M8 STAINLESS FORM A - Duratool Corporation

TNPV e3

www.vishay.com Vishay Draloric

Revision: 12-Apr-18 1Document Number: 28881

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

High Voltage Thin Film Flat Chip Resistors

TNPV e3 precision thin film flat chip resistors are the perfect

choice for most fields of modern electronics where the

highest reliability and stability at high operating voltages are

of major concern. Typical applications include industrial and

automotive inverters, voltage measurement systems as

implemented in battery management systems, and test and

measuring equipment.

FEATURES

• High operating voltage Umax. up to 1000 V

• Low voltage coefficient < 1 ppm/V

• Excellent overall stability at different

environmental conditions ≤ 0.05 % 

(1000 h rated power at 70 °C)

• Superior moisture resistivity (85 °C; 85 % RH)

• AEC-Q200 qualified

• Sulfur resistance verified according to ASTM B 809

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• Industrial and automotive inverters

• Battery management system

• Test and measuring equipment

Notes

(1) Size not specified in EN 140401-801

(2) Please refer to APPLICATION INFORMATION below

(3) Application-specific safety requirements may set limitations to the applicability of the specified voltage

APPLICATION INFORMATION

The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow

support of the printed circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is

not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder

joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly.

These resistors do not feature a lifetime limitation when operated within the limits of rated dissipation, permissible operating

voltage, and permissible film temperature. However, the resistance typically increases due to the resistor's film temperature

over operating time, generally known as drift. The drift may exceed the stability requirements of an individual application circuit

and thereby limits the functional lifetime. The designer may estimate the performance of the particular resistor application or set

certain load and temperature limits in order to maintain a desired stability.

TECHNICAL SPECIFICATIONS

DESCRIPTION

TNPV1206 e3 TNPV1210 e3

Imperial size 1206 1210 (1)

Metric size code RR3216M RR3225M (1)

Resistance range 160 k to 2 M121 k to 3.01 M

Resistance tolerance ± 1 %; ± 0.5 %; ± 0.1 %

Temperature coefficient ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K

Voltage coefficient |c| < 1 ppm/V

Rated dissipation, P70 (2) 0.25 W 0.33 W

Maximum operating voltage, Umax. ACRMS

or DC (3) 700 V 1000 V

Permissible film temperature,



F max. (2) 155 °C

Operating temperature range -55 °C to 125 °C (155 °C)

TNPV e3

www.vishay.com Vishay Draloric

Revision: 12-Apr-18 2Document Number: 28881

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Note

(1) 1000 pieces packaging is available only for precision resistors with tolerance ± 0.1 %

Note

• Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION

MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION

OPERATION MODE STANDARD

Rated dissipation, P70

TNPV1206 e3 0.25 W

TNPV1210 e3 0.33 W

Applied maximum film temperature,



F max. 125 °C

Max. resistance change at P70 for resistance

range R/R, after:

TNPV1206 e3 160 k to 2 M

TNPV1210 e3 121 k to 3.01 M

1000 h  0.05 %

8000 h  0.10 %

225 000 h  0.30 %

TEMPERATURE COEFFICIENT AND RESISTANCE RANGE

TYPE/SIZE TCR TOLERANCE RESISTANCE E-SERIES

TNPV1206 e3

± 50 ppm/K ± 1 %

160 k to 2.0 M

E24; E96

± 25 ppm/K ± 0.5 %

E24; E192

± 0.1 %

± 15 ppm/K ± 0.1 %

± 10 ppm/K ± 0.1 %

TNPV1210 e3

± 50 ppm/K ± 1 % 121 k to 3.01 M E24; E96

± 25 ppm/K ± 0.5 %

E24; E192

± 0.1 %

121 k to 2.13 M ± 15 ppm/K ± 0.1 %

± 10 ppm/K ± 0.1 %

PACKAGING

TYPE/SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH REEL DIAMETER

TNPV1206 e3

TNPV1210 e3

E52 = EN 1000 (1) Paper tape

acc. IEC 60286-3

Type 1a

8 mm 4 mm 180 mm / 7"

