VIN VOUT
1x GAIN
VDC
VDD
GND
GND
DIAPHRAGM
AIRGAP
BACKPLATE
ELECTRET
CONNECTOR
LMV1032
x
x
x
x
x
x
x
x
xxx
x
xx
x
IC
VCC
VOUT
LMV1032
www.ti.com
SNAS233G –DECEMBER 2003–REVISED MAY 2013
LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones
Check for Samples: LMV1032
1FEATURES DESCRIPTION
The LMV1032s are an audio amplifier series for small
2• (Typical LMV1032-15, 1.7V Supply; Unless form factor electret microphones. They are designed
Otherwise Noted) to replace the JFET preamp currently being used.
• Output Voltage Noise (A-weighted) −89 dBV The LMV1032 series is ideal for extended battery life
• Low Supply Current 60 μAapplications, such as a Bluetooth communication link.
The addition of a third pin to an electret microphones
• Supply Voltage 1.7V to 5V that incorporates an LMV1032 allows for a dramatic
• PSRR 70 dB reduction in supply current as compared to the JFET
• Signal to Noise Ratio 61 dB equipped electret microphone. Microphone supply
current is thus reduced to 60 µA, assuring longer
• Input Capacitance 2 pF battery life. The LMV1032 series is specified for
• Input Impedance >100 MΩsupply voltages from 1.7V to 5V, and has fixed
• Output Impedance <200Ωvoltage gains of 6 dB, 15 dB and 25 dB.
• Max Input Signal 170 mVPP The LMV1032 series offers low output impedance
• Temperature Range −40°C to 85°C over the voice bandwidth, excellent power supply
rejection (PSRR), and stability over temperature.
• Large Dome 4-Bump DSBGA Package with
Improved Adhesion Technology. The devices are offered in space saving 4-bump ultra
thin DSBGA lead free packages and are thus ideally
APPLICATIONS suited for the form factor of miniature electret
microphone packages. These extremely miniature
• Mobile Communications - Bluetooth packages have the Large Dome Bump (LDB)
• Automotive Accessories technology. This DSBGA technology is designed for
microphone PCBs requiring 1 kg adhesion criteria.
• Cellular Phones
• PDAs
• Accessory Microphone Products
Block Diagram Electret Microphone
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2003–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMV1032
SNAS233G –DECEMBER 2003–REVISED MAY 2013
www.ti.com
Absolute Maximum Ratings(1)(2)
ESD Tolerance(3) Human Body Model 2500V
Machine Model 250V
Supply Voltage VDD - GND 5.5V
Storage Temperature Range −65°C to 150°C
Junction Temperature(4) 150°C max
Mounting Temperature Infrared or Convection (20 sec.) 235°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The Human Body Model (HBM) is 1.5 kΩin series with 100 pF. The Machine Model is 0Ωin series with 200 pF.
(4) The maximum power dissipation is a function of TJ(MAX) ,θJA and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings(1)
Supply Voltage 1.7V to 5V
Temperature Range −40°C to +85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
1.7V and 5V Electrical Characteristics(1)
Unless otherwise specified, all limits ensured for TJ= 25°C and VDD = 1.7V and 5V. Boldface limits apply at the temperature
extremes.
Symbol Parameter Conditions Min(2) Typ(3) Max(2) Units
IDD Supply Current VIN = GND 60 85 μA
100
SNR Signal to Noise Ratio VDD = 1.7V LMV1032-06 58
VIN = 18 mVPP LMV1032-15 61
f = 1 kHz LMV1032-25 61 dB
VDD = 5V LMV1032-06 59
VIN = 18 mVPP LMV1036-15 61
f = 1 kHz LMV1032-25 62
PSRR Power Supply Rejection Ratio 1.7V < VDD < 5V LMV1032-06 65 75
60
LMV1032-15 60 70 dB
55
LMV1032-25 55 65
50
VIN Max Input Signal f = 1 kHz and THD+N < LMV1032-06 300
1% LMV1032-15 170 mVPP
LMV1032-25 60
fLOW Lower −3 dB Roll Off Frequency RSOURCE = 50Ω70 Hz
VIN = 18 mVPP
fHIGH Upper −3 dB Roll Off Frequency RSOURCE = 50ΩLMV1032-06 120 kHz
VIN = 18 mVPP LMV1032-15 75
LMV1032-25 21
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ= TA. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where TJ> TA.
