PAN9026
Wi-Fi Dual Band 2.4/5 GHz and Bluetooth Module
Product Specification
Rev. 1.0
Wireless Modules
PAN9026 Wi-Fi/BT Module
Product Specification Rev. 1.0 Page 2
Chip
Antenna
SPDT
88W8977
Radio SoC
Crystal
32.768 kHz
SPI
UART
COEX
GPIOs
Status LED's
MCU Ready
PDN
Factory Reset
V SPDT
Wake Up's
JTAG
VIO 1.8 V
BPF
RF Pad
PAN9026
Wi-Fi & Bluetooth Radio Module
IEEE 802.11 a/b/g/n
Bluetooth 5.0 (BR, LE & EDR)
Crystal
26 MHz
DPX
SPDT
50 Ohm
VDD 2.2 V
VDD 1.8 V
PCM Interface
SDIO Interface
VIO SD
32 kHz DISABLE
RF SWVIO RF 3.3 VCNTL
Overview
The PAN9026 is a 2.4/5 GHz ISM band Wi-Fi and
Bluetooth radio module, which includes a wireless
radio for easy integration of Wi-Fi and
Bluetooth connectivity into various electronic
devices.
Features
• Dual band 2.4/5 GHz 802.11 a/b/g/n Wi-Fi/BT
combo module
• Supports 802.11i security standards through
AES, CCMP, and more security mechanisms
• 802.11e Quality of Service is supported for
multimedia applications
• IEEE 802.11n-compliant, 1x1 spatial stream with
data rates up to MCS7 150 Mbps
• Bluetooth 5.0 (includes LE)
• Dual simultaneous and independent WLAN and
Bluetooth operation
• Dynamic Rapid Channel Switching (DRCS) for
simultaneous operation in 2.4 GHz and 5 GHz
bands
• Indoor location and navigation with
IEEE 802.11mc
• Power management with sleep clock
• Coexistence interface for arbitration of co-
located WLAN, Bluetooth, or Mobile Wireless
System (e.g. LTE)
• Generic interfaces include SDIO 3.0 and high-
speed UART for host processor connection
• Software Linux driver
Characteristics
• Surface Mount Type (SMT)
17.5 mm x 10.0 mm x 2.6 mm
• Marvell® 88W8977 WLAN 2.4/5 GHz and
Bluetooth single-chip solution inside
• TX Power +16 dBm @ 802.11b
• RX Sensitivity -98 dBm @ 802.11b DSSS
1 Mbps
• IEEE 802.11n 20 MHz and 40 MHz
channel bandwidth
• Long and Short Guard Interval support
• Power supply 3.3 V, 2.2 V, 1.8 V
• Current consumption Wi-Fi typical 400 mA @ TX
and 70 mA @ RX
• SDIO 1-bit or 4-bit
• Wide temperature range of -30 to +85 °C
Block Diagram
PAN9026 Wi-Fi/BT Module
Product Specification Rev. 1.0 Page 3
By purchase of any of the products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations. Panasonic
reserves the right to make changes as required at any time without notification. Please consult the most
recently issued Product Specification before initiating or completing a design.
© Panasonic Industrial Devices Europe GmbH 2017.
This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is
without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do
not disclose it to a third party.
All rights reserved.
This Product Description does not lodge the claim to be complete and free of mistakes.
Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status “Engineering
Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Product Specification and may bear
defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the installation
or integration in another product to be sold by the customer,
Deviation or lapse in function of the Engineering Sample,
Improper use of the Engineering Sample.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental
damages. In case of any queries regarding the Engineering Samples, please contact your local sales
partner or the related product manager.
PAN9026 Wi-Fi/BT Module
Product Specification Rev. 1.0 Page 4
Table of Contents
1 About This Document ......................................................................................................................... 5
1.1 Purpose and Audience .............................................................................................................. 5
1.2 Revision History ......................................................................................................................... 5
1.3 Use of Symbols ......................................................................................................................... 5
1.4 Related Documents ................................................................................................................... 5
2 Overview .............................................................................................................................................. 6
2.1 Block Diagram ........................................................................................................................... 7
2.2 Pin Configuration ....................................................................................................................... 8
2.3 Power Management................................................................................................................. 12
2.4 Host Interfaces ........................................................................................................................ 13
2.5 Peripheral Bus Interface .......................................................................................................... 14
2.6 PCM Interface .......................................................................................................................... 15
2.7 Coexistence ............................................................................................................................. 16
2.8 WLAN ...................................................................................................................................... 29
2.9 Bluetooth ................................................................................................................................. 34
3 Detailed Description ......................................................................................................................... 36
3.1 Dimensions .............................................................................................................................. 36
3.2 Footprint .................................................................................................................................. 37
3.3 Packaging ................................................................................................................................ 38
3.4 Case Marking .......................................................................................................................... 41
4 Specification ..................................................................................................................................... 42
4.1 Default Test Conditions ........................................................................................................... 42
4.2 Absolute Maximum Ratings ..................................................................................................... 43
4.3 Recommended Operating Conditions ...................................................................................... 44
4.4 RF Electrical Characteristics .................................................................................................... 63
4.5 Reliability Tests ....................................................................................................................... 73
4.6 Recommended Soldering Profile ............................................................................................. 74
5 Cautions ............................................................................................................................................ 75
5.1 Design Notes ........................................................................................................................... 75
5.2 Installation Notes ..................................................................................................................... 75
5.3 Usage Condition Notes ............................................................................................................ 76
5.4 Storage Notes .......................................................................................................................... 76
5.5 Safety Cautions ....................................................................................................................... 76
5.6 Other Cautions ........................................................................................................................ 77
5.7 Life Support Policy ................................................................................................................... 77
6 Regulatory and Certification Information ....................................................................................... 78
6.1 RoHS And REACH Declaration ............................................................................................... 78
7 Appendix ........................................................................................................................................... 79
7.1 Ordering Information ................................................................................................................ 79
7.2 Acronyms and Abbreviations ................................................................................................... 80
7.3 Contact Details ........................................................................................................................ 82
PAN9026 Wi-Fi/BT Module
1 About This Document
Product Specification Rev. 1.0 Page 5
1 About This Document
1.1 Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical
characteristics of the Panasonic PAN9026 modules. It is intended for hardware design,
application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to
as “the PAN9026” or “the module” within this document.
1.2 Revision History
Revision
Date
Modifications/Remarks
0.1
13.04.2017
First preliminary version
1.0
20.12.2017
Change to Bluetooth 5.0: Features, 2.1 Block Diagram, 2.9 Bluetooth,
7.1 Ordering Information
Change PM: 2.3.1 Power Configuration Example with 3.3 V Host Operation
Include values: 4.3.2 Current Consumption, 4.4.3.2 Transmitter Section RF
Characteristics
Remove section: 4.3.7.2 TDM Interface
Additional models: 7.1 Ordering Information
Add section: 7.2 Acronyms and Abbreviations
1.3 Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product.
Non-observance can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates cross references within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4 Related Documents
Please refer to the Panasonic website for related documents 7.3.2 Product Information.
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 6
2 Overview
The PAN9026 is a dual band 2.4/5 GHz 802.11 a/b/g/n Wi-Fi radio module with integrated
Bluetooth BR/EDR/LE, specifically designed for highly integrated and cost-effective
applications. The simultaneous and independent operation of the two standards enables high
data rates (802.11n) and low-power operation (Bluetooth Low Energy). Integrated power
management, a fast dual-core CPU, 802.11i security standard support, and high-speed data
interfaces deliver the performance for the speed, reliability, and quality requirements of next
generation products. TX power calibration data and Wi-Fi/Bluetooth system parameters are pre-
stored on the one-time-programmable memory of the PAN9026 during production at Panasonic.
This simplifies passing the certification process for PAN9026 customers. Furthermore, the
module reduces design, test, and calibration effort resulting in reduced time-to-market
compared to discrete solutions.
Integrating Wi-Fi and Bluetooth wireless connectivity allows applications such as Smart Energy
and home gateways to manage multiple devices and appliances. The combination of Wi-Fi and
Bluetooth provides the highest flexibility for connectivity.
Please refer to the Panasonic website for related documents 7.3.2 Product Information.
Further information on the variants and versions 7.1 Ordering Information.
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 7
2.1 Block Diagram
Chip
Antenna
SPDT
88W8977
Radio SoC
Crystal
32.768 kHz
SPI
UART
COEX
GPIOs
Status LED's
MCU Ready
PDN
Factory Reset
V SPDT
Wake Up's
JTAG
VIO 1.8 V
BPF
RF Pad
PAN9026
Wi-Fi & Bluetooth Radio Module
IEEE 802.11 a/b/g/n
Bluetooth 5.0 (BR, LE & EDR)
Crystal
26 MHz
DPX
SPDT
50 Ohm
VDD 2.2 V
VDD 1.8 V
PCM Interface
SDIO Interface
VIO SD
32 kHz DISABLE
RF SWVIO RF 3.3 VCNTL
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 8
2.2 Pin Configuration
Pin Assignment
Pin Functions
No
Pin Name
Pin Type
Description
A1 1
PCM_DOUT
Output signal
PCM data output signal
IO5
Digital I/O
General Purpose IO – GPIO[5]
A2
32KHZ_IN
NC
Do not connect
A3
PDN
Input signal
Power down, active-low
A4
VDD1V8
Power
1.7 V-1.9 V (typ. 1.8 V) power supply connection
A5
VDD1V8
Power
1.7 V-1.9 V (typ. 1.8 V) power supply connection
A6
VDD2V2
Power
2.1 V- 2.3 V (typ. 2.2 V) power supply connection
A7
RF_SW1
Input signal
RF Switch Pin 1 – logical voltage level to activate on-board antenna
or RF Pad RF-Switch Pins Function
A8
GND
Ground pin
Connect to ground
A9
RF_OUT
RF port
50 bottom pad to be activated by RF_SW1/RF_SW2 control
voltage RF-Switch Pins Function
B1 1
PCM_CLK
Input/output
PCM clock signal, output if PCM master, input if PCM slave
IO6
Digital I/O
General Purpose IO – GPIO[6]
1
Multi-purpose pins: After the firmware download, the pins (GPIO, Serial Interface, RF control) are programmed in functional
mode with dedicated functionality.
A1
B1
C1
D1
E1
F1
A2
B2
C2
D2
E2
F2
G2
A3
B3
C3
D3
E3
F3
G3
A4
B4
C4
D4
E4
F4
G4
A5
B5
F5
G5
A6
B6
F6
G6
A7
B7
F7
G7
A8
B8
F8
G8
A9
B9
C9
D9
E9
F9
G9
EP1 EP2
Chip
Antenna
10,00 mm
Ground plane
keep out area
Top View
G1
17,50 mm
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 9
No
Pin Name
Pin Type
Description
B2 1
PCM_DIN
Input signal
PCM data input signal
IO4
Digital I/O
General Purpose IO – GPIO[4]
B3 1
PCM_SYNC 2
Input/output
PCM Sync Pulse signal, output if PCM master, input if PCM slave
IO7 3
Digital I/O
General Purpose IO – GPIO[7]
B4
32KHZ_EN
Input Signal
If using VIO 3.3V disable the internal 32.768 kHz crystal oscillator
(100 to GND) to use the SoC reference clock with lower accuracy
B5
VDD2V2
Power
2.1 V-2.3 V (typ. 2.2 V) power supply connection
B6
VDD2V2
Power
2.1 V-2.3 V (typ. 2.2 V) power supply connection
B7
RF_SW2
Input signal
RF Switch Pin 2 – logical voltage level to activate on-board antenna
or RF Pad RF-Switch Pins Function
B8
GND
Ground pin
Connect to ground
B9
GND
Ground pin
Connect to ground
C1
IO2
Digital I/O
General Purpose IO – GPIO[2]
DVSC[0]
Output signal
Digital voltage scaling control for PMIC (VOUT 2.2V)
Power Configuration Example with 3.3 V Host Operation
C2
IO3
Digital I/O
General Purpose IO – GPIO[3]
DVSC[1]
Output signal
Digital voltage scaling control for PMIC (VOUT 1.05V) - not used
C3
IO1
Digital I/O
General Purpose IO – GPIO[1]
C4
COEX_SIN
Input signal
Serial data input from MWS modem or peripheral device
C9
GND
Ground pin
Connect to ground
D1
IO15
Digital I/O
General Purpose IO – GPIO[15]
D2
IO14
Digital I/O
General Purpose IO – GPIO[14]
D3
DNC_E3
NC
Do not connect
D4
COEX_SOUT
Output signal
Serial data output to MWS modem or peripheral device
D9
GND
Ground pin
Connect to ground
E1
SD_CLK
Digital I/O
For SDIO specific terminals SDIO Pins Function
E2
SD_CMD
Digital I/O
For SDIO specific terminals SDIO Pins Function
E3
IO0
Digital I/O
General Purpose IO – GPIO[0]
E4
DNC_E4
NC
Do not connect
E9
GND
Ground pin
Connect to ground
F1
SD_DAT0
Digital I/O
For SDIO specific terminals SDIO Pins Function
2
PCM Mode: After enabling the mode by host command, the pin is used as PCM Audio Interface.
