2016-2019 Microchip Technology Inc. DS50002519D-page 1
RN4678
Features
• Bluetooth® Classic (BR/EDR) and Low Energy
(LE)
• Certified to FCC, ISED, MIC, KCC, NCC, and
SRRC Radio Regulations
• European Radio Equipment Directive (RED)
Assessed Radio Module
• Qualified for Bluetooth SIG v5.0 Core
Specification
• Transparent UART mode for seamless serial data
over Bluetooth Classic using Serial Port Profile
(SPP), and Bluetooth Low Energy (BLE) using
Generic Attribute (GATT) Profile
• Easily Programmable through ASCII Commands
and easily configurable with available PIC® MCU
driver library
• Firmware can be upgraded in the field over UART
(Flash version)
• Integral Chip Antenna (RN4678)
• Integrated Crystal, Internal Voltage Regulator, and
Matching Circuitry
• Available Configurable I/O Pins for Control or
Status Indication
• Supports Apple® iPod® Accessory Protocol
(iAP2) (only RN4678APL)
• Supports Bluetooth LE Secure Connections
• Bluetooth LE Data Packet Length Extension
• Small and Compact Surface Mount Module
• Castellated SMT Pads for easy and reliable PCB
mounting
• Ideal for Portable Battery-Operated Devices
RF/Analog
• Frequency: 2.402 GHz to 2.480 GHz
• RX Sensitivity: -90 dBm (BR/EDR), -92 dBm (LE)
• Class 2 Output Power (+1.5 dBm typical)
Data Throughput
Data Throughput at 1 Mbps UART Baud Rate:
• BR/EDR: up to 32 Kbytes/s
• LE: up to 7 Kbytes/s
Data Throughput at 115200 bps UART Baud Rate
• BR/EDR: up to 10 Kbytes/s
• LE: up to 6 Kbytes/s
Operating Conditions
• Operating Voltage Range: 3.3V to 4.2V
• Operating Temperature Range: -20°C to +70°C
MAC/Baseband/Higher Layer Features
• Secure AES128 Encryption
• Bluetooth Classic: GAP, SPP, SDP, RFCOMM and
L2CAP
• Bluetooth Low Energy: GAP, GATT, ATT, SMP
and L2CAP
Applications
• Internet of Things (IoT)
• Secure Payment
• Home and Security
• Health and Fitness
• Industrial and Data Logger
• LED Lighting (16 configurations)
Description
The RN4678 module is a fully certified, Bluetooth v5.0
compliant (BR/EDR/LE) dual mode module available
for customers to easily add dual mode Bluetooth
wireless capability to their products. The RN4678 is
built around Microchip's IS1678 Bluetooth dual mode
chip. Refer to Section 8.0 “Ordering Information”.
The RN4678 provides a convenient method for cable
replacement for smartphones or tablets for data
transfer and control based on the Bluetooth protocols.
Data transfer is achieved through the Bluetooth link by
sending or receiving data through SPP in Bluetooth
(BT) Classic mode and through Transparent UART in
the BLE mode. The ASCII interface provides an easy
way to learn the operation and to integrate the module
with any microprocessor or Microcontroller (MCU) with
a UART interface.
Bluetooth® Dual Mode Module
RN4678
DS50002519D-page 2 2016-2019 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 3
2.0 Application Information................................................................................................................................................................. 7
3.0 Electrical Characteristics ............................................................................................................................................................ 15
4.0 Radio Characteristics ................................................................................................................................................................. 19
5.0 Physical Dimensions .................................................................................................................................................................. 21
6.0 Reflow profile.............................................................................................................................................................................. 25
7.0 Module Placement...................................................................................................................................................................... 27
8.0 Ordering Information .................................................................................................................................................................. 31
9.0 Regulatory Approval ................................................................................................................................................................... 33
Appendix A: Revision History .............................................................................................................................................................. 39
The Microchip WebSite ........................................................................................................................................................................ 41
Customer Change Notification Service ................................................................................................................................................ 41
Customer Support ................................................................................................................................................................................ 41
Product Identification System............................................................................................................................................................... 43
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
2016-2019 Microchip Technology Inc. DS50002519D-page 3
RN4678
1.0 DEVICE OVERVIEW
The RN4678 module is a fully certified, embedded
Bluetooth (BR/EDR/LE) wireless module. The module
includes an on-board Bluetooth stack, power
management subsystem, a 2.4 GHz transceiver, and
RF power amplifier. Customers can embed Bluetooth
functionality into any application using the RN4678
module.
The RN4678 enables rapid product development and
faster time to market, and it is designed to provide
integrators with the following features:
• Simple integration and programming
• Reduced development time
• Superior wireless module with low-cost system
• Interoperability with Bluetooth host
• Wide range of applications
The RN4678 is a complete and fully regulatory certified
module with an integral ceramic chip antenna and RF
shield.
The RN4678 is a small, compact and surface mounted
module with castellated pads for easy and reliable host
PCB mounting. The module is compatible with
standard pick-and-place equipment and can
independently maintain a low-power wireless
connection. Low-power usage and flexible power
management maximize the lifetime of the RN4678
module in battery-operated devices. A wide operating
temperature range enables its applications in indoor
and outdoor environments.
Figure 1-1 illustrates the internal block diagram of the
RN4678 module.
FIGURE 1-1: RN4678 INTERNAL BLOCK DIAGRAM
BAT_ IN
SW_ BTN
LDO3V3_OUT
LDO1V8_OUT
PMU
VDDIO
WAKEUP
LED DRIVER
EEPROM
UART
GPIO
IS1678 S/SM 16 MHz
CRYSTAL
Matching
Ant enn a
RN4678 BT Dual Mode Module
HOST
MCU
SW_ BTN
LDO33 _O
LDO18 _O
RST_N
WA KEUP
BAT_ DET
Bluetooth
Baseband
& RF
TXD
RXD
RTS
CTS
VDD_IO
Core
320 KB ROM
28 KB SRAM
MCU
LE D 4 Mb Fla sh
(Only IS1678SM)
RST_N
RN4678
DS50002519D-page 4 2016-2019 Microchip Technology Inc.
Table 1-1 provides the description of the various pins of the RN4678 module.
TABLE 1-1: PIN DESCRIPTION
RN4678 Pin Name Type Description
1GND Power Ground reference
2GND Power Ground reference
3GND Power Ground reference
4BAT_IN Power Battery Input (3.3V to 4.2V)
Main positive supply input
Connect to 10 µF (X5R/X7R) capacitor
5SW_BTN DI • Software Button
- H: Power On
- L: Power Off
• By default, this functionality is disabled. Refer to RN4678 Com-
mand Reference User Guide (DS50002506) to enable the feature
6LDO33_O Power Internal 3.3V LDO output; can source no more than 50 mA
7VDD_IO Power I/O positive supply input. For internal use only; do not connect to other
devices.
8LDO18_O Power Internal 1.8V LDO output. For internal use only; do not connect to other
devices.
