PAN9026 Wi-Fi Dual Band 2.4/5 GHz and Bluetooth Module Product Specification Rev. 1.0 Wireless Modules PAN9026 Wi-Fi/BT Module * * Overview The PAN9026 is a 2.4/5 GHz ISM band Wi-Fi and Bluetooth radio module, which includes a wireless radio for easy integration of Wi-Fi and Bluetooth connectivity into various electronic devices. * * Features * Dual band 2.4/5 GHz 802.11 a/b/g/n Wi-Fi/BT * * * * * * Coexistence interface for arbitration of colocated WLAN, Bluetooth, or Mobile Wireless System (e.g. LTE) Generic interfaces include SDIO 3.0 and highspeed UART for host processor connection Software Linux driver Characteristics * Surface Mount Type (SMT) combo module * Power management with sleep clock 17.5 mm x 10.0 mm x 2.6 mm Supports 802.11i security standards through AES, CCMP, and more security mechanisms * 802.11e Quality of Service is supported for multimedia applications * * IEEE 802.11n-compliant, 1x1 spatial stream with data rates up to MCS7 150 Mbps * Bluetooth 5.0 (includes LE) * * * Dual simultaneous and independent WLAN and Bluetooth operation Dynamic Rapid Channel Switching (DRCS) for simultaneous operation in 2.4 GHz and 5 GHz bands * * Indoor location and navigation with IEEE 802.11mc Marvell(R) 88W8977 WLAN 2.4/5 GHz and Bluetooth single-chip solution inside TX Power +16 dBm @ 802.11b RX Sensitivity -98 dBm @ 802.11b DSSS 1 Mbps IEEE 802.11n 20 MHz and 40 MHz channel bandwidth Long and Short Guard Interval support Power supply 3.3 V, 2.2 V, 1.8 V Current consumption Wi-Fi typical 400 mA @ TX and 70 mA @ RX SDIO 1-bit or 4-bit Wide temperature range of -30 to +85 C Block Diagram VIO 1.8 V VDD 2.2 V Crystal 26 MHz VDD 1.8 V Crystal 32.768 kHz PAN9026 Wi-Fi & Bluetooth Radio Module IEEE 802.11 a/b/g/n Bluetooth 5.0 (BR, LE & EDR) 32 kHz DISABLE SPI GPIOs BPF PDN Chip Antenna JTAG 88W8977 Radio SoC UART Status LED's MCU Ready DPX 50 Ohm COEX SPDT VIO SD SDIO Interface Factory Reset Wake Up's PCM Interface SPDT CNTL VIO RF 3.3 V RF SW RF Pad V SPDT Product Specification Rev. 1.0 Page 2 PAN9026 Wi-Fi/BT Module By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. (c) Panasonic Industrial Devices Europe GmbH 2017. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Description does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status "Engineering Samples". This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by: The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, Deviation or lapse in function of the Engineering Sample, Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. Product Specification Rev. 1.0 Page 3 PAN9026 Wi-Fi/BT Module Table of Contents 1 2 3 4 5 6 About This Document......................................................................................................................... 5 1.1 Purpose and Audience .............................................................................................................. 5 1.2 Revision History ......................................................................................................................... 5 1.3 Use of Symbols ......................................................................................................................... 5 1.4 Related Documents ................................................................................................................... 5 Overview .............................................................................................................................................. 6 2.1 Block Diagram ........................................................................................................................... 7 2.2 Pin Configuration ....................................................................................................................... 8 2.3 Power Management................................................................................................................. 12 2.4 Host Interfaces ........................................................................................................................ 13 2.5 Peripheral Bus Interface .......................................................................................................... 14 2.6 PCM Interface .......................................................................................................................... 15 2.7 Coexistence ............................................................................................................................. 16 2.8 WLAN ...................................................................................................................................... 29 2.9 Bluetooth ................................................................................................................................. 34 Detailed Description ......................................................................................................................... 36 3.1 Dimensions .............................................................................................................................. 36 3.2 Footprint .................................................................................................................................. 37 3.3 Packaging ................................................................................................................................ 38 3.4 Case Marking .......................................................................................................................... 41 Specification ..................................................................................................................................... 42 4.1 Default Test Conditions ........................................................................................................... 42 4.2 Absolute Maximum Ratings ..................................................................................................... 43 4.3 Recommended Operating Conditions ...................................................................................... 44 4.4 RF Electrical Characteristics .................................................................................................... 63 4.5 Reliability Tests ....................................................................................................................... 73 4.6 Recommended Soldering Profile ............................................................................................. 74 Cautions ............................................................................................................................................ 75 5.1 Design Notes ........................................................................................................................... 75 5.2 Installation Notes ..................................................................................................................... 75 5.3 Usage Condition Notes ............................................................................................................ 76 5.4 Storage Notes .......................................................................................................................... 76 5.5 Safety Cautions ....................................................................................................................... 76 5.6 Other Cautions ........................................................................................................................ 77 5.7 Life Support Policy ................................................................................................................... 77 Regulatory and Certification Information ....................................................................................... 78 6.1 7 RoHS And REACH Declaration ............................................................................................... 78 Appendix ........................................................................................................................................... 79 7.1 Ordering Information ................................................................................................................ 79 7.2 Acronyms and Abbreviations ................................................................................................... 80 7.3 Contact Details ........................................................................................................................ 82 Product Specification Rev. 1.0 Page 4 PAN9026 Wi-Fi/BT Module 1 About This Document 1 About This Document 1.1 Purpose and Audience This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN9026 modules. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as "the PAN9026" or "the module" within this document. 1.2 1.3 Revision History Revision Date Modifications/Remarks 0.1 13.04.2017 First preliminary version 1.0 20.12.2017 Change to Bluetooth 5.0: Features, 2.1 Block Diagram, 2.9 Bluetooth, 7.1 Ordering Information Change PM: 2.3.1 Power Configuration Example with 3.3 V Host Operation Include values: 4.3.2 Current Consumption, 4.4.3.2 Transmitter Section RF Characteristics Remove section: 4.3.7.2 TDM Interface Additional models: 7.1 Ordering Information Add section: 7.2 Acronyms and Abbreviations Use of Symbols Symbol Description Note Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product's functionality at risk. [chapter number] [chapter title] Cross reference Indicates cross references within the document. Example: Description of the symbols used in this document 1.3 Use of Symbols. 1.4 Related Documents Please refer to the Panasonic website for related documents 7.3.2 Product Information. Product Specification Rev. 1.0 Page 5 PAN9026 Wi-Fi/BT Module 2 Overview 2 Overview The PAN9026 is a dual band 2.4/5 GHz 802.11 a/b/g/n Wi-Fi radio module with integrated Bluetooth BR/EDR/LE, specifically designed for highly integrated and cost-effective applications. The simultaneous and independent operation of the two standards enables high data rates (802.11n) and low-power operation (Bluetooth Low Energy). Integrated power management, a fast dual-core CPU, 802.11i security standard support, and high-speed data interfaces deliver the performance for the speed, reliability, and quality requirements of next generation products. TX power calibration data and Wi-Fi/Bluetooth system parameters are prestored on the one-time-programmable memory of the PAN9026 during production at Panasonic. This simplifies passing the certification process for PAN9026 customers. Furthermore, the module reduces design, test, and calibration effort resulting in reduced time-to-market compared to discrete solutions. Integrating Wi-Fi and Bluetooth wireless connectivity allows applications such as Smart Energy and home gateways to manage multiple devices and appliances. The combination of Wi-Fi and Bluetooth provides the highest flexibility for connectivity. Please refer to the Panasonic website for related documents 7.3.2 Product Information. Further information on the variants and versions 7.1 Ordering Information. Product Specification Rev. 1.0 Page 6 PAN9026 Wi-Fi/BT Module 2 Overview 2.1 Block Diagram VIO 1.8 V VDD 2.2 V Crystal 26 MHz VDD 1.8 V Crystal 32.768 kHz PAN9026 Wi-Fi & Bluetooth Radio Module IEEE 802.11 a/b/g/n Bluetooth 5.0 (BR, LE & EDR) 32 kHz DISABLE SPI GPIOs BPF PDN Chip Antenna JTAG 88W8977 Radio SoC UART Status LED's VIO SD MCU Ready DPX 50 Ohm COEX SPDT SDIO Interface Factory Reset Wake Up's PCM Interface SPDT CNTL VIO RF 3.3 V RF SW RF Pad V SPDT Product Specification Rev. 1.0 Page 7 PAN9026 Wi-Fi/BT Module 2 Overview 2.2 Pin Configuration Pin Assignment G1 G2 G3 G4 G5 G6 G7 G8 G9 F1 F2 F3 F4 F5 F6 F7 F8 F9 E1 E2 E3 E4 D1 D2 D3 D4 C1 C2 C3 C4 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 E9 EP1 EP2 D9 Ground plane keep out area C9 Chip Antenna 10,00 mm Top View 17,50 mm Pin Functions No Pin Name Pin Type Description A1 1 PCM_DOUT Output signal PCM data output signal IO5 Digital I/O General Purpose IO - GPIO[5] A2 32KHZ_IN NC Do not connect A3 PDN Input signal Power down, active-low A4 VDD1V8 Power 1.7 V-1.9 V (typ. 1.8 V) power supply connection A5 VDD1V8 Power 1.7 V-1.9 V (typ. 1.8 V) power supply connection A6 VDD2V2 Power 2.1 V- 2.3 V (typ. 2.2 V) power supply connection A7 RF_SW1 Input signal RF Switch Pin 1 - logical voltage level to activate on-board antenna or RF Pad RF-Switch Pins Function A8 GND Ground pin Connect to ground A9 RF_OUT RF port 50 bottom pad to be activated by RF_SW1/RF_SW2 control voltage RF-Switch Pins Function B1 1 1 PCM_CLK Input/output PCM clock signal, output if PCM