3
GPIO Mode: After enabling the mode by host command, the pin is used as Multi-Purpose Interface.
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 10
No
Pin Name
Pin Type
Description
F2
SD_DAT1
Digital I/O
For SDIO specific terminals SDIO Pins Function
F3 1
UART_SOUT 4
Output Signal
Serial data output to peripheral device
IO8 3
Digital I/O
General Purpose IO – GPIO[8]
BT_FREQ 5
Input Signal
Information BT using channel which overlaps WLAN channel or not
F4 1
UART_SIN 4
Input signal
Serial data input to peripheral device
IO9 3
Digital I/O
General Purpose IO – GPIO[9]
BT_STATE 5
Input signal
Information BT_REQ priority (1- or 2-bit) and direction BT RX/TX
F5 1
UART_RTS 4
Output signal
Request-to-Send output to peripheral device
IO11 3
Digital I/O
General Purpose IO – GPIO[11]
BT_REQ 5
Input signal
BT device request access to medium
F6
IO12
Digital I/O
General Purpose IO – GPIO[12]
F7
CNTL1
Output signal
Do not connect
F8
CNTL0
Input signal
Keep open (DNC) if using SDIO interface for BT or connect with
100 k to GND if using UART interface for BT Control Pin
Function
F9
GND
Ground pin
Connect to ground
G1
SD_DAT2
Digital I/O
For SDIO specific terminals SDIO Pins Function
G2
SD_DAT3
Digital I/O
For SDIO specific terminals SDIO Pins Function
G3
VIOSD
Power
1.8 V or 3.3 V Digital I/O SDIO power supply
G4
VIO
Power
1.8 V or 3.3 V power supply for General Purpose IO, if using VIO
3.3V disable the internal 32.768 kHz crystal oscillator (Pin No B4)
G5 1
UART_CTS 4
Input signal
Clear-to-send input from peripheral device
IO10 3
Digital I/O
General Purpose IO – GPIO[10]
BT_GRANT 5
Output signal
Indicate permission to transmit, low BT can transmit
G6
IO13
Digital I/O
General Purpose IO – GPIO[13]
G7
VIORF
Power
3.0 V – 3.6 V (typ. 3.3 V) power supply connection
G8
DNC
NC
Do not connect
G9
GND
Ground pin
Connect to ground
EP1
EPAD1
Thermal pin
Connect to ground
EP2
EPAD2
Thermal pin
Connect to gorund
4
UART mode: After the dedicated firmware download, the pin is used as Host Controller Interface (HCI) for Bluetooth.
5
Bluetooth External Coexistence Mode: After enabling the mode by host command, the pin is used as Bluetooth external
Coexistence Interface.
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 11
SDIO Pins Function
No
Pin Name
Pin Type
Description
4-Bit Mode
1-Bit Mode
E1
SD_CLK
Digital I/O
Clock
Clock
E2
SD_CMD
Digital I/O
Command Line
Command Line
F1
SD_DAT0
Digital I/O
Data Line bit [0]
Data Line
F2
SD_DAT1
Digital I/O
Data Line bit [1] or Interrupt
(optional)
Interrupt
G1
SD_DAT2
Digital I/O
Data Line bit [2] or Read Wait
(optional)
Read Wait (optional)
G2
SD_DAT3
Digital I/O
Data Line bit [3]
Not used
RF-Switch Pins Function
No
Pin Name
Pin Type
Logical Level for Activation
On-Board Chip Antenna
RF OUT Pin
A7
RF_SW1
Input signal
3.0 V-3.6 V (typ. 3.3 V)
GND (0 V)
B7
RF_SW2
Input signal
GND (0 V)
3.0 V-3.6 V (typ. 3.3 V)
Control Pin Function
The control pin is used as configuration input to set parameters following a reset. The definition
of the pin changes immediately after a reset to its usual function. To set a configuration bit to 0,
attach a 100 k resistor from the pin to ground. No external circuitry is required to set a
configuration bit to 1.
No
Pin
Name
Pin Type
Strap
Value
WLAN
BT/BLE
Firmware Download
Number SDIO
Functions
Type
Mode
F8
CNTL0
Input Signal
0
SDIO
UART
SDIO+UART
Parallel/Serial
1 (WLAN)
1
SDIO
SDIO
SDIO+SDIO
Parallel/Serial
2 (WLAN, BT)
The configuration of the control pin is used for the firmware boot option. The
software reads and boots accordingly.
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 12
2.3 Power Management
2.3.1 Power Configuration Example with 3.3 V Host Operation
2.3.2 Power Configuration Example with 1.8 V Host Operation
Further information 4.3.4 Power-up Sequence.
PAN9026
VIO SD
VIO RF
VDD 2.2 V
VDD 1.8 V
DVSC[0]
88PG823
PMIC
Enable
VDD 3.3 V 3.3 V
3.3 V
2.2 V
1.8 V
3.3 V
VDD 3.3 V
or Host GPIO
VIN
1.8 V VIO
PAN9026
VIO/VIO SD
VIO RF
VDD 2.2 V
VDD 1.8 V
3.3 V
2.2 V
1.8 V
DC
DC
DC
DC
LDO
Step-up
Step-down
VDD 1.8 V 1.8 V
1.8 V
3.3 V
3.3 V
2.2 V
2.2 V
Dual
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 13
2.4 Host Interfaces
The bus interface connects several host interface bus units to the CPU bus of the device
through the internal bus. The connection of each unit is multiplexed with other bus units.
The high-speed UART interface is connected to the CPU bus through a separate bus.
Type
Features
High-speed UART interface
The device supports a high-speed Universal Asynchronous
Receiver/Transmitter (UART) interface, compliant with the industry
standard 16550 specification.
• FIFO mode permanently selected for transmit and receive operations
• Two pins for transmit and receive operations
• Two flow control pins
• Interrupt triggers for low-power, high throughput operation
SDIO interface
The device supports an SDIO device interface that conforms to the
industry standard SDIO full-speed card specification and allows a host
controller using the SDIO bus protocol to access the device.
• Supports SDIO 3.0 Standard
• 1-bit SDIO or 4-bit SDIO transfer modes with full clock range up to
100 MHz
• On-chip memory used for CIS
• Special interrupt register for information exchange
• Allows card to interrupt host
Further information 4.3.5 Host Interface
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 14
2.5 Peripheral Bus Interface
The Peripheral Bus Unit (PBU) connects several low speed peripherals to the internal bus of the
device. The device consists of the GPIO Interface and the One Time Programmable Memory.
Type
Features
General Purpose I/O
(GPIO) Interface
• User-defined GPIOs (each configured to either input or output)
• Each GPIO controlled independently
• Each I/O configurable to output bit from GPIO_OUT
One Time Programmable
Memory (OTP)
• Storing device-specific calibration data and hardware information like
MAC/BD address, WLAN, and Bluetooth parameter
• Programmed during production process of device
• Device performs calibration when it is powered up
Further information 4.3.6 Peripheral Interface
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 15
2.6 PCM Interface
The device supports the PCM interface.
Type
Features
PCM Interface
• Master or slave mode
• PCM bit width size of 8 bits or 16 bits
• Up to four slots with configurable bit width and start positions
• Short frame and long frame synchronization
Further information 4.3.7 Audio Interface
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 16
2.7 Coexistence
The implemented coexistence framework is based on the IEEE 802.15.2 recommended practice
Packet Traffic Arbitration (PTA) scheme and the Bluetooth Special Interest Group (BTSIG) Core
Specification Volume 7 (Wireless Coexistence Volume).
2.7.1 WLAN/Bluetooth Channel Information Exchange
Since Bluetooth and IEEE 802.11 b/g/n WLAN use the same 2.4 GHz frequency band, each can
cause interference with another. The level of interference depends on the respective frequency
channel used by Bluetooth and WLAN (other factors can impact interference, like Tx power and
Rx sensitivity of the device).
In a system with both Bluetooth and WLAN, the common host receives information about WLAN
channel usage and passes the information to the Bluetooth device. For Bluetooth 1.2 devices
with Adaptive Frequency Hopping (AFH) enabled, the Bluetooth device can block channel
usage that overlaps the WLAN channel in use.
When the Bluetooth device avoids all channels used by the WLAN, the impact of interference is
reduced, but not completely eliminated. For Bluetooth 1.1 devices, the Bluetooth device cannot
block WLAN channel usage. In this case, a Bluetooth Coexistence Arbiter (BCA) scheme at
MAC level is required. The BCA scheme can also be used with Bluetooth 1.2 devices to further
reduce the impact of interference to a minimum.
2.7.2 External Mobile Wireless System (LTE/ZigBee) and BCA Exchange
Based on the BTSIG Wireless Coexistence Volume, the device supports a Wireless
Coexistence Interface 2 (WCI-2) protocol for WLAN/Bluetooth coexistence with an external
Mobile Wireless System (MWS), such as a Long Term Evolution (LTE) or ZigBee device.
WCI-2 is a 2-wire transport interface. An internal coexistence is used to exchange request/grant
with the BCA.
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 17
2.7.3 System Configuration
External MWS Device
External BCA Device
WLAN
MAC BCA
Bluetooth
RF Front End
Host
BCA WLAN
CTL
BCA BT
CTL
MWS to BCA
BCA to MWS
COEX SIN
COEX SOUT
External LTE
Device
88W8977 Radio SoC
BCA WLAN CTL
External BCA Device
BCA WLAN
MAC
88W8977 Radio SoC
BT REQ
BT STATE
BT FREQ
BT GRANTn
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 18
2.7.4 WCI-2 Interface
The coexistence interface includes a Mobile Wireless System (MWS) transport controller to
accommodate a 2-wire, UART-based serial transport interface. This interface is a standard full-
duplex UART (TXD and RXD) carrying logical signals framed as UART characters. In addition, it
allows support of multiple logical channels.
Interface Signals
Pin No
Signal Name
Specification
Name
Pin Type
Description
C4
COEX_SIN
RXD
Input
Serial data from external MWS device
D4
COEX_SOUT
TXD
Output
Serial data to external MWS device
Signal Waveform Format
The messaging is based on a standard UART format. The UART signals should be connected
like a null-modem. For example, the local TXD connected to the remote RXD and vice versa.
Interface Transport Settings
Item
Range
Comment
Baudrate
921 600 ~ 4 000 000
Baud
Data Bits
8
LSB first
Parity Bits
0
No parity
Stop Bit
1
One stop bit
Flow Control
No
No flow control
Supported Baud Rates
Baud
921 600
2 000 000
3 000 000
4 000 000
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 19
Real-Time Signaling Message
The real-time signaling message is used to transport real-time signals over the 2-wire transport
interface.
The real-time signaling message conveys the real-time signals (Bluetooth Core Specification,
Volume 7, Part A) in one message. The time reference point for the real-time signaling message
is the end of message bit 5 (transition to stop bit).
Defined real-time signaling messages include:
• Coexistence Controller to MWS device
• MWS device to Coexistence Controller
Real-Time Signaling
MSG[0]
MSG[1]
MSG[2]
MSG[3]
MSG[4]
MWS to Coexistence
Controller (Signal)
FRAME_SYNC
MWS_RX
MWS_TX
PATTERN[0]
PATTERN[1]
Coexistence Controller to
MWS (Message)
BT_RX_PRI
BT_TX_ON
802_RX_PRI
802_TX_ON
RFU
Signal Name
FRAME_SYNC
MWS_RX
MWS_TX
PATTERN[1,0]
BT_RX_PRI
BT_TX_ON
802_RX_PRI
802_TX_ON
MWS_INACTIVITY_DURATION
MWS_SCAN_FREQUENCY_OFFSET
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 20
Transport Control Message
The transport control messages can modify the state and request state information of the MWS
coexistence interface.
Message
MSG[0]
MSG[1]
MSG[2]
MSG[3]
MSG[4]
Transport Control Message
RESEND_REA
L_TIME
RFU
RFU
RFU
RFU
Signal Name
Description
RESEND_REAL_TIME
This bit is set if a device wants to get a status update of the real-time signals.
The signal is usually used after wake-up from sleep of the transport interface
to get an update of the real-time signals.
If the receiving device’s transport interface is awake it shall send a real-time
message with the current status of the real-time signals within 4 UART
character period. If the signal is not transmitted within 4 UART character
periods, the device is considered asleep.
If the receiving device’s transport interface is not awake it shall not send a
real-time message.
Bluetooth initiated:
If the MWS is currently scanning or has an ongoing inactivity duration, the
MWS shall send a frequency scan message or an inactivity duration message
after transmitting the real-time message.
