PCA8886TS/Q900/1,1 - NXP Semiconductors

1. General description

The PCA8886 is a low power dual channel capacitive proximity switch that uses a

patented (EDISEN) digital method to detect a change in capacitance on remote sensing

plates. Changes in the static capacitance (as opposed to dynamic capacitance changes)

are automatically compensated using continuous auto-calibration. Remo te sensing plates

(for example, conductive foil) can be connected directly to the IC1 or remotely using a

coaxial cable.

2. Features and benefits

Dynamic proximity switch

Digital processing meth od

Automatic calibration

Adjustable sensitivity, can be made very high

Adjustable response time

Wide input capacitance range (10 pF to 60 pF)

A large distance (several meters) between the sensing plate and the IC is possible

Open-drain output (P-type MOSFET, external load between pin and ground)

Output configurable as push-button, toggle, or pulse

Wide voltage operating rang e (VDD = 3 V to 9 V)

Designed for battery powered applications (IDD = 6 A, typical)

Large temperature operating range (Tamb =40 C to +85 C)

AEC-Q100 compliant for automotive applications

Available in TSSOP16

3. Applications

Proximity detection

Proximity sensing in

Door locks and grips

Portable entertainment units

Computing tablets

Switch for medical applications

Dashboard: switch to toggle menus and resetting trip counter

Switch for use in explosive environments

PCA8886

Dual channel capacitive proximity switch with

auto-calibration and large voltage operating range

Rev. 3 — 14 March 2014 Product data sheet

1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 20.

Product data sheet Rev. 3 — 14 March 2014 2 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

Vandal proof switches

Transportation: Switches in or under upholstery, leather, handles, mats, and glass

Buildings: switch in or under carpets, glass, or tiles

Sanitar y applications: use of st andard metal sa nitary p art s (for e xample, t ap) as switch

Hermetically sealed keys on a keyboard

4. Ordering information

4.1 Ordering options

5. Marking

Table 1. Ordering information

Type number Package

Name Description Version

PCA8886TS TSSOP16 plastic thin shrink small outline package;

16 leads; body width 4.4 mm PCA8886

Table 2. Ordering options

Product type number Orderable part number Sales item

(12NC) Delivery form IC

revision

PCA8886TS/Q900/1 PCA8886TS/Q900/1,1 935297325118 tape and reel, 13 inch 1

Table 3. Marking codes

Product type number Marking code

PCA8886TS/Q900/1 PCA8886

Product data sheet Rev. 3 — 14 March 2014 3 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

6. Block diagram

The PCA8886 integrates two identical capacitive proximity switches which can be configured

separately.

Fig 1. Block diagram of PCA8886

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Product data sheet Rev. 3 — 14 March 2014 4 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

7. Pinning information

7.1 Pinning

7.2 Pin description

[1] The internal regulated supply voltage outputs must be decoupled with a decoupling capacitor to VSS[1:2].

Top view. For mechanical details, see Figure 16.

Fig 2. Pin configuration of PCA8886TS (TSSOP16)

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Table 4. Pin description

Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified.

Symbol Pin Type Description

TSSOP16

(PCA8886TS)

IN1 1 analog input/outpu t sensor input 1

TYPE1 2 input select output configuration of pi n OUT1

CPC1 3 analog input/output sensitivity setting 1

VSS1 4 supply ground supply voltage 1

IN2 5 analog input/outpu t sensor input 2

TYPE2 6 input select output configuration of pi n OUT2

CPC2 7 analog input/output sensitivity setting 2

VSS2 8 supply ground supply voltage 2

VDD2 9 supply supply voltage 2

OUT2 10 output switch output 2

CLIN2 11 analog input/outpu t sampling rate setting 2

VDD(INTREGD)2[1] 12 supply internal regulated supply voltage

output 2

VDD1 13 supply supply voltage 1

OUT1 14 output switch output 1

CLIN1 15 analog input/outpu t sampling rate setting 1

VDD(INTREGD)1[1] 16 supply internal regulated supply voltage

output 1

Product data sheet Rev. 3 — 14 March 2014 5 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

8. Functional description

Figure 3 and Figure 4 show the functional principle of one channel of the PCA8886.

The discharge time (t dch) of a chip-inter nal RC timing circuit, to which the external sensing

plates are conn ec te d via pin s IN[1 :2 ], is compared to the disch a rg e time (tdch(ref)) of a

second chip-inte rn al re fe re nc e RC tim ing circuit. Both RC timing circuits are periodically

charged from VDD(INTREGD)[1:2] via identical switches and then discharged via a resistor to

ground (VSS). Both switches are synchro nized.