9WAKEUP DI Wake-up from Sleep mode (active-low) (internal pull-up)
10 PMULDO_O Power Power management unit output. For internal use only; do not connect
to other devices.
11 P0_4 DO Status Indication pin. Indicates the current status of BLE data
transmission.
High: Data currently transmitting
Low: No current data transmission
12 P1_5 DO Status Indication pin. Indicates the current connection status.
High: Powered On and not connected
Low: Connected to peer device
13 P1_2 DO GPIO pin. Internally pulled-up by default.
14 P1_3 DIO GPIO pin. Internally pulled-up by default.
15 P1_7/CTS DIO Configurable Control or Indication pin or UART CTS (input)
16 P0_5 DIO Configurable Control or Indication pin
17 P0_0/RTS DIO Configurable Control or Indication pin or UART RTS (output)
18 P2_0 DI System configuration pin. Along with P2_4 and EAN pins, used to set
the module in any of the following three modes: Application mode (for
normal operation), Test mode (to change EEPROM values), and Write
Flash mode (to enter the new firmware into the module); refer to
Table 2-1.
19 P2_4 DI System configuration pin. Along with P2_0 and EAN pins, used to set
the module in any of the following three modes: Application mode (for
normal operation), Test mode (to change EEPROM values), and Write
Flash mode (to enter new firmware into the module); refer to Ta bl e 2-1.
20 EAN DI External address-bus negative pin. System configuration pin along with
P2_0 and P2_4 pins, used to set the module in any of the following
three modes: Application mode (for normal operation), Test mode (to
change EEPROM values), and Write Flash mode (to enter new
firmware into the module); refer to Ta b l e 2-1.
Must be pulled down with 4.7 k to GND.
21 RST_N DI Module Reset (internal pull-up). Apply a pulse of at least 63 ns.
22 RXD DI UART data input
2016-2019 Microchip Technology Inc. DS50002519D-page 5
RN4678
Figure 1-2 illustrates the pin diagram of the RN4678 module.
FIGURE 1-2: RN4678 PIN DIAGRAM
23 TXD DO UART data output
24 P3_1 DIO Configurable Control or Indication pin (Internally pulled-up, if configured
as an input)
25 P3_2 DIO Configurable Control or Indication pin (Internally pulled-up, if configured
as an input)
26 P3_3 DIO Configurable Control or Indication pin (Internally pulled-up, if configured
as an input)
27 P3_4 DIO Configurable Control or Indication pin (Internally pulled-up, if configured
as an input)
28 P3_6 DIO Do not connect.
29 P3_7 DIO Configurable Control or Indication pin (Internally pulled-up, if configured
as an input)
30 LED DO Status LED, connect to LDO33_0
31 GND Power Ground reference
—BT_RF AIO External antenna connection (50 ohms)
32 GND Power Ground reference
33 GND Power Ground reference
Legend: A = Analog D = Digital I = Input O = Output
TABLE 1-1: PIN DESCRIPTION (CONTINUED)
RN4678 Pin Name Type Description
GND 1
GND 2
GND 3
BAT_IN 4
SW_BTN 5
LDO33_O 6
VDD_IO 7
LDO18_O 8
WAKEUP 9
PMULDO_O 10
P0_4 11
P1_5 12
P1_2 13
P1_3 14
31 GND
30 LED
29 P3_7
28 P3_6
27 P3_4
26 P3_3
25 P3_2
24 P3_1
23 TXD
22 RXD
P1_7/CTS 15
P0_5 16
P0_0/RTS 17
P2_0 18
P2_4 19
EAN 20
RST_N 21
33 GND
32 GND
RN4678
DS50002519D-page 6 2016-2019 Microchip Technology Inc.
NOTES:
2016-2019 Microchip Technology Inc. DS50002519D-page 7
RN4678
2.0 APPLICATION INFORMATION
2.1 Module Configuration
For the I/O pins, P2_0, P2_4 and EAN, place the
RN4678 into Operating mode. Each of these pins have
internal pull-up and allow configuration settings and
firmware to be updated from UART. Ta b l e 2-1 provides
system configuration details.
2.2 Flow Control
Flow control is enabled by default on the RN4678
module. With the flow control enabled, the RTS and
CTS lines need to be connected to the corresponding
lines for the module to operate. To pause data flow from
the RN4678, the CTS (RN4678 input pin) must be
pulled high. The RN4678 pulls the RTS pin (output pin)
low to indicate that it can accept data.
2.3 Control and Indication I/O Pins
The GPIO pins of the RN4678 module can be
configured to different functions using the ASCII
command interface. Tabl e 2-2 shows the various pins
in the RN4678 module that are available for
configuration and their default configuration settings.
Table 2-3 provides details on each of the functions
available.
TABLE 2-2: CONTROL AND INDICATION I/O PIN ASSIGNMENTS
TABLE 2-3: CONFIGURABLE FUNCTIONS AND DESCRIPTIONS
TABLE 2-1: SYSTEM CONFIGURATION SETTINGS
P2_0 P2_4 EAN Operational Mode
Low Low High Write FLASH
Low High Low Write EEPROM and Test mode
High High Low Normal Operational/Application mode
PIN Symbol Default Configuration
P0_0 UART_RTS(1,2)
P0_5 N/C
P1_7 UART_CTS(1,2)
P3_1 INQUIRY CONTROL
P3_2 LINK_DROP_CONTROL (DISCONNECT)
P3_3 UART_RX_IND
P3_4 PAIRING_KEY
P3_7 LOW_BATTERY_IND
Note 1: The RTS pin can only be assigned to P0_0 and the CTS pin can only be assigned to P1_7.
2: The RTS and CTS pins can be configured as GPIOs if flow control is disabled.
Function Name Description
Low Battery Indication Pin output goes low when the battery level is below a specified level. Default
battery low indication voltage level is 3.4V
RSSI Indication Use this pin to indicate the quality of the link based on the RSSI level. If the
RSSI level is lower than the specified values, then the RSSI indication pin
goes low.
Link Drop Control Use this pin to force the module to drop the current BLE link with a peer
device. Pulling the Link Drop pin low forces to disconnect. The pin must be
pulled low for at least 10 ms.
RN4678
DS50002519D-page 8 2016-2019 Microchip Technology Inc.
2.4 Power Tree
Figure 2-1 illustrates the power tree diagram of the RN4678.
FIGURE 2-1: POWER TREE DIAGRAM
UART RX Indication Use this pin to enable communication with the UART when the module is in
Low-Power mode. When not in Low-Power mode, the module runs on a 16
MHz clock. If Low-Power mode is enabled on the module by using
command SO,1, the module runs on a 32 kHz clock thus reducing power
consumption. However, in Low-Power mode, the host MCU cannot
communicate with the module via the UART since the UART is not
operational. If the user intends to provide data or commands via UART in
the Low-Power mode, then the UART_RX_IND pin must be pulled low and
the user needs to wait for at least five milliseconds before sending the data.