(2) All limits are specified by design or statistical analysis.
(3) Typical values represent the most likely parametric norm.
2Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated
Product Folder Links: LMV1032
A1
GND
B2
VCC
B1
INPUT
X
A2
OUTPUT
LMV1032
www.ti.com
SNAS233G –DECEMBER 2003–REVISED MAY 2013
1.7V and 5V Electrical Characteristics(1) (continued)
Unless otherwise specified, all limits ensured for TJ= 25°C and VDD = 1.7V and 5V. Boldface limits apply at the temperature
extremes.
Symbol Parameter Conditions Min(2) Typ(3) Max(2) Units
enOutput Noise A-Weighted LMV1032-06 −97
LMV1032-15 −89 dBV
LMV1032-25 −80
VOUT Output Voltage VIN = GND LMV1032-06 100 300 500
LMV1032-15 250 500 750 mV
LMV1032-25 300 600 1000
ROOutput Impedance f = 1 kHz <200 Ω
IOOutput Current VDD = 1.7V, VOUT = 1.7V, Sinking 0.9 2.3
0.5
VDD = 1.7V, VOUT = 0V, Sourcing 0.3 0.64
0.2 mA
VDD = 5V, VOUT = 1.7V, Sinking 0.9 2.4
0.5
VDD = 5V, VOUT = 0V, Sourcing 0.4 1.46
0.1
THD Total Harmonic Distortion f = 1 kHz LMV1032-06 0.11
VIN = 18 mVPP LMV1032-15 0.13 %
LMV1032-25 0.35
CIN Input Capacitance 2 pF
ZIN Input Impedance >100 MΩ
AVGain f = 1 kHz LMV1032-06 5.5 6.2 6.7
VIN = 18 mVPP 4.5 7.7
LMV1032-15 14.8 15.4 16 dB
14 17
LMV1032-25 24.8 25.5 26.2
24 27
Connection Diagram
Large Dome 4-Bump DSBGA
Figure 1. Top View
Note:
• Pin numbers are referenced to package marking text orientation.
• The actual physical placement of the package marking will vary slightly from part to part. The package will
designate the date code and will vary considerably. Package marking does not correlate to device type in any
way.
Copyright © 2003–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LMV1032
10 1k 1M
FREQUENCY (Hz)
-15
-5
5
20
GAIN (dB)
100k
10k
100
15
0
-10
10
PHASE
GAIN
150
300
450
400
250
200
350
PHASE (°)
10 1k 1M
FREQUENCY (Hz)
-15
-5
30
GAIN (dB)
100k
10k
100
20
15
-10
25
10
5
0
150
450
400
350
200
300
250
PHASE (°)
GAIN
PHASE
1.5 2 2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
50
55
60
65
70
SUPPLY CURRENT (PA)
-40°C
25°C
85°C
10.00
10 1k 1M
FREQUENCY (Hz)
-30.00
-15.00
GAIN (dB)
100k
10k
100
0.00
-5.00
-20.00
-25.00
-10.00
5.00
180
-180
-45
90
45
-90
-135
0
135
PHASE (°)
GAIN
PHASE
1.5 2 2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
45
50
55
60
65
70
SUPPLY CURRENT (PA)
85°C
25°C
-40°C
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (PA)
1.5 2 2.5 3 3.5 4 4.5 5 5.5
50
55
60
65
70
75
85°C
25°C
-40°C
LMV1032
SNAS233G –DECEMBER 2003–REVISED MAY 2013
www.ti.com
Typical Performance Characteristics
Unless otherwise specified, VS= 1.7V, single supply, TA= 25°C
Supply Current vs. Supply Voltage (LMV1032-06) Supply Current vs. Supply Voltage (LMV1032-15)
Figure 2. Figure 3. '
Supply Current vs. Supply Voltage (LMV1032-25) Closed Loop Gain and Phase vs. Frequency (LMV1032-06)
Figure 4. Figure 5.
Closed Loop Gain and Phase vs. Frequency (LMV1032-15) Closed Loop Gain and Phase vs. Frequency (LMV1032-25)
Figure 6. Figure 7.
4Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated
Product Folder Links: LMV1032
10 100 1k 10k 100k
FREQUENCY (Hz)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
THD + N (%)
VIN = 18 mVPP
10 100 1k 10k 100k
FREQUENCY (Hz)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
THD+N (%)
VIN = 18 mVPP
10 100 1k 10k 100k
FREQUENCY (Hz)
0
20
40
60
80
100
120
PSRR (dB)
10 100 1k 10k 100k
FREQUENCY (Hz)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
THD+N (%)
VIN = 18 mVPP
10 100 1k 10k 100k
FREQUENCY (Hz)
0
20
40
60
80
100
120
PSRR (dB)
10 100 1k 10k 100k
FREQUENCY (Hz)
0
20
40
60
80
100
120
PSRR (dB)
LMV1032
www.ti.com
SNAS233G –DECEMBER 2003–REVISED MAY 2013
Typical Performance Characteristics (continued)
Unless otherwise specified, VS= 1.7V, single supply, TA= 25°C
Power Supply Rejection Ratio vs. Frequency (LMV1032-06) Power Supply Rejection Ratio vs. Frequency (LMV1032-15)
Figure 8. \ Figure 9.
Power Supply Rejection Ratio vs. Frequency (LMV1032-25) Total Harmonic Distortion vs. Frequency (LMV1032-06)
Figure 10. Figure 11.
Total Harmonic Distortion vs. Frequency (LMV1032-15) Total Harmonic Distortion vs. Frequency (LMV1032-25)
Figure 12. Figure 13.
Copyright © 2003–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LMV1032
NOISE (dBV/ Hz)
10 100 1k 10k 100k
FREQUENCY (Hz)
-150
-140
-130
-120
-110
-100
-90
-80
NOISE (dBV/ Hz)
10 100 1k 10k 100k
FREQUENCY (Hz)
-150
-140
-130
-120
-110
-100
-90
-80
0 20 40 60 80
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
THD+N (%)
INPUT VOLTAGE (mVPP)
f = 1 kHz
10 100 1k 10k 100k
FREQUENCY (Hz)
-105
-100
-150
-145
-140
-135
-130
-125
-120
-115
-110
NOISE (dBV/ Hz)
0 50 100 150 200
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
THD+N (%)
INPUT VOLTAGE (mVPP)
f = 1 kHz
050 100 150 200 250 300 350 400
INPUT VOLTAGE (mVPP)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
THD+N (%)
f = 1 kHz
LMV1032
SNAS233G –DECEMBER 2003–REVISED MAY 2013
www.ti.com
Typical Performance Characteristics (continued)
Unless otherwise specified, VS= 1.7V, single supply, TA= 25°C
Total Harmonic Distortion vs.Input Voltage (LMV1032-06) Total Harmonic Distortion vs. Input Voltage (LMV1032-15)
Figure 14. Figure 15.
Total Harmonic Distortion vs. Input Voltage (LMV1032-25) Output Voltage Noise vs. Frequency (LMV1032-06)
Figure 16. Figure 17.
Output Voltage Noise vs. Frequency (LMV1032-15) Output Voltage Noise vs. Frequency (LMV1032-25)
Figure 18. Figure 19.
6Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated
Product Folder Links: LMV1032
10 100 1k 10k 100k
FREQUENCY (Hz)
-70
-60
-50
-40
-30
-20
-10
0
10
dBV
GND
DIAPHRAGM
AIRGAP
BACKPLATE
ELECTRET
CONNECTOR
LMV1032
x
x
x
x
x
x
x
x
xxx
x
xx
x
IC
VCC
VOUT
LMV1032
www.ti.com
SNAS233G –DECEMBER 2003–REVISED MAY 2013
APPLICATION SECTION
LOW CURRENT
The LMV1032 has a low supply current which allows for a longer battery life. The low supply current of 60µA
makes this amplifier optimal for microphone applications which need to be always on.
BUILT-IN GAIN
The LMV1032 is offered in the space saving small DSBGA package which fits perfectly into the metal can of a
microphone. This allows the LMV1032 to be placed on the PCB inside the microphone.
The bottom side of the PCB has the pins that connect the supply voltage to the amplifier and make the output
available. The input of the amplifier is connected to the microphone via the PCB.
Figure 20. Built-in Gain
A-WEIGHTED FILTER
The human ear has a frequency range from 20 Hz to about 20 kHz. Within this range the sensitivity of the human
ear is not equal for each frequency. To approach the hearing response weighting filters are introduced. One of
those filters is the A-weighted filter.
The A-weighted filter is usually used in signal-to-noise ratio measurements, where sound is compared to device
noise. It improves the correlation of the measured data to the signal-to-noise ratio perceived by the human ear.