The charge-discharge cycle is governed by the sampling rate (fs). If the voltage of one of

the RC timing circuits falls below the inte rn al re fe re nc e vo ltage Vref, the respective

comparator output becomes LOW. The logic following the comparators determines which

comparator switches first. If the upper (reference) comparator switches, then a pulse is

given on CUP. If the lower (input) comp arat or switches first, th en a pulse is given on CDN

(see Figure 3).

The pulses control the charge on the external capacitor CCPC on pins CPC[1:2]. Every

time a pulse is given on CUP, capacitor C CPC is charged from V DD(INTREGD) for a fixed time

causing the voltage on CCPC to rise. Likewise when a pulse occurs on CDN, capacitor

CCPC is connected to a current sink to ground for a fixed time causing the voltage on CCPC

to fall.

Fig 3. Functional diagram of the sensor logic (one channel)

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Product data sheet Rev. 3 — 14 March 2014 6 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

If the capacitance on pins IN[1:2] increases, the discharge time tdch increases too.

Therefore it takes longer for the voltage on the corresponding comparator to drop below

Vref. Only once this happens, the comparator output becomes LOW and this results in a

pulse on CDN discharging the external capacitor CCPC slightly. Thus most pulses will now

be given by CUP. Without furt he r ac tion, capacitor CCPC would then fully charge.

However, a chip-internal automatic calibration mechanism that is based on a voltage

controlled sink current (Isink) connected to pins IN[1:2] attempts to equalize the discharge

time tdch with the internal reference discharge time tdch(ref). The current source is

controlled by the voltage on CCPC which causes the capacitance on pins IN[1:2] to be

discharged more quickly in the case that the voltage on CCPC is rising, thereb y

compensating for the increase in capacitance on input pins IN[1:2]. This arrangement

constitutes a closed-loop control system that constantly attempts to equalize the

discharge time tdch with tdch(ref). This allows compensatin g for slow changes in

capacitance on input pins IN[1:2]. Fast changes due to an approaching hand for example

will not be compensated. In the equilibrium state, the discharge times are equal and the

pulses alternate between CUP and CDN.

From this also follows, that an increase in capacitor value CCPC results in a smaller

voltage change per pulse CUP or CDN. Thus the compensation due to internal current

sink source Isink is slower and therefor e the se nsitivity of the sensor incre ases. Likewise a

decrease in capacitor CCPC results in a lower sensitivity. (For further informa tion se e

Section 14.)

CSENS = sensing plate capacitance.

CCABLE = cable capacitance.

RC= external pull-down resistor.

RF= low pass filter resistor.

CF= low pass filter capacitor.

Fig 4. Functional principle of one channel of the PCA8886

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Product data sheet Rev. 3 — 14 March 2014 7 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

The counter, following the sensor logic depicted in Figure 3, counts the pulses of CUP or

CDN respectively. The counter is r eset every time the pulse sequence changes fr om CUP

to CDN or the other way around. Pins OUT[1:2] will only be activated when enough

consecutive CUP or CDN pulses occur. Low-level interference or slow changes in the

input capacitance do not cause the output to switch.

Various measures, such as asymmetrical charge and discharge steps, are taken to

ensure that the output switches off correctly. A special start-up circuit ensu res that the

device reaches equilibrium quickly when the supply is attached.

Pins OUT[1:2] are open-drain outputs capable of pulling an external load Rext

(at maximum current of 20 mA) up to VDD. The load resistor must be dimensioned

appropriately, taking the maximum expected VDD voltage into account. The output will be

automatically deactivated (short circuit protection) for loads in excess of 30 mA. Pins

OUT[1:2] can also drive CMOS inputs without connection of the external load.

A small internal 150 nA current sink Isink enables a full voltag e swing to t ake place on pins

OUT[1:2], even if no load resistor is connected. This is useful for dr iving pu re ly capacitive

CMOS inputs. The falling slope can be fairly slow in this mode, depending on load

capacitance.

The sampling rate (fs) corresponds to half of the frequency used in the RC timing circuit.

The sampling rate can be adjusted within a specified range by selecting the value of

CCLIN. The oscillator frequency is internally modulated by 4 % using a pseudo random

signal. This prev en ts interfer ence c aus e d by local AC-f ield s.