Pulling the UART_RX_IND pin low allows the module to operate the 16
MHz clock and to enable UART.
Pairing Key Use this pin to force the module to enter Standby mode. The pin must be
pulled down for at least 160 ms.
Inquiry Control This pin forces the module enter Inquiry mode (BT Classic). The pin must
be pulled low for at least 240 ms for the device to enter Inquiry mode.
Profile_IND This pin is used to indicate whether current connection is in BR/EDR (BT
Classic), or in Bluetooth Low Energy (BLE). If the Profile_IND pin is high,
then the current connection is BR/EDR connection. If low, then the current
connection is a BLE connection. This pin is valid only for Link State.
Function Name Description
BAT_IN
3.3v˜4.2v
LDO33
PMU Logic
VCC_RF
AVDD_SAR
VDD_XO
VDD_IO
LED
EEPROM
LDO18
PMULDO
o
LDO33_EN
LDO18_EN 1v8
3v3
SW_BTN
2016-2019 Microchip Technology Inc. DS50002519D-page 9
RN4678
2.5 Software Button (SW_BTN)
The Software Button (SW_BT) pin powers the main
sections of the module into operation. If the SW_BTN
pin is low, the module is turned OFF. After turning the
module ON via the SW_BTN, the host MCU must wait
for specific time before sending the first command. The
timing diagrams for the SW_BTN, other related pins,
and the time delay are required before the host MCU
sends the first command.
Figure 2-2 through Figure 2-4 show the timing
diagrams for the RN4678 with regard to the SW_BTN
and the other relevant pins in different states of the
module.
FIGURE 2-2: SW_BTN TIME (HIGH) AT APP MODE(1,2)
Note 1: Time duration (475 ms) is for reference purposes only. Use the Status Indication pins to verify the exact time
when the host MCU can start sending the commands.
2: Reset pin is not connected.
Note: By default, the SW_BTN functionality is
disabled and it can be enabled using the
Host MCU commands. Refer to the
RN4678 Command Reference User
Guide (DS50002506) for more details.
BAT_IN
MCU State Power on
/Initial Idle Power on
SW_BTN
LDO18_O
RST_N
P1_5
P0_4
MCU send UART command
(BT UART RX)
10 ms
40 ms
4 ms
UART
command
475 ms
RN4678
DS50002519D-page 10 2016-2019 Microchip Technology Inc.
FIGURE 2-3: SW_BTN TIME (LOW) AT ACCESS STATES(1)
Note 1: Reset pin is not connected.
FIGURE 2-4: SW_BTN TIME (LOW) AT LINK STATES(1,2)
Note 1: 830 ms time duration is a typical value measured on iPhone® 6 and this time duration can vary from one
smartphone to another.
2: Reset pin is not connected.
SW_BTN
LDO33_O
RST_N
BAT_IN
140 ms
12 ms
SW_BTN
LDO33_O
RST_N
BAT_IN
140 ms
830 ms
2016-2019 Microchip Technology Inc. DS50002519D-page 11
RN4678
2.6 WAKE-UP
The WAKEUP input pin wakes the RN4678 module
from Deep-Sleep mode. The WAKEUP pin is active-
low and puts module in Standby mode. Figure 2-5
illustrates the timing diagram of the RN4678 in the
Wake-Up mode.
FIGURE 2-5: WAKE-UP TIME(1)
Note 1: The 85 ms is for reference time. Use the Status Indication pins to verify the exact results.
2.7 External Reset
The RN4678 provides an External Reset pin which
resets the module. The Reset pin, RST_N, is active-
low. Figure 2-6 shows the timing diagram for the
RST_N pin of the RN4678 module.
FIGURE 2-6: TIMING WAVEFORMS ON RESET (1,2)
Note 1: The RST_N state trigger must be greater than 63 ns.
2: Time duration (350 ms) is for reference purpose only. Use the Status Indication pins to verify the exact
results.
P0_4
P1_5
WAKE UP
85ms
P0_4
P1_5
RST_N
4 ms 350 ms
RST_N state RST_N
trigger System RESET
RN4678
DS50002519D-page 12 2016-2019 Microchip Technology Inc.
2.8 LED Driver
The RN4678 has a dedicated LED driver and the LED
can be connected directly to this pin as shown in
Figure 2-7.
The maximum current sourcing for the LED is 5 mA.
The brightness of this LED can be configured via an
ASCII command.
FIGURE 2-7: LED DRIVER
The following are the LED status indications. Each indi-
cation is a configurable flashing sequence:
• Standby
• Link Back
• Low Battery
• Inquiry
• Link
2.9 Host MCU Interface over UART
Figure 2-8 illustrates an example of UART interface
with host MCU and power scheme using 3.3V to the
VDD. From the LDO33_O pin, voltage can be routed to
the VDD_IO pin and the external circuitry including the
MCU. This power scheme ensures that the RN4678
and the MCU I/O voltages are compatible.
FIGURE 2-8: POWER AND MCU INTERFACE EXAMPLE FOR RN4678
Note 1: Ensure that VDD_IO and MCU VDD voltages are compatible.
2: The control and indication ports are configurable.
RN4678518
Module
LDO33_O
LED1
Note: The internal 3.3V LDO current source
must not exceed 50 mA (maximum).
(3.3V to 4.2V)
10uF
BAT_IN
LDO33_O
VDD_IO
(Note:1)
LDO18_O
LED
P1_5/STATUS_IND_1
P0_4/UART_TX_IND/STATUS_IND_2
RN4678
MODULE
SW_BTN
WAKE_UP
RST_N
P3_4
P3_7
P3_2
P3_3
P1_7/CTS
P0_0/RTS
P3_1
P0_5
TXD
RXD
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
RTS
CTS
TX
RX
HOST
MCU
VDD
System Configuration
3.3V
P2_0
P2_4
EAN
Note:2
2016-2019 Microchip Technology Inc. DS50002519D-page 13
RN4678
2.10 Reference Circuit
Figure illustrates the reference schematic of the power supply design implemented for the RN4678.