If the receiving device’s transport interface is not awake it shall not send a
frequency scan or inactivity duration message.
Transparent Data Message
The transport control messages can modify the state and request state information of the MWS
coexistence interface.
Message
MSG[0]
MSG[1]
MSG[2]
MSG[3]
MSG[4]
Transparent Data Message
NIBBLE_POSI
TION
DATA[0]/[4]
DATA[1]/[5]
DATA[2]/[6]
DATA[3]/[7]
Signal Name
Description
NIBBLE_POSITION
0 = least significant nibble
1 = most significant nibble
DATA[n]; n=0 .. 7
Data bits of the message octet
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 21
MWS Inactivity Duration Message
The inactivity duration messages is used to send the MWS_INACTIVITY_DURATION signal
from the MWS device to the Coexistence Controller.
Message
MSG[0]
MSG[1]
MSG[2]
MSG[3]
MSG[4]
MWS Inactivity Duration
Message
DURATION[0]
DURATION[1]
DURATION[2]
DURATION[3]
DURATION[4]
The idle duration is encoded in 5 bits given by the formula:
Inactivity_Duration = DURATION * 5 ms
Inactivity durarations smaller than 5 ms are not communicated.
If all bits are set to 1 the inactivity duration is infinite. If all bits are set to 0 or MWS_RX or
MWS_TX are set to 1, the inactivity period ends.
MWS Scan Frequency Offset Message
The MWS scan frequency offset message is used to send the MWS_SCAN_FREQUENCY_
OFFSET signal from the MWS device to the Coexistence Controller.
Message
MSG[0]
MSG[1]
MSG[2]
MSG[3]
MSG[4]
MWS Scan Frequency
Offset
BAND
FREQ[0]
FREQ [1]
FREQ [2]
FREQ [3]
The RF scan frequency is encoded in 5 bits given by the formula:
RF_FREQ_OFFSET = FREQ * 10 MHz
If BAND is set to o the RF_FREQ_OFFSET is the negative value from the lower edge of the
ISM band and if BAND is set to 1, RF_FREQ_OFFSET is the positive value from the top edge
of the ISM band.
FREQ set to all 0 indicates the end of the scan period.
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 22
2.7.5 Bluetooth Coexistence Arbiter
Type
Features
Capability
• Programmable coexistence interface timing, interface modes, and signal
polarity to support a variety of external Bluetooth devices
• Programmable decision policies and transaction lock behavior for
various use cases
• Interface with external or on-chip Bluetooth device
• Support Bluetooth 1.1 or Bluetooth 1.2 AFH
• WLAN-/Bluetooth-coordinated low-power design
• Enhanced information sharing between WLAN and Bluetooth for combo
systems
• WLAN/Bluetooth/MWS (LTE/ZigBee) coexistence support
Arbitration
• Contention resolved by a customizable decision matrix that allows
independent grant decision for each device
• Vectors for the decision matrix:
WLAN priority (2-bit)
WLAN direction
Bluetooth priority (1- or 2-bit)
Bluetooth direction
Bluetooth frequency in/out band
MWS priority (2-bit)
MWS direction
AFH
If AFH is enabled in the Bluetooth device, and there is a sufficient guard-
band outside the WLAN operating frequency, the Bluetooth device uses the
Out-Of-Band (OOB) channel with respect to the WLAN device. Otherwise,
the Bluetooth device uses the In-Band (IB) and OOB channels with respect
to the WLAN device.
The IB and OOB information is either provided by the Bluetooth device
through the coexistence interface, or it can be provided through firmware
controls in a shared-host system. IB/OOB is a vector in the decision matrix.
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 23
Type
Features
Decision Policies
System configuration is a major consideration when planning decision
policies. The configuration governs how RF paths are shared and how
much interference will occur. Interference combinations include:
WLAN TX and Bluetooth TX
WLAN TX and Bluetooth RX
WLAN RX and Bluetooth TX
WLAN RX and Bluetooth RX
Interference combinations where WLAN and Bluetooth share the same
antenna:
WLAN TX and Bluetooth TX share same antenna, the decision matrix
allows either WLAN or Bluetooth TX (both OOB and IB), based on
relative packet priorities.
WLAN TX and Bluetooth RX (both OOB and IB) have sizable
interference impacts on Bluetooth RX, the decision matrix grants or
denies WLAN TX based on relative packet priorities.
WLAN RX and Bluetooth TX (both OOB and IB) have sizable
interference impacts on WLAN RX, the decision matrix grants or
denies Bluetooth TX based on relative packet priorities.
WLAN RX and Bluetooth RX (both OOB and IB) have no impact on
each other, the decision matrix grants both.
Interference combinations where WLAN and Bluetooth have their own
antenna:
WLAN TX and Bluetooth TX in OOB situation have little interference
impact on each other, the decision matrix grants both.
WLAN TX and Bluetooth TX in IB have sizable interference impact on
each other, the decision matrix allows either WLAN or Bluetooth TX,
based on relative packet priorities.
WLAN TX and Bluetooth RX in OOB situation have little interference
impact on each other, the decision matrix grants both provided there
is enough antenna isolation between WLAN and Bluetooth antenna.
WLAN TX and Bluetooth RX in IB situation have sizable interference
impact on Bluetooth RX, the decision matrix grants or denies WLAN
TX based on relative packet priorities.
WLAN RX and Bluetooth TX in OOB situation have little interference
impact on each other, the decision matrix grants both provided there
is enough antenna isolation between WLAN and Bluetooth antenna.
WLAN RX and Bluetooth TX in IB situation have sizable interference
impact on WLAN RX, the decision matrix grants or denies Bluetooth
TX based on relative packet priorities.
WLAN RX and Bluetooth RX (both OOB and IB) have no impact on
each other, the decision matrix grants both.
For the devices running in a basic shared antenna configuration, the linear
switching imposes restrictions on simultaneous transfer. Reasonable
policies include:
WLAN and Bluetooth are never granted at the same time
Decision matrix grants a device based on relative packet priorities
and direction
Priority order: High > Medium High > Medium > Low
For equal priority contention, select one device to win, that optimizes
the usage case
For the devices running in an enhanced shared antenna configuration, the
linear switching imposes restrictions on some simultaneous transfers.
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 24
Type
Features
Transaction Stopping
The arbiter allows control of what transfers can be stopped after an initial
grant. If allowed, a transaction can be stopped for higher priority request.
A transaction stop decision is a function of the decision policies and
transaction stopping control. The transaction stopping control is
configurable per device and direction.
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 25
2.7.6 Bluetooth Capability
Type
Features
Request Schemes
The PTA signals are directly controlled by the hardware to meet timing
requirements of the Bluetooth radio. The software controls the type of traffic
in priority mode. Mechanism enforced for control include:
• Selection of certain types of communication always treated as high
priority
• Selection of individual frames marked with high priority
• Real-time signaling of the next slot marked with high priority
• Automatic hardware control based on the grant/denial history of the
Bluetooth link
Timing Control
The PTA signal timing scheme is fully programmable relative to the
Bluetooth packet timing.
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 26
2.7.7 WLAN Capability
Type
Features
Capability
The WLAN device technology uses an internal coexistence interface to
exchange request/grant with the BCA. Features include:
• Packet-based request signaling with direction and priority information
• 1- or 2-bit priority signaling to support 4 priority levels
• Multiple WLAN RX request trigger sources, including early prediction
• WLAN TX request cancellation and abort if grant denied or revoked in
middle of request
• 802.11n A-MPDU treated as single packet
Packet Classification
• Programmable mask allows each frame type to be mapped to a priority
• Default setting puts response frames (ACK), beacons, and QoS frames
as high priority
• WLAN TX and RX have separate priority mask
Queue Classification
• Programmable mask allows each transmit queue to be mapped to a
priority
• Queue-based mapping is optional for software-generated frames only
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 27
2.7.8 LTE (MWS) Capability
The device supports a BTSIG WCI-2 MWS coexistence signaling interface. The coexistence
logical signaling is designed to enable a standard interface to allow an MWS device and a
Coexistence Controller to exchange information and support cooperative coexistence.
The WCI-2 signals carry time-critical information such as the start point of an MWS frame. The
logical coexistence signaling architecture also includes transparent data messaging and vendor
specific data messaging mechanism to enable passing information to and from the collocated
MWS device and Coexistence Controller when long latency (tens of milliseconds) cannot be
tolerated.
Further information 2.7.4 WCI-2 Interface
Coexistence Signals
The logical signals assist in time alignment, protecting MWS from interference and maximizing
the usability of the Bluetooth radio.
Time-Critical Coexistence Signals
Signal Name
Direction
FRAME_SYNC
MWS to Bluetooth
BT_RX_PRI
Bluetooth to MWS
BT_TX_ON
Bluetooth to MWS
802_RX_PRI
Bluetooth to MWS
802_TX_ON
Bluetooth to MWS
MWS_PATTERN
MWS to Bluetooth
MWS_RX
MWS to Bluetooth
MWS_TX
MWS to Bluetooth
MWS_INACTIVITY_DURATION
MWS to Bluetooth
MWS_SCAN_FREQUENCY_OFFSET
MWS to Bluetooth
MWS_TX_PRIL (MWS TX Priority Level)
MWS to Bluetooth
MWS_RX_PRIL (MWS RX Priority Level)
MWS to Bluetooth
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 28
2.7.9 ZigBee (MWS) Coexistence Capability
ZigBee is based on the IEEE 802.15.4 standard and it is used by a suite of communication
protocols to create Personal Area Networks (PANs) supporting home automation, lighting
control, etc. ZigBee radios operate in the 2.4 GHz ISM band worldwide. Unlike Bluetooth, the
ZigBee specification does not use AFH. When coexisting with WLAN/Bluetooth in the 2.4 GHz
band, it is important to avoid co-channel (IB) operation of these radios.
The device re-uses the MWS coexistence interface to support ZigBee coexistence. The
coexistence logical signaling is used to allow a ZigBee device and a WLAN/Bluetooth combo
device to exchange information and support cooperative coexistence.
Coexistence Signals
The logical signals used for ZigBee and WLAN/Bluetooth coexistence are a subset of the LTE
coexistence signaling. Considering the lower data rate of ZigBee packets, a lower baud rate
may be chosen for the 2-wire UART physical interface. The BCA supports 3-way arbitration
among ZigBee/WLAN/Bluetooth requests.