8.1 Output switching modes

The output switching behavior can be selected using pins TYPE[1:2] (see Figure 5)

•Push-button (TYPE[1:2] connected to VSS[1:2]): The output OUT is active as long as

the capacitive event2 lasts.

•Toggle (TYPE[1:2] connected to VDD(INTREGD)[1:2]): The output OUT is activated by the

first capacitive event and deactivated by a following capacitive event.

•Pulse (CTYPE connected between TYPE[1:2] and VSS[1:2]): The output OUT is

activated for a defined time at each capacitive event. The pulse duration is

determined by the value of CTYPE and is approximately 2.5 ms/nF.

A typical value for CTYPE is 4.7 nF which results in an output pulse duration of about

10 ms. The maximum value of CTYPE is 470 nF which results in a pulse duration of

about 1 s. Capacitive events are ignored that occur during the time the output is active.

Figure 5 illustrates the switching behavior for the output switching modes. Additionally the

graph illustrates, that short-term disturbances on the sensor are suppressed by the circuit.

2. A capacitive event is a dynamic increase of capacitance at the sensor input pins IN[1:2].

Product data sheet Rev. 3 — 14 March 2014 8 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

8.2 Voltage regulator

The PCA8886 implements a chip-internal voltage regulator supplied by pins VDD[1:2] that

provides an internal supp ly (VDD(INTREGD)), limited to a maximum of 4.6 V. Figure 6 sh ows

the relationsh ip be tween VDD[1:2] and VDD(INTREGD)[1:2].

9. Safety notes

Fig 5. Switching modes timing diagram of PCA8886

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CAUTION

This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling

electrostatic sensitive devices.

Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or

equivalent standards.

Product data sheet Rev. 3 — 14 March 2014 9 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

10. Limiting values

[1] Pass level; Human Body Model (HBM) according to Ref. 7 “ JESD22-A114”.

[2] Pass level; Charged-Device Model (CDM), according to Ref. 8 “JESD22-C101”.

[3] Pass level; latch-up testing, according to Ref. 9 “JESD78” at maximum ambient temperature (Tamb(max) =+85C).

[4] According to the store and transport requirements (see Ref. 12 “UM10569”) the devices have to be stored at a temperature of +8 C to

+45 C and a humidity of 25 % to 75 %.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDD supply voltage 0.5 +9 V

VIinput voltage on pins IN[1:2], TYPE[1:2],

CPC[1:2] 0.5 VDD(INTREGD) +0.5 V

IOoutput current on pins OUT[1:2] 10 +50 mA

ISS ground supply current 10 +50 mA

IIinput current on any other pin 10 +10 mA

Ptot total power dissipation - 100 mW

VESD electrostatic discharge

voltage HBM [1] -2500 V

CDM [2] -1000 V

Ilu latch-up current [3] - 100 mA

Tstg storage temperature [4] 60 +125 C

Tamb ambient temperature operating device 40 +85 C

Product data sheet Rev. 3 — 14 March 2014 10 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

11. Static characteristics

[1] When the input capacitance range is limited to 10 pF  Ci40 pF or an external pull-do wn resistor RC is used, the device can be

operated down to VDD = 3.0 V over the full temperature range.

[2] Idle state is the steady state after completed power-on without any activity on the sensor plate and the voltage on the reservoir capacitor

CCPC settled.

[3] For reliability reasons, the average output current must be limited to 4.6 mA at 70 C and 3.0 mA at 85 C.

[4] External ceramic chip capacitor recommended (see Figure 15).

Table 6. Static characteristics

VDD = 5 V, Tamb = +25

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C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VDD supply voltage [1] 3.0 - 9.0 V

VDD(INTREGD) internal regulated supply voltage 3.0 4.0 4.6 V

VDD(INTREGD) internal regulated supply voltage

variation regulator voltage drop - 10 50 mV

IDD supply current idle state;

fs = 1 kHz [2] -610 A

idle state;

fs = 1 kHz;

VDD =3.0V

[2] -4.47 A

Isink sink current internal constant current

to VSS[1:2]

-150- nA

VOoutput voltage on pins OUT[1:2];

pull-up voltage 0V

DD 9.0 V

IOoutput current P-MOS [3] 01020 mA

short circuit protection

VO  0.6 V 20 30 50 mA

Vsat saturation voltage on pins OUT[1:2];

IO = +10 mA 0.1 0.2 0.4 V

on pins OUT[1:2];

IO = +10 mA;

