continued) Field Description 2 SCIRX PTB0 - SCI Module Rx Input 0 - PTB0 Input buffer disconnected from SCI Module Rx Input 1 - PTB0 Input buffer routed to SCI Module Rx Input 1 LINTX PTB0 - LIN Module Tx Input 0 - PTB0 Input buffer disconnected from LIN Module Tx Input 1 - PTB0 Input buffer routed to LIN Module Tx Input 4.11.5.3.5 Port 0 output configuration (GPIO_OUT0) Table 234. Port 0 output configuration (GPIO_OUT0) Offset(206) 0x45 R W Reset Access: User read/write 7 6 5 4 3 2 1 0 WKUP TCOMP3 TCOMP2 TCOMP1 TCOMP0 SCITX LINRX 0 0 0 0 0 0 0 0 PTBX0 0 Notes 206. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 235. Port 0 output configuration (GPIO_OUT0) Field 7 WKUP Description PTB0 - Wake-up output 0 - Internal wake-up signal disconnected from PTB0 output buffer OR gate 1 - Internal wake-up signal connected to PTB0 output buffer OR gate 6 TCOMP3 PTB0 - Timer Channel 3 - Output Compare output 0 - Timer Channel 3 - output compare disconnected from PTB0 output buffer OR gate 1 - Timer Channel 3 - output compare connected to PTB0 output buffer OR gate 5 TCOMP2 PTB0 - Timer Channel 2 - Output Compare output 0 - Timer Channel 2 - output compare disconnected from PTB0 output buffer OR gate 1 - Timer Channel 2 - output compare connected to PTB0 output buffer OR gate 4 TCOMP1 PTB0 - Timer Channel 1 - Output Compare output 0 - Timer Channel 1 - output compare disconnected from PTB0 output buffer OR gate 1 - Timer Channel 1 - output compare connected to PTB0 output buffer OR gate 3 TCOMP0 PTB0 - Timer Channel 0 - Output Compare output 0 - Timer Channel 0 - output compare disconnected from PTB0 output buffer OR gate 1 - Timer Channel 0 - output compare connected to PTB0 output buffer OR gate 2 SCITX PTB0 - SCI TX Output 0 - SCI TX output disconnected from PTB0 output buffer OR gate 1 - SCI TX output connected to PTB0 output buffer OR gate 1 LINRX PTB0 - LIN RX Output 0 - LIN RX output disconnected from PTB0 output buffer OR gate 1 - LIN RX output connected to PTB0 output buffer OR gate 0 PTBX0 PTB0 - Output Buffer Control 0 - PTB0 output buffer OR gate input = 0 1 - PTB0 output buffer OR gate input = 1 MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.11.5.3.6 Port 1 input configuration (GPIO_IN1) Table 236. Port 1 input configuration (GPIO_IN1) Offset(207) 0x46 Access: User read/write 7 R 0 W Reset 0 6 5 4 3 2 1 0 TCAP3 TCAP2 TCAP1 TCAP0 SCIRX LINTX 0 0 0 0 0 0 0 Notes 207. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 237. Port 1 input configuration (GPIO_IN1) Field Description 6 TCAP3 PTB1 - Timer Input Capture Channel 3 0 - PTB1 Input buffer disconnected from Timer Channel 3 - Input Capture 1 - PTB1 Input buffer routed to Timer Channel 3 - Input Capture 5 TCAP2 PTB1 - Timer Input Capture Channel 2 0 - PTB1 Input buffer disconnected from Timer Channel 2 - Input Capture 1 - PTB1 Input buffer routed to Timer Channel 2 - Input Capture 4 TCAP1 PTB1 - Timer Input Capture Channel 1 0 - PTB1 Input buffer disconnected from Timer Channel 1 - Input Capture 1 - PTB1 Input buffer routed to Timer Channel 1 - Input Capture 3 TCAP0 PTB1 - Timer Input Capture Channel 0 0 - PTB1 Input buffer disconnected from Timer Channel 0 - Input Capture 1 - PTB1 Input buffer routed to Timer Channel 0 - Input Capture 2 SCIRX PTB1 - SCI Module Rx Input 0 - PTB1 Input buffer disconnected from SCI Module Rx Input 1 - PTB1 Input buffer routed to SCI Module Rx Input 1 LINTX PTB1 - LIN Module Tx Input 0 - PTB1 Input buffer disconnected from LIN Module Tx Input 1 - PTB1 Input buffer routed to LIN Module Tx Input 4.11.5.3.7 Port 1 output configuration (GPIO_OUT1) Table 238. Port 1 output configuration (GPIO_OUT1) Offset(208) 0x47 R W Reset Access: User read/write 7 6 5 4 3 2 1 WKUP TCOMP3 TCOMP2 TCOMP1 TCOMP0 SCITX LINRX 0 0 0 0 0 0 0 0 0 PTBX1 0 Notes 208. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 239. Port 1 output configuration (GPIO_OUT1) Field 7 WKUP Description PTB1 - Wake-up output 0 - Internal wake-up signal disconnected from PTB1 output buffer OR gate 1 - Internal wake-up signal connected to PTB1 output buffer OR gate 6 TCOMP3 PTB1 - Timer Channel 3 - Output Compare output 0 - Timer Channel 3 - output compare disconnected from PTB1 output buffer OR gate 1 - Timer Channel 3 - output compare connected to PTB1 output buffer OR gate 5 TCOMP2 PTB1 - Timer Channel 2 - Output Compare output 0 - Timer Channel 2 - output compare disconnected from PTB1 output buffer OR gate 1 - Timer Channel 2 - output compare connected to PTB1 output buffer OR gate 4 TCOMP1 PTB1 - Timer Channel 1 - Output Compare output 0 - Timer Channel 1 - output compare disconnected from PTB1 output buffer OR gate 1 - Timer Channel 1 - output compare connected to PTB1 output buffer OR gate 3 TCOMP0 PTB1 - Timer Channel 0 - Output Compare output 0 - Timer Channel 0 - output compare disconnected from PTB1 output buffer OR gate 1 - Timer Channel 0 - output compare connected to PTB1 output buffer OR gate 2 SCITX PTB1 - SCI TX Output 0 - SCI TX output disconnected from PTB1 output buffer OR gate 1 - SCI TX output connected to PTB1 output buffer OR gate 1 LINRX PTB1 - LIN RX Output 0 - LIN RX output disconnected from PTB1 output buffer OR gate 1 - LIN RX output connected to PTB1 output buffer OR gate 0 PTBX1 PTB1 - Output Buffer Control 0 - PTB1 output buffer OR gate input = 0 1 - PTB1 output buffer OR gate input = 1 4.11.5.3.8 Port 2 input configuration (GPIO_IN2) Table 240. Port 2 input configuration (GPIO_IN2) Offset(209) 0x48 Access: User read/write 7 R 0 W Reset 0 6 5 4 3 2 1 0 TCAP3 TCAP2 TCAP1 TCAP0 SCIRX LINTX 0 0 0 0 0 0 0 0 Notes 209. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 241. Port 2 input configuration (GPIO_IN2) Field Description 6 TCAP3 PTB2 - Timer Input Capture Channel 3 0 - PTB2 Input buffer disconnected from Timer Channel 3 - Input Capture 1 - PTB2 Input buffer routed to Timer Channel 3 - Input Capture 5 TCAP2 PTB2 - Timer Input Capture Channel 2 0 - PTB2 Input buffer disconnected from Timer Channel 2 - Input Capture 1 - PTB2 Input buffer routed to Timer Channel 2 - Input Capture 4 TCAP1 PTB2 - Timer Input Capture Channel 1 0 - PTB2 Input buffer disconnected from Timer Channel 1 - Input Capture 1 - PTB2 Input buffer routed to Timer Channel 1 - Input Capture MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 241. Port 2 input configuration (GPIO_IN2) (continued) Field Description 3 TCAP0 PTB2 - Timer Input Capture Channel 0 0 - PTB2 Input buffer disconnected from Timer Channel 0 - Input Capture 1 - PTB2 Input buffer routed to Timer Channel 0 - Input Capture 2 SCIRX PTB2 - SCI Module Rx Input 0 - PTB2 Input buffer disconnected from SCI Module Rx Input 1 - PTB2 Input buffer routed to SCI Module Rx Input 1 LINTX PTB2 - LIN Module Tx Input 0 - PTB2 Input buffer disconnected from LIN Module Tx Input 1 - PTB2 Input buffer routed to LIN Module Tx Input 4.11.5.3.9 Port 2 output configuration (GPIO_OUT2) Table 242. Port 2 output configuration (GPIO_OUT2) Offset(209) 0x49 R W Reset Access: User read/write 7 6 5 4 3 2 1 WKUP TCOMP3 TCOMP2 TCOMP1 TCOMP0 SCITX LINRX 0 0 0 0 0 0 0 0 0 PTBX2 0 Notes 210. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 243. Port 2 output configuration (GPIO_OUT2) Field 7 WKUP Description PTB2 - Wake-up output 0 - Internal wake-up signal disconnected from PTB2 output buffer OR gate 1 - Internal wake-up signal connected to PTB2 output buffer OR gate 6 TCOMP3 PTB2 - Timer Channel 3 - Output Compare output 0 - Timer Channel 3 - output compare disconnected from PTB2 output buffer OR gate 1 - Timer Channel 3 - output compare connected to PTB2 output buffer OR gate 5 TCOMP2 PTB2 - Timer Channel 2 - Output Compare output 0 - Timer Channel 2 - output compare disconnected from PTB2 output buffer OR gate 1 - Timer Channel 2 - output compare connected to PTB2 output buffer OR gate 4 TCOMP1 PTB2 - Timer Channel 1 - Output Compare output 0 - Timer Channel 1 - output compare disconnected from PTB2 output buffer OR gate 1 - Timer Channel 1 - output compare connected to PTB2 output buffer OR gate 3 TCOMP0 PTB2 - Timer Channel 0 - Output Compare output 0 - Timer Channel 0 - output compare disconnected from PTB2 output buffer OR gate 1 - Timer Channel 0 - output compare connected to PTB2 output buffer OR gate 2 SCITX PTB2 - SCI TX Output 0 - SCI TX output disconnected from PTB2 output buffer OR gate 1 - SCI TX output connected to PTB2 output buffer OR gate 1 LINRX PTB2 - LIN RX Output 0 - LIN RX output disconnected from PTB2 output buffer OR gate 1 - LIN RX output connected to PTB2 output buffer OR gate 0 PTBX2 PTB2 - Output Buffer Control 0 - PTB2 output buffer OR gate input = 0 1 - PTB2 output buffer OR gate input = 1 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.11.5.3.10 Port 3 input configuration (GPIO_IN3) Table 244. Port 3 input configuration (GPIO_IN3) Offset(211) 0x4A R W Access: User read/write 7 6 5 4 3 PTWU TCAP3 TCAP2 TCAP1 TCAP0 0 0 0 0 0 Reset 2 1 0 0 0 0 0 0 0 Notes 211. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 245. Port 3 input configuration (GPIO_IN3) Field Description 7 PTWU PTB3 Wake-up 0 - PTB3 Input buffer low power mode wake-up circuity disabled 1 - PTB3 Input buffer low power mode wake-up circuity enabled 6 TCAP3 PTB3 - Timer Input Capture Channel 3 0 - PTB3 Input buffer disconnected from Timer Channel 3 - Input Capture 1 - PTB3 Input buffer routed to Timer Channel 3 - Input Capture 5 TCAP2 PTB3 - Timer Input Capture Channel 2 0 - PTB3 Input buffer disconnected from Timer Channel 2 - Input Capture 1 - PTB3 Input buffer routed to Timer Channel 2 - Input Capture 4 TCAP1 PTB3 - Timer Input Capture Channel 1 0 - PTB3 Input buffer disconnected from Timer Channel 1 - Input Capture 1 - PTB3 Input buffer routed to Timer Channel 1 - Input Capture 3 TCAP0 PTB3 - Timer Input Capture Channel 0 0 - PTB3 Input buffer disconnected from Timer Channel 0 - Input Capture 1 - PTB3 Input buffer routed to Timer Channel 0 - Input Capture 4.12 4.12.1 LIN Introduction The LIN bus pin provides a physical layer for single-wire communication in automotive applications. The LIN physical layer is designed to meet the LIN physical layer version 2.0 / 2.1 and J2602 specification, and has the following features: * LIN physical layer 2.0 / 2.1 / J2602 compliant * Slew rate selection 20 kBit, 10 kBit, and fast Mode (100 kBit) * Overtemperature Shutdown - HTI * Permanent Pull-up in Normal mode 30 k, 1.0 M in low power * Current limitation * Special J2602 compliant configuration * Direct Rx / Tx access * Optional external Rx / Tx access and routing to the TIMER Input through PTBx The LIN driver is a low side MOSFET with current limitation and thermal shutdown. An internal pull-up resistor with a serial diode structure is integrated, so no external pull-up components are required for the application in a slave node. The fall time from dominant to recessive and the rise time from recessive to dominant is controlled. The symmetry between both slopes is guaranteed. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.12.2 Overview 4.12.2.1 Block diagram Figure 44 shows the basic function of the LIN module. UV Undervoltage Detection LVSD (M) VSUP Wake Up DSER HF Wake-up Filter RSLAVE RX TOPTB TOSCI Receiver RX SCI LIN =1 TX TX FROMSCI PTB 0 FROMPTB 1 TXDM (M) LGND SRS (M)[1:0] RDY EN (M) Transmitter Control OTIE (M) OT Interrupt Overtemperature Detection Figure 44. LIN module block diagram 4.12.2.2 LIN pin The LIN pin offers high susceptibility immunity level from external disturbance, guaranteeing communication during external disturbances. See Section 3.8, "Electromagnetic compatibility (EMC)". 4.12.2.3 Slew rate selection The slew rate can be selected for optimized operation at 10 kBit/s and 20 kBit/s as well as a fast baud rate (100 kBit) for test and programming. The slew rate can be adapted with the bits SRS[1:0] in the LIN Control Register (LIN_CTL). The initial slew rate is 20 kBit/s. 4.12.2.4 Overtemperature shutdown (LIN interrupt) The output low side FET (transmitter) is protected against overtemperature conditions. In an overtemperature condition, the transmitter will be shut down, and the TO bit in the LIN Control Register (LIN_CTL) is set as long as the condition is present. If the OTIEM bit is set in the LIN Status Register (LIN_SR), an Interrupt IRQ will be generated. Acknowledge the interrupt by writing a "1" in the LIN Status Register (LIN_SR). To issue a new interrupt, the condition has to vanish and reoccur. The transmitter is automatically re-enabled once the overtemperature condition is gone and TxD is High. 4.12.2.5 Low power mode and wake-up feature During Low Power mode operation, the transmitter of the physical layer is disabled. The receiver is still active and able to detect wake-up events on the LIN bus line. A dominant level longer than tPROPWL, followed by a rising edge will generate a wake-up event and be reported in the Wake-up Source Register (WSR). MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.12.2.6 J2602 compliance A Low Voltage Shutdown feature was implemented to allow controlled LIN driver behavior under low voltage conditions at VSUP. If LVSD is set, once VSUP is below the threshold VJ2602H, the LIN transmitter is not turned dominant again. The condition is indicated by the UV flag. 4.12.2.7 Transmit/receiving line definition The LIN module can be connected to the SCI or PTB module, or can be directly controlled by the TXDM / RX bit 4.12.2.8 Transmitter enable/ready The LIN transmitter must be enabled before transmission is possible (EN). The RDY bit is set to 1 about 50 s after the LIN transmitter is enabled. This is due to the initialization time for the LIN transmitter, under some low voltage conditions. During this period (LIN enabled to RDY = 1), the LIN is forced to a recessive state. 4.12.3 4.12.3.1 Memory map and registers Overview This section provides a detailed description of the memory map and registers. 4.12.3.2 Module memory map The memory map for the LIN module is given in Table 62 Table 246. Module memory map Offset (212),(213) 0x50 Name LIN_CTL LIN control register 7 6 5 4 3 2 1 0 R 0 0 0 0 0 0 0 0 W OTIEM TXDM LVSDM ENM SRSM TXD LVSD EN SRS 0 UV 0 0 0 RX TX FROMPT B FROMSCI TOPTB TOSCI R W 0x52 0x53 0x54 0x55 LIN_SR (hi) R LIN status register W LIN_SR (lo) R LIN status register W LIN_TX R LIN transmit line definition W LIN_RX R LIN receive line definition W 0x56 Reserved 0x57 Reserved R OTIE OT 0 0 0 HF Write 1 will clear the flags RDY 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W Notes 212. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 213. This Register is 16-Bit access only. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.12.3.3 Register descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of the register bit and field function follow the register diagrams, in bit order. 4.12.3.3.1 LIN control register (LIN_CTL) Table 247. LIN control register (LIN_CTL) Offset (214) ,(215) Access: User write 0x50 15 14 13 12 11 10 9 8 R 0 0 0 0 0 0 0 0 W OTIEM TXDM LVSDM ENM Reset 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 0 0 TXD LVSD EN 0 0 0 0 0 R W Reset OTIE 0 SRSM SRS 0 0 Notes 214. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 215. This Register is 16-Bit access only. Table 248. LIN control register (LIN_CTL) - register field descriptions Field Description 15 OTIEM LIN Overtemperature Interrupt Enable - Mask 0 - writing the OTIE Bit will have no effect 1 - writing the OTIE Bit will be effective 12 TXDM IN - Direct Transmitter Control - Mask 0 - writing the TXD Bit will have no effect 1 - writing the TXD Bit will be effective 11 LVSDM LIN - Low Voltage Shutdown Disable (J2602 Compliance Control) - Mask 0 - writing the LVSD Bit will have no effect 1 - writing the LVSD Bit will be effective 10 ENM 9-8 SRSM[1:0] LIN Module Enable - Mask 0 - writing the EN Bit will have no effect 1 - writing the EN Bit will be effective LIN - Slew Rate Select - Mask 00,01,10 - writing the SRS Bits will have no effect 11 - writing the SRS Bits will be effective 7 OTIE LIN Overtemperature Interrupt Enable 0 - LIN overtemperature interrupt disabled 1 - LIN overtemperature interrupt enabled 4 TXD IN - Direct Transmitter Control 0 - Transmitter not controlled 1 - Transmitter dominant 3 LVSD LIN - Low Voltage Shutdown Disable (J2602 Compliance Control) 0 - LIN will be remain in recessive state in case of VSUP undervoltage condition 1 - LIN will stay functional even with a VSUP undervoltage condition MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 248. LIN control register (LIN_CTL) - register field descriptions (continued) Field 2 EN 1-0 SRS[1:0] Description LIN Module Enable 0 - LIN module disabled 1 - LIN module enabled LIN - Slew Rate Select 00 - Normal slew rate (20 kBit) 01 - Slow slew rate (10.4 kBit) 10 - Fast slew rate (100 kbit) 11 - normal Slew Rate (20 kBit) 4.12.3.3.2 LIN status register (LIN_SR (hi)) Table 249. LIN status register (LIN_SR (hi)) Offset(216) 0x52 R Access: User read/write 7 6 5 4 3 2 1 0 OT 0 HF 0 UV 0 0 0 0 0 0 W Write 1 will clear the flags Reset 0 0 0 0 0 Notes 216. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 250. LIN status register (LIN_SR (hi)) - register field descriptions Field Description 7 OT LIN Overtemperature Status. This bit is latched and has to be reset by writing 1 into OT bit. 0 - No LIN overtemperature condition detected 1 - LIN overtemperature condition detected 5 HF LIN HF (High Frequency) Condition Status indicating HF (DPI) disturbance in the LIN module. This bit is latched and has to be reset by writing 1 into HF bit. 0 - No LIN HF (DPI) condition detected 1 - LIN HF (DPI) condition detected 3 UV LIN Undervoltage Status. This threshold is used for the J2602 feature as well. This bit is latched and has to be reset by writing 1 into UV bit. 0 - No LIN undervoltage condition detected 1 - LIN undervoltage condition detected 4.12.3.3.3 LIN status register (LIN_SR (lo)) Table 251. LIN status register (LIN_SR (lo)) Offset(217) 0x53 R Access: User read 7 6 5 4 3 2 1 0 RDY 0 0 0 0 0 RX TX W Notes 217. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 252. LIN status register (LIN_SR (lo)) - register field descriptions Field 1 RDY Description Transmitter Ready Status 0 - Transmitter not ready 1 - Transmitter ready 1 RX Current RX status 0 - Rx recessive 1 - Rx dominant 0 TX Current TX status 0 - Tx recessive 1 - Tx dominant 4.12.3.3.4 LIN transmit line definition (LIN_TX) Table 253. LIN transmit line definition (LIN_TX) Offset(218) 0x54 R Access: User read/write 7 6 5 4 3 2 0 0 0 0 0 0 W Reset 0 0 0 0 0 0 1 0 FROMPTB FROMSCI 0 0 Notes 218. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 254. LIN transmit line definition (LIN_TX) - register field descriptions Field Description 1 FROMPTB LIN_TX internally routed from PTB. See Section 4.11, "General purpose I/O - GPIO" for details.(219) 0 - LIN transmitter disconnected from PTB module. 1 - LIN transmitter connected to the PTB module. 0 FROMSCI LIN_TX internally routed from SCI(219) 0 - LIN transmitter disconnected from SCI module. 1 - LIN transmitter connected to the SCI module. Notes 219. In case both, FROMPTB and FROMSCI are selected, the SCI has priority and the PTB signal is ignored. In any case, the signal is logically ORed with the TXD direct transmitter control. 4.12.3.3.5 LIN receive line definition (LIN_RX) Table 255. LIN receive line definition (LIN_RX) Offset(220) 0x55 R Access: User read/write 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 TOPTB TOSCI 0 0 Notes 220. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 256. LIN receive line definition (LIN_RX) - register field descriptions Field Description 1 TOPTB LIN_RX internally routed to PTB 0 - LIN receiver disconnected from PTB module. 1 - LIN receiver connected to the PTB module. 0 TOSCI LIN_RX internally routed to SCI 0 - LIN receiver disconnected from SCI module. 1 - LIN receiver connected to the SCI module. NOTE In order to route the RX signal to the Timer Input capture, one of the PTBx must be configured as a pass through. Figure 45. Definition of LIN bus timing parameters 4.13 Serial communication interface (S08SCIV4) 4.13.1 4.13.1.1 Introduction Features Features of SCI module include: * Full-duplex, standard non-return-to-zero (NRZ) format * Double-buffered transmitter and receiver with separate enables * Programmable baud rates (13-bit modulo divider) * Interrupt-driven or polled operation: -- Transmit data register empty and transmission complete -- Receive data register full -- Receive overrun, parity error, framing error, and noise error -- Idle receiver detect -- Active edge on receive pin -- Break detect supporting LIN MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS * * * * * Hardware parity generation and checking Programmable 8-bit or 9-bit character length Receiver wake-up by idle-line or address-mark Optional 13-bit break character generation / 11-bit break character detection Selectable transmitter output polarity 4.13.1.2 Modes of operation See Section 4.13.3, "Functional description", for details concerning SCI operation in these modes: * 8- and 9-bit data modes * Loop mode * Single-wire mode 4.13.1.3 Block diagram Figure 46 shows the transmitter portion of the SCI. INTERNAL BUS (WRITE-ONLY) LOOPS SCID - Tx BUFFER RSRC STOP M START 11-BIT TRANSMIT SHIFT REGISTER 8 7 6 5 4 3 2 1 SHIFT DIRECTION 0 TO RECEIVE DATA IN TO TxD L LSB H 1 x BAUD RATE CLOCK LOOP CONTROL BREAK (ALL 0s) PARITY GENERATION PT PREAMBLE (ALL 1s) PE SHIFT ENABLE T8 LOAD FROM SCID TXINV SCI CONTROLS TxD TE SBK TRANSMIT CONTROL TXDIR TxD DIRECTION TO TxD LOGIC BRK13 TDRE TIE TC Tx INTERRUPT REQUEST TCIE Figure 46. SCI transmitter block diagram MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Figure 47 shows the receiver portion of the SCI. INTERNAL BUS (READ-ONLY) 16 x BAUD RATE CLOCK DIVIDE BY 16 SCID - Rx BUFFER FROM TRANSMITTER H DATA RECOVERY 8 7 6 4 3 2 0 L 1 SHIFT DIRECTION WAKEUP LOGIC ILT 5 LSB LBKDE START STOP FROM RxD RXINV M MSB RSRC 11-BIT RECEIVE SHIFT REGISTER SINGLE-WIRE LOOP CONTROL ALL 1s LOOPS RWU RWUID ACTIVE EDGE DETECT RDRF RIE IDLE ILIE LBKDIF Rx INTERRUPT REQUEST LBKDIE RXEDGIF RXEDGIE OR ORIE FE FEIE NF ERROR INTERRUPT REQUEST NEIE PE PT PARITY CHECKING PF PEIE Figure 47. SCI receiver block diagram MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.13.2 4.13.2.1 Memory map and registers Overview This section provides a detailed description of the memory map and registers. 4.13.2.2 Module memory map The memory map for the S08SCIV4 module is given in Table 62. Table 257. Module memory map Offset( Name 221) 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F SCIBD (hi) R SCI Baud Rate Register W SCIBD (lo) R SCI Baud Rate Register W SCIC1 R SCI Control Register 1 W SCIC2 R SCI Control Register 2 W SCIS1 R SCI Status Register 1 W SCIS2 R SCI Status Register 2 W SCIC3 R SCI Control Register 3 W SCID R SCI Data Register W 7 6 5 4 3 2 1 0 LBKDIE RXEDGIE 0 SBR12 SBR11 SBR10 SBR9 SBR8 SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0 RSRC M ILT PE PT LOOPS 0 0 TIE TCIE RIE ILIE TE RE RWU SBK TDRE TC RDRF IDLE OR NF FE PF LBKDIF RXEDGIF RXINV RWUID BRK13 LBKDE R8 0 RAF T8 TXDIR TXINV ORIE NEIE FEIE PEIE R7 R6 R5 R4 R3 R2 R1 R0 T7 T6 T5 T4 T3 T2 T1 T0 Notes 221. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 4.13.2.3 Register definition The SCI has eight 8-bit registers to control baud rate, select SCI options, report SCI status, and for transmit/receive data. 4.13.2.3.1 SCI baud rate registers (SCIBD (hi), SCIBD (lo)) This pair of registers control the prescale divisor for SCI baud rate generation. To update the 13-bit baud rate setting [SBR12:SBR0], first write to SCIBD (hi) to buffer the high half of the new value, and then write to SCIBD (lo). The working value in SCIBD (hi) does not change until SCIBD (lo) is written. SCIBDL is reset to a non-zero value, so after reset the baud rate generator remains disabled until the first time the receiver or transmitter is enabled (RE or TE bits in SCIC2 are written to 1). MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 258. SCI baud rate register (SCIBD (hi)) Offset(222) 0x18 R W Access: User read/write 7 6 LBKDIE RXEDGIE 0 0 Reset 5 0 4 3 2 1 0 SBR12 SBR11 SBR10 SBR9 SBR8 0 0 0 0 0 0 = Unimplemented or Reserved Notes 222. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 259. SCIBD (hi) field descriptions Field 7 LBKDIE Description LIN Break Detect Interrupt Enable (for LBKDIF) 0 Hardware interrupts from LBKDIF disabled (use polling). 1 Hardware interrupt requested when LBKDIF flag is 1. 6 RXEDGIE RxD Input Active Edge Interrupt Enable (for RXEDGIF) 0 Hardware interrupts from RXEDGIF disabled (use polling). 1 Hardware interrupt requested when RXEDGIF flag is 1. 4:0 SBR[12:8] Baud Rate Modulo Divisor -- The 13 bits in SBR[12:0] are referred to collectively as BR, and they set the modulo divide rate for the SCI baud rate generator. When BR = 0, the SCI baud rate generator is disabled to reduce supply current. When BR = 1 to 8191, the SCI baud rate = BUSCLK/(64xBR). See BR bits in Table 260. Table 260. SCI baud rate register (SCIBDL) Offset(223) 0x19 R W Reset Access: User read/write 7 6 5 4 3 2 1 0 SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0 0 0 0 0 0 1 0 0 Notes 223. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 261. SCIBDL field descriptions Field Description 7:0 SBR[7:0] Baud Rate Modulo Divisor -- These 13 bits in SBR[12:0] are referred to collectively as BR, and they set the modulo divide rate for the SCI baud rate generator. When BR = 0, the SCI baud rate generator is disabled to reduce supply current. When BR = 1 to 8191, the SCI baud rate = BUSCLK/(64xBR). See also BR bits in Table 258. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.13.2.3.2 SCI control register 1 (SCIC1) This read/write register is used to control various optional features of the SCI system. Table 262. SCI control register 1 (SCIC1) Offset(224) 0x1A Access: User read/write 7 R W Reset LOOPS 0 6 0 0 5 4 RSRC M 0 0 3 0 0 2 1 0 ILT PE PT 0 0 0 Notes 224. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 263. SCIC1 field descriptions Field Description 7 LOOPS Loop Mode Select -- Selects between loop back modes and normal 2-pin full-duplex modes. When LOOPS = 1, the transmitter output is internally connected to the receiver input. 0 Normal operation -- RxD and TxD use separate pins. 1 Loop mode or single-wire mode where transmitter outputs are internally connected to receiver input. (See RSRC bit.) RxD pin is not used by SCI. 5 RSRC Receiver Source Select -- This bit has no meaning or effect unless the LOOPS bit is set to 1. When LOOPS = 1, the receiver input is internally connected to the TxD pin and RSRC determines whether this connection is also connected to the transmitter output. 0 Provided LOOPS = 1, RSRC = 0 selects internal loop back mode and the SCI does not use the RxD pins. 1 Single-wire SCI mode where the TxD pin is connected to the transmitter output and receiver input. 4 M 9-Bit or 8-Bit Mode Select 0 Normal -- start + 8 data bits (LSB first) + stop. 1 Receiver and transmitter use 9-bit data characters start + 8 data bits (LSB first) + 9th data bit + stop. 2 ILT Idle Line Type Select -- Setting this bit to 1 ensures that the stop bit and logic 1 bits at the end of a character do not count toward the 10 or 11 bit times of logic high level needed by the idle line detection logic. Refer to Section 4.13.3.3.2.1, "Idle-line wake-up" for more information. 0 Idle character bit count starts after start bit. 1 Idle character bit count starts after stop bit. 1 PE Parity Enable -- Enables hardware parity generation and checking. When parity is enabled, the most significant bit (MSB) of the data character (eighth or ninth data bit) is treated as the parity bit. 0 No hardware parity generation or checking. 1 Parity enabled. 0 PT Parity Type -- Provided parity is enabled (PE = 1), this bit selects even or odd parity. Odd parity means the total number of 1s in the data character, including the parity bit, is odd. Even parity means the total number of 1s in the data character, including the parity bit, is even. 0 Even parity. 1 Odd parity. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.13.2.3.3 SCI control register 2 (SCIC2) This register can be read or written at any time. Table 264. SCI control register 2 (SCIC2) Offset(225) 0x1B R W Reset Access: User read/write 7 6 5 4 3 2 1 0 TIE TCIE RIE ILIE TE RE RWU SBK 0 0 0 0 0 0 0 0 Notes 225. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 265. SCIC2 field descriptions Field 7 TIE 6 TCIE Description Transmit Interrupt Enable (for TDRE) 0 Hardware interrupts from TDRE disabled (use polling). 1 Hardware interrupt requested when TDRE flag is 1. Transmission Complete Interrupt Enable (for TC) 0 Hardware interrupts from TC disabled (use polling). 1 Hardware interrupt requested when TC flag is 1. 5 RIE Receiver Interrupt Enable (for RDRF) 0 Hardware interrupts from RDRF disabled (use polling). 1 Hardware interrupt requested when RDRF flag is 1. 4 ILIE Idle Line Interrupt Enable (for IDLE) 0 Hardware interrupts from IDLE disabled (use polling). 1 Hardware interrupt requested when IDLE flag is 1. 3 TE Transmitter Enable 0 Transmitter off. 1 Transmitter on. TE must be 1 in order to use the SCI transmitter. When TE = 1, the SCI forces the TxD pin to act as an output for the SCI system. When the SCI is configured for single-wire operation (LOOPS = RSRC = 1), TXDIR controls the direction of traffic on the single SCI communication line (TxD pin). TE also can be used to queue an idle character by writing TE = 0 then TE = 1 while a transmission is in progress. Refer to Section 4.13.3.2.1, "Send break and queued idle" for more details. When TE is written to 0, the transmitter keeps control of the port TxD pin until any data, queued idle, or queued break character finishes transmitting before allowing the pin to revert to a general-purpose I/O pin. 2 RE Receiver Enable -- When the SCI receiver is off, the RxD pin reverts to being a general-purpose port I/O pin. If LOOPS = 1 the RxD pin reverts to being a general-purpose I/O pin even if RE = 1. 0 Receiver off. 1 Receiver on. 1 RWU Receiver Wake-up Control -- This bit can be written to 1 to place the SCI receiver in a standby state where it waits for automatic hardware detection of a selected wake-up condition. The wake-up condition is either an idle line between messages (WAKE = 0, idle-line wake-up), or a logic 1 in the most significant data bit in a character (WAKE = 1, address-mark wake-up). Application software sets RWU and (normally) a selected hardware condition automatically clears RWU. Refer to Section 4.13.3.3.2, "Receiver wake-up operation" for more details. 0 Normal SCI receiver operation. 1 SCI receiver in standby waiting for wake-up condition. 0 SBK Send Break -- Writing a 1 and then a 0 to SBK queues a break character in the transmit data stream. Additional break characters of 10 or 11 (13 or 14 if BRK13 = 1) bit times of logic 0 are queued as long as SBK = 1. Depending on the timing of the set and clear of SBK relative to the information currently being transmitted, a second break character may be queued before software clears SBK. Refer to Section 4.13.3.2.1, "Send break and queued idle" for more details. 0 Normal transmitter operation. 1 Queue break character(s) to be sent. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.13.2.3.4 SCI status register 1 (SCIS1) This register has eight read-only status flags. Writes have no effect. Special software sequences (which do not involve writing to this register) are used to clear these status flags. Table 266. SCI status register 1 (SCIS1) Offset(226) 0x1C R Access: User read/write 7 6 5 4 3 2 1 0 TDRE TC RDRF IDLE OR NF FE PF 1 1 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Notes 226. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 267. SCIS1 field descriptions Field Description 7 TDRE Transmit Data Register Empty Flag -- TDRE is set out of reset and when a transmit data value transfers from the transmit data buffer to the transmit shifter, leaving room for a new character in the buffer. To clear TDRE, read SCIS1 with TDRE = 1 and then write to the SCI data register (SCID). 0 Transmit data register (buffer) full. 1 Transmit data register (buffer) empty. 6 TC Transmission Complete Flag -- TC is set out of reset and when TDRE = 1 and no data, preamble, or break character is being transmitted. 0 Transmitter active (sending data, a preamble, or a break). 1 Transmitter idle (transmission activity complete). TC is cleared automatically by reading SCIS1 with TC = 1 and then doing one of the following three things: * Write to the SCI data register (SCID) to transmit new data * Queue a preamble by changing TE from 0 to 1 * Queue a break character by writing 1 to SBK in SCIC2 5 RDRF Receive Data Register Full Flag -- RDRF becomes set when a character transfers from the receive shifter into the receive data register (SCID). If the OR bit is set, further received characters are lost and RDRF bit does not set. To clear RDRF, read SCIS1 with RDRF = 1 and then read the SCI data register (SCID). 0 Receive data register empty. 1 Receive data register full. 4 IDLE Idle Line Flag -- IDLE is set when the SCI receive line becomes idle for a full character time after a period of activity. When ILT = 0, the receiver starts counting idle bit times after the start bit. So if the receive character is all 1s, these bit times and the stop bit time count toward the full character time of logic high (10 or 11 bit times depending on the M control bit) needed for the receiver to detect an idle line. When ILT = 1, the receiver doesn't start counting idle bit times until after the stop bit. So the stop bit and any logic high bit times at the end of the previous character do not count toward the full character time of logic high needed for the receiver to detect an idle line. To clear IDLE, read SCIS1 with IDLE = 1 and then read the SCI data register (SCID). After IDLE has been cleared, it cannot become set again until after a new character has been received and RDRF has been set. IDLE will get set only once even if the receive line remains idle for an extended period. 0 No idle line detected. 1 Idle line was detected. 3 OR Receiver Overrun Flag -- OR is set when a new serial character is ready to be transferred to the receive data register (buffer), but the previously received character has not been read from SCID yet. In this case, the new character (and all associated error information) is lost because there is no room to move it into SCID. To clear OR, read SCIS1 with OR = 1 and then read the SCI data register (SCID). 0 No overrun. 1 Receive overrun (new SCI data lost). 2 NF Noise Flag -- The advanced sampling technique used in the receiver takes seven samples during the start bit and three samples in each data bit and the stop bit. If any of these samples disagrees with the rest of the samples within any bit time in the frame, the flag NF will be set at the same time as the flag RDRF gets set for the character. To clear NF, read SCIS1 and then read the SCI data register (SCID). 0 No noise detected. 1 Noise detected in the received character in SCID. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 267. SCIS1 field descriptions (continued) Field Description 1 FE Framing Error Flag -- FE is set at the same time as RDRF when the receiver detects a logic 0 where the stop bit was expected. This suggests the receiver was not properly aligned to a character frame. To clear FE, read SCIS1 with FE = 1 and then read the SCI data register (SCID). 0 No framing error detected. This does not guarantee the framing is correct. 1 Framing error. 0 PF Parity Error Flag -- PF is set at the same time as RDRF when parity is enabled (PE = 1) and the parity bit in the received character does not agree with the expected parity value. To clear PF, read SCIS1 and then read the SCI data register (SCID). 0 No parity error. 1 Parity error. 4.13.2.3.5 SCI status register 2 (SCIS2) This register has one read-only status flag. Table 268. SCI status register 2 (SCIS2) Offset(227) 0x1D R W Reset Access: User read/write 7 6 5 LBKDIF RXEDGIF 0 0 0 4 3 2 1 RXINV RWUID BRK13 LBKDE 0 0 0 0 0 0 RAF 0 = Unimplemented or Reserved Notes 227. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 269. SCIS2 field descriptions Field Description 7 LBKDIF LIN Break Detect Interrupt Flag -- LBKDIF is set when the LIN break detect circuitry is enabled and a LIN break character is detected. LBKDIF is cleared by writing a "1" to it. 0 No LIN break character has been detected. 1 LIN break character has been detected. 6 RXEDGIF RxD Pin Active Edge Interrupt Flag -- RXEDGIF is set when an active edge (falling if RXINV = 0, rising if RXINV=1) on the RxD pin occurs. RXEDGIF is cleared by writing a "1" to it. 0 No active edge on the receive pin has occurred. 1 An active edge on the receive pin has occurred. 4 RXINV(228) Receive Data Inversion -- Setting this bit reverses the polarity of the received data input. 0 Receive data not inverted 1 Receive data inverted 3 RWUID Receive Wake Up Idle Detect-- RWUID controls whether the idle character that wakes up the receiver sets the IDLE bit. 0 During receive standby state (RWU = 1), the IDLE bit does not get set upon detection of an idle character. 1 During receive standby state (RWU = 1), the IDLE bit gets set upon detection of an idle character. 2 BRK13 Break Character Generation Length -- BRK13 is used to select a longer transmitted break character length. Detection of a framing error is not affected by the state of this bit. 0 Break character is transmitted with length of 10 bit times (11 if M = 1) 1 Break character is transmitted with length of 13 bit times (14 if M = 1) 1 LBKDE LIN Break Detection Enable-- LBKDE is used to select a longer break character detection length. While LBKDE is set, framing error (FE) and receive data register full (RDRF) flags are prevented from setting. 0 Break character detection enabled. 1 Break character detection disabled. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 269. SCIS2 field descriptions (continued) Field Description 0 RAF Receiver Active Flag -- RAF is set when the SCI receiver detects the beginning of a valid start bit, and RAF is cleared automatically when the receiver detects an idle line. This status flag can be used to check whether an SCI character is being received before instructing the MCU to go to stop mode. 0 SCI receiver idle waiting for a start bit. 1 SCI receiver active (RxD input not idle). Notes 228. Setting RXINV inverts the RxD input for all cases: data bits, start and stop bits, break, and idle. When using an internal oscillator in a LIN system, it is necessary to raise the break detection threshold by one bit time. Under the worst case timing conditions allowed in LIN, it is possible that a 0x00 data character can appear to be 10.26 bit times long at a slave which is running 14% faster than the master. This would trigger normal break detection circuitry, which is designed to detect a 10 bit break symbol. When the LBKDE bit is set, framing errors are inhibited and the break detection threshold changes from 10 bits to 11 bits, preventing false detection of a 0x00 data character as a LIN break symbol. 4.13.2.3.6 SCI control register 3 (SCIC3) Table 270. SCI control register 3 (SCIC3) Offset(229) 0x1E Access: User read/write 7 R R8 W Reset 0 6 5 4 3 2 1 0 T8 TXDIR TXINV ORIE NEIE FEIE PEIE 0 0 0 0 0 0 0 = Unimplemented or Reserved Notes 229. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 271. SCIC3 field descriptions Field Description 7 R8 Ninth Data Bit for Receiver -- When the SCI is configured for 9-bit data (M = 1), R8 can be thought of as a ninth receive data bit to the left of the MSB of the buffered data in the SCID register. When reading 9-bit data, read R8 before reading SCID, because reading SCID completes automatic flag clearing sequences, which could allow R8 and SCID to be overwritten with new data. 6 T8 Ninth Data Bit for Transmitter -- When the SCI is configured for 9-bit data (M = 1), T8 may be thought of as a ninth transmit data bit to the left of the MSB of the data in the SCID register. When writing 9-bit data, the entire 9-bit value is transferred to the SCI shift register after SCID is written, so T8 should be written (if it needs to change from its previous value) before SCID is written. If T8 does not need to change in the new value (such as when it is used to generate mark or space parity), it need not be written each time SCID is written. 5 TXDIR TxD Pin Direction in Single-wire Mode -- When the SCI is configured for single-wire half-duplex operation (LOOPS = RSRC = 1), this bit determines the direction of data at the TxD pin. 0 TxD pin is an input in single-wire mode. 1 TxD pin is an output in single-wire mode. 4 TXINV(230) Transmit Data Inversion -- Setting this bit reverses the polarity of the transmitted data output. 0 Transmit data not inverted 1 Transmit data inverted 3 ORIE Overrun Interrupt Enable -- This bit enables the overrun flag (OR) to generate hardware interrupt requests. 0 OR interrupts disabled (use polling). 1 Hardware interrupt requested when OR = 1. 2 NEIE Noise Error Interrupt Enable -- This bit enables the noise flag (NF) to generate hardware interrupt requests. 0 NF interrupts disabled (use polling). 1 Hardware interrupt requested when NF = 1. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 271. SCIC3 field descriptions (continued) Field Description 1 FEIE Framing Error Interrupt Enable -- This bit enables the framing error flag (FE) to generate hardware interrupt requests. 0 FE interrupts disabled (use polling). 1 Hardware interrupt requested when FE = 1. 0 PEIE Parity Error Interrupt Enable -- This bit enables the parity error flag (PF) to generate hardware interrupt requests. 0 PF interrupts disabled (use polling). 1 Hardware interrupt requested when PF = 1. Notes 230. Setting TXINV inverts the TxD output for all cases: data bits, start and stop bits, break, and idle. 4.13.2.3.7 SCI data register (SCID) This register is actually two separate registers. Reads return the contents of the read-only receive data buffer and writes go to the write-only transmit data buffer. Reads and writes of this register are also involved in the automatic flag clearing mechanisms for the SCI status flags. Table 272. SCI data register (SCID) Offset(231) 0x1D Access: User read/write 7 6 5 4 3 2 1 0 R R7 R6 R5 R4 R3 R2 R1 R0 W T7 T6 T5 T4 T3 T2 T1 T0 Reset 0 0 0 0 0 0 0 0 Notes 231. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 4.13.3 Functional description The SCI allows full-duplex, asynchronous, NRZ serial communication among the MCU and remote devices, including other MCUs. The SCI comprises a baud rate generator, transmitter, and receiver block. The transmitter and receiver operate independently, although they use the same baud rate generator. During normal operation, the MCU monitors the status of the SCI, writes the data to be transmitted, and processes received data. The following describes each of the blocks of the SCI. 4.13.3.1 Baud rate generation Figure 48 shows the clock source for the SCI baud rate generator is the D2D clock / 4. MODULO DIVIDE BY (1 THROUGH 8191) D2D / 4 SBR12:SBR0 BAUD RATE GENERATOR OFF IF [SBR12:SBR0] = 0 DIVIDE BY 16 Tx BAUD RATE Rx SAMPLING CLOCK (16 x BAUD RATE) D2DCLK / 4 BAUD RATE = [SBR12:SBR0] x 16 Figure 48. SCI baud rate generation SCI communications require the transmitter and receiver (which typically derive baud rates from independent clock sources) to use the same baud rate. Allowed tolerance on this baud frequency depends on the details of how the receiver synchronizes to the leading edge of the start bit and how bit sampling is performed. The MCU resynchronizes to bit boundaries on every high-to-low transition, but in the worst case, there are no such transitions in the full 10- or 11-bit time character frame so any mismatch in baud rate is accumulated for the whole character time. For a NXP Semiconductor MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS SCI system whose bus frequency is driven by a crystal, the allowed baud rate mismatch is about 4.5 percent for 8-bit data format and about 4.0 percent for 9-bit data format. Although baud rate modulo divider settings do not always produce baud rates that exactly match standard rates, it is normally possible to get within a few percent, which is acceptable for reliable communications. 4.13.3.2 Transmitter functional description This section describes the overall block diagram for the SCI transmitter, as well as specialized functions for sending break and idle characters. The transmitter block diagram is shown in Figure 46. The transmitter output (TxD) idle state defaults to logic high (TXINV = 0 following reset). The transmitter output is inverted by setting TXINV = 1. The transmitter is enabled by setting the TE bit in SCIC2. This queues a preamble character that is one full character frame of the idle state. The transmitter then remains idle until data is available in the transmit data buffer. Programs store data into the transmit data buffer by writing to the SCI data register (SCID). The central element of the SCI transmitter is the transmit shift register that is either 10 or 11 bits long depending on the setting in the M control bit. For the remainder of this section, we will assume M = 0, selecting the normal 8-bit data mode. In 8-bit data mode, the shift register holds a start bit, eight data bits, and a stop bit. When the transmit shift register is available for a new SCI character, the value waiting in the transmit data register is transferred to the shift register (synchronized with the baud rate clock) and the transmit data register empty (TDRE) status flag is set to indicate another character may be written to the transmit data buffer at SCID. If no new character is waiting in the transmit data buffer after a stop bit is shifted out the TxD pin, the transmitter sets the transmit complete flag and enters an idle mode, with TxD high, waiting for more characters to transmit. Writing 0 to TE does not immediately release the pin to be a general purpose I/O pin. Any transmit activity that is in progress must first be completed. This includes data characters in progress, queued idle characters, and queued break characters. 4.13.3.2.1 Send break and queued idle The SBK control bit in SCIC2 is used to send break characters which were originally used to gain the attention of old teletype receivers. Break characters are a full character time of logic 0 (10 bit times including the start and stop bits). A longer break of 13 bit times can be enabled by setting BRK13 = 1. Normally, a program would wait for TDRE to become set to indicate the last character of a message has moved to the transmit shifter, then write 1 and then write 0 to the SBK bit. This action queues a break character to be sent as soon as the shifter is available. If SBK is still 1 when the queued break moves into the shifter (synchronized to the baud rate clock), an additional break character is queued. If the receiving device is another NXP Semiconductor SCI, the break characters will be received as 0s in all eight data bits and a framing error (FE = 1) occurs. When idle-line wake-up is used, a full character time of idle (logic 1) is needed between messages to wake up any sleeping receivers. Normally, a program would wait for TDRE to become set to indicate the last character of a message has moved to the transmit shifter, then write 0 and then write 1 to the TE bit. This action queues an idle character to be sent as soon as the shifter is available. As long as the character in the shifter does not finish while TE = 0, the SCI transmitter never actually releases control of the TxD pin. If there is a possibility of the shifter finishing while TE = 0, set the general-purpose I/O controls so the pin that is shared with TxD is an output driving a logic 1. This ensures that the TxD line will look like a normal idle line even if the SCI loses control of the port pin between writing 0 and then 1 to TE. The length of the break character is affected by the BRK13 and M bits as shown in Table 273. Table 273. Break character length BRK13 M Break character length 0 0 10 bit times 0 1 11 bit times 1 0 13 bit times 1 1 14 bit times 4.13.3.3 Receiver functional description In this section, the receiver block diagram (Figure 47) is used as a guide for the overall receiver functional description. The data sampling technique used to reconstruct receiver data is then described in more detail. Finally, two variations of the receiver wake-up function are explained. The receiver input is inverted by setting RXINV = 1. The receiver is enabled by setting the RE bit in SCIC2. Character frames consist of a start bit of logic 0, eight (or nine) data bits (LSB first), and a stop bit of logic 1. For information about 9-bit data mode, refer to Section 4.13.3.5.1, "8- and 9-bit data modes". For the remainder of this discussion, we assume the SCI is configured for normal 8-bit data mode. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS After receiving the stop bit into the receive shifter, and provided the receive data register is not already full, the data character is transferred to the receive data register and the receive data register full (RDRF) status flag is set. If RDRF was already set indicating the receive data register (buffer) was already full, the overrun (OR) status flag is set and the new data is lost. Because the SCI receiver is double-buffered, the program has one full character time after RDRF is set before the data in the receive data buffer must be read to avoid a receiver overrun. When a program detects that the receive data register is full (RDRF = 1), it gets the data from the receive data register by reading SCID. The RDRF flag is cleared automatically by a 2-step sequence which is normally satisfied in the course of the user's program that handles receive data. Refer to Section 4.13.3.4, "Interrupts and status flags" for more details about flag clearing. 4.13.3.3.1 Data sampling technique The SCI receiver uses a 16x baud rate clock for sampling. The receiver starts by taking logic level samples at 16 times the baud rate to search for a falling edge on the RxD serial data input pin. A falling edge is defined as a logic 0 sample after three consecutive logic 1 samples. The 16x baud rate clock is used to divide the bit time into 16 segments labeled RT1 through RT16. When a falling edge is located, three more samples are taken at RT3, RT5, and RT7 to make sure this was a real start bit and not merely noise. If at least two of these three samples are 0, the receiver assumes it is synchronized to a receive character. The receiver then samples each bit time, including the start and stop bits, at RT8, RT9, and RT10 to determine the logic level for that bit. The logic level is interpreted to be that of the majority of the samples taken during the bit time. In the case of the start bit, the bit is assumed to be 0 if at least two of the samples at RT3, RT5, and RT7 are 0 even if one or all of the samples taken at RT8, RT9, and RT10 are 1s. If any sample in any bit time (including the start and stop bits) in a character frame fails to agree with the logic level for that bit, the noise flag (NF) will be set when the received character is transferred to the receive data buffer. The falling edge detection logic continuously looks for falling edges, and if an edge is detected, the sample clock is resynchronized to bit times. This improves the reliability of the receiver in the presence of noise or mismatched baud rates. It does not improve worst case analysis because some characters do not have any extra falling edges anywhere in the character frame. In the case of a framing error, provided the received character was not a break character, the sampling logic that searches for a falling edge is filled with three logic 1 samples so that a new start bit can be detected almost immediately. The receiver is inhibited from receiving any new characters until the framing error flag is cleared. The receive shift register continues to function, but a complete character cannot transfer to the receive data buffer if FE is still set. 4.13.3.3.2 Receiver wake-up operation Receiver wake-up is a hardware mechanism that allows an SCI receiver to ignore the characters in a message that is intended for a different SCI receiver. In such a system, all receivers evaluate the first character(s) of each message, and as soon as they determine the message is intended for a different receiver, they write logic 1 to the receiver wake up (RWU) control bit in SCIC2. When RWU bit is set, the status flags associated with the receiver (with the exception of the idle bit, IDLE, when RWUID bit is set) are inhibited from setting, thus eliminating the software overhead for handling the unimportant message characters. At the end of a message, or at the beginning of the next message, all receivers automatically force RWU to 0 so all receivers wake up in time to look at the first character(s) of the next message. 4.13.3.3.2.1 Idle-line wake-up When WAKE = 0, the receiver is configured for idle-line wake-up. In this mode, RWU is cleared automatically when the receiver detects a full character time of the idle-line level. The M control bit selects 8-bit or 9-bit data mode that determines how many bit times of idle are needed to constitute a full character time (10 or 11 bit times because of the start and stop bits). When RWU is one and RWUID is zero, the idle condition that wakes up the receiver does not set the IDLE flag. The receiver wakes up and waits for the first data character of the next message which will set the RDRF flag and generate an interrupt if enabled. When RWUID is one, any idle condition sets the IDLE flag and generates an interrupt if enabled, regardless of whether RWU is zero or one. The idle-line type (ILT) control bit selects one of two ways to detect an idle line. When ILT = 0, the idle bit counter starts after the start bit so the stop bit and any logic 1s at the end of a character count toward the full character time of idle. When ILT = 1, the idle bit counter does not start until after a stop bit time, so the idle detection is not affected by the data in the last character of the previous message. 4.13.3.3.2.2 Address-mark wake-up When WAKE = 1, the receiver is configured for address-mark wake-up. In this mode, RWU is cleared automatically when the receiver detects a logic 1 in the most significant bit of a received character (eighth bit in M = 0 mode and ninth bit in M = 1 mode). Address-mark wake-up allows messages to contain idle characters but requires that the MSB be reserved for use in address frames. The logic 1 MSB of an address frame clears the RWU bit before the stop bit is received and sets the RDRF flag. In this case, the character with the MSB set is received even though the receiver was sleeping during most of this character time. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.13.3.4 Interrupts and status flags The SCI system has three separate interrupt vectors to reduce the amount of software needed to isolate the cause of the interrupt. One interrupt vector is associated with the transmitter for TDRE and TC events. Another interrupt vector is associated with the receiver for RDRF, IDLE, RXEDGIF, and LBKDIF events, and a third vector is used for OR, NF, FE, and PF error conditions. Each of these ten interrupt sources can be separately masked by local interrupt enable masks. The flags can still be polled by software when the local masks are cleared to disable generation of hardware interrupt requests. The SCI transmitter has two status flags that optionally can generate hardware interrupt requests. Transmit data register empty (TDRE) indicates when there is room in the transmit data buffer to write another transmit character to SCID. If the transmit interrupt enable (TIE) bit is set, a hardware interrupt will be requested whenever TDRE = 1. Transmit complete (TC) indicates that the transmitter is finished transmitting all data, preamble, and break characters and is idle with TxD at the inactive level. This flag is often used in systems with modems to determine when it is safe to turn off the modem. If the transmit complete interrupt enable (TCIE) bit is set, a hardware interrupt will be requested whenever TC = 1. Instead of hardware interrupts, software polling may be used to monitor the TDRE and TC status flags if the corresponding TIE or TCIE local interrupt masks are 0s. When a program detects that the receive data register is full (RDRF = 1), it gets the data from the receive data register by reading SCID. The RDRF flag is cleared by reading SCIS1 while RDRF = 1 and then reading SCID. When polling is used, this sequence is naturally satisfied in the normal course of the user program. If hardware interrupts are used, SCIS1 must be read in the interrupt service routine (ISR). Normally, this is done in the ISR anyway to check for receive errors, so the sequence is automatically satisfied. The IDLE status flag includes logic that prevents it from getting set repeatedly when the RxD line remains idle for an extended period of time. IDLE is cleared by reading SCIS1 while IDLE = 1 and then reading SCID. After IDLE has been cleared, it cannot become set again until the receiver has received at least one new character and has set RDRF. If the associated error was detected in the received character that caused RDRF to be set, the error flags -- noise flag (NF), framing error (FE), and parity error flag (PF) -- get set at the same time as RDRF. These flags are not set in overrun cases. If RDRF was already set when a new character is ready to be transferred from the receive shifter to the receive data buffer, the overrun (OR) flag gets set instead the data along with any associated NF, FE, or PF condition is lost. At any time, an active edge on the RxD serial data input pin causes the RXEDGIF flag to set. The RXEDGIF flag is cleared by writing a "1" to it. This function does depend on the receiver being enabled (RE = 1). 4.13.3.5 Additional SCI functions The following sections describe additional SCI functions. 4.13.3.5.1 8- and 9-bit data modes The SCI system (transmitter and receiver) can be configured to operate in 9-bit data mode by setting the M control bit in SCIC1. In 9-bit mode, there is a ninth data bit to the left of the MSB of the SCI data register. For the transmit data buffer, this bit is stored in T8 in SCIC3. For the receiver, the ninth bit is held in R8 in SCIC3. For coherent writes to the transmit data buffer, write to the T8 bit before writing to SCID. If the bit value to be transmitted as the ninth bit of a new character is the same as for the previous character, it is not necessary to write to T8 again. When data is transferred from the transmit data buffer to the transmit shifter, the value in T8 is copied at the same time data is transferred from SCID to the shifter. 9-bit data mode typically is used in conjunction with parity to allow eight bits of data plus the parity in the ninth bit. Or it is used with address-mark wake-up so the ninth data bit can serve as the wake-up bit. In custom protocols, the ninth bit can also serve as a software-controlled marker. 4.13.3.5.2 Stop mode operation During all stop modes, clocks to the SCI module are halted. In stop1 and stop2 modes, all SCI register data is lost and must be re-initialized upon recovery from these two stop modes. No SCI module registers are affected in stop3 mode. The receive input active edge detect circuit is still active in stop3 mode, but not in stop2. An active edge on the receive input brings the CPU out of stop3 mode if the interrupt is not masked (RXEDGIE = 1). Note, because the clocks are halted, the SCI module will resume operation upon exit from stop (only in stop3 mode). Software should ensure stop mode is not entered while there is a character being transmitted out of or received into the SCI module. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.13.3.5.3 Loop mode When LOOPS = 1, the RSRC bit in the same register chooses between loop mode (RSRC = 0) or single-wire mode (RSRC = 1). Loop mode is sometimes used to check software, independent of connections in the external system, to help isolate system problems. In this mode, the transmitter output is internally connected to the receiver input and the RxD pin is not used by the SCI, so it reverts to a general purpose port I/O pin. 4.13.3.5.4 Single-wire operation When LOOPS = 1, the RSRC bit in the same register chooses between loop mode (RSRC = 0) or single-wire mode (RSRC = 1). Single-wire mode is used to implement a half-duplex serial connection. The receiver is internally connected to the transmitter output and to the TxD pin. The RxD pin is not used and reverts to a general-purpose port I/O pin. In single-wire mode, the TXDIR bit in SCIC3 controls the direction of serial data on the TxD pin. When TXDIR = 0, the TxD pin is an input to the SCI receiver and the transmitter is temporarily disconnected from the TxD pin so an external device can send serial data to the receiver. When TXDIR = 1, the TxD pin is an output driven by the transmitter. In single-wire mode, the internal loop back connection from the transmitter to the receiver causes the receiver to receive characters that are sent out by the transmitter. 4.14 Life time counter (LTC) 4.14.1 Introduction The Life Time Counter is implemented as flexible counter running in both, low power (STOP and SLEEP) and normal modes. It is based on the ALFCLK clock featuring IRQ and Wake Up capabilities on the Life Time Counter Overflow. The Wake Up on overflow would be indicated in the PCR_SR register WULTCF bit. The Life Time Counter must be set in Normal mode. The Life Time Counter is an up counter. 4.14.2 4.14.2.1 Memory map and registers Overview This section provides a detailed description of the memory map and registers. 4.14.2.2 Module memory map The memory map for the LTC module is in Table 62 Table 274. Module memory map Offset(232) 0x38 0x39 0x3A 0x3B Name 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 LTC_CTL (hi) R 0 Life Time Counter control register W LTCIEM LTC_CTL (lo) R Life Time Counter control register W LTC_SR R LTCOF Life Time Counter status register W 1 = clear R 0 Reserved LTCIE LTCEM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 LTCE W MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 274. Module memory map (continued) Offset(232) Name 7 6 5 4 3 2 1 0 R 0x3C LTC_CNT1 Life Time Counter Register W R W LTC[31:0] R 0x3E LTC_CNT0 Life Time Counter Register W R W Notes 232. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 4.14.2.3 Register descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. 4.14.2.3.1 Life time counter control register (LTC_CTL (hi)) Table 275. Life time counter control register (LTC_CTL (hi)) Offset(233) 0x38 Access: User write 7 6 5 4 3 2 1 0 R 0 0 0 0 0 0 0 0 W LTCIEM Reset 0 LTCEM 0 0 0 0 0 0 0 Notes 233. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 276. Life time counter control register (LTC_CTL (hi)) - register field descriptions Field Description 0 LTCEM Life Time Counter Enable Mask 0 - writing the LTCE Bit will have no effect 1 - writing the LTCE Bit will be effective 7 LTCIEM Life Time Counter Interrupt Enable Mask 0 - writing the LTCIE Bit will have no effect 1 - writing the LTCIE Bit will be effective MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.14.2.3.2 Life time counter control register (LTC_CTL (lo)) Table 277. Life time counter control register (LTC_CTL (lo)) Offset(234) 0x39 Access: User read/write 7 R LTCIE W Reset 0 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 LTCE 0 Notes 234. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 278. Life time counter control register (LTC_CTL (lo)) - register field descriptions Field Description 0 LTCE Life Time Counter Enable 1 - Life time counter module enabled. Counter will be incremented with based on the ALFCLK frequency. 0 - Life time counter module disabled. Counter content will remain.(235) 7 LTCIE Life Time Counter Interrupt Enable 1 - Life time counter overflow will generate an interrupt request. 0 - Life time counter overflow will not generate an interrupt request. Notes 235. The first period after enable might be shorted due to the asynchronous clocks. 4.14.2.3.3 Life time counter status register (LTC_SR) Table 279. Life time counter status register (LTC_SR) Offset(236) 0x3A R Access: User read/write 7 6 5 4 3 2 1 0 LTCOF 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset Notes 236. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 280. Life time counter status register (LTC_SR) - register field descriptions Field 0 LTCOF Description Life Time Counter Overflow Flag. Writing 1 will clear the flag. 1 - Life time counter overflow detected. 0 - No life time counter overflow since last clear MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.14.2.3.4 Life time counter register (LTC_CNT1, LTC_CNT0) Table 281. Life time counter register (LTC_CNT1, LTC_CNT0) Offset (237),(238) Access: User read/write 0x3C, 0x3E 7 6 5 4 3 2 1 0 0 0 0 0 R W LTC[31:16] R W R W LTC[15:0] R W Reset 0 0 0 0 Notes 237. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 238. Those Registers are 16-Bit access only. Table 282. Life time counter register (LTC_CNT1, LTC_CNT0) - register field descriptions Field Description 0-31 LTC[31:0] Life Time Counter Register The two 16-Bit words of the 32-Bit Life Time Counter register represent the current counter status. Whenever the microcontroller performs a reading operation on one of the 16Bit registers, the Life Time Counter is stopped until the remaining 16-Bit register is read, to prevent loss of information. After the second part is read, the LTC continues automatically. Write operations should be performed with the Life Time Counter disabled to prevent a loss of data. 4.15 Die to die interface - target The D2D Interface is the bus interface to the Microcontroller. Access to the MM912_637 analog die is controlled by the D2D Interface module. This section describes the functionality of the die-to-die target block (D2D). 4.15.1 Overview The D2D is the target for a data transfer from the target to the initiator (MCU). The initiator provides a set of configuration registers and two memory mapped 256 Byte address windows. When writing to a window a transaction is initiated sending a write command, followed by an 8-bit address and the data byte or word is received from the initiator. When reading from a window a transaction is received with the read command, followed by an 8-bit address. The target then responds with the data. The basic idea is that a peripheral located on the MM912_637 analog die, can be addressed like an on-chip peripheral. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Internal Read Data Bus Command, Address and Data Buffer Internal Write Data Bus Internal Address Bus D2DCLK Internal Interrupt signal (INT) Internal Interrupt Sources Figure 49. Die to die interface Features: * software transparent register access to peripherals on the MM912_637 analog die * 256 Byte address window * supports blocking read or write as well as non-blocking write transactions * 8 bit physical bus width * automatic synchronization of the target when initiator starts driving the interface clock * generates transaction and error status as well as EOT acknowledge * providing single interrupt interface to D2D Initiator 4.15.2 Low power mode operation The D2D module is disabled in SLEEP and STOP mode. In Stop mode, the D2DINT signal is used to wake-up a powered down MCU after re-enabling the D2D interface. As the MCU could wake-up without the MM912_637 analog die, a special command will be recognized as wake-up event during Stop mode. See Section 4.3, "Analog die - power, clock and resets - PCR". 4.15.2.1 Normal mode While in Normal, D2DCLK acts as an input only with pull present. D2D[7:0] operates as input/output with pull-down always present. D2DINT acts as an output only. 4.15.2.2 Sleep mode/stop mode While in Sleep mode, all Interface data pins are pulled down to DGND to reduce power consumption. 4.16 4.16.1 Embedded microcontroller - overview Introduction The S12 Central Processing Unit (CPU) offers 128 kB of Flash memory and 6.0 kB of system SRAM, up to eight general purpose I/Os, an on-chip oscillator and clock multiplier, one Serial Peripheral Interface (SPI), an interrupt module, and debug capabilities via the on-chip debug module (DBG), in combination with the Background Debug mode (BDM) interface. Additionally, there is a die-to-die initiator (D2DI) which represents the communication interface to the companion (analog) die. 4.16.2 Features This section describes the key features of the MM912_637 micro controller die. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.16.2.1 Chip-level features On-chip modules available within the family include the following features: * S12 CPU core (CPU12_V1) * 128 kByte on-chip flash with ECC * 4.0 kbyte on-chip data flash with ECC * 6.0 kbyte on-chip SRAM * Phase locked loop (IPLL) frequency multiplier with internal filter * 4.0-16 MHz amplitude controlled Pierce oscillator * 1.024 MHz internal RC oscillator * One serial peripheral interface (SPI) module * On-chip voltage regulator (VREG) for regulation of input supply and all internal voltages * Die to Die Initiator (D2DI) 4.16.3 Module features The following sections provide more details of the modules implemented on the MC9S12I128. 4.16.3.1 S12 16-bit central processor unit (CPU) S12 CPU is a high-speed 16-bit processing unit: * * * Full 16-bit data paths supports efficient arithmetic operation and high speed math execution Includes many single-byte instructions. This allows much more efficient use of ROM space Extensive set of indexed addressing capabilities, including: -- Using the stack pointer as an indexing register in all indexed operations -- Using the program counter as an indexing register in all but auto increment/decrement mode -- Accumulator offsets using A, B, or D accumulators -- Automatic index predecrement, preincrement, postdecrement, and postincrement (by -8 to +8) 4.16.3.2 On-chip flash with ECC On-chip flash memory on the MM912_637 features the following: * 128 kbyte of program flash memory -- 32 data bits plus 7 syndrome ECC (Error Correction Code) bits allow single bit error correction and double fault detection -- Erase sector size 512 bytes -- Automated program and erase algorithm -- User margin level setting for reads -- Protection scheme to prevent accidental program or erase * 4.0 kbyte data flash memory -- 16 data bits plus 6 syndrome ECC (Error Correction Code) bits allow single bit error correction and double-bit error detection -- Erase sector size 256 bytes -- Automated program and erase algorithm -- User margin level setting for reads 4.16.3.3 * 6.0 kBytes of general purpose RAM 4.16.3.4 * On-chip SRAM Main external oscillator (XOSC) Loop controlled Pierce oscillator using a 4.0 MHz to 16 MHz crystal or resonator -- Current gain control on amplitude output -- Signal with low harmonic distortion -- Low power -- Good noise immunity MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS -- -- 4.16.3.5 * * Serial peripheral interface module (SPI) Configurable 8- or 16-bit data size Full duplex or single-wire bidirectional Double buffered transmit and receive Master or slave mode MSB-first or LSB-first shifting Serial clock phase and polarity options 4.16.3.9 * * * * System integrity support Power-on reset (POR) System reset generation Illegal address detection with reset Low voltage detection with interrupt or reset Real time interrupt (RTI) Computer operating properly (COP) watchdog -- Configurable as window COP for enhanced failure detection -- Initialized out of reset using option bits located in flash memory Clock monitor supervising the correct function of the oscillator 4.16.3.8 * * * * * * Internal phase-locked-loop (IPLL) Phase-locked-loop clock frequency multiplier -- No external components required -- Reference divider and multiplier allow large variety of clock rates -- Automatic bandwidth control mode for low-jitter operation -- Automatic frequency lock detector -- Configurable option to spread spectrum for reduced EMC radiation (frequency modulation) -- Reference clock sources: - External 4.0-16 MHz resonator/crystal (XOSC) - Internal 1.024 MHz RC oscillator (IRC) 4.16.3.7 * * * * * * Internal RC oscillator (IRC) Trimmable internal reference clock -- Frequency: 1.024 MHz 4.16.3.6 * Eliminates need for external current limiting resistor Transconductance sized for optimum start-up margin for typical crystals On-chip voltage regulator (VREG) Linear voltage regulator with bandgap reference Low voltage detect (LVD) with low voltage interrupt (LVI) Power-on reset (POR) circuit Low voltage reset (LVR) 4.16.3.10 Background debug (BDM) * * Non-intrusive memory access commands Supports in-circuit programming of on-chip nonvolatile memory MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.16.3.11 Debugger (DBG) * * * * * Trace buffer with depth of 64 entries Three comparators (A, B and C) -- Comparator A compares the full address bus and full 16-bit data bus -- Exact address or address range comparisons Two types of comparator matches -- Tagged: This matches just before a specific instruction begins execution -- Force: This is valid on the first instruction boundary after a match occurs Four trace modes Four stage state sequencer 4.16.3.12 Die to die initiator (D2DI) * * Up to 2.0 Mbyte/s data rate Configurable 4-bit or 8-bit wide data path 4.16.4 Block diagram PORTD 6.0 k bytes RAM D2D0 D2D1 D2D2 D2D3 D2D4 D2D5 D2D6 D2D7 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 D2DCLK D2DINT PORTC 128 k bytes Flash with ECC PC0 PC1 PORTA Figure 50 shows a block diagram of the MC9S12I128 device. PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 Die-to-Die Initiator selectable 4 or 8 bit wide 4.0 k bytes Dataflash with ECC Voltage Regulator Input: 3.13 V ... 5.5 V Outputs: 1.8 V core and 2.7 Flash CPU12-V1 PORTE BKGD PE0 PE1 RESET TEST Debug Module Single-wire Background 3 address breakpoints Debug Module 1 data breakpoints 64 Byte Trace Buffer EXTAL XTAL Amplitude Controlled Low Power Clock Monitor COP Watchdog Periodic Interrupt . PLL with Frequency Modulation option Reset Generation and Test Entry Interrupt Module SPI Synchronous Serial IF MISO MOSI SCK SS Power Supply: VDDRX, VSSRX: 3.13 V ...5.5V for Regulator Input, Port A, Port E, BKGD, TEST and RESET VDDD2D, VSSD2D: 2.5 V for Ports C and D Figure 50. MC9S12I128 block diagram 4.16.5 Device memory map Table 283 shows the device register memory map. Table 283. Device register memory map Address Module Size (Bytes) 0x0000-0x0009 PIM (port integration module) 10 0x000A-0x000B MMC (memory map control) 2 0x000C-0x000D PIM (port integration module) 2 0x000E-0x000F Reserved 2 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 283. Device register memory map (continued) Address Module Size (Bytes) 0x0010-0x0015 MMC (memory map control) 8 0x0016-0x0019 Reserved 2 0x001A-0x001B Device ID register 2 0x001C-0x001E Reserved 4 0x001F INT (interrupt module) 1 0x0020-0x002F DBG (debug module) 16 0x0030-0x0033 Reserved 4 0x0034-0x003F CPMU (clock and power management) 12 0x0040-0x00D7 Reserved 152 0x00D8-0x00DF D2DI (die 2 die initiator) 8 0x00E0-0x00E7 Reserved 32 0x00E8-0x00EF SPI (serial peripheral interface) 8 0x00F0-0x00FF Reserved 32 0x0100-0x0113 FTMRC control registers 20 0x0114-0x011F Reserved 12 0x0120-0x017F PIM (port integration module) 96 0x0180-0x01EF Reserved 112 0x01F0-0x01FC CPMU (clock and power management) 13 0x01FD-0x01FF Reserved 3 0x0200-0x02FF D2DI (die 2 die initiator, blocking access window) 256 0x0300-0x03FF D2DI (die 2 die initiator, non-blocking write window) 256 NOTE Reserved register space shown in Table 283 is not allocated to any module. This register space is reserved for future use. Writing to these locations have no effect. Read access to these locations returns zero. Figure 51 shows MM912_637 CPU and BDM local address translation to the global memory map. It indicates also the location of the internal resources in the memory map. The whole 256 k global memory space is visible through the P-Flash window located in the 64 k local memory map located at 0x8000 - 0xBFFF using the PPAGE register. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS CPU and BDM Local Memory Map 0x0000 0x0_0000 Registers Registers Unimplemented D-Flash 4K Bytes 0x0_2800 0x1400 RAM 6K Unpaged P-Flash Page 0x0C 0x0_4000 0x0_4400 RAM 6K Bytes NVM Resources D-Flash 0x0_5400 NVM Resources 0x4000 Unimplemented (PPAGES 0x02-0x07) P-Flash 4* 16K Pages (PPAGES 0x08-0x0B) 0x0_8000 (PPAGE 0x01) 0x2800 (PPAGE 0x00) 0x0400 Global Memory Map Unpaged P-Flash Page 0x0D 0x2_0000 0x8000 P-Flash window 0 0 0 0 Unpaged P-Flash P3 P2 P1 P0 PPAGE 0x3_4000 0xC000 Unpaged P-Flash 0x3_8000 Unpaged P-Flash Page 0x0F 0xFFFF 0x3_C000 Unpaged P-Flash 0x3_FFFF Figure 51. MC9S12I128 global memory map (PPAGE 0x0C) (PPAGE 0x0D) (PPAGE 0x0E) (PPAGE 0x0F) 0x3_0000 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.16.6 Part ID assignments The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses 0x001A and 0x001B). The read-only value is a unique part ID for each revision of the chip. Table 284 shows the assigned part ID number and Mask Set number. The Version ID in Table 284 is a word located in a flash information row. The version ID number indicates a specific version of internal NVM controller. Table 284. Assigned part ID numbers Device Mask set number Part ID(239) Version ID MM912_637 0M96X 0x3880 0x0000 Notes 239. The coding is as follows: Bit 15-12: Major family identifier Bit 11-6: Minor family identifier Bit 5-4: Major mask set revision number including FAB transfers Bit 3-0: Minor -- non full -- mask set revision 4.16.7 System clock description Refer to Section 4.23, "S12 clock, reset, and power management unit (9S12I128PIMV1)" for the system clock description. 4.16.8 Modes of operation The MCU can operate in different modes. These are described in Section 4.16.8.1, "Chip configuration summary". The MCU can operate in different power modes to facilitate power saving when full system performance is not required. These are described in Section 4.16.8.2, "Low power operation". Some modules feature a software programmable option to freeze the module status while the background debug module is active to facilitate debugging. 4.16.8.1 Chip configuration summary The different modes and the security state of the MCU affect the debug features (enabled or disabled). The operating mode out of reset is determined by the state of the MODC signal during reset (see Table 285). The MODC bit in the MODE register shows the current operating mode and provides limited mode switching during operation. The state of the MODC signal is latched into this bit on the rising edge of RESET. Table 285. Chip modes Chip modes MODC Normal single chip 1 Special single chip 0 4.16.8.1.1 Normal single-chip mode This mode is intended for normal device operation. The opcode from the on-chip memory is being executed after reset (requires the reset vector to be programmed correctly). The processor program is executed from internal memory. 4.16.8.1.2 Special single-chip mode This mode is used for debugging single-chip operation, boot-strapping, or security related operations. The background debug module BDM is active in this mode. The CPU executes a monitor program located in an on-chip ROM. BDM firmware waits for additional serial commands through the BKGD pin. 4.16.8.2 Low power operation The MM912_637 has two static low-power modes Pseudo Stop and Stop mode. For a detailed description refer to the S12CPMU section. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.16.9 Security The MCU security mechanism prevents unauthorized access to the Flash memory. Refer to Section 4.21, "MCU - security (S12XS9S12I128PIMV1V2)", Section 4.22.4.1, "Security", and Section 4.25.5, "Security". 4.16.10 Resets and interrupts Consult the S12 CPU manual and the S12SINT section for information on exception processing. 4.16.10.1 Resets Table 286 lists all Reset sources and the vector locations. Resets are explained in detail in Section 4.23, "S12 clock, reset, and power management unit (9S12I128PIMV1)". Table 286. Reset sources and vector locations Vector address Reset source CCR mask Local enable $FFFE Power-On Reset (POR) None None $FFFE Low Voltage Reset (LVR) None None $FFFE External pin RESET None None $FFFE Illegal Address Reset None None $FFFC Clock monitor reset None OSCE Bit in CPMUOSC register $FFFA COP watchdog reset None CR[2:0] in CPMUCOP register 4.16.10.2 Interrupt vectors Table 287 lists all interrupt sources and vectors in the default order of priority. The interrupt module (see Section 4.18, "MCU - interrupt module (S12S9S12I128PIMV1V1)") provides an interrupt vector base register (IVBR) to relocate the vectors. Table 287. Interrupt vector locations (Sheet 2 of 2) Vector Address(240) Interrupt Source CCR Mask Local Enable Wake-up from STOP Wake-up from WAIT Vector base + $F8 Unimplemented instruction trap None None - - Vector base+ $F6 SWI None None - - Vector base+ $F4 D2DI Error Interrupt X Bit None Yes Yes Vector base+ $F2 D2DI External Interrupt I bit D2DCTL (D2DIE) Yes Yes Vector base+ $F0 RTI timeout interrupt I bit CPMUINT (RTIE) Vector base + $EE to Vector base + $DA Vector base + $D8 3.22.6 Interrupts Reserved SPI I bit Vector base + $D6 to Vector base + $CA SPICR1 (SPIE, SPTIE) No Yes Reserved Vector base + $C8 Oscillator status interrupt I bit CPMUINT (OSCIE) No No Vector base + $C6 PLL lock interrupt I bit CPMUINT (LOCKIE) No No No No Vector base + $C4 to Vector base + $BC Vector base + $BA Reserved FLASH error I bit FERCNFG (SFDIE, DFDIE) MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 287. Interrupt vector locations (Sheet 2 of 2) Vector Address(240) Interrupt Source CCR Mask Local Enable Wake-up from STOP Wake-up from WAIT Vector base + $B8 FLASH command I bit FCNFG (CCIE) No Yes No Yes - - Vector base + $B6 to Vector base + $8C Vector base + $8A Reserved Low-voltage interrupt (LVI) I bit Vector base + $88 to Vector base + $82 Vector base + $80 CPMUCTRL (LVIE) Reserved Spurious interrupt -- None Notes 240. 16-bit vector address based 4.16.10.3 Effects of reset When a reset occurs, MCU registers and control bits are initialized. Refer to the respective block sections for register reset states. On each reset, the Flash module executes a reset sequence to load Flash configuration registers. 4.16.10.3.1 Flash configuration reset sequence phase The Flash module will hold CPU on each reset activity while loading Flash module registers from the Flash memory. If double faults are detected in the reset phase, Flash module protection and security may be active on leaving reset. This is explained in more detail in the Flash module, Section 4.25.6, "Initialization". 4.16.10.3.2 Reset while flash command active If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/block being erased is not guaranteed. 4.16.10.3.3 I/O pins Refer to the PIM section for reset configurations of all peripheral module ports. 4.16.10.3.4 Memory The RAM arrays are not initialized out of reset. 4.16.11 COP configuration The COP timeout rate bits CR[2:0] and the WCOP bit in the CPMUCOP register at address 0x003C are loaded from the Flash register FOPT. See Table 288 and Table 289 for coding. The FOPT register is loaded from the Flash configuration field byte at global address 0x3_FF0E during the reset sequence. Table 288. Initial COP rate configuration NV[2:0] in FOPT register CR[2:0] in COPCTL register 000 111 001 110 010 101 011 100 100 011 MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 288. Initial COP rate configuration (continued) NV[2:0] in FOPT register CR[2:0] in COPCTL register 101 010 110 001 111 000 Table 289. Initial WCOP configuration NV[3] in FOPT register WCOP in COPCTL register 1 0 0 1 4.17 MCU - port integration module (9S12I128PIMV1) 4.17.1 Introduction The Port Integration Module (PIM) establishes the interface between the S12I128 peripheral modules SPI and Die-To-Die Interface module (D2DI) to the I/O pins of the MCU. All port A and port E pins support general purpose I/O functionality, if not in use with other functions. The PIM controls the signal prioritization and multiplexing on shared pins. 4.17.1.1 Overview Figure 52 is a block diagram of the Port Integration Module. D2DDAT0 D2DDAT1 D2DDAT2 D2DDAT3 D2DDAT4 D2DDAT5 D2DDAT6 D2DDAT7 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 SPI Synchronous Serial IF EXTAL XTAL MISO MOSI SCK SS PORTA CPMU OSC PORTE PC0 PC1 DDRE Die-to-Die IF D2DCLK D2DINT DDRA D2DI PE0 PE1 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 Figure 52. Port integration module - block diagram 4.17.1.2 * * * * * Features 8-pin port A associated with the SPI module 2-pin port C used as D2DI clock output and D2DI interrupt input 8-pin port D used as 8 or 4 bit data I/O for the D2DI module 2-pin port E associated with the CPMU OSC module GPIO function shared on port A and E pins MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS * * Pull-down devices on PC1 and PD7-0 if used as D2DI inputs Reduced drive capability on PC0 and PD7-0 on per pin basis The Port Integration Module includes these distinctive registers: * Data registers for ports A and E when used as general purpose I/O * Data direction registers for ports A and E when used as general purpose I/O * Port input register on ports A and E * Reduced drive register on port C and D 4.17.2 External signal description This section lists and describes the signals that do connect off-chip. Table 290 shows all the pins and their functions that are controlled by the Port Integration Module. NOTE If there is more than one function associated with a pin, the priority is indicated by the position in the table from top (highest priority) to bottom (lowest priority). Table 290. Pin functions and priorities Port Pin name Pin function & priority I/O PA7 GPIO I/O General-purpose I/O PA6 GPIO I/O General-purpose I/O PA5 GPIO I/O General-purpose I/O PA4 GPIO I/O General-purpose I/O SS I/O Serial Peripheral Interface 0 slave select output in master mode, input in slave or master mode GPIO I/O General-purpose I/O SCK I/O Serial Peripheral Interface 0 serial clock pin GPIO I/O General-purpose I/O MOSI I/O Serial Peripheral Interface 0 master out/slave in pin GPIO I/O General-purpose I/O MISO I/O Serial Peripheral Interface 0 master in/slave out pin GPIO I/O General-purpose I/O XTAL - CPMU OSC XTAL pin GPIO I/O General-purpose I/O EXTAL - GPIO I/O PA3 A PA2 PA1 PA0 PE1 E PE0 4.17.3 Pin function after reset Description CPMU OSC EXTAL pin GPI GPI General-purpose I/O Memory map and register definition This section provides a detailed description of all Port Integration Module registers. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.17.3.1 Memory map Table 291. PIM register summary Register Name 0x0000 PORTA 0x0001 PORTE 0x0002 DDRA 0x0003 DDRE 0x00040x0009 Reserved 0x000C PUCR 0x000D RDRIV 0x0120 PTIA 0x0121 PTIE 0x01220x017F Reserved Bit 7 6 5 4 3 2 1 Bit 0 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 0 0 0 0 0 0 PE1 PE0 DDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0 0 0 0 0 0 0 DDRE1 DDRE0 0 0 0 0 0 0 0 0 0 0 0 0 RDPD RDPC R W R W R W R W R W R 0 BKPUE W R 0 0 0 0 PTIA7 PTIA6 PTIA5 PTIA4 PTIA3 0 0 0 0 0 0 0 0 W R PDPEE 0 0 0 PTIA2 PTIA1 PTIA0 0 0 PTIE1 PTIE0 0 0 0 0 W R W R W = Unimplemented or Reserved 4.17.3.2 Port A data register (PORTA) Table 292. Port A data register (PORTA) Address 0x0000 Access: User read/write 7 6 5 4 3 2 1 0 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 SPI Function -- -- -- -- SS SCK MOSI MISO Reset 0 0 0 0 0 0 0 0 R W Read: Anytime. Write: Anytime. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 293. PORTA register field descriptions Field Description 7-4 PA Port A general purpose input/output data--Data Register In / output mode the register bit is driven to the pin. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered and synchronized pin input state is read. 3 PA Port A general purpose input/output data--Data Register, SPI SS input/output When not used with the alternative function, this pin can be used as general purpose I/O. In general purpose output mode the register bit is driven to the pin. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. The SPI function takes precedence over the general purpose I/O function if enabled. 2 PA Port A general purpose input/output data--Data Register, SPI SCK input/output When not used with the alternative function, this pin can be used as general purpose I/O. In general purpose output mode the register bit is driven to the pin. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. The SPI function takes precedence over the general purpose I/O function if enabled. 1 PA Port A general purpose input/output data--Data Register, SPI MOSI input/output When not used with the alternative function, this pin can be used as general purpose I/O. In general purpose output mode the register bit is driven to the pin. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. The SPI function takes precedence over the general purpose I/O function if enabled. 0 PA Port A general purpose input/output data--Data Register, SPI MISO input/output When not used with the alternative function, this pin can be used as general purpose I/O. In general purpose output mode the register bit is driven to the pin. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. The SPI function takes precedence over the general purpose I/O function if enabled. 4.17.3.3 Port E data register (PORTE) Table 294. Port E data register (PORTE) Address 0x0001 Access: User read/write 7 6 5 4 3 2 0 0 0 0 0 0 CPMU OSC Function -- -- -- -- -- Reset 0 0 0 0 0 R 1 0 PE1 PE0 -- XTAL EXTAL 0 0 0 W Read: Anytime. Write: Anytime. Table 295. PORTE register field descriptions Field Description 1 PE Port E general purpose input/output data--Data Register, CPMU OSC XTAL signal When not used with the alternative function, this pin can be used as general purpose I/O. In general purpose output mode the register bit is driven to the pin. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. The CPMU OSC function takes precedence over the general purpose I/O function if enabled. 0 PE Port E general purpose input/output data--Data Register, CPMU OSC EXTAL signal When not used with the alternative function, this pin can be used as general purpose I/O. In general purpose output mode the register bit is driven to the pin. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. The CPMU OSC function takes precedence over the general purpose I/O function if enabled. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.17.3.4 Port A data direction register (DDRA) Table 296. Port A data direction register (DDRA) Address 0x0002 R W Access: User read/write 7 6 5 4 3 2 1 0 DDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0 0 0 0 0 0 0 0 0 Reset Read: Anytime. Write: Anytime. Table 297. DDRA register field descriptions Field Description 7-4 DDRA Port A Data Direction-- This bit determines whether the associated pin is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 3-0 DDRA Port A Data Direction-- This bit determines whether the associated pin is an input or output. Depending on the configuration of the enabled SPI the I/O state will be forced to input or output. In this case, the data direction bits will not change. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 4.17.3.5 Port E data direction register (DDRE) Table 298. Port E data direction register (DDRE) Address 0x0003 R Access: User read/write 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 DDRE1 DDRE0 0 0 Read: Anytime. Write: Anytime. Table 299. DDRE register field descriptions Field Description 1-0 DDRE Port E Data Direction-- This bit determines whether the associated pin is an input or output. The enabled CPMU OSC function connects the associated pins directly to the oscillator module. In this case, the data direction bits will not change. 1 Associated pin is configured as output. 0 Associated pin is configured as input. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.17.3.6 Pull-up control register (PUCR) Table 300. Pull control register (PUCR) Address 0x000C 7 R 0 W Reset 0 Access: User read/write 6 BKPUE 1 5 4 3 2 0 0 0 0 0 0 0 0 1 0 PDPEE 1 0 0 Read: Anytime. Write: Anytime. Table 301. PUCR register field descriptions Field Description 6 BKPUE BKGD pin pull-up Enable--Enable pull-up devices on BKGD pin This bit configures whether a pull-up device is activated, if the pin is used as input. This bit has no effect if the pin is used as output. Out of reset the pull-up device is enabled. 1 Pull-up device enabled. 0 Pull-up device disabled. 1 PDPEE Pull-down Port E Enable--Enable pull-down devices on all Port E input pins This bit configures whether pull-down devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-down devices are enabled. If the CPMU OSC function is active, the pull-down devices are disabled. In this case, the register bit will not change. 1 Pull-down devices enabled. 0 Pull-down devices disabled. 4.17.3.7 Reduced drive register (RDRIV) Table 302. Reduced drive register (RDRIV) Address 0x000D R Access: User read/write 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 RDPD RDPC 0 0 1 0 0 0 0 0 Read: Anytime. Write: Anytime. Table 303. RDRIV register field descriptions Field Description 3 RDPD Port D reduced drive--Select reduced drive for output pins This bit configures the drive strength of output pins as either full or reduced. If a pin is used as input, this bit has no effect. 1 Reduced drive selected (1/5 of the full drive strength) 0 Full drive strength enabled 2 RDPC Port C reduced drive--Select reduced drive for D2DCLK output pin This bit configures the drive strength of D2DCLK output pin as either full or reduced. 1 Reduced drive selected (1/5 of the full drive strength) 0 Full drive strength enabled MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.17.3.8 Port A input register (PTIA) Table 304. Port A input register (PTIA) Address 0x0120 R Access: User read 7 6 5 4 3 2 1 0 PTIA7 PTIA6 PTIA5 PTIA4 PTIA3 PTIA2 PTIA1 PTIA0 u u u u u u u u W Reset(241) Notes 241. u = Unaffected by reset Read: Anytime. Write: Unimplemented. Writing to this register has no effect. Table 305. PTIA register field descriptions Field Description 7-0 PTIA Port A input data-- A read always returns the buffered input state of the associated pin. It can be used to detect overload or short-circuit conditions on output pins. 4.17.3.9 Port E input register (PTIE) Table 306. Port E input register (PTIE) Address 0x0121 R Access: User read 7 6 5 4 3 2 1 0 0 0 0 0 0 0 PTIE1 PTIE0 u u u u u u u u W Reset (242) Notes 242. u = Unaffected by reset Read: Anytime. Write: Unimplemented. Writing to this register has no effect. Table 307. PTIE register field descriptions Field Description 1-0 PTIE Port E input data-- A read always returns the buffered input state of the associated pin. It can be used to detect overload or short-circuit conditions on output pins. 4.17.4 4.17.4.1 4.17.4.1.1 Functional description Registers Data register (PORTx) This register holds the value driven out to the pin, if the pin is used as a general purpose I/O. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Writing to this register has only an effect on the pin, if the pin is used as general purpose output. When reading this address, the buffered and synchronized state of the pin is returned, if the associated data direction register bit is set to "0". If the data direction register bits are set to logic level "1", the contents of the data register is returned. This is independent of any other configuration (Figure 53). 4.17.4.1.2 Data direction register (DDRx) This register defines whether the pin is used as an input or an output. If a peripheral module controls the pin the contents of the data direction register is ignored (Figure 53). 4.17.4.1.3 Input register (PTIx) This is a read-only register and always returns the buffered and synchronized state of the pin (Figure 53). PTIx synch. 0 1 PORTx 0 PIN 1 DDRx 0 1 data out Periph. Module output enable port enable data in Figure 53. Illustration of I/O pin functionality 4.17.4.1.4 Reduced drive register (RDRIV) If the pin is used as an output, this register allows the configuration of the drive strength. 4.17.4.1.5 Pull device enable register (PUCR) This register turns on a pull-up or pull-down device. It becomes active only if the pin is used as an input. 4.17.4.2 4.17.4.2.1 Ports Port A This port is associated with the SPI. Port A pins PA7-0 can be used for general purpose I/O and PA3-0 also with the SPI subsystem. 4.17.4.2.2 Port E This port is associated with the CPMU OSC. Port E pins PE1-0 can be used for general purpose or with the CPMU OSC module. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.17.5 Initialization information 4.17.5.1 Port data and data direction register writes Writing PTx and DDRx in a word access is not recommended. When changing the register pins from inputs to outputs, the data may have extra transitions during the write access. Initialize the port data register before enabling the outputs. 4.18 MCU - interrupt module (S12S9S12I128PIMV1V1) 4.18.1 Introduction The 9S12I128PIMV1 module decodes the priority of all system exception requests and provides the applicable vector for processing the exception to the CPU. The 9S12I128PIMV1 module supports: * I bit and X bit maskable interrupt requests * A non-maskable unimplemented op-code trap * A non-maskable software interrupt (SWI) or background debug mode request * Three system reset vector requests * A spurious interrupt vector Each of the I bit maskable interrupt requests is assigned to a fixed priority level. 4.18.1.1 Glossary Table 308 contains terms and abbreviations used in the document. Table 308. Terminology Term Meaning CCR Condition Code Register (in the CPU) ISR Interrupt Service Routine MCU 4.18.1.2 * * * * * * * * * * Micro-controller Unit Features Interrupt vector base register (IVBR) One spurious interrupt vector (at address vector base(243) + 0x0080). 2-58 I bit maskable interrupt vector requests (at addresses vector base + 0x0082-0x00F2) I bit maskable interrupts can be nested One X bit maskable interrupt vector request (at address vector base + 0x00F4) One non-maskable software interrupt request (SWI) or background debug mode vector request (at address vector base + 0x00F6) One non-maskable unimplemented op-code trap (TRAP) vector (at address vector base + 0x00F8) Three system reset vectors (at addresses 0xFFFA-0xFFFE) Determines the highest priority interrupt vector requests, drives the vector to the bus on CPU request Wakes up the system from stop or wait mode when an appropriate interrupt request occurs Notes 243. The vector base is a 16-bit address which is accumulated from the contents of the interrupt vector base register (IVBR, used as upper byte) and 0x00 (used as lower byte). MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.18.1.3 * * * * Modes of operation Run mode This is the basic mode of operation. Wait mode In Wait mode, the clock to the 9S12I128PIMV1 module is disabled. The 9S12I128PIMV1 module is however capable of waking up the CPU from Wait mode, if an interrupt occurs. Refer to Section 4.18.5.3, "Wake-up from stop or wait mode"" for details Stop mode In Stop mode, the clock to the 9S12I128PIMV1 module is disabled. The 9S12I128PIMV1 module is however capable of waking up the CPU from Stop mode, if an interrupt occurs. Refer to Section 4.18.5.3, "Wake-up from stop or wait mode"" for details Freeze mode (BDM active) In Freeze mode (BDM active), the interrupt vector base register is overridden internally. Refer to Section 4.18.3.1.1, "Interrupt vector base register (IVBR)"" for details 4.18.1.4 Block diagram Figure 54 shows a block diagram of the 9S12I128PIMV1 module. Peripheral Interrupt Requests Priority Decoder Non I bit Maskable Channels Vector Address I bit Maskable Channels To CPU Wake-up CPU IVBR Interrupt Requests Figure 54. 9S12I128PIMV1 block diagram 4.18.2 External signal description The 9S12I128PIMV1 module has no external signals. 4.18.3 Memory map and register definition This section provides a detailed description of all registers accessible in the 9S12I128PIMV1 module. 4.18.3.1 Register descriptions This section describes in address order all the 9S12I128PIMV1 registers and their individual bits. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.18.3.1.1 Interrupt vector base register (IVBR) Table 309. Interrupt vector base register (IVBR) Address: 0x001F 7 6 5 4 R 3 2 1 0 1 1 1 1 IVB_ADDR[7:0] W Reset 1 1 1 1 Read: Anytime. Write: Anytime. Table 310. IVBR field descriptions Field Description 7-0 IVB_ADDR[7:0] Interrupt Vector Base Address Bits -- These bits represent the upper byte of all vector addresses. Out of reset, these bits are set to 0xFF (i.e., vectors are located at 0xFF80-0xFFFE) to ensure compatibility to HCS12. Note: A system reset will initialize the interrupt vector base register with "0xFF" before it is used to determine the reset vector address. Therefore, changing the IVBR has no effect on the location of the three reset vectors (0xFFFA-0xFFFE). Note: If the BDM is active (i.e., the CPU is in the process of executing BDM firmware code), the contents of IVBR are ignored and the upper byte of the vector address is fixed as "0xFF". This is done to enable handling of all non-maskable interrupts in the BDM firmware. 4.18.4 Functional description The 9S12I128PIMV1 module processes all exception requests to be serviced by the CPU module. These exceptions include interrupt vector requests and reset vector requests. Each of these exception types and their overall priority level is discussed in the following subsections. 4.18.4.1 S12S exception requests The CPU handles both reset requests and interrupt requests. A priority decoder is used to evaluate the priority of pending interrupt requests. 4.18.4.2 Interrupt prioritization The 9S12I128PIMV1 module contains a priority decoder to determine the priority for all interrupt requests pending for the CPU. If more than one interrupt request is pending, the interrupt request with the higher vector address wins the prioritization. The following conditions must be met for an I bit maskable interrupt request to be processed. 1. The local interrupt enabled bit in the peripheral module must be set. 2. The I bit in the condition code register (CCR) of the CPU must be cleared. 3. There is no SWI, TRAP, or X bit maskable request pending. NOTE All non I bit maskable interrupt requests always have higher priority than the I bit maskable interrupt requests. If the X bit in the CCR is cleared, it is possible to interrupt an I bit maskable interrupt by an X bit maskable interrupt. It is possible to nest non maskable interrupt requests, e.g., by nesting SWI or TRAP calls. Since an interrupt vector is only supplied at the time when the CPU requests it, it is possible that a higher priority interrupt request could override the original interrupt request that caused the CPU to request the vector. In this case, the CPU will receive the highest priority vector and the system will process this interrupt request first, before the original interrupt request is processed. If the interrupt source is unknown (for example, in the case where an interrupt request becomes inactive after the interrupt has been recognized, but prior to the CPU vector request), the vector address supplied to the CPU will default to that of the spurious interrupt vector. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS NOTE Care must be taken to ensure that all interrupt requests remain active until the system begins execution of the applicable service routine; otherwise, the exception request may not get processed at all or the result may be a spurious interrupt request (vector at address (vector base + 0x0080)). 4.18.4.3 Reset exception requests The 9S12I128PIMV1 module supports three system reset exception request types (Refer to the Clock and Reset generator module for details): 1. Pin reset, power-on reset or illegal address reset, low voltage reset (if applicable) 2. Clock monitor reset request 3. COP watchdog reset request 4.18.4.4 Exception priority The priority (from highest to lowest) and address of all exception vectors issued by the 9S12I128PIMV1 module upon request by the CPU is shown in Table 311. Table 311. Exception vector map and priority Vector address(244) Source 0xFFFE Pin reset, power-on reset, illegal address reset, low voltage reset (if applicable) 0xFFFC Clock monitor reset 0xFFFA COP watchdog reset (Vector base + 0x00F8) Unimplemented opcode trap (Vector base + 0x00F6) Software interrupt instruction (SWI) or BDM vector request (Vector base + 0x00F4) X bit maskable interrupt request (XIRQ or D2D error interrupt)(245) (Vector base + 0x00F2) IRQ or D2D interrupt request(246) (Vector base + 0x00F0-0x0082) (Vector base + 0x0080) Device specific I bit maskable interrupt sources (priority determined by the low byte of the vector address, in descending order) Spurious interrupt Notes 244. 16-bit vector address based 245. D2D error interrupt on MCUs featuring a D2D initiator module, otherwise XIRQ pin interrupt 246. D2D interrupt on MCUs featuring a D2D initiator module, otherwise IRQ pin interrupt 4.18.5 4.18.5.1 Initialization/application information Initialization After a system reset, the software should: 1. Initialize the interrupt vector base register, if the interrupt vector table is not located at the default location (0xFF80-0xFFF9). 2. Enable I bit maskable interrupts by clearing the I bit in the CCR. 3. Enable the X bit maskable interrupt by clearing the X bit in the CCR. 4.18.5.2 Interrupt nesting The interrupt request scheme makes it possible to nest I bit maskable interrupt requests handled by the CPU. I bit maskable interrupt requests can be interrupted by an interrupt request with a higher priority. I bit maskable interrupt requests cannot be interrupted by other I bit maskable interrupt requests per default. In order to make an interrupt service routine (ISR) interruptible, the ISR must explicitly clear the I bit in the CCR (CLI). After clearing the I bit, other I bit maskable interrupt requests can interrupt the current ISR. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS An ISR of an interruptible I bit maskable interrupt request could basically look like this: 1. Service interrupt, e.g., clear interrupt flags, copy data, etc. 2. Clear I bit in the CCR by executing the instruction CLI (thus allowing other I bit maskable interrupt requests) 3. Process data 4. Return from interrupt by executing the instruction RTI 4.18.5.3 Wake-up from stop or wait mode 4.18.5.3.1 CPU wake-up from stop or wait mode Every I bit maskable interrupt request is capable of waking the MCU from Stop or Wait mode. To determine whether an I bit maskable interrupts is qualified to wake-up the CPU, the same conditions as in normal run mode are applied during Stop or Wait mode: If the I bit in the CCR is set, all I bit maskable interrupts are masked from waking up the MCU. Since there are no clocks running in Stop mode, only interrupts which can be asserted asynchronously can wake-up the MCU from Stop mode. NOTE The only asynchronously asserted, I bit maskable interrupt for the MM912_637 would be the "D2D External Interrupt". The X bit maskable interrupt request can wake-up the MCU from Stop or Wait mode at anytime, even if the X bit in CCR is set. If the X bit maskable interrupt request is used to wake-up the MCU with the X bit in the CCR set, the associated ISR is not called. The CPU then resumes program execution with the instruction following the WAI or STOP instruction. This features works the same rules as with any interrupt request, i.e. care must be taken that the X interrupt request used for wake-up remains active at least until the system begins execution of the instruction following the WAI or STOP instruction; otherwise, wake-up may not occur. NOTE The only X bit maskable interrupt for the MM912_637 would be the D2D Error Interrupt. As the D2D Initiator module is not active during STOP and WAIT mode, no X bit maskable interrupt source is existing for the MM912_637. 4.19 Memory map control (S12PMMCV1) 4.19.1 Introduction The S12PMMC module controls the access to all internal memories and peripherals for the CPU12 and S12SBDM module. It regulates access priorities and determines the address mapping of the on-chip resources. Figure 55 shows a block diagram of the S12PMMC module. 4.19.1.1 Glossary Table 312. Glossary of terms Term Definition Local Address Address within the CPU12's Local Address Map (Figure 60) Global Address Address within the Global Address Map (Figure 60) Aligned Bus Access Bus access to an even address. Misaligned Bus Access Bus access to an odd address. NS Normal Single-chip Mode SS Special Single-chip Mode Unimplemented Address Ranges Address ranges which are not mapped to any on-chip resource. P-Flash Program Flash D-Plash Data Flash MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 312. Glossary of terms (continued) Term Definition NVM Non-volatile Memory; P-Flash or D-Flash IFR NVM Information Row. Refer to FTMRC Block Guide 4.19.1.2 Overview The S12PMMC connects the CPU12's and the S12SBDM's bus interfaces to the MCU's on-chip resources (memories and peripherals). It arbitrates the bus accesses and determines all of the MCU's memory maps. Furthermore, the S12PMMC is responsible for constraining memory accesses on secured devices and for selecting the MCU's functional mode. 4.19.1.3 Features The main features of this block are: * Paging capability to support a global 256 kByte memory address space * Bus arbitration between the masters CPU12, S12SBDM to different resources * MCU operation mode control * MCU security control * Separate memory map schemes for each master CPU12, S12SBDM * Generation of system reset when CPU12 accesses an unimplemented address (i.e., an address which does not belong to any of the on-chip modules) in single-chip modes 4.19.1.4 Modes of operation The S12PMMC selects the MCU's functional mode. It also determines the devices behavior in secured and unsecured state. 4.19.1.4.1 Functional modes Two functional modes are implemented on devices of the S12I product family: * Normal Single Chip (NS) The mode used for running applications. * Special Single Chip Mode (SS) A debug mode which causes the device to enter BDM Active Mode after each reset. Peripherals may also provide special debug features in this mode 4.19.1.4.2 Security S12I devices can be secured to prohibit external access to the on-chip P-Flash. The S12PMMC module determines the access permissions to the on-chip memories in secured and unsecured state. 4.19.1.5 Block diagram Figure 55 shows a block diagram of the S12PMMC. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS CPU BDM MMC Address Decoder & Priority DBG Target Bus Controller D-Flash P-Flash Peripherals RAM Figure 55. S12PMMC block diagram 4.19.2 External signal description The S12PMMC uses two external pins to determine the devices operating mode: RESET and MODC (Table 313) See Device User Guide (DUG) for the mapping of these signals to device pins. Table 313. External system pins associated With S12PMMC Pin Name Pin Functions RESET (See DUG) RESET The RESET pin is used the select the MCU's operating mode. MODC (See DUG) MODC The MODC pin is captured at the rising edge of the RESET pin. The captured value determines the MCU's operating mode. 4.19.3 4.19.3.1 Description Memory map and registers Module memory map A summary of the registers associated with the S12PMMC block is shown in Table 314. Detailed descriptions of the registers and bits are given in the subsections that follow. Table 314. MMC register table Address 0x000A 0x000B Register name Reserved MODE R Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W MODC MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 314. MMC register table (continued) 0x0010 Reserved 0x0011 DIRECT 0x0012 Reserved 0x0013 Reserved 0x0014 Reserved 0x0015 PPAGE R 0 0 0 0 0 0 0 0 DP15 DP14 DP13 DP12 DP11 DP10 DP9 DP8 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PIX3 PIX2 PIX1 PIX0 W R W R W R W R W R W = Unimplemented or Reserved 4.19.3.2 Register descriptions This section consists of the S12PMMC control register descriptions in address order. 4.19.3.2.1 Mode register (MODE) Table 315. Mode register (MODE) Address: 0x000B 7 R W Reset MODC MODC(247) 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Notes 247. External signal (see Table 313). Read: Anytime. Write: Only if a transition is allowed (see Figure 56). The MODC bit of the MODE register is used to select the MCU's operating mode. Table 316. MODE field descriptions Field Description 7 MODC Mode Select Bit -- This bit controls the current operating mode during RESET high (inactive). The external mode MODC pin determines the operating mode during RESET low (active). The state of the pin is registered into the respective register bit after the RESET signal goes inactive (see Figure 56). Write restrictions exist to disallow transitions between certain modes. Figure 56 illustrates all allowed mode changes. Attempting non authorized transitions will not change the MODE bit, but it will block further writes to the register bit except in special modes. Write accesses to the MODE register are blocked when the device is secured. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS RESET 1 0 Normal Single-Chip (NS) 1 Special Single-Chip (SS) 1 0 Figure 56. Mode transition diagram when MCU is unsecured 4.19.3.2.2 Direct page register (DIRECT) Table 317. Direct register (DIRECT) Address: 0x0011 R W 7 6 5 4 3 2 1 0 DP15 DP14 DP13 DP12 DP11 DP10 DP9 DP8 0 0 0 0 0 0 0 0 Reset Read: Anytime. Write: anytime in special SS, write-one in NS. This register determines the position of the 256 Byte direct page within the memory map.It is valid for both global and local mapping scheme. Table 318. DIRECT field descriptions Field Description 7-0 DP[15:8] Direct Page Index Bits 15-8 -- These bits are used by the CPU when performing accesses using the direct addressing mode. These register bits form bits [15:8] of the local address (see Figure 57). Bit15 Bit8 Bit7 Bit0 DP [15:8] CPU Address [15:0] Figure 57. DIRECT address mapping Example 1. This example demonstrates usage of the Direct Addressing Mode MOVB #$80,DIRECT ;Set DIRECT register to 0x80. Write once only. ;Global data accesses to the range 0xXX_80XX can be direct. ;Logical data accesses to the range 0x80XX are direct. LDY <$00 ;Load the Y index register from 0x8000 (direct access). ;< operator forces direct access on some assemblers but in ;many cases assemblers are "direct page aware" and can ;automatically select direct mode. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.19.3.2.3 Program page index register (PPAGE) Table 319. Program page index register (PPAGE) Address: 0x0030 R 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 1 0 PIX3 PIX2 PIX1 PIX0 1 1 1 0 Read: Anytime. Write: Anytime. These four index bits are used to map 16 kB blocks into the Flash page window located in the local (CPU or BDM) memory map, from address 0x8000 to address 0xBFFF (see Figure 58). This supports accessing up to 256 kB of Flash (in the Global map) within the 64 kB Local map. The PPAGE index register is effectively used to construct paged Flash addresses in the Local map format. The CPU has special access to read and write this register directly during execution of CALL and RTC instructions. Global Address [17:0] Bit17 Bit0 Bit14 Bit13 PPAGE Register [3:0] Address [13:0] Address: CPU Local Address or BDM Local Address Figure 58. PPAGE address mapping NOTE Writes to this register using the special access of the CALL and RTC instructions will be complete before the end of the instruction execution. Table 320. PPAGE field descriptions Field 3-0 PIX[3:0] Description Program Page Index Bits 3-0 -- These page index bits are used to select which of the 256 P-Flash or ROM array pages is to be accessed in the Program Page Window. The fixed 16 kB page from 0x0000 to 0x3FFF is the page number 0x0C. Parts of this page are covered by Registers, D-Flash and RAM space. See the SoC Guide for details. The fixed 16 kB page from 0x4000-0x7FFF is the page number 0x0D. The reset value of 0x0E ensures that there is linear Flash space available between addresses 0x0000 and 0xFFFF out of reset. The fixed 16 kB page from 0xC000-0xFFFF is the page number 0x0F. 4.19.4 Functional description The S12PMMC block performs several basic functions of the S12I sub-system operation: MCU operation modes, priority control, address mapping, select signal generation, and access limitations for the system. Each aspect is described in the following subsections. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.19.4.1 * * MCU operating modes Normal single chip mode This is the operation mode for running application code. There is no external bus in this mode. Special single chip mode This mode is generally used for debugging operation, boot-strapping or security related operations. The active background debug mode is in control of the CPU code execution and the BDM firmware is waiting for serial commands sent through the BKGD pin. 4.19.4.2 4.19.4.2.1 Memory map scheme CPU and BDM memory map scheme The BDM firmware lookup tables and BDM register memory locations share addresses with other modules; however they are not visible in the memory map during user's code execution. The BDM memory resources are enabled only during the READ_BD and WRITE_BD access cycles to distinguish between accesses to the BDM memory area and accesses to the other modules. (Refer to the BDM Block Guide for further details). When the MCU enters active BDM mode, the BDM firmware look-up tables and the BDM registers become visible in the local memory map in the range 0xFF00-0xFFFF (global address 0x3_FF00 - 0x3_FFFF) and the CPU begins execution of firmware commands or the BDM begins execution of hardware commands. The resources which share memory space with the BDM module will not be visible in the memory map during active BDM mode. Note that after the MCU enters active BDM mode the BDM firmware look-up tables and the BDM registers will also be visible between addresses 0xBF00 and 0xBFFF if the PPAGE register contains value of 0x0F. 4.19.4.2.1.1 Expansion of the local address map 4.19.4.2.1.1.1 Expansion of the CPU local address map The program page index register in S12PMMC allows accessing up to 256 kB of P-Flash in the global memory map by using the four index bits (PPAGE[3:0]) to page 16x16 kB blocks into the program page window, located from address 0x8000 to address 0xBFFF in the local CPU memory map. The page value for the program page window is stored in the PPAGE register. The value of the PPAGE register can be read or written by normal memory accesses as well as by the CALL and RTC instructions (see Section 4.19.6.1, "CALL and RTC instructions"). Control registers, vector space and parts of the on-chip memories are located in unpaged portions of the 64 kB local CPU address space. The starting address of an interrupt service routine must be located in unpaged memory unless the user is certain that the PPAGE register will be set to the appropriate value when the service routine is called. However an interrupt service routine can call other routines that are in paged memory. The upper 16 kB block of the local CPU memory space (0xC000-0xFFFF) is unpaged. It is recommended that all reset and interrupt vectors point to locations in this area or to the other unmapped pages sections of the local CPU memory map. 4.19.4.2.1.1.2 Expansion of the BDM local address map PPAGE and BDMPPR register is also used for the expansion of the BDM local address to the global address. These registers can be read and written by the BDM. The BDM expansion scheme is the same as the CPU expansion scheme. The four BDMPPR Program Page index bits allow access to the full 256 kB address map that can be accessed with 18 address bits. The BDM program page index register (BDMPPR) is used only when the feature is enabled in BDM and, in the case the CPU is executing a firmware command which uses CPU instructions, or by a BDM hardware commands. See the BDM Block Guide for further details. (see Figure 59). MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS BDM HARDWARE COMMAND Global Address [17:0] Bit17 Bit0 Bit14 Bit13 BDMPPR Register [3:0] BDM Local Address [13:0] BDM FIRMWARE COMMAND Global Address [17:0] Bit17 Bit0 Bit14 Bit13 BDMPPR Register [3:0] CPU Local Address [13:0] Figure 59. BDMPPR address mapping MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS CPU and BDM Local Memory Map 0x0000 Global Memory Map 0x0400 REGISTERS 0x1400 RAM_LOW Unpaged P-Flash NVM Resources D-Flash 0x0_5400 NVM Resources (PPAGE 0x01) 0x4000 0x0_4400 RAMSIZE RAM 0x0_4000 RAM RAMSIZE Unimplemented Area D-Flash (PPAGE 0x00) 0x0_0000 REGISTERS 0x0_8000 P-Flash 10 *16K paged 0x8000 0x3_0000 P-Flash window 0 0 0 0 P3P2P1P0 Unpaged P-Flash PPAGE Unpaged P-Flash Unpaged P-Flash (PPAGE 0x0E) Unpaged P-Flash (PPAGE 0x0F) 0xC000 (PPAGE 0x0D) 0x3_4000 0x3_8000 Unpaged P-Flash 0x3_C000 0x3_FFFF (PPAGE 0x0C) Unpaged P-Flash or 0xFFFF (PPAGE 0x02-0x0B)) Unpaged P-Flash Figure 60. Local to global address mapping MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.19.5 Implemented memory in the system memory architecture Each memory can be implemented in its maximum allowed size. But some devices have been defined for smaller sizes, which means less implemented pages. All non implemented pages are called unimplemented areas. * Registers has a fixed size of 1.0 kB, accessible via xbus0 * SRAM has a maximum size of 11 kB, accessible via xbus0 * D-Flash has a fixed size of 4.0 kB accessible via xbus0 * P-Flash has a maximum size of 224 kB, accessible via xbus0 * NVM resources (IFR) including D-Flash have maximum size of 16 kB (PPAGE 0x01) 4.19.5.0.1 Implemented memory map The global memory spaces reserved for the internal resources (RAM, D-Flash, and P-Flash) are not determined by the MMC module. Size of the individual internal resources are however fixed in the design of the device cannot be changed by the user. Refer to the SoC Guide for further details. Figure 61 and Table 321 show the memory spaces occupied by the on-chip resources. Note that the memory spaces have fixed top addresses. Table 321. Global implemented memory space Internal resource Bottom address Top address Registers 0x0_0000 0x0_03FF System RAM RAM_LOW = 0x0_4000 minus RAMSIZE(248) 0x0_3FFF D-Flash 0x0_4400 0x0_53FF P-Flash PF_LOW = 0x4_0000 minus FLASHSIZE(249) 0x3_FFFF Notes 248. RAMSIZE is the hexadecimal value of RAM SIZE in bytes 249. FLASHSIZE is the hexadecimal value of FLASH SIZE in bytes In single-chip modes accesses by the CPU12 (except for firmware commands) to any of the unimplemented areas (see Figure 61) will result in an illegal access reset (system reset). BDM accesses to the unimplemented areas are allowed but the data will be undefined. No misaligned word access from the BDM module will occur; these accesses are blocked in the BDM module (Refer to BDM Block Guide). MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS CPU and BDM Local Memory Map 0x0000 Global Memory Map REGISTERS D-Flash REGISTERS 0x1400 RAM_LOW Unpaged P-Flash RAM RAM 0x4000 0x0_4400 NVM Resources D-Flash 0x0_5400 NVM Resources (PPAGE 0x01) RAMSIZE 0x0_4000 RAMSIZE Unimplemented Area (PPAGE 0x00) 0x0_0000 0x0400 0x0_8000 Unpaged P-Flash Unimplemented area 0x8000 0 0 0 0 P3P2P1P0 P-Flash window PPAGE PF_LOW 0xC000 0xFFFF PFSIZE P-Flash Unpaged P-Flash 0x3_FFFF Figure 61. Implemented global address mapping 4.19.5.1 Chip bus control The S12PMMC controls the address buses and the data buses that interface the bus masters (CPU12, S12SBDM) with the rest of the system (master buses). In addition, the MMC handles all CPU read data bus swapping operations. All internal resources are connected to specific target buses (see Figure 62). MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS DBG BDM CPU S12X1 S12X0 MMC "Crossbar Switch" XBUS0 P-Flash BDM D-Flash resources SRAM IPBI Peripherals Figure 62. S12I platform 4.19.5.1.1 Master bus prioritization regarding access conflicts on target buses The arbitration scheme allows only one master to be connected to a target at any given time. The following rules apply when prioritizing accesses from different masters to the same target bus: * CPU12 always has priority over BDM. * BDM has priority over CPU12 when its access is stalled for more than 128 cycles. In the later case the CPU will be stalled after finishing the current operation and the BDM will gain access to the bus. 4.19.5.2 Interrupts The MMC does not generate any interrupts. 