February 2006
Copyright © Alliance Semiconductor. All rights reserved.
®
AS7C32098A
3.3 V 128K × 16 CMOS SRAM
2/17/06, v 1.1 Alliance Semiconductor P. 1 of 10
Features
• Industrial and commercial temperature
• Organization: 13 1,072 words × 16 bits
• Center power and ground pins
• High speed
- 10/12/15/20 ns address access time
- 4/5/6/7 ns output enable access time
• Low power consumption: ACTIVE
- 650 mW /max @ 10 ns
• Low power consumption: STANDBY
-28.8 mW /max CMOS
• Individual byte read/write controls
• Easy memory expansion with CE, OE inputs
• TTL- and CMOS-compatible, three-state I/O
• 44-pin JEDEC standard packages
- TSOP 2
• ESD protection ≥ 2000 volts
• Latch-up current ≥ 200 mA
Logic block diagram
1024 × 128 × 16
Array
(2,097,152)
OE
CE
WE Column decoder
Row Decoder
A0
A1
A2
A3
A4
A6
A7
A8
V
CC
GND
A12
A5
A9
A10
A11
A14
A15
A16
A13
Control circuit
I/O1–I/O8
I/O9–I/O16
UB
LB
I/O
buffer
Pin arrangement for TSOP 2
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
I/O14
I/O13
GND
V
CC
I/O12
I/O11
I/O10
I/O9
NC
A13
A12
A11
A10
NC
A4
CE
I/O1
I/O2
I/O3
I/O4
V
CC
GND
I/O5
I/O6
I/O7
I/O8
WE
A5
A6
A7 21
22
A8
A9
UB
LB
I/O16
I/O15
2A1 3A2 4A3
1
A0
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
43
42
41
44 A15
A14
OE
A16
Selection guide –10 –12 –15 –20 Unit
Maximum address access time 10 12 15 20 ns
Maximum output enable access time 4 5 6 7 ns
Maximum operating current Industrial 180 160 140 110 mA
Commercial 170 150 130 100 mA
Maximum CMOS standby current 8 8 8 8 mA
®
AS7C32098A
2/17/06, v 1.1 Alliance Semiconductor P. 2 of 10
Functional description
The AS7C32098A is a high-performance CMO S 2,097,152-bit Static Random Access Memory (SRAM) device organized as
131,072 words × 16 bits. It is designed for memory applications where fast data access, low power, and simple interfacing are
desired.
Equal address access and cycle times (tAA, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 4/5/6/7 ns are
ideal for high-performance applications. The chip enable input CE permits easy memory expansion with multiple-bank
memory systems.
When CE is high the device enters standby mode. The device is guaranteed not to exceed 28.8mW power consumption in
CMOS standby mode. A wri te cycle is acco mplished by assert ing write enable (WE) and chip enable (CE). Data on the input
pins I/O1–I/O16 is written on the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external
devices should drive I/O pins only after outputs have been disabled with output enable (OE) or write enable (WE).
A read cycle is accomplished by asserting output enable (OE) and chip enable (CE), with write enable (WE) high. The chip
drives I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive, or
write enable is active, output drivers stay in high-impedance mode.
The device provides multiple center power and ground pins, an d separate byte enable controls, allowing individ ual bytes to be
written and read. LB controls the lower bits, I/O1–I/O8, and UB controls the higher bits , I/O9–I/O16.
All chip inputs and outputs are TTL- an d CMOS-compatible, and operation is for 3.3V (AS7C32 098A) supply. The device is
available in the JEDEC standard TSOP 2 package.
Note: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Absolute maximum ratings
Parameter Symbol Min Max Unit
Voltage on VCC relative to GND Vt1 –0.50 +5.0 V
Voltage on any pin relative to GND Vt2 –0.50 VCC +0.50 V
Power dissipation PD–1.5W
Storage temperature (plastic) Tstg –65 +150 °C
Ambient temperature with VCC applied Tbias –55 +125 °C
DC current into outputs (low) IOUT –±20mA
Truth table
CE WE OE LB UB I/O1–I/O8 I/O9–I/O16 Mode
H X X X X High Z High Z Standby (ISB, ISB1)
LHHXX High Z High Z Output disable (ICC)
LXXHH
LHL
LH D
OUT High Z
Read (ICC)H L High Z DOUT
LL D
OUT DOUT
LLX
LH D
IN High Z
Write (ICC)
H L High Z DIN
LL D
IN DIN
Key: X = Don’t care, L = Low, H = High.