VDD =3.0V

0.1 0.3 0.5 V

Cdec decoupling capacitance on pins VDD(INTREGD)[1:2] [4] 100 - 220 nF

VIinput voltage on pins CPC[1:2] 0.6 - VDD(INTREGD) 0.5 V

Product data sheet Rev. 3 — 14 March 2014 11 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

12. Dynamic characteristics

13. Characteristic curves

13.1 Power consumption

Table 7. Dynamic characteristics

VDD = 5 V, CCLIN = 22 pF, CCPC = 470 nF, Tamb = +25



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

CCLIN capacitance on pin CLIN 0 22 100 pF

CCPC capacitance on pin CPC X7R ceramic chip capacitor 90 470 2500 nF

Nres(dig)eq equivalent digital resolution - 14 - bit

CTYPE capacitance on pin TYPE 0.1 - 470 nF

Ciinput capacitance sensing plate and connecting cable 10 - 60 pF

sensing plate and connecting cable;

Tamb =40 Cto+85C;

VDD =3.0V

10 - 40 pF

tstartup start-up time until normal operation is established - 0.5 - s

tppulse duration on pins OUT[1:2];

in pulse mode;

CTYPE 10 nF

-2.5-ms/nF

fssampling frequency CCLIN = 0 pF -3.3-kHz

CCLIN = 22 pF (typical value) - 1 - kHz

CCLIN = 100 pF - 275 - Hz

tsw switching time at fs = 1 kHz - 64 - ms

Idle state; fs=1kHz; T

amb =25C.

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Product data sheet Rev. 3 — 14 March 2014 12 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

Idle state; fs=1kHz.

Fig 8. IDD with respect to temperature

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amb =25C.

Fig 9. IDD with respect to sampling frequency (fs)

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Product data sheet Rev. 3 — 14 March 2014 13 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

13.2 Typical reaction time

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Fig 10. Switching time (tsw) with respect to sampling frequency (fs)

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Fig 11. Switching time (tsw) with respect to capacitor (CCLIN) on pins CLIN[1:2]

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Product data sheet Rev. 3 — 14 March 2014 14 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

13.3 Reservoir capacitor voltage

VDD =6V.

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VI(CPC) = input voltage on pins CPC[1:2].

CIN = capacitor on pins IN[1:2].

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Product data sheet Rev. 3 — 14 March 2014 15 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

14. Application information

Figure 15 shows the typical connections for a general application3. The positive supply is

connected to pins VDD[1:2]. It is recommended to connect smoothing capacitors to ground

to both VDD[1:2] and VDD(INTREGD)[1:2] (values for Cdec, see Table 6).

VDD =6V.

VI(CPC) = input voltage on pins CPC[1:2]

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“UM10505”.

Product data sheet Rev. 3 — 14 March 2014 16 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

The sampling rate is determined by the capacitance CCLIN on pins CLIN[1:2]. A higher

sampling rate red uc es the re ac tio n tim e an d inc re as es th e cu rr en t con su m ptio n .

The sensing plate capacitance CSENS may consist of a small metal area, for example

behind an isolating layer. The sensing plate can be connected to a coaxial cable (CCABLE)

which in turn is connected to the input pins IN[1:2]. Alternatively, the sensing plate can be

directly connected to the in put pins IN[1:2]. An internal low pa ss filter is used to reduce RF

interference. An additional low pass filter consisting of a resistor RF and capacitor CF can

be added to the in put to fur t her impro ve RF immunity as required. For good performance,

the total amount of capacitance on the input (CSENS +C

CABLE +C

F) should be in the

proper range, the optimum point being around 30 pF. These conditions allow the control

loop to adapt to the static capacitance on CSENS and to compensate for slow changes in

the sensing plate cap acitance. A higher capacitive input loading is possible if an additional

discharge resistor RC is placed as shown in Figure 15. Resistor RC simply reduces the

CSENS = sensing plate capacitance.

The coaxial cable is optional.

Fig 15. Typical application

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Product data sheet Rev. 3 — 14 March 2014 17 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

discharge time such that the internal timing requirements are fulfilled.

The sensitivity of the sensor can be influenced by the sensing plate area and capacitor

CCPC. The sensitivity is significantly reduced when CCPC is reduced. When maximum

sensitivity is desired CCPC can be increased, but this also increases sensitivity to

interference. Pins CPC[1:2] has high-impedance and is sensitive to leakage currents.

Remark: CCPC should be a high-quality foil or ceramic capacitor, for example an

X7R type.

For the choice of proper component values for a given application, the component

specifications in Table 6 and Table 7 must be followed.