4.19.6 4.19.6.1 Initialization/application information CALL and RTC instructions CALL and RTC instructions are uninterruptable CPU instructions that automate page switching in the program page window. The CALL instruction is similar to the JSR instruction, but the subroutine that is called can be located anywhere in the local address space or in any Flash or ROM page visible through the program page window. The CALL instruction calculates and stacks a return address, stacks the current PPAGE value and writes a new instruction-supplied value to the PPAGE register. The PPAGE value controls which of the 256 possible pages is visible through the 16 kbyte program page window in the 64 kbyte local CPU memory map. Execution then begins at the address of the called subroutine. During the execution of the CALL instruction, the CPU performs the following steps: 1. Writes the current PPAGE value into an internal temporary register and writes the new instruction supplied PPAGE value into the PPAGE register 2. Calculates the address of the next instruction after the CALL instruction (the return address) and pushes this 16-bit value onto the stack 3. Pushes the temporarily stored PPAGE value onto the stack 4. Calculates the effective address of the subroutine, refills the queue and begins execution at the new address This sequence is uninterruptable. There is no need to inhibit interrupts during the CALL instruction execution. A CALL instruction can be performed from any address to any other address in the local CPU memory space. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS The PPAGE value supplied by the instruction is part of the effective address of the CPU. For all addressing mode variations (except indexed-indirect modes), the new page value is provided by an immediate operand in the instruction. In indexed indirect variations of the CALL instruction, a pointer specifies memory locations where the new page value and the address of the called subroutine are stored. Using indirect addressing for both the new page value and the address within the page allows usage of values calculated at run time, rather than immediate values that must be known at the time of assembly. The RTC instruction terminates subroutines invoked by a CALL instruction. The RTC instruction unstacks the PPAGE value and the return address and refills the queue. Execution resumes with the next instruction after the CALL instruction. During the execution of an RTC instruction the CPU performs the following steps: 1. Pulls the previously stored PPAGE value from the stack 2. Pulls the 16-bit return address from the stack and loads it into the PC 3. Writes the PPAGE value into the PPAGE register 4. Refills the queue and resumes execution at the return address This sequence is uninterruptable. The RTC can be executed from anywhere in the local CPU memory space. The CALL and RTC instructions behave like JSR and RTS instruction. However they require more execution cycles. Usage of JSR/RTS instructions is therefore recommended when possible, and CALL/RTC instructions should only be used when needed. The JSR and RTS instructions can be used to access subroutines that are already present in the local CPU memory map (i.e. in the same page in the program memory page window for example). However calling a function located in a different page requires usage of the CALL instruction. The function must be terminated by the RTC instruction. Because the RTC instruction restores contents of the PPAGE register from the stack. Functions terminated with the RTC instruction must be called using the CALL instruction, even when the correct page is already present in the memory map. This is to make sure that the correct PPAGE value will be present on the stack at the time of the RTC instruction execution. 4.20 MCU - debug module (9S12I128PIMV1) 4.20.1 Introduction The 9S12I128PIMV1 module provides an on-chip trace buffer with flexible triggering capability, to allow non-intrusive debug of application software. The 9S12I128PIMV1 module is optimized for S12SCPUdebugging. Typically, the 9S12I128PIMV1 module is used in conjunction with the S12SBDM module, whereby the user configures the 9S12I128PIMV1 module for a debugging session over the BDM interface. Once configured the 9S12I128PIMV1 module is armed, the device leaves BDM returning control to the user program, which is then monitored by the 9S12I128PIMV1 module. Alternatively the 9S12I128PIMV1 module can be configured over a serial interface using SWI routines. 4.20.1.1 Glossary Of terms COF: Change Of Flow. Change in the program flow due to a conditional branch, indexed jump or interrupt. BDM: Background Debug Mode S12SBDM: Background Debug Module DUG: Device User Guide, describing the features of the device into which the DBG is integrated. WORD: 16-bit data entity Data Line: 20-bit data entity CPU: S12SCPU module DBG: S12SDBG module POR: Power On Reset Tag: Tags can be attached to CPU opcodes as they enter the instruction pipe. If the tagged opcode reaches the execution stage a tag hit occurs. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.20.1.2 Overview The comparators monitor the bus activity of the CPU module. A match can initiate a state sequencer transition. On a transition to the Final state, bus tracing is triggered and/or a breakpoint can be generated. Independent of comparator matches a transition to Final state with associated tracing and breakpoint can be triggered immediately by writing to the TRIG control bit. The trace buffer is visible through a 2-byte window in the register address map and can be read out using standard 16-bit word reads. Tracing is disabled when the MCU system is secured. 4.20.1.3 * Features Three comparators (A, B and C) -- Comparators A compares the full address bus and full 16-bit data bus -- Comparator A features a data bus mask register -- Comparators B and C compare the full address bus only -- Each comparator features selection of read or write access cycles -- Comparator B allows selection of byte or word access cycles -- Comparator matches can initiate state sequencer transitions Three comparator modes -- Simple address/data comparator match mode -- Inside address range mode, Addmin Address Addmax -- Outside address range match mode, Address < Addmin or Address > Addmax Two types of matches -- Tagged -- This matches just before a specific instruction begins execution -- Force -- This is valid on the first instruction boundary after a match occurs Two types of breakpoints -- CPU breakpoint entering BDM on breakpoint (BDM) -- CPU breakpoint executing SWI on breakpoint (SWI) Trigger mode independent of comparators -- TRIG Immediate software trigger Four trace modes -- Normal: change of flow (COF) PC information is stored (see Section 4.20.4.5.2.1, "Normal mode") for change of flow definition. -- Loop1: same as Normal but inhibits consecutive duplicate source address entries -- Detail: address and data for all cycles except free cycles and opcode fetches are stored -- Compressed Pure PC: all program counter addresses are stored 4-stage state sequencer for trace buffer control -- Tracing session trigger linked to Final State of state sequencer -- Begin and End alignment of tracing to trigger * * * * * * 4.20.1.4 Modes of operation The DBG module can be used in all MCU functional modes. During BDM hardware accesses and while the BDM module is active, CPU monitoring is disabled. When the CPU enters active BDM Mode through a BACKGROUND command, the DBG module, if already armed, remains armed. The DBG module tracing is disabled if the MCU is secure, however, breakpoints can still be generated. Table 322. Mode dependent restriction summary BDM enable BDM active MCU secure Comparator matches enabled Breakpoints possible Tagging possible Tracing possible x x 1 Yes Yes Yes No 0 0 0 Yes Only SWI Yes Yes 0 1 0 1 0 0 Yes Yes Yes Yes 1 1 0 No No No No Active BDM not possible when not enabled MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.20.1.5 Block diagram TAGS TAGHITS BREAKPOINT REQUESTS TO CPU COMPARATOR A BUS INTERFACE CPU BUS COMPARATOR B COMPARATOR C COMPARATOR MATCH CONTROL SECURE MATCH0 TAG & MATCH CONTROL LOGIC MATCH1 TRANSITION STATE STATE SEQUENCER STATE MATCH2 TRACE CONTROL TRIGGER TRACE BUFFER READ TRACE DATA (DBG READ DATA BUS) Figure 63. Debug module block diagram 4.20.2 External signal description There are no external signals associated with this module. 4.20.3 4.20.3.1 Memory map and registers Module memory map A summary of the registers associated with the DBG sub-block is shown in Table 323. Detailed descriptions of the registers and bits are given in the subsections that follow. Table 323. Quick reference to DBG registers Address Name 0x0020 DBGC1 0x0021 DBGSR 0x0022 DBGTCR 0x0023 DBGC2 0x0024 DBGTBH Bit 7 R W R ARM (250)TBF 6 5 4 3 0 0 BDM DBGBRK 0 0 0 0 0 TRIG 0 2 1 0 SSF2 Bit 0 COMRV SSF1 SSF0 W R 0 W R TSOURCE 0 TRCMOD 0 0 0 0 0 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 ABCM W R TALIGN Bit 9 Bit 8 W MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 323. Quick reference to DBG registers (continued) Address Name 0x0025 DBGTBL 0x0026 DBGCNT 0x0027 DBGSCRX 0x0027 DBGMFR 0x0028(251) DBGACTL 0x0028(252) DBGBCTL 0x0028(253) DBGCCTL 0x0029 DBGXAH 0x002A DBGXAM 0x002B DBGXAL 0x002C DBGADH 0x002D DBGADL 0x002E DBGADHM 0x002F DBGADLM R Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 TBF 0 0 0 0 0 SC3 SC2 SC1 SC0 0 0 0 0 0 MC2 MC1 MC0 SZE SZ TAG BRK RW RWE NDB COMPE SZE SZ TAG BRK RW RWE 0 0 TAG BRK RW RWE 0 0 0 0 0 0 Bit 15 14 13 12 11 Bit 7 6 5 4 Bit 15 14 13 Bit 7 6 Bit 15 Bit 7 W R CNT W R W R W R W R W R W R W R W R W R W R W R W 0 COMPE COMPE Bit 17 Bit 16 10 9 Bit 8 3 2 1 Bit 0 12 11 10 9 Bit 8 5 4 3 2 1 Bit 0 14 13 12 11 10 9 Bit 8 6 5 4 3 2 1 Bit 0 W R 0 Notes 250. This bit is visible at DBGCNT[7] and DBGSR[7] 251. This represents the contents if the Comparator A control register is blended into this address 252. This represents the contents if the Comparator B control register is blended into this address 253. This represents the contents if the Comparator C control register is blended into this address 4.20.3.2 Register descriptions This section consists of the DBG control and trace buffer register descriptions in address order. Each comparator has a bank of registers that are visible through an 8-byte window between 0x0028 and 0x002F in the DBG module register address map. When ARM is set in DBGC1, the only bits in the DBG module registers that can be written are ARM, TRIG, and COMRV[1:0] MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.20.3.2.1 Debug control register 1 (DBGC1) Table 324. Debug control register (DBGC1) Address: 0x0020 7 R W Reset ARM 0 6 5 0 0 TRIG 0 4 3 BDM DBGBRK 0 0 0 2 1 0 0 0 COMRV 0 0 = Unimplemented or Reserved Read: Anytime Write: Bits 7, 1, 0 anytime Bit 6 can be written anytime but always reads back as 0. Bits 4:3 anytime DBG is not armed. NOTE When disarming the DBG by clearing ARM with software, the contents of bits[4:3] are not affected by the write, since up until the write operation, ARM = 1 preventing these bits from being written. These bits must be cleared using a second write if required. Table 325. DBGC1 field descriptions Field Description 7 ARM Arm Bit -- The ARM bit controls whether the DBG module is armed. This bit can be set and cleared by user software and is automatically cleared on completion of a debug session, or if a breakpoint is generated with tracing not enabled. On setting this bit the state sequencer enters State1. 0 Debugger disarmed 1 Debugger armed 6 TRIG Immediate Trigger Request Bit -- This bit when written to 1 requests an immediate trigger independent of state sequencer status. When tracing is complete a forced breakpoint may be generated depending upon DBGBRK and BDM bit settings. This bit always reads back a 0. Writing a 0 to this bit has no effect. If the DBGTCR_TSOURCE bit is clear no tracing is carried out. If tracing has already commenced using BEGIN trigger alignment, it continues until the end of the tracing session as defined by the TALIGN bit, thus TRIG has no affect. In secure mode, tracing is disabled and writing to this bit cannot initiate a tracing session. The session is ended by setting TRIG and ARM simultaneously. 0 Do not trigger until the state sequencer enters the Final state. 1 Trigger immediately 4 BDM Background Debug Mode Enable -- This bit determines if a breakpoint causes the system to enter Background Debug mode (BDM) or initiate a Software Interrupt (SWI). If this bit is set but the BDM is not enabled by the ENBDM bit in the BDM module, then breakpoints default to SWI. 0 Breakpoint to Software Interrupt if BDM inactive. Otherwise no breakpoint. 1 Breakpoint to BDM, if BDM enabled. Otherwise breakpoint to SWI 3 DBGBRK 9S12I128PIMV1 Breakpoint Enable Bit -- The DBGBRK bit controls whether the debugger will request a breakpoint on reaching the state sequencer Final State. If tracing is enabled, the breakpoint is generated on completion of the tracing session. If tracing is not enabled, the breakpoint is generated immediately. 0 No Breakpoint generated 1 Breakpoint generated 1-0 COMRV Comparator Register Visibility Bits -- These bits determine which bank of comparator register is visible in the 8-byte window of the S12SDBG module address map, located between 0x0028 to 0x002F. Furthermore these bits determine which register is visible at the address 0x0027. See Table 326. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 326. COMRV encoding COMRV Visible comparator Visible register at 0x0027 00 Comparator A DBGSCR1 01 Comparator B DBGSCR2 10 Comparator C DBGSCR3 11 None DBGMFR 4.20.3.2.2 Debug status register (DBGSR) Table 327. Debug status register (DBGSR) Address: 0x0021 R 7 6 5 4 3 2 1 0 TBF 0 0 0 0 SSF2 SSF1 SSF0 -- 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset POR = Unimplemented or Reserved Read: Anytime Write: Never Table 328. DBGSR field descriptions Field Description 7 TBF Trace Buffer Full -- The TBF bit indicates that the trace buffer has stored 64 or more lines of data since it was last armed. If this bit is set, then all 64 lines will be valid data, regardless of the value of DBGCNT bits. The TBF bit is cleared when ARM in DBGC1 is written to a one. The TBF is cleared by the power on reset initialization. Other system generated resets have no affect on this bit This bit is also visible at DBGCNT[7] 2-0 SSF[2:0] State Sequencer Flag Bits -- The SSF bits indicate in which state the State Sequencer is currently in. During a debug session on each transition to a new state these bits are updated. If the debug session is ended by software clearing the ARM bit, then these bits retain their value to reflect the last state of the state sequencer before disarming. If a debug session is ended by an internal event, then the state sequencer returns to state0 and these bits are cleared to indicate that state0 was entered during the session. On arming the module the state sequencer enters state1 and these bits are forced to SSF[2:0] = 001. See Table 329. Table 329. SSF[2:0] -- State sequence flag bit encoding SSF[2:0] Current state 000 State0 (disarmed) 001 State1 010 State2 011 State3 100 Final State 101,110,111 Reserved MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.20.3.2.3 Debug trace control register (DBGTCR) Table 330. Debug trace control register (DBGTCR) Address: 0x0022 7 R 0 W Reset 0 6 TSOURCE 0 5 4 0 0 0 0 3 2 0 0 TRCMOD 0 1 0 TALIGN 0 0 Read: Anytime Write: Bit 6 only when DBG is neither secure nor armed.Bits 3,2,0 anytime the module is disarmed. Table 331. DBGTCR field descriptions Field Description 6 TSOURCE Trace Source Control Bit -- The TSOURCE bit enables a tracing session given a trigger condition. If the MCU system is secured, this bit cannot be set and tracing is inhibited. This bit must be set to read the trace buffer. 0 Debug session without tracing requested 1 Debug session with tracing requested 3-2 TRCMOD Trace Mode Bits -- See Section 4.20.4.5.2, "Trace modes" for detailed Trace mode descriptions. In Normal mode, change of flow information is stored. In Loop1 mode, change of flow information is stored but redundant entries into trace memory are inhibited. In Detail mode, address and data for all memory and register accesses is stored. In Compressed Pure PC mode the program counter value for each instruction executed is stored. See Table 332. 0 TALIGN Trigger Align Bit -- This bit controls whether the trigger is aligned to the beginning or end of a tracing session. 0 Trigger at end of stored data 1 Trigger before storing data Table 332. TRCMOD trace mode bit encoding TRCMOD Description 00 Normal 01 Loop1 10 Detail 11 Compressed Pure PC 4.20.3.2.4 Debug control register2 (DBGC2) Table 333. Debug control register2 (DBGC2) Address: 0x0023 R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 1 ABCM W Reset 0 0 0 = Unimplemented or Reserved Read: Anytime Write: Anytime the module is disarmed This register configures the comparators for range matching. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 334. DBGC2 field descriptions Field Description 1-0 ABCM[1:0] A and B Comparator Match Control -- These bits determine the A and B comparator match mapping as described in Table 335. Table 335. ABCM encoding ABCM Description 00 Match0 mapped to comparator A match: Match1 mapped to comparator B match. 01 Match 0 mapped to comparator A/B inside range: Match1 disabled. 10 Match 0 mapped to comparator A/B outside range: Match1 disabled. 11 Reserved(254) Notes 254. Currently defaults to Comparator A, Comparator B disabled 4.20.3.2.5 Debug trace buffer register (DBGTBH:DBGTBL) Table 336. Debug trace buffer register (DBGTB) Address: 0x0024, 0x0025 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 POR X X X X X X X X X X X X X X X X Other Resets -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- R W Read: Only when unlocked AND unsecured AND not armed AND TSOURCE set Write: Aligned word writes when disarmed unlock the trace buffer for reading but do not affect trace buffer contents Table 337. DBGTB field descriptions Field Description 15-0 Bit[15:0] Trace Buffer Data Bits -- The Trace Buffer Register is a window through which the 20-bit wide data lines of the Trace Buffer may be read 16 bits at a time. Each valid read of DBGTB increments an internal trace buffer pointer which points to the next address to be read. When the ARM bit is set the trace buffer is locked to prevent reading. The trace buffer can only be unlocked for reading by writing to DBGTB with an aligned word write when the module is disarmed. The DBGTB register can be read only as an aligned word, any byte reads or misaligned access of these registers return a 0, and do not cause the trace buffer pointer to increment to the next trace buffer address. Similarly reads while the debugger is armed or with the TSOURCE bit clear, return a 0, and do not affect the trace buffer pointer. The POR state is undefined. Other resets do not affect the trace buffer contents. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.20.3.2.6 Debug count register (DBGCNT) Table 338. Debug count register (DBGCNT) Address: 0x0026 R 7 6 TBF 0 -- 0 -- 0 5 4 3 2 1 0 -- 0 -- 0 -- 0 CNT W Reset POR -- 0 -- 0 -- 0 = Unimplemented or Reserved Read: Anytime Write: Never Table 339. DBGCNT field descriptions Field Description 7 TBF Trace Buffer Full -- The TBF bit indicates that the trace buffer has stored 64 or more lines of data since it was last armed. If this bit is set, then all 64 lines will be valid data, regardless of the value of DBGCNT bits. The TBF bit is cleared when ARM in DBGC1 is written to a one. The TBF is cleared by the power on reset initialization. Other system generated resets have no affect on this bit This bit is also visible at DBGSR[7] 5-0 CNT[5:0] Count Value -- The CNT bits indicate the number of valid data 20-bit data lines stored in the Trace Buffer. Table 340 shows the correlation between the CNT bits and the number of valid data lines in the Trace Buffer. When the CNT rolls over to zero, the TBF bit in DBGSR is set and incrementing of CNT will continue in end-trigger mode. The DBGCNT register is cleared when ARM in DBGC1 is written to a one. The DBGCNT register is cleared by power-on-reset initialization but is not cleared by other system resets. Thus should a reset occur during a debug session, the DBGCNT register still indicates after the reset, the number of valid trace buffer entries stored before the reset occurred. The DBGCNT register is not decremented when reading from the trace buffer. Table 340. CNT decoding table TBF CNT[5:0] Description 0 000000 No data valid 0 000001 000010 000100 000110 ... 111111 1 line valid 2 lines valid 4 lines valid 6 lines valid ... 63 lines valid 1 000000 64 lines valid; if using Begin trigger alignment, ARM bit will be cleared and the tracing session ends. 1 000001 ... ... 111110 64 lines valid, oldest data has been overwritten by most recent data 4.20.3.2.7 Debug state control registers There is a dedicated control register for each of the state sequencer states 1 to 3, that determines if transitions from that state are allowed, depending upon comparator matches or tag hits, and define the next state for the state sequencer following a match. The three debug state control registers are located at the same address in the register address map (0x0027). Each register can be accessed using the COMRV bits in DBGC1 to blend in the required register. The COMRV = 11 value blends in the match flag register (DBGMFR). MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 341. State control register access encoding COMRV Visible state control register 00 DBGSCR1 01 DBGSCR2 10 DBGSCR3 11 DBGMFR 4.20.3.2.7.1 Debug state control register 1 (DBGSCR1) Table 342. Debug state control register 1 (DBGSCR1) Address: 0x0027 R 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 1 0 SC3 SC2 SC1 SC0 0 0 0 0 = Unimplemented or Reserved Read: If COMRV[1:0] = 00 Write: If COMRV[1:0] = 00 and DBG is not armed This register is visible at 0x0027 only with COMRV[1:0] = 00. The state control register 1 selects the targeted next state while in State1. The matches refer to the match channels of the comparator match control logic, as depicted in Figure 63 and described in Section 4.20.3.2.8.1, "Debug comparator control register (DBGXCTL)". Comparators must be enabled by setting the comparator enable bit in the associated DBGXCTL control register. Table 343. DBGSCR1 field descriptions Field 3-0 SC[3:0] Description These bits select the targeted next state while in State1, based upon the match event. Table 344. State1 sequencer next state selection SC[3:0] Description (unspecified matches have no effect) 0000 Any match to Final State 0001 Match1 to State3 0010 Match2 to State2 0011 Match1 to State2 0100 Match0 to State2....... Match1 to State3 0101 Match1 to State3.........Match0 to Final State 0110 Match0 to State2....... Match2 to State3 0111 Either Match0 or Match1 to State2 1000 Reserved 1001 Match0 to State3 1010 Reserved 1011 Reserved 1100 Reserved MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 344. State1 sequencer next state selection (continued) SC[3:0] Description (unspecified matches have no effect) 1101 Either Match0 or Match2 to Final State........Match1 to State2 1110 Reserved 1111 Reserved The priorities described in Table 377 dictate that in the case of simultaneous matches, a match leading to final state has priority followed by the match on the lower channel number (0,1,2). Thus with SC[3:0]=1101, a simultaneous match0/match1 transitions to Final state. 4.20.3.2.7.2 Debug state control register 2 (DBGSCR2) Table 345. Debug state control register 2 (DBGSCR2) Address: 0x0027 R 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 1 0 SC3 SC2 SC1 SC0 0 0 0 0 = Unimplemented or Reserved Read: If COMRV[1:0] = 01 Write: If COMRV[1:0] = 01 and DBG is not armed This register is visible at 0x0027 only with COMRV[1:0] = 01. The state control register 2 selects the targeted next state while in State 2. The matches refer to the match channels of the comparator match control logic, as depicted in Figure 63 and described in Section 4.20.3.2.8.1, "Debug comparator control register (DBGXCTL)". Comparators must be enabled by setting the comparator enable bit in the associated DBGXCTL control register. Table 346. DBGSCR2 field descriptions Field 3-0 SC[3:0] Description These bits select the targeted next state while in State 2, based upon the match event. Table 347. State2 --sequencer next state selection SC[3:0] Description (unspecified matches have no effect) 0000 Match0 to State1....... Match2 to State3. 0001 Match1 to State3 0010 Match2 to State3 0011 Match1 to State3....... Match0 Final State 0100 Match1 to State1....... Match2 to State3. 0101 Match2 to Final State 0110 Match2 to State1..... Match0 to Final State 0111 Either Match0 or Match1 to Final State 1000 Reserved 1001 Reserved 1010 Reserved 1011 Reserved MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 347. State2 --sequencer next state selection (continued) SC[3:0] Description (unspecified matches have no effect) 1100 Either Match0 or Match1 to Final State........Match2 to State3 1101 Reserved 1110 Reserved 1111 Either Match0 or Match1 to Final State........Match2 to State1 The priorities described in Table 377 dictate that in the case of simultaneous matches, a match leading to final state has priority followed by the match on the lower channel number (0,1,2). 4.20.3.2.7.3 Debug state control register 3 (DBGSCR3) Table 348. Debug state control register 3 (DBGSCR3) Address: 0x0027 R 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 1 0 SC3 SC2 SC1 SC0 0 0 0 0 = Unimplemented or Reserved Read: If COMRV[1:0] = 10 Write: If COMRV[1:0] = 10 and DBG is not armed This register is visible at 0x0027 only with COMRV[1:0] = 10. The state control register three selects the targeted next state while in State 3. The matches refer to the match channels of the comparator match control logic, as depicted in Figure 63 and described in Section 4.20.3.2.8.1, "Debug comparator control register (DBGXCTL)". Comparators must be enabled by setting the comparator enable bit in the associated DBGXCTL control register. Table 349. DBGSCR3 field descriptions Field 3-0 SC[3:0] Description These bits select the targeted next state while in State 3, based upon the match event. Table 350. State3 -- sequencer next state selection SC[3:0] Description (Unspecified matches have no effect) 0000 Match0 to State1 0001 Match2 to State2........ Match1 to Final State 0010 Match0 to Final State....... Match1 to State1 0011 Match1 to Final State....... Match2 to State1 0100 Match1 to State2 0101 Match1 to Final State 0110 Match2 to State2........ Match0 to Final State 0111 Match0 to Final State 1000 Reserved 1001 Reserved 1010 Either Match1 or Match2 to State1....... Match0 to Final State MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 350. State3 -- sequencer next state selection (continued) SC[3:0] Description (Unspecified matches have no effect) 1011 Reserved 1100 Reserved 1101 Either Match1 or Match2 to Final State....... Match0 to State1 1110 Match0 to State2....... Match2 to Final State 1111 Reserved The priorities described in Table 377 dictate that in the case of simultaneous matches, a match leading to final state has priority, followed by the match on the lower channel number (0,1,2). 4.20.3.2.7.4 Debug match flag register (DBGMFR) Table 351. Debug match flag register (DBGMFR) Address: 0x0027 R 7 6 5 4 3 2 1 0 0 0 0 0 0 MC2 MC1 MC0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Read: If COMRV[1:0] = 11 Write: Never DBGMFR is visible at 0x0027 only with COMRV[1:0] = 11. It features 3 flag bits, each mapped directly to a channel. Should a match occur on the channel during the debug session, then the corresponding flag is set and remains set until the next time the module is armed, by writing to the ARM bit. Thus the contents are retained after a debug session for evaluation purposes. These flags cannot be cleared by software. They are cleared only when arming the module. A set flag does not inhibit the setting of other flags. Once a flag is set, further comparator matches on the same channel in the same session have no affect on that flag. 4.20.3.2.8 Comparator register descriptions Each comparator has a bank of registers that are visible through an 8-byte window in the DBG module register address map. Comparator A consists of 8 register bytes (3 address bus compare registers, two data bus compare registers, two data bus mask registers, and a control register). Comparator B consists of four register bytes (three address bus compare registers and a control register). Comparator C consists of four register bytes (three address bus compare registers and a control register). Each set of comparator registers can be accessed using the COMRV bits in the DBGC1 register. Unimplemented registers (e.g. Comparator B data bus and data bus masking) read as zero and cannot be written. The control register for comparator B differs from those of comparators A and C. Table 352. Comparator register layout 0x0028 CONTROL Read/Write Comparators A,B and C 0x0029 ADDRESS HIGH Read/Write Comparators A,B and C 0x002A ADDRESS MEDIUM Read/Write Comparators A,B and C 0x002B ADDRESS LOW Read/Write Comparators A,B and C 0x002C DATA HIGH COMPARATOR Read/Write Comparator A only 0x002D DATA LOW COMPARATOR Read/Write Comparator A only 0x002E DATA HIGH MASK Read/Write Comparator A only 0x002F DATA LOW MASK Read/Write Comparator A only MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.20.3.2.8.1 Debug comparator control register (DBGXCTL) The contents of register bits 7 and 6 differ, depending upon which comparator registers are visible in the 8-byte window of the DBG module register address map. Table 353. Debug comparator control register DBGACTL (comparator A) Address: 0x0028 R W Reset 7 6 5 4 3 2 1 0 SZE SZ TAG BRK RW RWE NDB COMPE 0 0 0 0 0 0 0 0 1 0 = Unimplemented or Reserved Table 354. Debug comparator control register DBGBCTL (comparator B) Address: 0x0028 R W Reset 7 6 5 4 3 2 SZE SZ TAG BRK RW RWE 0 0 0 0 0 0 0 0 1 0 0 COMPE = Unimplemented or Reserved Table 355. Debug comparator control register DBGCCTL (comparator C) Address: 0x0028 R 7 6 0 0 0 0 W Reset 5 4 3 2 TAG BRK RW RWE 0 0 0 0 0 0 COMPE 0 = Unimplemented or Reserved Read: DBGACTL if COMRV[1:0] = 00 DBGBCTL if COMRV[1:0] = 01 DBGCCTL if COMRV[1:0] = 10 Write: DBGACTL if COMRV[1:0] = 00 and DBG not armed DBGBCTL if COMRV[1:0] = 01 and DBG not armed DBGCCTL if COMRV[1:0] = 10 and DBG not armed Table 356. DBGXCTL field descriptions Field Description 7 SZE (Comparators A and B) Size Comparator Enable Bit -- The SZE bit controls whether access size comparison is enabled for the associated comparator. This bit is ignored if the TAG bit in the same register is set. 0 Word/Byte access size is not used in comparison 1 Word/Byte access size is used in comparison 6 SZ (Comparators A and B) Size Comparator Value Bit -- The SZ bit selects either word or byte access size in comparison for the associated comparator. This bit is ignored if the SZE bit is cleared or if the TAG bit in the same register is set. 0 Word access size is compared 1 Byte access size is compared MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 356. DBGXCTL field descriptions (continued) Field Description 5 TAG Tag Select-- This bit controls whether the comparator match has immediate effect, causing an immediate state sequencer transition or tag the opcode at the matched address. Tagged opcodes trigger only if they reach the execution stage of the instruction queue. 0 Allow state sequencer transition immediately on match 1 On match, tag the opcode. If the opcode is about to be executed allow a state sequencer transition 4 BRK Break-- This bit controls whether a comparator match terminates a debug session immediately, independent of state sequencer state. To generate an immediate breakpoint the module breakpoints must be enabled using the DBGC1 bit DBGBRK. 0 The debug session termination is dependent upon the state sequencer and trigger conditions. 1 A match on this channel terminates the debug session immediately; breakpoints if active are generated, tracing, if active, is terminated and the module disarmed. 3 RW Read/Write Comparator Value Bit -- The RW bit controls whether read or write is used in compare for the associated comparator. The RW bit is not used if RWE = 0. This bit is ignored if the TAG bit in the same register is set. 0 Write cycle is matched1Read cycle is matched 2 RWE Read/Write Enable Bit -- The RWE bit controls whether read or write comparison is enabled for the associated comparator.This bit is ignored if the TAG bit in the same register is set 0 Read/Write is not used in comparison 1 Read/Write is used in comparison 1 NDB (Comparator A) 0 COMPE Not Data Bus -- The NDB bit controls whether the match occurs when the data bus matches the comparator register value or when the data bus differs from the register value. This bit is ignored if the TAG bit in the same register is set. This bit is only available for comparator A. 0 Match on data bus equivalence to comparator register contents 1 Match on data bus difference to comparator register contents Determines if comparator is enabled 0 The comparator is not enabled 1 The comparator is enabled Table 357 shows the effect for RWE and RW on the comparison conditions. These bits are ignored if the corresponding TAG bit is set, since the match occurs based on the tagged opcode reaching the execution stage of the instruction queue. Table 357. Read or write comparison logic table RWE bit RW bit RW signal Comment 0 x 0 RW not used in comparison 0 x 1 RW not used in comparison 1 0 0 Write data bus 1 0 1 No match 1 1 0 No match 1 1 1 Read data bus 4.20.3.2.8.2 Debug comparator address high register (DBGXAH) Table 358. Debug comparator address high register (DBGXAH) Address: 0x0029 R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 Bit 17 Bit 16 0 0 = Unimplemented or Reserved The DBGC1_COMRV bits determine which comparator address registers are visible in the 8-byte window from 0x0028 to 0x002F, as shown in Table 359 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 359. Comparator address register visibility COMRV Visible comparator 00 DBGAAH, DBGAAM, DBGAAL 01 DBGBAH, DBGBAM, DBGBAL 10 DBGCAH, DBGCAM, DBGCAL 11 None Notes 255. Read: Anytime. See Table for visible register encoding. Write: If DBG not armed. See Table for visible register encoding. Table 360. DBGXAH field descriptions Field 1-0 Bit[17:16] Description Comparator Address High Compare Bits -- The Comparator address high compare bits control whether the selected comparator compares the address bus bits [17:16] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one 4.20.3.2.8.3 Debug comparator address mid register (DBGXAM) Table 361. Debug comparator address mid register (DBGXAM) Address: 0x002A R W Reset 7 6 5 4 3 2 1 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0 0 0 0 0 0 0 0 Read: Anytime. See Table 359 for visible register encoding. Write: If DBG not armed. See Table 359 for visible register encoding. Table 362. DBGXAM field descriptions Field 7-0 Bit[15:8] Description Comparator Address Mid Compare Bits -- The Comparator address mid compare bits control whether the selected comparator compares the address bus bits [15:8] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one 4.20.3.2.8.4 Debug comparator address low register (DBGXAL) Table 363. Debug comparator address low register (DBGXAL) Address: 0x002B R W Reset 7 6 5 4 3 2 1 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 Read: Anytime. See Table for visible register encoding Write: If DBG not armed. See Table for visible register encoding MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 364. DBGXAL field descriptions Field 7-0 Bits[7:0] Description Comparator Address Low Compare Bits -- The Comparator address low compare bits control whether the selected comparator compares the address bus bits [7:0] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one 4.20.3.2.8.5 Debug comparator data high register (DBGADH) Table 365. Debug comparator data high register (DBGADH) Address: 0x002C R W 7 6 5 4 3 2 1 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0 0 0 0 0 0 0 0 Reset Read: If COMRV[1:0] = 00 Write: If COMRV[1:0] = 00 and DBG not armed Table 366. DBGADH field descriptions Field Description 7-0 Bits[15:8] Comparator Data High Compare Bits-- The Comparator data high compare bits control whether the selected comparator compares the data bus bits [15:8] to a logic one or logic zero. The comparator data compare bits are only used in comparison if the corresponding data mask bit is logic 1. This register is available only for comparator A. Data bus comparisons are only performed if the TAG bit in DBGACTL is clear. 0 Compare corresponding data bit to a logic zero 1 Compare corresponding data bit to a logic one 4.20.3.2.8.6 Debug comparator data low register (DBGADL) Table 367. Debug comparator data low register (DBGADL) Address: 0x002D R W Reset 7 6 5 4 3 2 1 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 Read: If COMRV[1:0] = 00 Write: If COMRV[1:0] = 00 and DBG not armed Table 368. DBGADL field descriptions Field Description 7-0 Bits[7:0] Comparator Data Low Compare Bits -- The Comparator data low compare bits control, whether the selected comparator compares the data bus bits [7:0] to a logic one or a logic zero. The comparator data compare bits are only used in comparison if the corresponding data mask bit is a logic 1. This register is available only for comparator A. Data bus comparisons are only performed if the TAG bit in DBGACTL is clear 0 Compare corresponding data bit to a logic zero 1 Compare corresponding data bit to a logic one MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.20.3.2.8.7 Debug comparator data high mask register (DBGADHM) Table 369. Debug comparator data high mask register (DBGADHM) Address: 0x002E R W Reset 7 6 5 4 3 2 1 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0 0 0 0 0 0 0 0 Read: If COMRV[1:0] = 00 Write: If COMRV[1:0] = 00 and DBG not armed Table 370. DBGADHM field descriptions Field Description 7-0 Bits[15:8] Comparator Data High Mask Bits -- The Comparator data high mask bits control whether the selected comparator compares the data bus bits [15:8] to the corresponding comparator data compare bits. Data bus comparisons are only performed if the TAG bit in DBGACTL is clear 0 Do not compare corresponding data bit Any value of corresponding data bit allows match. 1 Compare corresponding data bit 4.20.3.2.8.8 Debug comparator data low mask register (DBGADLM) Table 371. Debug comparator data low mask register (DBGADLM) Address: 0x002F R W Reset 7 6 5 4 3 2 1 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 Read: If COMRV[1:0] = 00 Write: If COMRV[1:0] = 00 and DBG not armed Table 372. DBGADLM field descriptions Field Description 7-0 Bits[7:0] Comparator Data Low Mask Bits -- The Comparator data low mask bits control whether the selected comparator compares the data bus bits [7:0] to the corresponding comparator data compare bits. Data bus comparisons are only performed if the TAG bit in DBGACTL is clear 0 Do not compare corresponding data bit. Any value of corresponding data bit allows match 1 Compare corresponding data bit 4.20.4 Functional description This section provides a complete functional description of the DBG module. If the part is in secure mode, the DBG module can generate breakpoints, but tracing is not possible. 4.20.4.1 9S12I128PIMV1 operation Arming the DBG module by setting ARM in DBGC1 allows triggering the state sequencer, storing of data in the trace buffer, and generation of breakpoints to the CPU. The DBG module is made up of four main blocks, the comparators, control logic, the state sequencer, and the trace buffer. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS The comparators monitor the bus activity of the CPU. All comparators can be configured to monitor address bus activity. Comparator A can also be configured to monitor data bus activity and mask out individual data bus bits during a compare. Comparators can be configured to use R/W and word/byte access qualification in the comparison. A match with a comparator register value can initiate a state sequencer transition to another state (see Figure 65). Either forced or tagged matches are possible. Using a forced match, a state sequencer transition can occur immediately on a successful match of system busses and comparator registers. While tagging at a comparator match, the instruction opcode is tagged, and only if the instruction reaches the execution stage of the instruction queue, can a state sequencer transition occur. In the case of a transition to Final state, bus tracing is triggered, and/or a breakpoint can be generated. A state sequencer transition to final state (with associated breakpoint, if enabled) can be initiated by writing to the TRIG bit in the DBGC1 control register. The trace buffer is visible through a 2-byte window in the register address map and must be read out using standard 16-bit word reads. TAGS TAGHITS BREAKPOINT REQUESTS TO CPU COMPARATOR A COMPARATOR B COMPARATOR C COMPARATOR MATCH CONTROL CPU BUS BUS INTERFACE SECURE MATCH0 MATCH1 TAG & MATCH CONTROL LOGIC TRANSITION STATE STATE SEQUENCER STATE MATCH2 TRACE CONTROL TRIGGER TRACE BUFFER READ TRACE DATA (DBG READ DATA BUS) Figure 64. DBG overview 4.20.4.2 Comparator modes The DBG contains three comparators, A, B and C. Each comparator compares the system address bus with the address stored in DBGXAH, DBGXAM, and DBGXAL. Furthermore, comparator A also compares the data buses to the data stored in DBGADH, DBGADL and allows masking of individual data bus bits. All comparators are disabled in BDM and during BDM accesses. The comparator match control logic (see Figure 64) configures comparators to monitor the buses for an exact address or an address range, whereby either an access inside or outside the specified range generates a match condition. The comparator configuration is controlled by the control register contents and the range control by the DBGC2 contents. A match can initiate a transition to another state sequencer state (see Section 4.20.4.4, "State sequence control""). The comparator control register also allows the type of access to be included in the comparison through the use of the RWE, RW, SZE, and SZ bits. The RWE bit controls whether read or write comparison is enabled for the associated comparator and the RW bit selects either a read or write access for a valid match. Similarly the SZE and SZ bits allow the size of access (word or byte) to be considered in the compare. Only comparators A and B feature SZE and SZ. The TAG bit in each comparator control register is used to determine the match condition. By setting TAG, the comparator qualifies a match with the output of opcode tracking logic, and a state sequencer transition occurs when the tagged instruction reaches the CPU execution stage. While tagging, the RW, RWE, SZE, and SZ bits and the comparator data registers are ignored; the comparator address register must be loaded with the exact opcode address. If the TAG bit is clear (forced type match), a comparator match is generated when the selected address appears on the system address bus. If the selected address is an opcode address, the match is generated when the opcode is fetched from the memory, which precedes the instruction execution by an indefinite number of cycles due to instruction pipelining. For a comparator match of an opcode at an odd address when TAG = 0, the corresponding even address must be contained in the comparator register. Thus for an opcode at odd address (n), the comparator register must contain address (n-1). MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Once a successful comparator match has occurred, the condition that caused the original match is not verified again on subsequent matches. If a particular data value is verified at a given address, this address may not still contain that data value when a subsequent match occurs. Match[0, 1, 2] map directly to Comparators [A, B, C] respectively, except in range modes (see Section 4.20.3.2.4, "Debug control register2 (DBGC2)"). Comparator channel priority rules are described in the priority section (Section 4.20.4.3.4, "Channel priorities"). 4.20.4.2.1 Single address comparator match With range comparisons disabled, the match condition is an exact equivalence of address bus, with the value stored in the comparator address registers. Further qualification of the type of access (R/W, word/byte) and data bus contents is possible, depending on comparator channel. 4.20.4.2.1.1 Comparator C Comparator C offers only address and direction (R/W) comparison. The exact address is compared, with the comparator address register loaded with address (n), a word access of address (n-1) also accesses (n) but does not cause a match. Table 373. Comparator C access considerations Condition for valid match Comp C address RWE RW Examples Read and write accesses of ADDR[n] ADDR[n](256) 0 X LDAA ADDR[n] STAA #$BYTE ADDR[n] Write accesses of ADDR[n] ADDR[n] 1 0 STAA #$BYTE ADDR[n] Read accesses of ADDR[n] ADDR[n] 1 1 LDAA #$BYTE ADDR[n] Notes 256. A word access of ADDR[n-1] also accesses ADDR[n] but does not generate a match. The comparator address register must contain the exact address from the code. 4.20.4.2.1.2 Comparator B Comparator B offers address, direction (R/W) and access size (word/byte) comparison. If the SZE bit is set, the access size (word or byte) is compared with the SZ bit value such that only the specified size of access causes a match. If configured for a byte access of a particular address, a word access covering the same address does not lead to match. Assuming the access direction is not qualified (RWE=0), for simplicity, the size access considerations are shown in Table 374. Table 374. Comparator B access size considerations Condition for valid match Comp B address RWE SZE SZ8 Examples Word and byte accesses of ADDR[n] ADDR[n](257) 0 0 X MOVB #$BYTE ADDR[n] MOVW #$WORD ADDR[n] Word accesses of ADDR[n] only ADDR[n] 0 1 0 MOVW #$WORD ADDR[n] LDD ADDR[n] Byte accesses of ADDR[n] only ADDR[n] 0 1 1 MOVB #$BYTE ADDR[n] LDAB ADDR[n] Notes 257. A word access of ADDR[n-1] also accesses ADDR[n] but does not generate a match. The comparator address register must contain the exact address from the code. Access direction can also be used to qualify a match for Comparator B in the same way, as described for Comparator C in Table 373. 4.20.4.2.1.3 Comparator A Comparator A offers address, direction (R/W), access size (word/byte), and data bus comparison. Table 375 lists access considerations with data bus comparison. On word accesses, the data byte of the lower address is mapped to DBGADH. Access direction can also be used to qualify a match for Comparator A in the same way as described for Comparator C in Table 373. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 375. Comparator A matches when accessing ADDR[n] SZE SZ DBGADHM, DBGADLM 0 X $0000 Byte Word No databus comparison 0 X $FF00 Byte, data(ADDR[n])=DH Word, data(ADDR[n])=DH, data(ADDR[n+1])=X Match data(ADDR[n]) 0 X $00FF Word, data(ADDR[n])=X, data(ADDR[n+1])=DL Match data(ADDR[n+1]) 0 X $00FF Byte, data(ADDR[n])=X, data(ADDR[n+1])=DL Possible unintended match 0 X $FFFF Word, data(ADDR[n])=DH, data(ADDR[n+1])=DL Match data(ADDR[n], ADDR[n+1]) 0 X $FFFF Byte, data(ADDR[n])=DH, data(ADDR[n+1])=DL Possible unintended match 1 0 $0000 Word No databus comparison 1 0 $00FF Word, data(ADDR[n])=X, data(ADDR[n+1])=DL Match only data at ADDR[n+1] 1 0 $FF00 Word, data(ADDR[n])=DH, data(ADDR[n+1])=X Match only data at ADDR[n] 1 0 $FFFF Word, data(ADDR[n])=DH, data(ADDR[n+1])=DL Match data at ADDR[n] & ADDR[n+1] 1 1 $0000 Byte No databus comparison 1 1 $FF00 Byte, data(ADDR[n])=DH Match data at ADDR[n] Access DH=DBGADH, DL=DBGADL Comment 4.20.4.2.1.4 Comparator A data bus comparison NDB dependency Comparator A features an NDB control bit, which allows data bus comparators to be configured to either trigger on equivalence or trigger on difference. This allows monitoring of a difference in the contents of an address location from an expected value. When matching on an equivalence (NDB=0), each individual data bus bit position can be masked out by clearing the corresponding mask bit (DBGADHM/DBGADLM) so that it is ignored in the comparison. A match occurs when all data bus bits with corresponding mask bits set are equivalent. If all mask register bits are clear, then a match is based on the address bus only, the data bus is ignored. When matching on a difference, mask bits can be cleared to ignore bit positions. A match occurs when any data bus bit with corresponding mask bit set is different. Clearing all mask bits causes all bits to be ignored and prevents a match because no difference can be detected. In this case, address bus equivalence does not cause a match. Table 376. NDB and MASK bit dependency NDB DBGADHM[n] / DBGADLM[n] Comment 0 0 Do not compare data bus bit. 0 1 Compare data bus bit. Match on equivalence. 1 0 Do not compare data bus bit. 1 1 Compare data bus bit. Match on difference. 4.20.4.2.2 Range comparisons Using the AB comparator pair for a range comparison, the data bus can also be used for qualification by using the comparator A data registers. Furthermore, the DBGACTL RW and RWE bits can be used to qualify the range comparison on either a read or a write access. The corresponding DBGBCTL bits are ignored. The SZE and SZ control bits are ignored in range mode. The comparator A TAG bit is used to tag range comparisons. The comparator B TAG bit is ignored in range modes. For a range comparison using comparators A and B, both COMPEA and COMPEB must be set; to disable range comparisons both must be cleared. The comparator A BRK bit is used to for the AB range, the comparator B BRK bit is ignored in range mode. When configured for range comparisons and tagging, the ranges are accurate only to word boundaries. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.20.4.2.2.1 Inside range (CompA_Addr address CompB_Addr) In the Inside Range comparator mode, comparator pair A and B can be configured for range comparisons. This configuration depends upon the control register (DBGC2). The match condition requires that a valid match for both comparators happens on the same bus cycle. A match condition on only one comparator is not valid. An aligned word access which straddles the range boundary is valid only if the aligned address is inside the range. 4.20.4.2.2.2 Outside range (address < CompA_Addr or address > CompB_Addr) In the Outside Range comparator mode, comparator pair A and B can be configured for range comparisons. A single match condition on either of the comparators is recognized as valid. An aligned word access which straddles the range boundary is valid, only if the aligned address is outside the range. Outside range mode in combination with tagging can be used to detect, if the opcode fetches are from an unexpected range. In forced match mode, the outside range match would typically be activated at any interrupt vector fetch or register access. This can be avoided by setting the upper range limit to $3FFFF or lower range limit to $00000 respectively. 4.20.4.3 Match modes (forced or tagged) Match modes are used as qualifiers for a state sequencer change of state. The Comparator control register TAG bits select the match mode. The modes are described in the following sections. 4.20.4.3.1 Forced match When configured for forced matching, a comparator channel match can immediately initiate a transition to the next state sequencer state, whereby the corresponding flags in DBGSR are set. The state control register for the current state determines the next state. Forced matches are typically generated 2-3 bus cycles after the final matching address bus cycle, independent of comparator RWE/RW settings. Furthermore, since opcode fetches occur several cycles before the opcode execution, a forced match of an opcode address typically precedes a tagged match at the same address. 4.20.4.3.2 Tagged match If a CPU taghit occurs, a transition to another state sequencer state is initiated and the corresponding DBGSR flags are set. For a comparator related taghit to occur, the DBG must first attach tags to instructions as they are fetched from memory. When the tagged instruction reaches the execution stage of the instruction queue, a taghit is generated by the CPU. This can initiate a state sequencer transition. 4.20.4.3.3 Immediate trigger Independent of comparator matches, it is possible to initiate a tracing session and/or breakpoint by writing to the TRIG bit in DBGC1. If configured for begin aligned tracing, this triggers the state sequencer into the Final state, if configured for end alignment, setting the TRIG bit disarms the module, ending the session and issues a forced breakpoint request to the CPU. It is possible to set both TRIG and ARM simultaneously to generate an immediate trigger, independent of the current state of ARM. 4.20.4.3.4 Channel priorities In case of simultaneous matches, the priority is resolved according to Table 377. The lower priority is suppressed. It is possible to miss a lower priority match, if it occurs simultaneously with a higher priority. The priorities described in Table 377 dictate that in the case of simultaneous matches, the match pointing to Final state has highest priority, followed by the lower channel number (0,1,2). Table 377. Channel priorities Priority Source Action Highest TRIG Enter Final State Channel pointing to Final State Transition to next state as defined by state control registers Match0 (force or tag hit) Transition to next state as defined by state control registers Match1 (force or tag hit) Transition to next state as defined by state control registers Match2 (force or tag hit) Transition to next state as defined by state control registers Lowest MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.20.4.4 State sequence control ARM = 0 State 0 (Disarmed) ARM = 1 State1 State2 ARM = 0 Session Complete (Disarm) Final State State3 ARM = 0 Figure 65. State sequencer diagram The state sequencer allows a defined sequence of events to provide a trigger point for tracing of data in the trace buffer. Once the DBG module has been armed by setting the ARM bit in the DBGC1 register, the state 1 of the state sequencer is entered. Further transitions between the states are then controlled by the state control registers and channel matches. From Final state, the only permitted transition is back to the disarmed state 0. Transition between any of the states 1 to 3 is not restricted. Each transition updates the SSF[2:0] flags in DBGSR accordingly to indicate the current state. Alternatively, writing to the TRIG bit in DBGSC1, provides an immediate trigger independent of comparator matches. Independent of the state sequencer, each comparator channel can be individually configured to generate an immediate breakpoint when a match occurs, through the use of the BRK bits in the DBGxCTL registers. It is possible to generate an immediate breakpoint on selected channels, while a state sequencer transition can be initiated by a match on other channels. If a debug session is ended by a match on a channel, the state sequencer transitions through Final state for a clock cycle to state 0. This is independent of tracing and breakpoint activity, and with tracing and breakpoints disabled, the state sequencer enters state 0 and the debug module is disarmed. 4.20.4.4.1 Final state On entering Final state, a trigger may be issued to the trace buffer according to the trace alignment control, as defined by the TALIGN bit (see Section 4.20.3.2.3, "Debug trace control register (DBGTCR)""). If the TSOURCE bit in DBGTCR is clear, then the trace buffer is disabled and the transition to Final state can only generate a breakpoint request. In this case or upon completion of a tracing session when tracing is enabled, the ARM bit in the DBGC1 register is cleared, returning the module to the disarmed state 0. If tracing is enabled, a breakpoint request can occur at the end of the tracing session. If neither tracing nor breakpoints are enabled, when the final state is reached, it returns automatically to state 0 and the debug module is disarmed. 4.20.4.5 Trace buffer operation The trace buffer is a 64 lines deep by 20-bits wide RAM array. The DBG module stores trace information in the RAM array in a circular buffer format. The system accesses the RAM array through a register window (DBGTBH:DBGTBL) using 16-bit wide word accesses. After each complete 20-bit trace buffer line is read, an internal pointer into the RAM increments so that the next read receives fresh information. Data is stored in the format shown in Table 378 and Table 374. After each store the counter register DBGCNT is incremented. Tracing of CPU activity is disabled when the BDM is active. Reading the trace buffer while the DBG is armed, returns invalid data and the trace buffer pointer is not incremented. 4.20.4.5.1 Trace trigger alignment Using the TALIGN bit (see Section 4.20.3.2.3, "Debug trace control register (DBGTCR)"), it is possible to align the trigger with the end or the beginning of a tracing session. If End tracing is selected, tracing begins when the ARM bit in DBGC1 is set and State1 is entered; the transition to Final state signals the end of the tracing session. Tracing with Begin Trigger starts at the opcode of the trigger. Using End Trigger or when the tracing is initiated by writing to the TRIG bit while configured for Begin Trigger, tracing starts in the second cycle after the DBGC1 write cycle. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.20.4.5.1.1 Storing with begin trigger Storing with Begin Trigger, data is not stored in the Trace Buffer until the Final state is entered. Once the trigger condition is met, the DBG module remains armed until 64 lines are stored in the Trace Buffer. If the trigger is at the address of the change-of-flow instruction, the change of flow associated with the trigger is stored in the Trace Buffer. Using Begin Trigger together with tagging, if the tagged instruction is about to be executed, then the trace is started. Upon completion of the tracing session, the breakpoint is generated, thus the breakpoint does not occur at the tagged instruction boundary. 4.20.4.5.1.2 Storing with end trigger Storing with End Trigger, data is stored in the Trace Buffer until the Final State is entered, at which point the DBG module becomes disarmed and no more data is stored. If the trigger is at the address of a change of flow instruction, the trigger event is not stored in the Trace Buffer. 4.20.4.5.2 Trace modes Four trace modes are available. The mode is selected using the TRCMOD bits in the DBGTCR register. Tracing is enabled using the TSOURCE bit in the DBGTCR register. The modes are described in the following subsections. 4.20.4.5.2.1 Normal mode In Normal mode, change of flow (COF) program counter (PC) addresses are stored. COF addresses are defined as follows: * Source address of taken conditional branches (long, short, bit-conditional, and loop primitives) * Destination address of indexed JMP, JSR, and CALL instruction * Destination address of RTI, RTS, and RTC instructions * Vector address of interrupts, except for BDM vectors LBRA, BRA, BSR, BGND, as well as non-indexed JMP, JSR, and CALL instructions are not classified as change of flow and are not stored in the trace buffer. Stored information includes the full 18-bit address bus and information bits, which contains a source/destination bit to indicate whether the stored address was a source address or destination address. NOTE When a COF instruction with destination address is executed, the destination address is stored to the trace buffer on instruction completion, indicating the COF has taken place. If an interrupt occurs simultaneously, then the next instruction carried out is actually from the interrupt service routine. The instruction at the destination address of the original program flow gets executed after the interrupt service routine. In the following example, an IRQ interrupt occurs during execution of the indexed JMP at address MARK1. The BRN at the destination (SUB_1) is not executed until after the IRQ service routine, but the destination address is entered into the trace buffer to indicate that the indexed JMP COF has taken place. MARK1 MARK2 LDX JMP NOP #SUB_1 0,X SUB_1 BRN * ADDR1 NOP DBNE A,PART5 IRQ_ISR LDAB STAB RTI #$F0 VAR_C1 ; IRQ interrupt occurs during execution of this ; ; JMP Destination address TRACE BUFFER ENTRY 1 ; RTI Destination address TRACE BUFFER ENTRY 3 ; ; Source address TRACE BUFFER ENTRY 4 ; IRQ Vector $FFF2 = TRACE BUFFER ENTRY 2 ; MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS The execution flow taking into account the IRQ is as follows MARK1 IRQ_ISR SUB_1 ADDR1 LDX JMP LDAB STAB RTI BRN NOP DBNE #SUB_1 0,X #$F0 VAR_C1 ; ; ; * A,PART5 ; ; 4.20.4.5.2.2 Loop1 mode Loop1 mode, similarly to Normal mode also stores only COF address information to the trace buffer, it however allows the filtering out of redundant information. The intent of Loop1 mode is to prevent the Trace Buffer from being filled entirely with duplicate information from a looping construct, such as delays using the DBNE instruction or polling loops using BRSET/BRCLR instructions. Immediately after address information is placed in the Trace Buffer, the DBG module writes this value into a background register. This prevents consecutive duplicate address entries in the Trace Buffer resulting from repeated branches. Loop1 mode only inhibits consecutive duplicate source address entries that would typically be stored in most tight looping constructs. It does not inhibit repeated entries of destination addresses or vector addresses, since repeated entries of these would most likely indicate a bug in the user's code that the DBG module is designed to help find. 4.20.4.5.2.3 Detail mode In Detail mode, address and data for all memory and register accesses is stored in the trace buffer. This mode is intended to supply additional information on indexed, indirect addressing modes where storing only the destination address would not provide all information required for a user to determine where the code is in error. This mode also features information bit storage to the trace buffer, for each address byte storage. The information bits indicate the size of access (word or byte) and the type of access (read or write). When tracing in Detail mode, all cycles are traced except those when the CPU is either in a free or opcode fetch cycle. 