master, input if PCM slave IO6 Digital I/O General Purpose IO - GPIO[6] Multi-purpose pins: After the firmware download, the pins (GPIO, Serial Interface, RF control) are programmed in functional mode with dedicated functionality. Product Specification Rev. 1.0 Page 8 PAN9026 Wi-Fi/BT Module 2 Overview No Pin Name Pin Type Description B2 1 PCM_DIN Input signal PCM data input signal Digital I/O General Purpose IO - GPIO[4] Input/output PCM Sync Pulse signal, output if PCM master, input if PCM slave IO7 3 Digital I/O General Purpose IO - GPIO[7] B4 32KHZ_EN Input Signal If using VIO 3.3V disable the internal 32.768 kHz crystal oscillator (100 to GND) to use the SoC reference clock with lower accuracy B5 VDD2V2 Power 2.1 V-2.3 V (typ. 2.2 V) power supply connection B6 VDD2V2 Power 2.1 V-2.3 V (typ. 2.2 V) power supply connection B7 RF_SW2 Input signal RF Switch Pin 2 - logical voltage level to activate on-board antenna or RF Pad RF-Switch Pins Function B8 GND Ground pin Connect to ground B9 GND Ground pin Connect to ground C1 IO2 Digital I/O General Purpose IO - GPIO[2] DVSC[0] Output signal Digital voltage scaling control for PMIC (VOUT 2.2V) Power Configuration Example with 3.3 V Host Operation IO3 Digital I/O General Purpose IO - GPIO[3] DVSC[1] Output signal Digital voltage scaling control for PMIC (VOUT 1.05V) - not used C3 IO1 Digital I/O General Purpose IO - GPIO[1] C4 COEX_SIN Input signal Serial data input from MWS modem or peripheral device C9 GND Ground pin Connect to ground D1 IO15 Digital I/O General Purpose IO - GPIO[15] D2 IO14 Digital I/O General Purpose IO - GPIO[14] D3 DNC_E3 NC Do not connect D4 COEX_SOUT Output signal Serial data output to MWS modem or peripheral device D9 GND Ground pin Connect to ground E1 SD_CLK Digital I/O For SDIO specific terminals SDIO Pins Function E2 SD_CMD Digital I/O For SDIO specific terminals SDIO Pins Function E3 IO0 Digital I/O General Purpose IO - GPIO[0] E4 DNC_E4 NC Do not connect E9 GND Ground pin Connect to ground F1 SD_DAT0 Digital I/O For SDIO specific terminals SDIO Pins Function IO4 B3 1 PCM_SYNC C2 2 2 PCM Mode: After enabling the mode by host command, the pin is used as PCM Audio Interface. 3 GPIO Mode: After enabling the mode by host command, the pin is used as Multi-Purpose Interface. Product Specification Rev. 1.0 Page 9 PAN9026 Wi-Fi/BT Module 2 Overview No Pin Name Pin Type Description F2 SD_DAT1 Digital I/O For SDIO specific terminals SDIO Pins Function F3 1 UART_SOUT 4 Output Signal Serial data output to peripheral device IO8 3 Digital I/O General Purpose IO - GPIO[8] Input Signal Information BT using channel which overlaps WLAN channel or not UART_SIN 4 Input signal Serial data input to peripheral device IO9 3 Digital I/O General Purpose IO - GPIO[9] Input signal Information BT_REQ priority (1- or 2-bit) and direction BT RX/TX Output signal Request-to-Send output to peripheral device IO11 3 Digital I/O General Purpose IO - GPIO[11] BT_REQ 5 Input signal BT device request access to medium F6 IO12 Digital I/O General Purpose IO - GPIO[12] F7 CNTL1 Output signal Do not connect F8 CNTL0 Input signal Keep open (DNC) if using SDIO interface for BT or connect with 100 k to GND if using UART interface for BT Control Pin Function F9 GND Ground pin Connect to ground G1 SD_DAT2 Digital I/O For SDIO specific terminals SDIO Pins Function G2 SD_DAT3 Digital I/O For SDIO specific terminals SDIO Pins Function G3 VIOSD Power 1.8 V or 3.3 V Digital I/O SDIO power supply G4 VIO Power 1.8 V or 3.3 V power supply for General Purpose IO, if using VIO 3.3V disable the internal 32.768 kHz crystal oscillator (Pin No B4) G5 1 UART_CTS 4 Input signal Clear-to-send input from peripheral device Digital I/O General Purpose IO - GPIO[10] BT_GRANT 5 Output signal Indicate permission to transmit, low BT can transmit G6 IO13 Digital I/O General Purpose IO - GPIO[13] G7 VIORF Power 3.0 V - 3.6 V (typ. 3.3 V) power supply connection G8 DNC NC Do not connect G9 GND Ground pin Connect to ground EP1 EPAD1 Thermal pin Connect to ground EP2 EPAD2 Thermal pin Connect to gorund BT_FREQ F4 1 5 BT_STATE 5 F5 1 UART_RTS IO10 4 3 4 UART mode: After the dedicated firmware download, the pin is used as Host Controller Interface (HCI) for Bluetooth. 5 Bluetooth External Coexistence Mode: After enabling the mode by host command, the pin is used as Bluetooth external Coexistence Interface. Product Specification Rev. 1.0 Page 10 PAN9026 Wi-Fi/BT Module 2 Overview SDIO Pins Function No Pin Name Pin Type Description 4-Bit Mode 1-Bit Mode E1 SD_CLK Digital I/O Clock Clock E2 SD_CMD Digital I/O Command Line Command Line F1 SD_DAT0 Digital I/O Data Line bit [0] Data Line F2 SD_DAT1 Digital I/O Data Line bit [1] or Interrupt (optional) Interrupt G1 SD_DAT2 Digital I/O Data Line bit [2] or Read Wait (optional) Read Wait (optional) G2 SD_DAT3 Digital I/O Data Line bit [3] Not used RF-Switch Pins Function No Pin Name Pin Type Logical Level for Activation On-Board Chip Antenna RF OUT Pin A7 RF_SW1 Input signal 3.0 V-3.6 V (typ. 3.3 V) GND (0 V) B7 RF_SW2 Input signal GND (0 V) 3.0 V-3.6 V (typ. 3.3 V) Control Pin Function The control pin is used as configuration input to set parameters following a reset. The definition of the pin changes immediately after a reset to its usual function. To set a configuration bit to 0, attach a 100 k resistor from the pin to ground. No external circuitry is required to set a configuration bit to 1. No F8 Pin Name CNTL0 Pin Type Input Signal Strap Value WLAN BT/BLE Firmware Download Type Mode Number SDIO Functions 0 SDIO UART SDIO+UART Parallel/Serial 1 (WLAN) 1 SDIO SDIO SDIO+SDIO Parallel/Serial 2 (WLAN, BT) The configuration of the control pin is used for the firmware boot option. The software reads and boots accordingly. Product Specification Rev. 1.0 Page 11 PAN9026 Wi-Fi/BT Module 2 Overview 2.3 2.3.1 Power Management Power Configuration Example with 3.3 V Host Operation PAN9026 VDD 3.3 V 3.3 V VIO RF 3.3 V PMIC VIO SD 2.2 V VIN VDD 2.2 V 1.8 V VDD 1.8 V 1.8 V VIO VDD 3.3 V or Host GPIO Enable 3.3 V DVSC[0] 88PG823 2.3.2 Power Configuration Example with 1.8 V Host Operation VDD 1.8 V 1.8 V 1.8 V DC 3.3 V 3.3 V PAN9026 VIO/VIO SD VIO RF DC Step-up 3.3 V DC 2.2 V 2.2 V VDD 2.2 V DC Dual Step-down 2.2 V LDO 1.8 V VDD 1.8 V Further information 4.3.4 Power-up Sequence. Product Specification Rev. 1.0 Page 12 PAN9026 Wi-Fi/BT Module 2 Overview 2.4 Host Interfaces The bus interface connects several host interface bus units to the CPU bus of the device through the internal bus. The connection of each unit is multiplexed with other bus units. The high-speed UART interface is connected to the CPU bus through a separate bus. Type Features High-speed UART interface The device supports a high-speed Universal Asynchronous Receiver/Transmitter (UART) interface, compliant with the industry standard 16550 specification. * * * * SDIO interface FIFO mode permanently selected for transmit and receive operations Two pins for transmit and receive operations Two flow control pins Interrupt triggers for low-power, high throughput operation The device supports an SDIO device interface that conforms to the industry standard SDIO full-speed card specification and allows a host controller using the SDIO bus protocol to access the device. * * * * * Supports SDIO 3.0 Standard 1-bit SDIO or 4-bit SDIO transfer modes with full clock range up to 100 MHz On-chip memory used for CIS Special interrupt register for information exchange Allows card to interrupt host Further information 4.3.5 Host Interface Product Specification Rev. 1.0 Page 13 PAN9026 Wi-Fi/BT Module 2 Overview 2.5 Peripheral Bus Interface The Peripheral Bus Unit (PBU) connects several low speed peripherals to the internal bus of the device. The device consists of the GPIO Interface and the One Time Programmable Memory. Type General Purpose I/O (GPIO) Interface One Time Programmable Memory (OTP) Features * * * * * * User-defined GPIOs (each configured to either input or output) Each GPIO controlled independently Each I/O configurable to output bit from GPIO_OUT Storing device-specific calibration data and hardware information like MAC/BD address, WLAN, and Bluetooth parameter Programmed during production process of device Device performs calibration when it is powered up Further information 4.3.6 Peripheral Interface Product Specification Rev. 1.0 Page 14 PAN9026 Wi-Fi/BT Module 2 Overview 2.6 PCM Interface The device supports the PCM interface. Type PCM Interface Features * * * * Master or slave mode PCM bit width size of 8 bits or 16 bits Up to four slots with configurable bit width and start positions Short frame and long frame synchronization Further information 4.3.7 Audio Interface Product Specification Rev. 1.0 Page 15 PAN9026 Wi-Fi/BT Module 2 Overview 2.7 Coexistence The implemented coexistence framework is based on the IEEE 802.15.2 recommended practice Packet Traffic Arbitration (PTA) scheme and the Bluetooth Special Interest Group (BTSIG) Core Specification Volume 7 (Wireless Coexistence Volume). 2.7.1 WLAN/Bluetooth Channel Information Exchange Since Bluetooth and IEEE 802.11 b/g/n WLAN use the same 2.4 GHz frequency band, each can cause interference with another. The level of interference depends on the respective frequency channel used by Bluetooth and WLAN (other factors can impact interference, like Tx power and Rx sensitivity of the device). In a system with both Bluetooth and WLAN, the common host receives information about WLAN channel usage and passes the information to the Bluetooth device. For Bluetooth 1.2 devices with Adaptive Frequency Hopping (AFH) enabled, the Bluetooth device can block channel usage that overlaps the WLAN channel in use. When the Bluetooth device avoids all channels used by the WLAN, the impact of interference is reduced, but not completely eliminated. For Bluetooth 1.1 devices, the Bluetooth device cannot block WLAN channel usage. In this case, a Bluetooth Coexistence Arbiter (BCA) scheme at MAC level is required. The BCA scheme can also be used with Bluetooth 1.2 devices to further reduce the impact of interference to a minimum. 2.7.2 External Mobile Wireless System (LTE/ZigBee) and BCA Exchange Based on the BTSIG Wireless Coexistence Volume, the device supports a Wireless Coexistence Interface 2 (WCI-2) protocol for WLAN/Bluetooth coexistence with an external Mobile Wireless System (MWS), such as a Long Term Evolution (LTE) or ZigBee device. WCI-2 is a 2-wire transport interface. An internal coexistence is used to exchange request/grant with the BCA. Product Specification Rev. 1.0 Page 16 PAN9026 Wi-Fi/BT Module 2 Overview 2.7.3 System Configuration External MWS Device RF Front End BCA BT CTL WLAN MAC BCA WLAN CTL Bluetooth BCA COEX SIN MWS to BCA COEX SOUT BCA to MWS External LTE Device 88W8977 Radio SoC Host External BCA Device BT REQ BT STATE BCA BCA WLAN CTL WLAN MAC BT FREQ BT GRANTn 88W8977 Radio SoC Product Specification Rev. 1.0 External BCA Device Page 17 PAN9026 Wi-Fi/BT Module 2 Overview 2.7.4 WCI-2 Interface The coexistence interface includes a Mobile Wireless System (MWS) transport controller to accommodate a 2-wire, UART-based serial transport interface. This interface is a standard fullduplex UART (TXD and RXD) carrying logical signals framed as UART characters. In addition, it allows support of multiple logical channels. Interface Signals Pin No Signal Name Specification Name Pin Type Description C4 COEX_SIN RXD Input Serial data from external MWS device D4 COEX_SOUT TXD Output Serial data to external MWS device Signal Waveform Format The messaging is based on a standard UART format. The UART signals should be connected like a null-modem. For example, the local TXD connected to the remote RXD and vice versa. Interface Transport Settings Item Range Comment Baudrate 921 600 ~ 4 000 000 Baud Data Bits 8 LSB first Parity Bits 0 No parity Stop Bit 1 One stop bit Flow Control No No flow control Supported Baud Rates Baud 921 600 Product Specification Rev. 1.0 2 000 000 3 000 000 4 000 000 Page 18 PAN9026 Wi-Fi/BT Module 2 Overview Real-Time Signaling Message The real-time signaling message is used to transport real-time signals over the 2-wire transport interface. The real-time signaling message conveys the real-time signals (Bluetooth Core Specification, Volume 7, Part A) in one message. The time reference point for the real-time signaling message is the end of message bit 5 (transition to stop bit). Defined real-time signaling messages include: * * Coexistence Controller to MWS device MWS device to Coexistence Controller Real-Time Signaling MSG[0] MSG[1] MSG[2] MSG[3] MSG[4] MWS