15. Test information

15.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated

circuits, and is suitable for use in automotive applications.

Product data sheet Rev. 3 — 14 March 2014 18 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

16. Package outline

Fig 16. Package outline of PCA8886TS (TSSOP16)

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Product data sheet Rev. 3 — 14 March 2014 19 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

17. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that

all normal precautions are taken as described in JESD625-A, IEC61340-5 or equivalent

standards.

Product data sheet Rev. 3 — 14 March 2014 20 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

18. Packing information

18.1 Tape and reel information

Fig 17. Carrier tape details for PCA8886

Table 8. Carrier t ape dimensions of PCA8886

Symbol Description Value Unit

Compartments

A0 pocket width in x directi o n 6 .9 mm

B0 pocket width in y directi o n 5 .6 mm

K0 pocket depth 1.5 to 1.6 m m

P1 pocket hole pitc h 8 mm

D1 pocket hole diameter 1.5 to 1.6 mm

Overall dimensions

W tape width 12 mm

D0 sprocket hole diameter 1.5 to 1.55 mm

P0 sprocket hole pitch 4 mm

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Product data sheet Rev. 3 — 14 March 2014 21 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

19. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

19.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

19.2 Wave and reflow soldering

W ave soldering is a joinin g technology in which the joint s are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

•Board specifications, including the board finish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering versus SnPb soldering

19.3 Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath specifications, including temperature and impurities

Product data sheet Rev. 3 — 14 March 2014 22 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

19.4 Reflow soldering

Key characteristics in reflow soldering are:

•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to

higher minimum peak temperatures (see Figure 18) than a SnPb process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enoug h for the solder to make reliable solder joint s (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 9 and 10

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 18.

Table 9. SnPb eutectic process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm3)

< 350  350

< 2.5 235 220

 2.5 220 220

Table 10. Le ad-free process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 3 — 14 March 2014 23 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

20. Abbreviations

MSL: Moisture Sensitivity Level

Fig 18. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 11. Abbreviations

Acronym Description

CMOS Comp lementary Metal Oxide Semiconductor

HBM Human Body Model

IC Integrated Circuit

MM Machine Model

MOS Metal Oxide Semiconductor

MOSFET Metal–Oxide–Semiconductor Field-Effect Transisto r

MSL Moisture Sensitivity Level

PCB Printed-Circuit Board

RC Resistance-Capacitance

RF Radio Frequency

SMD Surface Mount Device

Product data sheet Rev. 3 — 14 March 2014 24 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

21. References

[1] AN10365 — Surface mount reflow soldering description

[2] AN10832 — PCF8883 - capacitive proximity switch with auto-calibration

[3] AN11122 — Water and condensatio n safe touc h se nsing with the NXP

capacitive touch sensors

[4] IEC 60134 — Rating systems for electronic tubes and valves and analogous

semiconductor devices

[5] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena

[6] IPC/JEDEC J-STD-020D — Moisture/R eflow Sensitivity Classific ation for

Nonhermetic Solid State Surface Mount Devices

[7] JESD22 -A 114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body

Model (HBM)

[8] JESD22 -C 10 1 — Field-Induced Charged-Device Model Test Method for

Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components

[9] JESD78 — IC Latch-Up Test

[10] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive

(ESDS) Devices

[11] UM10505 — OM11057 quick start guide

[12] UM10569 — Store and transport requirements

Product data sheet Rev. 3 — 14 March 2014 25 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

22. Revision history

Table 12. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PCA8886 v.3 20140314 Product data sheet - PCA8886 v.2

Modifications: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Emphasized the X7R statement (Section 14)

•Added Section 9

•Added Input or input/output statement in Table 4

•Enhanced ordering informa tion in Table 2

•Corrected Figure 6

PCA8886 v.2 20120920 Product data sheet - PCA8886 v.1

PCA8886 v.1 20111123 Objective data sheet - -

Product data sheet Rev. 3 — 14 March 2014 26 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

23. Legal information

23.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

23.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

23.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. Unless ot herwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, lif e-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 3 — 14 March 2014 27 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

No offer to sell or license — Nothing in this document may be interpret ed or

construed as an of fer to sell product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English version s.

23.4 Licenses

23.5 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

24. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

ICs with cap acitive sensing functionality

This NXP Semiconductors IC is made under license to European Patent

No. 0723339, owned by EDISEN - SENSOR SYSTEME GmbH & CO KG

and counterparts. Any license fee is included in the purchase price.