4.20.4.5.2.4 Compressed pure PC mode In Compressed Pure PC mode, the PC addresses of all executed opcodes, including where illegal opcodes are stored. A compressed storage format is used to increase the effective depth of the trace buffer. This is achieved by storing the lower order bits each time and using 2 information bits to indicate if a 64 byte boundary has been crossed, in which case the full PC is stored. Each Trace Buffer row consists of 2 information bits and 18 PC address bits NOTE: When tracing is terminated using forced breakpoints, latency in breakpoint generation means that opcodes following the opcode causing the breakpoint can be stored to the trace buffer. The number of opcodes is dependent on program flow. This can be avoided by using tagged breakpoints. 4.20.4.5.3 Trace buffer organization (normal, loop1, detail modes) ADRH, ADRM, ADRL denote address high, middle, and low byte respectively. The numerical suffix refers to the tracing count. The information format for Loop1 and Normal modes are identical. In Detail mode, the address and data for each entry are stored on consecutive lines, thus the maximum number of entries is 32. In this case, DBGCNT bits are incremented twice, once for the address line, and once for the data line, on each trace buffer entry. In Detail mode, CINF comprises of R/W and size access information (CRW and CSZ respectively). Single byte data accesses in Detail mode are always stored to the low byte of the trace buffer (DATAL) and the high byte is cleared. When tracing word accesses, the byte at the lower address is always stored to trace buffer byte1 and the byte at the higher address is stored to byte0. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 378. Trace buffer organization (normal, loop1, detail modes) Mode 4-bits 8-bits 8-bits Field 2 Field 1 Field 0 CINF1,ADRH1 ADRM1 ADRL1 0 DATAH1 DATAL1 CINF2,ADRH2 ADRM2 ADRL2 0 DATAH2 DATAL2 Entry 1 PCH1 PCM1 PCL1 Entry 2 PCH2 PCM2 PCL2 Entry Number Entry 1 Detail Mode Entry 2 Normal/Loop1 Modes 4.20.4.5.3.1 Information bit organization The format of the bits is dependent upon the active trace mode as described by the following. 4.20.4.5.3.1.1 Field2 bits in detail mode Table 379. Field2 bits in detail mode Bit 3 Bit 2 Bit 1 Bit 0 CSZ CRW ADDR[17] ADDR[16] In Detail Mode, the CSZ and CRW bits indicate the type of access being made by the CPU. Table 380. Field descriptions Bit Description 3 CSZ Access Type Indicator-- This bit indicates if the access was a byte or word size when tracing in Detail mode 0 Word Access 1 Byte Access 2 CRW Read Write Indicator -- This bit indicates if the corresponding stored address corresponds to a read or write access when tracing in Detail mode. 0 Write Access 1 Read Access 1 ADDR[17] Address Bus bit 17-- Corresponds to system address bus bit 17. 0 ADDR[16] Address Bus bit 16-- Corresponds to system address bus bit 16. 4.20.4.5.3.1.2 Field2 bits in normal and loop1 modes Table 381. Information bits PCH Bit 3 Bit 2 Bit 1 Bit 0 CSD CVA PC17 PC16 MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 382. PCH field descriptions Bit Description 3 CSD Source Destination Indicator -- In Normal and Loop1 mode, this bit indicates if the corresponding stored address is a source or destination address. This bit has no meaning in Compressed Pure PC mode. 0 Source Address 1 Destination Address 2 CVA Vector Indicator -- In Normal and Loop1 mode, this bit indicates if the corresponding stored address is a vector address. Vector addresses are destination addresses, thus if CVA is set, then the corresponding CSD is also set. This bit has no meaning in Compressed Pure PC mode. 0 Non-Vector destination address 1 Vector destination address 1 PC17 Program Counter bit 17-- In Normal and Loop1 mode, this bit corresponds to program counter bit 17. Program Counter bit 16-- In Normal and Loop1 mode, this bit corresponds to program counter bit 16. 0 PC16 4.20.4.5.4 Trace buffer organization (compressed pure PC mode) Table 383. Trace buffer organization example (compressed pure PC mode) Mode Line Number 2-bits 6-bits 6-bits 6-bits Field 3 Field 2 Field 1 Field 0 Line 1 00 Line 2 11 PC4 PC3 PC2 Line 3 01 0 0 PC5 Line 4 00 Line 5 10 Line 6 00 Compressed Pure PC Mode PC1 (Initial 18-bit PC Base Address) PC6 (New 18-bit PC Base Address) 0 PC8 PC7 PC9 (New 18-bit PC Base Address) 4.20.4.5.4.0.1 Field3 bits in compressed pure PC modes Table 384. Compressed pure PC mode field 3 information bit encoding INF1 INF0 TRACE BUFFER ROW CONTENT 0 0 Base PC address TB[17:0] contains a full PC[17:0] value 0 1 Trace Buffer[5:0] contain incremental PC relative to base address zero value 1 0 Trace Buffer[11:0] contain next 2 incremental PCs relative to base address zero value 1 1 Trace Buffer[17:0] contain next 3 incremental PCs relative to base address zero value Each time PC[17:6] differs form the previous base PC[17:6], a new base address is stored. The base address zero value is the lowest address in the 64 address range. The first line of the trace buffer always gets a base PC address; this applies also on rollover. 4.20.4.5.5 Reading data from trace buffer The data stored in the Trace Buffer can be read provided the DBG module is not armed, is configured for tracing (TSOURCE bit is set), and the system not secured. When the ARM bit is written to 1 the trace buffer, it is locked to prevent reading. The trace buffer can only be unlocked for reading by a single aligned word write to DBGTB when the module is disarmed. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS The Trace Buffer can only be read through the DBGTB register using aligned word reads. Any byte or misaligned reads return 0 and does not cause the trace buffer pointer to increment to the next trace buffer address. The Trace Buffer data is read out first-in first-out. By reading CNT in DBGCNT, the number of valid lines can be determined. DBGCNT does not decrement as data is read. While reading, an internal pointer is used to determine the next line to be read. After a tracing session, the pointer points to the oldest data entry. If no overflow has occurred, the pointer points to line 0, otherwise it points to the line with the oldest entry. In compressed Pure PC mode on rollover, the line with the oldest data entry may also contain newer data entries in fields 0 and 1. If rollover is indicated by the TBF bit, the line status must be decoded using the INF bits in field3 of that line. If both INF bits are clear, the line contains only entries from before the last rollover. If INF0=1, field 0 contains post rollover data but fields 1 and 2 contain pre rollover data. If INF1=1, fields 0 and 1 contain post rollover data but field 2 contains pre rollover data. The pointer is initialized by each aligned write to DBGTBH to point to the oldest data again. This enables an interrupted trace buffer read sequence to be easily restarted from the oldest data entry. The least significant word of line is read out first. This corresponds to the fields 1 and 0 of Table 378. The next word read returns field 2 in the least significant bits [3:0] and "0" for bits [15:4]. Reading the Trace Buffer while the DBG module is armed, returns invalid data and no shifting of the RAM pointer occurs. 4.20.4.5.6 Trace buffer reset state The Trace Buffer contents and DBGCNT bits are not initialized by a system reset. Should a system reset occur, immediately before the reset occurred, the trace session information can be read out and the number of valid lines in the trace buffer is indicated by DBGCNT. The internal pointer to the current trace buffer address is initialized by unlocking the trace buffer and points to the oldest valid data, even if a reset occurred during the tracing session. To read the trace buffer after a reset, TSOURCE must be set, otherwise the trace buffer reads as all zeroes. Generally, debugging occurrences of system resets are best handled using end trigger alignment, since the reset may occur before the trace trigger, which in the begin trigger alignment case, means no information would be stored in the trace buffer. The Trace Buffer contents and DBGCNT bits are undefined following a POR. NOTE An external pin RESET that occurs simultaneous to a trace buffer entry can, in very few cases, lead to either that entry being corrupted, or the first entry of the session being corrupted. In such cases, the other contents of the trace buffer still contain valid tracing information. The case occurs when the reset assertion coincides with the trace buffer entry clock edge. 4.20.4.6 Tagging A tag follows program information as it advances through the instruction queue. When a tagged instruction reaches the head of the queue, a tag hit occurs and can initiate a state sequencer transition. Each comparator control register features a TAG bit, which controls whether the comparator match causes a state sequencer transition immediately or tags the opcode at the matched address. If a comparator is enabled for tagged comparisons, the address stored in the comparator match address registers must be an opcode address. Using Begin Trigger together with tagging, if the tagged instruction is about to be executed, the transition to the next state sequencer state occurs. If the transition is to the Final state, tracing is started. Only upon completion of the tracing session can a breakpoint be generated. Using End alignment, when the tagged instruction is about to be executed and the next transition is to Final state, a breakpoint is generated immediately, before the tagged instruction is carried out. R/W monitoring, access size (SZ) monitoring and data bus monitoring are not useful if tagging is selected, since the tag is attached to the opcode at the matched address and is not dependent on the data bus nor on ta type of access. These bits are ignored if tagging is selected. When configured for range comparisons and tagging, the ranges are accurate only to word boundaries. Tagging is disabled when the BDM becomes active. 4.20.4.7 Breakpoints It is possible to generate breakpoints from channel transitions to final state or use software to write to the TRIG bit in the DBGC1 register. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.20.4.7.1 Breakpoints from comparator channels Breakpoints can be generated when the state sequencer transitions to the Final state. If configured for tagging, the breakpoint is generated when the tagged opcode reaches the execution stage of the instruction queue. If a tracing session is selected by the TSOURCE bit, breakpoints are requested when the tracing session has completed. If Begin aligned triggering is selected, the breakpoint is requested only on completion of the subsequent trace (see Table 385). If no tracing session is selected, breakpoints are requested immediately. If the BRK bit is set, the associated breakpoint is generated immediately independent of tracing trigger alignment. Table 385. Breakpoint setup for CPU breakpoints BRK TALIGN DBGBRK Breakpoint Alignment 0 0 0 Fill Trace Buffer until trigger then disarm (no breakpoints) 0 0 1 Fill Trace Buffer until trigger, then breakpoint request occurs 0 1 0 Start Trace Buffer at trigger (no breakpoints) 0 1 1 Start Trace Buffer at trigger A breakpoint request occurs when Trace Buffer is full 1 x 1 Terminate tracing and generate breakpoint immediately on trigger 1 x 0 Terminate tracing immediately on trigger 4.20.4.7.2 Breakpoints generated via the TRIG bit If a TRIG triggers occur, the Final state is entered, where the tracing trigger alignment is defined by the TALIGN bit. If a tracing session is selected by the TSOURCE bit, breakpoints are requested when the tracing session has completed. If Begin aligned triggering is selected, the breakpoint is requested only on completion of the subsequent trace (see Table 385). If no tracing session is selected, breakpoints are requested immediately. TRIG breakpoints are possible with a single write to DBGC1, setting ARM and TRIG simultaneously. 4.20.4.7.3 Breakpoint priorities If a TRIG trigger occurs after Begin aligned tracing has already started, then the TRIG no longer has an effect. When the associated tracing session is complete, the breakpoint occurs. Similarly, if a TRIG is followed by a subsequent comparator channel match, it has no effect, since tracing has already started. If a forced SWI breakpoint coincides with a BGND in user code with BDM enabled, then the BDM is activated by the BGND and the breakpoint to SWI is suppressed. 4.20.4.7.3.1 DBG breakpoint priorities and BDM interfacing Breakpoint operation is dependent on the state of the BDM module. If the BDM module is active, the CPU is executing out of BDM firmware. Comparator matches and associated breakpoints are disabled. In addition, while executing a BDM TRACE command, tagging into BDM is disabled. If BDM is not active, the breakpoint gives priority to BDM requests over SWI requests if the breakpoint happens to coincide with a SWI instruction in user code. On returning from BDM, the SWI from user code gets executed. Table 386. Breakpoint mapping summary DBGBRK BDM bit (DBGC1[4]) BDM enabled BDM active Breakpoint mapping 0 X X X No Breakpoint 1 0 X 0 Breakpoint to SWI X X 1 1 No Breakpoint 1 1 0 X Breakpoint to SWI 1 1 1 0 Breakpoint to BDM BDM cannot be entered from a breakpoint unless the ENABLE bit is set in the BDM. If entry to BDM via a BGND instruction is attempted and the ENABLE bit in the BDM is cleared, the CPU actually executes the BDM firmware code, checks the ENABLE, and returns if ENABLE is not set. If not serviced by the monitor, the breakpoint is re-asserted when the BDM returns to normal CPU flow. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS If the comparator register contents coincide with the SWI/BDM vector address, an SWI in user code could coincide with a DBG breakpoint. The CPU ensures that BDM requests have a higher priority than SWI requests. Returning from the BDM/SWI service routine, care must be taken to avoid a repeated breakpoint at the same address. Should a tagged or forced breakpoint coincide with a BGND in user code, the instruction that follows the BGND instruction is the first instruction executed when normal program execution resumes. NOTE When program control returns from a tagged breakpoint using an RTI or BDM GO command without program counter modification, it returns to the instruction whose tag generated the breakpoint. To avoid a repeated breakpoint at the same location, reconfigure the DBG module in the SWI routine, if configured for an SWI breakpoint, or over the BDM interface by executing a TRACE command before the GO, to increment the program flow past the tagged instruction. 4.20.5 4.20.5.1 Application information State machine scenarios Defining the state control registers as SCR1,SCR2, SCR3, and M0,M1,M2 as matches on channels 0, 1, 2 respectively. SCR encoding supported by S12SDBGV1 are shown in black. SCR encoding supported only in S12SDBGV2 are shown in red. For backwards compatibility the new scenarios use a 4th bit in each SCR register. Thus the existing encoding for SCRx[2:0] is not changed. 4.20.5.2 Scenario 1 A trigger is generated if a given sequence of 3 code events is executed. SCR2=0010 SCR1=0011 State1 M1 SCR3=0111 M2 State2 State3 M0 Final State Figure 66. Scenario 1 Scenario 1 is possible with S12SDBGV1 SCR encoding. 4.20.5.3 Scenario 2 A trigger is generated if a given sequence of 2 code events is executed. SCR2=0101 SCR1=0011 State1 M1 M2 State2 Final State Figure 67. Scenario 2a A trigger is generated if a given sequence of 2 code events is executed, whereby the first event is entry into a range (COMPA, COMPB configured for range mode). M1 is disabled in range modes. SCR2=0101 SCR1=0111 State1 M01 State2 M2 Final State Figure 68. Scenario 2b A trigger is generated if a given sequence of 2 code events is executed, whereby the second event is entry into a range (COMPA, COMPB configured for range mode). MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS SCR2=0011 SCR1=0010 State1 M2 M0 State2 Final State Figure 69. Scenario 2c All 3 scenarios 2a, 2b, 2c are possible with the S12SDBGV1 SCR encoding. 4.20.5.4 Scenario 3 A trigger is generated immediately when one of up to 3 given events occurs. SCR1=0000 State1 M012 Final State Figure 70. Scenario 3 Scenario 3 is possible with S12SDBGV1 SCR encoding. 4.20.5.5 Scenario 4 Trigger if a sequence of 2 events is carried out in an incorrect order. Event A must be followed by event B, and event B must be followed by event A. 2 consecutive occurrences of event A without an intermediate event B causes a trigger. Similarly 2 consecutive occurrences of event B without an intermediate event A causes a trigger. This is possible by using CompA and CompC to match on the same address as shown. SCR1=0100 State1 M2 M1 SCR3=0001 M0 State 3 SCR2=0011 State2 M0 M1 Final State M1 Figure 71. Scenario 4a This scenario is currently not possible using 2 comparators only. S12SDBGV2 makes it possible with 2 comparators, State 3 allows a M0 to return to state 2, while a M2 leads to Final state, as shown in Figure 72. SCR1=0110 State1 M2 SCR3=1110 State 3 M0 M0 State2 M01 M2 M2 SCR2=1100 M1 disabled in range mode Final State Figure 72. Scenario 4b (with 2 comparators) MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS The advantage of using only 2 channels is that range comparisons can now be included (channel0). This however violates the S12SDBGV1 specification, which states that a match leading to final state always has priority, in case of a simultaneous match, while priority is also given to the lowest channel number. For the S12SDBG, the corresponding CPU priority decoder is removed to support this, such that on simultaneous taghits, taghits pointing to Final state have highest priority. If no taghit points to Final state, then the lowest channel number has priority. With the above encoding from State3, the CPU and DBG would break on a simultaneous M0/M2. 4.20.5.6 Scenario 5 Trigger if following event A, event C precedes event B. i.e... the expected execution flow is A->B->C. SCR2=0110 SCR1=0011 State1 M1 M0 State2 Final State M2 Figure 73. Scenario 5 Scenario 5 is possible with the S12SDBGV1 SCR encoding. 4.20.5.7 Scenario 6 Trigger if event A occurs twice in succession before any of 2 other events (BC) occur. This scenario is not possible using the S12SDBGV1 SCR encoding. S12SDBGV2 includes additions shown in red. The change in SCR1 encoding also has the advantage that a State1->State3 transition using M0 is now possible. This is advantageous because range and data bus comparisons use channel 0 only. SCR3=1010 SCR1=1001 State1 M0 State3 M0 Final State M12 Figure 74. Scenario 6 4.20.5.8 Scenario 7 Trigger when a series of 3 events are executed out of order. Specifying the event order as M1, M2, M0 to run in loops (120120120). Any deviation from that order should trigger. This scenario is not possible using the S12SDBGV1 SCR encoding, because OR possibilities are very limited in the channel encoding. By adding OR forks as shown in red, this scenario is possible. M01 SCR2=1100 SCR1=1101 State1 M1 State2 SCR3=1101 M2 State3 M12 Final State M0 M02 Figure 75. Scenario 7 MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS On simultaneous matches the lowest channel number has priority, so with this configuration the forking from State1 has the peculiar effect that a simultaneous match0/match1 transitions to Final state, but a simultaneous match2/match1transitions to state2. 4.20.5.9 Scenario 8 Trigger when a routine/event at M2 follows either M1 or M0. SCR2=0101 SCR1=0111 State1 M01 M2 State2 Final State Figure 76. Scenario 8a Trigger when an event M2 is followed by either an event M0 or event M1 SCR2=0111 SCR1=0010 State1 M2 M01 State2 Final State Figure 77. Scenario 8b Scenario 8a and 8b are possible with the S12SDBGV1 and S12SDBGV2 SCR encoding. 4.20.5.10 Scenario 9 Trigger when a routine/event at A (M2) does not follow either B or C (M1 or M0) before they are executed again. This cannot be realized with the S12SDBGV1 SCR encoding, due to OR limitations. By changing the SCR2 encoding as shown in red this scenario becomes possible. SCR2=1111 SCR1=0111 State1 M01 M01 State2 Final State M2 Figure 78. Scenario 9 4.20.5.11 Scenario 10 Trigger if an event M0 occurs following up to two successive M2 events, without the resetting event M1. As shown, up to 2 consecutive M2 events are allowed, whereby a reset to State1 is possible, after either one or two M2 events. If an event M0 occurs following the second M2, before M1 resets to State1, a trigger is generated. Configuring CompA and CompC the same, it is possible to generate a breakpoint on the third consecutive occurrence of event M0 without a reset on M1. SCR1=0010 State1 M1 M2 SCR2=0100 State2 SCR3=0010 M2 State3 M0 Final State M1 Figure 79. Scenario 10a MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS M0 SCR2=0011 SCR1=0010 State1 M2 SCR3=0000 M1 State2 Final State State3 M0 Figure 80. Scenario 10b Scenario 10b shows the case that after M2, an M1 must occur before M0. Starting from a particular point in code, event M2 must always be followed by M1 before M0. If after any M2 event, M0 occurs before M1, then a trigger is generated. 4.21 MCU - security (S12XS9S12I128PIMV1V2) 4.21.1 Introduction This specification describes the function of the security mechanism in the S12I chip family (9S12I128PIMV1). NOTE No security feature is absolutely secure. However, NXP's strategy is to make reading or copying the FLASH and/or EEPROM difficult for unauthorized users. 4.21.1.1 Features The user must be reminded that part of the security must lie with the application code. An extreme example would be application code that dumps the contents of the internal memory. This would defeat the purpose of security. At the same time, the user may also wish to put a backdoor in the application program. An example of this is the user downloads a security key through the SCI, which allows access to a programming routine that updates parameters stored in another section of the Flash memory. The security features of the S12I chip family (in secure mode) are: * Protect the content of non-volatile memories (Flash, EEPROM) * Execution of NVM commands is restricted * Disable access to internal memory via background debug module (BDM) 4.21.1.2 Modes of operation Table 387 gives an overview over availability of security relevant features in unsecure and secure modes. Table 387. Feature availability in unsecure and secure modes on S12XS Unsecure mode NS SS Flash Array Access 4 EEPROM Array Access NX ES Secure mode EX ST NS SS 4 4 4 4 4 4 4 NVM Commands 4(258) 4 4(258) 4(258) BDM 4 4 -- 4(259) DBG Module Trace 4 4 -- -- NX ES EX ST Notes 258. Restricted NVM command set only. Refer to the NVM wrapper block guides for detailed information. 259. BDM hardware commands restricted to peripheral registers only. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.21.1.3 Securing the microcontroller Once the user has programmed the Flash and EEPROM, the chip can be secured by programming the security bits located in the options/security byte in the Flash memory array. These non-volatile bits will keep the device secured through reset and power-down. The options/security byte is located at address 0xFF0F (= global address 0x7F_FF0F) in the Flash memory array. This byte can be erased and programmed like any other Flash location. Two bits of this byte are used for security (SEC[1:0]). On devices which have a memory page window, the Flash options/security byte is also available at address 0xBF0F by selecting page 0x3F with the PPAGE register. The contents of this byte are copied into the Flash security register (FSEC) during a reset sequence. Table 388. Flash options/security byte 0xFF0F 7 6 5 4 3 2 1 0 KEYEN1 KEYEN0 NV5 NV4 NV3 NV2 SEC1 SEC0 The meaning of the bits KEYEN[1:0] is shown in Table 389. Refer to Section 4.21.1.5.1, "Unsecuring the MCU using the backdoor key access" for more information. Table 389. Backdoor key access enable bits KEYEN[1:0] Backdoor key access enabled 00 0 (disabled) 01 0 (disabled) 10 1 (enabled) 11 0 (disabled) The meaning of the security bits SEC[1:0] is shown in Table 390. For security reasons, the state of device security is controlled by two bits. To put the device in unsecured mode, these bits must be programmed to SEC[1:0] = `10'. All other combinations put the device in a secured mode. The recommended value to put the device in secured state is the inverse of the unsecured state, i.e. SEC[1:0] = `01'. Table 390. Security bits SEC[1:0] Security state 00 1 (secured) 01 1 (secured) 10 0 (unsecured) 11 1 (secured) NOTE Refer to the Flash block guide for actual security configuration (in section "Flash Module Security"). 4.21.1.4 Operation of the secured microcontroller By securing the device, unauthorized access to the EEPROM and Flash memory contents can be prevented. However, it must be understood that the security of the EEPROM and Flash memory contents also depends on the design of the application program. For example, if the application has the capability of downloading code through a serial port and then executing that code (e.g. an application containing bootloader code), then this capability could potentially be used to read the EEPROM and Flash memory contents, even when the microcontroller is in the secure state. In this example, the security of the application could be enhanced by requiring a challenge/response authentication before any code can be downloaded. Secured operation has the following effects on the microcontroller: 4.21.1.4.1 * * * Normal single chip mode (NS) Background debug module (BDM) operation is completely disabled. Execution of Flash and EEPROM commands is restricted. Refer to the NVM block guide for details. Tracing code execution using the DBG module is disabled. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.21.1.4.2 * * * * Special single chip mode (SS) BDM firmware commands are disabled. BDM hardware commands are restricted to the register space. Execution of Flash and EEPROM commands is restricted. Refer to the NVM block guide for details. Tracing code execution using the DBG module is disabled. Special single chip mode means BDM is active after reset. The availability of BDM firmware commands depends on the security state of the device. The BDM secure firmware first performs a blank check of both the Flash memory and the EEPROM. If the blank check succeeds, security will be temporarily turned off and the state of the security bits in the appropriate Flash memory location can be changed. If the blank check fails, security will remain active, only the BDM hardware commands will be enabled, and the accessible memory space is restricted to the peripheral register area. This will allow the BDM to be used to erase the EEPROM and Flash memory without giving access to their contents. After erasing both Flash memory and EEPROM, another reset into special single chip mode will cause the blank check to succeed and the options/security byte can be programmed to "unsecured" state via BDM. While the BDM is executing the blank check, the BDM interface is completely blocked, which means that all BDM commands are temporarily blocked. 4.21.1.5 Unsecuring the microcontroller Unsecuring the microcontroller can be done by three different methods: 1. Backdoor key access 2. Reprogramming the security bits 3. Complete memory erase (special modes) 4.21.1.5.1 Unsecuring the MCU using the backdoor key access In Normal modes (single chip and expanded), security can be temporarily disabled using the backdoor key access method. This method requires that: * The backdoor key at 0xFF00-0xFF07 (= global addresses 0x7F_FF00-0x7F_FF07) has been programmed to a valid value. * The KEYEN[1:0] bits within the Flash options/security byte select `enabled'. * In single chip mode, the application program programmed into the microcontroller must be designed to have the capability to write to the backdoor key locations. The backdoor key values themselves would not normally be stored within the application data, which means the application program would have to be designed to receive the backdoor key values from an external source (e.g. through a serial port). The backdoor key access method allows debugging of a secured microcontroller without having to erase the Flash. This is particularly useful for failure analysis. NOTE No word of the backdoor key is allowed to have the value 0x0000 or 0xFFFF. 4.21.1.6 Reprogramming the security bits In normal single chip mode (NS), security can also be disabled by erasing and reprogramming the security bits within Flash options/security byte to the unsecured value. Because the erase operation will erase the entire sector from 0xFE00-0xFFFF (0x7F_FE00-0x7F_FFFF), the backdoor key and the interrupt vectors will also be erased; this method is not recommended for normal single chip mode. The application software can only erase and program the Flash options/security byte if the Flash sector containing the Flash options/security byte is not protected (see Flash protection). Flash protection is a useful means of preventing this method. The microcontroller will enter the unsecured state after the next reset following the programming of the security bits to the unsecured value. This method requires that: * The application software previously programmed into the microcontroller has been designed to have the capability to erase and program the Flash options/security byte, or security is first disabled using the backdoor key method, allowing BDM to be used to issue commands to erase and program the Flash options/security byte. * The Flash sector containing the Flash options/security byte is not protected. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.21.1.7 Complete memory erase (special modes) The microcontroller can be unsecured in special modes by erasing the entire EEPROM and Flash memory contents. When a secure microcontroller is reset into special single chip mode (SS), the BDM firmware verifies whether the EEPROM and Flash memory are erased. If any EEPROM or Flash memory address is not erased, only BDM hardware commands are enabled. BDM hardware commands can then be used to write to the EEPROM and Flash registers to mass erase the EEPROM and all Flash memory blocks. When next resetting into special single chip mode, the BDM firmware will again verify whether all EEPROM and Flash memory are erased. This being the case, it will enable all BDM commands, allowing the Flash options/security byte to be programmed to the unsecured value. The security bits SEC[1:0] in the Flash security register will indicate the unsecure state following the next reset. 4.22 Background debug module (9S12I128PIMV1) 4.22.1 Introduction This section describes the functionality of the background debug module (BDM) sub-block of the HCS12S core platform. The background debug module (BDM) sub-block is a single-wire, background debug system, implemented in on-chip hardware for minimal CPU intervention. All interfacing with the BDM is done via the BKGD pin. The BDM has enhanced capability for maintaining synchronization between the target and host while allowing more flexibility in clock rates. This includes a sync signal to determine the communication rate and a handshake signal to indicate when an operation is complete. The system is backwards compatible to the BDM of the S12 family with the following exceptions: * TAGGO command not supported by S12SBDM * External instruction tagging feature is part of the DBG module * S12SBDM register map and register content modified * Family ID readable from BDM ROM at global address 0x3_FF0F in active BDM (value for devices with HCS12S core is 0xC2) * Clock switch removed from BDM (CLKSW bit removed from BDMSTS register) 4.22.1.1 Features The BDM includes these distinctive features: * Single-wire communication with host development system * Enhanced capability for allowing more flexibility in clock rates * SYNC command to determine communication rate * GO_UNTIL(266) command * Hardware handshake protocol to increase the performance of the serial communication * Active out of reset in special single chip mode * Nine hardware commands using free cycles, if available, for minimal CPU intervention * Hardware commands not requiring active BDM * 14 firmware commands execute from the standard BDM firmware lookup table * Software control of BDM operation during Wait mode * When secured, hardware commands are allowed to access the register space in special single chip mode, if the Flash erase tests fail * Family ID readable from BDM ROM at global address 0x3_FF0F in active BDM (value for devices with HCS12S core is 0xC2) * BDM hardware commands are operational until system Stop mode is entered 4.22.1.2 Modes of operation BDM is available in all operating modes, but must be enabled before firmware commands are executed. Some systems may have a control bit that allows suspending the function during background debug mode. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.22.1.2.1 Regular run modes All of these operations refer to the part in run mode and not being secured. The BDM does not provide controls to conserve power during run mode. * Normal modes - General operation of the BDM is available and operates the same in all normal modes * Special single chip mode - In special single chip mode, background operation is enabled and active out of reset. This allows programming a system with blank memory 4.22.1.2.2 Secure mode operation If the device is in secure mode, the operation of the BDM is reduced to a small subset of its regular run mode operation. Secure operation prevents access to Flash other than allowing erasure. For more information, see Section 4.22.4.1, "Security". 4.22.1.2.3 Low-power modes The BDM can be used until Stop mode is entered. When CPU is in Wait mode, all BDM firmware commands as well as the hardware BACKGROUND command cannot be used and are ignored. In this case, the CPU can not enter BDM active mode, and only hardware read and write commands are available. Also, the CPU can not enter a Low Power mode (stop or wait) during BDM active mode. In Stop mode, the BDM clocks are stopped. When BDM clocks are disabled and Stop mode is exited, the BDM clocks will restart and BDM will have a soft reset (clearing the instruction register, any command in progress and disable the ACK function). The BDM is now ready to receive a new command. 4.22.1.3 Block diagram A block diagram of the BDM is shown in Figure 81. Host System BKGD Serial Interface Data 16-Bit Shift Register Control Register Block Address TRACE BDMACT Instruction Code and Execution Bus Interface and Control Logic Data Control Clocks ENBDM SDV Standard BDM Firmware LOOKUP TABLE UNSEC Secured BDM Firmware LOOKUP TABLE BDMSTS Register Figure 81. BDM block diagram MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.22.2 External signal description A single-wire interface pin called the background debug interface (BKGD) pin is used to communicate with the BDM system. During reset, this pin is a mode select input which selects between normal and special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the background debug mode. The communication rate of this pin is based on the settings for the VCO clock (CPMUSYNR). The BDM clock frequency is always VCO clock frequency divided by 8. After reset, the BDM clock is based on the reset values of the CPMUSYNR register (4.0 MHz). When modifying the VCO clock, make sure that the communication rate is adapted accordingly, and a communication timeout (BDM soft reset) has occurred. 4.22.3 Memory map and register definition 4.22.3.1 Module memory map Table 48 shows the BDM memory map when BDM is active. Table 391. BDM memory map Global Address Module Size (bytes) 0x3_FF00-0x3_FF0B BDM registers 12 0x3_FF0C-0x3_FF0E BDM firmware ROM 3 0x3_FF0F Family ID (part of BDM firmware ROM) 1 0x3_FF10-0x3_FFFF BDM firmware ROM 240 4.22.3.2 Register descriptions A summary of the registers associated with the BDM is shown in Table 392. Registers are accessed by host-driven communications to the BDM hardware using READ_BD and WRITE_BD commands. Table 392. BDM register summary Global address Register name 0x3_FF00 Reserved 0x3_FF01 BDMSTS 0x3_FF02 Reserved 0x3_FF03 Reserved 0x3_FF04 Reserved 0x3_FF05 Reserved 0x3_FF06 BDMCCR R Bit 7 6 5 4 3 2 1 Bit 0 X X X X X X 0 0 BDMACT 0 SDV TRACE 0 UNSEC 0 Z Z W R W R ENBDM X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X CCR7 CCR6 CCR5 CCR4 CCR3 CCR2 CCR1 CCR0 W R W R W R W R W X = Unimplemented, Reserved Z = Implemented (do not alter) = Indeterminate 0 = Always read zero MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 392. BDM register summary (continued) Global address Register name 0x3_FF07 Reserved BDMPPR 0x3_FF08 Reserved 0x3_FF0A Reserved 0x3_FF0B Reserved 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 0 0 0 BPP3 BPP2 BPP1 BPP0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W R W 0x3_FF09 Bit 7 BPAE R W R W R W X 4.22.3.2.1 = Unimplemented, Reserved Z = Implemented (do not alter) = Indeterminate 0 = Always read zero BDM status register (BDMSTS) Table 393. BDM status register (BDMSTS) Register Global Address 0x3_FF01 R W 7 ENBDM 6 5 4 3 2 1 0 BDMACT 0 SDV TRACE 0 UNSEC 0 Reset Special Single-Chip Mode 0(260) 1 0 0 0 0 0(261) 0 All Other Modes 0 0 0 0 0 0 0 0 = Unimplemented, Reserved 0 Z = Implemented (do not alter) = Always read zero Notes 260. ENBDM is read as a 1 by a debugging environment in special single chip mode, when the device is either secured or not secured, but fully erased (Flash). This is because the ENBDM bit is set by the standard BDM firmware before a BDM command can be fully transmitted and executed. 261. UNSEC is read as a 1 by a debugging environment in special single chip mode when the device is secured and fully erased, else it is 0 and can only be read if not secure (see also bit description). Read: All modes through BDM operation when not secured Write: All modes through BDM operation when not secured, but subject to the following: -- ENBDM should only be set via a BDM hardware command if the BDM firmware commands are needed. (This does not apply in special single chip mode) -- BDMACT can only be set by BDM hardware upon entry into BDM. It can only be cleared by the standard BDM firmware lookup table upon exit from BDM active mode -- All other bits, while writable via BDM hardware or standard BDM firmware write commands, should only be altered by the BDM hardware or the standard firmware lookup table, as part of BDM command execution MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 394. BDMSTS field descriptions Field Description Enable BDM -- This bit controls whether the BDM is enabled or disabled. When enabled, BDM can be made active to allow firmware commands to be executed. When disabled, BDM cannot be made active but BDM hardware commands are still allowed. 0 BDM disabled 1 BDM enabled Note: ENBDM is set out of reset in special single chip mode. In special single chip mode with the device secured, this bit will not be set until after the Flash erase verify tests are complete. 7 ENBDM BDM Active Status -- This bit becomes set upon entering BDM. The standard BDM firmware lookup table is then enabled and put into the memory map. BDMACT is cleared by a carefully timed store instruction in the standard BDM firmware, as part of the exit sequence to return to user code and remove the BDM memory from the map. 0 BDM not active 1 BDM active 6 BDMACT Shift Data Valid -- This bit is set and cleared by the BDM hardware. It is set after data has been transmitted as part of a BDM firmware or hardware read command, or after data has been received as part of a BDM firmware or hardware write command. It is cleared when the next BDM command has been received or BDM is exited. SDV is used by the standard BDM firmware to control program flow execution. 0 Data phase of command not complete 1 Data phase of command is complete 4 SDV TRACE1 BDM Firmware Command is Being Executed -- This bit gets set when a BDM TRACE1 firmware command is first recognized. It will stay set until BDM firmware is exited by one of the following BDM commands: GO or GO_UNTIL(266). 0 TRACE1 command is not being executed 1 TRACE1 command is being executed 3 TRACE Unsecure -- If the device is secured this bit is only writable in special single chip mode from the BDM secure firmware. It is in a zero state as secure mode is entered so that the secure BDM firmware lookup table is enabled and put into the memory map, overlapping the standard BDM firmware lookup table. The secure BDM firmware lookup table verifies that the on-chip Flash is erased. This being the case, the UNSEC bit is set and the BDM program jumps to the start of the standard BDM firmware lookup table, and the secure BDM firmware lookup table is turned off. If the erase test fails, the UNSEC bit will not be asserted. 0 System is in a secured mode. 1 System is in a unsecured mode. Note: When UNSEC is set, security is off and the user can change the state of the secure bits in the on-chip Flash EEPROM. Note that if the user does not change the state of the bits to "unsecured" mode, the system will be secured again when it is next taken out of reset. After reset, this bit has no meaning or effect when the security byte in the Flash EEPROM is configured for unsecure mode. 1 UNSEC Table 395. BDM CCR holding register (BDMCCR) Register Global Address 0x3_FF06 7 6 5 4 3 2 1 0 CCR7 CCR6 CCR5 CCR4 CCR3 CCR2 CCR1 CCR0 Special Single-Chip Mode 1 1 0 1 1 0 0 0 All Other Modes 0 0 0 0 0 0 0 0 R W Reset Read: All modes through BDM operation when not secured Write: All modes through BDM operation when not secured NOTE When BDM is made active, the CPU stores the content of its CCR register in the BDMCCR register. However, out of special single-chip reset, the BDMCCR is set to 0xD8 and not 0xD0 which is the reset value of the CCR register in this CPU mode. Out of reset in all other modes the BDMCCR register is read zero. When entering background debug mode, the BDM CCR holding register is used to save the condition code register of the user's program. It is also used for temporary storage in the standard BDM firmware mode. The BDM CCR holding register can be written to modify the CCR value. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.22.3.2.2 BDM program page index register (BDMPPR) Table 396. BDM program page register (BDMPPR) Register Global Address 0x3_FF08 R W Reset 7 BPAE 0 6 5 4 0 0 0 0 0 0 3 2 1 0 BPP3 BPP2 BPP1 BPP0 0 0 0 0 = Unimplemented, Reserved Read: All modes through BDM operation when not secured Write: All modes through BDM operation when not secured Table 397. BDMPPR field descriptions Field Description 7 BPAE BDM Program Page Access Enable Bit -- BPAE enables program page access for BDM hardware and firmware read/write instructions The BDM hardware commands used to access the BDM registers (READ_BD and WRITE_BD) can not be used for global accesses even if the BGAE bit is set. 0 BDM Program Paging disabled 1 BDM Program Paging enabled 3-0 BPP[3:0] 4.22.3.3 BDM Program Page Index Bits 3-0 -- These bits define the selected program page. For more detailed information regarding the program page window scheme, refer to the S12S_MMC Block Guide. Family ID assignment The family ID is an 8-bit value located in the BDM ROM in active BDM (at global address: 0x3_FF0F). The read-only value is a unique family ID which is 0xC2 for devices with an HCS12S core. 4.22.4 Functional description The BDM receives and executes commands from a host via a single wire serial interface. There are two types of BDM commands: hardware and firmware commands. Hardware commands are used to read and write target system memory locations and to enter active background debug mode. See Section 4.22.4.3, "BDM hardware commands". Target system memory includes all memory that is accessible by the CPU. Firmware commands are used to read and write CPU resources and to exit from active background debug mode. See Section 4.22.4.4, "Standard BDM firmware commands". The CPU resources referred to are the accumulator (D), X index register (X), Y index register (Y), stack pointer (SP), and program counter (PC). Hardware commands can be executed at any time and in any mode, excluding a few exceptions as highlighted (see Section 4.22.4.3, "BDM hardware commands") and in secure mode (see Section 4.22.4.1, "Security"). BDM firmware commands can only be executed when the system is not secure and is in active background debug mode (BDM). 4.22.4.1 Security If the user resets into special single chip mode with the system secured, a secured mode BDM firmware lookup table is brought into the map overlapping a portion of the standard BDM firmware lookup table. The secure BDM firmware verifies that the on-chip Flash EEPROM is erased. This being the case, the UNSEC and ENBDM bits will get set. The BDM program jumps to the start of the standard BDM firmware, the secured mode BDM firmware is turned off, and all BDM commands are allowed. If the Flash does not verify as erased, the BDM firmware sets the ENBDM bit, without asserting UNSEC, and the firmware enters a loop. This causes the BDM hardware commands to become enabled, but does not enable the firmware commands. This allows the BDM hardware to be used to erase the Flash. BDM operation is not possible in any other mode than special single chip mode when the device is secured. The device can only be unsecured via the BDM serial interface in special single chip mode. For more information regarding security, see the S12S_9SEC Block Guide. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.22.4.2 Enabling and activating BDM The system must be in active BDM to execute standard BDM firmware commands. BDM can be activated only after being enabled. BDM is enabled by setting the ENBDM bit in the BDM status (BDMSTS) register. The ENBDM bit is set by writing to the BDM status (BDMSTS) register, via the single-wire interface, using a hardware command such as WRITE_BD_BYTE. After being enabled, BDM is activated by one of the following (262): * Hardware BACKGROUND command * CPU BGND instruction * Breakpoint force or tag mechanism(263) Notes 262. BDM is enabled and active immediately out of special single-chip reset. 263. This method is provided by the S12S_DBG module. When BDM is activated, the CPU finishes executing the current instruction and then begins executing the firmware in the standard BDM firmware lookup table. When BDM is activated by a breakpoint, the type of breakpoint used determines if BDM becomes active before or after execution of the next instruction. NOTE If an attempt is made to activate BDM before being enabled, the CPU resumes normal instruction execution after a brief delay. If BDM is not enabled, any hardware BACKGROUND commands issued are ignored by the BDM and the CPU is not delayed. In active BDM, the BDM registers and standard BDM firmware lookup table are mapped to addresses 0x3_FF00 to 0x3_FFFF. BDM registers are mapped to addresses 0x3_FF00 to 0x3_FF0B. The BDM uses these registers which are readable anytime by the BDM. However, these registers are not readable by user programs. When BDM is activated, while CPU executes code overlapping with the BDM firmware space, the saved program counter (PC) will be auto incremented by one from the BDM firmware, regardless of what caused the entry into BDM active mode (BGND instruction, BACKGROUND command or breakpoints). In such cases, the PC must be set to the next valid address via a WRITE_PC command, before executing the GO command. 4.22.4.3 BDM hardware commands Hardware commands are used to read and write target system memory locations and to enter active background debug mode. Target system memory includes all memory that is accessible by the CPU such as on-chip RAM, Flash, I/O and control registers. Hardware commands are executed with minimal or no CPU intervention, and do not require the system to be in active BDM for execution, although, they can still be executed in this mode. When executing a hardware command, the BDM sub-block waits for a free bus cycle, so the background access does not disturb the running application program. If a free cycle is not found within 128 clock cycles, the CPU is momentarily frozen so the BDM can steal a cycle. When the BDM finds a free cycle, the operation does not intrude on normal CPU operation, provided it can be completed in a single cycle. However, if an operation requires multiple cycles, the CPU is frozen until the operation is complete, even though the BDM found a free cycle. The BDM hardware commands are listed in Table 398. The READ_BD and WRITE_BD commands allow access to the BDM register locations. These locations are not normally in the system memory map, but share addresses with the application in memory. To distinguish between physical memory locations that share the same address, BDM memory resources are enabled just for the READ_BD and WRITE_BD access cycle. This allows the BDM to access BDM locations unobtrusively, even if the addresses conflict with the application memory map. Table 398. Hardware commands Command Opcode (hex) Data Description BACKGROUND 90 None Enter background mode if BDM is enabled. If enabled, an ACK will be issued when the part enters active background mode. ACK_ENABLE D5 None Enable Handshake. Issues an ACK pulse after the command is executed. ACK_DISABLE D6 None Disable Handshake. This command does not issue an ACK pulse. E4 16-bit address 16-bit data out Read from memory with standard BDM firmware lookup table in map. Odd address data on low byte; even address data on high byte. EC 16-bit address 16-bit data out Read from memory with standard BDM firmware lookup table in map. Must be aligned access. READ_BD_BYTE READ_BD_WORD MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 398. Hardware commands (continued) Command Opcode (hex) Data READ_BYTE E0 16-bit address 16-bit data out Read from memory with standard BDM firmware lookup table out of map. Odd address data on low byte; even address data on high byte. READ_WORD E8 16-bit address 16-bit data out Read from memory with standard BDM firmware lookup table out of map. Must be aligned access. C4 16-bit address 16-bit data in Write to memory with standard BDM firmware lookup table in map. Odd address data on low byte; even address data on high byte. WRITE_BD_WORD CC 16-bit address 16-bit data in Write to memory with standard BDM firmware lookup table in map. Must be aligned access. WRITE_BYTE C0 16-bit address 16-bit data in Write to memory with standard BDM firmware lookup table out of map. Odd address data on low byte; even address data on high byte. WRITE_WORD C8 16-bit address 16-bit data in Write to memory with standard BDM firmware lookup table out of map. Must be aligned access. WRITE_BD_BYTE Description If enabled, ACK will occur when data is ready for transmission for all BDM READ commands, and will occur after the write is complete for all BDM WRITE commands. 4.22.4.4 Standard BDM firmware commands BDM firmware commands are used to access and manipulate CPU resources. The system must be in active BDM to execute standard BDM firmware commands. See Section 4.22.4.2, "Enabling and activating BDM". Normal instruction execution is suspended while the CPU executes the firmware located in the standard BDM firmware lookup table. The hardware command BACKGROUND is the usual way to activate BDM. As the system enters active BDM, the standard BDM firmware lookup table, BDM registers become visible in the on-chip memory map at 0x3_FF00-0x3_FFFF, and the CPU begins executing the standard BDM firmware. The standard BDM firmware watches for serial commands and executes them as they are received. The firmware commands are shown in Table 399. Table 399. Firmware commands Command(264) Opcode (hex) Data READ_NEXT(265) 62 16-bit data out Increment X index register by 2 (X = X + 2), then read word X points to. READ_PC 63 16-bit data out Read program counter. READ_D 64 16-bit data out Read D accumulator. READ_X 65 16-bit data out Read X index register. READ_Y 66 16-bit data out Read Y index register. READ_SP 67 16-bit data out Read stack pointer. WRITE_NEXT 42 16-bit data in Increment X index register by 2 (X = X + 2), then write word to location pointed to by X. WRITE_PC 43 16-bit data in Write program counter. WRITE_D 44 16-bit data in Write D accumulator. WRITE_X 45 16-bit data in Write X index register. WRITE_Y 46 16-bit data in Write Y index register. WRITE_SP 47 16-bit data in Write stack pointer. GO 08 none Go to user program. If enabled, ACK will occur when leaving active background mode. GO_UNTIL(266) 0C none Go to user program. If enabled, ACK will occur upon returning to active background mode. TRACE1 10 none Execute one user instruction then return to active BDM. If enabled, ACK will occur upon returning to active background mode. Description MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 399. Firmware commands (continued) Command(264) Opcode (hex) Data TAGGO -> GO 18 none Description (Previous enable tagging and go to user program.) This command will be deprecated and should not be used anymore. Opcode will be executed as a GO command. Notes 264. If enabled, ACK will occur when data is ready for transmission for all BDM READ commands, and will occur after the write is complete for all BDM WRITE commands. 265. When the firmware command READ_NEXT or WRITE_NEXT is used to access the BDM address space, the BDM resources are accessed, rather than user code. Writing BDM firmware is not possible. 266. System stop disables the ACK function and ignored commands will have no ACK-pulse (e.g., CPU in stop or wait mode). The GO_UNTIL command will not get an Acknowledge, if the CPU executes the wait or stop instruction before the "UNTIL" condition (BDM active again) is reached (see Section 4.22.4.7, "Serial interface hardware handshake protocol" last note). 4.22.4.5 BDM command structure Hardware and firmware BDM commands start with an 8-bit opcode followed by a 16-bit address and/or a 16-bit data word, depending on the command. All the read commands return 16 bits of data despite the byte or word implication in the command name. 8-bit reads return 16-bits of data, only one byte of which contains valid data. If reading an even address, the valid data will appear in the MSB. If reading an odd address, the valid data will appear in the LSB. 16-bit misaligned reads and writes are generally not allowed. If attempted by BDM hardware command, the BDM ignores the least significant bit of the address and assumes an even address from the remaining bits. For hardware data read commands, the external host must wait at least 150 bus clock cycles after sending the address before attempting to obtain the read data. This is to be certain that valid data is available in the BDM shift register, ready to be shifted out. For hardware write commands, the external host must wait 150 bus clock cycles after sending the data to be written, before attempting to send a new command. This is to avoid disturbing the BDM shift register before the write has been completed. The 150 bus clock cycle delay, in both cases, includes the maximum 128 cycle delay that can be incurred, as the BDM waits for a free cycle before stealing a cycle. The external host should wait at least 48 bus clock cycles after sending the command opcode and before attempting to obtain the read data for BDM firmware read commands. The 48 cycle wait allows enough time for the requested data to be made available in the BDM shift register, ready to be shifted out. The external host must wait 36 bus clock cycles after sending the data to be written, before attempting to send a new command for BDM firmware write commands. This is to avoid disturbing the BDM shift register before the write has been completed. The external host should wait for at least for 76 bus clock cycles, after a TRACE1 or GO command and before starting any new serial command. This is to allow the CPU to exit gracefully from the standard BDM firmware lookup table and resume execution of the user code. Disturbing the BDM shift register prematurely may adversely affect the exit from the standard BDM firmware lookup table. NOTE If the bus rate of the target processor is unknown or could be changing, it is recommended that the ACK (acknowledge function) is used to indicate when an operation is complete. When using ACK, the delay times are automated. Figure 82 represents the BDM command structure. The command blocks illustrate a series of eight bit times, starting with a falling edge. The bar across the top of the blocks indicates that the BKGD line idles in the high state. The time for an 8-bit command is 8 x 16 target clock cycles.(267) Notes 267. Target clock cycles are cycles measured using the target MCU's serial clock rate. See Section 4.22.4.6, "BDM serial interface" and Section 4.22.3.2.1, "BDM status register (BDMSTS)" for information on how serial clock rate is selected. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Hardware Read 8-Bits AT ~16 TC/Bit 16-Bits AT ~16 TC/Bit Command Address 150-BC Delay 16 Bits AT ~16 TC/Bit Data Next Command 150-BC Delay Hardware Write Command Address Data Next Command 48-BC DELAY Firmware Read Command Data Next Command 36-BC DELAY Firmware Write Command Data Next Command 76-BC Delay GO, TRACE Command Next Command BC = Bus Clock Cycles TC = Target Clock Cycles Figure 82. BDM command structure 4.22.4.6 BDM serial interface The BDM communicates with external devices serially via the BKGD pin. During reset, this pin is a mode select input which selects between normal and special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the BDM. The BDM serial interface is timed, based on the VCO clock (refer to the CPMU Block Guide for more details), which gets divided by 8. This clock will be referred to as the target clock in the following explanation. The BDM serial interface uses a clocking scheme in which the external host generates a falling edge on the BKGD pin to indicate the start of each bit time. This falling edge is sent for every bit whether data is transmitted or received. Data is transferred, most significant bit (MSB) first, at 16 target clock cycles per bit. The interface times out if 512 clock cycles occur between falling edges from the host. The BKGD pin is a pseudo open-drain pin and has an weak on-chip active pull-up that is enabled at all times. It is assumed that there is an external pull-up and drivers connected to BKGD do not typically drive the high level. Since R-C rise time could be unacceptably long, the target system and host provide brief driven-high (speedup) pulses to drive BKGD to a logic 1. The source of this speedup pulse is the host for transmit cases and the target for receive cases. The timing for host-to-target is shown in Figure 83, and that of target-to-host in Figure 84 and Figure 85. All four cases begin when the host drives the BKGD pin low to generate a falling edge. Since the host and target are operating from separate clocks, it can take the target system up to one full clock cycle to recognize this edge. The target measures delays from this perceived start of the bit time, while the host measures delays from the point it actually drove BKGD low to start the bit up to one target clock cycle earlier. Synchronization between the host and target is established in this manner at the start of every bit time. Figure 83 shows an external host transmitting a logic 1 and transmitting a logic 0 to the BKGD pin of a target system. The host is asynchronous to the target, so there is up to a one clock-cycle delay from the host-generated falling edge to where the target recognizes this edge as the beginning of the bit time. Ten target clock cycles later, the target senses the bit level on the BKGD pin. Internal glitch detect logic requires the pin be driven high no later that eight target clock cycles after the falling edge for a logic 1 transmission. Since the host drives the high speedup pulses in these two cases, the rising edges look like digitally driven signals. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS BDM Clock (Target MCU) Host Transmit 1 Host Transmit 0 Perceived Start of Bit Time Target Senses Bit Earliest Start of Next Bit 10 Cycles Synchronization Uncertainty Figure 83. BDM host-to-target serial bit timing The receive cases are more complicated. Figure 84 shows the host receiving a logic 1 from the target system. Since the host is asynchronous to the target, there is up to one clock cycle delay from the host-generated falling edge on BKGD to the perceived start of the bit time in the target. The host holds the BKGD pin low long enough for the target to recognize it (at least two target clock cycles). The host must release the low drive before the target drives a brief high speedup pulse seven target clock cycles after the perceived start of the bit time. The host should sample the bit level about 10 target clock cycles after it started the bit time. BDM Clock (Target MCU) Host Drive to BKGD Pin Target System Speedup Pulse Perceived Start of Bit Time High-impedance High-impedance High-impedance R-C Rise BKGD Pin 10 Cycles 10 Cycles Host Samples BKGD Pin Figure 84. BDM target-to-host serial bit timing (logic 1) Earliest Start of Next Bit Figure 85 shows the host receiving a logic 0 from the target. Since the host is asynchronous to the target, there is up to a one clock cycle delay from the host-generated falling edge on BKGD to the start of the bit time as perceived by the target. The host initiates the bit time but the target finishes it. Since the target wants the host to receive a logic 0, it drives the BKGD pin low for 13 target clock cycles then briefly drives it high to speed up the rising edge. The host samples the bit level about 10 target clock cycles after starting the bit time. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS BDM Clock (Target MCU) Host Drive to BKGD Pin High-impedance Speedup Pulse Target System Drive and Speedup Pulse Perceived Start of Bit Time BKGD Pin 10 Cycles 10 Cycles Earliest Start of Next Bit Host Samples BKGD Pin Figure 85. BDM target-to-host serial bit timing (logic 0) 4.22.4.7 Serial interface hardware handshake protocol BDM commands that require CPU execution are ultimately treated at the MCU bus rate. Since the BDM clock source can be modified when changing the settings for the VCO frequency (CPMUSYNR), it is very helpful to provide a handshake protocol in which the host could determine when an issued command is executed by the CPU. The BDM clock frequency is always VCO frequency divided by 8. The alternative is to always wait the amount of time equal to the appropriate number of cycles at the slowest possible rate the clock could be running. This sub-section will describe the hardware handshake protocol. The hardware handshake protocol signals to the host controller when an issued command was successfully executed by the target. This protocol is implemented by a 16 serial clock cycle low pulse followed by a brief speedup pulse in the BKGD pin. This pulse is generated by the target MCU when a command, issued by the host, has been successfully executed (see Figure 86). This pulse is referred to as the ACK pulse. After the ACK pulse has finished: the host can start the bit retrieval if the last issued command was a read command, or start a new command if the last command was a write command or a control command (BACKGROUND, GO, GO_UNTIL(266) or TRACE1). The ACK pulse is not issued earlier than 32 serial clock cycles after the BDM command was issued. The end of the BDM command is assumed to be the 16th tick of the last bit. This minimum delay assures enough time for the host to perceive the ACK pulse. Note also that, there is no upper limit for the delay between the command and the related ACK pulse, since the command execution depends upon the CPU bus, which in some cases could be very slow due to long accesses taking place.This protocol allows a great flexibility for the POD designers, since it does not rely on any accurate time measurement or short response time to any event in the serial communication. BDM Clock (Target MCU) Target Transmits ACK Pulse High-Impedance 32 Cycles 16 Cycles High-Impedance Speedup Pulse Minimum Delay From the BDM Command BKGD Pin Earliest Start of Next Bit 16th Tick of the Last Command Bit Figure 86. Target acknowledge pulse (ACK) MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS NOTE If the ACK pulse was issued by the target, the host assumes the previous command was executed. If the CPU enters wait or stop prior to executing a hardware command, the ACK pulse will not be issued meaning that the BDM command was not executed. After entering wait or stop mode, the BDM command is no longer pending. Figure 87 shows the ACK handshake protocol in a command level timing diagram. The READ_BYTE instruction is used as an example. First, the 8-bit instruction opcode is sent by the host, followed by the address of the memory location to be read. The target BDM decodes the instruction. A bus cycle is grabbed (free or stolen) by the BDM and it executes the READ_BYTE operation. Having retrieved the data, the BDM issues an ACK pulse to the host controller, indicating that the addressed byte is ready to be retrieved. After detecting the ACK pulse, the host initiates the byte retrieval process. Note that data is sent in the form of a word, and the host needs to determine which is the appropriate byte, based on whether the address was odd or even. Target BKGD Pin READ_BYTE Host Host (2) Bytes are Retrieved Byte Address New BDM Command Host Target Target BDM Issues the ACK Pulse (out of scale) BDM Executes the READ_BYTE Command BDM Decodes the Command Figure 87. Handshake protocol at command level Differently from the normal bit transfer (where the host initiates the transmission), the serial interface ACK handshake pulse is initiated by the target MCU by issuing a negative edge on the BKGD pin. The hardware handshake protocol in Figure 86 specifies the timing when the BKGD pin is being driven, so the host should follow this timing constraint to avoid the risk of an electrical conflict on the BKGD pin. NOTE The only place the BKGD pin can have an electrical conflict is when one side is driving low and the other side is issuing a speedup pulse (high). Other "highs" are pulled rather than driven. The time of the speedup pulse can become lengthy at low rates, and so the potential conflict time becomes longer as well. The ACK handshake protocol does not support nested ACK pulses. If a BDM command is not acknowledge by an ACK pulse, the host needs to abort the pending command first in order to be able to issue a new BDM command. When the CPU enters wait or stop while the host issues a hardware command (e.g., WRITE_BYTE), the target discards the incoming command due to the wait or stop being detected. Therefore, the command is not acknowledged by the target, which means that the ACK pulse will not be issued. After a certain time the host (not aware of stop or wait) should decide to abort any possible pending ACK pulse, to be sure a new command can be issued. The protocol provides a mechanism in which a command, and its corresponding ACK, can be aborted. NOTE The ACK pulse does not provide a timeout. This means for the GO_UNTIL(266) command, it cannot be distinguished if a stop or wait has been executed (command discarded and ACK not issued), or if the "UNTIL" condition (BDM active) is just not reached yet. Therefore, where the ACK pulse of a command is not issued, the possible pending command should be aborted before issuing a new command. See the handshake abort procedure described in Section 4.22.4.8, "Hardware handshake abort procedure". MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.22.4.8 Hardware handshake abort procedure The abort procedure is based on the SYNC command. To abort a command which had not issued the corresponding ACK pulse, the host controller should generate a low pulse on the BKGD pin by driving it low for at least 128 serial clock cycles, and then driving it high for one serial clock cycle, providing a speedup pulse. By detecting this long low pulse on the BKGD pin, the target executes the SYNC protocol, see Section 4.22.4.9, "SYNC -- request timed reference pulse", and assumes that the pending command, and therefore the related ACK pulse, are being aborted. Therefore, after the SYNC protocol has been completed, the host is free to issue new BDM commands. For BDM firmware READ or WRITE commands, it can not be guaranteed that the pending command is aborted, when issuing a SYNC before the corresponding ACK pulse. There is a short latency time from the time the READ or WRITE access begins until it is finished and the corresponding ACK pulse is issued. The latency time depends on the firmware READ or WRITE command that is issued and on the selected bus clock rate. When the SYNC command starts during this latency time, the READ or WRITE command will not be aborted, but the corresponding ACK pulse will be aborted. A pending GO, TRACE1 or GO_UNTIL(266) command can not be aborted. Only the corresponding ACK pulse can be aborted by the SYNC command. Although it is not recommended, the host could abort a pending BDM command by issuing a low pulse on the BKGD pin, shorter than 128 serial clock cycles, which will not be interpreted as the SYNC command. The ACK is actually aborted when a negative edge is perceived by the target in the BKGD pin. The short abort pulse should have at least 4 clock cycles keeping the BKGD pin low, to allow the negative edge to be detected by the target. In this case, the target will not execute the SYNC protocol, but the pending command will be aborted along with the ACK pulse. The potential problem with this abort procedure is when there is a conflict between the ACK pulse and the short abort pulse, where the target may not perceive the abort pulse. The worst case is when the pending command is a read command (i.e., READ_BYTE). If the abort pulse is not perceived by the target, the host will attempt to send a new command after the abort pulse was issued, while the target expects the host to retrieve the accessed memory byte. In this case, host and target will run out of synchronism. However, if the command to be aborted is not a read command, the short abort pulse could be used. After a command is aborted, the target assumes the next negative edge, after the abort pulse, is the first bit of a new BDM command. NOTE The details about the short abort pulse are being provided only as a reference for the reader to better understand the BDM internal behavior. It is not recommended that this procedure be used in a real application. Since the host knows the target serial clock frequency, the SYNC command (used to abort a command) does not need to consider the lower possible target frequency. The host could issue a SYNC very close to the 128 serial clock cycles length, providing a small overhead on the pulse length, to assure the SYNC pulse will not be misinterpreted by the target. See Section 4.22.4.9, "SYNC -- request timed reference pulse". Figure 88 shows a SYNC command being issued after a READ_BYTE, which aborts the READ_BYTE command. Note that, after the command is aborted, a new command could be issued by the host computer. SYNC Response From the Target (Out of Scale) READ_BYTE CMD is Aborted by the SYNC Request (Out of Scale) BKGD Pin READ_BYTE Host Memory Address READ_STATUS Target Host BDM Decode and Starts to Execute the READ_BYTE Command Target New BDM Command Host Target New BDM Command Figure 88. ACK abort procedure at the command level NOTE Figure 88 does not represent the signals in a true timing scale. Figure 89 shows a conflict between the ACK pulse and the SYNC request pulse. This conflict could occur if a POD device is connected to the target BKGD pin and the target is already in debug active mode. Consider that the target CPU is executing a pending BDM command at the exact moment the POD is being connected to the BKGD pin. In this case, an ACK pulse is issued along with the SYNC command. In this case, there is an electrical conflict between the ACK speedup pulse and the SYNC pulse. Since this is not a probable situation, the protocol does not prevent this conflict from happening. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS At Least 128 Cycles BDM Clock (Target MCU) Target MCU Drives to BKGD Pin Host Drives SYNC To BKGD Pin ACK Pulse High-impedance Host and Target Drive to BKGD Pin Electrical Conflict Speedup Pulse Host SYNC Request Pulse BKGD Pin 16 Cycles Figure 89. ACK pulse and sync request conflict NOTE This information is being provided so that the MCU integrator will be aware that such a conflict could occur. The hardware handshake protocol is enabled by the ACK_ENABLE and disabled by the ACK_DISABLE BDM commands. This provides backwards compatibility with the existing POD devices, which are not able to execute the hardware handshake protocol. It also allows for new POD devices supporting the hardware handshake protocol, to freely communicate with the target device. If desired, without the need for waiting for the ACK pulse. The commands are described as follows: * ACK_ENABLE -- enables the hardware handshake protocol. The target will issue the ACK pulse when a CPU command is executed by the CPU. The ACK_ENABLE command itself also has the ACK pulse as a response. * ACK_DISABLE -- disables the ACK pulse protocol The host needs to use the worst case delay time at the appropriate places in the protocol. The default state of the BDM after reset is hardware handshake protocol disabled. All the read commands will ACK (if enabled) when the data bus cycle has completed and the data is then ready for reading out by the BKGD serial pin. All the write commands will ACK (if enabled) after the data has been received by the BDM through the BKGD serial pin, and when the data bus cycle is complete. See Section 4.22.4.3, "BDM hardware commands" and Section 4.22.4.4, "Standard BDM firmware commands" for more information on the BDM commands. The ACK_ENABLE sends an ACK pulse when the command has been completed. This feature could be used by the host to evaluate if the target supports the hardware handshake protocol. If an ACK pulse is issued in response to this command, the host knows that the target supports the hardware handshake protocol. If the target does not support the hardware handshake protocol the ACK pulse is not issued. In this case, the ACK_ENABLE command is ignored by the target since it is not recognized as a valid command. The BACKGROUND command issues an ACK pulse when the CPU changes from normal to background mode. The ACK pulse related to this command could be aborted using the SYNC command. The GO command issues an ACK pulse when the CPU exits from background mode. The ACK pulse related to this command could be aborted using the SYNC command. The GO_UNTIL(266) command is equivalent to a GO command with exception that the ACK pulse, in this case, is issued when the CPU enters into background mode. This command is an alternative to the GO command and should be used when the host wants to trace if a breakpoint match occurs and causes the CPU to enter active background mode. Note that the ACK is issued whenever the CPU enters BDM, which could be caused by a breakpoint match or by a BGND instruction being executed. The ACK pulse related to this command could be aborted using the SYNC command. The TRACE1 command has the related ACK pulse issued when the CPU enters background active mode after one instruction of the application program is executed. The ACK pulse related to this command could be aborted using the SYNC command. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.22.4.9 SYNC -- request timed reference pulse The SYNC command is unlike other BDM commands, because the host does not necessarily know the correct communication speed to use for BDM communications until after it has analyzed the response to the SYNC command. To issue a SYNC command, the host should perform the following steps: 1. Drive the BKGD pin low for at least 128 cycles at the lowest possible BDM serial communication frequency (The lowest serial communication frequency is determined by the settings for the VCO clock (CPMUSYNR). The BDM clock frequency is always VCO clock frequency divided by 8.) 2. Drive BKGD high for a brief speedup pulse to get a fast rise time (this speedup pulse is typically one cycle of the host clock.) 3. Remove all drive to the BKGD pin so it reverts to high-impedance. 4. Listen to the BKGD pin for the sync response pulse. Upon detecting the SYNC request from the host, the target performs the following steps: 1. Discards any incomplete command received or bit retrieved. 2. Waits for BKGD to return to a logic one. 3. Delays 16 cycles to allow the host to stop driving the high speedup pulse. 4. Drives BKGD low for 128 cycles at the current BDM serial communication frequency. 5. Drives a one-cycle high speedup pulse to force a fast rise time on BKGD. 6. Removes all drive to the BKGD pin so it reverts to high-impedance. The host measures the low time of this 128 cycle SYNC response pulse and determines the correct speed for subsequent BDM communications. Typically, the host can determine the correct communication speed within a few percent of the actual target speed, and the communication protocol can easily tolerate speed errors of several percent. As soon as the SYNC request is detected by the target, any partially received command or bit retrieved is discarded. This is referred to as a soft-reset, equivalent to a time-out in the serial communication. After the SYNC response, the target will consider the next negative edge (issued by the host) as the start of a new BDM command or the start of new SYNC request. Another use of the SYNC command pulse is to abort a pending ACK pulse. The behavior is exactly the same as in a regular SYNC command. Note that one of the possible causes for a command to not be acknowledged by the target is a host-target synchronization problem. In this case, the command may not have been understood by the target, so an ACK response pulse will not be issued. 4.22.4.10 Instruction tracing When a TRACE1 command is issued to the BDM in active BDM, the CPU exits the standard BDM firmware and executes a single instruction in the user code. Once this has occurred, the CPU is forced to return to the standard BDM firmware, the BDM is active, and ready to receive a new command. If the TRACE1 command is issued again, the next user instruction will be executed. This facilitates stepping or tracing through the user code one instruction at a time. If an interrupt is pending when a TRACE1 command is issued, the interrupt stacking operation occurs but no user instruction is executed. Once back in standard BDM firmware execution, the program counter points to the first instruction in the interrupt service routine. Be aware when tracing through the user code that the execution of the user code is done step by step, but peripherals are free running. Hence possible timing relations between CPU code execution and occurrence of events of other peripherals no longer exist. Do not trace the CPU instruction BGND used for soft breakpoints. Tracing over the BGND instruction will result in a return address pointing to BDM firmware address space. When tracing through user code which contains stop or wait instructions the following will happen when the stop or wait instruction is traced: The CPU enters stop or wait mode and the TRACE1 command can not be finished before leaving the low power mode. This is the case because BDM active mode can not be entered after the CPU executed the stop instruction. However, all BDM hardware commands except the BACKGROUND command are operational after tracing a stop or wait instruction, and still being in stop or wait mode. If system stop mode is entered (all bus masters are in stop mode), no BDM command is operational. As soon as stop or wait mode is exited, the CPU enters BDM active mode and the saved PC value points to the entry of the corresponding interrupt service routine. If the handshake feature is enabled, the corresponding ACK pulse of the TRACE1 command will be discarded when tracing a stop or wait instruction. Hence, there is no ACK pulse when BDM active mode is entered as part of the TRACE1 command, after CPU exited from stop or wait mode. All valid commands sent during CPU being in stop or wait mode or after CPU exited from stop or wait mode will have an ACK pulse. The handshake feature becomes disabled only when system stop mode has been reached. After a system stop mode, the handshake feature must be enabled again by sending the ACK_ENABLE command. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.22.4.11 Serial communication timeout The host initiates a host-to-target serial transmission by generating a falling edge on the BKGD pin. If BKGD is kept low for more than 128 target clock cycles, the target understands that a SYNC command was issued. In this case, the target will keep waiting for a rising edge on BKGD, to answer the SYNC request pulse. If the rising edge is not detected, the target will keep waiting forever without any timeout limit. Consider now the case where the host returns BKGD to a logic one before 128 cycles. This is interpreted as a valid bit transmission, and not as a SYNC request. The target will keep waiting for another falling edge, marking the start of a new bit. If, a new falling edge is not detected by the target within 512 clock cycles, since the last falling edge, a timeout occurs and the current command is discarded without affecting memory or the operating mode of the MCU. This is referred to as a soft-reset. If a read command is issued, but the data is not retrieved within 512 serial clock cycles, a soft-reset will occur causing the command to be disregarded. The data is not available for retrieval after the timeout has occurred. This is expected behavior if the handshake protocol is not enabled. To allow the data to be retrieved, even with a large clock frequency mismatch (between BDM and CPU) when the hardware handshake protocol is enabled, the timeout between a read command and the data retrieval is disabled. Therefore, the host could wait for more then 512 serial clock cycles, and still be able to retrieve the data from an issued read command. However, once the handshake pulse (ACK pulse) is issued, the timeout feature is re-activated, meaning that the target will timeout after 512 clock cycles. The host needs to retrieve the data within a 512 serial clock cycles time frame after the ACK pulse had been issued. After that period, the read command is discarded and the data is no longer available for retrieval. Any negative edge in the BKGD pin after the timeout period is considered to be a new command or a SYNC request. Note that whenever a partially issued command, or partially retrieved data has occurred, the timeout in the serial communication is active. This means that if a time frame higher than 512 serial clock cycles is observed between two consecutive negative edges and the command being issued or data being retrieved is not complete, a soft-reset will occur causing the partially received command or data retrieved to be disregarded. The next negative edge in the BKGD pin, after a soft-reset has occurred, is considered by the target as the start of a new BDM command, or the start of a SYNC request pulse. 4.23 S12 clock, reset, and power management unit (9S12I128PIMV1) 4.23.1 Introduction This specification describes the function of the Clock, Reset, and Power Management Unit (9S12I128PIMV1). * The Pierce oscillator (OSCLCP) provides a robust, low noise and low power external clock source. It is designed for optimal start-up margin with typical crystal oscillators * The voltage regulator (IVREG) operates from the range 3.13 to 5.5 V. It provides all the required chip internal voltages and voltage monitors * The Phase Locked Loop (PLL) provides a highly accurate frequency multiplier with internal filter * The Internal Reference Clock (IRC1M) provides a1.0 MHz clock 4.23.1.1 Features The Pierce Oscillator (OSCLCP) contains circuitry to dynamically control current gain in the output amplitude. This ensures a signal with low harmonic distortion, low power, and good noise immunity. * Supports crystals or resonators from 4.0 to 16 MHz * High noise immunity due to input hysteresis and spike filtering * Low RF emissions with peak-to-peak swing limited dynamically * Transconductance (gm) sized for optimum start-up margin for typical crystals * Dynamic gain control eliminates the need for external current limiting resistor * Integrated resistor eliminates the need for external bias resistor * Low power consumption: Operates from an internal 1.8 V (nominal) supply, amplitude control limits power The Voltage Regulator (IVREG) has the following features: * Input voltage range from 3.13 to 5.5 V * Low voltage detect (LVD) with low voltage interrupt (LVI) * Power-on reset (POR) * Low voltage reset (LVR) MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS The Phase Locked Loop (PLL) has the following features: * Highly accurate and phase locked frequency multiplier * Configurable internal filter for best stability and lock time * Frequency modulation for defined jitter and reduced emission * Automatic frequency lock detector * Interrupt request on entry or exit from locked condition * Reference clock either external (crystal) or internal square wave (1.0 MHz IRC1M) based * PLL stability is sufficient for LIN communication, even if using IRC1M as reference clock The Internal Reference Clock (IRC1M) has the following features: * Trimmable in frequency * Factory trimmed value for 1.0 MHz in Flash memory, can be overwritten by application if required Other features of the 9S12I128PIMV1 include * Clock monitor to detect loss of crystal * Bus Clock Generator -- Clock switch to select either PLLCLK or external crystal/resonator based bus clock -- PLLCLK divider to adjust system speed * System Reset generation from the following possible sources: -- Power-on reset (POR) -- Low voltage reset (LVR) -- Illegal address access -- COP timeout -- Loss of oscillation (clock monitor fail) -- External pin RESET 4.23.1.2 Modes of operation This subsection lists and briefly describes all operating modes supported by the 9S12I128PIMV1. 4.23.1.2.1 Run mode The voltage regulator is in Full Performance mode (FPM). The Phase Locked Loop (PLL) is on. The Internal Reference Clock (IRC1M) is on. * PLL Engaged Internal (PEI) -- This is the default mode after system reset and power-on reset. -- The bus clock is based on the PLLCLK. -- After reset the PLL is configured for 64 MHz VCOCLK operation. Post divider is 0x03, so PLLCLK is VCOCLK divided by 4, that is 16 MHz and bus clock is 8.0 MHz. The PLL can be re-configured for other bus frequencies. -- The reference clock for the PLL (REFCLK) is based on internal reference clock IRC1M * PLL Engaged External (PEE) -- The bus clock is based on the PLLCLK. -- This mode can be entered from default mode PEI by performing the following steps: - Configure the PLL for desired bus frequency. - Program the reference divider (REFDIV[3:0] bits) to divide down oscillator frequency if necessary. - Enable the external oscillator (OSCE bit) * PLL Bypassed External (PBE) -- The bus clock is based on the oscillator clock (OSCCLK). -- This mode can be entered from default mode PEI by performing the following steps: - Enable the external oscillator (OSCE bit) - Wait for oscillator to start up (UPOSC=1) - Select the oscillator clock (OSCCLK) as bus clock (PLLSEL=0). -- The PLLCLK is still on to filter possible spikes of the external oscillator clock. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.23.1.2.2 Wait mode For 9S12I128PIMV1 Wait mode is the same as Run mode. 4.23.1.2.3 Stop mode This mode is entered by executing the CPU STOP instruction. The voltage regulator is in Reduced Power mode (RPM). The Phase Locked Loop (PLL) is off. The internal reference clock (IRC1M) is off. Core clock, bus clock and BDM clock are stopped. Depending on the setting of the PSTP and the OSCE bit, Stop mode can be differentiated between Full Stop mode (PSTP = 0 or OSCE=0) and Pseudo Stop mode (PSTP = 1 and OSCE=1). * Full Stop mode (PSTP = 0 or OSCE=0) The external oscillator (OSCLCP) is disabled. After wake-up from Full Stop mode the core clock and bus clock are running on PLLCLK (PLLSEL=1). After wake-up from Full Stop mode the COP and RTI are running on IRCCLK (COPOSCSEL=0, RTIOSCSEL=0). * Pseudo Stop Mode (PSTP = 1 and OSCE=1) The external oscillator (OSCLCP) continues to run. If the respective enable bits are set the COP and RTI will continue to run. The clock configuration bits PLLSEL, COPOSCSEL, RTIOSCSEL are unchanged. NOTE When starting up the external oscillator (either by programming OSCE bit to 1 or on exit from Full Stop mode with OSCE bit already 1), the software must wait for a minimum time equivalent to the startup-time of the external oscillator tUPOSC before entering Pseudo Stop mode. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.23.1.3 9S12I128PIMV1 block diagram Illegal Address Access MMC VDD, VDDF ILAF (core supplies) Low Voltage Interrupt VDDRX VDDRX VSS LVDS Low Voltage Interrupt LVIE Low Voltage Reset VDDRX VSSRX Voltage Regulator 3.13 to 5.5V LVRF Power-On Detect S12CPMU PORF RESET Clock Monitor Loop Controlled EXTAL Pierce Oscillator (OSCLCP) XTAL 4.0 MHz16 MH COP timeout Power-On Reset System Reset Reset Generator monitor fail Oscillator status Interrupt OSCIE UPOSC=0 sets PLLSEL bit CAN_OSCCLK OSCCLK adaptive & (to MSCAN) spike OSCFILT[4:0] filter PLLSEL UPOSC OSCBW REFDIV[3:0] IRCTRIM[9:0] Reference Divider PSTP Internal Reference Clock (IRC1M) OSCE POSTDIV[4:0] Post Divider 1,2,...,32 divide by 4 ECLK2X (Core Clock) PLLCLK ECLK divide by 2 (Bus Clock) IRCCLK (to LCD) VCOFRQ[1:0] divide by 8 VCOCLK Lock detect REFCLK FBCLK Phase locked Loop with internal Filter (PLL) BDM Clock REFFRQ[1:0] LOCK LOCKIE PLL Lock Interrupt Divide by 2*(SYNDIV+1) UPOSC SYNDIV[5:0] RTIE UPOSC=0 clears IRCCLK OSCCLK IRCCLK COP timeout COPCLK COP to Reset Watchdog Generator OSCCLK COPOSCSEL PCE CPMUCOP RTI Interrupt Real Time RTICLK Interrupt (RTI) RTIOSCSEL PRE CPMURTI Figure 90. Block diagram of 9S12I128PIMV1 MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Figure 91 shows a block diagram of the OSCLCP. OSCCLK Peak Detector Gain Control VDD = 1.8 V VSS Rf XTAL EXTAL Figure 91. OSCLCP block diagram 4.23.2 Signal description This section lists and describes the signals that connect off chip. 4.23.2.1 RESET Pin RESET is an active-low bidirectional pin. As an input, it initializes the MCU asynchronously to a known start-up state. As an open-drain output, it indicates that an MCU-internal reset has been triggered. 4.23.2.2 EXTAL and XTAL These pins provide the interface for a crystal to control the internal clock generator circuitry. EXTAL is the external clock input or the input to the crystal oscillator amplifier. XTAL is the output of the crystal oscillator amplifier. The MCU internal OSCCLK is derived from the EXTAL input frequency. If OSCE=0, the EXTAL pin is pulled down by an internal resistor of approximately 200 k, and the XTAL pin is pulled down by an internal resistor of approximately 700 k. NOTE NXP recommends an evaluation of the application board and chosen resonator or crystal by the resonator or crystal supplier. Loop controlled circuit is not suited for overtone resonators and crystals. 4.23.2.3 VSS -- ground pin VSS must be grounded. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.23.2.4 VDDRX, VSSRX-- regulator power input pin and pad supply pins VDDRX is the power input of IVREG and the PAD positive supply pin. All currents sourced into the regulator loads flow through this pin.The VDDRX/VSSX supply domain is monitored by the low voltage reset circuit. An off-chip decoupling capacitor (100 nF...220 nF, X7R ceramic) between VDDRX and VSSX can further improve the quality of this supply. 4.23.2.5 VDD -- internal regulator output supply (core logic) Node VDD is a device internal supply output of the voltage regulator that provides the power supply for the core logic. This supply domain is monitored by the low voltage reset circuit. 4.23.2.6 VDDF -- internal regulator output supply (NVM logic) Node VDDF is a device internal supply output of the voltage regulator that provides the power supply for the NVM logic. This supply domain is monitored by the low voltage reset circuit 4.23.3 Memory map and registers This section provides a detailed description of all registers accessible in the 9S12I128PIMV1. 4.23.3.1 Module memory map The 9S12I128PIMV1 registers are shown in Table 400. Table 400. CPMU register summary Address Name 0x0034 CPMU SYNR 0x0035 CPMU REFDIV 0x0036 CPMU POSTDIV 0x0037 CPMUFLG 0x0038 CPMUINT 0x0039 CPMUCLKS 0x003A CPMUPLL 0x003B CPMURTI 0x003C CPMUCOP 0x003D RESERVEDC Bit 7 R W R W R 6 5 4 3 VCOFRQ[1:0] 2 W R 0 REFFRQ[1:0] 0 0 0 RTIF PORF LVRF 0 0 W R W R RTIE PLLSEL PSTP 0 0 RTDEC RTR6 WCOP RSBCK 0 0 W R W R W R Bit 0 SYNDIV[5:0] 0 REFDIV[3:0] POSTDIV[4:0] W R 1 LOCKIF LOCKIE LOCK OSCIF UPOSC 0 0 PRE PCE RTI OSCSEL COP OSCSEL 0 0 0 0 RTR2 RTR1 RTR0 CR2 CR1 CR0 0 0 0 0 0 FM1 FM0 RTR5 RTR4 RTR3 0 0 0 0 0 WRTMASK 0 ILAF OSCIE 0 W = Unimplemented or Reserved MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 400. CPMU register summary (continued) Address Name 0x003E RESERVEDC 0x003F CPMU ARMCOP 0x02F0 RESERVED 0x02F1 CPMU LVCTL 0x02F2 0x02F3 0x02F4 0x02F5 RESERVED Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 R 0 0 0 0 0 0 0 0 W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 R 0 0 0 0 0 0 0 0 0 0 0 0 0 LVDS LVIE LVIF 0 0 0 0 R W W R W R W RESERVED R W RESERVED R W RESERVED R W 0x02F6 RESERVEDC 0x02F7 RESERVED 0x02F8 CPMU IRCTRIMH 0x02F9 CPMU IRCTRIML 0x02FA CPMUOSC R 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W R IRCTRIM[9:8] IRCTRIM[7:0] W R 0 TCTRIM[4:0] OSCPINS_E N OSCE OSCBW OSCFILT[4:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W 0x02FB CPMUPROT 0x02FC RESERVEDC R W R PROT 0 W = Unimplemented or Reserved 4.23.3.2 Register descriptions This section describes all the 9S12I128PIMV1 registers and their individual bits. Address order is as listed in Table 400. 4.23.3.2.1 9S12I128PIMV1 synthesizer register (CPMUSYNR) The CPMUSYNR register controls the multiplication factor of the PLL and selects the VCO frequency range. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 401. 9S12I128PIMV1 synthesizer register (CPMUSYNR) 0x0034 7 R 6 5 4 3 VCOFRQ[1:0] W Reset 0 2 1 0 1 1 1 SYNDIV[5:0] 1 0 1 1 Read: Anytime Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register), Else write has no effect. NOTE Writing to this register clears the LOCK and UPOSC status bits. f VCO = 2 x f REF x ( SYNDIV + 1 ) If PLL has locked (LOCK=1) NOTE fVCO must be within the specified VCO frequency lock range. Bus frequency fBUS must not exceed the specified maximum. The VCOFRQ[1:0] bits are used to configure the VCO gain for optimal stability and lock time. For correct PLL operation, the VCOFRQ[1:0] bits have to be selected according to the actual target VCOCLK frequency, as shown in Table 402. Setting the VCOFRQ[1:0] bits incorrectly can result in a non functional PLL (no locking and/or insufficient stability). Table 402. VCO clock frequency selection VCOCLK Frequency Ranges VCOFRQ[1:0] 32 MHz <= fVCO<= 48 MHz 00 48 MHz < fVCO<= 64 MHz 01 Reserved 10 Reserved 11 4.23.3.2.2 9S12I128PIMV1 reference divider register (CPMUREFDIV) The CPMUREFDIV register provides a finer granularity for the PLL multiplier steps when using the external oscillator as reference. Table 403. 9S12I128PIMV1 reference divider register (CPMUREFDIV) 0x0035 7 R 6 REFFRQ[1:0] W Reset 0 0 5 4 0 0 0 0 3 2 1 0 1 1 REFDIV[3:0] 1 1 Read: Anytime Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register), else write has no effect. NOTE Write to this register clears the LOCK and UPOSC status bits. If OSCLCP is enabled (OSCE=1) f OSC f REF = ------------------------------------( REFDIV + 1 ) If OSCLCP is disabled (OSCE=0) f REF = f IRC1M MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS The REFFRQ[1:0] bits are used to configure the internal PLL filter for optimal stability and lock time. For correct PLL operation, the REFFRQ[1:0] bits have to be selected according to the actual REFCLK frequency as shown in Table 404. If IRC1M is selected as REFCLK (OSCE=0) the PLL filter is fixed configured for the 1.0 MHz <= fREF <= 2.0 MHz range. The bits can still be written but will have no effect on the PLL filter configuration. For OSCE=1, setting the REFFRQ[1:0] bits incorrectly can result in a non functional PLL (no locking and/or insufficient stability). Table 404. Reference clock frequency selection if OSC_LCP Is enabled REFCLK Frequency Ranges (OSCE=1) REFFRQ[1:0] 1.0 MHz <= fREF <= 2.0 MHz 00 2.0 MHz < fREF <= 6.0 MHz 01 6.0 MHz < fREF <= 12.0 MHz 10 fREF >12.0 MHz 11 4.23.3.2.3 9S12I128PIMV1 post divider register (CPMUPOSTDIV) The POSTDIV register controls the frequency ratio between the VCOCLK and the PLLCLK. Table 405. 9S12I128PIMV1 post divider register (CPMUPOSTDIV) 0x0036 R 7 6 5 0 0 0 0 0 0 4 3 1 0 1 1 POSTDIV[4:0] W Reset 2 0 0 0 = Unimplemented or Reserved Read: Anytime Write: Anytime if PLLSEL=1. Else write has no effect. If PLL is locked (LOCK=1) f VCO f PLL = ---------------------------------------( POSTDIV + 1 ) If PLL is not locked (LOCK=0) f VCO f PLL = -------------4 If PLL is selected (PLLSEL=1) f PLL f bus = -----------2 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.23.3.2.4 9S12I128PIMV1 flags register (CPMUFLG) This register provides 9S12I128PIMV1 status bits and flags. Table 406. 9S12I128PIMV1 flags register (CPMUFLG) 0x0037 R W Reset 7 6 5 4 RTIF PORF LVRF LOCKIF 0 (268) (269) 0 3 LOCK 0 2 1 0 ILAF OSCIF (270) 0 UPOSC 0 = Unimplemented or Reserved Notes 268. 1. PORF is set to 1 when a power on reset occurs. Unaffected by System Reset. 269. 2. LVRF is set to 1 when a low voltage reset occurs. Unaffected by System Reset. Set by power on reset. 270. 3. ILAF is set to 1 when an illegal address reset occurs. Unaffected by System Reset. Cleared by power on reset. Read: Anytime Write: Refer to each bit for individual write conditions Table 407. CPMUFLG field descriptions Field Description 7 RTIF Real Time Interrupt Flag -- RTIF is set to 1 at the end of the RTI period. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (RTIE=1), RTIF causes an interrupt request. 0 RTI timeout has not yet occurred. 1 RTI timeout has occurred. 6 PORF Power on Reset Flag -- PORF is set to 1 when a power on reset occurs. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Power on reset has not occurred. 1 Power on reset has occurred. 5 LVRF Low Voltage Reset Flag -- LVRF is set to 1 when a low voltage reset occurs. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Low voltage reset has not occurred. 1 Low voltage reset has occurred. 4 LOCKIF PLL Lock Interrupt Flag -- LOCKIF is set to 1 when LOCK status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect.If enabled (LOCKIE=1), LOCKIF causes an interrupt request. 0 No change in LOCK bit. 1 LOCK bit has changed. 3 LOCK Lock Status Bit -- LOCK reflects the current state of PLL lock condition. Writes have no effect. While PLL is unlocked (LOCK=0) fPLL is fVCO / 4 to protect the system from high core clock frequencies during the PLL stabilization time tlock. 0 VCOCLK is not within the desired tolerance of the target frequency. fPLL = fVCO/4. 1 VCOCLK is within the desired tolerance of the target frequency. fPLL = fVCO/(POSTDIV+1). 2 ILAF Illegal Address Reset Flag -- ILAF is set to 1 when an illegal address reset occurs. Refer to MMC chapter for details. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Illegal address reset has not occurred. 1 Illegal address reset has occurred. 1 OSCIF Oscillator Interrupt Flag -- OSCIF is set to 1 when UPOSC status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect.If enabled (OSCIE=1), OSCIF causes an interrupt request. 0 No change in UPOSC bit. 1 UPOSC bit has changed. 0 UPOSC Oscillator Status Bit -- UPOSC reflects the status of the oscillator. Writes have no effect. While UPOSC=0 the OSCCLK going to the MSCAN module is off. Entering Full Stop Mode UPOSC is cleared. 0 The oscillator is off or oscillation is not qualified by the PLL. 1 The oscillator is qualified by the PLL. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS NOTE The adaptive oscillator filter uses the VCO clock as a reference to continuously qualify the external oscillator clock. As a result, the PLL is always active and a valid PLL configuration is required for the system to work properly. Furthermore, the adaptive oscillator filter is used to determine the status of the external oscillator (reflected in the UPOSC bit). Since this function also relies on the VCO clock, loosing PLL lock status (LOCK=0, except for entering Pseudo Stop mode) means loosing the oscillator status information as well (UPOSC=0). 4.23.3.2.5 9S12I128PIMV1 interrupt enable register (CPMUINT) This register enables 9S12I128PIMV1 interrupt requests. Table 408. 9S12I128PIMV1 interrupt enable register (CPMUINT) 0x0038 7 R RTIE W Reset 0 6 5 0 0 0 0 4 LOCKIE 0 3 2 1 0 0 0 0 0 0 3 2 1 0 PRE PCE RTI OSCSEL COP OSCSEL 0 0 0 0 OSCIE 0 0 = Unimplemented or Reserved Read: Anytime Write: Anytime Table 409. CRGINT field descriptions Field 7 RTIE Description Real Time Interrupt Enable Bit 0 Interrupt requests from RTI are disabled. 1 Interrupt will be requested whenever RTIF is set. 4 LOCKIE PLL Lock Interrupt Enable Bit 0 PLL LOCK interrupt requests are disabled. 1 Interrupt will be requested whenever LOCKIF is set. 1 OSCIE Oscillator Corrupt Interrupt Enable Bit 0 Oscillator Corrupt interrupt requests are disabled. 1 Interrupt will be requested whenever OSCIF is set. 4.23.3.2.6 9S12I128PIMV1 clock select register (CPMUCLKS) This register controls 9S12I128PIMV1 clock selection. Table 410. 9S12I128PIMV1 clock select register (CPMUCLKS) 0x0039 R W Reset 7 6 PLLSEL PSTP 1 0 5 4 0 0 0 0 = Unimplemented or Reserved Read: Anytime Write: 1. 2. Only possible if PROT=0 (CPMUPROT register) in all MCU modes (Normal and Special mode). All bits in Special mode (if PROT=0). MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 3. 4. PLLSEL, PSTP, PRE, PCE, RTIOSCSEL: In Normal mode (if PROT=0). COPOSCSEL: In Normal mode (if PROT=0) until CPMUCOP write once is taken. If COPOSCSEL was cleared by UPOSC=0 (entering Full Stop mode with COPOSCSEL=1 or insufficient OSCCLK quality), then COPOSCSEL can be set again once. NOTE After writing CPMUCLKS register, it is strongly recommended to read back CPMUCLKS register to make sure that write of PLLSEL, RTIOSCSEL and COPOSCSEL was successful. Table 411. CPMUCLKS descriptions Field 7 PLLSEL Description PLL Select Bit This bit selects the PLLCLK as source of the system clocks (core clock and bus clock). PLLSEL can only be set to 0, if UPOSC=1. UPOSC= 0 sets the PLLSEL bit. Entering Full Stop mode sets the PLLSEL bit. 0 System clocks are derived from OSCCLK if oscillator is up (UPOSC=1, fBUS = fOSC / 2. 1 System clocks are derived from PLLCLK, fBUS = fPLL / 2. 6 PSTP Pseudo Stop Bit This bit controls the functionality of the oscillator during Stop mode. 0 Oscillator is disabled in Stop mode (Full Stop mode). 1 Oscillator continues to run in Stop mode (Pseudo Stop mode), option to run RTI and COP. Note: Pseudo Stop mode allows for faster STOP recovery and reduces the mechanical stress and aging of the resonator in case of frequent STOP conditions at the expense of a slightly increased power consumption. Note: When starting up the external oscillator (either by programming OSCE bit to 1 or on exit from Full Stop mode with OSCE bit is already 1) the software must wait for a minimum time equivalent to the startup time of the external oscillator tUPOSC before entering Pseudo Stop mode. 3 PRE RTI Enable During Pseudo Stop Bit -- PRE enables the RTI during Pseudo Stop mode. 0 RTI stops running during Pseudo Stop mode. 1 RTI continues running during Pseudo Stop mode if RTIOSCSEL=1. Note: If PRE=0 or RTIOSCSEL=0 then the RTI will go static while Stop mode is active. The RTI counter will not be reset. 2 PCE COP Enable During Pseudo Stop Bit -- PCE enables the COP during Pseudo Stop mode. 0 COP stops running during Pseudo Stop mode 1 COP continues running during Pseudo Stop mode if COPOSCSEL=1 Note: If PCE=0 or COPOSCSEL=0 then the COP will go static while Stop mode is active. The COP counter will not be reset. 1 RTIOSCSEL RTI Clock Select-- RTIOSCSEL selects the clock source to the RTI. Either IRCCLK or OSCCLK. Changing the RTIOSCSEL bit re-starts the RTI timeout period. RTIOSCSEL can only be set to 1, if UPOSC=1. UPOSC= 0 clears the RTIOSCSEL bit. 0 RTI clock source is IRCCLK. 1 RTI clock source is OSCCLK. COP Clock Select-- COPOSCSEL selects the clock source to the COP. Either IRCCLK or OSCCLK. Changing the COPOSCSEL bit re-starts the COP timeout period. COPOSCSEL can only be set to 1, if UPOSC=1. 0 COPOSCSEL UPOSC= 0 clears the COPOSCSEL bit. 0 COP clock source is IRCCLK. 1 COP clock source is OSCCLK MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.23.3.2.7 9S12I128PIMV1 PLL control register (CPMUPLL) This register controls the PLL functionality. Table 412. 9S12I128PIMV1 PLL control register (CPMUPLL) 0x003A R 7 6 0 0 0 0 W Reset 5 4 FM1 FM0 0 0 3 2 1 0 0 0 0 0 0 0 0 0 Read: Anytime Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register). Else write has no effect. NOTE Write to this register clears the LOCK and UPOSC status bits. NOTE Care should be taken to ensure that the bus frequency does not exceed the specified maximum when frequency modulation is enabled. NOTE The frequency modulation (FM1 and FM0) can not be used if the Adaptive Oscillator Filter is enabled. Table 413. CPMUPLL field descriptions Field Description 5, 4 FM1, FM0 PLL Frequency Modulation Enable Bits -- FM1 and FM0 enable frequency modulation on the VCOCLK. This is to reduce noise emission. The modulation frequency is fREF divided by 16. See Table 414 for coding. Table 414. FM Amplitude selection FM1 FM0 FM amplitude /fVCO variation 0 0 FM off 0 1 1% 1 0 2% 1 1 4% 4.23.3.2.8 9S12I128PIMV1 RTI control register (CPMURTI) This register selects the timeout period for the Real Time Interrupt. The clock source for the RTI is either IRCCLK or OSCCLK depending on the setting of the RTIOSCSEL bit. In Stop mode with PSTP=1 (Pseudo Stop mode) and RTIOSCSEL=1 the RTI continues to run, else the RTI counter halts in Stop mode. Table 415. 9S12I128PIMV1 RTI control register (CPMURTI) 0x003B R W Reset 7 6 5 4 3 2 1 0 RTDEC RTR6 RTR5 RTR4 RTR3 RTR2 RTR1 RTR0 0 0 0 0 0 0 0 0 Read: Anytime Write: Anytime MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS NOTE A write to this register starts the RTI timeout period. A change of the RTIOSCSEL bit (writing a different value or loosing UPOSC status) re-starts the RTI timeout period. Table 416. CPMURTI field descriptions Field Description 7 RTDEC Decimal or Binary Divider Select Bit -- RTDEC selects decimal or binary based prescaler values. 0 Binary based divider value. See Table 417 1 Decimal based divider value. See Table 418 6-4 RTR[6:4] Real Time Interrupt Prescale Rate Select Bits -- These bits select the prescale rate for the RTI. See Table 417 and Table 418. 3-0 RTR[3:0] Real Time Interrupt Modulus Counter Select Bits -- These bits select the modulus counter target value to provide additional granularity.Table 417 and Table 418 show all possible divide values selectable by the CPMURTI register. Table 417. RTI frequency divide rates for RTDEC = 0 RTR[6:4] = RTR[3:0] 000 (OFF) 001 (210) 010 (211) 011 (212) 100 (213) 101 (214) 110 (215) 111 (216) 0000 (/1) OFF(271) 210 211 212 213 214 215 216 0001 (/2) OFF 2x210 2x211 2x212 2x213 2x214 2x215 2x216 0010 (/3) OFF 3x210 3x211 3x212 3x213 3x214 3x215 3x216 0011 (/4) OFF 4x210 4x211 4x212 4x213 4x214 4x215 4x216 0100 (/5) OFF 5x210 5x211 5x212 5x213 5x214 5x215 5x216 0101 (/6) OFF 6x210 6x211 6x212 6x213 6x214 6x215 6x216 0110 (/7) OFF 7x210 7x211 7x212 7x213 7x214 7x215 7x216 0111 (/8) OFF 8x210 8x211 8x212 8x213 8x214 8x215 8x216 1000 (/9) OFF 9x210 9x211 9x212 9x213 9x214 9x215 9x216 1001 (/10) OFF 10x210 10x211 10x212 10x213 10x214 10x215 10x216 1010 (/11) OFF 11x210 11x211 11x212 11x213 11x214 11x215 11x216 1011 (/12) OFF 12x210 12x211 12x212 12x213 12x214 12x215 12x216 1100 (/13) OFF 13x210 13x211 13x212 13x213 13x214 13x215 13x216 1101 (/14) OFF 14x210 14x211 14x212 14x213 14x214 14x215 14x216 1110 (/15) OFF 15x210 15x211 15x212 15x213 15x214 15x215 15x216 1111 (/16) OFF 16x210 16x211 16x212 16x213 16x214 16x215 16x216 Notes 271. Denotes the default value out of reset.This value should be used to disable the RTI to ensure future backwards compatibility. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 418. RTI frequency divide rates for RTDEC=1 RTR[6:4] = RTR[3:0] 000 (1x103) 001 (2x103) 010 (5x103) 011 (10x103) 100 (20x103) 101 (50x103) 110 (100x103) 111 (200x103) 0000 (/1) 1x103 2x103 5x103 10x103 20x103 50x103 100x103 200x103 0001 (/2) 2x103 4x103 10x103 20x103 40x103 100x103 200x103 400x103 0010 (/3) 3x103 6x103 15x103 30x103 60x103 150x103 300x103 600x103 0011 (/4) 4x103 8x103 20x103 40x103 80x103 200x103 400x103 800x103 0100 (/5) 5x103 10x103 25x103 50x103 100x103 250x103 500x103 1x106 0101 (/6) 6x103 12x103 30x103 60x103 120x103 300x103 600x103 1.2x106 0110 (/7) 7x103 14x103 35x103 70x103 140x103 350x103 700x103 1.4x106 0111 (/8) 8x103 16x103 40x103 80x103 160x103 400x103 800x103 1.6x106 1000 (/9) 9x103 18x103 45x103 90x103 180x103 450x103 900x103 1.8x106 1001 (/10) 10 x103 20x103 50x103 100x103 200x103 500x103 1x106 2x106 1010 (/11) 11 x103 22x103 55x103 110x103 220x103 550x103 1.1x106 2.2x106 1011 (/12) 12x103 24x103 60x103 120x103 240x103 600x103 1.2x106 2.4x106 1100 (/13) 13x103 26x103 65x103 130x103 260x103 650x103 1.3x106 2.6x106 1101 (/14) 14x103 28x103 70x103 140x103 280x103 700x103 1.4x106 2.8x106 1110 (/15) 15x103 30x103 75x103 150x103 300x103 750x103 1.5x106 3x106 1111 (/16) 16x103 32x103 80x103 160x103 320x103 800x103 1.6x106 3.2x106 4.23.3.2.9 9S12I128PIMV1 COP control register (CPMUCOP) This register controls the COP (Computer Operating Properly) watchdog. The clock source for the COP is either IRCCLK or OSCCLK depending on the setting of the COPOSCSEL bit. In Stop mode with PSTP=1(Pseudo Stop mode), COPOSCSEL=1 and PCE=1 the COP continues to run, else the COP counter halts in Stop mode. Table 419. 9S12I128PIMV1 COP control register (CPMUCOP) 0x003C R W Reset 7 6 WCOP RSBCK F 0 5 4 3 0 0 0 0 0 WRTMASK 0 2 1 0 CR2 CR1 CR0 F F F After de-assert of System Reset the values are automatically loaded from the Flash memory. See Device specification for details. = Unimplemented or Reserved Read: Anytime Write: 1. 2. RSBCK: anytime in Special Mode; write to "1" but not to "0" in Normal mode WCOP, CR2, CR1, CR0: -- Anytime in Special mode, when WRTMASK is 0, otherwise it has no effect -- Write once in Normal mode, when WRTMASK is 0, otherwise it has no effect. - Writing CR[2:0] to "000" has no effect, but counts for the "write once" condition. - Writing WCOP to "0" has no effect, but counts for the "write once" condition. When a non-zero value is loaded from Flash to CR[2:0] the COP timeout period is started. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS A change of the COPOSCSEL bit (writing a different value or loosing UPOSC status) re-starts the COP timeout period. In Normal mode the COP timeout period is restarted if either of these conditions is true: 1. Writing a non-zero value to CR[2:0] (anytime in Special mode, once in Normal mode) with WRTMASK = 0. 2. Writing WCOP bit (anytime in Special mode, once in Normal mode) with WRTMASK = 0. 3. Changing RSBCK bit from "0" to "1". In Special mode, any write access to CPMUCOP register restarts the COP timeout period. Table 420. CPMUCOP field descriptions Field Description 7 WCOP Window COP Mode Bit -- When set, a write to the CPMUARMCOP register must occur in the last 25% of the selected period. A write during the first 75% of the selected period generates a COP reset. As long as all writes occur during this window, $55 can be written as often as desired. Once $AA is written after the $55, the timeout logic restarts and the user must wait until the next window before writing to CPMUARMCOP. Table 421 shows the duration of this window for the seven available COP rates. 0 Normal COP operation 1 Window COP operation 6 RSBCK COP and RTI Stop in Active BDM Mode Bit 0 Allows the COP and RTI to keep running in Active BDM mode. 1 Stops the COP and RTI counters whenever the part is in Active BDM mode. 5 WRTMASK 2-0 CR[2:0] Write Mask for WCOP and CR[2:0] Bit -- This write-only bit serves as a mask for the WCOP and CR[2:0] bits while writing the CPMUCOP register. It is intended for BDM writing the RSBCK without changing the content of WCOP and CR[2:0]. 0 Write of WCOP and CR[2:0] has an effect with this write of CPMUCOP 1 Write of WCOP and CR[2:0] has no effect with this write of CPMUCOP. (Does not count for "write once".) COP Watchdog Timer Rate Select -- These bits select the COP timeout rate (see Table 421). Writing a nonzero value to CR[2:0] enables the COP counter and starts the timeout period. A COP counter timeout causes a System Reset. This can be avoided by periodically (before timeout) initializing the COP counter via the CPMUARMCOP register. While all of the following four conditions are true the CR[2:0], WCOP bits are ignored and the COP operates at highest timeout period (2 24 cycles) in normal COP mode (Window COP mode disabled): 1) COP is enabled (CR[2:0] is not 000) 2) BDM mode active 3) RSBCK = 0 4) Operation in Special mode Table 421. COP watchdog rates CR2 CR1 CR0 COPCLK Cycles to Time-out (COPCLK is either IRCCLK or OSCCLK depending on the COPOSCSEL bit) 0 0 0 COP disabled 0 0 1 2 14 0 1 0 2 16 0 1 1 2 18 1 0 0 2 20 1 0 1 2 22 1 1 0 2 23 1 1 1 2 24 MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.23.3.2.10 Reserved register CPMUTEST0 NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in Special mode can alter the 9S12I128PIMV1's functionality. Table 422. Reserved register (CPMUTEST0) 0x003D R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Read: Anytime Write: Only in Special mode 4.23.3.2.11 Reserved register CPMUTEST1 NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in Special mode can alter the 9S12I128PIMV1's functionality. Table 423. Reserved register (CPMUTEST1) 0x003E R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Read: Anytime Write: Only in Special Mode 4.23.3.2.12 9S12I128PIMV1 COP Timer Arm/reset Register (CPMUARMCOP) This register is used to restart the COP timeout period. Table 424. 9S12I128PIMV1 CPMUARMCOP register 0x003F 7 6 5 4 3 2 1 0 R 0 0 0 0 0 0 0 0 W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset 0 0 0 0 0 0 0 0 Read: Always reads $00 Write: Anytime When the COP is disabled (CR[2:0] = "000") writing to this register has no effect. When the COP is enabled by setting CR[2:0] nonzero, the following applies: MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Writing any value other than $55 or $AA causes a COP reset. To restart the COP timeout period write $55 followed by a write of $AA. These writes do not need to occur back-to-back, but the sequence ($55, $AA) must be completed prior to COP end of timeout period to avoid a COP reset. Sequences of $55 writes are allowed. When the WCOP bit is set, $55 and $AA writes must be done in the last 25% of the selected timeout period; writing any value in the first 75% of the selected period will cause a COP reset. 4.23.3.2.13 Low-voltage control register (CPMULVCTL) The CPMULVCTL register allows the configuration of the low-voltage detect features. Table 425. Low-voltage control register (CPMULVCTL) 0x02F1 R 7 6 5 4 3 2 0 0 0 0 0 LVDS 0 0 0 0 0 U W Reset 1 0 LVIE LVIF 0 U The Reset state of LVDS and LVIF depends on the external supplied VDDXR level = Unimplemented or Reserved Read: Anytime Write: LVIE and LVIF are write anytime, LVDS is read only Table 426. CPMULVCTL field descriptions Field Description 2 LVDS Low-voltage Detect Status Bit -- This read-only status bit reflects the voltage level on VDDXR. Writes have no effect. 0 Input voltage VDDXR is above level VLVID or RPM. 1 Input voltage VDDRX is below level VLVIA and FPM. 1 LVIE Low-voltage Interrupt Enable Bit 0 Interrupt request is disabled. 1 Interrupt will be requested whenever LVIF is set. 0 LVIF Low-voltage Interrupt Flag -- LVIF is set to 1 when LVDS status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (LVIE = 1), LVIF causes an interrupt request. 0 No change in LVDS bit. 1 LVDS bit has changed. 4.23.3.2.14 Reserved register CPMUTEST3 NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in Special mode can alter the 9S12I128PIMV1's functionality. Table 427. Reserved register (CPMUTEST3) 0x02F6 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Read: Anytime Write: Only in Special mode MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.23.3.2.15 9S12I128PIMV1 IRC1M trim registers (CPMUIRCTRIMH / CPMUIRCTRIML) Table 429. 9S12I128PIMV1 IRC1M trim high register (CPMUIRCTRIMH) 0x02F8 15 14 R 13 12 11 10 0 TCTRIM[4:0] W Reset F F 9 F F 0 8 IRCTRIM[9:8] 0 F F After de-assert of System Reset a factory programmed trim value is automatically loaded from the Flash memory to provide trimmed Internal Reference Frequency fIRC1M_TRIM. Table 430. 9S12I128PIMV1 IRC1M trim low register (CPMUIRCTRIML) 0x02F9 7 6 5 4 R 2 1 0 F F F F IRCTRIM[7:0] W Reset 3 F F F F After de-assert of System Reset a factory programmed trim value is automatically loaded from the Flash memory to provide trimmed Internal Reference Frequency fIRC1M_TRIM. Read: Anytime Write: Anytime if PROT=0 (CPMUPROT register). Else write has no effect NOTE Writes to these registers while PLLSEL=1 clears the LOCK and UPOSC status bits. Table 431. CPMUIRCTRIMH/L field descriptions Field Description 15-11 TCTRIM IRC1M temperature coefficient Trim Bits Trim bits for the Temperature Coefficient (TC) of the IRC1M frequency. Figure 93 shows the influence of the bits TCTRIM4:0] on the relationship between frequency and temperature. Figure 93 shows an approximate TC variation, relative to the nominal TC of the IRC1M (i.e. for TCTRIM[4:0]=0x00000 or 0x10000). 9-0 IRCTRIM IRC1M Frequency Trim Bits -- Trim bits for Internal Reference Clock After System Reset the factory programmed trim value is automatically loaded into these registers, resulting in an Internal Reference Frequency fIRC1M_TRIM. See device electrical characteristics for value of fIRC1M_TRIM. The frequency trimming consists of two different trimming methods: A rough trimming controlled by bits IRCTRIM[9:6] can be done with frequency leaps of about 6% in average. A fine trimming controlled by the bits IRCTRIM[5:0] can be done with frequency leaps of about 0.3% (this trimming determines the precision of the frequency setting of 0.15%, i.e. 0.3% is the distance between two trimming values). Figure 92 shows the relationship between the trim bits and the resulting IRC1M frequency. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS IRC1M frequency (IRCCLK) IRCTRIM[9:6] 1.5 MHz ...... IRCTRIM[5:0] 1.0 MHz 600 kHz IRCTRIM[9:0] $000 $1FF $3FF Figure 92. IRC1M frequency trimming diagram frequency 111 x11 0 = 0x11111 ... 0x10101 IM R T 0x10100 TC increases TC 0x10011 0x10010 0x10001 TCTRIM[4:0] = 0x10000 or 0x00000 (nominal TC) ] [4:0 T CT RIM [4:0 ]= 0x00001 0x00010 0x00011 0x00100 TC decreases 0x00101 ... 0x01111 0x0 1111 $1FF 150 C - 40 C temperature Figure 93. Influence of TCTRIM[4:0] on the temperature coefficient NOTE The frequency is not necessarily linear with the temperature (in most cases it will not be). The above diagram is meant only to give the direction (positive or negative) of the variation of the TC, relative to the nominal TC. Setting TCTRIM[4:0] at 0x00000 or 0x10000 does not mean that the temperature coefficient will be zero. These two combinations basically switch off the TC compensation module, which result in the nominal TC of the IRC1M. Table 432. TC Trimming of the Frequency of the IRC1M TCTRIM[4:0] IRC1M indicative relative TC variation IRC1M indicative frequency drift for relative TC variation 00000 0 (nominal TC of the IRC) 0% 00001 -0.27% -0.5% 00010 -0.54% -0.9% 00011 -0.81% -1.3% 00100 -1.08% -1.7% MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 432. TC Trimming of the Frequency of the IRC1M (continued) TCTRIM[4:0] IRC1M indicative relative TC variation IRC1M indicative frequency drift for relative TC variation 00101 -1.35% -2.0% 00110 -1.63% -2.2% 00111 -1.9% -2.5% 01000 -2.20% -3.0% 01001 -2.47% -3.4% 01010 -2.77% -3.9% 01011 -3.04 -4.3% 01100 -3.33% -4.7% 01101 -3.6% -5.1% 01110 -3.91% -5.6% 01111 -4.18% -5.9% 10000 0 (nominal TC of the IRC) 0% 10001 +0.27% +0.5% 10010 +0.54% +0.9% 10011 +0.81% +1.3% 10100 +1.07% +1.7% 10101 +1.34% +2.0% 10110 +1.59% +2.2% 10111 +1.86% +2.5% 11000 +2.11% +3.0% 11001 +2.38% +3.4% 11010 +2.62% +3.9% 11011 +2.89% +4.3% 11100 +3.12% +4.7% 11101 +3.39% +5.1% 11110 +3.62% +5.6% 11111 +3.89% +5.9% NOTE Since the IRC1M frequency is not a linear function of the temperature, but more like a parabola, the above relative variation is only an indication and should be considered with care. Be aware that the output frequency varies with the TC trimming. A frequency trimming correction is therefore necessary. The values provided in Table 432 are typical values at ambient temperature which can vary from device to device. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.23.3.2.16 9S12I128PIMV1 oscillator register (CPMUOSC) This register configures the external oscillator (OSCLCP). Table 433. 9S12I128PIMV1 oscillator register (CPMUOSC) 0x02FA R W Reset 7 6 OSCE OSCBW 0 0 5 4 3 OSCPINS_EN 0 2 1 0 0 0 OSCFILT[4:0] 0 0 0 Read: Anytime Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register), else write has no effect. NOTE Write to this register clears the LOCK and UPOSC status bits. NOTE If the chosen VCOCLK-to-OSCCLK ratio divided by two ((fVCO / fOSC)/2) is not an integer number, the filter can not be used and the OSCFILT[4:0] bits must be set to 0. NOTE The frequency modulation (FM1 and FM0) can not be used if the Adaptive Oscillator Filter is enabled. Table 434. CPMUOSC field descriptions Field Description 7 OSCE Oscillator Enable Bit -- This bit enables the external oscillator (OSCLCP). The UPOSC status bit in the CPMUFLG register indicates when the oscillation is stable and OSCCLK can be selected as bus clock or source of the COP or RTI. A loss of oscillation will lead to a clock monitor reset. 0 External oscillator is disabled. REFCLK for PLL is IRCCLK. 1 External oscillator is enabled.Clock monitor is enabled. REFCLK for PLL is external oscillator clock divided by REFDIV. Note: When starting up the external oscillator (either by programming OSCE bit to 1 or on exit from Full Stop mode with OSCE bit already 1) the software must wait for a minimum time equivalent to the startup time of the external oscillator tUPOSC before entering Pseudo Stop mode. 6 OSCBW Oscillator Filter Bandwidth Bit -- If the VCOCLK frequency exceeds 25 MHz wide bandwidth must be selected. The Oscillator Filter is described in more detail in Section 4.23.4.5.2, "The adaptive oscillator filter" 0 Oscillator filter bandwidth is narrow (window for expected OSCCLK edge is one VCOCLK cycle). 1 Oscillator filter bandwidth is wide (window for expected OSCCLK edge is three VCOCLK cycles). Oscillator Pins EXTAL and XTAL Enable Bit If OSCE=1 this read-only bit is set. It can only be cleared with the next reset. 5 Enabling the external oscillator reserves the EXTAL and XTAL pins exclusively for oscillator application. OSCPINS_EN 0 EXTAL and XTAL pins are not reserved for oscillator. 