to Coexistence Controller (Signal) FRAME_SYNC MWS_RX MWS_TX PATTERN[0] PATTERN[1] Coexistence Controller to MWS (Message) BT_RX_PRI BT_TX_ON 802_RX_PRI 802_TX_ON RFU Signal Name FRAME_SYNC MWS_RX MWS_TX PATTERN[1,0] BT_RX_PRI BT_TX_ON 802_RX_PRI 802_TX_ON MWS_INACTIVITY_DURATION MWS_SCAN_FREQUENCY_OFFSET Product Specification Rev. 1.0 Page 19 PAN9026 Wi-Fi/BT Module 2 Overview Transport Control Message The transport control messages can modify the state and request state information of the MWS coexistence interface. Message MSG[0] MSG[1] MSG[2] MSG[3] MSG[4] Transport Control Message RESEND_REA L_TIME RFU RFU RFU RFU Signal Name Description RESEND_REAL_TIME This bit is set if a device wants to get a status update of the real-time signals. The signal is usually used after wake-up from sleep of the transport interface to get an update of the real-time signals. If the receiving device's transport interface is awake it shall send a real-time message with the current status of the real-time signals within 4 UART character period. If the signal is not transmitted within 4 UART character periods, the device is considered asleep. If the receiving device's transport interface is not awake it shall not send a real-time message. Bluetooth initiated: If the MWS is currently scanning or has an ongoing inactivity duration, the MWS shall send a frequency scan message or an inactivity duration message after transmitting the real-time message. If the receiving device's transport interface is not awake it shall not send a frequency scan or inactivity duration message. Transparent Data Message The transport control messages can modify the state and request state information of the MWS coexistence interface. Message MSG[0] MSG[1] MSG[2] MSG[3] MSG[4] Transparent Data Message NIBBLE_POSI TION DATA[0]/[4] DATA[1]/[5] DATA[2]/[6] DATA[3]/[7] Signal Name Description NIBBLE_POSITION 0 = least significant nibble 1 = most significant nibble DATA[n]; n=0 .. 7 Product Specification Rev. 1.0 Data bits of the message octet Page 20 PAN9026 Wi-Fi/BT Module 2 Overview MWS Inactivity Duration Message The inactivity duration messages is used to send the MWS_INACTIVITY_DURATION signal from the MWS device to the Coexistence Controller. Message MSG[0] MSG[1] MSG[2] MSG[3] MSG[4] MWS Inactivity Duration Message DURATION[0] DURATION[1] DURATION[2] DURATION[3] DURATION[4] The idle duration is encoded in 5 bits given by the formula: Inactivity_Duration = DURATION * 5 ms Inactivity durarations smaller than 5 ms are not communicated. If all bits are set to 1 the inactivity duration is infinite. If all bits are set to 0 or MWS_RX or MWS_TX are set to 1, the inactivity period ends. MWS Scan Frequency Offset Message The MWS scan frequency offset message is used to send the MWS_SCAN_FREQUENCY_ OFFSET signal from the MWS device to the Coexistence Controller. Message MSG[0] MSG[1] MSG[2] MSG[3] MSG[4] MWS Scan Frequency Offset BAND FREQ[0] FREQ [1] FREQ [2] FREQ [3] The RF scan frequency is encoded in 5 bits given by the formula: RF_FREQ_OFFSET = FREQ * 10 MHz If BAND is set to o the RF_FREQ_OFFSET is the negative value from the lower edge of the ISM band and if BAND is set to 1, RF_FREQ_OFFSET is the positive value from the top edge of the ISM band. FREQ set to all 0 indicates the end of the scan period. Product Specification Rev. 1.0 Page 21 PAN9026 Wi-Fi/BT Module 2 Overview 2.7.5 Bluetooth Coexistence Arbiter Type Features Capability * * * * * * Arbitration * * * AFH Programmable coexistence interface timing, interface modes, and signal polarity to support a variety of external Bluetooth devices Programmable decision policies and transaction lock behavior for various use cases Interface with external or on-chip Bluetooth device Support Bluetooth 1.1 or Bluetooth 1.2 AFH WLAN-/Bluetooth-coordinated low-power design Enhanced information sharing between WLAN and Bluetooth for combo systems WLAN/Bluetooth/MWS (LTE/ZigBee) coexistence support Contention resolved by a customizable decision matrix that allows independent grant decision for each device Vectors for the decision matrix: WLAN priority (2-bit) WLAN direction Bluetooth priority (1- or 2-bit) Bluetooth direction Bluetooth frequency in/out band MWS priority (2-bit) MWS direction If AFH is enabled in the Bluetooth device, and there is a sufficient guardband outside the WLAN operating frequency, the Bluetooth device uses the Out-Of-Band (OOB) channel with respect to the WLAN device. Otherwise, the Bluetooth device uses the In-Band (IB) and OOB channels with respect to the WLAN device. The IB and OOB information is either provided by the Bluetooth device through the coexistence interface, or it can be provided through firmware controls in a shared-host system. IB/OOB is a vector in the decision matrix. Product Specification Rev. 1.0 Page 22 PAN9026 Wi-Fi/BT Module 2 Overview Type Features Decision Policies System configuration is a major consideration when planning decision policies. The configuration governs how RF paths are shared and how much interference will occur. Interference combinations include: WLAN TX and Bluetooth TX WLAN TX and Bluetooth RX WLAN RX and Bluetooth TX WLAN RX and Bluetooth RX Interference combinations where WLAN and Bluetooth share the same antenna: WLAN TX and Bluetooth TX share same antenna, the decision matrix allows either WLAN or Bluetooth TX (both OOB and IB), based on relative packet priorities. WLAN TX and Bluetooth RX (both OOB and IB) have sizable interference impacts on Bluetooth RX, the decision matrix grants or denies WLAN TX based on relative packet priorities. WLAN RX and Bluetooth TX (both OOB and IB) have sizable interference impacts on WLAN RX, the decision matrix grants or denies Bluetooth TX based on relative packet priorities. WLAN RX and Bluetooth RX (both OOB and IB) have no impact on each other, the decision matrix grants both. Interference combinations where WLAN and Bluetooth have their own antenna: WLAN TX and Bluetooth TX in OOB situation have little interference impact on each other, the decision matrix grants both. WLAN TX and Bluetooth TX in IB have sizable interference impact on each other, the decision matrix allows either WLAN or Bluetooth TX, based on relative packet priorities. WLAN TX and Bluetooth RX in OOB situation have little interference impact on each other, the decision matrix grants both provided there is enough antenna isolation between WLAN and Bluetooth antenna. WLAN TX and Bluetooth RX in IB situation have sizable interference impact on Bluetooth RX, the decision matrix grants or denies WLAN TX based on relative packet priorities. WLAN RX and Bluetooth TX in OOB situation have little interference impact on each other, the decision matrix grants both provided there is enough antenna isolation between WLAN and Bluetooth antenna. WLAN RX and Bluetooth TX in IB situation have sizable interference impact on WLAN RX, the decision matrix grants or denies Bluetooth TX based on relative packet priorities. WLAN RX and Bluetooth RX (both OOB and IB) have no impact on each other, the decision matrix grants both. For the devices running in a basic shared antenna configuration, the linear switching imposes restrictions on simultaneous transfer. Reasonable policies include: WLAN and Bluetooth are never granted at the same time Decision matrix grants a device based on relative packet priorities and direction Priority order: High > Medium High > Medium > Low For equal priority contention, select one device to win, that optimizes the usage case For the devices running in an enhanced shared antenna configuration, the linear switching imposes restrictions on some simultaneous transfers. Product Specification Rev. 1.0 Page 23 PAN9026 Wi-Fi/BT Module 2 Overview Type Features Transaction Stopping The arbiter allows control of what transfers can be stopped after an initial grant. If allowed, a transaction can be stopped for higher priority request. A transaction stop decision is a function of the decision policies and transaction stopping control. The transaction stopping control is configurable per device and direction. Product Specification Rev. 1.0 Page 24 PAN9026 Wi-Fi/BT Module 2 Overview 2.7.6 Bluetooth Capability Type Features Request Schemes The PTA signals are directly controlled by the hardware to meet timing requirements of the Bluetooth radio. The software controls the type of traffic in priority mode. Mechanism enforced for control include: * * * * Timing Control Product Specification Rev. 1.0 Selection of certain types of communication always treated as high priority Selection of individual frames marked with high priority Real-time signaling of the next slot marked with high priority Automatic hardware control based on the grant/denial history of the Bluetooth link The PTA signal timing scheme is fully programmable relative to the Bluetooth packet timing. Page 25 PAN9026 Wi-Fi/BT Module 2 Overview 2.7.7 WLAN Capability Type Features Capability The WLAN device technology uses an internal coexistence interface to exchange request/grant with the BCA. Features include: * * * * Packet Classification Queue Classification * * * * * * Product Specification Rev. 1.0 Packet-based request signaling with direction and priority information 1- or 2-bit priority signaling to support 4 priority levels Multiple WLAN RX request trigger sources, including early prediction WLAN TX request cancellation and abort if grant denied or revoked in middle of request 802.11n A-MPDU treated as single packet Programmable mask allows each frame type to be mapped to a priority Default setting puts response frames (ACK), beacons, and QoS frames as high priority WLAN TX and RX have separate priority mask Programmable mask allows each transmit queue to be mapped to a priority Queue-based mapping is optional for software-generated frames only Page 26 PAN9026 Wi-Fi/BT Module 2 Overview 2.7.8 LTE (MWS) Capability The device supports a BTSIG WCI-2 MWS coexistence signaling interface. The coexistence logical signaling is designed to enable a standard interface to allow an MWS device and a Coexistence Controller to exchange information and support cooperative coexistence. The WCI-2 signals carry time-critical information such as the start point of an MWS frame. The logical coexistence signaling architecture also includes transparent data messaging and vendor specific data messaging mechanism to enable passing information to and from the collocated MWS device and Coexistence Controller when long latency (tens of milliseconds) cannot be tolerated. Further information 2.7.4 WCI-2 Interface Coexistence Signals The logical signals assist in time alignment, protecting MWS from interference and maximizing the usability of the Bluetooth radio. Time-Critical Coexistence Signals Signal Name Direction FRAME_SYNC MWS to Bluetooth BT_RX_PRI Bluetooth to MWS BT_TX_ON Bluetooth to MWS 802_RX_PRI Bluetooth to MWS 802_TX_ON Bluetooth to MWS MWS_PATTERN MWS to Bluetooth MWS_RX MWS to Bluetooth MWS_TX MWS to Bluetooth MWS_INACTIVITY_DURATION MWS to Bluetooth MWS_SCAN_FREQUENCY_OFFSET MWS to Bluetooth MWS_TX_PRIL (MWS TX Priority Level) MWS to Bluetooth MWS_RX_PRIL (MWS RX Priority Level) MWS to Bluetooth Product Specification Rev. 1.0 Page 27 PAN9026 Wi-Fi/BT Module 2 Overview 2.7.9 ZigBee (MWS) Coexistence Capability ZigBee is based on the IEEE 802.15.4 standard and it is used by a suite of communication protocols to create Personal Area Networks (PANs) supporting home automation, lighting control, etc. ZigBee radios operate in the 2.4 GHz ISM band worldwide. Unlike Bluetooth, the ZigBee specification does not use AFH. When coexisting with WLAN/Bluetooth in the 2.4 GHz band, it is important to avoid co-channel (IB) operation of these radios. The device re-uses the MWS coexistence interface to support ZigBee coexistence. The coexistence logical signaling is used to allow a ZigBee device and a WLAN/Bluetooth combo device to exchange information and support cooperative coexistence. Coexistence Signals The logical signals used for ZigBee and WLAN/Bluetooth coexistence are a subset of the LTE coexistence signaling. Considering the lower data rate of ZigBee packets, a lower baud rate may be chosen for the 2-wire UART physical interface. The BCA supports 3-way arbitration among ZigBee/WLAN/Bluetooth requests. Coexistence Signals Signal Name Direction MWS_RX MWS to Bluetooth MWS_TX MWS to Bluetooth MWS_PATTERN MWS to Bluetooth MWS_RX_PRI MWS to Bluetooth MWS_TX_PRI MWS to Bluetooth 802_RX_PRI Bluetooth to MWS 802_TX_ON Bluetooth to MWS BT_RX_PRI Bluetooth to MWS BT_TX_ON Bluetooth to MWS Product