Product data sheet Rev. 3 — 14 March 2014 28 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

25. Tables

Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .2

Table 2. Ordering options. . . . . . . . . . . . . . . . . . . . . . . . .2

Table 3. Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2

Table 4. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4

Table 5. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .9

Table 6. Static characteristics . . . . . . . . . . . . . . . . . . . .10

Table 7. Dynamic characteristics . . . . . . . . . . . . . . . . . .11

Table 8. Carrier tape dimensions of PCA8886 . . . . . . .20

Table 9. SnPb eutectic process (from J-STD-020D) . . .22

Table 10. Lead-free process (from J-STD-020D) . . . . . .22

Table 11. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .23

Table 12. Revision history . . . . . . . . . . . . . . . . . . . . . . . .25

Product data sheet Rev. 3 — 14 March 2014 29 of 30

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

26. Figures

Fig 1. Block diagram of PCA8886 . . . . . . . . . . . . . . . . . .3

Fig 2. Pin configuration of PCA8886TS (TSSOP16) . . . .4

Fig 3. Functional diagram of the sensor logic (one

channel). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Fig 4. Functional principle of one channel

of the PCA8886 . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Fig 5. Switching modes timing diagram of PCA8886. . . .8

Fig 6. Integrated voltage regulator. . . . . . . . . . . . . . . . . .8

Fig 7. IDD with res pect to VDD . . . . . . . . . . . . . . . . . . . .11

Fig 8. IDD with respect to temperature . . . . . . . . . . . . . .12

Fig 9. IDD with respect to sampling frequency (fs) . . . . .12

Fig 10. Switching time (tsw) with respect to sampling

frequency (fs) . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Fig 11. Switchin g time (tsw) with respect to capacitor

(CCLIN) on pins CLIN[1:2] . . . . . . . . . . . . . . . . . .13

Fig 12. Switching time (tsw) with respect to temperature .14

Fig 13. Input voltage on pins CPC[1:2] (VI(CPC))

with respect to capacitor (CIN) on pins IN[1:2] . .14

Fig 14. In put voltage (VI(CPC)) on pins CP C[1:2]

with respect to temperature . . . . . . . . . . . . . . . . .15

Fig 15. Typical application . . . . . . . . . . . . . . . . . . . . . . . .16

Fig 16. Package outline of PCA8886TS (TSSOP16). . . .18

Fig 17. Carrier tape details for PCA8886. . . . . . . . . . . . .20

Fig 18. Temperature profiles for large and small

components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

NXP Semiconductors PCA8886

Dual channel capacitive proximity switch with auto-calibration

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 14 March 2014

Document identifier: PCA8886

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

27. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2

5 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Functional description . . . . . . . . . . . . . . . . . . . 5

8.1 Output switching modes . . . . . . . . . . . . . . . . . . 7

8.2 Voltage regulator. . . . . . . . . . . . . . . . . . . . . . . . 8

9 Safety notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9

11 Static characteristics. . . . . . . . . . . . . . . . . . . . 10

12 Dynamic characteristics . . . . . . . . . . . . . . . . . 11

13 Characteristic curves . . . . . . . . . . . . . . . . . . . 11

13.1 Power consumption . . . . . . . . . . . . . . . . . . . . 11

13.2 Typical reaction time. . . . . . . . . . . . . . . . . . . . 13

13.3 Reservoir capacitor voltage . . . . . . . . . . . . . . 14

14 Application information. . . . . . . . . . . . . . . . . . 15

15 Test information. . . . . . . . . . . . . . . . . . . . . . . . 17

15.1 Quality information . . . . . . . . . . . . . . . . . . . . . 17

16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18

17 Handling information. . . . . . . . . . . . . . . . . . . . 19

18 Packing information . . . . . . . . . . . . . . . . . . . . 20

18.1 Tape and reel information. . . . . . . . . . . . . . . . 20

19 Soldering of SMD packages . . . . . . . . . . . . . . 21

19.1 Introduction to soldering . . . . . . . . . . . . . . . . . 21

19.2 Wave and reflow soldering . . . . . . . . . . . . . . . 21

19.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 21

19.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 22

20 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 23

21 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

22 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 25

23 Legal information. . . . . . . . . . . . . . . . . . . . . . . 26

23.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26

23.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

23.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 26

23.4 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

23.5 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 27

24 Contact information. . . . . . . . . . . . . . . . . . . . . 27

25 Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

26 Figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

27 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Mouser Electronics

Authorized Distributor

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NXP:

PCA8886TS/Q900/1,1