Coexistence Signals
Signal Name
Direction
MWS_RX
MWS to Bluetooth
MWS_TX
MWS to Bluetooth
MWS_PATTERN
MWS to Bluetooth
MWS_RX_PRI
MWS to Bluetooth
MWS_TX_PRI
MWS to Bluetooth
802_RX_PRI
Bluetooth to MWS
802_TX_ON
Bluetooth to MWS
BT_RX_PRI
Bluetooth to MWS
BT_TX_ON
Bluetooth to MWS
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 29
2.8 WLAN
Type
Features
IEEE 802.11/
Standards
• 802.11 data rates 1 and 2 Mbps (DSSS)
• 802.11b data rates 5.5 and 11 Mbps (CCK)
• 802.11a/g data rates 6, 9, 12, 18, 24, 36, 48, and 54 Mbps (OFDM)
• 802.11b/g performance enhancements
• 802.11n with maximum data rates up to 72 Mbps (20 MHz channel) and
150 Mbps (40 MHz channel)
• 802.11e quality of service (QoS)
• 802.11h transmit power control
• 802.11h DFS radar pulse detection
• 802.11i enhanced security (WEP, WPA, WPA2)
• 802.11k radio resource measurement
• 802.11mc precise indoor location and navigation
• 802.11n block acknowledgment extension
• 802.11r fast hand-off for AP roaming
• 802.11u Hotspot 2.0 (STA mode only)
• 802.11v TIM frame transmission/reception
• 802.11w protected management frames
• Support clients (stations) implementing IEEE Power Save mode
WLAN MAC
• Frame exchange at the MAC level to deliver data
• Received frame filtering and validation (CRC)
• Generation of MAC header and trailer information (MPDUs)
• Fragmentation of data frames (MSDUs)
• Access mechanism support for fair access to shared wireless medium
through:
Distributed Coordination Function (DCF)
Enhanced Distributed Channel Access (EDCA)
• A-MPDU aggregation/de-aggregation
• 20/40 MHz channel coexistence
• RIFS burst receive
• Management information base
• Radio resource measurement
• Quality of service
• Block acknowledgement
• Dynamic frequency selection
• TIM frame TX and RX
• Multiple BSS/Station
• Transmit rate adaption
• Transmit power control
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 30
Type
Features
WLAN Baseband
• 802.11n 1x1 SISO (WLAN SoC with SISO RF radio)
• Backward compatibility with legacy 802.11a/b/g technology
• WLAN/Bluetooth LNA sharing
• PHY data rates up to 150 Mbps
• 20 MHz bandwidth/channel, 40 MHz bandwidth/channel, upper/lower
20 MHz bandwidth in 40 MHz channel, and 20 MHz duplicate legacy
bandwidth in 40 MHz channel mode operation
• Modulation and Coding Scheme MCS 0 ~ 7 and MCS 32 (duplicate
6 Mbps)
• Dynamic frequency selection (radar detection)
– Enhanced radar detection for short and long pulse radar
– Enhanced AGC scheme for DFS channel
– Japan DFS requirement for W53 and W56
• 802.11k Radio resource measurement
• 802.11n optional features:
– 20/40 MHz coexistence
– Space-Time-Block-Coding (STBC) one spatial stream reception
and transmission
– Short Guard Interval for both 20 and 40 MHz operation (TX/RX)
– RIFS on receive path
– Beamformer function and hardware acceleration
– Greenfield TX/RX
• 802.11mc locationing
• Power save features
WLAN Radio
• Integrated direct-conversion radio
• 20 and 40 MHz channel bandwidth
• Shared WLAN/Bluetooth receive input scheme for 2.4 GHz band
• RX Path
On-chip gain selectable LNA with optimized noise figure and power
consumpttion
High dynamic range AGC function in receive mode
• TX Path
Internal PA with power control
Optimized TX gain distribution for linearity and noise performance
• Local Oscillator with fine channel step
WLAN Encryption
• WEP 64-bit and 128-bit encryption with hardware TKIP processing
(WPA)
• AES-CCMP hardware implementation as part of 802.11i security
standard (WPA2)
• Enhanced AES engine performance
• Advanced encryption standard (AES)/Counter-Mode/CBC-MAC Protocol
(CCMP)
• AES-Cipher-Based Message Authentication Code (CMAC) as part of the
802.11w security standard
• WLAN Authentication and Privacy Infrastructure (WAPI)
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 31
Operation Modes
Parameter
Operation Mode
Specification
Standard Conformance
IEEE 802.11/IEEE 802.11b
IEEE 802.11a
IEEE 802.11g
IEEE 802.11n
Modulation
IEEE 802.11a
OFDM
IEEE 802.11b
DSSS/CCK
IEEE 802.11g
OFDM
IEEE 802.11n
OFDM @ MCS0~7 and MCS32 (duplicate
6 Mbps)
Physical layer data rates
IEEE 802.11
1, 2 Mbps @ DSSS
IEEE 802.11b
5.5, 11 Mbps @ DSSS/CCK
Supported data rates
IEEE 802.11g
6, 9, 12, 18, 24, 36, 48, 54 Mbps
IEEE 802.11a
6, 9, 12, 18, 24, 36, 48, 54 Mbps
IEEE
802.11n
MCS0~7
HT20
LGI
6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps
SGI
7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,
72.2 Mbps
HT40
LGI
13.5, 27, 40.5, 54, 81, 108, 121.5,
135 Mbps
SGI
15, 30, 45, 60, 90, 120, 135, 150 Mbps
Supported bandwidth
IEEE 802.11n
20, 40 MHz (BW)
Supported channel mode
operation
IEEE 802.11n
20 MHz BW/channel, 40 MHz BW/channel,
upper/lower 20 MHz BW @ 40 MHz
channel, 20 MHz duplicate legacy BW
@ 40 MHz channel
Supported Guard Interval
IEEE 802.11n
400 ns (SGI), 800 ns (LGI)
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 32
Supported Channels and Frequencies
2.4 GHz – IEEE 802.11b/g/n
20 MHz Channels
40 MHz Channels
Channel
Frequency
Unit
Channel
Frequency
Unit
1
2 412
MHz
1-5
2 422
MHz
2
2 417
MHz
2-6
2 427
MHz
3
2 422
MHz
3-7
2 432
MHz
4
2 427
MHz
4-8
2 437
MHz
5
2 432
MHz
5-9
2 442
MHz
6
2 437
MHz
6-10
2 447
MHz
7
2 442
MHz
7-11
2 452
MHz
8
2 447
MHz
9
2 452
MHz
10
2 457
MHz
11
2 462
MHz
12
2 467
MHz
13
2 472
MHz
5 GHz – IEEE 802.11a/n
20 MHz Channels
40 MHz Channels
Channel
Frequency
Unit
Channel
Frequency
Unit
36
5 180
MHz
36-40
5 190
MHz
40
5 200
MHz
44-48
5 230
MHz
44
5 220
MHz
52-56
5 270
MHz
48
5 240
MHz
60-64
5 310
MHz
52
5 260
MHz
56
5 280
MHz
60
5 300
MHz
64
5 320
MHz
100
5 500
MHz
100-104
5 510
MHz
104
5 520
MHz
108-112
5 550
MHz
108
5 540
MHz
116-120
5 590
MHz
112
5 560
MHz
124-128
5 630
MHz
116
5 580
MHz
132-136
5 670
MHz
120
5 600
MHz
124
5 620
MHz
128
5 640
MHz
132
5 660
MHz
136
5 680
MHz
140
5 700
MHz
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 33
5 GHz – IEEE 802.11a/n
20 MHz Channels
40 MHz Channels
Channel
Frequency
Unit
Channel
Frequency
Unit
149
5 745
MHz
149-153
5 755
MHz
153
5 765
MHz
157-161
5 795
MHz
157
5 785
MHz
161
5 805
MHz
165
5 825
MHz
5 GHz – IEEE 802.11a/n (India and additional UNII Channels)
20 MHz Channels
40 MHz Channels
Channel
Frequency
Unit
Channel
Frequency
Unit
144
5 720
MHz
68-72
5 350
MHz
1696
5 845
MHz
76-80
5 390
MHz
173
5 865
MHz
84-88
5 430
MHz
177
5 885
MHz
92-96
5 470
MHz
181
5 905
MHz
140-144
5 710
MHz
165-169
5 835
MHz
169-1737
5 855
MHz
173-177
5 875
MHz
6
India channels that can be used in other countries as well
7
India use only
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 34
2.9 Bluetooth
Type
Features
General
• Supports Bluetooth 5.0
• Shared Tx/Rx path for Bluetooth
• Digital Audio Interface including PCM interface for voice application
• Bluetooth and WLAN coexistence
• WLAN/Bluetooth Coexistence (BCA) protocol support
Bluetooth Classic
(BR/EDR)
• Bluetooth Classic with BT Class 1 support
• Baseband and radio Basic Rate (BR) and Enhanced Data Rate (EDR)
packet types with 1 Mbps (GFSK), 2 Mbps (π/4-DQPSK) and 3 Mbps
(8DPSK)
• Fully functional Bluetooth baseband with:
– Adaptive Frequency Hopping (AFH)
– Forward error correction
– Header error control
– Access code correlation
– CRC
– Encryption bit stream generation
– Whitening
• Adaptive Frequency Hopping (AFH) including Packet Loss Rate (PLR)
• Interlaced scan for faster connection setup
• Simultaneous active ACL connection support
• Automatic ACL packet type selection
• Full master slave piconet support
• Scatternet support
• Standard UART and SDIO HCI transport layer
• SCO/eSCO links with hardware accelerated audio signal pocessing and
hardware supported PPEC algorithm for speech quality improvement
• All standard SCO/eSCO voice coding
• All standard pairing, authentication, link key, and encryption operations
• Standard Bluetooth power saving mechanism (i.e. hold, sniff modes, and
sniff-sub rating)
• Enhanced Power Control (EPC)
• Channel Quality Driven (CQD) data rate
• Wideband Speech (WBS) support (1 WBS link)
• Encryption (AES) support
• LTE/MWS coexistence
PAN9026 Wi-Fi/BT Module
2 Overview
Product Specification Rev. 1.0 Page 35
Type
Features
Bluetooth Low Energy (LE)
• Broadcaster, Observer, Central, and Peripheral roles
• Supports link layer topology to be master and slave (connects up to
16 links)
• Shared RF with BR/EDR
• Encryption AES support
• Hardware support for intelligent Adaptive Frequency Hopping (AFH)
• LE Privacy 1.2
• LE Secure Connection
• LE Data Length Extension
• LE Advertising Length Extension
• Direction Finding
– Connection-oriented Angle of Arrival (AoA)
PAN9026 Wi-Fi/BT Module
3 Detailed Description
Product Specification Rev. 1.0 Page 36
3 Detailed Description
3.1 Dimensions
All dimensions are in millimeters.
No.
Item
Dimension
Tolerance
Remark
1
Width
10.00
± 0.35
2
Length
17.50
± 0.35
3
Height
2.55
± 0.20
with case
17,50
10
2,55
PAN9026 Wi-Fi/BT Module
3 Detailed Description
Product Specification Rev. 1.0 Page 37
3.2 Footprint
The outer dimensions have a tolerance of 0.35 mm.
8,80 mm
2,20 mm2,20 mm
6,00 mm
3,20 mm
6,80 mm
0,80 mm
0,80 mm
0,80 mm
A1
B1
C1
D1
E1
F1
A2
B2
C2
D2
E2
F2
G2
A3
B3
C3
D3
E3
F3
G3
A4
B4
C4
D4
E4
F4
G4
A5
B5
F5
G5
A6
B6
F6
G6
A7
B7
F7
G7
A8
B8
F8
G8
A9
B9
C9
D9
E9
F9
G9
Chip
Antenna
0,80 mm
2,20 mm
3,60 mm
5,00 mm
17,50 mm
6,40 mm
7,80 mm
9,20 mm
10,60 mm
12,00 mm
1,40 mm
12,00 mm
4,80 mm
8.00 mm
1.00 mm 1.00 mm
2,20 mm
0,80 mm
3,60 mm
5,00 mm
6,40 mm
7,80 mm
9,20 mm
10,00 mm
Ground plane
keep out area
Top View
G1
EP1 EP2
PAN9026 Wi-Fi/BT Module
3 Detailed Description
Product Specification Rev. 1.0 Page 38
3.3 Packaging
The product is a mass production status product and will be delivered in the package described
below.
3.3.1 Tape Dimensions
3.3.2 Packing in Tape
Empty spaces in the component packed area shall be less than two per reel and those spaces
shall not be consecutive.
The top cover tape shall not be found on reel holes and it shall not stick out from the reel.
W
Do
1.5
+ 0.1
0.0
PoP2 E1
Ao
D1
2.0MIN
F(III)
So
P1
X X
A
Y
Y
SECTION X-X
0.20 ± 0.05
R0.75
DETAIL A
Ko
T
0.30± 0.03
Bo
SECTION Y-Y
Measured from centreline of sprocket hole
to centreline of pocket.
Cumulative tolerance of 10 sprocket
holes is ± 0.20 .
Measured from centreline of sprocket
hole to centreline of pocket.
(I)
(II)
(III)
(IV) Other material available.
ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED.
W
F
SO
+/- 0.15
+/- 0.15
+/- 0.3
14.20
28.40
32.00
Ao
18.05 +/- 0.15
Bo
3.00 +/- 0.15
20.00
P1+/- 0.15
Ko
10.55 +/- 0.15
2.0± 0.15(I) 4.0± 0.15(II) 1.75± 0.1
PAN9026 Wi-Fi/BT Module
3 Detailed Description
Product Specification Rev. 1.0 Page 39
3.3.3 Component Direction
3.3.4 Reel Dimension
PAN9026 Wi-Fi/BT Module
3 Detailed Description
Product Specification Rev. 1.0 Page 40
3.3.5 Package Label
Example
(1T)
(1P)
(2P)
(9D)
(Q)
(HW/SW)
Lot code
Customer order number, if applicable
Order number
Date code
Quantity
Hardware/software version
3.3.6 Total Package
barcode
label
moisture-sensitive print
(already exist on barrier bag) barcode
label
desiccant 1) 2)
moisture indicator
barrier bag
sealed
inner carton box
size 340 x 340 x 41 mm³
1) quantity of desiccant according
to calculation
2) optional: desiccant placed into
the corner of the barrier bag
PAN9026 Wi-Fi/BT Module
3 Detailed Description
Product Specification Rev. 1.0 Page 41
3.4 Case Marking
Example for PAN9026 (top view)
1
2
3
4
5
6
7
8
9
10
11
Brand name
Hardware/Software version
Engineering Sample (optional)
Model Name/ENW number
Lot code
Serial number
WLAN MAC address
BD address
(Reserved)
Marking for Pin 1
2D barcode, for internal usage only
PAN9026 HW/SW ES
M/N: ENWF9201A1EF
YYWWDLL
12345678
0013430B801E
11
1
3
4
2
5
6
7
10
90013430B801F
8
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 42
4 Specification
All specifications are over temperature and process, unless indicated
otherwise.