Specification Rev. 1.0 Page 28 PAN9026 Wi-Fi/BT Module 2 Overview 2.8 WLAN Type IEEE 802.11/ Standards WLAN MAC Features * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * Product Specification Rev. 1.0 802.11 data rates 1 and 2 Mbps (DSSS) 802.11b data rates 5.5 and 11 Mbps (CCK) 802.11a/g data rates 6, 9, 12, 18, 24, 36, 48, and 54 Mbps (OFDM) 802.11b/g performance enhancements 802.11n with maximum data rates up to 72 Mbps (20 MHz channel) and 150 Mbps (40 MHz channel) 802.11e quality of service (QoS) 802.11h transmit power control 802.11h DFS radar pulse detection 802.11i enhanced security (WEP, WPA, WPA2) 802.11k radio resource measurement 802.11mc precise indoor location and navigation 802.11n block acknowledgment extension 802.11r fast hand-off for AP roaming 802.11u Hotspot 2.0 (STA mode only) 802.11v TIM frame transmission/reception 802.11w protected management frames Support clients (stations) implementing IEEE Power Save mode Frame exchange at the MAC level to deliver data Received frame filtering and validation (CRC) Generation of MAC header and trailer information (MPDUs) Fragmentation of data frames (MSDUs) Access mechanism support for fair access to shared wireless medium through: Distributed Coordination Function (DCF) Enhanced Distributed Channel Access (EDCA) A-MPDU aggregation/de-aggregation 20/40 MHz channel coexistence RIFS burst receive Management information base Radio resource measurement Quality of service Block acknowledgement Dynamic frequency selection TIM frame TX and RX Multiple BSS/Station Transmit rate adaption Transmit power control Page 29 PAN9026 Wi-Fi/BT Module 2 Overview Type WLAN Baseband Features * * * * * * * * * WLAN Radio * * * * * * * WLAN Encryption * * * * * * * Product Specification Rev. 1.0 802.11n 1x1 SISO (WLAN SoC with SISO RF radio) Backward compatibility with legacy 802.11a/b/g technology WLAN/Bluetooth LNA sharing PHY data rates up to 150 Mbps 20 MHz bandwidth/channel, 40 MHz bandwidth/channel, upper/lower 20 MHz bandwidth in 40 MHz channel, and 20 MHz duplicate legacy bandwidth in 40 MHz channel mode operation Modulation and Coding Scheme MCS 0 ~ 7 and MCS 32 (duplicate 6 Mbps) Dynamic frequency selection (radar detection) - Enhanced radar detection for short and long pulse radar - Enhanced AGC scheme for DFS channel - Japan DFS requirement for W53 and W56 802.11k Radio resource measurement 802.11n optional features: - 20/40 MHz coexistence - Space-Time-Block-Coding (STBC) one spatial stream reception and transmission - Short Guard Interval for both 20 and 40 MHz operation (TX/RX) - RIFS on receive path - Beamformer function and hardware acceleration - Greenfield TX/RX 802.11mc locationing Power save features Integrated direct-conversion radio 20 and 40 MHz channel bandwidth Shared WLAN/Bluetooth receive input scheme for 2.4 GHz band RX Path On-chip gain selectable LNA with optimized noise figure and power consumpttion High dynamic range AGC function in receive mode TX Path Internal PA with power control Optimized TX gain distribution for linearity and noise performance Local Oscillator with fine channel step WEP 64-bit and 128-bit encryption with hardware TKIP processing (WPA) AES-CCMP hardware implementation as part of 802.11i security standard (WPA2) Enhanced AES engine performance Advanced encryption standard (AES)/Counter-Mode/CBC-MAC Protocol (CCMP) AES-Cipher-Based Message Authentication Code (CMAC) as part of the 802.11w security standard WLAN Authentication and Privacy Infrastructure (WAPI) Page 30 PAN9026 Wi-Fi/BT Module 2 Overview Operation Modes Parameter Operation Mode Specification Standard Conformance IEEE 802.11/IEEE 802.11b IEEE 802.11a IEEE 802.11g IEEE 802.11n Modulation Physical layer data rates Supported data rates IEEE 802.11a OFDM IEEE 802.11b DSSS/CCK IEEE 802.11g OFDM IEEE 802.11n OFDM @ MCS0~7 and MCS32 (duplicate 6 Mbps) IEEE 802.11 1, 2 Mbps @ DSSS IEEE 802.11b 5.5, 11 Mbps @ DSSS/CCK IEEE 802.11g 6, 9, 12, 18, 24, 36, 48, 54 Mbps IEEE 802.11a 6, 9, 12, 18, 24, 36, 48, 54 Mbps IEEE 802.11n MCS0~7 HT20 HT40 LGI 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps SGI 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65, 72.2 Mbps LGI 13.5, 27, 40.5, 54, 81, 108, 121.5, 135 Mbps SGI 15, 30, 45, 60, 90, 120, 135, 150 Mbps Supported bandwidth IEEE 802.11n 20, 40 MHz (BW) Supported channel mode operation IEEE 802.11n 20 MHz BW/channel, 40 MHz BW/channel, upper/lower 20 MHz BW @ 40 MHz channel, 20 MHz duplicate legacy BW @ 40 MHz channel Supported Guard Interval IEEE 802.11n 400 ns (SGI), 800 ns (LGI) Product Specification Rev. 1.0 Page 31 PAN9026 Wi-Fi/BT Module 2 Overview Supported Channels and Frequencies 2.4 GHz - IEEE 802.11b/g/n 20 MHz Channels Channel 40 MHz Channels Frequency Unit Channel Frequency Unit 1 2 412 MHz 1-5 2 422 MHz 2 2 417 MHz 2-6 2 427 MHz 3 2 422 MHz 3-7 2 432 MHz 4 2 427 MHz 4-8 2 437 MHz 5 2 432 MHz 5-9 2 442 MHz 6 2 437 MHz 6-10 2 447 MHz 7 2 442 MHz 7-11 2 452 MHz 8 2 447 MHz 9 2 452 MHz 10 2 457 MHz 11 2 462 MHz 12 2 467 MHz 13 2 472 MHz 5 GHz - IEEE 802.11a/n 20 MHz Channels Channel 40 MHz Channels Frequency Unit Channel Frequency Unit 36 5 180 MHz 36-40 5 190 MHz 40 5 200 MHz 44-48 5 230 MHz 44 5 220 MHz 52-56 5 270 MHz 48 5 240 MHz 60-64 5 310 MHz 52 5 260 MHz 56 5 280 MHz 60 5 300 MHz 64 5 320 MHz 100 5 500 MHz 100-104 5 510 MHz 104 5 520 MHz 108-112 5 550 MHz 108 5 540 MHz 116-120 5 590 MHz 112 5 560 MHz 124-128 5 630 MHz 116 5 580 MHz 132-136 5 670 MHz 120 5 600 MHz 124 5 620 MHz 128 5 640 MHz 132 5 660 MHz 136 5 680 MHz 140 5 700 MHz Product Specification Rev. 1.0 Page 32 PAN9026 Wi-Fi/BT Module 2 Overview 5 GHz - IEEE 802.11a/n 20 MHz Channels Channel 40 MHz Channels Frequency Unit Channel Frequency Unit 149 5 745 MHz 149-153 5 755 MHz 153 5 765 MHz 157-161 5 795 MHz 157 5 785 MHz 161 5 805 MHz 165 5 825 MHz 5 GHz - IEEE 802.11a/n (India and additional UNII Channels) 20 MHz Channels Channel 40 MHz Channels Frequency Unit Channel Frequency Unit 144 5 720 MHz 68-72 5 350 MHz 1696 5 845 MHz 76-80 5 390 MHz 173 5 865 MHz 84-88 5 430 MHz 177 5 885 MHz 92-96 5 470 MHz 181 5 905 MHz 140-144 5 710 MHz 165-169 5 835 MHz 7 5 855 MHz 173-177 5 875 MHz 169-173 6 India channels that can be used in other countries as well 7 India use only Product Specification Rev. 1.0 Page 33 PAN9026 Wi-Fi/BT Module 2 Overview 2.9 Bluetooth Type General Bluetooth Classic (BR/EDR) Features * * * * * * * * * * * * * * * * * * * * * * * * Product Specification Rev. 1.0 Supports Bluetooth 5.0 Shared Tx/Rx path for Bluetooth Digital Audio Interface including PCM interface for voice application Bluetooth and WLAN coexistence WLAN/Bluetooth Coexistence (BCA) protocol support Bluetooth Classic with BT Class 1 support Baseband and radio Basic Rate (BR) and Enhanced Data Rate (EDR) packet types with 1 Mbps (GFSK), 2 Mbps (/4-DQPSK) and 3 Mbps (8DPSK) Fully functional Bluetooth baseband with: - Adaptive Frequency Hopping (AFH) - Forward error correction - Header error control - Access code correlation - CRC - Encryption bit stream generation - Whitening Adaptive Frequency Hopping (AFH) including Packet Loss Rate (PLR) Interlaced scan for faster connection setup Simultaneous active ACL connection support Automatic ACL packet type selection Full master slave piconet support Scatternet support Standard UART and SDIO HCI transport layer SCO/eSCO links with hardware accelerated audio signal pocessing and hardware supported PPEC algorithm for speech quality improvement All standard SCO/eSCO voice coding All standard pairing, authentication, link key, and encryption operations Standard Bluetooth power saving mechanism (i.e. hold, sniff modes, and sniff-sub rating) Enhanced Power Control (EPC) Channel Quality Driven (CQD) data rate Wideband Speech (WBS) support (1 WBS link) Encryption (AES) support LTE/MWS coexistence Page 34 PAN9026 Wi-Fi/BT Module 2 Overview Type Bluetooth Low Energy (LE) Features * * * * * * * * * * Product Specification Rev. 1.0 Broadcaster, Observer, Central, and Peripheral roles Supports link layer topology to be master and slave (connects up to 16 links) Shared RF with BR/EDR Encryption AES support Hardware support for intelligent Adaptive Frequency Hopping (AFH) LE Privacy 1.2 LE Secure Connection LE Data Length Extension LE Advertising Length Extension Direction Finding - Connection-oriented Angle of Arrival (AoA) Page 35 PAN9026 Wi-Fi/BT Module 3 Detailed Description 3 Detailed Description 3.1 Dimensions All dimensions are in millimeters. ,5 0 10 2,55 17 No. Item Dimension Tolerance Remark 1 Width 10.00 0.35 2 Length 17.50 0.35 3 Height 2.55 Product Specification Rev. 1.0 0.20 with case Page 36 PAN9026 Wi-Fi/BT Module 3 Detailed Description 3.2 Footprint The outer dimensions have a tolerance of 0.35 mm. Top View G1 G2 G3 1.00 mm 9,20 mm 7,80 mm 6,80 mm 6,40 mm 5,00 mm 3,60 mm 3,20 mm 2,20 mm 0,80 mm 8,80 mm 6,00 mm 2,20 mm 2,20 mm G4 G5 G6 G7 G8 G9 F5 F6 F7 F8 F9 F1 F2 F3 F4 E1 E2 E3 E4 D2 D3 D4 C2 C3 C4 B2 B3 B4 B5 B6 B7 B8 B9 A4 A5 A6 A7 A8 A9 B1 EP2 D9 Ground plane keep out area C9 0,80 mm A1 0,80 mm 2,20 mm 3,60 mm 5,00 mm 6,40 mm 7,80 mm 9,20 mm 10,60 mm 12,00 mm 12,00 mm A2 A3 8.00 mm EP1 4,80 mm 1,40 mm 1.00 mm C1 E9 Chip Antenna D1 0,80 mm 10,00 mm 0,80 mm 17,50 mm Product Specification Rev. 1.0 Page 37 PAN9026 Wi-Fi/BT Module 3 Detailed Description 3.3 Packaging The product is a mass production status product and will be delivered in the package described below. 3.3.1 Tape Dimensions T 0.30 0.03 P2 2.0 0.15(I) Do + 0.1 1.5 0.0 Po 4.0 0.15(II) E1 1.75 0.1 Y X W Bo So F(III) D1 2.0MIN X Y SECTION Y-Y A P1 0.20 0.05 Ko DETAIL A Ao Bo Ko F P1 SO W 3.3.2 Ao R0.75 10.55 +/- 0.15 18.05 +/- 0.15 3.00 +/- 0.15 14.20 +/- 0.15 20.00 +/- 0.15 28.40 +/- 0.15 32.00 +/- 0.3 SECTION X-X (I) (II) (III) (IV) Measured from centreline of sprocket hole to centreline of pocket. Cumulative tolerance of 10 sprocket holes is 0.20 . Measured from centreline of sprocket hole to centreline of pocket. Other material available. ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED. Packing in Tape Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. The top cover tape shall not be found on reel holes and it shall not stick out from the reel. Product Specification Rev. 1.0 Page 38 PAN9026 Wi-Fi/BT Module 3 Detailed Description 3.3.3 Component Direction 3.3.4 Reel Dimension Product Specification Rev. 1.0 Page 39 PAN9026 Wi-Fi/BT Module 3 Detailed Description 3.3.5 Package Label Example 3.3.6 (1T) Lot code (1P) Customer order number, if applicable (2P) Order number (9D) Date code (Q) Quantity (HW/SW) Hardware/software version Total Package moisture-sensitive print (already exist on barrier bag) barcode label barrier bag sealed desiccant 1) 2) moisture indicator barcode label 1) quantity of desiccant according to calculation 2) optional: desiccant placed into the corner of the barrier bag inner carton box size 340 x 340 x 41 mm Product Specification Rev. 1.0 Page 40 PAN9026 Wi-Fi/BT Module 3 Detailed Description 3.4 Case Marking Example for PAN9026 (top view) 2 1 4 5 3 PAN9026 HW/SW ES M/N: ENWF9201A1EF YYWWDLL 12345678 7 0013430B801E 8 0013430B801F 6 9 11 10 Product Specification Rev. 1.0 1 Brand name 2 Hardware/Software version 3 Engineering Sample (optional) 4 Model Name/ENW number 5 Lot code 6 Serial number 7 WLAN MAC address 8 BD address 9 (Reserved) 10 Marking for Pin 1 11 2D barcode, for internal usage only Page 41 PAN9026 Wi-Fi/BT Module 4 Specification 4 Specification All specifications are over temperature and process, unless indicated otherwise. 