OPTICAL COMMUNICATIONS 1310/1550 nm 10 G XFP ROSA Key Features * Handles data rates up to 10 Gbps * Supports 1310 nm and 1550 nm multi-rate applications * Operates from -40C to 85C * Includes differential output * Supports received signal strength indicator (RSSI) function Applications * 10 G Ethernet 10GBASE-LR/ER * SONET OC-192 SR1/IR2 Compliance * RoHS 6 north america : 800 498-JDSU (5378) The high-reliability JDSU 1310/1550 nm 10G XFP ROSA receiver optical sub-assembly (ROSA) product, designed specifically for the XFP transceiver, provides excellent performance over extended operating temperatures in high-speed applications up to 10 Gbps. The product integrates PIN and TIA chips in a custom hermetic TO46 package. Each device is actively aligned to a precision OSA housing using a proprietary alignment algorithm and is tested to precise requirements. An optional, controlled-impedance flex OSA-PCBA connector provides the user with optimum performance. worldwide : +800 5378-JDSU website : www.jdsu.com 1310/1550 nm 10 G XFP ROSA 2 Dimensions Diagram (Specifications in mm unless otherwise noted. ) 5.73 0.87 0.58 BARREL KEYING FEATURE R3.30 4.00 2X 13.85 2.95 4.90 2.92 2.97 A ID OF LC RECEPTACLE 2.92 5.84 1.10 OPTICAL REF PLANE 3X 13.46 +0.35 4.76 - 0.25 6.44 2X 57 Pinout PIN 5 PIN 4 2X PIN 1 0.25 2.54 3X Pin Symbol Description 1 2 3 4 5 OUT+ Vcc RSSI OUT- GND Non-inverting output Power supply Received signal strength indicator Inverting output Case & RF ground 2X 82 1.40 0.44 PIN 3 PIN 2 0.50 A RXTO ASSY 10 MAX ROTATIONAL MISALIGNMENT BETWEEN RXTO ASSEMBLY AND BARREL Electrical Schematics for flexible printed circuit (FPC) Pinout Note: Pin definition for FPC can open to customer design Pin Symbol 1 2 3 4 5 6 7 8 GND Vcc GND VOUT -N VOUT +P GND Monitor GND 1310/1550 nm 10 G XFP ROSA 3 Absolute Maximum Ratings Parameter Symbol Rating Storage temperature Operating case temperature (Top) Supply voltage Voltage at either output Current into any input or output ESD threshold (HBM) Maximum incident optical power TSTG Top Vcc VIO IIO VESD PO -40 to +85C -40 to +85C -0.3 to 4.0 V -0.3 to 4.0 V -8 to 8 mA 300 V +4.5 dBm Note: All specifications are at Top = 25C unless otherwise stated Specifications Parameter Symbol Conditions Minimum Typical Maximum TIA supply voltage Vcc 3.15 V 3.30 V 3.45 V TIA supply current Icc Vcc=3.3 V 28 mA 41mA Wavelength l 1260 nm 1565 nm Photodiode responsivity R Measured at 1310 nm 0.75 A/W Single ended output impedance Zout 40 W 50 W 60 W Power consumption Pe 100 mW RSSI offset current (no light)1 IdRSSI 3.5 A 10 A 16 A RSSI gain internal bias ARSSI 0.48 A/A 0.50 A/A 0.52 A/A Data rate B 9.95 Gbps 11.35 Gbps RF bandwidth (-3 dB) BW Small signal bandwidth 7 GHz Low frequency cut-off (-3 dB) fc, low 30 KHz 100 KHz Sensitivity average power Sens_Avg 10.709 Gbps, NRZ, PRBS 231-1 1550 nm, ExtRatio>10 dB, BER=10-12 -19.5 dBm Stressed sensitivity OMA XFP-SR1 SRS_10GbaseL IEEE802.3ae, 10GBase-L stress -16 dBm XFP-IR2 SRS_10GbaseE IEEE802.3ae, 10GBase-E stress -16 dBm Overload Pmax 10.709 Gbps, NRZ, PRBS 231-1, 1.5 dBm - 1260 - 1355 nm, Ext Ratio=13.0 dB, BER=10-12 Optical return loss ORL XFP-SR1 1290 - 1330 nm -14 dB XFP-IR2 1530 - 1565 nm -28 dB Transimpedance (single-ended) ZT 5000 W 7000 W 10000 W Maximum differential Vout, D, Max 240 mVPP 280 mVPP 350 mVPP output voltage TIA input referred RMS noise 10 GHz bandwidth 0.9 A 1.6 A Note: All parameters are over temperature and end-of-life unless otherwise stated. 1. The RSSI (received signal strength indicator) function is used to mirror the photodiode output with an analog current output. This current has been defined at certain proportion ratio to the photodiode output current. This function requires a resistive load to ground (GND). The voltage gain can be adjusted for the intended application by choosing different external resistor. Offset is added to improve accuracy below 5 A. When measured without input current (no light) the offset can be subtracted as a constant offset from RSSI measurements. RSSI current output will operate from sensitivity to overload. 1310/1550 nm 10 G XFP ROSA Electrostatic Discharge (ESD) ESD protection is imperative. Use of grounding straps, antistatic mats, and other standard ESD protective equipment is required when handling or testing a junction photodiode. Fiber pigtail should be handled with less than 10 N pull and with bending radius greater than one inch. Soldering temperature of the leads should not exceed 260C for more than 10 seconds. Ordering Information For more information on this or other products and their availability, please contact your local JDSU account manager or JDSU directly at 1-800-498-JDSU (5378) in North America and +800-5378-JDSU worldwide, or via e-mail at customer.service@jdsu.com. Product Code 21141321-001 21141320-001 21132362-001 Description 10G 5L LC ROSA for XFP SR1 with flex 10G 5L LC ROSA for XFP IR2 with flex 10G 5L LC ROSA for XFP SR1 without flex north america : 800 498-JDSU (5378) worldwide : +800 5378-JDSU website : www.jdsu.com Product specifications and descriptions in this document subject to change without notice. (c) 2011 JDS Uniphase Corporation 30162889 001 0811 RXPMGRTL097.DS.OC.AE August 2011