Figure 21. A-Weighted Filter
Copyright © 2003–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LMV1032
ABSOLUTE
SOUND
PRESSURE
[dBPa]
-94dB SENSITIVITY
[dBV/Pa]
SOUND
PRESSURE
[dB SPL]
VOLTAGE
[dBV]
A-WEIGHTED FILTER
5pF
LMV1032
SNAS233G –DECEMBER 2003–REVISED MAY 2013
www.ti.com
MEASURING NOISE AND SNR
The overall noise of the LMV1032 is measured within the frequency band from 10 Hz to 22 kHz using an A-
weighted filter. The input of the LMV1032 is connected to ground with a 5 pF capacitor.
Figure 22. Noise Measurement Setup
The signal-to-noise ratio (SNR) is measured with a 1 kHz input signal of 18 mVPP using an A-weighted filter. This
represents a sound pressure level of 94 dB SPL. No input capacitor is connected.
SOUND PRESSURE LEVEL
The volume of sound applied to a microphone is usually stated as the pressure level with respect to the threshold
of hearing of the human ear. The sound pressure level (SPL) in decibels is defined by:
Sound pressure level (dB) = 20 log Pm/PO
Where,
Pmis the measured sound pressure
POis the threshold of hearing (20μPa)
In order to be able to calculate the resulting output voltage of the microphone for a given SPL, the sound
pressure in dB SPL needs to be converted to the absolute sound pressure in dBPa. This is the sound pressure
level in decibels which is referred to as 1 Pascal (Pa).
The conversion is given by:
dBPa = dB SPL + 20*log 20 μPa
dBPa = dB SPL - 94 dB
Translation from absolute sound pressure level to a voltage is specified by the sensitivity of the microphone. A
conventional microphone has a sensitivity of −44 dBV/Pa.
Figure 23. dB SPL to dBV Conversion
8Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated
Product Folder Links: LMV1032
10 1k 1M
FREQUENCY (Hz)
-15
-5
5
20
GAIN (dB)
100k
10k
100
15
0
-10
10
PHASE
GAIN
150
300
450
400
250
200
350
PHASE (°)
LMV1032
www.ti.com
SNAS233G –DECEMBER 2003–REVISED MAY 2013
Example: Busy traffic is 70 dB SPL
VOUT = 70 −94 −44 = −68 dBV
This is equivalent to 1.13 mVPP
Since the LMV1032-15 has a gain of 5.6 (15 dB) over the JFET, the output voltage of the microphone is 6.35
mVPP. By replacing the JFET with the LMV1032-15, the sensitivity of the microphone is −29 dBV/Pa (−44 + 15).
LOW FREQUENCY CUT OFF FILTER
To reduce noise on the output of the microphone a low cut filter has been implemented in the LMV1032. This
filter reduces the effect of wind and handling noise.
It's also helpful to reduce the proximity effect in directional microphones. This effect occurs when the sound
source is very close to the microphone. The lower frequencies are amplified which gives a bass sound. This
amplification can cause an overload, which results in a distortion of the signal.
Figure 24. Gain vs. Frequency
The LMV1032 is optimized to be used in audio band applications. The LMV1032 provides a flat gain response
within the audio band and offers linearity and excellent temperature stability.
ADVANTAGE OF THREE PINS
The LMV1032 ECM solution has three pins instead of the two pins provided in the case of a JFET solution. The
third pin provides the advantage of a low supply current, high PSRR and eliminates the need for additional
components.
Noise pick-up by a microphone in a cell phone is a well-known problem. A conventional JFET circuit is sensitive
for noise pick-up because of its high output impedance. The output impedance is usually around 2.2 kΩ. By
providing separate output and supply pins a much lower output impedance is achieved and therefore is less
sensitive to noise pick-up.
RF noise is among other caused by non-linear behavior. The non-linear behavior of the amplifier at high
frequencies, well above the usable bandwidth of the device, causes AM demodulation of high frequency signals.
The AM modulation contained in such signals folds back into the audio band, thereby disturbing the intended
microphone signal. The GSM signal of a cell phone is such an AM-modulated signal. The modulation frequency
of 216 Hz and its harmonics can be observed in the audio band. This type of noise is called bumblebee noise.