4.1 Default Test Conditions
Temperature: 25 ± 10 °C
Humidity: 40 to 85 % RH
Supply Voltage: VDD2V2 = 2.2 V
VDD1V8 = 1.8 V
VIORF = 3.3 V
VIOSD = 3.3 V
VIO = 1.8 V
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 43
4.2 Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not
even momentarily or individually, as permanent damage to the module may
result.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
TSTOR
Storage
temperature
-55
+125
°C
VESD
ESD
robustness
All pads, according to human
body model (HBM), JEDEC
STD 22, method A114
1 000
V
According to charged device
model (CDM), JEDEC STD 22,
method C101
500
V
PRF
RF input level
+20
dBm
VDD1V8
Maximum
voltage
Maximum power supply voltage
from any pin with respect to
VSS (GND)
1.8
1.98
V
VDD2V2
2.2
2.3
V
VIOSD
1.8
2.2
V
3.3
4.0
V
VIO
1.8
2.2
V
3.3
4.0
V
VIORF
3.3
4.0
V
VRF_SW1/2
3.3
4.0
V
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 44
4.3 Recommended Operating Conditions
The maximum ratings may not be exceeded under any circumstances, not
even momentarily or individually, as permanent damage to the module may
result.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
TA
Ambient
operating
temperature
range
Extended grade
-30
+85
°C
VDD1V8
1V8 supply
voltage8
VDD voltage on pins A4, A5
1.71
1.80
1.89
V
VDD2V2
2V2 supply
voltage8
VDD voltage on pins A6, B5, B6
2.09
2.20
2.29
V
VIOSD
Digital I/O
VIOSD supply
voltage9
Pin G3 with 1.8 V operation
SDIO Pins Function
1.62
1.80
1.98
V
Pin G3 with 3.3 V operation
SDIO Pins Function
2.97
3.30
3.47
V
VIO
Digital I/O VIO
supply voltage
Pin G4 with 1.8 V operation
1.62
1.80
1.98
V
Pin G4 with 3.3 V operation
Pin B4 connect to GND10
2.97
3.30
3.47
V
VIORF
Digital I/O
VIORF supply
voltage8
Pin G7 with 3.3 V operation
2.97
3.30
3.47
V
VRF_SW1/2
VRF_SW1/2
switch
voltage8
Pin A7, B7 with 3.3 V logical
level switch operation
RF-Switch Pins Function
3.30
3.60
V
8
The supply current must be limited to max. 1 A
9
1.8 V or 3.3 V supply voltage possible
10
Connect the 32KHZ_EN pin via a 100 resistor to ground to disable the internal 32.768 kHz crystal oscillator. The low
power modes will then use the SoC reference clock, which has lower accuracy.
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 45
4.3.1 Digital Pin Characteristics
VIO with 1.8 V Operations
11
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VIH
High level input
voltage
1.8 V operation (VIO = 1.8 V)
0.7 VIO
VIO + 0.4
V
VIL
Low level input
voltage
1.8 V operation (VIO = 1.8 V)
-0.4
0.3 VIO
V
VHYS
Input hysteresis
100
mV
VOH
High level ouput
voltage
1.8 V operation (VIO = 1.8 V)
VIO - 0.4
V
VHO
Low level
output voltage
1.8 V operation (VIO = 1.8 V)
0.4
V
VIO with 3.3 V Operations11
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VIH
High level input
voltage
3.3 V operation (VIO = 3.3 V)
0.7 VIO
VIO + 0.4
V
VIL
Low level input
voltage
3.3 V operation (VIO = 3.3 V)
-0.4
0.3 VIO
V
VHYS
Input hysteresis
100
mV
VOH
High level ouput
voltage
3.3 V operation (VIO = 3.3 V)
VIO - 0.4
V
VHO
Low level
output voltage
3.3 V operation (VIO = 3.3 V)
0.4
V
VIOSD 1.8 V Operation for SDIO I/F11
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VIH
High level input
voltage
1.8 V operation (VIOSD = 1.8 V)
0.7 VIOSD
VIOSD
+0.4
V
VIL
Low level input
voltage
1.8 V operation (VIOSD = 1.8 V)
-0.4
0.3 VIOSD
V
VHYS
Input hysteresis
100
mV
VOH
High level ouput
voltage
1.8 V operation (VIOSD = 1.8 V)
VIOSD
- 0.4
V
VHO
Low level
output voltage
1.8 V operation (VIOSD = 1.8 V)
0.4
V
11
The capacitive load should not be larger than 50 pF for all I/Os when using the default driver strength settings. Large
capacitance loads generally increase the overall current consumption.
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 46
VIOSD 3.3 V Operation for SDIO I/F11
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VIH
High level input
voltage
3.3 V operation (VIOSD = 3.3 V)
0.7 VIO_SD
VIO_SD
+0.4
V
VIL
Low level input
voltage
3.3 V operation (VIOSD = 3.3 V)
-0.4
0.3 VIO_SD
V
VHYS
Input hysteresis
100
mV
VOH
High level ouput
voltage
3.3 V operation (VIOSD = 3.3 V)
VIOSD
- 0.4
V
VHO
Low level
output voltage
3.3 V operation (VIOSD = 3.3 V)
0.4
V
For SDIO 3.0 standard modes SDR12, SDR25, SDR50, and DDR50, a supply
voltage of VIOSD = 1.8 V should be used.
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 47
4.3.2 Current Consumption
The current consumption depends on the user scenario, the setup and timing
of the power modes. Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V,
VIOSD = 3.3 V, VIO = 1.8 V, and Tamb = 25 °C, if nothing else stated.
General Current Consumption
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
IVDD1V8 @ PDn
Power Down
Grounding of PDn pin
150
µA
IVDD2V2 @ PDn
5
µA
IVDD1V8 @ DeepSleep
WLAN / BT
Deep Sleep
Low-power state used in sleep state
600
µA
IVDD2V2 @ DeepSleep
5
µA
IVDD1V8 @ Firmware Init
Firmware
Initialization
Device Initialization
400
mA
IVDD2V2 @ Firmware Init
950
mA
WLAN Current Consumption
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
IVDD1V8 @ TX
Active
Transmit12
PTX = +15 dBm for 5 GHz band
802.11a @ 54 Mbps
230
mA
PTX = +14 dBm for 5 GHz band
802.11n 20M @ MCS7
240
mA
PTX = +13 dBm for 5 GHz band
802.11n 40M @ MCS7
250
mA
PTX = +16 dBm for 2.4 GHz band
802.11b @ 11 Mbps
175
mA
PTX = +15 dBm for 2.4 GHz band
802.11g @ 54 Mbps
180
mA
PTX = +14 dBm for 2.4 GHz band
802.11n 20M @ MCS7
185
mA
IVDD2V2 @ TX
Active
Transmit12
PTX = +15 dBm for 5 GHz band
802.11a @ 54 Mbps
180
mA
PTX = +14 dBm for 5 GHz band
802.11n 20M @ MCS7
170
mA
PTX = +13 dBm for 5 GHz band
802.11n 40M @ MCS7
160
mA
PTX = +16 dBm for 2.4 GHz band
802.11b @ 11 Mbps
240
mA
PTX = +15 dBm for 2.4 GHz band
802.11g @ 54 Mbps
190
mA
PTX = +14 dBm for 2.4 GHz band
802.11n 20M @ MCS7
170
mA
12
Peak values for specified output power level and data rate with UDP traffic between the AP and Device (STA).
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 48
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
IVDD1V8 @ RX
Active
Receive13
5 GHz band 802.11a @ 54 Mbps
85
mA
5 GHz band 802.11n 20M @ MCS7
95
mA
5 GHz band 802.11n 40M @ MCS7
110
mA
2.4 GHz band 802.11b @ 11 Mbps
65
mA
2.4 GHz band 802.11g @ 54 Mbps
70
mA
2.4 GHz band 802.11n 20M
@ MCS7
75
mA
IVDD2V2 @ RX
Active
Receive13
5 GHz band 802.11a/n
20
µA
2.4 GHz band 802.11b/g/n
20
µA
IVDD1V8 @ IEEE-PS
IEEE Power
Save14
DTIM = 1 with beacon interval
100 ms (Average15)
2
mA
IVDD2V2 @ IEEE-PS
20
µA
Bluetooth Current Consumption
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
IVDD1V8 @ TX
BT SCO HV3
Peak, PTX = +4 dBm
55
mA
BT ACL DH1
Average, PTX = 0 dBm
25
mA
BT ACL 3-DH5
Average, PTX = 0 dBm
35
mA
LE
PTX = 0 dBm
45
mA
IVDD2V2 @ TX
BT SCO HV3
PTX = +4 dBm
15
µA
BT ACL DH1
PTX = 0 dBm
15
µA
BT ACL 3-DH5
PTX = 0 dBm
15
µA
LE
PTX = 0 dBm
15
µA
IVDD1V8 @ RX
LE
Peak
30
mA
IVDD2V2 @ RX
LE
5
µA
IVDD1V8 @ Page Scan
BT Page Scan
Peak
2.4
mA
IVDD2V2 @ Page Scan
5
µA
IVDD1V8 @ PI Scan
BT Page and
Inquiry Scan
Peak
3.8
mA
IVDD2V2 @ PI Scan
5
µA
IVDD1V8 @ LE Advertise
LE Advertise in
1.28s Interval
Peak
1.5
mA
IVDD2V2 @ LE Advertise
5
µA
IVDD1V8 @ LE Scan
LE Scan with
Interval 1.28 s
Peak
1.5
mA
IVDD2V2 @ LE Scan
5
µA
13
Peak values for specified data rate with UDP traffic between the Device (Client) and AP (Server). The WLAN/BT combo
Firmware is downloaded and BT is in Deep Sleep.
14
In IEEE Power Save the device automatically wakes up on beacons. If it is a DTIM value of 1 along with a beacon interval of
100 ms, the device wakes up every 100 ms.
15
The average current is averaged over one cycle which includes sleep time and wake up time.
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 49
4.3.3 Internal Operating Frequencies
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
fSYSCLK1
CPU1/System
/Encryption
clock speed
Refers to clock speed of SoC’s
CPU1
160
MHz
fSYSCLK2
CPU2
Refers to clock speed of SoC’s
CPU2
64
MHz
fREFCLK1
Crystal
fundamental
frequency
Frequency tolerance < ±10 ppm
over operating temperature and
process
26
MHz
fSLEEPCLK
Sleep Clock
frequency
Frequency tolerance < ±20 ppm
over operating temperature,
aging and process, CMOS input
clock signal type
32.768
kHz
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 50
4.3.4 Power-up Sequence
Symbol
Parameter
Min.
Typ.
Max.
Units
VDD1V8
Voltage level of VDD2V2
90
%
PDn
Voltage level of VDD2V2
90
%
VIO
VIOSD
VIORF
VDD2V2
VDD1V8
PDn
90%
90%
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 51
4.3.5 Host Interface
4.3.5.1 SDIO Interface
The SDIO Interface pins are powered from the VIOSD voltage supply with
either 3.3 V or 1.8 V. The SDIO electrical specifications are identical for the
1-bit and 4-bit SDIO modes.
DC specification 4.3.1 Digital Pin Characteristics
SDIO Timing Data – Default and High-Speed Modes (VIOSD 3.3 V)
16
,
17
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
fPP
Clock frequency
Normal
0
25
MHz
High-speed
0
50
MHz
TWL
Clock low time
Normal
10
ns
High-speed
7
ns
TWH
Clock high time
Normal
10
ns
High-speed
7
ns
TISU
Input setup time
Normal
5
ns
High-speed
6
ns
TIH
Input hold time
Normal
5
ns
High-speed
2
ns
TODLY
Output delay time
Normal
14
ns
CL 40 pF (1 card)
High-speed
14
ns
TOH
Output hold time
High-speed
2.5
ns
16
For SDIO 2.0 running at 50 MHz clock frequency, a supply voltage VIOSD of 1.8 V is recommended.
17
For SDIO 2.0 running at 25 MHz clock frequency, either 1.8 V or 3.3 V can be used.
