GBU6A - GBU6M Bridge Rectifiers Features * Glass-Passivated Junction * Surge Overload Rating: 175 A Peak * Reliable Low-Cost Construction Utilizing Molded Plastic Technique * Ideal for Printed Circuit Board * UL Certified: UL #E258596 + ~ ~ - GBU Ordering Informations Part Number Marking Package Packing Method GBU6A GBU6A GBU 4L Rail GBU6B GBU6B GBU 4L Rail Rail GBU6D GBU6D GBU 4L GBU6G GBU6G GBU 4L Rail GBU6J GBU6J GBU 4L Rail GBU6K GBU6K GBU 4L Rail GBU6M GBU6M GBU 4L Rail Absolute Maximum Ratings(1) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at TA = 25C unless otherwise noted. Symbol Value Parameter 6A 6B 6D 6G 6J 6K 6M Units VRRM Maximum Repetitive Reverse Voltage 50 100 200 400 600 800 1000 V VRMS Maximum RMS Bridge Input Voltage 35 70 140 280 420 560 700 V DC Reverse Voltage (Rated VR) 50 100 200 400 600 800 1000 V VR IF(AV) Average Recitified Forward Current TA = 100C 6.0 A IFSM Non-Repetitive Peak Forward Surge Current 8.3 ms Single Half-Sine-Wave 175 A TSTG Storage Temperature Range -55 to +150 C Operating Junction Temperature -55 to +150 C TJ Note: 1. These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. (c) 2001 Fairchild Semiconductor Corporation GBU6A - GBU6M Rev. 1.2.1 www.fairchildsemi.com 1 GBU6A - GBU6M -- Bridge Rectifiers October 2013 Values are at TA = 25C unless otherwise noted. Symbol PD RJA Parameter Value Power Dissipation Thermal Resistance per Leg, Junction to Ambient(2) RJL Thermal Resistance per Leg, Junction to Lead(3) Notes: 2. Device mounted on PCB with 0.5 x 0.5 inch (12 x 12 mm). 3. Device mounted on Al plate with 2.6 x 1.4 x 0.06 inch (6.5 x 3.5 x 0.15 cm). Units 12 W 18.6 C/W 3.1 C/W Value Units Electrical Characteristics Values are at TA = 25C unless otherwise noted. Symbol VF Parameter Forward Voltage, per Element IR Reverse Current, per Element at Rated VR I2t I2t Rating for Fusing (c) 2001 Fairchild Semiconductor Corporation GBU6A - GBU6M Rev. 1.2.1 6.0 A 1.0 V TA = 25C 5.0 A TA = 125C 500 A t < 8.35 ms 127 A2s www.fairchildsemi.com 2 GBU6A - GBU6M -- Bridge Rectifiers Thermal Characteristics 5 Forward Current, IF [A] Average Rectified Forward Current, IF [A] 100 6 4 HEAT-SINK MOUNTING, TC 4x4x0.15" COPPER PLATE 3 2 MOUNTED ON PC BOARD, TA 0.5" (12.7mm) LEAD LENGTH 60Hz RESISTIVE OR INDUCTIVE LOAD 1 0 0 50 100 [C] Ambient Temperature Peak Forward Surge Current, IFSM [A] T A = 100 C Reverse Current, IR [mA] 0.8 0.9 1 1.1 1.2 Forward Voltage, VF [V] 1.3 1.4 Figure 2. Forward Voltage Characteristics 10 1 0.1 TA = 25 C 0 TA = 25 C Pulse Width = 300 s 1% Duty Cycle 1 0.1 0.7 150 Figure 1. Forward Current Derating Curve 0.01 10 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage [%] Figure 3. Reverse Current vs. Reverse Voltage 175 140 105 70 T A = 105 C 35 0 1 2 5 10 20 50 Number of Cycles at 60Hz 100 Figure 4. Non-Repetitive Surge Current Total Capacitance, CT [pF] 400 TA = 25 C f = 1.0 MHz Visg = 50m Vp-p 100 50 10 1 5 10 Reverse Voltage, VR [V] 50 100 Figure 5. Total Capacitance (c) 2001 Fairchild Semiconductor Corporation GBU6A - GBU6M Rev. 1.2.1 www.fairchildsemi.com 3 GBU6A - GBU6M -- Bridge Rectifiers Typical Performance Characteristics GBU6A - GBU6M -- Bridge Rectifiers Physical Dimension GBU-4L 22.30 21.80 3.56 3.30 R1.90 TYP 3.20 X 45 9 TYP 18.80 18.30 7.90 7.40 3.91 ~ ~ + 2.16 1.65 9 TYP 2.16 1.79 2.03 1.52 2.54 (2X) 2.16 5.33 (3X) 4.83 18.00 17.50 2.03 (2X) 1.65 0.75 0.46 1.27 (4X) 1.02 NOTES: A. THIS PACKAGE DOES NOT CONFORM TO ANY STANDARDS. B. ALL DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR PROTRUSIONS. E. DIMENSION AND TOLERANCE AS PER ASME Y14.5-1994. F. DRAWING FILE NAME: GBU04AREV1 Figure 6. 4-LEAD, GBU, THROUGH-HOLE, MOLDED PACKAGE (ACTIVE) Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/GB/GBU04A.pdf. 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Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I66 (c) Fairchild Semiconductor Corporation www.fairchildsemi.com