1 EXTAL and XTAL pins exclusively reserved for oscillator. 4-0 OSCFILT Oscillator Filter Bits -- When using the oscillator a noise filter can be enabled, which filters noise from the incoming external oscillator clock and detects if the external oscillator clock is qualified or not (quality status shown by bit UPOSC). The VCOCLK-to-OSCCLK ratio divided by two ((fVCO / fOSC)/2) must be an integer value. This value must be written to the OSCFILT[4:0] bits to enable the Adaptive Oscillator Filter. 0x0000 Adaptive Oscillator Filter disabled, else Adaptive Oscillator Filter enabled] MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.23.3.2.17 9S12I128PIMV1 protection register (CPMUPROT) This register protects the following clock configuration registers from accidental overwrite: CPMUSYNR, CPMUREFDIV, CPMUCLKS, CPMUPLL, CPMUIRCTRIMH/L, and CPMUOSC Table 435. 9S12I128PIMV1 protection register (CPMUPROT) 0x02FB R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PROT W Reset 0 Read: Anytime Write: Anytime Table 436. CPMUPROT field description Field Description 0 Clock Configuration Registers Protection Bit -- This bit protects the clock configuration registers from accidental overwrite (see list of protected registers above). Writing 0x26 to the CPMUPROT register clears the PROT bit, other write accesses set the PROT bit. 0 Protection of clock configuration registers is disabled. 1 Protection of clock configuration registers is enabled. (see list of protected registers above) 4.23.3.2.18 Reserved register CPMUTEST2 NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in Special mode can alter the 9S12I128PIMV1's functionality. Table 437. Reserved register CPMUTEST2 0x02FC R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Read: Anytime Write: Only in Special mode 4.23.4 4.23.4.1 Functional description Phase locked loop with internal filter (PLL) The PLL is used to generate a high speed PLLCLK based on a low frequency REFCLK. The REFCLK is by default the IRCCLK which is trimmed to fIRC1M_TRIM=1.0 MHz. If using the oscillator (OSCE=1) REFCLK will be based on OSCCLK. For increased flexibility, OSCCLK can be divided in a range of 1 to 16 to generate the reference frequency REFCLK using the REFDIV[3:0] bits. Based on the SYNDIV[5:0] bits, the PLL generates the VCOCLK by multiplying the reference clock by a 2, 4, 6,... 126, 128. Based on the POSTDIV[4:0] bits, the VCOCLK can be divided in a range of 1,2, 3, 4, 5, 6,... to 32 to generate the PLLCLK. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS . If Oscillator is enabled (OSCE=1) f OSC f REF = ------------------------------------( REFDIV + 1 ) If Oscillator is disabled (OSCE=0) f REF = f IRC1M f VCO = 2 x f REF x ( SYNDIV + 1 ) If PLL is locked (LOCK=1) f VCO f PLL = ---------------------------------------( POSTDIV + 1 ) If PLL is not locked (LOCK=0) f VCO f PLL = -------------4 If PLL is selected (PLLSEL=1) f PLL f bus = -----------2 NOTE Although it is possible to set the dividers to command a very high clock frequency, do not exceed the specified bus frequency limit for the MCU. Several examples of PLL divider settings are shown in Table 438. The following rules help to achieve optimum stability and shortest lock time: * Use lowest possible fVCO / fREF ratio (SYNDIV value). * Use highest possible REFCLK frequency fREF. Table 438. Examples of PLL divider settings fosc REFDIV[3:0] fREF REFFRQ[1:0] SYNDIV[5:0] fVCO VCOFRQ[1:0] POSTDIV[4:0] fPLL fbus off $00 1.0 MHz 00 $1F 64 MHz 01 $03 16 MHz 8.0 MHz off $00 1.0 MHz 00 $1F 64 MHz 01 $00 64 MHz 32 MHz off $00 1.0 MHz 00 $0F 32 MHz 00 $00 32 MHz 16 MHz 4.0 MHz $00 4.0 MHz 01 $03 32 MHz 01 $00 32 MHz 16 MHz The phase detector inside the PLL compares the feedback clock (FBCLK = VCOCLK/(SYNDIV+1) with the reference clock (REFCLK = (IRC1M or OSCCLK)/(REFDIV+1)). Correction pulses are generated based on the phase difference between the two signals. The loop filter alters the DC voltage on the internal filter capacitor, based on the width and direction of the correction pulse, which leads to a higher or lower VCO frequency. The user must select the range of the REFCLK frequency (REFFRQ[1:0] bits) and the range of the VCOCLK frequency (VCOFRQ[1:0] bits) to ensure that the correct PLL loop bandwidth is set. The lock detector compares the frequencies of the FBCLK and the REFCLK. Therefore, the speed of the lock detector is directly proportional to the reference clock frequency. The circuit determines the lock condition based on this comparison. If PLL LOCK interrupt requests are enabled, the software can wait for an interrupt request and for instance check the LOCK bit. If interrupt requests are disabled, software can poll the LOCK bit continuously (during PLL start-up) or at periodic intervals. In either case, only when the LOCK bit is set, the VCOCLK will have stabilized to the programmed frequency. * The LOCK bit is a read-only indicator of the locked state of the PLL. * The LOCK bit is set when the VCO frequency is within the tolerance, LOCK, and is cleared when the VCO frequency is out of the tolerance, UNl. * Interrupt requests can occur if enabled (LOCKIE = 1) when the lock condition changes, toggling the LOCK bit. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.23.4.2 Startup from reset An example of startup of clock system from Reset is given in Figure 94. System Reset 768 cycles PLLCLK fPLL increasing fVCORST fPLL=32 MHz fPLL=16MHz )( tlock LOCK SYNDIV $1F (default target fVCO=64MHz) POSTDIV $03 (default target fPLL=fVCO/4 = 16MHz) CPU reset state $01 vector fetch, program execution example change of POSTDIV Figure 94. Startup of clock system after reset 4.23.4.3 Stop mode using PLLCLK as bus clock An example of what happens going into Stop mode and exiting Stop mode after an interrupt is shown in Figure 95. Disable PLL Lock interrupt (LOCKIE=0) before going into Stop mode. wake-up CPU execution interrupt STOP instruction continue execution tSTP_REC PLLCLK tlock LOCK Figure 95. Stop mode using PLLCLK as bus clock 4.23.4.4 Full stop mode using oscillator clock as bus clock An example of what happens going into Full Stop mode and exiting Full Stop mode after an interrupt is shown in Figure 96. Disable PLL Lock interrupt (LOCKIE=0) and oscillator status change interrupt (OSCIE=0) before going into Full Stop mode. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS wake-up CPU execution interrupt STOP instruction Core Clock continue execution tSTP_REC tlock PLLCLK OSCCLK UPOSC select OSCCLK as Core/Bus Clock by writing PLLSEL to "0" PLLSEL automatically set when going into Full Stop Mode Figure 96. Full stop mode using oscillator clock as bus clock 4.23.4.5 4.23.4.5.1 External oscillator Enabling the external oscillator An example of how to use the oscillator as Bus Clock is shown in Figure 97. enable external oscillator by writing OSCE bit to one. OSCE crystal/resonator starts oscillating EXTAL UPOSC flag is set upon successful start of oscillation UPOSC OSCCLK select OSCCLK as Core/Bus Clock by writing PLLSEL to zero PLLSEL Core Clock based on PLLCLK based on OSCCLK Figure 97. Enabling the external oscillator MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.23.4.5.2 The adaptive oscillator filter A spike in the oscillator clock can disturb the function of the modules driven by this clock. The Adaptive Oscillator Filter includes two features: 1. Filter noise (spikes) from the incoming external oscillator clock. The filter feature is illustrated in Figure 98. enable external oscillator OSCE configure the Adaptive Oscillator Filter OSC FILT 0 >0 crystal/resonator starts oscillating EXTAL LOCK UPOSC filtered filtered OSCCLK (filtered) Figure 98. Noise filtered by the adaptive oscillator filter 2. Detect severe noise disturbance on external oscillator clock which can not be filtered and indicate the critical situation to the software by clearing the UPOSC and LOCK status bit and setting the OSCIF and LOCKIF flag. An example for the detection of critical noise is illustrated in Figure 99. enable external oscillator OSCE configure the Adaptive Oscillator Filter OSC FILT 0 >0 crystal/resonator starts oscillating phase shift can not be filtered but detected EXTAL LOCK UPOSC OSCCLK (filtered) Figure 99. Critical noise detected by the adaptive oscillator filter NOTE If the LOCK bit is clear due to severe noise disturbance on the external oscillator clock, the PLLCLK is derived from the VCO clock (with its actual frequency) divided by four (see Section 4.23.3.2.3, "9S12I128PIMV1 post divider register (CPMUPOSTDIV)"). The use of the filter function is only possible if the VCOCLK-to-OSCCLK ratio divided by two ((fVCO / fOSC)/2) is an integer number. This integer value must be written to the OSCFILT[4:0] bits. If enabled, the Adaptive Oscillator Filter samples the incoming external oscillator clock signal (EXTAL) with the VCOCLK frequency. Using VCOCLK, a time window is defined of which an edge of the OSCCLK is expected. In case of OSCBW = 1, the width of this window is three VCOCLK cycles, if the OSCBW = 0 it is one VCOCLK cycle. The noise detection is active for certain combinations of OSCFILT[4:0] and OSCBW bit settings, as shown in Table 439. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 439. Noise detection settings OSCFILT[4:0] OSCBW Detection Filter 0 x disabled disabled 1 x disabled active 0 active active 1 disabled active x active active 2 or 3 >=4 NOTE If the VCOCLK frequency is higher than 25 MHz the wide bandwidth must be selected (OSCBW = 1). 4.23.4.6 4.23.4.6.1 System clock configurations PLL engaged internal mode (PEI) This mode is the default mode after System Reset or Power-on Reset. The Bus Clock is based on the PLLCLK, the reference clock for the PLL is internally generated (IRC1M). The PLL is configured to 64 MHz VCOCLK with POSTDIV set to 0x03. If locked (LOCK=1) this results in a PLLCLK of 16 MHz and a Bus Clock of 8.0 MHz. The PLL can be re-configured to other bus frequencies. The clock sources for COP and RTI are based on the internal reference clock generator (IRC1M). 4.23.4.6.2 PLL engaged external mode (PEE) In this mode, the Bus Clock is based on the PLLCLK as well (like PEI). The reference clock for the PLL is based on the external oscillator. The adaptive spike filter and detection logic which uses the VCOCLK to filter and qualify the external oscillator clock can be enabled. The clock sources for COP and RTI can be based on the internal reference clock generator or on the external oscillator clock. This mode can be entered from default mode PEI by performing the following steps: 1. Configure the PLL for desired bus frequency. 2. Optionally the adaptive spike filter and detection logic can be enabled by calculating the integer value for the OSCFIL[4:0] bits and setting the bandwidth (OSCBW) accordingly. 3. Enable the external Oscillator (OSCE bit). 4. Wait for the PLL being locked (LOCK = 1) and the oscillator to start-up and additionally being qualified if the Adaptive Oscillator Filter is enabled (UPOSC =1). 5. Clear all flags in the CPMUFLG register to be able to detect any future status bit change. 6. Optionally status interrupts can be enabled (CPMUINT register). Since the Adaptive Oscillator Filter (adaptive spike filter and detection logic) uses the VCOCLK to continuously filter and qualify the external oscillator clock, losing PLL lock status (LOCK=0), means losing the oscillator status information as well (UPOSC=0). The impact of losing the oscillator status in PEE mode is as follows: * The PLLCLK is derived from the VCO clock (with its actual frequency) divided by four until the PLL locks again. Application software needs to be prepared to deal with the impact of losing the oscillator status at any time. 4.23.4.6.3 PLL bypassed external mode (PBE) In this mode, the Bus Clock is based on the external oscillator clock. The reference clock for the PLL is based on the external oscillator. The adaptive spike filter and detection logic can be enabled which uses the VCOCLK to filter and qualify the external oscillator clock. The clock sources for COP and RTI can be based on the internal reference clock generator or on the external oscillator clock. This mode can be entered from default mode PEI by performing the following steps: 1. Make sure the PLL configuration is valid. 2. Optionally, the adaptive spike filter and detection logic can be enabled by calculating the integer value for the OSCFIL[4:0] bits and setting the bandwidth (OSCBW) accordingly. 3. Enable the external Oscillator (OSCE bit) MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4. 5. 6. 7. Wait for the PLL being locked (LOCK = 1) and the oscillator to start-up, and additionally being qualified if the Adaptive Oscillator Filter is enabled (UPOSC=1). Clear all flags in the CPMUFLG register to be able to detect any status bit change. Optionally status interrupts can be enabled (CPMUINT register). Select the Oscillator Clock (OSCCLK) as Bus Clock (PLLSEL=0) Since the Adaptive Oscillator Filter (adaptive spike filter and detection logic) uses the VCOCLK to continuously filter and qualify the external oscillator clock, losing PLL lock status (LOCK=0) means losing the oscillator status information as well (UPOSC=0). The impact of losing the oscillator status in PBE mode is as follows: * PLLSEL is set automatically and the Bus Clock is switched back to the PLLCLK. * The PLLCLK is derived from the VCO clock (with its actual frequency) divided by four until the PLL locks again. Application software needs to be prepared to deal with the impact of loosing the oscillator status at any time. In the PBE mode, not every noise disturbance can be indicated by bits LOCK and UPOSC (both bits are based on the Bus Clock domain). There are clock disturbances possible, after which UPOSC and LOCK both stay asserted, while occasional pauses on the filtered OSCCLK and resulting Bus Clock occur. The adaptive spike filter is still functional and protects the Bus Clock from frequency overshoot due to spikes on the external oscillator clock. The filtered OSCCLK and resulting Bus Clock will pause until the PLL has stabilized again. 4.23.5 Resets 4.23.5.1 General All reset sources are listed in Table 440. Refer to MCU specification for related vector addresses and priorities. Table 440. Reset summary Reset source Local enable Power-On Reset (POR) None Low Voltage Reset (LVR) None External pin RESET None Illegal Address Reset None Clock Monitor Reset OSCE Bit in CPMUOSC register COP Reset CR[2:0] in CPMUCOP register 4.23.5.2 Description of reset operation Upon detection of any reset in Table 440, an internal circuit drives the RESET pin low for 512 PLLCLK cycles. After 512 PLLCLK cycles, the RESET pin is released. The reset generator of the 9S12I128PIMV1 waits for additional 256 PLLCLK cycles and then samples the RESET pin to determine the originating source. Table 441 shows which vector will be fetched. Table 441. Reset vector selection Sampled RESET Pin (256 cycles after release) Oscillator monitor fail pending COP timeout pending Vector fetch 1 0 0 POR LVR Illegal Address Reset External pin RESET 1 1 X Clock Monitor Reset 1 0 1 COP Reset 0 X X POR LVR Illegal Address Reset External pin RESET MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS NOTE While System Reset is asserted, the PLLCLK runs with the frequency fVCORST. The internal reset of the MCU remains asserted while the reset generator completes the 768 PLLCLK cycles long reset sequence. In case the RESET pin is externally driven low for more than these 768 PLLCLK cycles (External Reset), the internal reset remains asserted longer. RESET S12_CPMU drives RESET pin low fVCORST fVCORST ) ) PLLCLK S12_CPMU releases RESET pin ( ( 512 cycles ) ( 256 cycles possibly RESET driven low externally Figure 100. RESET timing 4.23.5.2.1 Clock monitor reset When the external oscillator is enabled (OSCE=1), in case of a loss of oscillation or the oscillator frequency is below the failure assert frequency fCMFA (see device electrical characteristics for values), the 9S12I128PIMV1 generates a clock monitor reset. In Full Stop mode the external oscillator and the clock monitor are disabled. 4.23.5.2.2 Computer operating properly watchdog (COP) reset The COP (free running watchdog timer) enables the user to check that a program is running and sequencing properly. When the COP is being used, software is responsible for keeping the COP from timing out. If the COP times out, it is an indication that the software is no longer being executed in the intended sequence, and a COP reset is generated. The clock source for the COP is either IRCCLK or OSCCLK, depending on the setting of the COPOSCSEL bit. In Stop mode with PSTP=1 (Pseudo Stop mode), COPOSCSEL=1 and PCE=1 the COP continues to run, else the COP counter halts in Stop mode. Three control bits in the CPMUCOP register allow selection of seven COP timeout periods. When COP is enabled, the program must write $55 and $AA (in this order) to the CPMUARMCOP register during the selected timeout period. Once this is done, the COP timeout period is restarted. If the program fails to do this and the COP times out, a COP reset is generated. Also, if any value other than $55 or $AA is written, a COP reset is generated. Windowed COP operation is enabled by setting WCOP in the CPMUCOP register. In this mode, writes to the CPMUARMCOP register to clear the COP timer must occur in the last 25% of the selected timeout period. A premature write will immediately reset the part. 4.23.5.3 Power-on Reset (POR) The on-chip POR circuitry detects when the internal supply VDD drops below an appropriate voltage level. The POR is deasserted if the internal supply VDD exceeds an appropriate voltage level (voltage levels are not specified in this document, because this internal supply is not visible on device pins). 4.23.5.4 Low-voltage Reset (LVR) The on-chip LVR circuitry detects when one of the supply voltages VDD, VDDF, or VDDX, drops below an appropriate voltage level. If LVR is deasserted, the MCU is fully operational at the specified maximum speed. The LVR assert and deassert levels for the supply voltage VDDX are VLVRXA and VLVRXD, and are specified in the device reference manual. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.23.6 Interrupts The interrupt/reset vectors requested by the 9S12I128PIMV1 are listed in Table 442. Refer to MCU specification for related vector addresses and priorities. Table 442. 9S12I128PIMV1 Interrupt Vectors Interrupt source CCR mask Local enable RTI timeout interrupt I bit CPMUINT (RTIE) PLL lock interrupt I bit CPMUINT (LOCKIE) Oscillator status interrupt I bit CPMUINT (OSCIE) Low voltage interrupt I bit CPMULVCTL (LVIE) 4.23.6.1 4.23.6.1.1 Description of interrupt operation Real time interrupt (RTI) The clock source for the RTI is either IRCCLK or OSCCLK, depending on the setting of the RTIOSCSEL bit. In Stop mode with PSTP=1 (Pseudo Stop mode), RTIOSCSEL=1 and PRE=1 the RTI continues to run, else the RTI counter halts in Stop mode. The RTI can be used to generate hardware interrupts at a fixed periodic rate. If enabled (by setting RTIE=1), this interrupt will occur at the rate selected by the CPMURTI register. At the end of the RTI timeout period, the RTIF flag is set to one and a new RTI timeout period starts immediately. A write to the CPMURTI register restarts the RTI timeout period. 4.23.6.1.2 PLL lock interrupt The 9S12I128PIMV1 generates a PLL Lock interrupt when the lock condition (LOCK status bit) of the PLL changes, either from a locked state to an unlocked state, or vice versa. Lock interrupts are locally disabled by setting the LOCKIE bit to zero. The PLL Lock interrupt flag (LOCKIF) is set to 1 when the lock condition has changed, and is cleared to 0 by writing a 1 to the LOCKIF bit. 4.23.6.1.3 Oscillator status interrupt The Adaptive Oscillator filter contains two different features: 1. Filters spikes of the external oscillator clock. 2. Qualify the external oscillator clock. When the OSCE bit is 0, then UPOSC stays 0. When OSCE=1 and OSCFILT = 0, then the filter is transparent and no spikes are filtered. The UPOSC bit is then set after the LOCK bit is set. Upon detection of a status change (UPOSC), where an unqualified oscillation becomes qualified or vice versa, the OSCIF flag is set. Going into Full Stop mode or disabling the oscillator can also cause a status change of UPOSC. Since the Adaptive Oscillator Filter is based on the PLLCLK, any change in PLL configuration or any other event which causes the PLL lock status to be cleared, leads to a loss of the oscillator status information as well (UPOSC=0). Oscillator status change interrupts are locally enabled with the OSCIE bit. NOTE Losing the oscillator status (UPOSC=0) affects the clock configuration of the system(272). This needs to be addressed in application software. Notes 272. For details refer to "Section 4.23.4.6, "System clock configurations" 4.23.6.1.4 Low-voltage interrupt (LVI) In FPM, the input voltage VDDXR is monitored. Whenever VDDXR drops below level VLVIA, the status bit LVDS is set to 1. When VDDXR rises above level VLVID, the status bit LVDS is cleared to 0. An interrupt, indicated by flag LVIF = 1, is triggered by any change of the status bit LVDS if interrupt enable bit LVIE = 1. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.23.7 Initialization/application information 4.23.7.1 General initialization information Usually applications run in MCU Normal mode. It is recommended to write the CPMUCOP register from the application program initialization routine after reset, regardless if the COP is used in the application, even if a configuration is loaded via the flash memory after reset. By doing a "controlled" write access in MCU Normal mode (with the right value for the application), the write once for the COP configuration bits (WCOP,CR[2:0]) takes place, which protects these bits from further accidental change. If there is a program sequencing issue (code runaway), the COP configuration cannot be accidentally modified. 4.24 MCU - serial peripheral interface (S129S12I128PIMV1V5) 4.24.1 Introduction The SPI module allows a duplex, synchronous, serial communication, between the MCU and peripheral devices. Software can poll the SPI status flags or the SPI operation can be interrupt driven. 4.24.1.1 Glossary of terms Table 443. Term Definition 4.24.1.2 SPI Serial Peripheral Interface SS Slave Select SCK Serial Clock MOSI Master Output, Slave Input MISO Master Input, Slave Output MOMI Master Output, Master Input SISO Slave Input, Slave Output Features The 9S12I128PIMV1 includes these distinctive features: * Master mode and slave mode * Selectable 8 or 16-bit transfer width * Bidirectional mode * Slave select output * Mode fault error flag with CPU interrupt capability * Double-buffered data register * Serial clock with programmable polarity and phase * Control of SPI operation during Wait mode 4.24.1.3 Modes of operation The SPI functions in three modes: run, wait, and stop. * Run mode This is the basic mode of operation. * Wait mode SPI operation in Wait mode is a configurable low power mode, controlled by the SPISWAI bit located in the SPICR2 register. In Wait mode, if the SPISWAI bit is clear, the SPI operates like in Run mode. If the SPISWAI bit is set, the SPI goes into a power conservative state, with the SPI clock generation turned off. If the SPI is configured as a master, any transmission in progress stops, but is resumed after CPU goes into Run mode. If the SPI is configured as a slave, reception and transmission of data continues, so that the slave stays synchronized to the master. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS * Stop mode The SPI is inactive in stop mode for reduced power consumption. If the SPI is configured as a master, any transmission in progress stops, but is resumed after CPU goes into Run mode. If the SPI is configured as a slave, reception and transmission of data continues, so that the slave stays synchronized to the master. For a detailed description of operating modes, refer to Section 4.24.4.7, "Low power mode options". 4.24.1.4 Block diagram Figure 101 gives an overview on the SPI architecture. The main parts of the SPI are status, control and data registers, shifter logic, baud rate generator, master/slave control logic, and port control logic. SPI 2 SPI Control Register 1 BIDIROE 2 SPI Control Register 2 SPC0 SPI Status Register Slave Control SPIF MODF SPTEF CPOL CPHA Phase + SCK In Slave Baud Rate Polarity Control Master Baud Rate Phase + SCK Out Polarity Control Interrupt Control SPI Interrupt Request Baud Rate Generator Master Control Counter Bus Clock Prescaler Clock Select SPPR 3 SPR MOSI Port Control Logic SCK SS Baud Rate 3 Shift Clock Sample Clock Shifter SPI Baud Rate Register Data In LSBFE=1 LSBFE=0 MSB SPI Data Register LSBFE=0 LSBFE=1 LSBFE=0 LSB LSBFE=1 Data Out Figure 101. SPI block diagram 4.24.2 External signal description This section lists the name and description of all ports including inputs and outputs that do, or may, connect off chip. The 9S12I128PIMV1 module has a total of four external pins. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.24.2.1 MOSI -- master out/slave in pin This pin is used to transmit data out of the SPI module when it is configured as a master and receive data when it is configured as slave. 4.24.2.2 MISO -- master in/slave out pin This pin is used to transmit data out of the SPI module when configured as a slave and receive data when configured as master. 4.24.2.3 SS -- slave select pin This pin is used to output the select signal from the SPI module to another peripheral, with which a data transfer is to take place when it is configured as a master, and is used as an input to receive the slave select signal when the SPI is configured as a slave. 4.24.2.4 SCK -- serial clock pin In master mode, this is the synchronous output clock. In slave mode, this is the synchronous input clock. 4.24.3 Memory map and register definition This section provides a detailed description of address space and registers used by the SPI. 4.24.3.1 Module memory map The memory map for the 9S12I128PIMV1 is given in Table 444. The address listed for each register is the sum of a base address and an address offset. The base address is defined at the SoC level and the address offset is defined at the module level. Reads from the reserved bits return zeros and writes to the reserved bits have no effect. Table 444. SPI register summary Register Name 0x00E8 SPICR1 0x00E9 SPICR2 0x00EA SPIBR 0x00EB SPISR 0x00EC SPIDRH 0x00ED SPIDRL 0x00EE Reserved 0x00EF Reserved R W R Bit 7 6 5 4 3 2 1 Bit 0 SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE MODFEN BIDIROE SPISWAI SPC0 SPR2 SPR1 SPR0 0 W R 0 XFRW 0 0 0 SPPR2 SPPR1 SPPR0 SPIF 0 SPTEF MODF 0 0 0 0 R R15 R14 R13 R12 R11 R10 R9 R8 W T15 T14 T13 T12 T11 T10 T9 T8 R R7 R6 R5 R4 R3 R2 R1 R0 W T7 T6 T5 T4 T3 T2 T1 T0 W R W R W R W = Unimplemented or Reserved MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.24.3.2 Register descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. 4.24.3.2.1 SPI control register 1 (SPICR1) Table 445. SPI control register 1 (SPICR1) 0x00E8 R W Reset 7 6 5 4 3 2 1 0 SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE 0 0 0 0 0 1 0 0 Read: Anytime Write: Anytime Table 446. SPICR1 field descriptions Field Description 7 SPIE SPI Interrupt Enable Bit -- This bit enables SPI interrupt requests, if SPIF or MODF status flag is set. 0 SPI interrupts disabled. 1 SPI interrupts enabled. 6 SPE SPI System Enable Bit -- This bit enables the SPI system and dedicates the SPI port pins to SPI system functions. If SPE is cleared, SPI is disabled and forced into idle state, status bits in SPISR register are reset. 0 SPI disabled (lower power consumption). 1 SPI enabled, port pins are dedicated to SPI functions. 5 SPTIE SPI Transmit Interrupt Enable -- This bit enables SPI interrupt requests, if SPTEF flag is set. 0 SPTEF interrupt disabled. 1 SPTEF interrupt enabled. 4 MSTR SPI Master/Slave Mode Select Bit -- This bit selects whether the SPI operates in master or slave mode. Switching the SPI from master to slave or vice versa forces the SPI system into idle state. 0 SPI is in slave mode. 1 SPI is in master mode. 3 CPOL SPI Clock Polarity Bit -- This bit selects an inverted or non-inverted SPI clock. To transmit data between SPI modules, the SPI modules must have identical CPOL values. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 Active-high clocks selected. In idle state SCK is low. 1 Active-low clocks selected. In idle state SCK is high. 2 CPHA SPI Clock Phase Bit -- This bit is used to select the SPI clock format. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 Sampling of data occurs at odd edges (1,3,5,...) of the SCK clock. 1 Sampling of data occurs at even edges (2,4,6,...) of the SCK clock. 1 SSOE Slave Select Output Enable -- The SS output feature is enabled only in master mode, if MODFEN is set, by asserting the SSOE as shown in Table 447. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 LSBFE LSB-First Enable -- This bit does not affect the position of the MSB and LSB in the data register. Reads and writes of the data register always have the MSB in the highest bit position. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 Data is transferred most significant bit first. 1 Data is transferred least significant bit first. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 447. SS input/output selection MODFEN SSOE Master mode Slave mode 0 0 SS not used by SPI SS input 0 1 SS not used by SPI SS input 1 0 SS input with MODF feature SS input 1 1 SS is slave select output SS input 4.24.3.2.2 SPI control register 2 (SPICR2) Table 448. SPI control register 2 (SPICR2) 0x00E9 7 R 0 W Reset 0 6 XFRW 0 5 0 0 4 3 MODFEN BIDIROE 0 0 2 0 0 1 0 SPISWAI SPC0 0 0 = Unimplemented or Reserved Read: Anytime Write: Anytime; writes to the reserved bits have no effect Table 449. SPICR2 field descriptions Field Description 6 XFRW Transfer Width -- This bit is used for selecting the data transfer width. If 8-bit transfer width is selected, SPIDRL becomes the dedicated data register and SPIDRH is unused. If 16-bit transfer width is selected, SPIDRH and SPIDRL form a 16-bit data register. Refer to Section 4.24.3.2.4, "SPI status register (SPISR)" for information about transmit/receive data handling and the interrupt flag clearing mechanism. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 8-bit Transfer Width (n = 8)(273) 1 16-bit Transfer Width (n = 16)(273) 4 MODFEN Mode Fault Enable Bit -- This bit allows the MODF failure to be detected. If the SPI is in master mode and MODFEN is cleared, then the SS port pin is not used by the SPI. In slave mode, the SS is available only as an input regardless of the value of MODFEN. For an overview on the impact of the MODFEN bit on the SS port pin configuration, refer to Table 447. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 SS port pin is not used by the SPI. 1 SS port pin with MODF feature. 3 BIDIROE Output Enable in the Bidirectional Mode of Operation -- This bit controls the MOSI and MISO output buffer of the SPI, when in bidirectional mode of operation (SPC0 is set). In master mode, this bit controls the output buffer of the MOSI port, in slave mode it controls the output buffer of the MISO port. In master mode, with SPC0 set, a change of this bit will abort a transmission in progress and force the SPI into idle state. 0 Output buffer disabled. 1 Output buffer enabled. 1 SPISWAI SPI Stop in Wait Mode Bit -- This bit is used for power conservation while in wait mode. 0 SPI clock operates normally in wait mode. 1 Stop SPI clock generation when in wait mode. 0 SPC0 Serial Pin Control Bit 0 -- This bit enables bidirectional pin configurations as shown in Table 450. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. Notes 273. n is used later in this document as a placeholder for the selected transfer width. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 450. Bidirectional pin configurations Pin Mode SPC0 BIDIROE MISO MOSI Master Mode of Operation Normal 0 Bidirectional 1 X Master In 0 Master Out Master In MISO not used by SPI 1 Master I/O Slave Mode of Operation Normal 0 Bidirectional 1 4.24.3.2.3 X Slave Out 0 Slave In 1 Slave I/O Slave In MOSI not used by SPI SPI baud rate register (SPIBR) Table 451. SPI baud rate register (SPIBR) 0x00EA 7 R 0 W Reset 0 6 5 4 SPPR2 SPPR1 SPPR0 0 0 0 3 0 0 2 1 0 SPR2 SPR1 SPR0 0 0 0 = Unimplemented or Reserved Read: Anytime Write: Anytime; writes to the reserved bits have no effect Table 452. SPIBR field descriptions Field Description 6-4 SPPR[2:0] SPI Baud Rate Preselection Bits -- These bits specify the SPI baud rates as shown in Table 453. In master mode, a change of these bits will abort a transmission in progress and force the SPI system into idle state. 2-0 SPR[2:0] SPI Baud Rate Selection Bits -- These bits specify the SPI baud rates as shown in Table 453. In master mode, a change of these bits will abort a transmission in progress and force the SPI system into idle state. The baud rate divisor equation is as follows: BaudRateDivisor = (SPPR + 1) * 2(SPR + 1) Eqn. 4 The baud rate can be calculated with the following equation: Baud Rate = BusClock / BaudRateDivisor Eqn. 5 NOTE For maximum allowed baud rates, refer to Section 3.6.2.5, "SPI timing" of this data sheet. Table 453. Example SPI baud rate selection (25 MHz bus clock) SPPR2 SPPR1 SPPR0 SPR2 SPR1 SPR0 Baud rate divisor Baud rate 0 0 0 0 0 0 2 12.5 Mbit/s 0 0 0 0 0 1 4 6.25 Mbit/s 0 0 0 0 1 0 8 3.125 Mbit/s MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 453. Example SPI baud rate selection (25 MHz bus clock) (continued) SPPR2 SPPR1 SPPR0 SPR2 SPR1 SPR0 Baud rate divisor Baud rate 0 0 0 0 1 1 16 1.5625 Mbit/s 0 0 0 1 0 0 32 781.25 kbit/s 0 0 0 1 0 1 64 390.63 kbit/s 0 0 0 1 1 0 128 195.31 kbit/s 0 0 0 1 1 1 256 97.66 kbit/s 0 0 1 0 0 0 4 6.25 Mbit/s 0 0 1 0 0 1 8 3.125 Mbit/s 0 0 1 0 1 0 16 1.5625 Mbit/s 0 0 1 0 1 1 32 781.25 kbit/s 0 0 1 1 0 0 64 390.63 kbit/s 0 0 1 1 0 1 128 195.31 kbit/s 0 0 1 1 1 0 256 97.66 kbit/s 0 0 1 1 1 1 512 48.83 kbit/s 0 1 0 0 0 0 6 4.16667 Mbit/s 0 1 0 0 0 1 12 2.08333 Mbit/s 0 1 0 0 1 0 24 1.04167 Mbit/s 0 1 0 0 1 1 48 520.83 kbit/s 0 1 0 1 0 0 96 260.42 kbit/s 0 1 0 1 0 1 192 130.21 kbit/s 0 1 0 1 1 0 384 65.10 kbit/s 0 1 0 1 1 1 768 32.55 kbit/s 0 1 1 0 0 0 8 3.125 Mbit/s 0 1 1 0 0 1 16 1.5625 Mbit/s 0 1 1 0 1 0 32 781.25 kbit/s 0 1 1 0 1 1 64 390.63 kbit/s 0 1 1 1 0 0 128 195.31 kbit/s 0 1 1 1 0 1 256 97.66 kbit/s 0 1 1 1 1 0 512 48.83 kbit/s 0 1 1 1 1 1 1024 24.41 kbit/s 1 0 0 0 0 0 10 2.5 Mbit/s 1 0 0 0 0 1 20 1.25 Mbit/s 1 0 0 0 1 0 40 625 kbit/s 1 0 0 0 1 1 80 312.5 kbit/s 1 0 0 1 0 0 160 156.25 kbit/s 1 0 0 1 0 1 320 78.13 kbit/s 1 0 0 1 1 0 640 39.06 kbit/s 1 0 0 1 1 1 1280 19.53 kbit/s MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 453. Example SPI baud rate selection (25 MHz bus clock) (continued) SPPR2 SPPR1 SPPR0 SPR2 SPR1 SPR0 Baud rate divisor Baud rate 1 0 1 0 0 0 12 2.08333 Mbit/s 1 0 1 0 0 1 24 1.04167 Mbit/s 1 0 1 0 1 0 48 520.83 kbit/s 1 0 1 0 1 1 96 260.42 kbit/s 1 0 1 1 0 0 192 130.21 kbit/s 1 0 1 1 0 1 384 65.10 kbit/s 1 0 1 1 1 0 768 32.55 kbit/s 1 0 1 1 1 1 1536 16.28 kbit/s 1 1 0 0 0 0 14 1.78571 Mbit/s 1 1 0 0 0 1 28 892.86 kbit/s 1 1 0 0 1 0 56 446.43 kbit/s 1 1 0 0 1 1 112 223.21 kbit/s 1 1 0 1 0 0 224 111.61 kbit/s 1 1 0 1 0 1 448 55.80 kbit/s 1 1 0 1 1 0 896 27.90 kbit/s 1 1 0 1 1 1 1792 13.95 kbit/s 1 1 1 0 0 0 16 1.5625 Mbit/s 1 1 1 0 0 1 32 781.25 kbit/s 1 1 1 0 1 0 64 390.63 kbit/s 1 1 1 0 1 1 128 195.31 kbit/s 1 1 1 1 0 0 256 97.66 kbit/s 1 1 1 1 0 1 512 48.83 kbit/s 1 1 1 1 1 0 1024 24.41 kbit/s 1 1 1 1 1 1 2048 12.21 kbit/s 4.24.3.2.4 SPI status register (SPISR) Table 454. SPI status register (SPISR) 0x00EB R 7 6 5 4 3 2 1 0 SPIF 0 SPTEF MODF 0 0 0 0 0 0 1 0 0 0 0 0 W Reset = Unimplemented or Reserved Read: Anytime Write: Has no effect MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 455. SPISR field descriptions Field Description 7 SPIF SPIF Interrupt Flag -- This bit is set after received data has been transferred into the SPI data register. For information about clearing SPIF Flag, refer to Table 456. 0 Transfer not yet complete. 1 New data copied to SPIDR. 5 SPTEF SPI Transmit Empty Interrupt Flag -- If set, this bit indicates that the transmit data register is empty. For information about clearing this bit and placing data into the transmit data register, refer to Table 457. 0 SPI data register not empty. 1 SPI data register empty. 4 MODF Mode Fault Flag -- This bit is set if the SS input becomes low while the SPI is configured as a master and mode fault detection is enabled, MODFEN bit of SPICR2 register is set. Refer to MODFEN bit description in Section 4.24.3.2.2, "SPI control register 2 (SPICR2)"". The flag is cleared automatically by a read of the SPI status register (with MODF set) followed by a write to the SPI control register 1. 0 Mode fault has not occurred. 1 Mode fault has occurred. Table 456. SPIF interrupt flag clearing sequence XFRW bit 0 SPIF interrupt flag clearing sequence Read SPISR with SPIF == 1 then Read SPIDRL Byte Read SPIDRL (274) or 1 Read SPISR with SPIF == 1 then Byte Read SPIDRH (275) Byte Read SPIDRL or Word Read (SPIDRH:SPIDRL) Notes 274. Data in SPIDRH is lost, in this case. 275. SPIDRH can be read repeatedly without any effect on SPIF. SPIF Flag is cleared only by the read of SPIDRL after reading SPISR with SPIF == 1. Table 457. SPTEF interrupt flag clearing sequence XFRW bit 0 SPTEF interrupt flag clearing sequence Read SPISR with SPTEF == 1 Write to SPIDRL (276) then Byte Write to SPIDRL (276) (277) or 1 Read SPISR with SPTEF == 1 then Byte Write to SPIDRH (276) (278) Byte Write to SPIDRL (276) or Word Write to (SPIDRH:SPIDRL) (276) Notes 276. Any write to SPIDRH or SPIDRL with SPTEF == 0 is effectively ignored. 277. Data in SPIDRH is undefined in this case. 278. SPIDRH can be written repeatedly without any effect on SPTEF. SPTEF Flag is cleared only by writing to SPIDRL after reading SPISR with SPTEF == 1. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.24.3.2.5 SPI data register (SPIDR = SPIDRH:SPIDRL) Table 458. SPI data register high (SPIDRH) 0x00EC 7 6 5 4 3 2 1 0 R R15 R14 R13 R12 R11 R10 R9 R8 W T15 T14 T13 T12 T11 T10 T9 T8 Reset 0 0 0 0 0 0 0 0 Table 459. SPI data register low (SPIDRL) 0x00ED 7 6 5 4 3 2 1 0 R R7 R6 R5 R4 R3 R2 R1 R0 W T7 T6 T5 T4 T3 T2 T1 T0 Reset 0 0 0 0 0 0 0 0 Read: Anytime; read data only valid when SPIF is set Write: Anytime The SPI data register is both the input and output register for SPI data. A write to this register allows data to be queued and transmitted. For an SPI configured as a master, queued data is transmitted immediately after the previous transmission has completed. The SPI transmitter empty flag SPTEF in the SPISR register indicates when the SPI data register is ready to accept new data. Received data in the SPIDR is valid when SPIF is set. If SPIF is cleared and data has been received, the received data is transferred from the receive shift register to the SPIDR and SPIF is set. If SPIF is set and not serviced, and a second data value has been received, the second received data is kept as valid data in the receive shift register until the start of another transmission. The data in the SPIDR does not change. If SPIF is set and valid data is in the receive shift register, and SPIF is serviced before the start of a third transmission, the data in the receive shift register is transferred into the SPIDR and SPIF remains set (see Figure 102). If SPIF is set and valid data is in the receive shift register, and SPIF is serviced after the start of a third transmission, the data in the receive shift register has become invalid and is not transferred into the SPIDR (see Figure 103). Data A Received Data B Received Data C Received SPIF Serviced Receive Shift Register Data B Data A Data C SPIF SPI Data Register Data A = Unspecified Data B Data C = Reception in progress Figure 102. Reception with SPIF serviced in time MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Data A Received Data B Received Data C Received Data B Lost SPIF Serviced Receive Shift Register Data B Data A Data C SPIF SPI Data Register Data A = Unspecified Data C = Reception in progress Figure 103. Reception with SPIF serviced too late 4.24.4 Functional description The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral devices. Software can poll the SPI status flags or SPI operation can be interrupt driven. The SPI system is enabled by setting the SPI enable (SPE) bit in SPI control register 1. While SPE is set, the four associated SPI port pins are dedicated to the SPI function as: * Slave select (SS) * Serial clock (SCK) * Master out/slave in (MOSI) * Master in/slave out (MISO) The main element of the SPI system is the SPI data register. The n-bit(279) data register in the master and the n-bit(279) data register in the slave are linked by the MOSI and MISO pins to form a distributed 2n-bit(279) register. When a data transfer operation is performed, this 2n-bit(279) register is serially shifted n(279) bit positions by the S-clock from the master, so data is exchanged between the master and the slave. Data written to the master SPI data register becomes the output data for the slave, and data read from the master SPI data register after a transfer operation is the input data from the slave. Notes 279. n depends on the selected transfer width, refer to Section 4.24.3.2.2, "SPI control register 2 (SPICR2)" A read of SPISR with SPTEF = 1 followed by a write to SPIDR, puts data into the transmit data register. When a transfer is complete and SPIF is cleared, received data is moved into the receive data register. This data register acts as the SPI receive data register for reads and as the SPI transmit data register for writes. A common SPI data register address is shared for reading data from the read data buffer and for writing data to the transmit data register. The clock phase control bit (CPHA) and a clock polarity control bit (CPOL) in the SPI control register 1 (SPICR1) select one of four possible clock formats to be used by the SPI system. The CPOL bit simply selects a non-inverted or inverted clock. The CPHA bit is used to accommodate two fundamentally different protocols by sampling data on odd numbered SCK edges or on even numbered SCK edges (see Section 4.24.4.3, "Transmission formats"). The SPI can be configured to operate as a master or as a slave. When the MSTR bit in SPI control register1 is set, master mode is selected, when the MSTR bit is clear, slave mode is selected. NOTE A change of CPOL or MSTR bit while there is a received byte pending in the receive shift register will destroy the received byte and must be avoided. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.24.4.1 Master mode The SPI operates in master mode when the MSTR bit is set. Only a master SPI module can initiate transmissions. A transmission begins by writing to the master SPI data register. If the shift register is empty, data immediately transfers to the shift register. Data begins shifting out on the MOSI pin under the control of the serial clock. * Serial clock The SPR2, SPR1, and SPR0 baud rate selection bits, in conjunction with the SPPR2, SPPR1, and SPPR0 baud rate preselection bits in the SPI baud rate register, control the baud rate generator and determine the speed of the transmission. The SCK pin is the SPI clock output. Through the SCK pin, the baud rate generator of the master controls the shift register of the slave peripheral. * MOSI, MISO pin In master mode, the function of the serial data output pin (MOSI) and the serial data input pin (MISO) is determined by the SPC0 and BIDIROE control bits. * SS pin If MODFEN and SSOE are set, the SS pin is configured as slave select output. The SS output becomes low during each transmission and is high when the SPI is in idle state. If MODFEN is set and SSOE is cleared, the SS pin is configured as input for detecting mode fault error. If the SS input becomes low, this indicates a mode fault error where another master tries to drive the MOSI and SCK lines. In this case, the SPI immediately switches to slave mode, by clearing the MSTR bit and also disables the slave output buffer MISO (or SISO in bidirectional mode). The result is that all outputs are disabled and SCK, MOSI, and MISO are inputs. If a transmission is in progress when the mode fault occurs, the transmission is aborted and the SPI is forced into idle state. This mode fault error also sets the mode fault (MODF) flag in the SPI status register (SPISR). If the SPI interrupt enable bit (SPIE) is set when the MODF flag becomes set, then an SPI interrupt sequence is also requested. When a write to the SPI data register in the master occurs, there is a half SCK-cycle delay. After the delay, SCK is started within the master. The rest of the transfer operation differs slightly, depending on the clock format specified by the SPI clock phase bit, CPHA, in SPI control register 1 (see Section 4.24.4.3, "Transmission formats"). NOTE A change of the bits CPOL, CPHA, SSOE, LSBFE, XFRW, MODFEN, SPC0, or BIDIROE with SPC0 set, SPPR2-SPPR0, and SPR2-SPR0 in master mode, will abort a transmission in progress and force the SPI into idle state. The remote slave cannot detect this, therefore the master must ensure that the remote slave is returned to idle state. 4.24.4.2 Slave mode The SPI operates in slave mode when the MSTR bit in SPI control register 1 is clear. * Serial clock In slave mode, SCK is the SPI clock input from the master. * MISO, MOSI pins In slave mode, the function of the serial data output pin (MISO) and serial data input pin (MOSI) is determined by the SPC0 bit and BIDIROE bit in SPI control register 2. * SS pin The SS pin is the slave select input. Before a data transmission occurs, the SS pin of the slave SPI must be low. SS must remain low until the transmission is complete. If SS goes high, the SPI is forced into idle state. The SS input also controls the serial data output pin. If SS is high (not selected), the serial data output pin is high impedance, and, if SS is low, the first bit in the SPI data register is driven out of the serial data output pin. Also, if the slave is not selected (SS is high), then the SCK input is ignored and no internal shifting of the SPI shift register occurs. Although the SPI is capable of duplex operation, some SPI peripherals are capable of only receiving SPI data in a slave mode. For these simpler devices, there is no serial data out pin. NOTE When peripherals with duplex capability are used, take care not to simultaneously enable two receivers whose serial outputs drive the same system slave's serial data output line. As long as no more than one slave device drives the system slave's serial data output line, it is possible for several slaves to receive the same transmission from a master, although the master would not receive return information from all of the receiving slaves. If the CPHA bit in SPI control register 1 is clear, odd numbered edges on the SCK input cause the data at the serial data input pin to be latched. Even numbered edges cause the value previously latched from the serial data input pin to shift into the LSB or MSB of the SPI shift register, depending on the LSBFE bit. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS If the CPHA bit is set, even numbered edges on the SCK input cause the data at the serial data input pin to be latched. Odd numbered edges cause the value previously latched from the serial data input pin to shift into the LSB or MSB of the SPI shift register, depending on the LSBFE bit. When CPHA is set, the first edge is used to get the first data bit onto the serial data output pin. When CPHA is clear and the SS input is low (slave selected), the first bit of the SPI data is driven out of the serial data output pin. After the nth(280) shift, the transfer is considered complete and the received data is transferred into the SPI data register. To indicate transfer is complete, the SPIF flag in the SPI status register is set. Notes 280. n depends on the selected transfer width, refer to Section 4.24.3.2.2, "SPI control register 2 (SPICR2)" NOTE A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0, or BIDIROE with SPC0 set in slave mode, will corrupt a transmission in progress and must be avoided. 4.24.4.3 Transmission formats During an SPI transmission, data is transmitted (shifted out serially) and received (shifted in serially) simultaneously. The serial clock (SCK) synchronizes shifting and sampling of the information on the two serial data lines. A slave select line allows selection of an individual slave SPI device; slave devices that are not selected do not interfere with SPI bus activities. Optionally, on a master SPI device, the slave select line can be used to indicate multiple-master bus contention. MASTER SPI SLAVE SPI SHIFT REGISTER BAUD RATE GENERATOR MISO MISO MOSI MOSI SCK SCK SS VDD SHIFT REGISTER SS Figure 104. Master/slave transfer block diagram 4.24.4.3.1 Clock phase and polarity controls Using two bits in the SPI control register 1, software selects one of four combinations of serial clock phase and polarity. The CPOL clock polarity control bit specifies an active high or low clock and has no significant effect on the transmission format. The CPHA clock phase control bit selects one of two fundamentally different transmission formats. Clock phase and polarity should be identical for the master SPI device and the communicating slave device. In some cases, the phase and polarity are changed between transmissions to allow a master device to communicate with peripheral slaves having different requirements. 4.24.4.3.2 CPHA = 0 transfer format The first edge on the SCK line is used to clock the first data bit of the slave into the master and the first data bit of the master into the slave. In some peripherals, the first bit of the slave's data is available at the slave's data out pin as soon as the slave is selected. In this format, the first SCK edge is issued a half cycle after SS has become low. A half SCK cycle later, the second edge appears on the SCK line. When this second edge occurs, the value previously latched from the serial data input pin is shifted into the LSB or MSB of the shift register, depending on LSBFE bit. After this second edge, the next bit of the SPI master data is transmitted out of the serial data output pin of the master to the serial input pin on the slave. This process continues for a total of 16 edges on the SCK line, with data being latched on odd numbered edges and shifted on even numbered edges. Data reception is double buffered. Data is shifted serially into the SPI shift register during the transfer and is transferred to the parallel SPI data register after the last bit is shifted in. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS After 2n(281) (last) SCK edges: * Data that was previously in the master SPI data register should now be in the slave data register and the data that was in the slave data register should be in the master. * The SPIF flag in the SPI status register is set, indicating that the transfer is complete. Notes 281. n depends on the selected transfer width, refer to Section 4.24.3.2.2, "SPI control register 2 (SPICR2)" Figure 105 is a timing diagram of an SPI transfer where CPHA = 0. SCK waveforms are shown for CPOL = 0 and CPOL = 1. The diagram may be interpreted as a master or slave timing diagram because the SCK, MISO, and MOSI pins are connected directly between the master and the slave. The MISO signal is the output from the slave and the MOSI signal is the output from the master. The SS pin of the master must be either high or reconfigured as a general purpose output not affecting the SPI. End of Idle State Begin 1 SCK Edge Number 2 3 4 5 6 7 8 Begin of Idle State End Transfer 9 10 11 12 13 14 15 16 Bit 1 Bit 6 LSB Minimum 1/2 SCK for tT, tl, tL MSB SCK (CPOL = 0) SCK (CPOL = 1) If next transfer begins here SAMPLE I MOSI/MISO CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) tT tL MSB first (LSBFE = 0): MSB Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 LSB first (LSBFE = 1): LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 tL = Minimum leading time before the first SCK edge tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time) tL, tT, and tI are guaranteed for the master mode and required for the slave mode. tI tL Figure 105. SPI Clock format 0 (CPHA = 0), with 8-bit transfer width selected (XFRW = 0) MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS End of Idle State SCK Edge Number Begin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Begin of Idle State End Transfer 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 SCK (CPOL = 0) SCK (CPOL = 1) If next transfer begins here SAMPLE I MOSI/MISO CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) MSB first (LSBFE = 0) LSB first (LSBFE = 1) tL tT tI tL MSB Bit 14Bit 13Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB Minimum 1/2 SCK LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Bit 8 Bit 9 Bit 10 Bit 11Bit 12Bit 13Bit 14 MSB for tT, tl, tL tL = Minimum leading time before the first SCK edge tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time) tL, tT, and tI are guaranteed for the master mode and required for the slave mode. Figure 106. SPI clock format 0 (CPHA = 0), with 16-Bit transfer width selected (XFRW = 1) In slave mode, if the SS line is not deasserted between the successive transmissions, then the content of the SPI data register is not transmitted; instead the last received data is transmitted. If the SS line is deasserted for at least minimum idle time (half SCK cycle) between successive transmissions, then the content of the SPI data register is transmitted. In master mode, with slave select output enabled, the SS line is always deasserted and reasserted between successive transfers for at least minimum idle time. 4.24.4.3.3 CPHA = 1 transfer format Some peripherals require the first SCK edge before the first data bit becomes available at the data out pin, the second edge clocks data into the system. In this format, the first SCK edge is issued by setting the CPHA bit at the beginning of the n(282)-cycle transfer operation. Notes 282. n depends on the selected transfer width, refer to Section 4.24.3.2.2, "SPI control register 2 (SPICR2)" The first edge of SCK occurs immediately after the half SCK clock cycle synchronization delay. This first edge commands the slave to transfer its first data bit to the serial data input pin of the master. A half SCK cycle later, the second edge appears on the SCK pin. This is the latching edge for both the master and slave. When the third edge occurs, the value previously latched from the serial data input pin is shifted into the LSB or MSB of the SPI shift register, depending on LSBFE bit. After this edge, the next bit of the master data is coupled out of the serial data output pin of the master to the serial input pin on the slave. This process continues for a total of n4 edges on the SCK line with data being latched on even numbered edges and shifting taking place on odd numbered edges. Data reception is double buffered, data is serially shifted into the SPI shift register during the transfer and is transferred to the parallel SPI data register after the last bit is shifted in. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS After 2n4 SCK edges: * Data that was previously in the SPI data register of the master is now in the data register of the slave, and data that was in the data register of the slave is in the master. * The SPIF flag bit in SPISR is set indicating that the transfer is complete. Figure 107 shows two clocking variations for CPHA = 1. The diagram may be interpreted as a master or slave timing diagram, because the SCK, MISO, and MOSI pins are connected directly between the master and the slave. The MISO signal is the output from the slave, and the MOSI signal is the output from the master. The SS line is the slave select input to the slave. The SS pin of the master must be either high or reconfigured as a general purpose output not affecting the SPI. End of Idle State Begin SCK Edge Number 1 2 3 4 End Transfer 5 6 7 8 9 10 11 12 13 14 Begin of Idle State 15 16 SCK (CPOL = 0) SCK (CPOL = 1) If next transfer begins here SAMPLE I MOSI/MISO CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) tT tL MSB first (LSBFE = 0): LSB first (LSBFE = 1): MSB LSB Bit 6 Bit 1 Bit 5 Bit 2 Bit 4 Bit 3 Bit 3 Bit 4 Bit 2 Bit 5 Bit 1 Bit 6 tI tL LSB Minimum 1/2 SCK for tT, tl, tL MSB tL = Minimum leading time before the first SCK edge, not required for back-to-back transfers tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time), not required for back-to-back transfers Figure 107. SPI clock format 1 (CPHA = 1), with 8-Bit transfer width selected (XFRW = 0) MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS End of Idle State SCK Edge Number Begin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Begin of Idle State End Transfer 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 SCK (CPOL = 0) SCK (CPOL = 1) If next transfer begins here SAMPLE I MOSI/MISO CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) tT tI tL Minimum 1/2 SCK for tT, tl, tL tL MSB first (LSBFE = 0) LSB first (LSBFE = 1) MSB Bit 14Bit 13Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Bit 8 Bit 9 Bit 10 Bit 11Bit 12Bit 13Bit 14 MSB tL = Minimum leading time before the first SCK edge, not required for back-to-back transfers tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time), not required for back-to-back transfers Figure 108. SPI clock format 1 (CPHA = 1), with 16-Bit transfer width selected (XFRW = 1) The SS line can remain active low between successive transfers (can be tied low at all times). This format is sometimes preferred in systems having a single fixed master and a single slave that drive the MISO data line. * Back-to-back transfers in master mode In master mode, if a transmission has completed and new data is available in the SPI data register, this data is sent out immediately without a trailing and minimum idle time. The SPI interrupt request flag (SPIF) is common to both the master and slave modes. SPIF gets set one half SCK cycle after the last SCK edge. 4.24.4.4 SPI baud rate generation Baud rate generation consists of a series of divider stages. Six bits in the SPI baud rate register (SPPR2, SPPR1, SPPR0, SPR2, SPR1, and SPR0) determine the divisor to the SPI module clock which results in the SPI baud rate. The SPI clock rate is determined by the product of the value in the baud rate preselection bits (SPPR2-SPPR0) and the value in the baud rate selection bits (SPR2-SPR0). The module clock divisor equation is shown in Equation 6. BaudRateDivisor = (SPPR + 1) * 2(SPR + 1) Eqn. 6 When all bits are clear (the default condition), the SPI module clock is divided by 2. When the selection bits (SPR2-SPR0) are 001 and the preselection bits (SPPR2-SPPR0) are 000, the module clock divisor becomes 4. When the selection bits are 010, the module clock divisor becomes 8, etc. When the preselection bits are 001, the divisor determined by the selection bits is multiplied by 2. When the preselection bits are 010, the divisor is multiplied by 3, etc. See Table 453 for baud rate calculations for all bit conditions, based on a 25 MHz bus clock. The two sets of selects allows the clock to be divided by a non-power of two to achieve other baud rates such as divide by 6, divide by 10, etc. The baud rate generator is activated only when the SPI is in master mode and a serial transfer is taking place. In the other cases, the divider is disabled to decrease IDD current. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS NOTE For maximum allowed baud rates, refer to Section 3.6.2.5, "SPI timing" of this data sheet. 4.24.4.5 4.24.4.5.1 Special features SS output The SS output feature automatically drives the SS pin low during transmission, to select external devices and drives it high during idle to deselect external devices. When SS output is selected, the SS output pin is connected to the SS input pin of the external device. The SS output is available only in master mode during normal SPI operation by asserting SSOE and MODFEN bit as shown in Table 447. The mode fault feature is disabled while SS output is enabled. NOTE Care must be taken when using the SS output feature in a multimaster system because the mode fault feature is not available for detecting system errors between masters. 4.24.4.5.2 Bidirectional mode (MOMI or SISO) The bidirectional mode is selected when the SPC0 bit is set in SPI control register 2 (see Table 460). In this mode, the SPI uses only one serial data pin for the interface with external device(s). The MSTR bit decides which pin to use. The MOSI pin becomes the serial data I/O (MOMI) pin for the master mode, and the MISO pin becomes serial data I/O (SISO) pin for the slave mode. The MISO pin in master mode and MOSI pin in slave mode are not used by the SPI. Table 460. Normal mode and bidirectional mode When SPE = 1 Normal mode SPC0 = 0 Master mode MSTR = 1 Serial Out MOSI MISO Serial Out SPI MOSI Serial In SPI SPI Serial In Bidirectional mode SPC0 = 1 Slave mode MSTR = 0 MOMI Serial Out Serial In SPI BIDIROE Serial In MISO Serial Out BIDIROE SISO The direction of each serial I/O pin depends on the BIDIROE bit. If the pin is configured as an output, serial data from the shift register is driven out on the pin. The same pin is also the serial input to the shift register. * The SCK is output for the master mode and input for the slave mode. * The SS is the input or output for the master mode, and it is always the input for the slave mode. * The bidirectional mode does not affect SCK and SS functions. NOTE In bidirectional master mode, with mode fault enabled, both data pins MISO and MOSI can be occupied by the SPI, though MOSI is normally used for transmissions in bidirectional mode and MISO is not used by the SPI. If a mode fault occurs, the SPI is automatically switched to slave mode. In this case, MISO becomes occupied by the SPI and MOSI is not used. This must be considered, if the MISO pin is used for another purpose. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.24.4.6 Error conditions The SPI has one error condition: Mode fault error 4.24.4.6.1 Mode fault error If the SS input becomes low while the SPI is configured as a master, it indicates a system error where more than one master may be trying to drive the MOSI and SCK lines simultaneously. This condition is not permitted in normal operation, the MODF bit in the SPI status register is set automatically, provided the MODFEN bit is set. In the special case where the SPI is in master mode and MODFEN bit is cleared, the SS pin is not used by the SPI. In this special case, the mode fault error function is inhibited and MODF remains cleared. In case the SPI system is configured as a slave, the SS pin is a dedicated input pin. Mode fault error doesn't occur in slave mode. If a mode fault error occurs, the SPI is switched to slave mode, with the exception that the slave output buffer is disabled. So SCK, MISO, and MOSI pins are forced to be high-impedance inputs to avoid any possibility of conflict with another output driver. A transmission in progress is aborted and the SPI is forced into idle state. If the mode fault error occurs in the bidirectional mode for a SPI system configured in master mode, output enable of the MOMI (MOSI in bidirectional mode) is cleared if it was set. No mode fault error occurs in the bidirectional mode for SPI system configured in slave mode. The mode fault flag is cleared automatically by a read of the SPI status register (with MODF set) followed by a write to SPI control register 1. If the mode fault flag is cleared, the SPI becomes a normal master or slave again. NOTE If a mode fault error occurs and a received data byte is pending in the receive shift register, this data byte will be lost. 4.24.4.7 4.24.4.7.1 Low power mode options SPI in run mode In run mode with the SPI system enable (SPE) bit in the SPI control register clear, the SPI system is in a low-power, disabled state. SPI registers remain accessible, but clocks to the core of this module are disabled. 4.24.4.7.2 SPI in wait mode SPI operation in wait mode depends upon the state of the SPISWAI bit in SPI control register 2. * If SPISWAI is clear, the SPI operates normally when the CPU is in wait mode * If SPISWAI is set, SPI clock generation ceases and the SPI module enters a power conservation state when the CPU is in wait mode. -- If SPISWAI is set and the SPI is configured for master, any transmission and reception in progress stops at wait mode entry. The transmission and reception resumes when the SPI exits wait mode. -- If SPISWAI is set and the SPI is configured as a slave, any transmission and reception in progress continues if the SCK continues to be driven from the master. This keeps the slave synchronized to the master and the SCK. If the master transmits several bytes while the slave is in wait mode, the slave will continue to send out bytes consistent with the operation mode at the start of wait mode (i.e., if the slave is currently sending its SPIDR to the master, it will continue to send the same byte. Else if the slave is currently sending the last received byte from the master, it will continue to send each previous master byte). NOTE Care must be taken when expecting data from a master while the slave is in wait or stop mode. Even though the shift register will continue to operate, the rest of the SPI is shut down (i.e., a SPIF interrupt will not be generated until exiting stop or wait mode). Also, the byte from the shift register will not be copied into the SPIDR register until after the slave SPI has exited wait or stop mode. In slave mode, a received byte pending in the receive shift register will be lost when entering wait or stop mode. An SPIF flag and SPIDR copy is generated only if wait mode is entered or exited during a transmission. If the slave enters wait mode in idle mode and exits wait mode in idle mode, neither a SPIF nor a SPIDR copy will occur. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.24.4.7.3 SPI in stop mode Stop mode is dependent on the system. The SPI enters stop mode when the module clock is disabled (held high or low). If the SPI is in master mode and exchanging data when the CPU enters stop mode, the transmission is frozen until the CPU exits stop mode. After stop, data to and from the external SPI is exchanged correctly. In slave mode, the SPI will stay synchronized with the master. The stop mode is not dependent on the SPISWAI bit. 4.24.4.7.4 Reset The reset values of registers and signals are described in Section 4.18.3, "Memory map and register definition", which details the registers and their bit fields. * If a data transmission occurs in slave mode after reset without a write to SPIDR, it will transmit garbage, or the data last received from the master before the reset. * Reading from the SPIDR after reset will always read zeros. 4.24.4.7.5 Interrupts The 9S12I128PIMV1 only originates interrupt requests when the SPI is enabled (SPE bit in SPICR1 set). The following is a description of how the 9S12I128PIMV1 makes a request and how the MCU should acknowledge that request. The interrupt vector offset and interrupt priority are chip dependent. The interrupt flags MODF, SPIF, and SPTEF are logically ORed to generate an interrupt request. 4.24.4.7.5.1 MODF MODF occurs when the master detects an error on the SS pin. The master SPI must be configured for the MODF feature (see Table 447). After MODF is set, the current transfer is aborted and the following bit is changed: MSTR = 0, The master bit in SPICR1 resets. The MODF interrupt is reflected in the status register MODF flag. Clearing the flag will also clear the interrupt. This interrupt will stay active while the MODF flag is set. MODF has an automatic clearing process which is described in Section 4.24.3.2.4, "SPI status register (SPISR)". 4.24.4.7.5.2 SPIF SPIF occurs when new data has been received and copied to the SPI data register. After SPIF is set, it does not clear until it is serviced. SPIF has an automatic clearing process, which is described in Section 4.24.3.2.4, "SPI status register (SPISR)". 4.24.4.7.5.3 SPTEF SPTEF occurs when the SPI data register is ready to accept new data. After SPTEF is set, it does not clear until it is serviced. SPTEF has an automatic clearing process, which is described in Section 4.24.3.2.4, "SPI status register (SPISR)". 4.25 4.25.1 128 kByte flash module (S12FTMRC128K1V1) Introduction The FTMRC128K1 module implements the following: * 128 kbytes of P-Flash (Program Flash) memory * 4.0 kbytes of D-Flash (Data Flash) memory The Flash memory is ideal for single-supply applications allowing for field reprogramming without requiring external high voltage sources for program or erase operations. The Flash module includes a memory controller that executes commands to modify Flash memory contents. The user interface to the memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is written to with the command, global address, data, and any required command parameters. The memory controller must complete the execution of a command before the FCCOB register can be written to with a new command. CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS The Flash memory may be read as bytes, aligned words, or misaligned words. Read access time is one bus cycle for bytes and aligned words, and two bus cycles for misaligned words. For Flash memory, an erased bit reads 1 and a programmed bit reads 0. It is possible to read from P-Flash memory while some commands are executing on D-Flash memory. It is not possible to read from D-Flash memory while a command is executing on P-Flash memory. Simultaneous P-Flash and D-Flash operations are discussed in Section 4.25.4.4, "Allowed simultaneous P-flash and D-flash operations". Both P-Flash and D-Flash memories are implemented with Error Correction Codes (ECC) that can resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation requires that programming be done on an aligned 8-byte basis (a Flash phrase). Since P-Flash memory is always read by half-phrase, only one single bit fault in an aligned 4-byte half-phrase containing the byte or word accessed will be corrected. 4.25.1.1 Glossary Command Write Sequence -- An MCU instruction sequence to execute built-in algorithms (including program and erase) on the Flash memory. D-Flash Memory -- The D-Flash memory constitutes the nonvolatile memory store for data. D-Flash Sector -- The D-Flash sector is the smallest portion of the D-Flash memory that can be erased. The D-Flash sector consists of four 64-byte rows for a total of 256-bytes. NVM Command Mode -- An NVM mode using the CPU to setup the FCCOB register to pass parameters required for Flash command execution. Phrase -- An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes two sets of aligned double words with each set, including 7 ECC bits for single bit fault correction and double bit fault detection within each double word. P-Flash Memory -- The P-Flash memory constitutes the main nonvolatile memory store for applications. P-Flash Sector -- The P-Flash sector is the smallest portion of the P-Flash memory that can be erased. Each P-Flash sector contains 512-bytes. Program IFR -- Nonvolatile information register located in the P-Flash block that contains the Device ID, Version ID, and the Program Once field. 4.25.1.2 4.25.1.2.1 * * * * * * D-flash features 4.0 kbytes of D-Flash memory composed of one 4.0 kbyte Flash block divided into 16 sectors of 256-bytes Single bit fault correction and double bit fault detection within a word during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and word program operation Protection scheme to prevent accidental program or erase of D-Flash memory Ability to program up to four words in a burst sequence 4.25.1.2.3 * * * P-flash features 128 kbytes of P-Flash memory composed of one 128 kbyte Flash block divided into 256 sectors of 512-bytes Single bit fault correction and double bit fault detection within a 32-bit double word during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and phrase program operation Ability to read the P-Flash memory while programming a word in the D-Flash memory Flexible protection scheme to prevent accidental program or erase of P-Flash memory 4.25.1.2.2 * * * * * * Features Other flash module features No external high-voltage power supply required for Flash memory program and erase operations Interrupt generation on Flash command completion and Flash error detection Security mechanism to prevent unauthorized access to the Flash memory MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.25.1.3 Block diagram The block diagram of the Flash module is shown in Figure 109. Flash Interface Command Interrupt Request Registers Error Interrupt Request Protection 16-bit internal bus sector 0 sector 1 Security Bus Clock CPU Clock Divider FCLK Memory Controller P-Flash 32Kx39 sector 255 D-Flash 2Kx22 sector 0 sector 1 Scratch RAM 384x16 sector 15 Figure 109. FTMRC128K1 block diagram 4.25.2 External signal description The Flash module contains no signals that connect off-chip. 4.25.3 Memory map and registers This section describes the memory map and registers for the Flash module. Read data from unimplemented memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space in the Flash module will be ignored by the Flash module. 4.25.3.1 Module memory map The S12 architecture places the P-Flash memory between global addresses 0x2_0000 and 0x3_FFFF, as shown in Table 461.The P-Flash memory map is shown in Figure 110. Table 461. P-flash memory addressing Global address Size (bytes) Description 0x2_0000 - 0x3_FFFF 128 k P-Flash Block Contains Flash Configuration Field (see Table 462) The FPROT register, described in Section 4.25.3.2.9, "P-flash protection register (FPROT)", can be set to protect regions in the Flash memory from accidental program or erase. Three separate memory regions, one growing upward from global address 0x3_8000 in the Flash memory (called the lower region), one growing downward from global address 0x3_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash memory, can be activated for protection. The Flash memory addresses covered by these protectable regions are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader code since it covers the vector space. Default protection settings as well as security information that allows the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in Table 462. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 462. Flash configuration field Global address Size (bytes) Description 0x3_FF00-0x3_FF07 8 Backdoor Comparison Key Refer to Section 4.25.4.5.11, "Verify backdoor access key command", and Section 4.25.5.1, "Unsecuring the MCU using backdoor key access". 0x3_FF08-0x3_FF0B(283) 4 Reserved 0x3_FF0C(283) 1 P-Flash Protection byte. Refer to Section 4.25.3.2.9, "P-flash protection register (FPROT)". 0x3_FF0D(283) 1 D-Flash Protection byte. Refer to Section 4.25.3.2.10, "D-flash protection register (DFPROT)". 0x3_FF0E(283) 1 Flash Nonvolatile byte Refer to Section 4.25.3.2.16, "Flash option register (FOPT)". 0x3_FF0F(283) 1 Flash Security byte Refer to Section 4.25.3.2.2, "Flash security register (FSEC)". Notes 283. 0x3FF08-0x3_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in the 0x3_FF08 - 0x3_FF0B reserved field should be programmed to 0xFF. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS P-Flash START = 0x2_0000 Flash Protected/Unprotected Region 96 kbytes 0x3_8000 0x3_8400 0x3_8800 0x3_9000 Protection Fixed End Flash Protected/Unprotected Lower Region 1.0, 2.0, 4.0, 8.0 kbytes 0x3_A000 Flash Protected/Unprotected Region 8.0 kbytes (up to 29 kbytes) Protection Movable End 0x3_C000 Protection Fixed End 0x3_E000 Flash Protected/Unprotected Higher Region 2.0, 4.0, 8.0, 16 kbytes 0x3_F000 0x3_F800 P-Flash END = 0x3_FFFF Flash Configuration Field 16 bytes (0x3_FF00 - 0x3_FF0F) Figure 110. P-flash memory map Table 463. Program IFR fields Global Address Size (Bytes) Field description 0x01_8000 - 0x01_8007 8 Reserved 0x01_8008 - 0x01_80B5 174 Reserved 0x01_80B6 - 0x01_80B7 2 Version ID(284) 0x01_80B8 - 0x01_80BF 8 Reserved 0x01_80C0 - 0x01_80FF 64 Program Once Field. Refer to Section 4.25.4.5.6, "Program once command". Notes 284. Used to track firmware patch versions, see Section 4.25.4.2, "IFR version ID word". MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.25.3.2 Register descriptions The Flash module contains a set of 20 control and status registers located between 0x0100 and 0x0113. A summary of the Flash module registers is given in Table 464 with detailed descriptions in the following subsections. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and adversely affect Memory Controller behavior. Table 464. FTMRC128K1 register summary Address & Name 0x0100 FCLKDIV 0x0101 FSEC 0x0102 FCCOBIX 0x0103 FRSV0 0x0104 FCNFG 0x0105 FERCNFG 0x0106 FSTAT 0x0107 FERSTAT 0x0108 FPROT 0x0109 DFPROT 0x010A FCCOBHI 0x010B FCCOBLO 0x010C FRSV1 0x010D FRSV2 0x010E FRSV3 7 R 6 5 4 3 2 1 0 FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0 KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0 0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0 0 0 0 0 0 0 0 0 0 0 0 0 FDFD FSFD 0 0 0 0 0 DFDIE SFDIE ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0 0 0 0 0 DFDIF SFDIF FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0 0 0 0 DPS3 DPS2 DPS1 DPS0 CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 FDIVLD W R W R W R W R W R CCIE 0 IGNSF W R W R CCIF 0 0 0 W R W R W R W R W R FPOPEN DPOPEN RNV6 W R W R W MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 464. FTMRC128K1 register summary (continued) Address & Name R 0x010F FRSV4 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R 0x0110 FOPT W R 0x0111 FRSV5 W R 0x0112 FRSV6 W R 0x01103 FRSV7 W = Unimplemented or Reserved 4.25.3.2.1 Flash clock divider register (FCLKDIV) The FCLKDIV register is used to control timed events in program and erase algorithms. Table 465. Flash clock divider register (FCLKDIV) Address: 0x0100 7 R 6 FDIVLD W Reset 0 5 4 3 FDIVLCK 0 2 1 0 0 0 0 FDIV[5:0] 0 0 0 = Unimplemented or Reserved All bits in the FCLKDIV register are readable, bit 7 is not writable, bit 6 is write-once-hi and controls the writability of the FDIV field. CAUTION The FCLKDIV register must never be written to while a Flash command is executing (CCIF=0). The FCLKDIV register is writable during the Flash reset sequence even though CCIF is clear. Table 466. FCLKDIV field descriptions Field 7 FDIVLD Description Clock Divider Loaded 0 FCLKDIV register has not been written since the last reset 1 FCLKDIV register has been written since the last reset 6 FDIVLCK Clock Divider Locked 0 FDIV field is open for writing 1 FDIV value is locked and cannot be changed. Once the lock bit is set high, only reset can clear this bit and restore writability to the FDIV field. 5-0 FDIV[5:0] Clock Divider Bits -- FDIV[5:0] must be set to effectively divide BUSCLK down to 1.0 MHz to control timed events during Flash program and erase algorithms. Table 467 shows recommended values for FDIV[5:0] based on the BUSCLK frequency. Refer to Section 4.25.4.3, "Flash command operations", for more information. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 467. FDIV values for various BUSCLK frequencies BUSCLK frequency (MHz) MIN. (285) MAX. (286) 1.0 1.6 1.6 BUSCLK frequency (MHz) FDIV[5:0] FDIV[5:0] MIN. (285) MAX. (286) 0x00 16.6 17.6 0x10 2.6 0x01 17.6 18.6 0x11 2.6 3.6 0x02 18.6 19.6 0x12 3.6 4.6 0x03 19.6 20.6 0x13 4.6 5.6 0x04 20.6 21.6 0x14 5.6 6.6 0x05 21.6 22.6 0x15 6.6 7.6 0x06 22.6 23.6 0x16 7.6 8.6 0x07 23.6 24.6 0x17 8.6 9.6 0x08 24.6 25.6 0x18 9.6 10.6 0x09 25.6 26.6 0x19 10.6 11.6 0x0A 26.6 27.6 0x1A 11.6 12.6 0x0B 27.6 28.6 0x1B 12.6 13.6 0x0C 28.6 29.6 0x1C 13.6 14.6 0x0D 29.6 30.6 0x1D 14.6 15.6 0x0E 30.6 31.6 0x1E 15.6 16.6 0x0F 31.6 32.6 0x1F Notes 285. BUSCLK is Greater Than this value. 286. BUSCLK is Less Than or Equal to this value. 4.25.3.2.2 Flash security register (FSEC) The FSEC register holds all bits associated with the security of the MCU and Flash module. Table 468. Flash security register (FSEC) Address: 0x0101 7 R 6 5 4 KEYEN[1:0] 3 2 1 RNV[5:2] 0 SEC[1:0] W Reset F F F F F F F F = Unimplemented or Reserved All bits in the FSEC register are readable, but not writable. During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the Flash configuration field at global address 0x3_FF0F located in P-Flash memory (see Table 462), as indicated by reset condition F in Figure 468. If a double bit fault is detected, while reading the P-Flash phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set to leave the Flash module in a secured state with backdoor key access disabled. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 469. FSEC field descriptions Field Description 7-6 KEYEN[1:0] Backdoor Key Security Enable Bits -- The KEYEN[1:0] bits define the enabling of backdoor key access to the Flash module as shown in Table 470. 5-2 RNV[5:2} Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements. 1-0 SEC[1:0] Flash Security Bits -- The SEC[1:0] bits define the security state of the MCU as shown in Table 471. If the Flash module is unsecured using backdoor key access, the SEC bits are forced to 10. Table 470. Flash KEYEN states KEYEN[1:0] Status of backdoor key access 00 DISABLED 01 DISABLED(287) 10 ENABLED 11 DISABLED Notes 287. Preferred KEYEN state to disable backdoor key access. Table 471. Flash Security States SEC[1:0] Status of security 00 SECURED 01 SECURED(288) 10 UNSECURED 11 SECURED Notes 288. Preferred SEC state to set MCU to secured state. The security function in the Flash module is described in Section 4.25.5, "Security". 4.25.3.2.3 Flash CCOB index register (FCCOBIX) The FCCOBIX register is used to index the FCCOB register for Flash memory operations. Table 472. FCCOB index register (FCCOBIX) Address: 0x0102 R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 CCOBIX[2:0] W Reset 1 0 0 0 = Unimplemented or Reserved CCOBIX bits are readable and writable while remaining bits read 0 and are not writable. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 473. FCCOBIX field descriptions Field Description 2-0 CCOBIX[1:0] Common Command Register Index-- The CCOBIX bits are used to select to which word of the FCCOB register array is being read or written. See Section 4.25.3.2.11, "Flash common command object register (FCCOB)" for more details. 4.25.3.2.4 Flash reserved0 register (FRSV0) This Flash register is reserved for factory testing. Table 474. Flash reserved0 register (FRSV0) Address: 0x0103 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved All bits in the FRSV0 register read 0 and are not writable. 4.25.3.2.5 Flash configuration register (FCNFG) The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array read access from the CPU. Table 475. Flash configuration register (FCNFG) Address: 0x0104 7 R W Reset CCIE 0 6 5 0 0 0 0 4 IGNSF 0 3 2 0 0 0 0 1 0 FDFD FSFD 0 0 = Unimplemented or Reserved CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not writable. Table 476. FCNFG field descriptions Field 7 CCIE 4 IGNSF Description Command Complete Interrupt Enable -- The CCIE bit controls interrupt generation when a Flash command has completed. 0 Command complete interrupt disabled 1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 4.25.3.2.7, "Flash status register (FSTAT)") Ignore Single Bit Fault -- The IGNSF controls single bit fault reporting in the FERSTAT register (see Section 4.25.3.2.8, "Flash error status register (FERSTAT)"). 0 All single bit faults detected during array reads are reported 1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be generated MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 476. FCNFG field descriptions (continued) Field Description 1 FDFD Force Double Bit Fault Detect -- The FDFD bit allows the user to simulate a double bit fault during Flash array read operations, and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD. The FECCR registers will not be updated during the Flash array read operation with FDFD set unless an actual double bit fault is detected. 0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected 1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see Section 4.25.3.2.7, "Flash status register (FSTAT)") and an interrupt will be generated, as long as the DFDIE interrupt enable in the FERCNFG register is set (see Section 4.25.3.2.6, "Flash error configuration register (FERCNFG)") 0 FSFD Force Single Bit Fault Detect -- The FSFD bit allows the user to simulate a single bit fault during Flash array read operations, and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD. The FECCR registers will not be updated during the Flash array read operation with FSFD set unless an actual single bit fault is detected. 0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected 1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 4.25.3.2.7, "Flash status register (FSTAT)"), and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see Section 4.25.3.2.6, "Flash error configuration register (FERCNFG)") 4.25.3.2.6 Flash error configuration register (FERCNFG) The FERCNFG register enables the Flash error interrupts for the FERSTAT flags. Table 477. Flash error configuration register (FERCNFG) Address: 0x0105 R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 DFDIE SFDIE 0 0 = Unimplemented or Reserved All assigned bits in the FERCNFG register are readable and writable. Table 478. FERCNFG field descriptions Field Description 1 DFDIE Double Bit Fault Detect Interrupt Enable -- The DFDIE bit controls interrupt generation when a double bit fault is detected during a Flash block read operation. 0 DFDIF interrupt disabled 1 An interrupt will be requested whenever the DFDIF flag is set (see Section 4.25.3.2.8, "Flash error status register (FERSTAT)") 0 SFDIE Single Bit Fault Detect Interrupt Enable -- The SFDIE bit controls interrupt generation when a single bit fault is detected during a Flash block read operation. 0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 4.25.3.2.8, "Flash error status register (FERSTAT)") 1 An interrupt will be requested whenever the SFDIF flag is set (see Section 4.25.3.2.8, "Flash error status register (FERSTAT)") MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.25.3.2.7 Flash status register (FSTAT) The FSTAT register reports the operational status of the Flash module. Table 479. Flash status register (FSTAT) Address: 0x0106 7 R W Reset CCIF 1 6 0 0 5 4 ACCERR FPVIOL 0 0 3 2 MGBUSY RSVD 0 0 1 0 MGSTAT[1:0] 0(289) 0(289) = Unimplemented or Reserved Notes 289. Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 4.25.6, "Initialization"). CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable but not writable, while remaining bits read 0 and are not writable. Table 480. FSTAT field descriptions Field Description 7 CCIF Command Complete Interrupt Flag -- The CCIF flag indicates that a Flash command has completed. The CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command completion or command violation. 0 Flash command in progress 1 Flash command has completed 5 ACCERR Flash Access Error Flag -- The ACCERR bit indicates an illegal access has occurred to the Flash memory caused by either a violation of the command write sequence (see Section 4.25.4.3.2, "Command write sequence") or issuing an illegal Flash command. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR. 0 No access error detected 1 Access error detected 4 FPVIOL Flash Protection Violation Flag --The FPVIOL bit indicates an attempt was made to program or erase an address in a protected area of P-Flash or D-Flash memory during a command write sequence. The FPVIOL bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL is set, it is not possible to launch a command or start a command write sequence. 0 No protection violation detected 1 Protection violation detected 3 MGBUSY 2 RSVD 1-0 MGSTAT[1:0] Memory Controller Busy Flag -- The MGBUSY flag reflects the active state of the Memory Controller. 0 Memory Controller is idle 1 Memory Controller is busy executing a Flash command (CCIF = 0) Reserved Bit -- This bit is reserved and always reads 0. Memory Controller Command Completion Status Flag -- One or more MGSTAT flag bits are set if an error is detected during execution of a Flash command or during the Flash reset sequence. See Section 4.25.4.5, "Flash command description", and Section 4.25.6, "Initialization", for details. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.25.3.2.8 Flash error status register (FERSTAT) The FERSTAT register reflects the error status of internal Flash operations. Table 481. Flash error status register (FERSTAT) Address: 0x0107 R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 DFDIF SFDIF 0 0 = Unimplemented or Reserved All flags in the FERSTAT register are readable and only writable to clear the flag. Table 482. FERSTAT field descriptions Field Description 1 DFDIF Double Bit Fault Detect Interrupt Flag -- The setting of the DFDIF flag indicates that a double bit fault was detected in the stored parity and data bits during a Flash array read operation, or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation.(290) The DFDIF flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF. 0 No double bit fault detected 1 Double bit fault detected or an invalid Flash array read operation attempted 0 SFDIF Single Bit Fault Detect Interrupt Flag -- With the IGNSF bit in the FCNFG register clear, the SFDIF flag indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation, or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation.(290) The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on SFDIF. 0 No single bit fault detected 1 Single bit fault detected and corrected or an invalid Flash array read operation attempted Notes 290. The single bit fault and double bit fault flags are mutually exclusive for parity errors (an ECC fault occurrence can be either single fault or double fault but never both). A simultaneous access collision (read attempted while command running) is indicated when both SFDIF and DFDIF flags are high. 4.25.3.2.9 P-flash protection register (FPROT) The FPROT register defines which P-Flash sectors are protected against program and erase operations. Table 483. Flash protection register (FPROT) Address: 0x0108 7 R W Reset FPOPEN F 6 5 RNV6 F 4 FPHDIS F 3 FPHS[1:0] F 2 1 FPLDIS F F 0 FPLS[1:0] F F = Unimplemented or Reserved The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected region can only be increased (see Section 4.25.3.2.9.1, "P-flash protection restrictions", and Table 488). During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte in the Flash configuration field at global address 0x3_FF0C located in P-Flash memory (see Table 462), as indicated by reset condition `F' in Figure 483. To change the P-Flash protection that will be loaded during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if any of the P-Flash sectors contained in the same P-Flash block are protected. Table 484. FPROT field descriptions Field Description 7 FPOPEN Flash Protection Operation Enable -- The FPOPEN bit determines the protection function for program or erase operations as shown in Table 485, for the P-Flash block. 0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the corresponding FPHS and FPLS bits 1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the corresponding FPHS and FPLS bits 6 RNV[6] Reserved Nonvolatile Bit -- The RNV bit should remain in the erased state for future enhancements. 5 FPHDIS Flash Protection Higher Address Range Disable -- The FPHDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x3_FFFF. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled 4-3 FPHS[1:0] Flash Protection Higher Address Size -- The FPHS bits determine the size of the protected/unprotected area in P-Flash memory as shown inTable 486. The FPHS bits can only be written to while the FPHDIS bit is set. 2 FPLDIS Flash Protection Lower Address Range Disable -- The FPLDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x3_8000. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled 1-0 FPLS[1:0] Flash Protection Lower Address Size -- The FPLS bits determine the size of the protected/unprotected area in P-Flash memory as shown in Table 487. The FPLS bits can only be written to while the FPLDIS bit is set. Table 485. P-flash protection function Function(291) FPOPEN FPHDIS FPLDIS 1 1 1 No P-Flash Protection 1 1 0 Protected Low Range 1 0 1 Protected High Range 1 0 0 Protected High and Low Ranges 0 1 1 Full P-Flash Memory Protected 0 1 0 Unprotected Low Range 0 0 1 Unprotected High Range 0 0 0 Unprotected High and Low Ranges Notes 291. For range sizes, refer to Table 486 and Table 487. Table 486. P-flash protection higher address range FPHS[1:0] Global address range Protected size 00 0x3_F800-0x3_FFFF 2.0 kbytes 01 0x3_F000-0x3_FFFF 4.0 kbytes 10 0x3_E000-0x3_FFFF 8.0 kbytes 11 0x3_C000-0x3_FFFF 16 kbytes MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 487. P-Flash protection lower address range FPLS[1:0] Global address range Protected size 00 0x3_8000-0x3_83FF 1.0 kbyte 01 0x3_8000-0x3_87FF 2.0 kbytes 10 0x3_8000-0x3_8FFF 4.0 kbytes 11 0x3_8000-0x3_9FFF 8.0 kbytes FPHDIS = 0 FPLDIS = 0 7 6 5 4 3 2 1 0 0x3_8000 FLASH START FPLS[1:0] 0x3_FFFF Scenario FPHS[1:0] 0x3_8000 FPOPEN = 0 FPHDIS = 0 FPLDIS = 1 FPLS[1:0] FPHDIS = 1 FPLDIS = 0 FPHS[1:0] Scenario FLASH START FPHDIS = 1 FPLDIS = 1 FPOPEN = 1 All possible P-Flash protection scenarios are shown in Figure 111. Although the protection scheme is loaded from the Flash memory at global address 0x3_FF0C during the reset sequence, it can be changed by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single chip mode while providing as much protection as possible, if reprogramming is not required. 0x3_FFFF Unprotected region Protected region with size defined by FPLS Protected region not defined by FPLS, FPHS Protected region with size defined by FPHS Figure 111. P-flash protection scenarios MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.25.3.2.9.1 P-flash protection restrictions The general guideline is that P-Flash protection can only be added and not removed. Table 488 specifies all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario. See the FPHS and FPLS bit descriptions for additional restrictions. Table 488. P-flash protection scenario transitions To Protection Scenario(292) From protection scenario 0 1 2 3 0 X X X X X 1 4 X X 4 X X X X X X X X X 5 X X 7 X 3 7 6 X 2 6 5 X X X X X X X Notes 292. Allowed transitions marked with X, see Figure 111 for a definition of the scenarios. 4.25.3.2.10 D-flash protection register (DFPROT) The DFPROT register defines which D-Flash sectors are protected against program and erase operations. Table 489. D-flash protection register (DFPROT) Address: 0x0109 7 R W Reset DPOPEN F 6 5 4 0 0 0 0 0 0 3 2 1 0 F F DPS[3:0] F F = Unimplemented or Reserved The (unreserved) bits of the DFPROT register are writable with the restriction that protection can be added but not removed. Writes must increase the DPS value and the DPOPEN bit can only be written from a 1 (protection disabled) to a 0 (protection enabled). If the DPOPEN bit is set, the state of the DPS bits is irrelevant. During the reset sequence, the DFPROT register is loaded with the contents of the D-Flash protection byte in the Flash configuration field at global address 0x3_FF0D located in P-Flash memory (see Table 462) as indicated by reset condition F in Figure 489. To change the D-Flash protection that will be loaded during the reset sequence, the P-Flash sector containing the D-Flash protection byte must be unprotected, then the D-Flash protection byte must be programmed. If a double bit fault is detected while reading the P-Flash phrase containing the D-Flash protection byte during the reset sequence, the DPOPEN bit will be cleared and DPS bits will be set to leave the D-Flash memory fully protected. Trying to alter data in any protected area in the D-Flash memory will result in a protection violation error, and the FPVIOL bit will be set in the FSTAT register. Block erase of the D-Flash memory is not possible if any of the D-Flash sectors are protected. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 490. DFPROT field descriptions Field Description 7 DPOPEN D-Flash Protection Control 0 Enables D-Flash memory protection from program and erase with protected address range defined by DPS bits 1 Disables D-Flash memory protection from program and erase 3-0 DPS[3:0] D-Flash Protection Size -- The DPS[3:0] bits determine the size of the protected area in the D-Flash memory as shown in Table 491. Table 491. D-flash protection address range DPS[3:0] Global address range Protected size 0000 0x0_4400 - 0x0_44FF 256 bytes 0001 0x0_4400 - 0x0_45FF 512 bytes 0010 0x0_4400 - 0x0_46FF 768 bytes 0011 0x0_4400 - 0x0_47FF 1024 bytes 0100 0x0_4400 - 0x0_48FF 1280 bytes 0101 0x0_4400 - 0x0_49FF 1536 bytes 0110 0x0_4400 - 0x0_4AFF 1792 bytes 0111 0x0_4400 - 0x0_4BFF 2048 bytes 1000 0x0_4400 - 0x0_4CFF 2304 bytes 1001 0x0_4400 - 0x0_4DFF 2560 bytes 1010 0x0_4400 - 0x0_4EFF 2816 bytes 1011 0x0_4400 - 0x0_4FFF 3072 bytes 1100 0x0_4400 - 0x0_50FF 3328 bytes 1101 0x0_4400 - 0x0_51FF 3584 bytes 1110 0x0_4400 - 0x0_52FF 3840 bytes 1111 0x0_4400 - 0x0_53FF 4096 bytes 4.25.3.2.11 Flash common command object register (FCCOB) The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register. Byte wide reads and writes are allowed to the FCCOB register. Table 492. Flash common command object high register (FCCOBHI) Address: 0x010A 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[15:8] W Reset 3 0 0 0 0 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 493. Flash common command object low register (FCCOBLO) Address: 0x010B 7 6 5 4 R 3 2 1 0 0 0 0 0 CCOB[7:0] W Reset 0 0 0 0 4.25.3.2.11.1 FCCOB - NVM command mode NVM command mode uses the indexed FCCOB register to provide a command code and its relevant parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates the command's execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the FCCOB register array. The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 494. The return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX = 111) are ignored with reads from these fields returning 0x0000. Table 494 shows the generic Flash command format. The high byte of the first word in the CCOB array contains the command code, followed by the parameters for this specific Flash command. For details on the FCCOB settings required by each command, see the Flash command descriptions in Section 4.25.4.5, "Flash command description". Table 494. FCCOB - NVM command mode (typical usage) CCOBIX[2:0] 000 001 010 011 100 101 Byte FCCOB parameter fields (NVM command mode) HI FCMD[7:0] defining Flash command LO 6'h0, Global address [17:16] HI Global address [15:8] LO Global address [7:0] HI Data 0 [15:8] LO Data 0 [7:0] HI Data 1 [15:8] LO Data 1 [7:0] HI Data 2 [15:8] LO Data 2 [7:0] HI Data 3 [15:8] LO Data 3 [7:0] MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.25.3.2.12 Flash reserved1 register (FRSV1) This Flash register is reserved for factory testing. Table 495. Flash reserved1 register (FRSV1) Address: 0x010C R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved All bits in the FRSV1 register read 0 and are not writable. 4.25.3.2.13 Flash reserved2 register (FRSV2) This Flash register is reserved for factory testing. Table 496. Flash reserved2 register (FRSV2) Address: 0x010D R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved All bits in the FRSV2 register read 0 and are not writable. 4.25.3.2.14 Flash reserved3 register (FRSV3) This Flash register is reserved for factory testing. Table 497. Flash reserved3 register (FRSV3) Address: 0x010E R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved All bits in the FRSV3 register read 0 and are not writable. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.25.3.2.15 Flash reserved4 register (FRSV4) This Flash register is reserved for factory testing. Table 498. Flash reserved4 register (FRSV4) Address: 0x010F R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 4 3 2 1 0 F F F F W Reset = Unimplemented or Reserved All bits in the FRSV4 register read 0 and are not writable. 4.25.3.2.16 Flash option register (FOPT) The FOPT register is the Flash option register. Table 499. Flash option register (FOPT) Address: 0x0110 7 6 5 R NV[7:0] W Reset F F F F = Unimplemented or Reserved All bits in the FOPT register are readable but are not writable. During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash configuration field, at global address 0x3_FF0E located in P-Flash memory (see Table 462), as indicated by reset condition F in Figure 499. If a double bit fault is detected while reading the P-Flash phrase containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set. Table 500. FOPT field descriptions Field 7-0 NV[7:0] Description Nonvolatile Bits -- The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper use of the NV bits. 4.25.3.2.17 Flash reserved5 register (FRSV5) This Flash register is reserved for factory testing. Table 501. Flash reserved5 register (FRSV5) Address: 0x0111 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved All bits in the FRSV5 register read 0 and are not writable. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.25.3.2.18 Flash reserved6 register (FRSV6) This Flash register is reserved for factory testing. Table 502. Flash reserved6 register (FRSV6) Address: 0x0112 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved All bits in the FRSV6 register read 0 and are not writable. 4.25.3.2.19 Flash reserved7 register (FRSV7) This Flash register is reserved for factory testing. Table 503. Flash reserved7 register (FRSV7) Address: 0x0113 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved All bits in the FRSV7 register read 0 and are not writable. 4.25.4 Functional description 4.25.4.1 Modes of operation The FTMRC128K1 module provides the modes of operation, as shown in Table 504. The operating mode is determined by module-level inputs and affects the FCLKDIV, FCNFG, and DFPROT registers, Scratch RAM writes, and the command set availability (see Table 506). Table 504. Modes and mode control inputs Operating mode 4.25.4.2 FTMRC input mmc_mode_ss_t2 Normal: 0 Special: 1 IFR version ID word The version ID word is stored in the IFR at address 0x01_80B6. The contents of the word are defined in Table 505. Table 505. IFR version ID fields [15:4] [3:0] Reserved VERNUM VERNUM: Version number. The first version is number 0b_0001 with both 0b_0000 and 0b_1111 meaning `none'. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.25.4.3 Flash command operations Flash command operations are used to modify Flash memory contents. The next sections describe: * How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from BUSCLK for Flash program and erase command operations * The command write sequence used to set Flash command parameters and launch execution * Valid Flash commands available for execution 4.25.4.3.1 Writing the FCLKDIV register Prior to issuing any Flash program or erase command after a reset, the user is required to write the FCLKDIV register to divide BUSCLK down to a target FCLK of 1.0 MHz. Table 467 shows recommended values for the FDIV field based on BUSCLK frequency. NOTE Programming or erasing the Flash memory cannot be performed if the bus clock runs at less than 0.8 MHz. Setting FDIV too high can destroy the Flash memory due to overstress. Setting FDIV too low can result in incomplete programming or erasure of the Flash memory cells. When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written, any Flash program or erase command loaded during a command write sequence will not execute and the ACCERR bit in the FSTAT register will set. 4.25.4.3.2 Command write sequence The Memory Controller will launch all valid Flash commands entered using a command write sequence. Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see Section 4.25.3.2.7, "Flash status register (FSTAT)") and the CCIF flag should be tested to determine the status of the current command write sequence. If CCIF is 0, the previous command write sequence is still active and a new command write sequence cannot be started, and all writes to the FCCOB register are ignored. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. 4.25.4.3.2.1 Define FCCOB contents The FCCOB parameter fields must be loaded with all required parameters for the Flash command being executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX register (see Section 4.25.3.2.3, "Flash CCOB index register (FCCOBIX)"). The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag will remain clear until the Flash command has completed. Upon completion, the Memory Controller will return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic command write sequence is shown in Figure 112. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS START Read: FCLKDIV register Clock Divider Value Check FDIV Correct? no no Read: FSTAT register yes FCCOB Availability Check CCIF Set? yes Read: FSTAT register Note: FCLKDIV must be set after each reset Write: FCLKDIV register no CCIF Set? yes Results from previous Command ACCERR/ FPVIOL Set? no Access Error and Protection Violation Check yes Write: FSTAT register Clear ACCERR/FPVIOL 0x30 Write to FCCOBIX register to identify specific command parameter to load. Write to FCCOB register to load required command parameter. More Parameters? yes no Write: FSTAT register (to launch command) Clear CCIF 0x80 Read: FSTAT register Bit Polling for Command Completion Check CCIF Set? no yes EXIT Figure 112. Generic flash command write sequence flowchart MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.25.4.3.3 Valid flash module commands Table 506. Flash commands by mode FCMD Command Unsecured Secured NS(293) SS(294) NS(295) SS(296) 0x01 Erase Verify All Blocks 0x02 Erase Verify Block 0x03 Erase Verify P-Flash Section 0x04 Read Once 0x06 Program P-Flash 0x07 Program Once 0x08 Erase All Blocks 0x09 Erase Flash Block 0x0A Erase P-Flash Sector 0x0B Unsecure Flash 0x0C Verify Backdoor Access Key 0x0D Set User Margin Level 0x0E Set Field Margin Level 0x10 Erase Verify D-Flash Section 0x11 Program D-Flash 0x12 Erase D-Flash Sector Notes 293. Unsecured Normal Single Chip mode. 294. Unsecured Special Single Chip mode. 295. Secured Normal Single Chip mode. 296. Secured Special Single Chip mode. 4.25.4.3.4 P-flash commands Table 507 summarizes the valid P-Flash commands along with the effects of the commands on the P-Flash block and other resources within the Flash module. Table 507. P-flash commands FCMD Command 0x01 Erase Verify All Blocks 0x02 Erase Verify Block 0x03 Function on P-flash memory Verify that all P-Flash (and D-Flash) blocks are erased. Verify that a P-Flash block is erased. Erase Verify P-Flash Section Verify that a given number of words starting at the address provided are erased. 0x04 Read Once 0x06 Program P-Flash 0x07 Program Once 0x08 Erase All Blocks Read a dedicated 64-byte field in the nonvolatile information register in P-Flash block that was previously programmed using the Program Once command. Program a phrase in a P-Flash block. Program a dedicated 64-byte field in the nonvolatile information register in P-Flash block that is allowed to be programmed only once. Erase all P-Flash (and D-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the DPOPEN bit in the DFPROT register are set prior to launching the command. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 507. P-flash commands (continued) FCMD Command 0x09 Erase Flash Block 0x0A Erase P-Flash Sector 0x0B Unsecure Flash 0x0C Function on P-flash memory Erase a P-Flash (or D-Flash) block. An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN bits in the FPROT register are set prior to launching the command. Erase all bytes in a P-Flash sector. Supports a method of releasing MCU security by erasing all P-Flash (and D-Flash) blocks and verifying that all P-Flash (and D-Flash) blocks are erased. Verify Backdoor Access Key Supports a method of releasing MCU security by verifying a set of security keys. 0x0D Set User Margin Level Specifies a user margin read level for all P-Flash blocks. 0x0E Set Field Margin Level Specifies a field margin read level for all P-Flash blocks (special modes only). 4.25.4.3.5 D-flash commands Table 508 summarizes the valid D-Flash commands along with the effects of the commands on the D-Flash block. Table 508. D-flash commands FCMD Command Function on D-flash memory 0x01 Erase Verify All Blocks 0x02 Erase Verify Block 0x08 Erase All Blocks 0x09 Erase Flash Block 0x0B Unsecure Flash 0x0D Set User Margin Level Specifies a user margin read level for the D-Flash block. 0x0E Set Field Margin Level Specifies a field margin read level for the D-Flash block (special modes only). 0x10 Erase Verify D-Flash Section 0x11 Program D-Flash Program up to four words in the D-Flash block. 0x12 Erase D-Flash Sector Erase all bytes in a sector of the D-Flash block. Verify that all D-Flash (and P-Flash) blocks are erased. Verify that the D-Flash block is erased. Erase all D-Flash (and P-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the DPOPEN bit in the DFPROT register are set prior to launching the command. Erase a D-Flash (or P-Flash) block. An erase of the full D-Flash block is only possible when DPOPEN bit in the DFPROT register is set prior to launching the command. Supports a method of releasing MCU security by erasing all D-Flash (and P-Flash) blocks and verifying that all D-Flash (and P-Flash) blocks are erased. Verify that a given number of words starting at the address provided are erased. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.25.4.4 Allowed simultaneous P-flash and D-flash operations Only the operations marked `OK' in Table 509 are permitted to be run simultaneously on the Program Flash and Data Flash blocks. Some operations cannot be executed simultaneously because certain hardware resources are shared by the two memories. The priority has been placed on permitting Program Flash reads while program and erase operations execute on the Data Flash, providing read (P-Flash) while write (D-Flash) functionality. Table 509. Allowed P-flash and D-flash simultaneous operations Data flash Program flash Margin read Read (297) Program Sector erase Read OK OK OK Margin read (297) OK(298) Mass erase (299) Program OK Sector erase Mass erase (299) OK Notes 297. A `Margin Read' is any read after executing the margin setting commands `Set User Margin Level', or `Set Field Margin Level' with anything but the `normal' level specified. 298. See the Note on margin settings in Section 4.25.4.5.12, "Set user margin level command" and Section 4.25.4.5.13, "Set field margin level command". 299. The `Mass Erase' operations are commands `Erase All Blocks' and `Erase Flash Block'. 4.25.4.5 Flash command description This section provides details of all available Flash commands launched by a command write sequence. The ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following illegal steps are performed, causing the command not to be processed by the Memory Controller: * Starting any command write sequence that programs or erases Flash memory before initializing the FCLKDIV register * Writing an invalid command as part of the command write sequence * For additional possible errors, refer to the error handling table provided for each command If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation will return invalid data. If the SFDIF or DFDIF flags were not previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set. If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting any command write sequence (see Section 4.25.3.2.7, "Flash status register (FSTAT)"). CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. 4.25.4.5.1 Erase verify all blocks command The Erase Verify All Blocks command will verify that all P-Flash and D-Flash blocks have been erased. Table 510. Erase verify all blocks command FCCOB requirements CCOBIX[2:0] 000 FCCOB parameters 0x01 Not required Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks operation has completed. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 511. Erase verify all blocks command error handling Register Error bit ACCERR FPVIOL FSTAT 4.25.4.5.2 Error condition Set if CCOBIX[2:0]!= 000 at command launch None MGSTAT1 Set if any errors have been encountered during the read MGSTAT0 Set if any non-correctable errors have been encountered during the read Erase verify block command The Erase Verify Block command allows the user to verify that an entire P-Flash or D-Flash block has been erased. The FCCOB upper global address bits determine which block must be verified. Table 512. Erase verify block command FCCOB requirements CCOBIX[2:0] FCCOB parameters 000 0x02 Global address [17:16] of the Flash block to be verified. Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that the selected P-Flash or D-Flash block is erased. The CCIF flag will set after the Erase Verify Block operation has completed. Table 513. Erase verify block command error handling Register Error bit ACCERR FSTAT 4.25.4.5.3 FPVIOL Error condition Set if CCOBIX[2:0]!= 000 at command launch Set if an invalid global address [17:16] is supplied None MGSTAT1 Set if any errors have been encountered during the read MGSTAT0 Set if any non-correctable errors have been encountered during the read Erase verify P-flash section command The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and the number of phrases. Table 514. Erase verify P-flash section command FCCOB requirements CCOBIX[2:0] 000 FCCOB Parameters 0x03 Global address [17:16] of a P-Flash block 001 Global address [15:0] of the first phrase to be verified 010 Number of phrases to be verified Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash Section operation has completed. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 515. Erase verify P-flash section command error handling Register Error bit Error condition Set if CCOBIX[2:0]!= 010 at command launch Set if command not available in current mode (see Table 506) ACCERR Set if a misaligned phrase address is supplied (global address [2:0]!= 000) FSTAT Set if the requested section crosses a 128 kbyte boundary FPVIOL 4.25.4.5.4 Set if an invalid global address [17:0] is supplied None MGSTAT1 Set if any errors have been encountered during the read MGSTAT0 Set if any non-correctable errors have been encountered during the read Read once command The Read Once command provides read access to a reserved 64-byte field (8 phrases) located in the nonvolatile information register of P-Flash. The Read Once field is programmed using the Program Once command described in Section 4.25.4.5.6, "Program once command". The Read Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 516. Read once command FCCOB requirements CCOBIX[2:0] FCCOB parameters 000 0x04 Not Required 001 Read Once phrase index (0x0000 - 0x0007) 010 Read Once word 0 value 011 Read Once word 1 value 100 Read Once word 2 value 101 Read Once word 3 value Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the Read Once command, any attempt to read addresses within P-Flash block will return invalid data. Table 517. Read once command error handling Register Error bit Error condition Set if CCOBIX[2:0]!= 001 at command launch ACCERR FSTAT 4.25.4.5.5 Set if command not available in current mode (see Table 506) Set if an invalid phrase index is supplied FPVIOL None MGSTAT1 Set if any errors have been encountered during the read MGSTAT0 Set if any non-correctable errors have been encountered during the read Program P-flash command The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an embedded algorithm. CAUTION A P-Flash phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash phrase is not allowed. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 518. Program P-flash command FCCOB requirements CCOBIX[2:0] FCCOB Parameters 000 0x06 Global address [17:16] to identify P-Flash block 001 Global address [15:0] of phrase location to be programmed(300) 010 Word 0 program value 011 Word 1 program value 100 Word 2 program value 101 Word 3 program value Notes 300. Global address [2:0] must be 000 Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the data words to the supplied global address and will then proceed to verify the data words read back as expected. The CCIF flag will set after the Program P-Flash operation has completed. Table 519. Program P-flash command error handling Register Error bit Error condition Set if CCOBIX[2:0]!= 101 at command launch Set if command not available in current mode (see Table 506) ACCERR Set if an invalid global address [17:0] is supplied FSTAT Set if a misaligned phrase address is supplied (global address [2:0]!= 000) FPVIOL 4.25.4.5.6 Set if the global address [17:0] points to a protected area MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Program once command The Program Once command restricts programming to a reserved 64-byte field (8 phrases) in the nonvolatile information register located in P-Flash. The Program Once reserved field can be read using the Read Once command as described in Section 4.25.4.5.4, "Read once command". The Program Once command must only be issued once, since the nonvolatile information register in P-Flash cannot be erased. The Program Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 520. Program once command FCCOB requirements CCOBIX[2:0] FCCOB parameters 000 0x07 Not Required 001 Program Once phrase index (0x0000 - 0x0007) 010 Program Once word 0 value 011 Program Once word 1 value 100 Program Once word 2 value 101 Program Once word 3 value Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS The reserved nonvolatile information register accessed by the Program Once command cannot be erased and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program Once command, any attempt to read addresses within P-Flash will return invalid data. Table 521. Program once command error handling Register Error bit Error condition Set if CCOBIX[2:0]!= 101 at command launch Set if command not available in current mode (see Table 506) ACCERR Set if an invalid phrase index is supplied Set if the requested phrase has already been programmed(301) FSTAT FPVIOL None MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Notes 301. If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will be allowed to execute again on that same phrase. 4.25.4.5.7 Erase all blocks command The Erase All Blocks operation will erase the entire P-Flash and D-Flash memory space. Table 522. Erase all blocks command FCCOB requirements CCOBIX[2:0] FCCOB Parameters 000 0x08 Not required Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All Blocks operation has completed. Table 523. Erase all blocks command error handling Register Error bit Error condition Set if CCOBIX[2:0]!= 000 at command launch ACCERR FSTAT 4.25.4.5.8 Set if command not available in current mode (see Table 506) FPVIOL Set if any area of the P-Flash or D-Flash memory is protected MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Erase flash block command The Erase Flash Block operation will erase all addresses in a P-Flash or D-Flash block. Table 524. Erase flash block command FCCOB requirements CCOBIX[2:0] 000 001 FCCOB parameters 0x09 Global address [17:16] to identify Flash block Global address [15:0] in Flash block to be erased Upon clearing CCIF to launch the Erase Flash Block command, the Memory Controller will erase the selected Flash block and verify that it is erased. The CCIF flag will set after the Erase Flash Block operation has completed. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 525. Erase flash block command error handling Register Error bit Error condition Set if CCOBIX[2:0]!= 001 at command launch Set if command not available in current mode (see Table 506) ACCERR Set if an invalid global address [17:16] is supplied FSTAT Set if the supplied P-Flash address is not phrase-aligned or if the D-Flash address is not word-aligned FPVIOL 4.25.4.5.9 Set if an area of the selected Flash block is protected MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Erase P-flash sector command The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector. Table 526. Erase P-flash sector command FCCOB requirements CCOBIX[2:0] FCCOB Parameters 000 001 Global address [17:16] to identify P-Flash block to be erased 0x0A Global address [15:0] anywhere within the sector to be erased. Refer to Section 4.25.1.2.1, "P-flash features" for the P-Flash sector size. Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash Sector operation has completed. Table 527. Erase P-flash sector command error handling Register Error bit Error condition Set if CCOBIX[2:0]!= 001 at command launch ACCERR FSTAT Set if command not available in current mode (see Table 506) Set if an invalid global address [17:16] is supplied Set if a misaligned phrase address is supplied (global address [2:0]!= 000) FPVIOL Set if the selected P-Flash sector is protected MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation 4.25.4.5.10 Unsecure flash command The Unsecure Flash command will erase the entire P-Flash and D-Flash memory space and, if the erase is successful, will release security. Table 528. Unsecure flash command FCCOB requirements CCOBIX[2:0] 000 FCCOB parameters 0x0B Not required Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire P-Flash and D-Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. If the erase verify is not successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security state. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag is set after the Unsecure Flash operation has completed. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 529. Unsecure flash command error handling Register Error bit ACCERR FSTAT 4.25.4.5.11 FPVIOL Error condition Set if CCOBIX[2:0]!= 000 at command launch Set if command not available in current mode (see Table 506) Set if any area of the P-Flash or D-Flash memory is protected MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Verify backdoor access key command The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the FSEC register (see Table 470). The Verify Backdoor Access Key command releases security if user-supplied keys match those stored in the Flash security bytes of the Flash configuration field (see Table 462). The Verify Backdoor Access Key command must not be executed from the Flash block containing the backdoor comparison key to avoid code runaway. Table 530. Verify backdoor access key command FCCOB requirements CCOBIX[2:0] FCCOB parameters 000 0x0C Not required 001 Key 0 010 Key 1 011 Key 2 100 Key 3 Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash configuration field with Key 0 compared to 0x3_FF00, etc. If the backdoor keys match, security will be released. If the backdoor keys do not match, security is not released and all future attempts to execute the Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is set after the Verify Backdoor Access Key operation has completed. Table 531. Verify backdoor access key command Error handling Register Error bit Error condition Set if CCOBIX[2:0]!= 100 at command launch ACCERR FSTAT Set if an incorrect backdoor key is supplied Set if backdoor key access has not been enabled (KEYEN[1:0]!= 10, see Section 4.25.3.2.2) Set if the backdoor key has mismatched since the last reset FPVIOL None MGSTAT1 None MGSTAT0 None MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.25.4.5.12 Set user margin level command The Set User Margin Level command causes the Memory Controller to set the margin level for future read operations of the P-Flash or D-Flash block. Table 532. Set user margin level command FCCOB requirements CCOBIX[2:0] FCCOB Parameters 000 0x0D Global address [17:16] to identify the Flash block 001 Margin level setting Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the user margin level for the targeted block and then set the CCIF flag. NOTE When the D-Flash block is targeted, the D-Flash user margin levels are applied only to the D-Flash reads. However, when the P-Flash block is targeted, the P-Flash user margin levels are applied to both P-Flash and D-Flash reads. It is not possible to apply user margin levels to the P-Flash block only. Valid margin level settings for the Set User Margin Level command are defined in Table 533. Table 533. Valid set user margin level settings CCOB (CCOBIX=001) Level description 0x0000 Return to Normal Level 0x0001 User Margin-1 Level(302) 0x0002 User Margin-0 Level(303) Notes 302. Read margin to the erased state 303. Read margin to the programmed state Table 534. Set user margin level command error handling Register Error bit Error condition Set if CCOBIX[2:0]!