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 52
SDIO Protocol Timing Diagram – Default Speed Mode (VIOSD 3.3 V)
SDIO Protocol Timing Diagram – High-Speed Mode (VIOSD 3.3 V)
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 53
SDIO Timing Data – SDR12, SDR25, SDR50 Modes (VIOSD 1.8 V)
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
fPP
Clock frequency
SDR12/SDR25/
SDR50
25
100
MHz
TIS
Input setup time
SDR12/SDR25/
SDR50
3
ns
TIH
Input hold time
SDR12/SDR25/
SDR50
0.8
ns
TCLK
Clock time
SDR12/SDR25/
SDR50
10
40
ns
TCR , TCF
Rise time, fall time
TCR , TCF < 2 ns (max) at
100 MHz
CCARD = 10 pF
SDR12/SDR25/
SDR50
0.2 *
TCLK
ns
TODLY
Output delay time
CL 30 pF
SDR12/SDR25/
SDR50
7.5
ns
TOH
Output hold time
CL = 15 pF
SDR12/SDR25/
SDR50
1.5
ns
SDIO Protocol Timing Diagram – SDR12, SDR25, SDR50 Modes (VIOSD 1.8 V)
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 54
SDIO Timing Data – DDR50 Mode (VIOSD 1.8 V)
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
Clock
TCLK
Clock time
50 MHz (max) between
rising edges
DDR50
20
ns
TCR, TCF
Rise time, fall time
TCR, TCF < 4.00 ns (max)
at 50 MHz,
CCARD = 10 pF
DDR50
0.2 *
TCLK
ns
Clock Duty
DDR50
45
55
%
CMD Input (referenced to clock rising edge)
TIS
Input setup time
CCARD 10 pF (1 card)
DDR50
6
ns
TIH
Input hold time
CCARD 10 pF (1 card)
DDR50
0.8
ns
CMD Output (referenced to clock rising edge)
TODLY
Output delay time during
data transfer mode
CL 30 pF (1 card)
DDR50
13.7
ns
TOHLD
Output hold time
CL ≥ 15 pF (1 card)
DDR50
1.5
ns
DAT[3:0] Input (referenced to clock rising and falling edge)
TIS2x
Input setup time
CCARD 10 pF (1 card)
DDR50
3
ns
TIH2x
Input hold time
CCARD 10 pF (1 card)
DDR50
0.8
ns
DAT[3:0] Output (referenced to clock rising and falling edge)
TODLY2x (max)
Output delay time during
data transfer mode
CL 25 pF (1 card)
DDR50
7
ns
TODLY2x (min)
Output hold time
CL ≥ 15 pF (1 card)
DDR50
1.5
ns
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 55
SDIO CMD Timing Diagram – DDR50 Mode (VIOSD 1.8 V, 50 MHz)
SDIO DAT[3:0] Timing Diagram – DDR50 Mode
18
(VIOSD 1.8 V, 50 MHz)
18
In DDR50 mode, DAT[3:0] lines are sampled on both edges of the clock (not applicable for CMD line).
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 56
4.3.5.2 High-Speed UART Interface
The High-Speed UART Interface pins are powered from the VIO voltage
supply with 1.8 V.
DC specification 4.3.1 Digital Pin Characteristics
The UART interface operation includes:
• Support data input/output operations for peripheral devices connected through a
standard UART interface
• 4-wire data transfer (RXD, TXD, RTS, CTS)
• Programmable baud rate (1 200 bps to 4 Mbps)
• Data format (LSB first)
• Data bit: (5-8 bit)
• Parity bit: (0-4 bit)
• Stop bit: (1-2 bit)
Interface Signals
Pin No
Signal Name
Specification
Name
Type
Description
F3
UART_SOUT
TXD
Host Controller
Interface (HCI)
Transmit data output
F4
UART_SIN
RXD
Receive data input
F5
UART_RTS
RTS
Request to send (active low)
G5
UART_CTS
CTS
Clear to send (active low)
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 57
Interface Transport Settings
Item
Range
Default
Comment
Baudrate
1 200 ~ 4 000 000
3 000 000
Baud
Data Bits
5 ~ 8
8
LSB first
Parity Bits
0 ~ 4
0
Stop Bit
1/1.5/2
1
Supported Baud Rates
Baud
1 200
2 400
4 800
9 600
19 200
38 400
57 600
76 800
115 200
230 400
460 800
500 000
921 600
1 000 000
1 382 400
1 500 000
1 843 200
2 000 000
2 100 000
2 764 800
3 000 000
3 250 000
3 692 300
4 000 000
UART Timing Diagram
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 58
4.3.6 Peripheral Interface
The Peripheral Interface pins are powered from the VIO voltage supply with
1.8 V.
DC specification 4.3.1 Digital Pin Characteristics
4.3.6.1 GPIO Interface
The General-Purpose I/O (GPIO) interface is used to implement user-defined input and output
signals to and from the device, such as external interrupts and other user-defined I/Os.
Configurable GPIOs
Function
GPIO Pin Name
IO0
IO1
IO2
IO3
IO12
IO13
IO14
IO15
GPIO IN
YES
YES
YES
YES
YES
YES
YES
YES
GPIO OUT
YES
YES
YES
YES
YES
YES
YES
YES
IRQ IN
YES
YES
YES
YES
YES
YES
YES
YES
LED Mode
Symbol
Parameter
Condition
Typ.
Units
IOH
Switching current high
Tristate on pin
(requires
pull-up)
Tristate when driving high
mA
IOL
Switching current low
@ 0.4 V
10
mA
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 59
4.3.7 Audio Interface
4.3.7.1 PCM Interface
Interface Signals
Pin No
Signal Name
Specification
Name
Type
Description
A1
PCM_DOUT
DOUT
Output
PCM data
B1
PCM_CLK
CLK
Input/Output
PCM clock signal, output if PCM
master, input if PCM slave
B1
PCM_MCLK
MCLK
Output
PCM clock signal (optional),
optional clock used for some codecs,
derived from PCM_CLK
B2
PCM_DIN
DIN
Input
PCM data
B3
PCM_SYNC
SYNC
Input/Output
PCM Sync pulse signal, output if PCM
master, input if PCM slave
Modes of Operation
The PCM Interface supports two modes of operation:
• PCM master
• PCM slave
When in PCM master mode, the interface generates a 2 MHz or a 2.048 MHz PCM_CLK and a
8 kHz PCM_SYNC signal. An alternative PCM master mode is available that uses an externally
generated PCM_CLK, but still generates the 8 kHz PCM_SYNC. The external PCM_CLK must
have a frequency that is an integer multiple of 8 kHz. Supported frequencies are in the 512 kHz
to 4 MHz range.
When in PCM slave mode, the interface has both PCM_CLK and PCM_SYNC as inputs,
thereby letting another unit on the PCM bus generate the signals.
The PCM interface consists of up to four PCM slots (time-devided) preceded by a PCM sync
signal. Each PCM slot can be either 8 or 16 bits wide. The slots can be separated in time, but
they are not required to follow immediately after another. The timing is relative to PCM_SYNC.
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 60
PCM Timing Data – Master Mode
Symbol
Min.
Typ.
Max.
Units
FBCLK
2/2.048
MHz
Duty CycleBCLK
0.4
0.5
0.6
TBCLK rise/fall
3
ns
TDO
15
ns
TDISU
20
ns
TDIHO
15
ns
TBF
15
ns
PCM Timing Diagram – Master Mode
CLK
DOUT
DIN
SYNC
TBF
TTDO
TBCLK
TDISU TDIHO
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 61
PCM Timing Data – Slave Mode
Symbol
Min.
Typ.
Max.
Units
FBCLK
2/2.048
MHz
Duty CycleBCLK
0.4
0.5
0.6
TBCLK rise/fall
3
ns
TDO
30
ns
TDISU
15
ns
TDIHO
10
ns
TBFSU
15
ns
TBFHO
10
ns
PCM Timing Diagram – Slave Mode
CLK
DOUT
DIN
SYNC
TBFSU
TTDO
TBCLK
TDISU TDIHO
TBFHO
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 63
4.4 RF Electrical Characteristics
4.4.1 WLAN Radio Specification
Receive Mode
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2.4 GHz – IEEE 802.11b/g/n
2 400
2 483.5
MHz
5 GHz – IEEE 802.11a/n
4 900
5 925
MHz
Transmit Mode
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2.4 GHz – IEEE 802.11b/g/n
2 400
2 483.5
MHz
5 GHz – IEEE 802.11a/n
4 900
5 925
MHz
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 64
4.4.2 WLAN RF Characteristics
4.4.2.1 RF Characteristics for IEEE 802.11b
Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V
and Tamb = 25 °C, if nothing else stated.
50 terminal load connected to the RF connector.
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2 400
2 483.5
MHz
Carrier frequency tolerance
-25
+25
ppm
Transmit output power
+16
dBm
Spectrum mask
fC ± 11 MHz
-30
dBr
fC ± 22 MHz
-50
Power-on/Power-down ramp
2
µs
RF Carrier suppression
-15
dB
Error Vector Magnitude (EVM)
Peak
35
%
Minimum Receive Sensitivity
1 Mbps (DSSS)
FER ≤ 8 %
-98
dBm
2 Mbps (DSSS)
FER ≤ 8 %
-93
-80
dBm
5.5 Mbps (CCK)
FER ≤ 8 %
-91
dBm
11 Mbps (CCK)
FER ≤ 8 %
-89
-76
dBm
Maximum Input Level
FER ≤ 8 %
-10
dBm
Adjacent Channel Rejection
FER ≤ 8 %
35
dB
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 65
4.4.2.2 RF Characteristics for IEEE 802.11g
Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V
and Tamb = 25 °C, if nothing else stated.
50 terminal load connected to the RF connector.
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2 400
2 483.5
MHz
Carrier frequency tolerance
-25
+25
ppm
Transmit output power
6 Mbps ~ 36 Mbps
+16
dBm
48 Mbps ~ 54 Mbps
+15
dBm
Spectrum mask
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-40
dBr
Transmitter center frequency
leakage
-15
dB
Transmitter Spectral Flatness
-4
+4
dB
Constellation Error (EVM)
BPSK, CR 1/2 (6 Mbps)
-5
dB
BPSK, CR 3/4 (9 Mbps)
-8
dB
QPSK, CR 1/2 (12 Mbps)
-10
dB
QPSK, CR 3/4 (18 Mbps)
-13
dB
16-QAM, CR 1/2 (24 Mbps)
-16
dB
16-QAM, CR 3/4 (36 Mbps)
-19
dB
64-QAM, CR 2/3 (48 Mbps)
-22
dB
64-QAM, CR 3/4 (54 Mbps)
-25
dB
Minimum Receive Sensitivity
BPSK, CR 1/2 (6 Mbps)
PER ≤ 10 %
-91
-82
dBm
BPSK, CR 3/4 (9 Mbps)
PER ≤ 10 %
-90
-81
dBm
QPSK, CR 1/2 (12 Mbps)
PER ≤ 10 %
-89
-79
dBm
QPSK, CR 3/4 (18 Mbps)
PER ≤ 10 %
-87
-77
dBm
16-QAM, CR 1/2 (24 Mbps)
PER ≤ 10 %
-84
-74
dBm
16-QAM, CR 3/4 (36 Mbps)
PER ≤ 10 %
-81
-70
dBm
64-QAM, CR 2/3 (48 Mbps)
PER ≤ 10 %
-77
-66
dBm
64-QAM, CR 3/4 (54 Mbps)
PER ≤ 10 %
-76
-65
dBm
Maximum Input Level
PER ≤ 10 %
-20
dBm
Adjacent channel rejection
BPSK, CR 1/2 (6 Mbps)
PER ≤ 10 %
16
dB
64-QAM, CR 3/4 (54 Mbps)
PER ≤ 10 %
-1
dB
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 66
4.4.2.3 RF Characteristics for IEEE 802.11n (BW 20 MHz, 2.4 GHz)
Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V
and Tamb = 25 °C, if nothing else stated.
50 terminal load connected to the RF connector.
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2.4 GHz
2 400
2 483.5
MHz
Carrier frequency tolerance
-25
+25
ppm
Transmit output power
MCS0 ~ MCS2
+15
dBm
MCS3 ~ MCS4
+15
dBm
MCS5 ~ MCS7
+14
dBm
Spectrum mask
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-45
dBr
Transmitter center frequency
leakage
-15
dB
Transmitter Spectral Flatness
-4
+4
dB
Constellation Error (EVM)
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
Minimum Receive Sensitivity19
6.5 Mbps (MCS0)
PER ≤ 10 %
-90
-82
dBm
13 Mbps (MCS1)
PER ≤ 10 %
-88
-79
dBm
19.5 Mbps (MCS2)
PER ≤ 10 %
-86
-77
dBm
26 Mbps (MCS3)
PER ≤ 10 %
-83
-74
dBm
39 Mbps (MCS4)
PER ≤ 10 %
-80
-70
dBm
52 Mbps (MCS5)
PER ≤ 10 %
-76
-66
dBm
58.5 Mbps (MCS6)
PER ≤ 10 %
-74
-65
dBm
65 Mbps (MCS7)
PER ≤ 10 %
-73
-64
dBm
Maximum Input Level
PER ≤ 10 %
-20
dBm
Adjacent channel rejection20
65 Mbps (MCS7)
PER ≤ 10 %
-2
dB
19
The Minimum Sensitivity levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI, and BCC.
20
The Adjacent Channel Rejection levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI, and BCC.
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 67
4.4.2.4 RF Characteristics for IEEE 802.11n (BW 40 MHz, 2.4 GHz)
Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V
and Tamb = 25 °C, if nothing else stated.
50 terminal load connected to the RF connector.