4.1 Default Test Conditions Temperature: Humidity: Supply Voltage: Product Specification Rev. 1.0 25 10 C 40 to 85 % RH VDD2V2 VDD1V8 VIORF VIOSD VIO = 2.2 V = 1.8 V = 3.3 V = 3.3 V = 1.8 V Page 42 PAN9026 Wi-Fi/BT Module 4 Specification 4.2 Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter TSTOR Storage temperature VESD ESD robustness Condition Min. Typ. Max. -55 Units +125 C 1 000 V 500 V +20 dBm 1.8 1.98 V 2.2 2.3 V 1.8 2.2 V 3.3 4.0 V 1.8 2.2 V 3.3 4.0 V VIORF 3.3 4.0 V VRF_SW1/2 3.3 4.0 V All pads, according to human body model (HBM), JEDEC STD 22, method A114 According to charged device model (CDM), JEDEC STD 22, method C101 PRF RF input level VDD1V8 Maximum voltage VDD2V2 VIOSD VIO Product Specification Rev. 1.0 Maximum power supply voltage from any pin with respect to VSS (GND) Page 43 PAN9026 Wi-Fi/BT Module 4 Specification 4.3 Recommended Operating Conditions The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter Condition Min. Typ. TA Ambient operating temperature range Extended grade VDD1V8 1V8 supply 8 voltage VDD voltage on pins A4, A5 1.71 VDD2V2 2V2 supply 8 voltage VDD voltage on pins A6, B5, B6 VIOSD Units +85 C 1.80 1.89 V 2.09 2.20 2.29 V Digital I/O Pin G3 with 1.8 V operation VIOSD supply SDIO Pins Function 9 voltage Pin G3 with 3.3 V operation SDIO Pins Function 1.62 1.80 1.98 V 2.97 3.30 3.47 V Digital I/O VIO Pin G4 with 1.8 V operation supply voltage Pin G4 with 3.3 V operation 10 Pin B4 connect to GND 1.62 1.80 1.98 V 2.97 3.30 3.47 V VIORF Digital I/O Pin G7 with 3.3 V operation VIORF supply 8 voltage 2.97 3.30 3.47 V VRF_SW1/2 VRF_SW1/2 switch 8 voltage 3.30 3.60 V VIO Pin A7, B7 with 3.3 V logical level switch operation RF-Switch Pins Function 8 The supply current must be limited to max. 1 A 9 1.8 V or 3.3 V supply voltage possible 10 -30 Max. Connect the 32KHZ_EN pin via a 100 resistor to ground to disable the internal 32.768 kHz crystal oscillator. The low power modes will then use the SoC reference clock, which has lower accuracy. Product Specification Rev. 1.0 Page 44 PAN9026 Wi-Fi/BT Module 4 Specification 4.3.1 Digital Pin Characteristics VIO with 1.8 V Operations11 Symbol Parameter Condition Min. Typ. Max. Units VIH High level input voltage 1.8 V operation (VIO = 1.8 V) 0.7 VIO VIO + 0.4 V VIL Low level input voltage 1.8 V operation (VIO = 1.8 V) -0.4 0.3 VIO V VHYS Input hysteresis 100 VOH High level ouput 1.8 V operation (VIO = 1.8 V) voltage VIO - 0.4 VHO Low level output voltage mV V 1.8 V operation (VIO = 1.8 V) 0.4 V VIO with 3.3 V Operations11 Symbol Parameter Condition Min. Typ. Max. Units VIH High level input voltage 3.3 V operation (VIO = 3.3 V) 0.7 VIO VIO + 0.4 V VIL Low level input voltage 3.3 V operation (VIO = 3.3 V) -0.4 0.3 VIO V VHYS Input hysteresis 100 VOH High level ouput 3.3 V operation (VIO = 3.3 V) voltage VIO - 0.4 VHO Low level output voltage mV V 3.3 V operation (VIO = 3.3 V) 0.4 V VIOSD 1.8 V Operation for SDIO I/F11 Symbol Parameter Condition Min. VIH High level input voltage 1.8 V operation (VIOSD = 1.8 V) 0.7 VIOSD VIL Low level input voltage 1.8 V operation (VIOSD = 1.8 V) VHYS Input hysteresis 100 mV VOH High level ouput 1.8 V operation (VIOSD = 1.8 V) voltage VIOSD V VHO Low level output voltage 11 Typ. Max. Units VIOSD V +0.4 1.8 V operation (VIOSD = 1.8 V) -0.4 0.3 VIOSD V - 0.4 0.4 V The capacitive load should not be larger than 50 pF for all I/Os when using the default driver strength settings. Large capacitance loads generally increase the overall current consumption. Product Specification Rev. 1.0 Page 45 PAN9026 Wi-Fi/BT Module 4 Specification VIOSD 3.3 V Operation for SDIO I/F11 Symbol Parameter Condition Min. Typ. Max. VIH High level input voltage 3.3 V operation (VIOSD = 3.3 V) 0.7 VIO_SD VIL Low level input voltage 3.3 V operation (VIOSD = 3.3 V) VHYS Input hysteresis 100 mV VOH High level ouput 3.3 V operation (VIOSD = 3.3 V) voltage VIOSD V VHO Low level output voltage VIO_SD Units V +0.4 3.3 V operation (VIOSD = 3.3 V) -0.4 0.3 VIO_SD V - 0.4 0.4 V For SDIO 3.0 standard modes SDR12, SDR25, SDR50, and DDR50, a supply voltage of VIOSD = 1.8 V should be used. Product Specification Rev. 1.0 Page 46 PAN9026 Wi-Fi/BT Module 4 Specification 4.3.2 Current Consumption The current consumption depends on the user scenario, the setup and timing of the power modes. Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V, and Tamb = 25 C, if nothing else stated. General Current Consumption Symbol Parameter Condition IVDD1V8 @ PDn Power Down Grounding of PDn pin Min. IVDD2V2 @ PDn IVDD1V8 @ DeepSleep IVDD2V2 @ DeepSleep IVDD1V8 @ Firmware Init IVDD2V2 @ Firmware Init WLAN / BT Deep Sleep Low-power state used in sleep state Firmware Initialization Device Initialization Typ. Max. Units 150 A 5 A 600 A 5 A 400 mA 950 mA WLAN Current Consumption Symbol Parameter Condition IVDD1V8 @ TX Active Transmit12 PTX = +15 dBm for 5 GHz band 802.11a @ 54 Mbps 230 mA PTX = +14 dBm for 5 GHz band 802.11n 20M @ MCS7 240 mA PTX = +13 dBm for 5 GHz band 802.11n 40M @ MCS7 250 mA PTX = +16 dBm for 2.4 GHz band 802.11b @ 11 Mbps 175 mA PTX = +15 dBm for 2.4 GHz band 802.11g @ 54 Mbps 180 mA PTX = +14 dBm for 2.4 GHz band 802.11n 20M @ MCS7 185 mA PTX = +15 dBm for 5 GHz band 802.11a @ 54 Mbps 180 mA PTX = +14 dBm for 5 GHz band 802.11n 20M @ MCS7 170 mA PTX = +13 dBm for 5 GHz band 802.11n 40M @ MCS7 160 mA PTX = +16 dBm for 2.4 GHz band 802.11b @ 11 Mbps 240 mA PTX = +15 dBm for 2.4 GHz band 802.11g @ 54 Mbps 190 mA PTX = +14 dBm for 2.4 GHz band 802.11n 20M @ MCS7 170 mA IVDD2V2 @ TX 12 Active Transmit12 Min. Typ. Max. Units Peak values for specified output power level and data rate with UDP traffic between the AP and Device (STA). Product Specification Rev. 1.0 Page 47 PAN9026 Wi-Fi/BT Module 4 Specification Symbol Parameter Condition IVDD1V8 @ RX Active Receive13 5 GHz band 802.11a @ 54 Mbps 85 mA 5 GHz band 802.11n 20M @ MCS7 95 mA 5 GHz band 802.11n 40M @ MCS7 110 mA 2.4 GHz band 802.11b @ 11 Mbps 65 mA 2.4 GHz band 802.11g @ 54 Mbps 70 mA 2.4 GHz band 802.11n 20M @ MCS7 75 mA Active Receive13 5 GHz band 802.11a/n 20 A 2.4 GHz band 802.11b/g/n 20 A IEEE Power Save14 DTIM = 1 with beacon interval 2 mA 20 A IVDD2V2 @ RX IVDD1V8 @ IEEE-PS IVDD2V2 @ IEEE-PS Min. 15 100 ms (Average ) Typ. Max. Units Bluetooth Current Consumption Symbol Parameter Condition IVDD1V8 @ TX BT SCO HV3 Peak, PTX = +4 dBm 55 mA BT ACL DH1 Average, PTX = 0 dBm 25 mA BT ACL 3-DH5 Average, PTX = 0 dBm 35 mA LE PTX = 0 dBm 45 mA BT SCO HV3 PTX = +4 dBm 15 A BT ACL DH1 PTX = 0 dBm 15 A BT ACL 3-DH5 PTX = 0 dBm 15 A LE PTX = 0 dBm 15 A IVDD1V8 @ RX LE Peak 30 mA IVDD2V2 @ RX LE 5 A IVDD1V8 @ Page Scan BT Page Scan 2.4 mA 5 A 3.8 mA 5 A 1.5 mA 5 A 1.5 mA 5 A IVDD2V2 @ TX Peak IVDD2V2 @ Page Scan IVDD1V8 @ PI Scan IVDD2V2 @ PI Scan IVDD1V8 @ LE Advertise IVDD2V2 @ LE Advertise IVDD1V8 @ LE Scan IVDD2V2 @ LE Scan BT Page and Inquiry Scan Peak LE Advertise in 1.28s Interval Peak LE Scan with Interval 1.28 s Peak Min. Typ. Max. Units 13 Peak values for specified data rate with UDP traffic between the Device (Client) and AP (Server). The WLAN/BT combo Firmware is downloaded and BT is in Deep Sleep. 14 In IEEE Power Save the device automatically wakes up on beacons. If it is a DTIM value of 1 along with a beacon interval of 100 ms, the device wakes up every 100 ms. 15 The average current is averaged over one cycle which includes sleep time and wake up time. Product Specification Rev. 1.0 Page 48 PAN9026 Wi-Fi/BT Module 4 Specification 4.3.3 Internal Operating Frequencies Symbol Parameter fSYSCLK1 CPU1/System Refers to clock speed of SoC's /Encryption CPU1 clock speed 160 MHz fSYSCLK2 CPU2 Refers to clock speed of SoC's CPU2 64 MHz fREFCLK1 Crystal fundamental frequency Frequency tolerance < 10 ppm over operating temperature and process 26 MHz fSLEEPCLK Sleep Clock frequency Frequency tolerance < 20 ppm over operating temperature, aging and process, CMOS input clock signal type 32.768 kHz Product Specification Rev. 1.0 Condition Min. Typ. Max. Units Page 49 PAN9026 Wi-Fi/BT Module 4 Specification 4.3.4 Power-up Sequence VIO VIOSD VIORF 90% VDD2V2 90% VDD1V8 PDn Symbol Parameter VDD1V8 Voltage level of VDD2V2 90 % PDn Voltage level of VDD2V2 90 % Product Specification Rev. 1.0 Min. Typ. Max. Units Page 50 PAN9026 Wi-Fi/BT Module 4 Specification 4.3.5 Host Interface 4.3.5.1 SDIO Interface The SDIO Interface pins are powered from the VIOSD voltage supply with either 3.3 V or 1.8 V. The SDIO electrical specifications are identical for the 1-bit and 4-bit SDIO modes. DC specification 4.3.1 Digital Pin Characteristics SDIO Timing Data - Default and High-Speed Modes (VIOSD 3.3 V)16,17 Symbol Parameter Condition fPP Clock frequency Normal 0 25 MHz High-speed 0 50 MHz TWL Clock low time Min. Normal Max. Units 10 ns 7 ns 10 ns High-speed 7 ns Normal 5 ns High-speed 6 ns Normal 5 ns High-speed 2 ns High-speed TWH Typ. Normal Clock high time TISU Input setup time TIH Input hold time TODLY TOH Output delay time Normal 14 ns CL 40 pF (1 card) High-speed 14 ns Output hold time High-speed 2.5 16 For SDIO 2.0 running at 50 MHz clock frequency, a supply voltage VIOSD of 1.8 V is recommended. 17 For SDIO 2.0 running at 25 MHz clock frequency, either 1.8 V or 3.3 V can be used. Product Specification Rev. 1.0 ns Page 51 PAN9026 Wi-Fi/BT Module 4 Specification SDIO Protocol Timing Diagram - Default Speed Mode (VIOSD 3.3 V) SDIO Protocol Timing Diagram - High-Speed Mode (VIOSD 3.3 V) Product Specification Rev. 1.0 Page 52 PAN9026 Wi-Fi/BT Module 4 Specification SDIO Timing Data - SDR12, SDR25, SDR50 Modes (VIOSD 1.8 V) Symbol Parameter Condition fPP Clock frequency SDR12/SDR25/ SDR50 25 TIS Input setup time SDR12/SDR25/ SDR50 3 ns SDR12/SDR25/ SDR50 0.8 ns 10 TIH Input hold time TCLK Clock time SDR12/SDR25/ SDR50 TCR , TCF Rise time, fall time TCR , TCF < 2 ns (max) at 100 MHz CCARD = 10 pF TODLY Output delay time CL 30 pF TOH Output hold time CL = 15 pF Min. Typ. Max. Units 100 MHz 40 ns SDR12/SDR25/ SDR50 0.2 * TCLK ns SDR12/SDR25/ SDR50 7.5 ns SDR12/SDR25/ SDR50 1.5 ns SDIO Protocol Timing Diagram - SDR12, SDR25, SDR50 Modes (VIOSD 1.8 V) Product Specification Rev. 1.0 Page 53 PAN9026 Wi-Fi/BT Module 4 Specification SDIO Timing Data - DDR50 Mode (VIOSD 1.8 V) Symbol Parameter Condition TCLK Clock time 50 MHz (max) between rising edges DDR50 TCR, TCF Rise time, fall time TCR, TCF < 4.00 ns (max) at 50 MHz, CCARD = 10 pF DDR50 Min. Typ. Max. Units Clock Clock Duty DDR50 20 45 ns 0.2 * TCLK ns 55 % CMD Input (referenced to clock rising edge) TIS Input setup time DDR50 6 ns DDR50 0.8 ns CCARD 10 pF (1 card) TIH Input hold time CCARD 10 pF (1 card) CMD Output (referenced to clock rising edge) TODLY Output delay time during data transfer mode DDR50 13.7 ns CL 30 pF (1 card) TOHLD Output hold time DDR50 1.5 ns DDR50 3 ns DDR50 0.8 ns CL 15 pF (1 card) DAT[3:0] Input (referenced to clock rising and falling edge) TIS2x Input setup time CCARD 10 pF (1 card) TIH2x Input hold time CCARD 10 pF (1 card) DAT[3:0] Output (referenced to clock rising and falling edge) TODLY2x (max) Output delay time during data transfer mode DDR50 7 ns CL 25 pF (1 card) TODLY2x (min) Output hold time DDR50 1.5 ns CL 15 pF (1 card) Product Specification Rev. 1.0 Page 54 PAN9026 Wi-Fi/BT Module 4 Specification SDIO CMD Timing Diagram - DDR50 Mode (VIOSD 1.8 V, 50 MHz) SDIO DAT[3:0] Timing Diagram - DDR50 Mode18 (VIOSD 1.8 V, 50 MHz) 18 In DDR50 mode, DAT[3:0] lines are sampled on both edges of the clock (not applicable for CMD line). Product Specification Rev. 1.0 Page 55 PAN9026 Wi-Fi/BT Module 4 Specification 4.3.5.2 High-Speed UART Interface The High-Speed UART Interface pins are powered from the VIO voltage supply with 1.8 V. DC specification 4.3.1 Digital Pin Characteristics The UART interface operation includes: * Support data input/output operations for peripheral devices connected through a standard UART interface * * * * * * 4-wire data transfer (RXD, TXD, RTS, CTS) Programmable baud rate (1 200 bps to 4 Mbps) Data format (LSB first) Data bit: (5-8 bit) Parity bit: (0-4 bit) Stop bit: (1-2 bit) Interface Signals Pin No Signal Name Specification Name F3 UART_SOUT TXD F4 UART_SIN RXD F5 UART_RTS RTS G5 UART_CTS CTS Product Specification Rev. 1.0 Type Description Transmit data output Host Controller Interface (HCI) Receive data input Request to send (active low) Clear to send (active low) Page 56 PAN9026 Wi-Fi/BT Module 4 Specification Interface Transport Settings Item Range Default Comment Baudrate 1 200 ~ 4 000 000 3 000 000 Baud Data Bits 5~8 8 LSB first Parity Bits 0~4 0 Stop Bit 1/1.5/2 1 Supported Baud Rates Baud 1 200 2 400 4 800 230 400 460 800 500 000 9 600 19 200 38 400 57 600 76 800 115 200 921 600 1 000 000 1 382 400 1 500 000 1 843 200 2 000 000 2 100 000 2 764 800 3 000 000 3 250 000 3 692 300 4 000 000 UART Timing Diagram Product Specification Rev. 1.0 Page 57 PAN9026 Wi-Fi/BT Module 4 Specification 4.3.6 Peripheral Interface The Peripheral Interface pins are powered from the VIO voltage supply with 1.8 V. DC specification 4.3.1 Digital Pin Characteristics 4.3.6.1 GPIO Interface The General-Purpose I/O (GPIO) interface is used to implement user-defined input and output signals to and from the device, such as external interrupts and other user-defined I/Os. Configurable GPIOs Function GPIO Pin Name IO0 IO1 IO2 IO3 IO12 IO13 IO14 IO15 YES YES YES YES YES YES YES YES GPIO OUT YES YES YES YES YES YES YES YES IRQ IN YES YES YES YES YES YES YES GPIO IN YES LED Mode Symbol Parameter Condition IOH Switching current high Tristate on pin Tristate when driving high (requires pull-up) mA IOL Switching current low @ 0.4 V mA Product Specification Rev. 1.0 Typ. 10 Units Page 58 PAN9026 Wi-Fi/BT Module 4 