ET1 = EA 5000

ET6 = EC 20 000 330 mm / 13"

PART NUMBER AND PRODUCT DESCRIPTION

Part Number: TNPV12061M24DEEA

TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING SPECIAL

TNPV1206

TNPV1210

R = decimal

K = thousand

M = million

(4 digits)

B = ± 0.1 %

D = ± 0.5 %

F = ± 1.0 %

H = ± 50 ppm/K

E = ± 25 ppm/K

X = ± 15 ppm/K

Y = ± 10 ppm/K

Up to 2 digits

Blank = standard

Product Description: TNPV1206 1M24 0.5 % T-9 ET1 e3

TNPV1206 1M24 0.5 % T-9 ET1 e3

TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING LEAD (Pb)-FREE

TNPV1206

TNPV1210

Examples:

1M24 = 1.24 M

560K = 560 k

± 0.1 %

± 0.5 %

± 1.0 %

T-2 = ± 50 ppm/K

T-9 = ± 25 ppm/K

T-10 = ± 15 ppm/K

T-13 = ± 10 ppm/K

ET1

ET6

E52

e3 = pure tin

termination finish

NPV12061MT4DEEA2

TNPV e3

www.vishay.com Vishay Draloric

Revision: 12-Apr-18 3Document Number: 28881

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

DESCRIPTION

Production is strictly controlled and follows an extensive set

of instructions established for reproducibility. A

homogeneous film of special metal alloy is deposited on a

high grade ceramic substrate (AI2O3) and conditioned to

achieve the desired temperature coefficient. Specially

designed inner contacts are deposited on both sides. A

special laser is used to achieve the target value by smoothly

cutting a meander groove in the resistive layer without

damaging the ceramics. The resistor elements are covered

by a unique protective coating designed for electrical,

mechanical and climatic protection. The terminations

receive a final pure tin on nickel plating.

The result of the determined production is verified by an

extensive testing procedure and optical inspection

performed on 100 % of the individual chip resistors. This

includes full screening for the elimination of products with a

potential risk of early life failures according to

EN 140401-801, 2.1.2.2. Only accepted products are laid

directly into the paper tape in accordance with

IEC 60286-3 (1).

ASSEMBLY

The resistors are suitable for processing on automatic SMD

assembly systems. They are suitable for automatic

soldering using wave, reflow or vapor phase as shown in

IEC 61760-1 (1). The encapsulation is resistant to all

cleaning solvents commonly used in the electronics

industry, including alcohols, esters and aqueous solutions.

The suitability of conformal coatings, potting compounds,

and their processes, if applied, shall be qualified by

appropriate means to ensure the long-term stability of the

whole system.

The resistors are RoHS-compliant, the pure tin plating

provides compatibility with lead (Pb)-free and

lead-containing soldering processes. The immunity of the

plating against tin whisker growth has been proven under

extensive testing.

All products comply with the IEC 62474, Material

Declaration for Products of and for the Electrotechnical

Industry. The dedicated database (2), that lists declarable

substances, ensures full compliance with the following

directives:

•

2000/53/EC End of Vehicle life Directive (ELV) and Annex II

(ELV II)

• 2011/65/EU Restriction of the use of Hazardous

Substances directive (RoHS)

• 2012/19/EU Waste Electrical and Electronic Equipment

Directive (WEEE)

The resistors are halogen-free according to JEDEC®

JS709A definition. Solderability is specified for 2 years after

production or re-qualification. The permitted storage time is

20 years.