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2.4 GHz
2 400
2 483.5
MHz
Carrier frequency tolerance
-25
+25
ppm
Transmit output power
MCS0 ~ MCS2
+14
dBm
MCS3 ~ MCS4
+14
dBm
MCS5 ~ MCS7
+13
dBm
Spectrum mask
fC ± 21 MHz
-20
dBr
fC ± 40 MHz
-28
dBr
fC ± 60 MHz
-45
dBr
Transmitter center frequency
leakage
-20
dB
Transmitter Spectral Flatness
-4
+4
dB
Constellation Error (EVM)
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
Minimum Receive Sensitivity19
13.5 Mbps (MCS0)
PER ≤ 10 %
-86
-79
dBm
27 Mbps (MCS1)
PER ≤ 10 %
-85
-76
dBm
40.5 Mbps (MCS2)
PER ≤ 10 %
-83
-74
dBm
54 Mbps (MCS3)
PER ≤ 10 %
-80
-71
dBm
81 Mbps (MCS4)
PER ≤ 10 %
-77
-67
dBm
108 Mbps (MCS5)
PER ≤ 10 %
-73
-63
dBm
121.5 Mbps (MCS6)
PER ≤ 10 %
-71
-62
dBm
135 Mbps (MCS7)
PER ≤ 10 %
-69
-61
dBm
Maximum Input Level
PER ≤ 10 %
-20
dBm
Adjacent channel rejection20
135 Mbps (MCS7)
PER ≤ 10 %
-2
dB
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 68
4.4.2.5 RF Characteristics for IEEE 802.11n (BW 20 MHz, 5 GHz)
Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V,
and Tamb = 25 °C, if nothing else stated.
50 terminal load connected to the RF connector.
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
5 GHz U-NII-1
5 150
5 250
MHz
5 GHz U-NII-2A
5 250
5 350
MHz
5 GHz U-NII-2C
5 470
5 725
MHz
5 GHz U-NII-3
5 725
5 825
MHz
Carrier frequency tolerance
-20
+20
ppm
Transmit output power
MCS0 ~ MCS2
+15
dBm
MCS3 ~ MCS4
+15
dBm
MCS5 ~ MCS7
+14
dBm
Spectrum mask
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-40
dBr
Transmitter center frequency
leakage
-15
dB
Transmitter Spectral Flatness
-4
+4
dB
Constellation Error (EVM)
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
Minimum Receive Sensitivity19
6.5 Mbps (MCS0)
PER ≤ 10 %
-89
-82
dBm
13 Mbps (MCS1)
PER ≤ 10 %
-88
-79
dBm
19.5 Mbps (MCS2)
PER ≤ 10 %
-85
-77
dBm
26 Mbps (MCS3)
PER ≤ 10 %
-82
-74
dBm
39 Mbps (MCS4)
PER ≤ 10 %
-79
-70
dBm
52 Mbps (MCS5)
PER ≤ 10 %
-74
-66
dBm
58.5 Mbps (MCS6)
PER ≤ 10 %
-73
-65
dBm
65 Mbps (MCS7)
PER ≤ 10 %
-71
-64
dBm
Maximum Input Level
PER ≤ 10 %
-30
dBm
Adjacent channel rejection20
65 Mbps (MCS7)
PER ≤ 10 %
-2
dB
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 69
4.4.2.6 RF Characteristics for IEEE 802.11n (BW 40 MHz, 5 GHz)
Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V,
and Tamb = 25 °C, if nothing else stated.
50 terminal load connected to the RF connector.
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
5 GHz U-NII-1
5 150
5 250
MHz
5 GHz U-NII-2A
5 250
5 350
MHz
5 GHz U-NII-2C
5 470
5 725
MHz
5 GHz U-NII-3
5 725
5 825
MHz
Carrier frequency tolerance
-20
+20
ppm
Transmit output power
MCS0 ~ MCS2
+14
dBm
MCS3 ~ MCS4
+14
dBm
MCS5 ~ MCS7
+13
dBm
Spectrum mask
fC ± 21 MHz
-20
dBr
fC ± 40 MHz
-28
dBr
fC ± 60 MHz
-40
dBr
Transmitter center frequency
leakage
-20
dB
Transmitter Spectral Flatness
-4
+4
dB
Constellation Error (EVM)
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
Minimum Receive Sensitivity19
13.5 Mbps (MCS0)
PER ≤ 10 %
-86
-79
dBm
27 Mbps (MCS1)
PER ≤ 10 %
-85
-76
dBm
40.5 Mbps (MCS2)
PER ≤ 10 %
-82
-74
dBm
54 Mbps (MCS3)
PER ≤ 10 %
-79
-71
dBm
81 Mbps (MCS4)
PER ≤ 10 %
-76
-67
dBm
108 Mbps (MCS5)
PER ≤ 10 %
-72
-63
dBm
121.5 Mbps (MCS6)
PER ≤ 10 %
-70
-62
dBm
135 Mbps (MCS7)
PER ≤ 10 %
-69
-61
dBm
Maximum Input Level
PER ≤ 10 %
-30
dBm
Adjacent channel rejection20
135 Mbps (MCS7)
PER ≤ 10 %
-2
dB
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 70
4.4.2.7 RF Characteristics for IEEE 802.11a
Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V,
and Tamb = 25 °C, if nothing else stated.
50 terminal load connected to the RF connector.
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
5 GHz U-NII-1
5 150
5 250
MHz
5 GHz U-NII-2A
5 250
5 350
MHz
5 GHz U-NII-2C
5 470
5 725
MHz
5 GHz U-NII-3
5 725
5 825
MHz
Carrier frequency tolerance
-20
+20
ppm
Transmit output power
6 Mbps ~ 36 Mbps
+16
dBm
48 Mbps ~ 54 Mbps
+15
dBm
Spectrum mask
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-40
dBr
Transmitter center frequency
leakage
-15
dB
Transmitter Spectral Flatness
-4
+4
dB
Constellation Error (EVM)
BPSK, CR 1/2 (6 Mbps)
-5
dB
BPSK, CR 3/4 (9 Mbps)
-8
dB
QPSK, CR 1/2 (12 Mbps)
-10
dB
QPSK, CR 3/4 (18 Mbps)
-13
dB
16-QAM, CR 1/2 (24 Mbps)
-16
dB
16-QAM, CR 3/4 (36 Mbps)
-19
dB
64-QAM, CR 2/3 (48 Mbps)
-22
dB
64-QAM, CR 3/4 (54 Mbps)
-25
dB
Minimum Receive Sensitivity
BPSK, CR 1/2 (6 Mbps)
PER ≤ 10 %
-90
-82
dBm
BPSK, CR 3/4 (9 Mbps)
PER ≤ 10 %
-90
-81
dBm
QPSK, CR 1/2 (12 Mbps)
PER ≤ 10 %
-89
-79
dBm
QPSK, CR 3/4 (18 Mbps)
PER ≤ 10 %
-86
-77
dBm
16-QAM, CR 1/2 (24 Mbps)
PER ≤ 10 %
-84
-74
dBm
16-QAM, CR 3/4 (36 Mbps)
PER ≤ 10 %
-80
-70
dBm
64-QAM, CR 2/3 (48 Mbps)
PER ≤ 10 %
-76
-66
dBm
64-QAM, CR 3/4 (54 Mbps)
PER ≤ 10 %
-75
-65
dBm
Maximum Input Level
PER ≤ 10 %
-30
dBm
Adjacent channel rejection
BPSK, CR 1/2 (6 Mbps)
PER ≤ 10 %
16
dB
64-QAM, CR 3/4 (54 Mbps)
PER ≤ 10 %
-1
dB
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 71
4.4.3 Bluetooth RF Characteristics
Assume VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VIORF = 3.3 V, VIOSD = 3.3 V, VIO = 1.8 V,
and Tamb = 25 °C, if nothing else stated.
50 terminal load connected to the RF connector.
4.4.3.1 Receiver Section RF Characteristics
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2 400
2 483.5
MHz
Interference Performance
(Basic Rate)
C/I Ratio
GFSK
RSL = -67 dBm
BER ≤ 0.1 %
C/I (Co-channel)
11
dB
C/I (1 MHz)
0
dB
C/I (2 MHz)
-30
dB
C/I (3 MHz)
-40
dB
C/I (Image)
-9
dB
C/I (Image ± 1 MHz)
-20
dB
Interference Performance
(Enhanced Data Rate)
C/I Ratio
π/4-DQPSK
RSL = -67 dBm
BER ≤ 0.01 %
C/I (Co-channel)
13
dB
C/I (1 MHz)
0
dB
C/I (2 MHz)
-30
dB
C/I (3 MHz)
-40
dB
C/I (Image)
-7
dB
C/I (Image ± 1 MHz)
-20
dB
8-DPSK
RSL = -67 dBm
BER ≤ 0.01 %
C/I (Co-channel)
21
dB
C/I (1 MHz)
5
dB
C/I (2 MHz)
-25
dB
C/I (3 MHz)
-33
dB
C/I (Image)
0
dB
C/I (Image ± 1 MHz)
-13
dB
Interference Performance
(Low Energy)
C/I Ratio
GFSK
RSL = -67 dBm
BER ≤ 0.1 %
1 Mbps
C/I (Co-channel)
21
dB
C/I (1 MHz)
15
dB
C/I (2 MHz)
-17
dB
C/I (3 MHz)
-27
dB
C/I (Image)
-9
dB
C/I (Image ± 1 MHz)
-15
dB
Minimum Receive Sensitivity
BR, DH1
BER ≤ 0.1 %
-94
-70
dBm
EDR, 2DH1
BER ≤ 0.01 %
-90
-70
dBm
LE, GFSK
BER ≤ 0.1 %
-90
-70
dBm
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 72
Parameter
Condition
Min.
Typ.
Max.
Units
Out-of-band blocking
(Basic Rate)
Interfering Signal Power
GFSK
RSL = -67 dBm
BER ≤ 0.1 %
30 MHz – 2 000 MHz
-10
dBm
2 GHz – 2.399 GHz
-27
dBm
2.484 GHz – 3 GHz
-27
dBm
3 GHz – 12.75 GHz
-10
dBm
Out-of-band blocking
(Low Energy)
Interfering Signal Power
GFSK
RSL = -67 dBm
BER ≤ 0.1 %
30 MHz – 2 000 MHz
-30
dBm
2.003 GHz – 2.399 GHz
-35
dBm
2.484 GHz – 2.997 GHz
-35
dBm
3 GHz – 12.75 GHz
-30
dBm
RSSI Range
Resolution = 1 dB
-90
0
dBm
4.4.3.2 Transmitter Section RF Characteristics
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2 400
2 483.5
MHz
Maximum Output power
Basic Rate (BR)
+8
+12
dBm
Enhanced Data Rate (EDR)
+4
+8
dBm
Low Energy (LE)
0
+4
dBm
Gain range
Gain control
30
dB
Gain resolution
0.5
dB
Spurious emission (BR)
(in-band)
± 500 kHz
-20
dBc
± 2 MHz, |M-N| = 2
-20
dBm
± 3 MHz or greater, |M-N| ≥ 3
-40
dBm
Spurious emission (EDR)
(in-band)
± 1 MHz
-26
dBc
± 1.5 MHz
-20
dBm
± 2.5 MHz
-40
dBm
Spurious emission (LE)
(in-band)
1 Mbps
± 2 MHz, |M-N| = 2
-20
dBm
± 3 MHz or greater, |M-N| ≥ 3
-30
dBm
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 73
4.5 Reliability Tests
The measurement should be done after the test device has been exposed to room temperature
and humidity for one hour.
No.
Item
Limit
Condition
1
Vibration test
Electrical parameter should be in
specification
Freq.: 10~50 Hz; Amplitude: 1.5 mm;
20 min./cycle, 1 h each of XYZ axis
2
Shock test
See above
Dropped 3 times onto hard wood from
a height of 1 m
3
Heat cycle test
See above
-40 °C for 30 min. and +85 °C for
30 min.; each temperature 300 cycles
4
Moisture test
See above
+60 °C, 90 % RH, 300 h
5
Low temp. test
See above
-40 °C, 300 h
6
High temp. test
See above
+85 °C, 300 h
PAN9026 Wi-Fi/BT Module
4 Specification
Product Specification Rev. 1.0 Page 74
4.6 Recommended Soldering Profile
• Reflow permissible cycle: 2
• Opposite side reflow is prohibited due to module weight
• More than 75 percent of the soldering area shall be coated by solder
• The soldering profiles should be adhered to in order to prevent electrical
or mechanical damage
• Soldering profile assumes lead-free soldering
PAN9026 Wi-Fi/BT Module
5 Cautions
Product Specification Rev. 1.0 Page 75
5 Cautions
Failure to follow the guidelines set forth in this document may result in
degrading of the product’s functions and damage to the product.
5.1 Design Notes
1. Follow the conditions written in this specification, especially the control signals of this
module.
2. The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for
example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF
directly at the module).