Specification 4.3.7 4.3.7.1 Audio Interface PCM Interface Interface Signals Pin No Signal Name Specification Name Type Description A1 PCM_DOUT DOUT Output PCM data B1 PCM_CLK CLK Input/Output PCM clock signal, output if PCM master, input if PCM slave B1 PCM_MCLK MCLK Output PCM clock signal (optional), optional clock used for some codecs, derived from PCM_CLK B2 PCM_DIN DIN Input PCM data B3 PCM_SYNC SYNC Input/Output PCM Sync pulse signal, output if PCM master, input if PCM slave Modes of Operation The PCM Interface supports two modes of operation: * * PCM master PCM slave When in PCM master mode, the interface generates a 2 MHz or a 2.048 MHz PCM_CLK and a 8 kHz PCM_SYNC signal. An alternative PCM master mode is available that uses an externally generated PCM_CLK, but still generates the 8 kHz PCM_SYNC. The external PCM_CLK must have a frequency that is an integer multiple of 8 kHz. Supported frequencies are in the 512 kHz to 4 MHz range. When in PCM slave mode, the interface has both PCM_CLK and PCM_SYNC as inputs, thereby letting another unit on the PCM bus generate the signals. The PCM interface consists of up to four PCM slots (time-devided) preceded by a PCM sync signal. Each PCM slot can be either 8 or 16 bits wide. The slots can be separated in time, but they are not required to follow immediately after another. The timing is relative to PCM_SYNC. Product Specification Rev. 1.0 Page 59 PAN9026 Wi-Fi/BT Module 4 Specification PCM Timing Data - Master Mode Symbol Min. Typ. FBCLK Max. Units 2/2.048 Duty CycleBCLK 0.4 TBCLK rise/fall 0.5 MHz 0.6 3 TDO ns 15 ns TDISU 20 ns TDIHO 15 ns TBF 15 ns PCM Timing Diagram - Master Mode TBCLK CLK TTDO DOUT TDISU TDIHO DIN TBF SYNC Product Specification Rev. 1.0 Page 60 PAN9026 Wi-Fi/BT Module 4 Specification PCM Timing Data - Slave Mode Symbol Min. Typ. FBCLK Max. Units 2/2.048 Duty CycleBCLK 0.4 TBCLK rise/fall 0.5 MHz 0.6 3 TDO ns 30 ns TDISU 15 ns TDIHO 10 ns TBFSU 15 ns TBFHO 10 ns PCM Timing Diagram - Slave Mode TBCLK CLK TTDO DOUT TDISU TDIHO TBFSU TBFHO DIN SYNC Product Specification Rev. 1.0 Page 61 PAN9026 Wi-Fi/BT Module 4 Specification 4.3.8 Coexistence Interface The Coexistence Interface pins are powered from the VIO voltage supply with 1.8 V. DC specification 4.3.1 Digital Pin Characteristics Product Specification Rev. 1.0 Page 62 PAN9026 Wi-Fi/BT Module 4 Specification 4.4 4.4.1 RF Electrical Characteristics WLAN Radio Specification Receive Mode Parameter Condition Min. Typ. Max. Units RF frequency range 2.4 GHz - IEEE 802.11b/g/n 2 400 2 483.5 MHz 5 GHz - IEEE 802.11a/n 4 900 5 925 MHz Transmit Mode Parameter Condition RF frequency range 2.4 GHz - IEEE 802.11b/g/n 2 400 2 483.5 MHz 5 GHz - IEEE 802.11a/n 4 900 5 925 MHz Product Specification Rev. 1.0 Min. Typ. Max. Units Page 63 PAN9026 Wi-Fi/BT Module 4 Specification 4.4.2 4.4.2.1 WLAN RF Characteristics RF Characteristics for IEEE 802.11b Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V and Tamb = 25 C, if nothing else stated. 50 terminal load connected to the RF connector. Parameter Condition RF frequency range Carrier frequency tolerance Min. Typ. 2 483.5 MHz -25 +25 ppm +16 dBm fC 11 MHz -30 fC 22 MHz -50 Power-on/Power-down ramp RF Carrier suppression Error Vector Magnitude (EVM) Peak Minimum Receive Sensitivity 1 Mbps (DSSS) FER 8 % -98 2 Mbps (DSSS) FER 8 % -93 5.5 Mbps (CCK) FER 8 % -91 11 Mbps (CCK) FER 8 % -89 FER 8 % Adjacent Channel Rejection FER 8 % 35 dBr 2 s -15 dB 35 Maximum Input Level Product Specification Rev. 1.0 Units 2 400 Transmit output power Spectrum mask Max. % dBm -80 dBm dBm -76 dBm -10 dBm dB Page 64 PAN9026 Wi-Fi/BT Module 4 Specification 4.4.2.2 RF Characteristics for IEEE 802.11g Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V and Tamb = 25 C, if nothing else stated. 50 terminal load connected to the RF connector. Parameter Condition RF frequency range Spectrum mask Typ. 2 400 Carrier frequency tolerance Transmit output power Min. -25 +25 dBm 48 Mbps ~ 54 Mbps +15 dBm fC 11 MHz -20 dBr fC 20 MHz -28 dBr fC 30 MHz -40 dBr -15 dB +4 dB BPSK, CR 1/2 (6 Mbps) -4 -5 dB BPSK, CR 3/4 (9 Mbps) -8 dB QPSK, CR 1/2 (12 Mbps) -10 dB QPSK, CR 3/4 (18 Mbps) -13 dB 16-QAM, CR 1/2 (24 Mbps) -16 dB 16-QAM, CR 3/4 (36 Mbps) -19 dB 64-QAM, CR 2/3 (48 Mbps) -22 dB -25 dB BPSK, CR 1/2 (6 Mbps) PER 10 % -91 -82 dBm BPSK, CR 3/4 (9 Mbps) PER 10 % -90 -81 dBm QPSK, CR 1/2 (12 Mbps) PER 10 % -89 -79 dBm QPSK, CR 3/4 (18 Mbps) PER 10 % -87 -77 dBm 16-QAM, CR 1/2 (24 Mbps) PER 10 % -84 -74 dBm 16-QAM, CR 3/4 (36 Mbps) PER 10 % -81 -70 dBm 64-QAM, CR 2/3 (48 Mbps) PER 10 % -77 -66 dBm 64-QAM, CR 3/4 (54 Mbps) PER 10 % -76 -65 dBm -20 dBm PER 10 % Maximum Input Level Product Specification Rev. 1.0 ppm +16 64-QAM, CR 3/4 (54 Mbps) Adjacent channel rejection MHz 6 Mbps ~ 36 Mbps Transmitter Spectral Flatness Minimum Receive Sensitivity Units 2 483.5 Transmitter center frequency leakage Constellation Error (EVM) Max. BPSK, CR 1/2 (6 Mbps) PER 10 % 16 dB 64-QAM, CR 3/4 (54 Mbps) PER 10 % -1 dB Page 65 PAN9026 Wi-Fi/BT Module 4 Specification 4.4.2.3 RF Characteristics for IEEE 802.11n (BW 20 MHz, 2.4 GHz) Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V and Tamb = 25 C, if nothing else stated. 50 terminal load connected to the RF connector. Parameter Condition RF frequency range 2.4 GHz Min. Typ. 2 400 Carrier frequency tolerance Spectrum mask +25 Minimum Receive Sensitivity dBm MCS3 ~ MCS4 +15 dBm MCS5 ~ MCS7 +14 dBm fC 11 MHz -20 dBr fC 20 MHz -28 dBr fC 30 MHz -45 dBr -15 dB +4 dB BPSK, CR 1/2 (MCS0) -5 dB QPSK, CR 1/2 (MCS1) -10 dB QPSK, CR 3/4 (MCS2) -13 dB 16-QAM, CR 1/2 (MCS3) -16 dB 16-QAM, CR 3/4 (MCS4) -19 dB 64-QAM, CR 2/3 (MCS5) -22 dB 64-QAM, CR 3/4 (MCS6) -25 dB 64-QAM, CR 5/6 (MCS7) -27 dB -4 6.5 Mbps (MCS0) PER 10 % -90 -82 dBm 13 Mbps (MCS1) PER 10 % -88 -79 dBm 19.5 Mbps (MCS2) PER 10 % -86 -77 dBm 26 Mbps (MCS3) PER 10 % -83 -74 dBm 39 Mbps (MCS4) PER 10 % -80 -70 dBm 52 Mbps (MCS5) PER 10 % -76 -66 dBm 58.5 Mbps (MCS6) PER 10 % -74 -65 dBm 65 Mbps (MCS7) PER 10 % -73 -64 dBm -20 dBm PER 10 % Maximum Input Level 20 Adjacent channel rejection 65 Mbps (MCS7) PER 10 % -2 19 The Minimum Sensitivity levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI, and BCC. 20 The Adjacent Channel Rejection levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI, and BCC. Product Specification Rev. 1.0 ppm +15 Transmitter Spectral Flatness 19 MHz MCS0 ~ MCS2 Transmitter center frequency leakage Constellation Error (EVM) Units 2 483.5 -25 Transmit output power Max. dB Page 66 PAN9026 Wi-Fi/BT Module 4 Specification 4.4.2.4 RF Characteristics for IEEE 802.11n (BW 40 MHz, 2.4 GHz) Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V and Tamb = 25 C, if nothing else stated. 50 terminal load connected to the RF connector. Parameter Condition RF frequency range 2.4 GHz Min. Typ. 2 400 Carrier frequency tolerance Spectrum mask +25 Minimum Receive Sensitivity dBm MCS3 ~ MCS4 +14 dBm MCS5 ~ MCS7 +13 dBm fC 21 MHz -20 dBr fC 40 MHz -28 dBr fC 60 MHz -45 dBr -20 dB +4 dB BPSK, CR 1/2 (MCS0) -5 dB QPSK, CR 1/2 (MCS1) -10 dB QPSK, CR 3/4 (MCS2) -13 dB 16-QAM, CR 1/2 (MCS3) -16 dB 16-QAM, CR 3/4 (MCS4) -19 dB 64-QAM, CR 2/3 (MCS5) -22 dB 64-QAM, CR 3/4 (MCS6) -25 dB 64-QAM, CR 5/6 (MCS7) -27 dB -4 13.5 Mbps (MCS0) PER 10 % -86 -79 dBm 27 Mbps (MCS1) PER 10 % -85 -76 dBm 40.5 Mbps (MCS2) PER 10 % -83 -74 dBm 54 Mbps (MCS3) PER 10 % -80 -71 dBm 81 Mbps (MCS4) PER 10 % -77 -67 dBm 108 Mbps (MCS5) PER 10 % -73 -63 dBm 121.5 Mbps (MCS6) PER 10 % -71 -62 dBm 135 Mbps (MCS7) PER 10 % -69 -61 dBm -20 dBm PER 10 % Maximum Input Level 20 Adjacent channel rejection Product Specification Rev. 1.0 ppm +14 Transmitter Spectral Flatness 19 MHz MCS0 ~ MCS2 Transmitter center frequency leakage Constellation Error (EVM) Units 2 483.5 -25 Transmit output power Max. 135 Mbps (MCS7) PER 10 % -2 dB Page 67 PAN9026 Wi-Fi/BT Module 4 Specification 4.4.2.5 RF Characteristics for IEEE 802.11n (BW 20 MHz, 5 GHz) Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V, and Tamb = 25 C, if nothing else stated. 50 terminal load connected to the RF connector. Parameter Condition RF frequency range Spectrum mask Typ. 5 250 MHz 5 GHz U-NII-2A 5 250 5 350 MHz 5 GHz U-NII-2C 5 470 5 725 MHz 5 GHz U-NII-3 5 725 5 825 MHz -20 +20 ppm MCS0 ~ MCS2 +15 dBm MCS3 ~ MCS4 +15 dBm MCS5 ~ MCS7 +14 dBm fC 11 MHz -20 dBr fC 20 MHz -28 dBr fC 30 MHz -40 dBr -15 dB +4 dB BPSK, CR 1/2 (MCS0) -5 dB QPSK, CR 1/2 (MCS1) -10 dB QPSK, CR 3/4 (MCS2) -13 dB 16-QAM, CR 1/2 (MCS3) -16 dB 16-QAM, CR 3/4 (MCS4) -19 dB 64-QAM, CR 2/3 (MCS5) -22 dB 64-QAM, CR 3/4 (MCS6) -25 dB 64-QAM, CR 5/6 (MCS7) -27 dB Transmitter Spectral Flatness Minimum Receive Sensitivity 19 -4 6.5 Mbps (MCS0) PER 10 % -89 -82 dBm 13 Mbps (MCS1) PER 10 % -88 -79 dBm 19.5 Mbps (MCS2) PER 10 % -85 -77 dBm 26 Mbps (MCS3) PER 10 % -82 -74 dBm 39 Mbps (MCS4) PER 10 % -79 -70 dBm 52 Mbps (MCS5) PER 10 % -74 -66 dBm 58.5 Mbps (MCS6) PER 10 % -73 -65 dBm 65 Mbps (MCS7) PER 10 % -71 -64 dBm -30 dBm PER 10 % Maximum Input Level Adjacent channel rejection 20 Product Specification Rev. 1.0 Units 5 150 Transmitter center frequency leakage Constellation Error (EVM) Max. 5 GHz U-NII-1 Carrier frequency tolerance Transmit output power Min. 65 Mbps (MCS7) PER 10 % -2 dB Page 68 PAN9026 Wi-Fi/BT Module 4 Specification 4.4.2.6 RF Characteristics for IEEE 802.11n (BW 40 MHz, 5 GHz) Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V, and Tamb = 25 C, if nothing else stated. 50 terminal load connected to the RF connector. Parameter Condition RF frequency range Spectrum mask Typ. 5 250 MHz 5 GHz U-NII-2A 5 250 5 350 MHz 5 GHz U-NII-2C 5 470 5 725 MHz 5 GHz U-NII-3 5 725 5 825 MHz -20 +20 ppm MCS0 ~ MCS2 +14 dBm MCS3 ~ MCS4 +14 dBm MCS5 ~ MCS7 +13 dBm fC 21 MHz -20 dBr fC 40 MHz -28 dBr fC 60 MHz -40 dBr -20 dB +4 dB BPSK, CR 1/2 (MCS0) -5 dB QPSK, CR 1/2 (MCS1) -10 dB QPSK, CR 3/4 (MCS2) -13 dB 16-QAM, CR 1/2 (MCS3) -16 dB 16-QAM, CR 3/4 (MCS4) -19 dB 64-QAM, CR 2/3 (MCS5) -22 dB 64-QAM, CR 3/4 (MCS6) -25 dB 64-QAM, CR 5/6 (MCS7) -27 dB Transmitter Spectral Flatness Minimum Receive Sensitivity 19 -4 13.5 Mbps (MCS0) PER 10 % -86 -79 dBm 27 Mbps (MCS1) PER 10 % -85 -76 dBm 40.5 Mbps (MCS2) PER 10 % -82 -74 dBm 54 Mbps (MCS3) PER 10 % -79 -71 dBm 81 Mbps (MCS4) PER 10 % -76 -67 dBm 108 Mbps (MCS5) PER 10 % -72 -63 dBm 121.5 Mbps (MCS6) PER 10 % -70 -62 dBm 135 Mbps (MCS7) PER 10 % -69 -61 dBm -30 dBm PER 10 % Maximum Input Level Adjacent channel rejection 20 Product Specification Rev. 1.0 Units 5 150 Transmitter center frequency leakage Constellation Error (EVM) Max. 5 GHz U-NII-1 Carrier frequency tolerance Transmit output power Min. 135 Mbps (MCS7) PER 10 % -2 dB Page 69 PAN9026 Wi-Fi/BT Module 4 Specification 4.4.2.7 RF Characteristics for IEEE 802.11a Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V, and Tamb = 25 C, if nothing else stated. 50 terminal load connected to the RF connector. Parameter RF frequency range Condition Spectrum mask Typ. 5 250 MHz 5 GHz U-NII-2A 5 250 5 350 MHz 5 GHz U-NII-2C 5 470 5 725 MHz 5 GHz U-NII-3 5 725 5 825 MHz -20 +20 ppm 6 Mbps ~ 36 Mbps +16 dBm 48 Mbps ~ 54 Mbps +15 dBm fC 11 MHz -20 dBr fC 20 MHz -28 dBr fC 30 MHz -40 dBr -15 dB +4 dB BPSK, CR 1/2 (6 Mbps) -5 dB BPSK, CR 3/4 (9 Mbps) -8 dB QPSK, CR 1/2 (12 Mbps) -10 dB QPSK, CR 3/4 (18 Mbps) -13 dB 16-QAM, CR 1/2 (24 Mbps) -16 dB 16-QAM, CR 3/4 (36 Mbps) -19 dB 64-QAM, CR 2/3 (48 Mbps) -22 dB 64-QAM, CR 3/4 (54 Mbps) -25 dB Transmitter Spectral Flatness Minimum Receive Sensitivity -4 BPSK, CR 1/2 (6 Mbps) PER 10 % -90 -82 dBm BPSK, CR 3/4 (9 Mbps) PER 10 % -90 -81 dBm QPSK, CR 1/2 (12 Mbps) PER 10 % -89 -79 dBm QPSK, CR 3/4 (18 Mbps) PER 10 % -86 -77 dBm 16-QAM, CR 1/2 (24 Mbps) PER 10 % -84 -74 dBm 16-QAM, CR 3/4 (36 Mbps) PER 10 % -80 -70 dBm 64-QAM, CR 2/3 (48 Mbps) PER 10 % -76 -66 dBm 64-QAM, CR 3/4 (54 Mbps) PER 10 % -75 -65 dBm -30 dBm PER 10 % Maximum Input Level Adjacent channel rejection Product Specification Rev. 1.0 Units 5 150 Transmitter center frequency leakage Constellation Error (EVM) Max. 5 GHz U-NII-1 Carrier frequency tolerance Transmit output power Min. BPSK, CR 1/2 (6 Mbps) PER 10 % 16 dB 64-QAM, CR 3/4 (54 Mbps) PER 10 % -1 dB Page 70 PAN9026 Wi-Fi/BT Module 4 Specification 4.4.3 Bluetooth RF Characteristics Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V, and Tamb = 25 C, if nothing else stated. 50 terminal load connected to the RF connector. 