®
AS7C32098A
2/17/06, v 1.1 Alliance Semiconductor P. 3 of 10
Recommended operating conditions
Parameter Symbol Min Typical Max Unit
Supply voltage VCC (10/12/15/20) 3.0 3.3 3.6 V
Input voltage VIH** 2.0 – VCC + 0.5 V
VIL*–0.5 – 0.8 V
Ambient operating temperature commercial TA0– 70°C
industrial TA–40 – 85 °C
* VIL min = –1.0V for pulse width less than 5ns.
** VIH max = VCC + 2.0V for pulse width less than 5ns.
DC operating characteristics (over the operating range)1
Parameter Symbol Test conditions
–10 –12 –15 –20
UnitMin Max Min Max Min Max Min Max
Input leakage
current |ILI|VCC = Max
VIN = GND to VCC –1–1–1–1µA
Output leakage
current |ILO|
VCC = Max
CE = VIH or OE = VIH
or WE = VIL
VI/O = GND to VCC
–1–1–1–1µA
Operating
power suppl y
current ICC VCC = Max
CE ≤ VIL, f = fmax IOUT = 0mA
Industrial – 180 – 160 – 140 – 110 mA
Commercial - 170 - 150 - 130 - 100 mA
Standby power
supply current
ISB VCC = Max
CE ≥ VIH, f = Max – 60 – 60 – 60 – 60 mA
ISB1
VCC = Max
CE ≥ VCC – 0.2V, VIN ≥ VCC – 0.2V or
VIN ≤ 0.2V, f = 0
–8–8–8–8mA
Output voltage VOL IOL = 8 mA, VCC = Min – 0.4 – 0.4 – 0. 4 – 0.4 V
VOH IOH = –4 mA, VCC = Min 2.4 – 2.4 – 2.4 – 2.4 – V
Capacitance (f = 1MHz, Ta = 25° C, VCC = NOMINAL)4
Parameter Symbol Signals Test conditions Max Unit
Input capacitance CIN A, CE, WE, OE, UB, LB VIN = 0V 6 pF
I/O capacitance CI/O I/O VIN = VOUT = 0V 8 pF
®
AS7C32098A
2/17/06, v 1.1 Alliance Semiconductor P. 4 of 10
Key to switching waveforms
Read waveform 1 (address controlled)5,6,8
Read cycle (over the operating range)2,8
Parameter Symbol
–10 –12 –15 –20
Unit NotesMin Max Min Max Min Max Min Max
Read cycle time tRC 10 –12–15–20– ns
Address access time tAA – 10–12–15–20ns
Chip enable (CE) access time tACE – 10–12–15–20ns
Output enable (OE) access time tOE – 4–5–6–7ns
Output hold from address chang e tOH 3 –3–3–3–ns4
CE Low to output in low Z tCLZ 3 –3–3–3–ns3,4
CE High to output in high Z tCHZ – 5–6–7–9ns3,4
OE Low to output in low Z tOLZ 0 –0–0–0–ns3,4
OE High to output in high Z tOHZ – 5–6–7–9ns3,4
LB, UB access time tBA – 5–6–7–8ns
LB, UB Low to output in low Z tBLZ 0 –0–0–0–ns
LB, UB High to output in high Z tBHZ – 5–6–7–9ns
Power up time tPU 0 –0–0–0–ns4
Power down time tPD – 10–12–15–20ns4
Undefined/don’t careFalling inputRising input
t
OH
t
AA
t
RC
t
OH
Data
OUT
Address
Data validPrevious data valid
®
AS7C32098A
2/17/06, v 1.1 Alliance Semiconductor P. 5 of 10
Read waveform 2 (CE, OE, UB, LB controlled)5,7,8
Write cycle (over the operating range)9
Parameter Symbol
–10 –12 –15 –20
Unit NoteMin Max Min Max Min Max Min Max
Write cycle time tWC 10–12–15–20– ns
Chip enable (CE) to write end tCW 7–8–10–12–ns
Address setup to write end tAW 7–8–10–12–ns
Address setup time tAS 0–0–0–0–ns
Write pulse width (OE = High) tWP1 7–8–10–12–ns
Write pulse width (OE = Low) tWP2 10–12–15–20– ns
Write recovery time tWR 0–0–0–0–ns
Address hold from end of write tAH 0–0–0–0–ns
Data valid to write end tDW 5–6 7–9–ns
Data hold time tDH 0–0–0–0–ns3,4
Write enable to output in High-Z tWZ 05060709ns3,4
Output active from write end tOW 3–3–3–3–ns3,4
Byte enable Low to write end tBW 7–8–10–12–ns3,4
Data valid
t
RC
t
AA
t
BLZ
t
BA
t
OE
t
OLZ
t
OH
t
OHZ
t
CHZ
t
BHZ
t
ACE
t
CLZ
Address
OE
CE
LB, UB
Data
OUT
®
AS7C32098A
2/17/06, v 1.1 Alliance Semiconductor P. 6 of 10
Write waveform 1(WE controlled)9
Write waveform 2 (CE controlled)9
Address
CE
LB, UB
WE
Data
IN
Data
OUT
t
WC
t
CW
t
BW
t
AW
t
AS
t
WP
t
DW
t
DH
t
OW
t
WZ
t
AH
Data undefined High Z
Data valid
t
WR
Address
CE
LB, UB
WE
Data
IN
t
WC
t
CW
t
BW
t
WP
t
DW
t
DH
t
OW
t
WZ
t
AH
Data
OUT
Data undefined
High Z High Z
t
AS
t
AW
Data valid
t
CLZ
t
WR
®
AS7C32098A
2/17/06, v 1.1 Alliance Semiconductor P. 7 of 10
Write waveform 3 9
AC test conditions
Notes
1During V
CC power-up, a pull-up resistor to VCC on CE is required to meet ISB specification.