EXTERNAL PRE-AMPLIFIER APPLICATION
The LMV1032 can also be used outside of an ECM as a space saving external pre-amplifier. In this application,
the LMV1032 follows a phantom biased JFET microphone in the circuit. This is shown in Figure 25. The input of
the LMV1032 is connected to the microphone via the 2.2 µF capacitor. The advantage of this circuit over one
with only a JFET microphone are the additional gain and the high pass filter supplied by the LMV1032. The high
pass filter makes the output signal more robust and less sensitive to low frequency disturbances. In this
configuration the LMV1032 should be placed as close as possible to the microphone.
Copyright © 2003–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LMV1032
LMV1032
www.ti.com
SNAS233G –DECEMBER 2003–REVISED MAY 2013
REVISION HISTORY
Changes from Revision F (May 2013) to Revision G Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 10
Copyright © 2003–2013, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LMV1032
PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMV1032UP-06/NOPB ACTIVE DSBGA YPC 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
LMV1032UP-15/NOPB ACTIVE DSBGA YPC 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
LMV1032UP-25/NOPB ACTIVE DSBGA YPC 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
LMV1032UPX-06/NOPB ACTIVE DSBGA YPC 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85
LMV1032UR-15/NOPB ACTIVE DSBGA YPD 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
LMV1032UR-25/NOPB ACTIVE DSBGA YPD 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
LMV1032URX-15/NOPB ACTIVE DSBGA YPD 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85
LMV1032URX-25/NOPB ACTIVE DSBGA YPD 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2017
Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMV1032UP-06/NOPB DSBGA YPC 4 250 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1
LMV1032UP-15/NOPB DSBGA YPC 4 250 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1
LMV1032UP-25/NOPB DSBGA YPC 4 250 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1
LMV1032UPX-06/NOPB DSBGA YPC 4 3000 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1
LMV1032UR-15/NOPB DSBGA YPD 4 250 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1
LMV1032UR-25/NOPB DSBGA YPD 4 250 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1
LMV1032URX-15/NOPB DSBGA YPD 4 3000 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1
LMV1032URX-25/NOPB DSBGA YPD 4 3000 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Aug-2017
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV1032UP-06/NOPB DSBGA YPC 4 250 210.0 185.0 35.0
LMV1032UP-15/NOPB DSBGA YPC 4 250 210.0 185.0 35.0
LMV1032UP-25/NOPB DSBGA YPC 4 250 210.0 185.0 35.0
LMV1032UPX-06/NOPB DSBGA YPC 4 3000 210.0 185.0 35.0
LMV1032UR-15/NOPB DSBGA YPD 4 250 210.0 185.0 35.0
LMV1032UR-25/NOPB DSBGA YPD 4 250 210.0 185.0 35.0
LMV1032URX-15/NOPB DSBGA YPD 4 3000 210.0 185.0 35.0
LMV1032URX-25/NOPB DSBGA YPD 4 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Aug-2017
Pack Materials-Page 2
MECHANICAL DATA
YPC0004
www.ti.com
UPA04XXX (Rev C)
0.350±0.045
D
E
4215139/A 12/12
A
. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
NOTES:
D: Max =
E: Max =
1.184 mm, Min =
1.184 mm, Min =
1.123 mm
1.123 mm
www.ti.com
PACKAGE OUTLINE
C
0.395 MAX
0.155
0.115
0.5
0.5
4X 0.295
0.255
B E A
D
4215141/B 08/2016
DSBGA - 0.395 mm max heightYPD0004
DIE SIZE BALL GRID ARRAY
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
SYMM
SYMM
BALL A1
CORNER
SEATING PLANE
BALL TYP 0.05 C
12
0.015 C A B
A
B
SCALE 14.000
D: Max =
E: Max =
1.184 mm, Min =
1.184 mm, Min =
1.123 mm
1.123 mm
www.ti.com
EXAMPLE BOARD LAYOUT
4X ( 0.265)
( 0.265)
METAL 0.05 MAX
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
( 0.265)
SOLDER MASK
OPENING
0.05 MIN
(0.5)
(0.5)
4215141/B 08/2016
DSBGA - 0.395 mm max heightYPD0004
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
SOLDER MASK DETAILS
NOT TO SCALE
12
A
B
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
NON-SOLDER MASK
DEFINED
(PREFERRED) SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
4X ( 0.25) (R0.05) TYP
METAL
TYP
(0.5) TYP
(0.5) TYP
4215141/B 08/2016
DSBGA - 0.395 mm max heightYPD0004
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
12
A
B
SYMM
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:50X
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