4.4.3.1 Receiver Section RF Characteristics Parameter Condition Min. RF frequency range Interference Performance (Basic Rate) C/I Ratio Typ. 2 400 GFSK RSL = -67 dBm BER 0.1 % C/I Ratio /4-DQPSK RSL = -67 dBm BER 0.01 % RSL = -67 dBm BER 0.01 % dB C/I (1 MHz) 0 dB C/I (2 MHz) -30 dB C/I (3 MHz) -40 dB C/I (Image) -9 dB -20 dB 13 dB C/I (1 MHz) 0 dB C/I (2 MHz) -30 dB C/I (3 MHz) -40 dB C/I (Image) -7 dB -20 dB 21 dB C/I (1 MHz) 5 dB C/I (2 MHz) -25 dB C/I (3 MHz) -33 dB C/I (Image) 0 dB -13 dB 21 dB C/I (1 MHz) 15 dB C/I (2 MHz) -17 dB C/I (3 MHz) -27 dB C/I (Image) -9 dB -15 dB C/I (Co-channel) C/I (Co-channel) C/I (Image 1 MHz) Interference Performance (Low Energy) C/I Ratio GFSK RSL = -67 dBm BER 0.1 % 1 Mbps C/I (Co-channel) C/I (Image 1 MHz) Minimum Receive Sensitivity Product Specification Rev. 1.0 MHz 11 C/I (Image 1 MHz) 8-DPSK Units 2 483.5 C/I (Co-channel) C/I (Image 1 MHz) Interference Performance (Enhanced Data Rate) Max. BR, DH1 BER 0.1 % -94 -70 dBm EDR, 2DH1 BER 0.01 % -90 -70 dBm LE, GFSK BER 0.1 % -90 -70 dBm Page 71 PAN9026 Wi-Fi/BT Module 4 Specification Parameter Condition Out-of-band blocking (Basic Rate) GFSK Interfering Signal Power Out-of-band blocking (Low Energy) Min. RSL = -67 dBm BER 0.1 % GFSK Interfering Signal Power RSL = -67 dBm BER 0.1 % RSSI Range Resolution = 1 dB Typ. Max. 30 MHz - 2 000 MHz -10 dBm 2 GHz - 2.399 GHz -27 dBm 2.484 GHz - 3 GHz -27 dBm 3 GHz - 12.75 GHz -10 dBm 30 MHz - 2 000 MHz -30 dBm 2.003 GHz - 2.399 GHz -35 dBm 2.484 GHz - 2.997 GHz -35 dBm -30 dBm 0 dBm 3 GHz - 12.75 GHz 4.4.3.2 Units -90 Transmitter Section RF Characteristics Parameter Condition Min. RF frequency range Maximum Output power 2 400 Spurious emission (EDR) (in-band) Spurious emission (LE) (in-band) Product Specification Rev. 1.0 Units 2 483.5 MHz +8 +12 dBm Enhanced Data Rate (EDR) +4 +8 dBm 0 +4 dBm Gain control Gain resolution Spurious emission (BR) (in-band) Max. Basic Rate (BR) Low Energy (LE) Gain range Typ. 30 dB 0.5 dB 500 kHz -20 dBc 2 MHz, |M-N| = 2 -20 dBm 3 MHz or greater, |M-N| 3 -40 dBm 1 MHz -26 dBc 1.5 MHz -20 dBm 2.5 MHz -40 dBm 2 MHz, |M-N| = 2 -20 dBm 3 MHz or greater, |M-N| 3 -30 dBm 1 Mbps Page 72 PAN9026 Wi-Fi/BT Module 4 Specification 4.5 Reliability Tests The measurement should be done after the test device has been exposed to room temperature and humidity for one hour. No. Item Limit Condition 1 Vibration test Electrical parameter should be in specification Freq.: 10~50 Hz; Amplitude: 1.5 mm; 20 min./cycle, 1 h each of XYZ axis 2 Shock test See above Dropped 3 times onto hard wood from a height of 1 m 3 Heat cycle test See above -40 C for 30 min. and +85 C for 30 min.; each temperature 300 cycles 4 Moisture test See above +60 C, 90 % RH, 300 h 5 Low temp. test See above -40 C, 300 h 6 High temp. test See above +85 C, 300 h Product Specification Rev. 1.0 Page 73 PAN9026 Wi-Fi/BT Module 4 Specification 4.6 Recommended Soldering Profile * * * * Reflow permissible cycle: 2 * Soldering profile assumes lead-free soldering Opposite side reflow is prohibited due to module weight More than 75 percent of the soldering area shall be coated by solder The soldering profiles should be adhered to in order to prevent electrical or mechanical damage Product Specification Rev. 1.0 Page 74 PAN9026 Wi-Fi/BT Module 5 Cautions 5 Cautions Failure to follow the guidelines set forth in this document may result in degrading of the product's functions and damage to the product. 5.1 Design Notes 1. Follow the conditions written in this specification, especially the control signals of this module. 2. The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47 F directly at the module). 3. This product should not be mechanically stressed when installed. 4. Keep this product away from heat. Heat is the major cause of decreasing the life of these products. 5. Avoid assembly and use of the target equipment in conditions where the product's temperature may exceed the maximum tolerance. 6. The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes. 7. Keep this product away from other high frequency circuits. 8. Refer to the recommended pattern when designing a board. 5.2 Installation Notes 1. Reflow soldering is possible twice based on the conditions set forth in 4.6 Recommended Soldering Profile. Set up the temperature at the soldering portion of this product according to this reflow profile. 2. Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat. 3. Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components. 4. If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur. 5. This product should not be mechanically stressed or vibrated when reflowed. 6. To repair the board by hand soldering, follow the conditions set forth in this chapter. 7. Do not wash this product. 8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit. Product Specification Rev. 1.0 Page 75 PAN9026 Wi-Fi/BT Module 5 Cautions 5.3 Usage Condition Notes 1. Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation befor assembly on the final products. 2. Do not use dropped products. 3. Do not touch, damage or soil the pins. 4. Follow the recommended condition ratings about the power supply applied to this product. 5. Electrode peeling strength: Do not add pressure of more than 4.9 N when soldered on PCB. 6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. 7. These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information, and communication equipment. 5.4 Storage Notes 1. The module should not be stressed mechanically during storage. 2. Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected: - Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX, - Storage in direct sunlight, - Storage in an environment where the temperature may be outside the range of 5 C to 35 C, or where the humidity may be outside the 45 to 85 % range, - Storage of the products for more than one year after the date of delivery storage period: Please check the adhesive strength of the embossed tape and soldering after 6 months of storage. 3. Keep this product away from water, poisonous gas, and corrosive gas. 4. This product should not be stressed or shocked when transported. 5. Follow the specification when stacking packed crates (max. 10). 5.5 Safety Cautions These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, provide the following failsafe functions as a minimum: Product Specification Rev. 1.0 Page 76 PAN9026 Wi-Fi/BT Module 5 Cautions 1. Ensure the safety of the whole system by installing a protection circuit and a protection device. 2. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. 5.6 Other Cautions 1. Do not use the products for other purposes than those listed. 2. Be sure to provide an appropriate fail-safe function on your product to prevent an additional damage that may be caused by the abnormal function or the failure of the product. 3. This product has been manufactured without any ozone chemical controlled under the Montreal Protocol. 4. These products are not intended for uses other than under the special conditions shown below. Before using these products under such special conditions, carefully check their performance and reliability under the said special conditions to determine whether or not they can be used in such a manner: - In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. - In direct sunlight, outdoors, or in a dusty environment. - In an environment where condensation occurs. - In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOX). 5. If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products. They may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. 6. When you have any question or uncertainty, contact Panasonic. 5.7 Life Support Policy This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting. Product Specification Rev. 1.0 Page 77 PAN9026 Wi-Fi/BT Module 6 Regulatory and Certification Information 6 Regulatory and Certification Information 6.1 RoHS And REACH Declaration The latest declaration of environmental compatibility (RoHS and REACH) for supplied products can be found on the Panasonic website in the "Downloads" section of the respective product 7.3.2 Product Information. Product Specification Rev. 1.0 Page 78 PAN9026 Wi-Fi/BT Module 7 Appendix 7 Appendix 7.1 Ordering Information Variants and Versions 21 Order Number Brand Name Description MOQ ENWF9201A1EF PAN9026 Wif-Fi/Bluetooth radio module IEEE 802.11 a/b/g/n 22 BT/BLE 5.0 with a ceramic chip-antenna, US version 1 000 ENWF9202A1EF PAN9026 Wif-Fi/Bluetooth radio module IEEE 802.11 a/b/g/n 23 BT/BLE 5.0 with a ceramic chip-antenna, EU version 1 000 ENWF9201AZEF PAN9026-ETU PAN9026 SDIO Adapter with module ENWF9201A1EF 1 ENWF9201AYEF PAN9026-KIT PAN9026 Kit: 2x PAN9026 SDIO Adapter with module ENWF9201A1EF and 1x Case 1 For further information please refer to our product documentation 7.3.2 Product Information. 21 Abbreviation for Minimum Order Quantity (MOQ). The standard MOQ for mass production is 1 000 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels. 22 The US version is restricted to FCC regulatory domain with blocked country code and Tx power table. The device does not support the channels 12 -13 in the 2.4 GHz band and any non-US channels. 23 The EU version has preset the country code and Tx power table for European regulatory domain ETSI. The country code and Tx power table are not blocked and additionally the country codes and Tx power tables for Canada and US can be set. Product Specification Rev. 1.0 Page 79 PAN9026 Wi-Fi/BT Module 7 Appendix 7.2 Acronyms and Abbreviations ACK ...................................................................................................................... Acknowledgment ACL............................................................................................... Asynchronous Connection-Less AES ............................................................................................... Advanced Encryption Standard AFH ...................................................................................................Adaptive Frequency Hopping AGC ............................................................................................................ Automatic Gain Control A-MPDU .................................................................................. Aggregate-MAC Protocol Data Unit AoA .......................................................................................................................... Angle of Arrival AoD.................................................................................................................... Angle of Departure AP ............................................................................................................................... Access Point BCA .................................................. Beacon Collision Avoidance, Bluetooth Coexistence Arbiter BCC ...................................................................................................... Binary Convolutional Code BD......................................................................................................................... Bluetooth Device BER ........................................................................................................................... Bit Error Rate BPSK ..................................................................................................... Binary Phase Shift Keying BR................................................................................................................................... Basic Rate BSS ..................................................................................................................... Basic Service Set BT ..................................................................................................................................... Bluetooth BTSIG .......................................................................................... Bluetooth Special Interest Group BW .................................................................................................................................. Bandwidth CCK .................................................................................................. Complementary Code Keying CCMP ............................................................................................... CTR with CBC-MAC Protocol CDM ........................................................................................................... Charged Device Model CIS......................................................................................................... Card Information Structure CMAC ....................................................................... Cipher-Based Message Authentication Code CMD ................................................................................................................................ Command CMOS ....................................................................... Complementary Metal-Oxide-Semiconductor CPU ........................................................................................................... Central Processing Unit CQD............................................................................................................ Channel Quality Driven CR .................................................................................................................................. Code Rate CRC ......................................................................................................... Cyclic Redundancy Code CTR .......................................................................................................................... Counter Mode CTS .......................................................................................................................... Clear To Send DCF ............................................................................................Distributed Coordination Function DFS ................................................................................................. Dynamic Frequency Selection DPSK .............................................................................................. Differential Phase Shift Keying DQPSK ........................................................................ Differential Quadrature Phase Shift Keying DSSS ....................................................................................... Direct Sequence Spread Spectrum DTIM ........................................................................................ Delivery Traffic Indication Message EDCA .................................................................................Enhanced Distributed Channel Access EDR ................................................................................................................ Enhanced Data Rate EPC ......................................................................................................... Enhanced Power Control ES ................................................................................................................. Engineering Samples eSCO ..................................................................... Embedded Synchronous Connection-Oriented ESD ........................................................................................................... Electro Static Discharge EVM ............................................................................................................ Error Vector Magnitude FER ..................................................................................................................... Frame Error Rate FIFO ...................................................................................................................... First In-First Out GFSK .............................................................................. Gaussian Frequency Shift Key or Keying GI ............................................................................................................................. Guard Interval GPIO................................................................................................................ General Purpose IO HBM..................................................................................................................Human Body Model HT ......................................................................................................................... High Throughput IB ........................................................................................................................................ In-Band IO ................................................................................................................................ Input Output ISM ..............................................................................................Industrial, Scientific, and Medical Product Specification Rev. 1.0 Page 80 PAN9026 Wi-Fi/BT Module 7 Appendix JEDEC ....................................................................... Joint Electronic Device Engineering Council LE ................................................................................................................................ Low Energy LGI ................................................................................................................... Long Guard Interval LNA.................................................................................................................. Low Noise Amplifier LP ................................................................................................................................. Low Power LSB ...................................................................................................................Least Significant Bit LTE ................................................................................................................. Long Term Evolution MAC........................................................................................................... Medium Access Control MCS.............................................................................................. Modulation and Coding Scheme MOQ ......................................................................................................... Minimum Order Quantity MPDU ........................................................................................................ MAC Protocol Data Unit MSDU ......................................................................................................... MAC Service Data Unit MWS .......................................................................................................... Mobile Wireless System OEM ......................................................................................... Original Equipment Manufacturers OFDM ........................................................................ Othorgonal Frequency Division Multiplexing OOB............................................................................................................................. Out-Of-Band OTP ...........................................................................................One Time Programmable Memory PA .......................................................................................................................... Power Amplifier PAN ............................................................................................................ Personal Area Network PBU .................................................................................................................. Peripheral Bus Unit PCB ................................................................................................................ Printed Circuit Board PCM............................................................................................................ Pulse Code Modulation PDn.............................................................................................................................. Power Down PER .....................................................................................................................Packet Error Rate PHY .......................................................................................................................... Physical Layer PLR...................................................................................................................... Packet Loss Rate PPEC ............................................................................................ Pitch Period Error Concealment PTA........................................................................................................... Packet Traffic Arbitration QAM .......................................................................................... Quadrature Amplitude Modulation QoS ..................................................................................................................... Quality of Service QPSK ............................................................................................ Quadrature Phase Shift Keying RH ....................................................................................................................... Relative Humidity RIFS ..................................................................................................... Reduced Interframe Space RSL.............................................................................................................. Received Signal Level RSSI ...........................................................................................Recieve Signal Strength Indicator RX.................................................................................................................... Receive or Receiver RXD ............................................................................................. Request To Send, Receive Data SCO .......................................................................................... Synchronous Connection-Oriented SDIO ..................................................................................................... Secure Digital Input Output SGI .................................................................................................................. Short Guard Interval SISO ...................................................................................................... Single Input Single Output SMT ................................................................................................................. Surface Mount Type STA....................................................................................................................................... Station STBC ..................................................................................................... Space-Time-Block-Coding STD ................................................................................................................................... Standard TIM ................................................................................................................ Traffic Indication Map TKIP...............................................................................................Temporal Key Integrity Protocol TX ............................................................................................................... Transmit or Transmitter TXD ...........................................................................................................................Transmit Data UART ...................................................................... Universal Asynchronous Receiver Transmitter UDP .......................................................................................................... User Datagram Protocol WAPI ................................................................... WLAN Authentication and Privacy Infrastructure WBS ................................................................................................................... Wideband Speech WCI-2 ......................................................................................... Wireless Coexistence Interface 2 WEP ........................................................................................................ Wired Equivalent Privacy WLAN ................................................................................................ Wireless Local Area Network WPA ........................................................................................................... Wi-Fi Protected Access Product Specification Rev. 1.0 Page 81 PAN9026 Wi-Fi/BT Module 7 Appendix 7.3 7.3.1 Contact Details Contact Us Please contact your local Panasonic Sales office for details on additional product options and services: For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: wireless@eu.panasonic.com For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support Tool to find assistance near you at https://na.industrial.panasonic.com/distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https://forum.na.industrial.panasonic.com 7.3.2 Product Information Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents: For complete Panasonic product details in the EU, visit http://pideu.panasonic.de/products/wireless-modules.html For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules Product Specification Rev. 1.0 Page 82