2 For test conditions, see AC Test Conditions, Figures A and B.
3t
CLZ and tCHZ are specified with CL = 5pF as in Figure B. Tr ansition is measured ±500mV from steady-state voltage.
4 This parameter is guaranteed, but not tested.
5WE
is High for read cycle.
6CE
and OE are Low for read cycle.
7 Address valid prior to or coincident with CE transition Low.
8 All read cycle timings are referenced from the last valid address to the first transitioning address.
9 All write cycle timings are referenced from the last valid address to the first transitioning address.
10 C=30pF, except on High Z and Low Z parameters, where C=5pF.
Address
CE
LB, UB
WE
Data
IN
t
WC
t
CW
t
BW
t
WP
t
DW
t
DH
t
WZ
t
AH
Data
OUT
Data undefined
High Z High Z
t
AS
t
AW
Data valid
t
WR
- Output load: see Figure B.
- Input pulse level: GND to 3.0V. See Figure A.
- Input rise and fall times: 2 ns. See Figure A.
- Input and output timing reference levels: 1.5V.
10%
90%
10%
90%
GND
+3.0V
2 ns
Figure A: Input pulse
350
Ω
C
10
320
Ω
D
OUT
GND
+3.3V
Figure B: 3.3V Output load
168
Ω
D
OUT
+1.728V
Thevenin equivalent:
®
AS7C32098A
2/17/06, v 1.1 Alliance Semiconductor P. 8 of 10
Package dimensions
44-pin TSOP 2
Min (mm) Max (mm)
A1.2
A10.05 0.15
A20.95 1.05
b0.3 0.45
c0.12 0.21
d18.31 18.52
e10.06 10.26
He11.68 11.94
E0.80 (typical)
l0.40 0.60
d
H
e
1234567891011121314
44 43424140393837363534333231
1516
3029
1718 1920
272625
c
l
A
1
A
2
E
44-pin TSOP 2
0–5
°
21
24
22
23
e
A
b
28
®
AS7C32098A
2/17/06, v 1.1 Alliance Semiconductor P. 9 of 10
Note: Add suffix ‘N’ to the above part numbers for Lead Free Parts. (EX: AS7C32098A - 10TCN)
Ordering Codes
Package Temperature 10 ns 12 ns 15 ns 20 ns
TSOP 2 Commercial AS7C32098A-10TC AS7C32098A-12TC AS7C32098A-15TC AS7C32098A-20TC
Industrial AS7C32098A-10TI AS7C32098A-12TI AS7C32098A-15TI AS7C32098A-20TI
Part numbering system
AS7C X 2098A –XX T X X
SRAM
prefix Voltage:
3 - 3.3V CMOS Device
number Access
time Package:
T: TSOP 2
Temperature ranges:
C: Commercial, 0°C to 70°C
I: Industrial, –40°C to 85°C N = Lead Free Parts
Alliance Semiconductor Corporation
2575, Augustine Drive,
Santa Clara, CA 95054
Tel: 408 - 855 - 4900
Fax: 408 - 855 - 4999
www.alsc.com
Copyright © Alliance Semiconductor
All Rights Reserved
Part Number: AS7C32098A
Document Version: v 1.1
© Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered
trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make
changes to this document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document.
The data contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at
any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in
this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any
guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product
described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability or warranties related
to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in Alliance's Terms and
Conditions of Sale (which are available from Alliance). All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of
Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other
intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components in life-supporting systems
where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-
supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.
AS7C32098A
®
®