FIGURE 2-9: RN4678 REFERENCE CIRCUIT
SW_BTN 5
LDO33_O
6
LDO18_O
8
WAKEUP 9
PMULDO_O
10
P0_4
11
P1_5
12
P1_7/CTS
15
P0_5 16
P0_0/RTS
17
P2_0
18
EAN
20
P3_6 28
P3_7 29
LED
30
S
W
_
BTN
LD
O
3
3
_
O
LD
O
1
8
_
O
W
AKE
UP
PM
U
LDO
_
O
P
0
_
4
P1
_
5
P1
_
7
/
C
T
S
P
0
_
5
P
0
_
0
/
RT
S
P
2
_
0
E
A
N
P
3
_
6
P
3
_
7
LED
GND
1
GND
2
GND
3
BAT_IN
4
VDD_IO
7
P2_4
19
RST 21
UART_RX
22
UART_TX
23 P3_1 24
P3_2 25
P3_3 26
P3_4 27
GND
31
GND
32
GND
33
P1_2
13
P1_3
14
U1
RN4678
BAT_IN LDO33_O
B
BLUE
D1
UART
Functional GPIO
Status indication
RESET, W-UP, SW-BTN
MCU
100R
R4
10uF
C3
GND
1uF
C4
GND
RXD
TXD
P1_7
P0_0
P0_4
P0_5
P1_5
P3_1
P3_2
P3_3
P3_4
P3_6
P3_7
GND
JP1
JP2
JP3
Configuration
System
P1_2
P1_3
RESET
SW2
WAKEUP
SW3
2
3
14
5
6
SW_BTN
SW1
20k
R1
LDO33_O
GND
GND
GND
RST
W-UP
SW_BTN
W-UP
RST
SW_BTN
RN4678
DS50002519D-page 14 2016-2019 Microchip Technology Inc.
NOTES:
2016-2019 Microchip Technology Inc. DS50002519D-Page 15
RN4678
3.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of the electrical characteristics of the RN4678 module. Additional information is
provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the RN4678 devices are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above
the parameters indicated in the operation listings of this specification, is not implied.
Absolute Maximum Ratings
Ambient temperature under bias...............................................................................................................-20°C to +70°C
Storage temperature .............................................................................................................................. -40°C to +125°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V
Maximum output current sunk by any I/O pin..........................................................................................................12 mA
Maximum output current sourced by any I/O pin.....................................................................................................12 mA
Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions,
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
RN4678
DS50002519D-Page 16 2016-2019 Microchip Technology Inc.
Table 3-1 through Tabl e 3-7 provide the recommended operating conditions and the electrical specifications of the
module.
Note 1: HTOL life test condition: +125ºC, BAT_IN = 4.2V, LDO33_O = 3.3V, LDO18_O = 1.9V
Note 1: With 10 uF capacitor at LDO33_O as the condition for IP verification.
2: Output voltage can be calibrated using the MP tool.
Note 1: With 1µF capacitor at PMULDO_O as the condition for IP verification.
2: Output voltage can be calibrated by using the MP tool.
TABLE 3-1: RECOMMENDED OPERATING CONDITIONS
Rating Min. Typical Max.
Ambient Operating Temperature Range -20ºC +25ºC +70ºC
Relative Humidity (Operating) 10% —90%
Relative Humidity (Storage) 10% —90%
ESD HBM —±2 KV —
MM —±200V —
HTOL(1) — 1000 hrs —
Supply Voltage: BAT_IN 3.3V —4.2V
Supply Voltage: 1V8, VCC_RF, VDD_XO, AVDD_SAR 1.8V 1.9V 2.1V
SW_BTN 3.3V —4.2V
LED1 — — 3.6V
Reset VTH,res threshold voltage —1.6V —
VIL Input Logic Level Low -0.3V —0.8V
VIH Input Logic Level High 2.0V —3.6V
VOL Output Logic Level Low (IOl = 12 mA) — — 0.4V
VOH Output Logic Level High (IOh = 12 mA) 2.4V — —
RF continuous TX mode — — 43 mA
RF continuous RX mode — — 37 mA
TABLE 3-2: 3.3V LDO ELECTRICAL PARAMETERS (1,2)
Parameter Min. Typical Max. Unit
Operating Temperature -20 —+70 ºC
Output Current (VIN = 3.6V /load regulation with 100 mV drop) —100 —mA
Quiescent Current (VIN = 3.6V) —150 —µA
TABLE 3-3: PMU LDO(1,2)
Parameter Min. Typical Max. Unit
Operating Temperature -20 —+70 ºC
Output Current (VIN = 3.6V/load regulation with 0.3 mV drop) —100 —µA
Quiescent Current (VIN = 3.6V) —120 —µA
2016-2019 Microchip Technology Inc. DS50002519D-Page 17
RN4678
Note 1: SAR_BAT is connected with BAT_IN internally for battery voltage detection.
TABLE 3-5: INTENSITY CONTROLLABLE LED DRIVER
Note 1: Classic BR/EDR and RX_IND functions are enabled.
TABLE 3-4: SAR-ADC AND BATTERY VOLTAGE DETECTOR
Parameter Min. Typical Max. Unit
Operating Temperature -20 —+70 ºC
AVDD_SAR Power Supply —1.8 — V
SAR_BAT Detection(1) 3.3 —4.2 V
Resolution — 10 —bit
Operating Current (including bandgap) — — 1 mA
Deep-Sleep Current — — 1 µA
Parameter Min. Typical Max. Unit
Operating Temperature -20 —+70 ºC
Open-Drain Voltage — — 3.6 V
Current Step —0.3 —mA
Programmable Current Range 0 — 5 mA
Intensity Control —16 —step
Power Down Open-Drain Current — — 1 µA
Deep-Sleep Current — — 1 µA
TABLE 3-6: POWER CONSUMPTION-CLASSIC(1)
Test Condition Current Consumption (avg.) (mA) Remarks
Standby mode 2.543 —
Deep-Sleep mode 0.281 —
Connected+Sniff, Master (no data) 0.710 No data was transmitted
Sniff interval = 500 ms
Connected+Sniff, Slave (no data) 0.70 No data was transmitted
Sniff interval = 500 ms
Data, Master 14.08 Data transmitted at 115200 bps;
block size = 500
Data, Slave 19.06 Data transmitted at 115200 bps;
block size = 500
RN4678
DS50002519D-Page 18 2016-2019 Microchip Technology Inc.
Note 1: Low energy, RX_IND function is enabled.
2: Only low energy.
TABLE 3-7: POWER CONSUMPTION-LOW ENERGY(1,2)
Test Condition Current Consumption (avg.) (mA) Remarks
Deep-Sleep mode 0.28 —
LE fast advertising 2.09 LE fast advertising interval = 100 ms
1.51 LE fast advertising interval = 160 ms
0.63 LE fast advertising interval = 500 ms
2.75 LE fast advertising interval = 100 ms +
Beacon 100 ms
0.83 LE fast advertising interval = 500 ms +
Beacon 500 ms
Reduced power advertising 0.62 LE Reduced Power advertising
interval = 961 ms
1.65 LE Reduced Power advertising
interval = 961 ms + Beacon 100 ms
0.84 LE Reduced Power advertising
interval = 961 ms + Beacon 500 ms
Connected (No data) 0.57 Connection interval = 1500 ms
0.61 Connection interval = 600 ms
Connected (iPhone 6 to module) 0.45 Connection interval = 500 ms
0.60 Connection interval = 200 ms
Connected (module to iPhone 6) 6.6 Connection interval = 500 ms
7.0 Connection interval = 200 ms
2016-2019 Microchip Technology Inc. DS50002519D-Page 19
RN4678
4.0 RADIO CHARACTERISTICS
Table 4-1 provides the transmitter performance characteristics of the RN4678 module.