RELATED PRODUCTS

For products with ultra precision specification see the

datasheet:

• TNPU e3 - Ultra Precision Thin Film Flat Chip Resistors

(www.vishay.com/doc?28779)

For products with high stability specification see the

datasheet:

• TNPW e3 - High Stability Thin Film Flat Chip Resistors

(www.vishay.com/doc?28758)

Note

(1) The quoted IEC standards are also released as EN standards with the same number and identical contents

(2) IEC 62474 database can be found at http://std.iec.ch/iec62474

TNPV e3

www.vishay.com Vishay Draloric

Revision: 12-Apr-18 4Document Number: 28881

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

FUNCTIONAL PERFORMANCE

Note

• The solid line is based on IEC/EN reference test conditions which is considered as standard mode. However, above that the maximum

permissible film temperature is 155 °C (dashed line)

Note

• The permissible operating voltage Umax. equals the rated voltage . For ambient temperatures above 70 °C power derating must

be considered

-55

Rated Power in %

Ambient Temperature in °C

Derating

-25 0 25 50 75 100 125 150 175

100

120

121K

160K

100K

Permissible Operating Voltage in V

Resistance Value in Ω

Nominal Operating Voltage

1M 10M

1000

1200

800

600

400

200

TNPV1210 e3

TNPV1206 e3

P70 x R

TNPV e3

www.vishay.com Vishay Draloric

Revision: 12-Apr-18 5Document Number: 28881

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

0.1

10μ 100μ 1m 10m 100m 1 10

Permissible Pulse Power P i, max. in W

Maximum Pulse Load Pi, max. Single Pulses

Pulse Duration ti in s

TNPV 1210 e3

TNPV 1206 e3

Conditions:

P 0, n 1000 and Ui Ui, max.

< <

100

1000

10μ 100μ 1m 10m 100m 1 10

Permissible Pulse Voltage Ui, max. in V

Maximum Pulse Voltage Ui, max.

Pulse Duration ti in s

Conditions:

i Pi, max.

TNPV 1210 e3

TNPV 1206 e3

TNPV e3

www.vishay.com Vishay Draloric

Revision: 12-Apr-18 6Document Number: 28881

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TEST AND REQUIREMENTS

All tests are carried out in accordance with the following

specifications:

EN 60115-1, generic specification

EN 60115-8 (successor of EN 140400), sectional

specification

EN 140401-801, detail specification

IEC 60068-2-xx, test methods

The parameters stated in the Test Procedures and

Requirements table are based on the required tests and

permitted limits of EN 140401-801. The table presents only

the most important tests, for the full test schedule refer to

the documents listed above. However, some additional

tests and a number of improvements against those

minimum requirements have been included.

The testing also covers most of the requirements specified

by EIA / ECA-703 and JIS-C-5201-1.

The tests are carried out under standard atmospheric

conditions in accordance with IEC 60068-1, 4.3, where upon

the following values are applied:

Temperature: 15 °C to 35 °C

Relative humidity: 45 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)

A climatic category LCT / UCT / 56 is applied, defined by the

lower category temperature (LCT), the upper category

temperature (UCT), and the duration of exposure in the

damp heat, steady state test (56 days).

The components are mounted for testing on printed circuit

boards in accordance with EN 60115-8, 2.4.2, unless

otherwise specified.

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1 

CLAUSE

IEC 60068-2 (1)

TEST

METHOD

TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE

(R)

Stability for product type:

TNPV1206 e3

TNPV1210 e3

4.5 - Resistance - ± 1 %; ± 0.5 %; ± 0.1 %

4.8.4.2 - Temperature

coefficient

At (20 / -55 / 20) °C

and (20 / 125 / 20) °C ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K

4.25.1 - Endurance

at 70 °C

U = Umax.;

1.5 h on; 0.5 h off;

70 °C; 1000 h ± (0.05 % R)

70 °C; 8000 h ± (0.1 % R)

4.25.3 -

Endurance at

upper category

temperature

125 °C; 1000 h ± (0.05 % R)

155 °C; 1000 h ± (0.1 % R)

4.24 78 (Cab) Damp heat,

steady state

(40 ± 2) °C; 56 days;

(93 ± 3) % RH;

U = 0.1 x Umax.