3. This product should not be mechanically stressed when installed.
4. Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
5. Avoid assembly and use of the target equipment in conditions where the product’s
temperature may exceed the maximum tolerance.
6. The supply voltage should not be exceedingly high or reversed. It should not carry noise
and/or spikes.
7. Keep this product away from other high frequency circuits.
8. Refer to the recommended pattern when designing a board.
5.2 Installation Notes
1. Reflow soldering is possible twice based on the conditions set forth in 4.6
Recommended Soldering Profile. Set up the temperature at the soldering portion of this
product according to this reflow profile.
2. Carefully position the products so that their heat will not burn into printed circuit boards
or affect the other components that are susceptible to heat.
3. Carefully locate these products so that their temperatures will not increase due to the
effects of heat generated by neighboring components.
4. If a vinyl-covered wire comes into contact with the products, then the cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between the cover and
these products to occur.
5. This product should not be mechanically stressed or vibrated when reflowed.
6. To repair the board by hand soldering, follow the conditions set forth in this chapter.
7. Do not wash this product.
8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage
to the unit.
PAN9026 Wi-Fi/BT Module
5 Cautions
Product Specification Rev. 1.0 Page 76
5.3 Usage Condition Notes
1. Take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, check and evaluate their operation befor assembly on the final products.
2. Do not use dropped products.
3. Do not touch, damage or soil the pins.
4. Follow the recommended condition ratings about the power supply applied to this
product.
5. Electrode peeling strength: Do not add pressure of more than 4.9 N when soldered on
PCB.
6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause
damage.
7. These products are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information, and communication
equipment.
5.4 Storage Notes
1. The module should not be stressed mechanically during storage.
2. Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely affected:
– Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX,
– Storage in direct sunlight,
– Storage in an environment where the temperature may be outside the range of 5 °C
to 35 °C, or where the humidity may be outside the 45 to 85 % range,
– Storage of the products for more than one year after the date of delivery storage
period: Please check the adhesive strength of the embossed tape and soldering
after 6 months of storage.
3. Keep this product away from water, poisonous gas, and corrosive gas.
4. This product should not be stressed or shocked when transported.
5. Follow the specification when stacking packed crates (max. 10).
5.5 Safety Cautions
These specifications are intended to preserve the quality assurance of products and individual
components.
Before use, check and evaluate the operation when mounted on your products. Abide by these
specifications without deviation when using the products. These products may short-circuit. If
electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a
short circuit occurs, provide the following failsafe functions as a minimum:
PAN9026 Wi-Fi/BT Module
5 Cautions
Product Specification Rev. 1.0 Page 77
1. Ensure the safety of the whole system by installing a protection circuit and a protection
device.
2. Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
5.6 Other Cautions
1. Do not use the products for other purposes than those listed.
2. Be sure to provide an appropriate fail-safe function on your product to prevent an
additional damage that may be caused by the abnormal function or the failure of the
product.
3. This product has been manufactured without any ozone chemical controlled under the
Montreal Protocol.
4. These products are not intended for uses other than under the special conditions shown
below. Before using these products under such special conditions, carefully check their
performance and reliability under the said special conditions to determine whether or not
they can be used in such a manner:
– In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash.
– In direct sunlight, outdoors, or in a dusty environment.
– In an environment where condensation occurs.
– In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2,
SO2, H2S, NH3, and NOX).
5. If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products. They may not be able to provide
normal performance even if their electronic characteristics and appearances appear
satisfactory.
6. When you have any question or uncertainty, contact Panasonic.
5.7 Life Support Policy
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support
appliances, devices, or systems where malfunction can reasonably be expected to result in a
significant personal injury to the user, or as a critical component in any life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
Panasonic customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any
damages resulting.
PAN9026 Wi-Fi/BT Module
6 Regulatory and Certification Information
Product Specification Rev. 1.0 Page 78
6 Regulatory and Certification Information
6.1 RoHS And REACH Declaration
The latest declaration of environmental compatibility (RoHS and REACH) for supplied products
can be found on the Panasonic website in the “Downloads” section of the respective product
7.3.2 Product Information.
PAN9026 Wi-Fi/BT Module
7 Appendix
Product Specification Rev. 1.0 Page 79
7 Appendix
7.1 Ordering Information
Variants and Versions
Order Number
Brand Name
Description
MOQ21
ENWF9201A1EF
PAN9026
Wif-Fi/Bluetooth radio module IEEE 802.11 a/b/g/n
BT/BLE 5.0 with a ceramic chip-antenna, US version22
1 000
ENWF9202A1EF
PAN9026
Wif-Fi/Bluetooth radio module IEEE 802.11 a/b/g/n
BT/BLE 5.0 with a ceramic chip-antenna, EU version23
1 000
ENWF9201AZEF
PAN9026-ETU
PAN9026 SDIO Adapter with module ENWF9201A1EF
1
ENWF9201AYEF
PAN9026-KIT
PAN9026 Kit: 2x PAN9026 SDIO Adapter with module
ENWF9201A1EF and 1x Case
1
For further information please refer to our product documentation 7.3.2 Product Information.
21
Abbreviation for Minimum Order Quantity (MOQ). The standard MOQ for mass production is 1 000 pieces, fewer only on
customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels.
22
The US version is restricted to FCC regulatory domain with blocked country code and Tx power table. The device does not
support the channels 12 -13 in the 2.4 GHz band and any non-US channels.
23
The EU version has preset the country code and Tx power table for European regulatory domain ETSI. The country code
and Tx power table are not blocked and additionally the country codes and Tx power tables for Canada and US can be set.
PAN9026 Wi-Fi/BT Module
7 Appendix
Product Specification Rev. 1.0 Page 80
7.2 Acronyms and Abbreviations
ACK ...................................................................................................................... Acknowledgment
ACL............................................................................................... Asynchronous Connection-Less
AES ............................................................................................... Advanced Encryption Standard
AFH ................................................................................................... Adaptive Frequency Hopping
AGC ............................................................................................................ Automatic Gain Control
A-MPDU .................................................................................. Aggregate-MAC Protocol Data Unit
AoA .......................................................................................................................... Angle of Arrival
AoD.................................................................................................................... Angle of Departure
AP ............................................................................................................................... Access Point
BCA .................................................. Beacon Collision Avoidance, Bluetooth Coexistence Arbiter
BCC ...................................................................................................... Binary Convolutional Code
BD......................................................................................................................... Bluetooth Device
BER ........................................................................................................................... Bit Error Rate
BPSK ..................................................................................................... Binary Phase Shift Keying
BR................................................................................................................................... Basic Rate
BSS ..................................................................................................................... Basic Service Set
BT ..................................................................................................................................... Bluetooth
BTSIG .......................................................................................... Bluetooth Special Interest Group
BW .................................................................................................................................. Bandwidth
CCK .................................................................................................. Complementary Code Keying
CCMP ............................................................................................... CTR with CBC-MAC Protocol
CDM ........................................................................................................... Charged Device Model
CIS......................................................................................................... Card Information Structure
CMAC ....................................................................... Cipher-Based Message Authentication Code
CMD ................................................................................................................................ Command
CMOS ....................................................................... Complementary Metal-Oxide-Semiconductor
CPU ........................................................................................................... Central Processing Unit
CQD............................................................................................................ Channel Quality Driven
CR .................................................................................................................................. Code Rate
CRC ......................................................................................................... Cyclic Redundancy Code
CTR .......................................................................................................................... Counter Mode
CTS .......................................................................................................................... Clear To Send
DCF ............................................................................................ Distributed Coordination Function
DFS ................................................................................................. Dynamic Frequency Selection
DPSK .............................................................................................. Differential Phase Shift Keying
DQPSK ........................................................................ Differential Quadrature Phase Shift Keying
DSSS ....................................................................................... Direct Sequence Spread Spectrum
DTIM ........................................................................................ Delivery Traffic Indication Message
EDCA .................................................................................Enhanced Distributed Channel Access
EDR ................................................................................................................ Enhanced Data Rate
EPC ......................................................................................................... Enhanced Power Control
ES ................................................................................................................. Engineering Samples
eSCO ..................................................................... Embedded Synchronous Connection-Oriented
ESD ........................................................................................................... Electro Static Discharge
EVM ............................................................................................................ Error Vector Magnitude
FER ..................................................................................................................... Frame Error Rate
FIFO ...................................................................................................................... First In-First Out
GFSK .............................................................................. Gaussian Frequency Shift Key or Keying
GI ............................................................................................................................. Guard Interval
GPIO................................................................................................................ General Purpose IO
HBM..................................................................................................................Human Body Model
HT ......................................................................................................................... High Throughput
IB ........................................................................................................................................ In-Band
IO ................................................................................................................................ Input Output
ISM .............................................................................................. Industrial, Scientific, and Medical
PAN9026 Wi-Fi/BT Module
7 Appendix
Product Specification Rev. 1.0 Page 81
JEDEC ....................................................................... Joint Electronic Device Engineering Council
LE ................................................................................................................................ Low Energy
LGI ................................................................................................................... Long Guard Interval
LNA.................................................................................................................. Low Noise Amplifier
LP ................................................................................................................................. Low Power
LSB ...................................................................................................................Least Significant Bit
LTE ................................................................................................................. Long Term Evolution
MAC........................................................................................................... Medium Access Control
MCS.............................................................................................. Modulation and Coding Scheme
MOQ ......................................................................................................... Minimum Order Quantity
MPDU ........................................................................................................ MAC Protocol Data Unit
MSDU ......................................................................................................... MAC Service Data Unit
MWS .......................................................................................................... Mobile Wireless System
OEM ......................................................................................... Original Equipment Manufacturers
OFDM ........................................................................ Othorgonal Frequency Division Multiplexing
OOB............................................................................................................................. Out-Of-Band
OTP ........................................................................................... One Time Programmable Memory
PA .......................................................................................................................... Power Amplifier
PAN ............................................................................................................ Personal Area Network
PBU .................................................................................................................. Peripheral Bus Unit
PCB ................................................................................................................ Printed Circuit Board
PCM............................................................................................................ Pulse Code Modulation
PDn.............................................................................................................................. Power Down
PER ..................................................................................................................... Packet Error Rate
PHY .......................................................................................................................... Physical Layer
PLR...................................................................................................................... Packet Loss Rate
PPEC ............................................................................................ Pitch Period Error Concealment
PTA........................................................................................................... Packet Traffic Arbitration
QAM .......................................................................................... Quadrature Amplitude Modulation
QoS ..................................................................................................................... Quality of Service
QPSK ............................................................................................ Quadrature Phase Shift Keying
RH ....................................................................................................................... Relative Humidity
RIFS ..................................................................................................... Reduced Interframe Space
RSL.............................................................................................................. Received Signal Level
RSSI ........................................................................................... Recieve Signal Strength Indicator
RX.................................................................................................................... Receive or Receiver
RXD ............................................................................................. Request To Send, Receive Data
SCO .......................................................................................... Synchronous Connection-Oriented
SDIO ..................................................................................................... Secure Digital Input Output
SGI .................................................................................................................. Short Guard Interval
SISO ...................................................................................................... Single Input Single Output
SMT ................................................................................................................. Surface Mount Type
STA....................................................................................................................................... Station
STBC ..................................................................................................... Space-Time-Block-Coding
STD ................................................................................................................................... Standard
TIM ................................................................................................................ Traffic Indication Map
TKIP............................................................................................... Temporal Key Integrity Protocol
TX ............................................................................................................... Transmit or Transmitter
TXD ........................................................................................................................... Transmit Data
UART ...................................................................... Universal Asynchronous Receiver Transmitter
UDP .......................................................................................................... User Datagram Protocol
WAPI ................................................................... WLAN Authentication and Privacy Infrastructure
WBS ................................................................................................................... Wideband Speech
WCI-2 ......................................................................................... Wireless Coexistence Interface 2
WEP ........................................................................................................ Wired Equivalent Privacy
WLAN ................................................................................................ Wireless Local Area Network
WPA ........................................................................................................... Wi-Fi Protected Access
PAN9026 Wi-Fi/BT Module
7 Appendix
Product Specification Rev. 1.0 Page 82
7.3 Contact Details
7.3.1 Contact Us
Please contact your local Panasonic Sales office for details on additional product options and
services:
For Panasonic Sales assistance in the EU, visit
https://eu.industrial.panasonic.com/about-us/contact-us
Email: wireless@eu.panasonic.com
For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support Tool to
find assistance near you at
https://na.industrial.panasonic.com/distributors
Please visit the Panasonic Wireless Technical Forum to submit a question at
https://forum.na.industrial.panasonic.com
7.3.2 Product Information
Please refer to the Panasonic Wireless Connectivity website for further information on our
products and related documents:
For complete Panasonic product details in the EU, visit
http://pideu.panasonic.de/products/wireless-modules.html
For complete Panasonic product details in North America, visit
http://www.panasonic.com/rfmodules