Table 4-2 provides the receiver performance characteristics of the RN4678 module.
TABLE 4-1: TRANSMITTER PERFORMANCE (1,2)
Min. Typical Max. Bluetooth
Specification Unit
BDR power —1.5 —-6 ~ +4
dBmEDR (2M/3M) power —-1 —-6 ~ +4
LE power —0.5 —-20 ~ +10
Note 1: The RF Transmit power can be calibrated during production by using the MP Tool software and the
MT8852 Bluetooth Test equipment.
2: Test condition: VCC RF = 1.80V, temperature = 25ºC.
TABLE 4-2: RECEIVER PERFORMANCE(1)
Min. Typical Max. Bluetooth
Specification Unit
BDR Sensitivity —-90 —
≤-70 dBm
EDR 2M Sensitivity —-90 —
EDR 3M Sensitivity —-82 —
LE Sensitivity —-92 —
Note 1: Test condition: VCC RF = 1.80V, temperature = 25ºC
RN4678
DS50002519D-Page 20 2016-2019 Microchip Technology Inc.
NOTES:
2016-2018 Microchip Technology Inc. DS50002519D-Page 21
RN4678
5.0 PHYSICAL DIMENSIONS
Figure 5-1 illustrates the physical dimensions of the RN4678 module.
FIGURE 5-1: RN4678 MODULE DIMENSIONS
0.7mm
1.1mm
1.0mm
0.5mm
0.7mm
1.0mm
(Top View) (Bottom View)
Pad Detail
(Side View)
0.0
2.7
3.8
4.9
6.0
7.1
8.2
9.3
12.0
0.0
1.8
2.9
4.0
5.1
6.2
7.3
8.4
9.5
10.6
11.7
12.8
13.9
20.1
21.2
2.0
22.0
18.0
0.0
0.6
2.4
0.7
17.3
0.8
11.2
Dimentions are in millimeters
Tolerances:
PCB Thickness: +/- 0.06 mm
0.0
2.7
3.8
4.9
6.0
7.1
8.2
9.3
12.0
0.0
1.8
2.9
4.0
5.1
6.2
7.3
8.4
9.5
10.6
11.7
12.8
13.9
20.1
21.2
22.0
18.0
2.0
10.2
16.95
133
19.9
21.5
14.90
18.95
(Bottom View)
shield mounting hole
shi eld
mounting
hole
0.8
11.2
RN4678
DS50002519D-Page 22 2016-2018 Microchip Technology Inc.
Figure 5-2 illustrates the recommended host PCB foot print.
FIGURE 5-2: RN4678 RECOMMENDED PCB FOOTPRINT
0.7mm
1.1mm
(Top View)
0.0
2.7
3.8
4.9
6.0
7.1
8.2
9.3
12.0
0.0
1.8
2.9
4.0
5.1
6.2
7.3
8.4
9.5
10.6
11.7
12.8
13.9
20.1
21.2
22.0
18.0
2.0
18.0
16.0
Keep Out Area
9.2
11.2
Top Copper
0.5mm
1.5mm
Silkscreen
area
2016-2018 Microchip Technology Inc. DS50002519D-Page 23
RN4678
Figure 5-3 illustrates the recommendations for
mounting the RN4678 on the host PCB, and also
shows the minimum ground plane area to the left and
right of the module for the best antenna performance.
Avoid top copper layer near the test pin area. When
designing the host PCB, the areas under the antenna
must not contain any top, inner or bottom copper layer.
A low-impedance ground plane ensures best radio per-
formance (best range and lowest noise). The ground
plane can be extended beyond the minimum recom-
mended as required for the host PCB EMC noise
reduction. For best range performance, keep all exter-
nal metal at least 31 mm away from the ceramic chip
antenna.
FIGURE 5-3: RN4678 HOST PCB MOUNTING SUGGESTION
This area needs to
have top metal copper
that is connected to
Ground for optimal
functioning of the chip
antenna.
This purple hashed
area must not have
any top metal layer
copper. It can have
bottom copper layer.
This area (purple with
dots) needs to have
both top and bottom
copper layers
connected to Ground
for optimal operation
of the antenna.
RN4678
DS50002519D-Page 24 2016-2018 Microchip Technology Inc.
NOTES:
2016-2019 Microchip Technology Inc. DS50002519D-Page 25
RN4678
6.0 REFLOW PROFILE
The RN4678 is highly recommended to be assembled
using a standard lead-free reflow profile, IPC/JEDEC
J-STD-020. The RN4678 can be soldered to the host
PCB by using the standard leaded and lead-free solder
reflow profile.
To avoid damage to the module, follow these recom-
mendations:
• Follow solder reflow recommendations provided
in Microchip Technology Application Note AN233
Solder Reflow Recommendation (DS00233).
• Refer to the solder paste data sheet for specific
reflow profile recommendations.
•Do not exceed the peak temperature (TP) of
250ºC.
• Use no-clean flux solder paste.
•Do not wash as moisture can be trapped under
the shield.
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
• Standard: IPC/JEDEC J-STD-020
- Condition: Preheat:150~200 ℃for 60~120
seconds.
- Average ramp-up rate (217 ℃ to peak):
3℃/sec max.
- Temperature maintained above 217 ℃:
60~150 seconds.
- Time within 5 ℃ of peak temperature:
30 ~ 40 seconds.
- Peak temperature: 260 +5/-0 ℃.
- Ramp-down rate (peak to 217): 6 ℃/sec.
max.
- Time 25 ℃ to peak temperature: 8 minutes
max.
- Cycle interval: 5 minutes
FIGURE 6-1: REFLOW PROFILE
RN4678
DS50002519D-Page 26 2016-2019 Microchip Technology Inc.
NOTES:
2016-2019 Microchip Technology Inc. DS50002519D-Page 27
RN4678
7.0 MODULE PLACEMENT
For a Bluetooth wireless product, the antenna place-
ment affects the performance of the whole system. The
antenna requires free space to radiate the RF signal
and it cannot be surrounded by the ground plane.
Microchip recommends that the areas underneath the
antenna on the host PCB must not contain copper on
top, inner or bottom layer. Figure 7-1 illustrates an
example of good and poor antenna placement on a
host PCB with ground plane.
The ground plane can be extended beyond the mini-
mum recommended as required for the main PCB EMC
noise reduction. For the best range performance, keep
all external metal away from the ceramic chip antenna,
that is minimum 15 mm away.
FIGURE 7-1: MODULE PLACEMENT EXAMPLES
TABLE 7-1: RECOMMENDED ANTENNA
Description Manufacturer Part Number Manufacturer
ANT ANT3216A063R2400A PIFA 2.4 GHz L3.2W1.6 ANT3216A063R2400A YAGEO
RN4678
DS50002519D-Page 28 2016-2019 Microchip Technology Inc.