± (0.1 % R)

4.19 14 (Na) Rapid change

of temperature

30 min at LCT and

30 min at UCT;

LCT = -55 °C; UCT = 125 °C;

1000 cycles

± (0.1 % R)

4.13 - Short time

overload

U = 2 x Umax.;

5 s ± (0.05 % R)

4.27 -

Single pulse

high voltage

overload

Severity no. 4:

U = 2 x Umax.;

10 pulses 10 μs/700 μs

± (0.1 % R)

4.39 - Periodic electric

overload

U = 2 x Umax.;

0.1 s on; 2.5 s off; 1000 cycles ± (0.1 % R)

4.22 6 (Fc) Vibration

Endurance by sweeping;

10 Hz to 2000 Hz;

no resonance;

amplitude  1.5 mm or

 200 m/s2; 7.5 h

± (0.05 % R)

TNPV e3

www.vishay.com Vishay Draloric

Revision: 12-Apr-18 7Document Number: 28881

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Note

(1) The quoted IEC standards are also released as EN standards with the same number and identical contents

4.38 -

Electrostatic

discharge (Human

Body Model)

IEC 61340-3-1 (1);

3 pos. + 3 neg. discharges;

6 kV

± (0.5 % R)

4.17.2 58 (Td) Solderability

Solder bath method;

SnPb40; non-activated flux

(215 ± 3) °C; (3 ± 0.3) s Good tinning ( 95 % covered);

no visible damage

Solder bath method;

SnAg3Cu0.5 or SnAg3.5;

non-activated flux

(235 ± 3) °C; (2 ± 0.2) s

4.18.2 58 (Td) Resistance to

soldering heat

Solder bath method;

(260 ± 5) °C; (10 ± 1) s

± (0.02 % R)

Reflow method 2

(IR/forced gas convection);

(260 ± 5) °C; (10 ± 1) s

4.29 45 (XA) Component

solvent resistance

Isopropyl alcohol; 50 °C;

method 2 No visible damage

4.30 45 (XA)

Solvent

resistance

of marking

Isopropyl alcohol;

50 °C;

method 1, toothbrush

No visible damage

4.32 21 (Ue3)Shear

(adhesion) 45 N No visible damage

4.33 21 (Ue1)Substrate

bending Depth 2 mm, 3 times ± (0.05 % R)

no visible damage, no open circuit in bent position

4.35 - Flammability IEC 60695-11-5 (1),

needle flame test; 10 s No burning after 30 s

4.37 67 (Cy)

Damp heat,

steady state,

accelerated

(85 ± 2) °C;

(85 ± 5) % RH;

U = 0.3 x Umax.;

1000 h

± (0.25 % R)

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1 

CLAUSE

IEC 60068-2 (1)

TEST

METHOD

TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE

(R)

Stability for product type:

TNPV1206 e3

TNPV1210 e3

TNPV e3

www.vishay.com Vishay Draloric

Revision: 12-Apr-18 8Document Number: 28881

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

DIMENSIONS

SOLDER PAD DIMENSIONS

Note

• Utilization of the full specified operating voltage may require special considerations on the creepage and clearance distance between

conductors at different potential levels

DIMENSIONS AND MASS

TYPE H

(mm)

(mm) Tt/Tb(mm) MASS

(mg)

TNPV1206 e3 0.55 ± 0.10 3.2 + 0.1 / - 0.2 1.6 ± 0.15 0.5 ± 0.25 10

TNPV1210 e3 0.60 ± 0.15 3.2 + 0.1 / - 0.2 2.45 ± 0.15 0.5 ± 0.25 16

RECOMMENDED SOLDER PAD DIMENSIONS

TYPE

REFLOW SOLDERING WAVE SOLDERING

(mm)

TNPV1206 e3 0.9 1.7 2.0 1.1 1.7 2.3

TNPV1210 e3 0.9 2.5 2.0 1.1 2.5 2.3

Legal Disclaimer Notice

www.vishay.com Vishay

Revision: 08-Feb-17 1Document Number: 91000

Disclaimer



ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE

RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,

“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other

disclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or

the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all

liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,

consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular

purpose, non-infringement and merchantability.

Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of

typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding

statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a

particular product with the properties described in the product specification is suitable for use in a particular application.

Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over

time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s

technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,

including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining

applications or for any other application in which the failure of the Vishay product could result in personal injury or death.

Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.

Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for

such applications.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document

or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.