= 001 at command launch ACCERR FSTAT Set if command not available in current mode (see Table 506) Set if an invalid global address [17:16] is supplied Set if an invalid margin level setting is supplied FPVIOL None MGSTAT1 None MGSTAT0 None NOTE User margin levels can be used to check that Flash memory contents have adequate margin for normal level read operations. If unexpected results are encountered when checking Flash memory contents at user margin levels, a potential loss of information has been detected. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.25.4.5.13 Set field margin level command The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set the margin level specified for future read operations of the P-Flash or D-Flash block. Table 535. Set field margin level command FCCOB requirements CCOBIX[2:0] 000 FCCOB Parameters 0x0E Global address [17:16] to identify the Flash block 001 Margin level setting Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the field margin level for the targeted block and then set the CCIF flag. NOTE When the D-Flash block is targeted, the D-Flash field margin levels are applied only to the D-Flash reads. However, when the P-Flash block is targeted, the P-Flash field margin levels are applied to both P-Flash and D-Flash reads. It is not possible to apply field margin levels to the P-Flash block only. Valid margin level settings for the Set Field Margin Level command are defined in Table 536. Table 536. Valid set field margin level settings CCOB (CCOBIX=001) Level description 0x0000 Return to Normal Level 0x0001 User Margin-1 Level(304) 0x0002 User Margin-0 Level(305) 0x0003 Field Margin-1 Level(304) 0x0004 Field Margin-0 Level(305) Notes 304. Read margin to the erased state 305. Read margin to the programmed state Table 537. Set field margin level command error handling Register Error bit Error condition Set if CCOBIX[2:0]!= 001 at command launch ACCERR FSTAT Set if command not available in current mode (see Table 506) Set if an invalid global address [17:16] is supplied Set if an invalid margin level setting is supplied FPVIOL None MGSTAT1 None MGSTAT0 None CAUTION Field margin levels must only be used during verify of the initial factory programming. NOTE Field margin levels can be used to check that Flash memory contents have adequate margin for data retention at the normal level setting. If unexpected results are encountered when checking Flash memory contents at field margin levels, the Flash memory contents should be erased and reprogrammed. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.25.4.5.14 Erase verify D-flash section command The Erase Verify D-Flash Section command will verify that a section of code in the D-Flash is erased. The Erase Verify D-Flash Section command defines the starting point of the data to be verified and the number of words. Table 538. Erase verify D-flash section command FCCOB requirements CCOBIX[2:0] FCCOB parameters 000 0x10 Global address [17:16] to identify the D-Flash block 001 Global address [15:0] of the first word to be verified 010 Number of words to be verified Upon clearing CCIF to launch the Erase Verify D-Flash Section command, the Memory Controller will verify the selected section of D-Flash memory is erased. The CCIF flag will set after the Erase Verify D-Flash Section operation has completed. Table 539. Erase verify D-flash section command error handling Register Error bit Error condition Set if CCOBIX[2:0]!= 010 at command launch Set if command not available in current mode (see Table 506) ACCERR Set if an invalid global address [17:0] is supplied Set if a misaligned word address is supplied (global address [0]!= 0) FSTAT Set if the requested section breaches the end of the D-Flash block FPVIOL None MGSTAT1 Set if any errors have been encountered during the read MGSTAT0 Set if any non-correctable errors have been encountered during the read 4.25.4.5.15 Program D-flash command The Program D-Flash operation programs one to four previously erased words in the D-Flash block. The Program D-Flash operation will confirm that the targeted location(s) were successfully programmed upon completion. CAUTION A Flash word must be in the erased state before being programmed. Cumulative programming of bits within a Flash word is not allowed. Table 540. Program D-flash command FCCOB requirements CCOBIX[2:0] 000 FCCOB parameters 0x11 Global address [17:16] to identify the D-Flash block 001 Global address [15:0] of word to be programmed 010 Word 0 program value 011 Word 1 program value, if desired 100 Word 2 program value, if desired 101 Word 3 program value, if desired Upon clearing CCIF to launch the Program D-Flash command, the user-supplied words will be transferred to the Memory Controller and be programmed if the area is unprotected. The CCOBIX index value at Program D-Flash command launch determines how many words will be programmed in the D-Flash block. The CCIF flag is set when the operation has completed. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 541. Program D-flash command error handling Register Error bit Error condition Set if CCOBIX[2:0] < 010 at command launch Set if CCOBIX[2:0] > 101 at command launch ACCERR FSTAT Set if command not available in current mode (see Table 506) Set if an invalid global address [17:0] is supplied Set if a misaligned word address is supplied (global address [0]!= 0) Set if the requested group of words breaches the end of the D-Flash block FPVIOL Set if the selected area of the D-Flash memory is protected MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation 4.25.4.5.16 Erase D-flash sector command The Erase D-Flash Sector operation will erase all addresses in a sector of the D-Flash block. Table 542. Erase D-flash sector command FCCOB requirements CCOBIX[2:0] 000 FCCOB Parameters 0x12 Global address [17:16] to identify D-Flash block Global address [15:0] anywhere within the sector to be erased. See Section 4.25.1.2.2, "D-flash features" for D-Flash sector size. 001 Upon clearing CCIF to launch the Erase D-Flash Sector command, the Memory Controller will erase the selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase D-Flash Sector operation has completed. Table 543. Erase D-flash sector command error handling Register Error bit Error condition Set if CCOBIX[2:0]!= 001 at command launch ACCERR FSTAT Set if an invalid global address [17:0] is supplied Set if a misaligned word address is supplied (global address [0]!= 0) FPVIOL 4.25.4.6 Set if command not available in current mode (see Table 506) Set if the selected area of the D-Flash memory is protected MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Interrupts The Flash module can generate an interrupt when a Flash command operation has completed, or when a Flash command operation has detected an ECC fault. Table 544. Flash interrupt sources Interrupt source Interrupt flag Local enable Global (CCR) Mask Flash Command Complete CCIF (FSTAT register) CCIE (FCNFG register) I Bit ECC Double Bit Fault on Flash Read DFDIF (FERSTAT register) DFDIE (FERCNFG register) I Bit ECC Single Bit Fault on Flash Read SFDIF (FERSTAT register) SFDIE (FERCNFG register) I Bit MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS NOTE Vector addresses and their relative interrupt priority are determined at the MCU level. 4.25.4.6.1 Description of flash interrupt operation The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the Flash command interrupt request. The Flash module uses the DFDIF and SFDIF flags in combination with the DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed description of the register bits involved, refer to Section 4.25.3.2.5, "Flash configuration register (FCNFG)", Section 4.25.3.2.6, "Flash error configuration register (FERCNFG)", Section 4.25.3.2.7, "Flash status register (FSTAT)", and Section 4.25.3.2.8, "Flash error status register (FERSTAT)". The logic used for generating the Flash module interrupts is shown in Figure 113. Flash Command Interrupt Request CCIE CCIF DFDIE DFDIF Flash Error Interrupt Request SFDIE SFDIF Figure 113. Flash module interrupts implementation 4.25.4.7 Wait mode The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU from wait via the CCIF interrupt (see Section 4.25.4.6, "Interrupts"). 4.25.4.8 Stop mode If a Flash command is active (CCIF = 0) when the MCU requests stop mode, the current Flash operation will be completed before the CPU is allowed to enter stop mode. 4.25.5 Security The Flash module provides security information to the MCU. The Flash security state is defined by the SEC bits of the FSEC register (see Table 471). During reset, the Flash module initializes the FSEC register using data read from the security byte of the Flash configuration field at global address 0x3_FF0F. The security state out of reset can be permanently changed by programming the security byte, assuming that the MCU is starting from a mode where the necessary P-Flash erase and program commands are available, and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully programmed, its new value will take affect after the next MCU reset. The following subsections describe these security-related subjects: * Unsecuring the MCU using backdoor key access * Unsecuring the MCU in special single chip mode using BDM * Mode and security effects on flash command availability MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.25.5.1 Unsecuring the MCU using backdoor key access The MCU may be unsecured by using the backdoor key access feature, which requires knowledge of the contents of the backdoor keys (four 16-bit words programmed at addresses 0x3_FF00-0x3_FF07). If the KEYEN[1:0] bits are in the enabled state (see Section 4.25.3.2.2, "Flash security register (FSEC)"), the Verify Backdoor Access Key command (see Section 4.25.4.5.11, "Verify backdoor access key command") allows the user to present four prospective keys for comparison to the keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC register (see Table 471) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash memory, and D-Flash memory will not be available for read access and will return invalid data. The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an external stimulus. This external stimulus would typically be through one of the on-chip serial ports. If the KEYEN[1:0] bits are in the enabled state (see Section 4.25.3.2.2, "Flash security register (FSEC)"), the MCU can be unsecured by the backdoor key access sequence described below: 1. Follow the command sequence for the Verify Backdoor Access Key command as explained in Section 4.25.4.5.11, "Verify backdoor access key command" 2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10 The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method to re-enable the Verify Backdoor Access Key command. The security as defined in the Flash security byte (0x3_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor keys stored in addresses 0x3_FF00-0x3_FF07 are unaffected by the Verify Backdoor Access Key command sequence. The Verify Backdoor Access Key command sequence has no effect on the program and erase protections defined in the Flash protection register, FPROT. After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the contents of the backdoor keys by programming addresses 0x3_FF00-0x3_FF07 in the Flash configuration field. 4.25.5.2 Unsecuring the MCU in special single chip mode using BDM A secured MCU can be unsecured in special single chip mode by using the following method to erase the P-Flash and D-Flash memory: 1. Reset the MCU into special single chip mode 2. Delay while the BDM executes the Erase Verify All Blocks command write sequence to check if the P-Flash and D-Flash memories are erased 3. Send BDM commands to disable protection in the P-Flash and D-Flash memory 4. Execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory 5. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the MCU into special single chip mode 6. Delay while the BDM executes the Erase Verify All Blocks command write sequence to verify that the P-Flash and D-Flash memory are erased If the P-Flash and D-Flash memory are verified as erased, the MCU will be unsecured. All BDM commands will now be enabled and the Flash security byte may be programmed to the unsecure state by continuing with the following steps: 7. Send BDM commands to execute the Program P-Flash command write sequence to program the Flash security byte to the unsecured state 8. Reset the MCU 4.25.5.3 Mode and security effects on flash command availability The availability of Flash module commands depends on the MCU operating mode and security state as shown in Table 506. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.25.6 Initialization On each system reset the Flash module executes a reset sequence which establishes initial values for the Flash Block Configuration Parameters, the FPROT and DFPROT protection registers, and the FOPT and FSEC registers. The Flash module reverts to using built-in default values that leave the module in a fully protected and secured state if errors are encountered during execution of the reset sequence. If a double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set. CCIF remains clear throughout the reset sequence. The Flash module holds off all CPU access for the initial portion of the reset sequence. While Flash memory reads and access to most Flash registers are possible when the hold is removed, writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers are ignored. Completion of the reset sequence is marked by setting CCIF high which enables writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers to launch any available Flash command. If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/block being erased is not guaranteed. 4.26 MCU - die-to-die initiator (9S12I128PIMV1) 4.26.0.1 Acronyms and abbreviations Table 545 contains sample acronyms and abbreviations used in this document. Table 545. Acronyms and abbreviated terms Term Meaning D2D 4.26.0.1.1 Die-to-Die Glossary Table 312 shows a glossary of the major terms used in this document. Table 546. Glossary Term Definition Active low The signal is asserted when it changes to logic-level zero. Active high The signal is asserted when it changes to logic-level one. Asserted Discrete signal is in active logic state. Customer The end user of an SoC design or device. EOT End of Transaction Negated A discrete signal is in inactive logic state. Pin External physical connection. Revision Revised or new version of a document. Revisions produce versions; there can be no `Rev 0.0.' Signal Electronic construct whose state or change in state conveys information. Transfer A read or write on the CPU bus following the IP-Bus protocol. Transaction Command, address and if required data sent on the D2D interface. A transaction is finished by the EOT acknowledge cycle. Version Particular form or variation of an earlier or original document. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.26.1 Introduction This section describes the functionality of the die-to-die (9S12I128PIMV1) initiator block especially designed for low cost connections between a microcontroller die (Interface Initiator) and an analog die (Interface Target) located in the same package. The D2DI block * realizes the initiator part of the D2D interface, including supervision and error interrupt generation * generates the clock for this interface * disables/enables the interrupt from the D2D interface 4.26.1.1 Overview The D2DI is the initiator for a data transfer to and from a target, typically located on another die in the same package. It provides a set of configuration registers and two memory mapped 256 Byte address windows. When writing to a window a transaction is initiated, sending a write command followed, by an 8-bit address and the data byte or word to the target. When reading from a window, a transaction is initiated, sending a read command, followed by an 8-bit address to the target. The target then responds with the data. The basic idea is that a peripheral located on another die, can be addressed like an on-chip peripheral, except for a small transaction delay. D2DCW Address and Data Buffer Address Bus Write Data Bus Read Data Bus D2DDAT[7:0] D2DIF D2DINT D2DINTI D2DERR_INT D2DIE xfr_wait D2DCLKDIV Bus Clock /n n=1 ... 8 D2DCLK Figure 114. Die-to-die initiator (D2DI) block diagram 4.26.1.2 Features The main features of this block are * Software transparent, memory mapped access to peripherals on target die -- 256 Byte address window -- Supports blocking read or write as well as non-blocking write transactions * Scalable interface clock divide by 1, 2, 3 and 4 of bus clock * Clock halt on system STOP * Configurable for 4- or 8-bit wide transfers * Configurable timeout period * Non-maskable interrupt on transaction errors * Transaction Status and Error Flags * Interrupt enable for receiving interrupt (from D2D target) MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.26.1.3 Modes of operation 4.26.1.3.1 D2DI in STOP/WAIT mode The D2DI stops working in STOP/WAIT mode. The D2DCLK signal as well as the data signals used are driven low (only after the end of the current high phase, as defined by D2DCLKDIV). Waking from STOP/WAIT mode, the D2DCLK line starts clocking again and the data lines will be driven low until the first transaction starts. STOP and WAIT mode are entered by different CPU instructions. In the WAIT mode the behavior of the D2DI can be configured (D2DSWAI). Every (enabled) interrupt can be used to leave the STOP and WAIT mode. 4.26.1.3.2 D2DI in special modes The MCU can enter a special mode (used for test and debugging purposes as well as programming the FLASH). In the D2DI, the "write-once" feature is disabled. See the MCU description for details. 4.26.2 External signal description The D2DI optionally uses 6 or 10 port pins. The functions of those pins depends on the settings in the D2DCTL0 register, when the D2DI module is enabled. 4.26.2.1 D2DCLK When the D2DI is enabled, this pin is the clock output. This signal is low if the initiator is disabled, in STOP mode or in WAIT mode (with D2DSWAI asserted), otherwise it is a continuos clock. This pin may be shared with general purpose functionality if the D2DI is disabled. 4.26.2.2 D2DDAT[7:4] When the D2DI is enabled and the interface connection width D2DCW is set to be 8-bit wide, those lines carry the data bits 7:4 acting as outputs or inputs. When they act as inputs pull-down elements are enabled. If the D2DI is disabled or if the interface connection width is set as 4-bit wide, the pins may be shared with general purpose pin functionality. 4.26.2.3 D2DDAT[3:0] When the D2DI is enabled those lines carry the data bits 3:0 acting as outputs or inputs. When they act as inputs pull-down elements are enabled. If the D2DI is disabled the pins and may be shared with general purpose pin functionality. 4.26.2.4 D2DINT The D2DINT is an active input interrupt input driven by the target device. The pin has an active pull-down device. If the D2DI is disabled, the pin may be shared with general purpose pin functionality. Table 547. Signal properties Name Primary (D2DEN=1) I/O Secondary (D2DEN=0) Reset Comment Pull down Bidirectional Data Lines I/O GPIO 0 driven low if in STOP mode Active(306) D2DCLK Interface Clock Signal O GPIO 0 low if in STOP mode -- D2DINT Active High Interrupt I GPIO -- -- Active(307) D2DDAT[7:0] Notes 306. Active if in input state, only if D2DEN=1 307. only if D2DEN=1 See the port interface module (PIM) guide for details of the GPIO function. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.26.3 4.26.3.1 Memory map and register definition Memory map The D2DI memory map is split into three sections. 1. An eight byte set of control registers 2. A 256 byte window for blocking transactions 3. A 256 byte window for non-blocking transactions See the chapter "Device Memory Map" for the register layout (distribution of these sections). D2DREGS D2DBLK D2DNBLK 8 Byte Control Registers 256 Byte Window Blocking Access 256 Byte Window Non-blocking Write Figure 115. D2DI top level memory map A summary of the registers associated with the D2DI block is shown in Table 548. Detailed descriptions of the registers and bits are given in the subsections that follow. Table 548. D2DI register summary Offset 0x0 0x1 0x2 0x3 0x4 0x5 0x6 0x7 Register name D2DCTL0 R W D2DCTL1 D2DSTAT0 D2DADRLO D2DDATAHI D2DDATALO 6 5 D2DEN D2DCW D2DSWAI 0 0 0 ACKERF CNCLF TIMEF TERRF PARF PAR1 PAR0 D2DBSY 0 0 0 0 0 0 SZ8 0 NBLK 0 0 0 0 D2DIE R W D2DSTAT1 D2DADRHI Bit 7 ERRIF D2DIF R RWB 4 3 2 0 0 0 1 Bit 0 D2DCLKDIV[1:0] TIMEOUT[3:0] W R ADR[7:0] W R DATA[15:8] W R DATA[7:0] W = Unimplemented or Reserved MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.26.3.2 Register definition 4.26.3.3 D2DI control register 0 (D2DCTL0) This register is used to enable and configure the interface width, the wait behavior and the frequency of the interface clock. Table 549. D2DI control register 0 (D2DCTL0) Offset 0x0 R W Reset Access: User read/write 7 6 5 D2DEN D2DCW D2DSWAI 0 0 0 4 3 2 0 0 0 0 0 0 1 0 D2DCLKDIV[1:0] 0 0 Table 550. D2DCTL0 register field descriptions Field Description 7 D2DEN D2DI Enable -- Enables the D2DI module. This bit is write-once in normal mode and can always be written in special modes. 0 D2DI initiator is disabled. No lines are not used, the pins have their GPIO (secondary) function. 1 D2DI initiator is enabled. After setting D2DEN=1 the D2DDAT[7:0] (or [3:0], see D2DCW) lines are driven low with the IDLE command; the D2DCLK is driven by the divided bus clock. 6 D2DCW D2D Connection Width -- Sets the number of data lines used by the interface. This bit is write-once in normal modes and can always be written in special modes. 0 Lines D2DDAT[3:0] are used for four line data transfer. D2DDAT[7:4] are unused. 1 All eight interface lines D2DDAT[7:0] are used for data transfer. 5 D2DSWAI 4:2 D2D Stop In Wait -- Controls the WAIT behavior. This bit can be written at any time. 0 Interface clock continues to run if the CPU enters WAIT mode 1 Interface clock stops if the CPU enters WAIT mode. Reserved, should be written to 0 to ensure compatibility with future versions of this interface. 1:0 D2DCLKDIV Interface Clock Divider -- Determines the frequency of the interface clock. These bits are write-once in normal modes and can be always written in special modes. See Figure 116 for details on the clock waveforms 00 Encoding 0. Bus clock divide by 1. 01 Encoding 1. Bus clock divide by 2. 10 Encoding 2. Bus clock divide by 3. 11 Encoding 3. Bus clock divide by 4. The Clock Divider will provide the waveforms as shown in Figure 116. The duty cycle of the clock is not always 50%, the high cycle is shorter than 50% or equal but never longer, since this is beneficial for the transaction speed. bus clock 00 01 10 11 Figure 116. Interface clock waveforms for various D2DCLKDIV encoding MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.26.3.4 D2DI control register 1 (D2DCTL1) This register is used to enable the D2DI interrupt and set number of D2DCLK cycles before a timeout error is asserted. Table 551. D2DI control register 1 (D2DCTL1) Offset 0x1 Access: User read/write 7 R D2DIE W Reset 0 6 5 4 0 0 0 0 0 0 3 2 1 0 0 0 TIMOUT[3:0] 0 0 Table 552. D2DCTL1 register field descriptions Field 7 D2DIE 6:4 3:0 TIMOUT Description D2D Interrupt Enable -- Enables the external interrupt 0 External Interrupt is disabled 1 External Interrupt is enabled Reserved, should be written to 0 to ensure compatibility with future versions of this interface. Time-out Setting -- Defines the number of D2DCLK cycles to wait after the last transaction cycle until a timeout is asserted. In case of a timeout the TIMEF flag in the D2DSTAT0 register will be set. These bits are write-once in normal modes and can always be written in special modes. 0000 The acknowledge is expected directly after the last transfer, i.e. the target must not insert a wait cycle. 0001 - 1111: The target may insert up to TIMOUT wait states before acknowledging a transaction until a timeout is asserted NOTE "Write-once" means that after writing D2DCNTL0.D2DEN=1 the write accesses to these bits have no effect. 4.26.3.5 D2DI status register 0 (D2DSTAT0) This register reflects the status of the D2DI transactions. Table 553. D2DI status register 0 (D2DSTAT0) Offset 0x2 Access: User read/write 7 R ERRIF W Reset 0 6 5 4 3 2 1 0 ACKERF CNCLF TIMEF TERRF PARF PAR1 PAR0 0 0 0 0 0 0 0 Table 554. D2DI status register 0 field descriptions Field Description 7 ERRIF D2DI error interrupt flag -- This status bit indicates that the D2D initiator has detected an error condition (summary of the following five flags).This interrupt is not locally maskable. Write a 1 to clear the flag. Writing a 0 has no effect. 0 D2DI has not detected an error during a transaction. 1 D2DI has detected an error during a transaction. 6 ACKERF Acknowledge Error Flag-- This read-only flag indicates that in the acknowledge cycle not all data inputs are sampled high, indicating a potential broken wire. This flag is cleared when the ERRIF bit is cleared by writing a 1 to the ERRIF bit. 5 CNCLF CNCLF -- This read-only flag indicates the initiator has canceled a transaction and replaced it by an IDLE command due to a pending error flag (ERRIF). This flag is cleared when the ERRIF bit is cleared by writing a 1 to the ERRIF bit. 4 TIMEF Time Out Error Flag -- This read-only flag indicates the initiator has detected a time-out error. This flag is cleared when the ERRIF bit is cleared by writing a 1 to the ERRIF bit. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 554. D2DI status register 0 field descriptions (continued) Field 3 TERRF Description Transaction Error Flag -- This read-only flag indicates the initiator has detected the error signal during the acknowledge cycle of the transaction. This flag is cleared when the ERRIF bit is cleared by writing a 1 to the ERRIF bit. 2 PARF Parity Error Flag -- This read-only flag indicates the initiator has detected a parity error. Parity bits[1:0] contain further information. This flag is cleared when the ERRIF bit is cleared by writing a 1 to the ERRIF bit. 1 PAR1 Parity Bit -- P[1] as received by the D2DI 0 PAR0 Parity Bit -- P[0] as received by the D2DI 4.26.3.6 D2DI status register 1 (D2DSTAT1) This register holds the status of the external interrupt pin and an indicator about the D2DI transaction status. Table 555. D2DI status register 1 (D2DSTAT1) Offset 0x3 Access: User read 7 R D2DIF W Reset 6 5 4 3 2 1 0 D2DBSY 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Table 556. D2DSTAT1 register field descriptions Field Description 7 D2DIF D2D Interrupt Flag -- This read-only flag reflects the status of the D2DINT Pin. The D2D interrupt flag can only be cleared by a target specific interrupt acknowledge sequence. 0 External Interrupt is negated 1 External Interrupt is asserted 6 D2DBSY 5:0 D2D Initiator Busy -- This read-only status bit indicates that a D2D transaction is ongoing. 0 D2D initiator idle. 1 D2D initiator transaction ongoing. Reserved, should be masked to ensure compatibility with future versions of this interface. 4.26.3.7 D2DI address buffer register (D2DADR) This read-only register contains information about the ongoing D2D interface transaction. The register content will be updated when a new transaction starts. In error cases the user can track back, which transaction failed. Table 557. D2DI address buffer register (D2DADR) Offset 0x4/0x5 R Access: User read 15 14 13 12 11 10 9 8 RWB SZ8 0 NBLK 0 0 0 0 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 0 0 0 ADR[7:0] W Reset 0 0 0 0 0 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 558. D2DI address buffer register bit descriptions Field Description 15 RWB Transaction Read-Write Direction -- This read-only bit reflects the direction of the transaction 0 Write Transaction 1 Read Transaction 14 SZ8 Transaction Size -- This read-only bit reflects the data size of the transaction 0 16-bit transaction. 1 8-bit transaction. 13 12 NBLK 11:8 7:0 ADR[7:0] Reserved, should be masked to ensure compatibility with future versions of this interface. Transaction Mode -- This read-only bit reflects the mode of the transaction 0 Blocking transaction. 1 Non-blocking transaction. Reserved, should be masked to ensure compatibility with future versions of this interface. Transaction Address -- Those read-only bits contain the address of the transaction 4.26.3.8 D2DI data buffer register (D2DDATA) This read-only register contains information about the ongoing D2D interface transaction. For a write transaction, the data becomes valid at the begin of the transaction. For a read transaction, the data will be updated during the transaction and is finalized when the transaction is acknowledged by the target. In error cases, the user can track back what has happened. Table 559. D2DI data buffer register (D2DDATA) Offset 0x6/0x7 15 Access: User read 14 13 12 11 10 9 R 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 DATA15:0 W Reset 0 0 0 0 0 0 0 0 0 Table 560. D2DI data buffer register bit descriptions Field 15:0 DATA Description Transaction Data -- Those read-only bits contain the data of the transaction Both D2DDATA and D2DADR can be read with byte accesses. 4.26.4 4.26.4.1 Functional description Initialization Out of reset the interface is disabled. The interface must be initialized by setting the interface clock speed, the timeout value, the transfer width and finally enabling the interface. This should be done using a 16-bit write or if using 8-bit write D2DCTL1 must be written before D2D2CTL0.D2DEN=1 is written. Once it is enabled in normal modes, only a reset can disable it again (write-once feature). MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.26.4.2 Transactions A transaction on the D2D Interface is triggered by writing to either the 256 byte address window or reading from the address window (see STAA/LDAA 0/1 in the next figure). Depending on which address window is used, a blocking or a non-blocking transaction is performed. The address for the transaction is the 8-bit wide window relative address. The data width of the CPU read or write instructions determines if 8-bit or 16-bit wide data are transferred. There is always only one transaction active. Figure 117 shows the various types of transactions explained in more detail below. For all 16-bit read/write accesses of the CPU the addresses are assigned according the big-endian model: word [15:8]: addr word[7:0]: addr+1 addr: byte-address (8 bit wide) inside the blocking or non-blocking window, as provided by the CPU and transferred to the D2D target word: CPU data, to be transferred from/to the D2D target The application must care for the stretched CPU cycles (limited by the TIMOUT value, caused by blocking or consecutive accesses), which could affect time limits, including COP (computer operates properly) supervision. The stretched CPU cycles cause the "CPU halted" phases (see Figure 117). Blocking Write CPU activity STAA 0 CPU activity CPU activity Blocking Read LDAA # STAA 1 Write Transaction 0 D2D activity Non-Blocking Write D2D activity CPU Halted CPU STAA 0 LDAA # STAA 1 Halted Write Transaction 0 LDAA 0 D2D activity CPU Halted Transaction 0 CPU Halted NOP Write Transaction 1 NOP Write Transaction 1 STAA MEM LDAA 1 CPU Halted NOP Transaction 1 Figure 117. Blocking and non-blocking transfers. 4.26.4.2.1 Blocking writes When writing to the address window associated with blocking transactions, the CPU is held until the transaction is completed, before completing the instruction. Figure 117 shows the behavior of the CPU for a blocking write transaction shown in the following example. STAA BLK_WINDOW+OFFS0 ; WRITE0 8-bit as a blocking transaction LDAA #BYTE1 STAA BLK_WINDOW+OFFS1 ; WRITE1 is executed after WRITE0 transaction is completed NOP Blocking writes should be used when clearing interrupt flags, located in the target or other writes which require that the operation at the target, is completed before proceeding with the CPU instruction stream. 4.26.4.3 Non-blocking writes When writing to the address window associated with non-blocking transactions, the CPU can continue before the transaction is completed. However, if there was an ongoing transaction when doing the 2nd write, the CPU is held until the first one is completed, and before executing the 2nd one. Figure 117 shows the behavior of the CPU for a blocking write transaction shown in the following example. STAA NONBLK_WINDOW+OFFS0; write 8-bit as a blocking transaction LDAA #BYTE1 ; load next byte STAA NONBLK_WINDOW+OFFS1; executed right after the first NOP As the figure illustrates, non-blocking writes have a performance advantage, but care must be taken that the following instructions are not affected by the change in the target caused by the previous transaction. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.26.4.4 Blocking read When reading from the address window associated with blocking transactions, the CPU is held until the data is returned from the target, before completing the instruction. Figure 117 shows the behavior of the CPU for a blocking read transaction shown in the following example. LDAA BLK_WINDOW+OFFS0 ; Read 8-bit as a blocking transaction STAA MEM ; Store result to local Memory LDAA BLK_WINDOW+OFFS1 ; Read 8-bit as a blocking transaction 4.26.4.5 Non-blocking read Read access to the non-blocking window is reserved for future use. When reading from the address window associated with non-blocking writes, the read returns an all 0s data byte or word. This behavior can change in future revisions. 4.26.4.6 Transfer width 8-bit wide writes or reads are translated into 8-bit wide interface transactions. 16-bit wide, aligned writes or reads are translated into a16-bit wide interface transactions. 16-bit wide, misaligned writes or reads are split up into two consecutive 8-bit transactions with the transaction on the odd address first followed by the transaction on the next higher even address. Due to the much more complex error handling (by the MCU), misaligned 16-bit transfers should be avoided. 4.26.4.7 Error conditions and handling faults Since the S12 CPU (as well as the S08) does not provide a method to abort a transfer once started, the D2DI asserts a D2DERRINT. The ERRIF Flag is set in the D2DSTAT0 register. Depending on the error condition, further error flags will be set, as described below. The content of the address and data buffers are frozen and all transactions will be replaced by an IDLE command, until the error flag is cleared. If an error is detected during the read transaction of a read-modify-write instruction, or a non-blocking write transaction was followed by another write or read transaction, the second transaction is cancelled. The CNCLF is set in the D2DSTAT0 register to indicate that a transaction has been cancelled. The D2DERRINT handler can read the address and data buffer register to assess the error situation. Any further transaction will be replaced by IDLE until the ERRIF is cleared. 4.26.4.7.1 Missing acknowledge If the target detects a wrong command, it will not send back an acknowledge. The same situation occurs if the acknowledge is corrupted. The D2DI detects this missing acknowledge after the timeout period configured in the TIMOUT parameter of the D2DCTL1 register. In case of a timeout, the ERRIF and the TIMEF flags in the D2DSTAT0 register will be set. 4.26.4.7.2 Parity error In the final acknowledge cycle of a transaction, the target sends two parity bits. If this parity does not match the parity calculated by the initiator, the ERRIF and the PARF flags in the D2DSTAT0 register will be set. The PAR[1:0] bits contain the parity value received by the D2DI. 4.26.4.7.3 Error signal During the acknowledge cycle the target can signal a target specific error condition. If the D2DI finds the error signal asserted during a transaction, the ERRIF and the TERRF flags in the D2DSTAT0 register will be set. 4.26.4.8 4.26.4.8.1 Low power mode options D2DI in run mode In run mode, with the D2D Interface enable (D2DEN) bit in the D2D control register 0 clear, the D2DI system is in a low-power, disabled state. D2D registers remain accessible, but clocks to the core of this module are disabled. On D2D lines the GPIO function is activated. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 4.26.4.8.2 D2DI in wait mode D2DI operation in wait mode depends upon the state of the D2DSWAI bit in D2D control register 0. * If D2DSWAI is clear, the D2DI operates normally when the CPU is in the wait mode * If D2DSWAI is set and the CPU enters the wait mode, any pending transmission is completed. When the D2DCLK output is driven low then the clock generation is stopped, all internal clocks to the D2DI module are stopped as well and the module enters a power saving state. 4.26.4.8.3 D2DI in stop mode If the CPU enters the STOP mode, the D2DI shows the same behavior as for the wait mode with an activated D2DSWAI bit. 4.26.4.8.4 Reset In case of reset any transaction is immediately stopped and the D2DI module is disabled. 4.26.4.8.5 Interrupts The D2DI only originates interrupt requests when D2DI is enabled (D2DIE bit in D2DCTL0 set). There are two different interrupt requests from the D2D module. The interrupt vector offset and interrupt priority are chip dependent. 4.26.4.8.5.1 D2D external interrupt This is a level sensitive active high external interrupt driven by the D2DINT input. This interrupt is enabled if the D2DIE bit in the D2DCTL1 register is set. The interrupt must be cleared using an target specific clearing sequence. The status of the D2D input pin can be observed by reading the D2DIF bit in the D2DSTAT1 register. The D2DINIT signal is also asserted in the wait and stop mode; it can be used to leave these modes. To read data bus (D2DSTAT1.D2DIF) D2DINTI D2DINT D2DIE Figure 118. D2D external interrupt scheme 4.26.4.8.5.2 D2D error interrupt Those D2D interface specific interrupts are level sensitive and are all cleared by writing a 1 to the ERRIF flag in the D2DSTAT0 register. This interrupt is not locally maskable and should be tied to the highest possible interrupt level in the system, on an S12 architecture to the XIRQ. See the chapter "Vectors" of the MCU description for details. ACKERF CNCLF ERRIF 1 TIMEF TERRF PARF D2DERRINT D2DEN Figure 119. D2D internal interrupts MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 4.26.5 Initialization information During initialization, the transfer width, clock divider, and timeout value must be set according to the capabilities of the target device before starting any transaction. See the D2D Target specification for details. 4.26.6 4.26.6.1 Application information Entering low-power mode The D2DI module is typically used on a microcontroller along with an analog companion device containing the D2D target interface and supplying the power. Interface specification does not provide special wires for signalling low power modes to the target device. The CPU should determine when it is time to enter one of the above power modes.The basic flow is as follows: 1. CPU determines there is no more work pending. 2. CPU writes a byte to a register on the analog die using blocking write configuring which mode to enter. 3. Analog die acknowledges that write sending back an acknowledge symbol on the interface. 4. CPU executes WAIT or STOP command. 5. Analog die can enter low power mode - (S12 needs some more cycles to stack data!) ; Example shows S12 code SEI ; disable interrupts during test ; check is there is work pending? ; if yes, branch off and re-enable interrupt ; else LDAA #STOP_ENTRY STAA MODE_REG ; store to the analog die mode reg (use blocking write here) CLI ; re-enable right before the STOP instruction STOP ; stack and turn off all clocks inc. interface clock For wake-up from STOP the basic flow is as follows: 1. Analog die detects a wake-up condition e.g. on a switch input or start bit of a LIN message. 2. Analog die exits Voltage Regulator low power mode. 3. Analog die asserts the interrupt signal D2DINT. 4. CPU starts clock generation. 5. CPU enters interrupt handler routine. 6. CPU services interrupt and acknowledges the source on the analog die. NOTE Entering STOP mode or WAIT mode with D2DSWAI asserted, the clock will complete the high duty cycle portion and settle at a low level. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 5 MM912_637 - trimming 5.1 Introduction To ensure the high precision requirements over a wide temperature and lifetime range, the MM912_637 uses several trimming and calibration techniques. Due to the advantage of the FLASH technology available in the microcontroller die, several factory trimmed values can be used to increase the overall device accuracy. Trimming will use factory measured and calculated values stored in the microcontroller IFR (Information Register) to be loaded into specific registers in the MCU and analog die at system power up. Calibration would be done during operation of the system using internal references or specific measurement procedures. As calibration is an essential part of the signal acquisition, see Section 4.8.5, "Calibration" as part of Section 4.8, "Channel acquisition". NOTE The MM912_637 trimming is primarily used to achieve the specified analog die parameters. The only valid trimming of the MCU die, the Internal Oscillator Trimming (ICG) will be automatically stored into the MCU trimming register during power up. See Section 4.23.3.2.15, "9S12I128PIMV1 IRC1M trim registers (CPMUIRCTRIMH / CPMUIRCTRIML)". 5.2 IFR trimming content and location All device trimming information are stored in the MCU Information Register (IFR) located at the following address. See also Section 4.25, "128 kByte flash module (S12FTMRC128K1V1)". Table 561. IFR location Global address Size (bytes) Field description 0x01_8000 - 0x01_8007 8 0x01_8008 - 0x01_80B5 174 0x01_80B6 - 0x01_80B7 2 Version ID(308) 0x01_80B8 - 0x01_80BF 8 Reserved 0x01_80C0 - 0x01_80FF 64 Analog Die Trimming Information (Program Once Field) Unique Device ID Reserved Notes 308. Used to track firmware patch versions, see Section 4.25.4.2, "IFR version ID word". NOTE The Program Once reserved field can be read using the Read Once command as described in Section 4.25.4.5.4, "Read once command". 5.2.1 IFR - trimming content for analog die functionality The following table shows the details of the 64 byte (0x01_80C0 - 0x01_80FF) Program Once Field Content used to store the Analog Die Trimming Information. Refer to Section 4.25.4.5.4, "Read once command", for access instructions. Table 562. Analog die trimming information OFFSET Global address HEX DEC 0x01_80C0 00 00 0x01_80C1 01 01 0x01_80C2 02 02 0x01_80C3 03 03 Byte description 7 6 5 4 3 Target register 2 1 0 IGC4[9:8] IGC4[7:0] COMP_IG4 (hi) COMP_IG4 (lo) IGC8[9:8] IGC8[7:0] Name COMP_IG8 (hi) COMP_IG8 (lo) Offset 0xB0 0xB2 MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 562. Analog die trimming information (continued) OFFSET Byte description Target register Global address HEX DEC 0x01_80C4 04 04 0x01_80C5 05 05 0x01_80C6 06 06 0x01_80C7 07 07 0x01_80C8 08 08 0x01_80C9 09 09 0x01_80CA 0A 10 0x01_80CB 0B 11 0x01_80CC 0C 12 0x01_80CD 0D 13 0x01_80CE 0E 14 0x01_80CF 0F 15 0x01_80D0 10 16 TCIBG2[2:0] SLPBG[2:0] TRIM_BG0 (hi) 0xE0 0x01_80D1 11 17 IBG2[2:0] IBG1[2:0] TRIM_BG0 (lo) 0xE1 0x01_80D2 12 18 TCBG2[2:0] TCBG1[2:0] TRIM_BG1 (hi) 0xE2 0x01_80D3 13 19 SLPBG[2:0] TRIM_BG1 (lo) 0xE3 0x01_80D4 14 20 V1P2BG2[3:0] V1P2BG1[3:0] TRIM_BG2 (hi) 0xE4 0x01_80D5 15 21 V2P5BG2[3:0] V2P5BG1[3:0] TRIM_BG2 (lo) 0xE5 0x01_80D6 16 22 LIN TRIM_LIN 0xE6 0x01_80D7 17 23 LVT TRIM_LVT 0xE7 0x01_80D8 18 24 TRIM_OSC (hi) 0xE8 0x01_80D9 19 25 LPOSC[7:0] TRIM_OSC (lo) 0xE9 0x01_80DA 1A 26 VOC_S[7:0] COMP_VO 0xAA(309) 0x01_80DB 1B 27 VOC_O[7:0] COMP_VO 0xAA(309) 0x01_80DC 1C 28 VOC_S_CHOP[7:0] (Chopper Mode) COMP_VO 0xAA(309) 0x01_80DD 1D 29 VOC_O_CHOP[7:0] (Chopper Mode) COMP_VO 0xAA(309) 0x01_80DE 1E 30 0x01_80DF 1F 31 0x01_80E0 20 32 0x01_80E1 21 33 VOGC[7:0] COMP_VOG (lo) 0x01_80E2 22 34 ITO[7:0] COMP_ITO 0xD0 0x01_80E3 23 35 ITG[7:0] COMP_ITG 0xD1 0x01_80E4 24 36 GAIN_CAL_VSENSE_ROOM (hi) n.a. 0x01_80E5 25 37 GAIN_CAL_VSENSE_ROOM (lo) n.a. 0x01_80E6 26 38 GAIN_CAL_VOPT_ROOM (hi) n.a. 0x01_80E7 27 39 GAIN_CAL_VOPT_ROOM (lo) n.a. 7 6 5 4 3 2 1 0 IGC16[9:8] IGC16[7:0] Offset COMP_IG16 (hi) 0xB4 COMP_IG16 (lo) IGC32[9:8] IGC32[7:0] COMP_IG32 (hi) 0xB6 COMP_IG32 (lo) IGC64[9:8] IGC64[7:0] COMP_IG64 (hi) 0xB8 COMP_IG64 (lo) IGC128[9:8] IGC128[7:0] COMP_IG128 (hi) 0xBA COMP_IG128 (lo) IGC256[9:8] IGC256[7:0] COMP_IG256 (hi) 0xBC COMP_IG256 (lo) IGC512[9:8] IGC512[7:0] UBG3 DBG3 Name COMP_IG512 (hi) 0xBE COMP_IG512 (lo) LPOSC[12:8] VSGC[9:8] VSGC[7:0] COMP_VSG (hi) 0xAC(309) COMP_VSG (lo) VOGC[9:8] BG3 diag measurement from Vsense channel after cal at room BG3 diag measurement from Vopt channel after cal at room COMP_VOG (hi) 0xAC(309) MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 562. Analog die trimming information (continued) OFFSET Global address HEX DEC 0x01_80E8 28 40 0x01_80E9 29 41 0x01_80EA 2A 42 0x01_80EB 2B 43 0x01_80EC 2C 44 0x01_80ED 2D 0x01_80EE Byte description 7 6 5 4 3 Target register 2 1 0 Name Offset GAIN_CAL_IG4_ROOM (hi) n.a. GAIN_CAL_IG4_ROOM (med) n.a. GAIN_CAL_IG4_ROOM (lo) n.a. COMP_VSG_COLD[7:0] VSENSE Channel Gain Compensation - COLD Temp(310) n.a. 45 COMP_VSG_HOT[7:0] VSENSE Channel Gain Compensation - HOT Temp(310) n.a. 2E 46 COMP_VOG_COLD[7:0] VOPT Channel Gain Compensation COLD Temp(310) n.a. 0x01_80EF 2F 47 COMP_VOG_HOT[7:0] VOPT Channel Gain Compensation HOT Temp(310) n.a. 0x01_80F0 30 48 IGC4_COLD[7:0] Current Channel Gain (4) Compensation - COLD Temp(310) n.a. 0x01_80F1 31 49 IGC4_HOT[7:0] Current Channel Gain (4) Compensation - HOT Temp(310) n.a. 0x01_80F2 32 50 IGC8_COLD[7:0] Current Channel Gain (8) Compensation - COLD Temp(310) n.a. 0x01_80F3 33 51 IGC8_HOT[7:0] Current Channel Gain (8) Compensation - HOT Temp(310) n.a. 0x01_80F4 34 52 IGC16_COLD[7:0] Current Channel Gain (16) Compensation - COLD Temp(310) n.a. 0x01_80F5 35 53 IGC16_HOT[7:0] Current Channel Gain (16) Compensation - HOT Temp(310) n.a. 0x01_80F6 36 54 IGC32_COLD[7:0] Current Channel Gain (32) Compensation - COLD Temp(310) n.a. 0x01_80F7 37 55 IGC32_HOT[7:0] Current Channel Gain (32) Compensation - HOT Temp(310) n.a. 0x01_80F8 38 56 IGC64_COLD[7:0] Current Channel Gain (64) Compensation - COLD Temp(310) n.a. 0x01_80F9 39 57 IGC64_HOT[7:0] Current Channel Gain (64) Compensation - HOT Temp(310) n.a. 0x01_80FA 3A 58 IGC128_COLD[7:0] Current Channel Gain (128) Compensation - COLD Temp(310) n.a. 0x01_80FB 3B 59 IGC128_HOT[7:0] Current Channel Gain (128) Compensation - HOT Temp(310) n.a. 0x01_80FC 3C 60 IGC256_COLD[7:0] Current Channel Gain (256) Compensation - COLD Temp(310) n.a. 0x01_80FD 3D 61 IGC256_HOT[7:0] Current Channel Gain (256) Compensation - HOT Temp(310) n.a. 0x01_80FE 3E 62 IGC512_COLD[7:0] Current Channel Gain (512) Compensation - COLD Temp(310) n.a. BG3 diag measurement from I channel (gain4) at room Reserved MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 562. Analog die trimming information (continued) OFFSET Global address HEX DEC 0x01_80FF 3F 63 Byte description 7 6 5 4 3 Target register 2 1 IGC512_HOT[7:0] 0 Name Offset Current Channel Gain (512) Compensation - HOT Temp(310) n.a. Notes 309. Based on the selection of the voltage measurement source (VSENSE or VOPT) and the activation of chopper mode. 310. 7 Bit character with bit 7 (MSB) as sign (0 = "+"; 1 = "-") with the difference to the corresponding room temperature value (e.g. 10000010 = "-2"). 5.2.2 5.2.2.1 Analog die trimming overview Current channel gain compensation trim (COMP_IG4-COMP_IG512) To achieve the specified accuracy of the current acquisition, the optimum trim value is calculated during final test and stored into the MCU FLASH memory. On device every power up, the corresponding trim value needs to be copied into the corresponding analog register via D2D interface. See Section 4.8, "Channel acquisition" for additional details. 5.2.2.2 Bandgap reference trimming (TRIM_BG0-TRIM_BG2) To achieve the specified accuracy of the integrated voltage regulators on the analog die, the optimum trim value is calculated during final test and stored into the MCU FLASH memory. On device every power up, the corresponding trim value needs to be copied into the desired analog register via D2D interface. 5.2.2.3 LIN slope control trimming (TRIM_LIN) To achieve the specified slope of the LIN output signal, the optimum trim information is determined during final test and stored into the IFR register block of the MCU FLASH memory. On device every power up, the corresponding trim value needs to be copied into the desired analog register via D2D interface. 5.2.2.4 Low voltage threshold trim (TRIM_LVT) To achieve the specified low voltage behavior, on device every power up, the corresponding trim value (LVR) needs to be copied into the corresponding analog trim register via D2D interface. 5.2.2.5 Low power oscillator trimming (TRIM_OSC) To achieve the specified accuracy of the analog low power reference frequency (fTOL_A), the optimum trim value is calculated during final test and stored into the IFR register block of the MCU FLASH memory. On device every power up, the corresponding trim value needs to be copied into the desired analog register via D2D interface. 5.2.2.6 Voltage channel compensation (COMP_VOx, COMP_VSG, COMP_VOG) To achieve the specified accuracy of the voltage channels, gain and offset compensation are trimmed during final test and stored into the IFR register block of the MCU FLASH memory. The information is used during the calibration procedure described in Section 4.8.5, "Calibration". 5.2.2.7 Temperature sense module trimming (COMP_ITO, COMP_ITG) To achieve the specified accuracy of the internal temperature sense module, the optimum trim information is determined during final test at hot / cold temperature and stored into the IFR register block of the MCU FLASH memory. On device every power up, the corresponding trim value needs to be copied into the desired analog register via D2D interface. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 5.2.2.8 Band gap reference - diagnostic measurements (GAIN_CAL_X_X) To achieve the specified accuracy of the voltage and current channels, reference measurements are performed during final test and stored for different temperatures into the IFR register block of the MCU FLASH memory. The information is used during the calibration procedure described in Section 4.8.5, "Calibration". 5.2.2.9 Hot/cold gain compensation data (0x01_80EC - 0x01_80FF) To achieve the specified accuracy of the voltage and current channels, reference measurements are performed during final test and stored for different temperatures into the IFR register block of the MCU FLASH memory. The information is used during the calibration procedure described in Section 4.8.5, "Calibration". 5.3 5.3.1 Memory map and registers Overview This section provides a detailed description of the memory map and registers for the analog die trimming excluding registers used for calibration located from offset 0xE0 to 0xEF. Refer to Section 4.8.5, "Calibration" for details on Current channel gain compensation trim (COMP_IG4-COMP_IG512), Voltage channel compensation (COMP_VOx, COMP_VSG, COMP_VOG), Temperature sense module trimming (COMP_ITO, COMP_ITG), Band gap reference - diagnostic measurements (GAIN_CAL_X_X) and Hot/cold gain compensation data (0x01_80EC - 0x01_80FF). 5.3.2 Module memory map The memory map for the Compensation module is given below in Table 62. Table 563. Module memory map Offset(311) 0xE0 0xE1 0xE2 0xE3 0xE4 0xE5 Name TRIM_BG0 (hi) R Trim bandgap 0 W TRIM_BG0 (lo) R Trim bandgap 0 W TRIM_BG1 (hi) R Trim bandgap 1 W TRIM_BG1 (lo) R Trim bandgap 1 W TRIM_BG2 (hi) R Trim bandgap 2 W TRIM_BG2 (lo) R Trim bandgap 2 W TRIM_LIN R Trim LIN W TRIM_LVT R Trim low voltage threshold W 0xE6 0xE7 7 6 0 0 0 0 UBG3 DBG3 0 0 5 0 4 3 2 1 0 TCIBG2[2:0] TCIBG1[2:0] IBG2[2:0] IBG1[2:0] TCBG2[2:0] TCBG1[2:0] 0 0 SLPBG[2:0] V1P2BG2[3:0] V1P2BG1[3:0] V2P5BG2[3:0] V2P5BG1[3:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 LIN LVT MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS Table 563. Module memory map (continued) Offset(311) Name 0xE8 0xE9 7 TRIM_OSC (hi) R Trim LP oscillator W TRIM_OSC (lo) R Trim LP oscillator W 0xEA0xEF 5 4 3 2 1 0 0 0 0 LPOSC[12:0] R Reserved 6 0 0 0 0 0 W Notes 311. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. 5.3.2.1 Trim bandgap 0 (TRIM_BG0 (hi)) Table 564. Trim bandgap 0 (TRIM_BG0 (hi)) Offset(312) 0xE0 R Access: User read/write 7 6 0 0 0 0 5 3 2 TCIBG2[2:0] W Reset 4 0 1 0 TCIBG1[2:0] 0 0 0 0 0 Notes 312. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 565. Trim bandgap 0 (TRIM_BG0 (hi)) - register field descriptions Field 5-3 TCIBG2[2:0] 2-0 TCIBG1[2:0] 5.3.2.2 Description The optimal content of this register is determined during final test and stored in the microcontroller IFR. For proper operation of the MM912_637, the content has to be copied to this location. See Section 5.2.1, "IFR - trimming content for analog die functionality" for location information. Trim bandgap 0 (TRIM_BG0 (lo)) Table 566. Trim bandgap 0 (TRIM_BG0 (lo)) Offset(313) 0xE1 R Access: User read/write 7 6 0 0 0 0 5 3 2 IBG2[2:0] W Reset 4 0 0 1 0 IBG1[2:0] 0 0 0 0 Notes 313. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS Table 567. Trim bandgap 0 (TRIM_BG0 (lo)) - register field descriptions Field 5-3 IBG2[2:0] 2-0 IBG1[2:0] 5.3.2.3 Description The optimal content of this register is determined during final test and stored in the microcontroller IFR. For proper operation of the MM912_637, the content has to be copied to this location. See Section 5.2.1, "IFR - trimming content for analog die functionality" for location information. Trim bandgap 1 (TRIM_BG1 (hi)) Table 568. Trim bandgap 1 (TRIM_BG1 (hi)) Offset(314) 0xE2 R W Access: User read/write 7 6 UBG3 DBG3 0 0 Reset 5 4 3 2 TCBG2[2:0] 0 0 1 0 TCBG1[2:0] 0 0 0 0 Notes 314. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 569. Trim bandgap 1 (TRIM_BG1 (hi)) - register field descriptions Field Description 7 UBG3 6 DBG3 5-3 TCBG2[2:0] The optimal content of this register is determined during final test and stored in the microcontroller IFR. For proper operation of the MM912_637, the content has to be copied to this location. See Section 5.2.1, "IFR - trimming content for analog die functionality" for location information. 2-1 TCBG1[2:0] 5.3.2.4 Trim bandgap 1 (TRIM_BG1 (lo)) Table 570. Trim bandgap 1 (TRIM_BG1 (lo)) Offset(315) 0xE3 R Access: User read/write 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 SLPBG[2:0] W Reset 1 0 0 0 Notes 315. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 571. Trim bandgap 1 (TRIM_BG1 (lo)) - register field descriptions Field 2-0 SLPBG[2:0] Description The optimal content of this register is determined during final test and stored in the microcontroller IFR. For proper operation of the MM912_637, the content has to be copied to this location. See Section 5.2.1, "IFR - trimming content for analog die functionality" for location information. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 5.3.2.5 Trim bandgap 2 (TRIM_BG2 (hi)) Table 572. Trim bandgap 2 (TRIM_BG2 (hi)) Offset(316) 0xE4 Access: User read/write 7 6 R 5 4 3 2 V1P2BG2[3:0] W Reset 0 0 1 0 0 0 V1P2BG1[3:0] 0 0 0 0 Notes 316. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 573. Trim bandgap 2 (TRIM_BG2 (hi)) - register field descriptions Field Description 7-4 V1P2BG2[3:0 The optimal content of this register is determined during final test and stored in the microcontroller IFR. For proper operation of the MM912_637, the content has to be copied to this location. See Section 5.2.1, "IFR - trimming content for analog die functionality" for location information. 3-0 V1P2BG1[3:0 5.3.2.6 Trim Bandgap 2 (TRIM_BG2 (lo)) Table 574. Trim bandgap 2 (TRIM_BG2 (hi)) Offset(317) 0xE5 Access: User read/write 7 6 R 4 3 2 V2P5BG2[3:0] W Reset 5 0 0 1 0 0 0 V2P5BG1[3:0] 0 0 0 0 Notes 317. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 575. Trim bandgap 2 (TRIM_BG2 (hi)) - register field descriptions Field 7-4 V2P5BG2[3:0 3-0 V2P5BG1[3:0 Description The optimal content of this register is determined during final test and stored in the microcontroller IFR. For proper operation of the MM912_637, the content has to be copied to this location. See Section 5.2.1, "IFR - trimming content for analog die functionality" for location information. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 5.3.2.7 trim LIN (TRIM_LIN) Table 576. Trim LIN (TRIM_LIN) Offset(318) 0xE6 R Access: User read/write 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 0 LIN 0 Notes 318. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 577. Trim LIN (TRIM_LIN) - register field descriptions Field 0 LIN 5.3.2.8 Description The optimal content of this register is determined during final test and stored in the microcontroller IFR. For proper operation of the MM912_637, the content has to be copied to this location. See Section 5.2.1, "IFR - trimming content for analog die functionality" for location information. Trim low voltage threshold (TRIM_LVT) Table 578. Trim low-voltage threshold (TRIM_LVT) Offset(319) 0xE7 R Access: User read/write 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 0 LVT 0 Notes 319. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 579. Trim low-voltage threshold (TRIM_LVT) - register field descriptions Field Description 0 LVT The optimal content of this register is determined during final test and stored in the microcontroller IFR. For proper operation of the MM912_637, the content has to be copied to this location. See Section 5.2.1, "IFR - trimming content for analog die functionality" for location information. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 5.3.2.9 Trim LP oscillator (TRIM_OSC (hi), TRIM_OSC (lo)) Table 580. Trim LP oscillator (TRIM_OSC (hi), TRIM_OSC (lo)) Offset(320) 0xE8 Access: User read/write 7 6 5 4 3 R 0 0 0 0 R 0 0 0 0 0 1 1 1 1 LPOSC[7:0] W Reset 1 LPOSC[12:8] W Reset 2 0 0 1 1 Notes 320. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space. Table 581. Trim LP Oscillator (TRIM_OSC (hi), TRIM_OSC (lo)) - Register Field Descriptions Field Description 12-0 LPOSC[12:0] The optimal content of this register is determined during final test and stored in the microcontroller IFR. For proper operation of the MM912_637, the content has to be copied to this location. See Section 5.2.1, "IFR - trimming content for analog die functionality" for location information. MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS 6 Packaging 6.1 Package dimensions For the most current package revision, visit www.nxp.com and perform a keyword search using the "98A" listed below. MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS MM912_637 25 NXP Semiconductors ELECTRICAL CHARACTERISTICS MM912_637 NXP Semiconductors 24 ELECTRICAL CHARACTERISTICS 7 Revision history Revision Date 1.0 4/2011 * Initial release 2.0 8/2011 * Minor changes throughout the document 3.0 1/2012 * Minor description changes and logo to align this data sheet to the Xtrinsic product platform. No content was altered. * * * * * * * * Added targeted applications Normal mode current max = 25 mA MM912_637 stop/sleep/pseudo stop consumption combined for the product Max operating conditions on Isense set to +/-0.3 V Low voltage resetH lower limit = 1.9 V Undervoltage interrupt assert lower limit = 4.55 V Undervoltage interrupt deassert lower limit = 4.7 V Description updated to fit current implementation on current ampere hour counter: The accumulator could be reset by writing 1 into AHCR register. The Ampere Hour Counter is counting after wake-up. In Normal mode, the accumulator register ACQ_AHC can be read out any time. Added RESET to RESETA connection to Figure 4. Required / Recommended External Components. Added connection information to VDDX/VDDRX, VDDH/VDDD2D and RESET/RESETA pins into pin description. Repeated description of the Life Time Counter Clarified to wait for PLL Lock after wake-up Repeated description of Low Power Current trigger threshold 10/2013 Description of Changes 4.0 * * * * * 3/2014 * Removed Xtrinsic logo. No other change to the document * Changed document status to Technical Data. 1/2015 * Remove option detailing reduced accuracy for voltage and current measurement if the temperature based compensation is not used (single temperature calibration). All known customers are using temperature based compensation for best accuracy. * Updated tables 62 and 182, and updated description corresponding descriiption tables 27 and 184. * Updated per PB #16604. 8/2016 * Updated to NXP document form and style 5.0 MM912_637 25 NXP Semiconductors How to Reach Us: Information in this document is provided solely to enable system and software implementers to use NXP products. Home Page: NXP.com There are no expressed or implied copyright licenses granted hereunder to design or fabricate any integrated circuits Web Support: http://www.nxp.com/support products herein. based on the information in this document. NXP reserves the right to make changes without further notice to any NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation, consequential or incidental damages. "Typical" parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including "typicals," must be validated for each customer application by the customer's technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: http://www.nxp.com/terms-of-use.html. NXP, the NXP logo, Freescale, the Freescale logo and SMARTMOS are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All rights reserved. (c) 2016 NXP B.V. Document Number: MM912_637D1 Rev. 5.0 8/2016