Figure 7-2 illustrates the RN4678 module mounted on the RN4678 Evaluation Board (EVB). It also shows the recom-
mended keep out area for the antenna.
FIGURE 7-2: KEEP OUT AREA RECOMMENDED FOR ANTENNA
Note: For additional information on free space for antenna placement design, refer to the design rule document
of the antenna manufacturer.
2016-2019 Microchip Technology Inc. DS50002519D-Page 29
RN4678
7.1 RN4678 Ceramic Chip Antenna
The RN4678 contains an integral ceramic chip antenna. Figure 7-3 illustrates the antenna radiation pattern of the
ceramic chip antenna on the RN4678.
FIGURE 7-3: RN4678 ANTENNA RADIATION PATTERN
Parameter Values
Frequency 2450 MHz
Peak Gain 1.63 dBi
Efficiency 71.55%
RN4678
DS50002519D-Page 30 2016-2019 Microchip Technology Inc.
NOTES:
2016-2019 Microchip Technology Inc. DS50002519D-Page 31
RN4678
8.0 ORDERING INFORMATION
Table 8-1 provides ordering information for the RN4678 module.
TABLE 8-1: ORDERING INFORMATION
Go to http://www.microchip.com for current pricing and a list of distributors carrying Microchip products.
Device Microchip IC Antenna Description Shield Regulatory Certification Ordering Number
RN4678-V/RM100 IS1678SM On-board BT Dual Mode, Class 2 Yes FCC, ISED, RED, MIC,
KCC, NCC, SRRC
RN4678-V/RM100
RN4678APL-V/RM100 IS1678SM On-board BT Dual Mode, Class 2, Use with
Apple MFI
Yes FCC, ISED, RED, MIC,
KCC, NCC, SRRC
RN4678APL-V/RM100
RN4678-V/RM113 IS1678SM On-Board BT Dual Mode, Class 2 Yes FCC, ISED, RED, MIC,
KCC, NCC, SRRC
RN4678-V/RM113
RN4678APL-V/RM113 IS1678SM On-Board BT Dual Mode, Class 2 Yes FCC, ISED, RED, MIC,
KCC, NCC, SRRC
RN4678APL-V/RM113
RN4678
DS50002519D-Page 32 2016-2019 Microchip Technology Inc.
NOTES:
2016-2019 Microchip Technology Inc. DS50002519D-page 33
RN4678
9.0 REGULATORY APPROVAL
This section outlines the regulatory information for the
RN4678 module for the following countries:
• United States
• Canada
• Europe
• Japan
•Korea
•Taiwan
• Other Regulatory Jurisdictions
9.1 United States
The RN4678 module has received Federal Communi-
cations Commission (FCC) CFR47 Telecommunica-
tions, Part 15 Subpart C “Intentional Radiators” single-
modular approval in accordance with Part 15.212 Mod-
ular Transmitter approval. Single-modular transmitter
approval is defined as a complete RF transmission
sub-assembly, designed to be incorporated into
another device, that must demonstrate compliance
with FCC rules and policies independent of any host. A
transmitter with a modular grant can be installed in dif-
ferent end-use products (referred to as a host, host
product, or host device) by the grantee or other equip-
ment manufacturer, then the host product may not
require additional testing or equipment authorization
for the transmitter function provided by that specific
module or limited module device.
The user must comply with all of the instructions pro-
vided by the Grantee, which indicate installation and/or
operating conditions necessary for compliance.
A host product itself is required to comply with all other
applicable FCC equipment authorization regulations,
requirements, and equipment functions that are not
associated with the transmitter module portion. For
example, compliance must be demonstrated: to regula-
tions for other transmitter components within a host
product; to requirements for unintentional radiators
(Part 15 Subpart B), such as digital devices, computer
peripherals, radio receivers, etc.; and to additional
authorization requirements for the non-transmitter
functions on the transmitter module (i.e., Verification or
Declaration of Conformity) as appropriate (e.g., Blue-
tooth and Wi-Fi transmitter modules may also contain
digital logic functions).
9.1.1 LABELING AND USER
INFORMATION REQUIREMENTS
The RN4678 module has been labeled with its own
FCC ID number, and if the FCC ID is not visible when
the module is installed inside another device, then the
outside of the finished product into which the module is
installed must also display a label referring to the
enclosed module. This exterior label can use wording
as follows:
A user’s manual for the product should include the fol-
lowing statement:
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748 available at the FCC Office of Engi-
neering and Technology (OET) Laboratory Division
Knowledge Database (KDB)
http://apps.fcc.gov/oetcf/kdb/index.cfm.
Contains Transmitter Module
FCC ID: A8TBM78ABCDEFGH
or
Contains FCC ID: A8TBM78ABCDEFGH
This device complies with Part 15 of the FCC
Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any
interference received, including interference that
may cause undesired operation.
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equip-
ment generates, uses and can radiate radio fre-
quency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the follow-
ing measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment
and receiver.
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is con-
nected.
• Consult the dealer or an experienced radio/TV
technician for help.
RN4678
DS50002519D-page 34 2016-2019 Microchip Technology Inc.
9.1.2 RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. KDB Publication 447498 Gen-
eral RF Exposure Guidance provides guidance in
determining whether proposed or existing transmitting
facilities, operations or devices comply with limits for
human exposure to Radio Frequency (RF) fields
adopted by the Federal Communications Commission
(FCC).
Output power listed is conducted. This grant is valid
only when the module is sold to OEM integrators and
must be installed by the OEM or OEM integrators. This
transmitter is restricted for use with the specific
antenna(s) tested in this application for Certification
and must not be co-located or operating in conjunction
with any other antenna or transmitters within a host
device, except in accordance with FCC multi-transmit-
ter product procedures. This module is approved for
installation into mobile or/and portable host platforms.
9.1.3 HELPFUL WEB SITES
Federal Communications Commission (FCC):
http://www.fcc.gov
FCC Office of Engineering and Technology (OET) Lab-
oratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm
9.2 Canada
The RN4678 module has been certified for use in
Canada under Innovation, Science and Economic
Development Canada (ISED, formerly Industry
Canada), Radio Standards Procedure (RSP) RSP-100,
Radio Standards Specification (RSS) RSS-Gen and
RSS-247. Modular approval permits the installation of
a module in a host device without the need to recertify
the device.
9.2.1 LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements (from RSP-100, Issue 11, Sec-
tion 3): The host product shall be properly labeled to
identify the module within the host device.
The Innovation, Science and Economic Development
Canada certification label of a module shall be clearly
visible at all times when installed in the host product,
otherwise the host device must be labeled to display
the Innovation, Science and Economic Development
Canada certification number of the module, preceded
by the word “Contains”, or similar wording expressing
the same meaning, as follows:
User Manual Notice for License-Exempt Radio Appara-
tus (from Section 8.4, RSS-Gen, Issue 4, November
2014): User manuals for license-exempt radio appara-
tus shall contain the following or equivalent notice in a
conspicuous location in the user manual or alterna-
tively on the device or both:
Guidelines on Transmitter Antenna for License Exempt
Radio Apparatus:
9.2.2 RF EXPOSURE
All transmitters regulated by the Innovation, Science
and Economic Development Canada (ISED) must
comply with RF exposure requirements listed in RSS-
102 - Radio Frequency (RF) Exposure Compliance of
Radiocommunication Apparatus (All Frequency
Bands).
This transmitter is restricted for use with a specific
antenna tested in this application for certification, and
must not be co-located or operating in conjunction with
any other antenna or transmitters, except in accor-
dance with Innovation, Science and Economic Devel-
opment Canada multi-transmitter guidelines.
Contains transmitter module
IC: 12246A-BM78SPPS5M2
This device complies with Industry Canada's license-
exempt RSS standard(s). Operation is subject to the
following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, includ-
ing interference that may cause undesired operation
of the device.
Le présent appareil est conforme aux CNR d'Indus-
trie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux con-
ditions suivantes:
(1) l'appareil ne doit pas produire de brouillage;
(2) l'utilisateur de l'appareil doit accepter tout brouil-
lage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
Under Industry Canada regulations, this radio trans-
mitter may only operate using an antenna of a type
and maximum (or lesser) gain approved for the trans-
mitter by Industry Canada. To reduce potential radio
interference to other users, the antenna type and its
gain should be so chosen that the equivalent isotrop-
ically radiated power (e.i.r.p.) is not more than that
necessary for successful communication.
Conformément à la réglementation d'Industrie Can-
ada, le présent émetteur radio peut fonctionner avec
une antenne d'un type et d'un gain maximal (ou
inférieur) approuvé pour l'émetteur par Industrie Can-
ada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il
faut choisir le type d'antenne et son gain de sorte
que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à
l'établissement d'une communication satisfaisante.
2016-2019 Microchip Technology Inc. DS50002519D-page 35
RN4678
The device operates at an output power level which is
within the ISED SAR test exemption limits at any user
distance.
9.2.3 HELPFUL WEB SITES
Innovation, Science and Economic Development Can-
ada (ISED): http://www.ic.gc.ca/
9.3 Europe
The RN4678 module is a Radio Equipment Directive
(RED) assessed radio module that is CE marked and
has been manufactured and tested with the intention of
being integrated into a final product.
The RN4678 module has been tested to RED 2014/53/
EU Essential Requirements for Health and Safety (Arti-
cle (3.1(a)), Electromagnetic Compatibility (EMC) (Arti-
cle 3.1(b)), and Radio (Article 3.2) and are summarized
in Table 9-1 European Compliance Testing.
The ETSI provides guidance on modular devices in
“Guide to the application of harmonised standards cov-
ering articles 3.1b and 3.2 of the RED 2014/53/EU
(RED) to multi-radio and combined radio and non-radio
equipment” document available at www.etsi.org.
9.3.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
RN4678 module must follow CE marking requirements.
9.3.2 CONFORMITY ASSESSMENT
From ETSI Guidance Note EG 203367, section 6.1
Non-radio products are combined with a radio product:
If the manufacturer of the combined equipment installs
the radio product in a host non-radio product in equiva-
lent assessment conditions (i.e. host equivalent to the
one used for the assessment of the radio product) and
according to the installation instructions for the radio
product, then no additional assessment of the com-
bined equipment against article 3.2 of the RED is
required
The European Compliance Testing listed in Table 9-1,
was performed using the integral ceramic chip
antenna.
9.3.2.1 SIMPLIFIED EU DECLARATION OF
CONFORMITY
Hereby, Microchip Technology Inc. declares that the
radio equipment type RN4678 is in compliance with
Directive 2014/53/EU.
The full text of the EU declaration of conformity, for this
product, is available at: http://www.microchip.com/
design-centers/wireless-connectivity.
Note: To maintain conformance to the testing
listed in Table 9-1, the module shall be
installed in accordance with the installa-
tion instructions in this data sheet and
shall not be modified.
When integrating a radio module into a
completed product the integrator
becomes the manufacturer of the final
product and is therefore responsible for
demonstrating compliance of the final
product with the essential requirements
against the RED.
TABLE 9-1: EUROPEAN COMPLIANCE TESTING
Certification Standards Article Laboratory Report Number Date
Safety EN 60950-1:2006+A11:2009
+A1:2010 +A12:2011+A2:2013
[3.1(a)] TUV
Rheinland
10052799 001 2015-10-30
Health EN 300 328 V1.9.1
EN 62479:2010
10052796 001
10052797 001
2015-12-21
EMC EN 300 489-1 V1.9. [3.1(b)] 10052437 001 2015-09-14
EN 301 489-17 V2.2.1
EN 301 489-1 V2.1.1 10052437 002 2017-05-26
EN 301 489-1 V2.2.0
EN 301 489-17 V3.1.1
EN 301 489-17 V3.2.0
Radio EN 300 328 V1.9.1 (3.2) 10052796 001
10052797 001
2015-12-21
EN 300 328 V2.1.1 10052796 002
10052797 002
2017-05-26
RN4678
DS50002519D-page 36 2016-2019 Microchip Technology Inc.
9.3.3 HELPFUL WEBSITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E, which
can be downloaded from the European Communica-
tions Committee (ECC) at: http://www.ecodocdb.dk/
Additional helpful web sites are:
• Radio Equipment Directive (2014/53/EU): https://
ec.europa.eu/growth/single-market/european-
standards/harmonised-standards/red_en
•European Conference of Postal and Telecommu-
nications Administrations (CEPT):
http://www.cept.org
• European Telecommunications Standards Insti-
tute (ETSI):http://www.etsi.org
•The Radio Equipment Directive Compliance
Association (REDCA): http://www.redca.eu/
9.4 Japan
The RN4678 module has received type certification
and is labeled with its own technical conformity mark
and certification number as required to conform to the
technical standards regulated by the Ministry of Internal
Affairs and Communications (MIC) of Japan pursuant
to the Radio Act of Japan.
Integration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed. Additional testing may be
required:
• If the host product is subject to electrical appli-
ance safety (for example, powered from an AC
mains), the host product may require Product
Safety Electrical Appliance and Material (PSE)
testing. The integrator must contact their confor-
mance laboratory to determine if this testing is
required.
• There is a voluntary Electromagnetic Compatibil-
ity (EMC) test for the host product administered
by VCCII: http://www.vcci.jp/vcci_e/index.html
9.4.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
RN4678 module must follow Japan marking
requirements. The integrator of the module must refer
to the labeling requirements for Japan available at the
Ministry of Internal Affairs and Communications (MIC)
website.
The RN4678 module is labeled with its own technical
conformity mark and certification number. The final
product in which this module is being used must have
a label referring to the type certified module inside:
9.4.2 HELPFUL WEB SITES
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm
Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/
9.5 Korea
The RN4678 module has received certification of con-
formity in accordance with the Radio Waves Act. Inte-
gration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed.
9.5.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
RN4678 module must follow KC marking requirements.
The integrator of the module should refer to the labeling
requirements for Korea available on the Korea Com-
munications Commission (KCC) website.
The RN4678 module is labeled with its own KC mark.
The final product requires the KC mark and certificate
number of the module:
9.5.2 HELPFUL WEB SITES
Korea Communications Commission (KCC):
http://www.kcc.go.kr.
National Radio Research Agency (RRA):
http://rra.go.kr.
2016-2019 Microchip Technology Inc. DS50002519D-page 37
RN4678
9.6 Taiwan
The RN4678 module has received compliance
approval in accordance with the Telecommunications
Act. Customers seeking to use the compliance
approval in their product must contact Microchip Tech-
nology sales or distribution partners to obtain a Letter
of Authority.
Integration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed.
9.6.1 LABELING AND USER
INFORMATION REQUIREMENTS
For the RN4678 module, due to limited module size,
the NCC mark and ID are displayed in the data sheet
and/or packaging and cannot be displayed on the mod-
ule label:
The user's manual must contain below warning (for RF
device) in traditional Chinese:
注意 !
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，非經許
可，
公司、商號或使用者均不得擅自變更頻率、加大功率或
變更原設計
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及
干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無干擾時
方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用
電波輻射性
電機設備之干擾。
9.6.2 HELPFUL WEB SITES
National Communications Commission (NCC):
http://www.ncc.gov.tw.
9.7 China
The RN4678 module has received certification of con-
formity in accordance with the China MIIT Notice 2014-
01 of State Radio Regulation Committee (SRRC) certi-
fication scheme. Integration of this module into a final
product does not require additional radio certification,
provided installation instructions are followed and no
modifications of the module are allowed.
9.7.1 LABELING AND USER
INFORMATION REQUIREMENTS
The RN4678 module is labeled with its own CMIIT ID
as follows:
When Host system is using an approved Full Modular
Approval (FMA) radio: The host must bear a label con-
taining the statement “This device contains SRRC
approved Radio module CMIIT ID: 2016DJ5735”.
9.8 Other Regulatory Information
• For information on the other countries jurisdictions
covered, refer to the http://www.microchip.com/
design-centers/wireless-connectivity.
• Should other regulatory jurisdiction certification be
required by the customer, or the customer need to
recertify the module for other reasons, contact
Microchip for the required utilities and documenta-
tion.
CMIIT ID: 2016DJ5735
RN4678
DS50002519D-page 38 2016-2019 Microchip Technology Inc.
NOTES:
2016-2019 Microchip Technology Inc. DS50002519D-page 39
RN4678
APPENDIX A: REVISION HISTORY
Revision A (June 2016)
This is the initial released version of the document.
Revision B (January 2018)
• Updated Figure 1-1, Figure 1-2, and Figure 5-3.
• Updated Ta b l e 1-1.
• Added Section 2.2 “Flow Control”.
• Updated Section 8.0 “Ordering Information”
• Updated Section “Product Identification Sys-
tem”
• Removed Figure 1-3, Figure 2-9, Figure 5-4,
Figure 5-5, and Figure 5-6.
Revision C (March 2019)
This revision includes the following changes and minor
updates to text and formatting, which were incorpo-
rated throughout the document.
Revision D (May 2019)
Updated China labeling ID in 9.7.1 “LABELING AND
USER INFORMATION REQUIREMENTS”.
TABLE 9-1: MAJOR SECTION UPDATES
Section Description
Section “Features” Updated certification information
Section “Data Throughput” Updated Kbytes/s
Section 1.0 “Device Overview” Updated Figure 1-1 and Ta b l e 1-1
Chapter 2.0, Application Information • Updated Table 2-3
• Added SW_BTN note in Section 2.5 “Software Button
(SW_BTN)”
Chapter 3.0, Electrical Characteristics • Updated Storage temperature
• Updated current consumption values in Tabl e 3-6 and Tabl e 3-7
Chapter 5.0, Physical Dimensions Updated Figure 5-1 and Figure 5-2
Chapter 8.0, Ordering Information Updated Table 8-1 with certification information
Chapter 9.0, Regulatory Approval • Updated IC to ISED in Section 9.2 “Canada”
• Updated RED certification information in Section 9.3 “Europe”
• Updated Section 9.6 “Taiwan”
• Added Section 9.7 “China”
RN4678
DS50002519D-page 40 2016-2019 Microchip Technology Inc.
NOTES:
2015-2019 Microchip Technology Inc. DS50002519D-page 41
RN4678
THE MICROCHIP WEBSITE
Microchip provides online support via our WWW site at
www.microchip.com. This website is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the website contains the following information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip website at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the website
at: http://microchip.com/support
2015-2019 Microchip Technology Inc. DS50002519D-page 42
RN4678
NOTES:
RN4678
DS50002519D-page 43 2016-2019 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.
Device: RN4678: Ceramic Chip Antenna
Temperature
Range:
V=-20C to +70C(Various)
Package: RM =
Radio Module
Example:
RN4678-V/RM100: Various temperature
PART NO.
Device
V
Temperature
Range
RM
Package
XXX
Firmware
Revision
Number
2019 Microchip Technology Inc. DS50002519D-page 44
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4556-2
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS50002519D-page 45 2019 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
ASIA/PACIFIC
Australia - Sydney
Tel: 61-2-9868-6733
China - Beijing
Tel: 86-10-8569-7000
China - Chengdu
Tel: 86-28-8665-5511
China - Chongqing
Tel: 86-23-8980-9588
China - Dongguan
Tel: 86-769-8702-9880
China - Guangzhou
Tel: 86-20-8755-8029
China - Hangzhou
Tel: 86-571-8792-8115
China - Hong Kong SAR
Tel: 852-2943-5100
China - Nanjing
Tel: 86-25-8473-2460
China - Qingdao
Tel: 86-532-8502-7355
China - Shanghai
Tel: 86-21-3326-8000
China - Shenyang
Tel: 86-24-2334-2829
China - Shenzhen
Tel: 86-755-8864-2200
China - Suzhou
Tel: 86-186-6233-1526
China - Wuhan
Tel: 86-27-5980-5300
China - Xian
Tel: 86-29-8833-7252
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
India - New Delhi
Tel: 91-11-4160-8631
India - Pune
Tel: 91-20-4121-0141
Japan - Osaka
Tel: 81-6-6152-7160
Japan - Tokyo
Tel: 81-3-6880- 3770
Korea - Daegu
Tel: 82-53-744-4301
Korea - Seoul
Tel: 82-2-554-7200
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
Malaysia - Penang
Tel: 60-4-227-8870
Philippines - Manila
Tel: 63-2-634-9065
Singapore
Tel: 65-6334-8870
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Thailand - Bangkok
Tel: 66-2-694-1351
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Finland - Espoo
Tel: 358-9-4520-820
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-72400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
05/14/19
