ALMD-LG37, ALMD-LL37, ALMD-LM37, ALMD-LB37
High Brightness SMT Oval LED Lamps
Amber, Red, Green and Blue
Data Sheet
CAUTION: InGaN devices are Class 1C HBM ESD sensitive, AlInGaP devices are Class 1B ESD sensitive per JEDEC Standard.
Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Description
The new Avago ALMD-Lx37 Oval LED series has the same
or just slightly less luminous intensity than conventional
high brightness through holes LEDs.
The new Oval LED lamps can be assembled using common
SMT assembly processes and are compatible with indus-
trial reow soldering processes.
The LEDs are made with an advanced optical grade epoxy
for superior performance in outdoor sign applications.
The surface mount Oval LEDs are specically designed for
full color / video signs and indoor or outdoor passenger
information sign applications.
For easy pick and place assembly, the LEDs are shipped
in tape and reel. Every reeled is shipped from a single
intensity and color bin except the red color for better uni-
formity.
Package Dimensions
Features
• Well dened spatial radiation pattern
• High brightness material
• Available in Red, Amber, Green and Blue color:
– Red AlInGaP 626 nm
– Amber AlInGaP 590 nm
– Green InGaN 525 nm
– Blue InGaN 470 nm
• JEDEC MSL 2A
• Compatible with reow soldering process
• Tinted and diused lens
• Wide viewing angle: 40° x 100°
Applications
• Full color signs
• Mono color signs
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.20 mm unless other specied.
CAUTION: Customer is advised to always keep the LED in the moisture barrier bag with <5%RH when not in use as prolonged
exposure to environment might cause the leads to tarnish or rust, which might cause diculties in soldering.
Package Marking
(Anode Mark)
A - Anode
C - Cathode
CC
AA
4.20 ± 0.20
4.20 ± 0.20
1.00
1.4 (4X)
1.60 ± 0.50
5.20 ± 0.50
2.50
3.40 ± 0.50
4.75 ± 0.50
2
Device Selection Guide
Part Number Color and Dominant Wavelength
λd (nm) Typ
Luminous Intensity Iv (mcd) [1,2,5] Viewing Angle
Typ - ° [4]
Min Max
ALMD-LG37-XZ002 Red 626 1660 2900 40° x 100°
ALMD-LL37-XZ002 Amber 590 1660 2900 40° x 100°
ALMD-LM37-24002 Green 525 3500 6050 40° x 100°
ALMD-LB37-SU002 Blue 470 660 1150 40° x 100°
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ½ is the o-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ± 15%
Part Numbering System
Packaging Option
02: tested 20mA, 13 inch carrier tape, 8mm pitch, 16mm carrier width
Color Bin Selection
0: Full Distribution
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle
37: Oval 40° x 100° / Mild steel lead frame
Color
B: Blue
G: Red
L: Amber
M: Green
Package
L: SMT Oval Lamps (AlInGaP/InGaN)
SMT Lamps
ALMD – X X 3 7 – x x x xx
3
Absolute Maximum Rating, TJ = 25 °C
Parameter Red and Amber Green Blue Unit
DC Forward Current [1] 50 30 20 mA
Peak Forward Current 100 [2] 100 [3] 100 [3] mA
Power Dissipation 120 114 76 mW
LED Junction Temperature 110 °C
Operating Temperature Range -40 to +85 °C
Storage Temperature Range -40 to +100 °C
Notes:
1. Derate linearly as shown in Figure 4 and Figure 9.
2. Duty Factor 30%, frequency 1kHz.
3. Duty Factor 10%, frequency 1kHz.
Electrical / Optical Characteristics, TJ = 25 °C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage
Red
Amber
Green
Blue
VF
1.8
1.8
2.8
2.8
2.1
2.1
3.2
3.2
2.4
2.4
3.8
3.8
V IF = 20 mA
Reverse Voltage [3]
Red & Amber
Green & Blue
VR
5
5
V IR = 100 mA
IR = 10 mA
Dominant Wavelength [1]
Red
Amber
Green
Blue
λd
618.0
584.5
519.0
460.0
626.0
590.0
530.0
470.0
630.0
594.5
539.0
480.0
IF = 20 mA
Peak Wavelength
Red
Amber
Green
Blue
λPEAK 634
594
516
464
nm Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Thermal Resistance
Red
Amber
Green
Blue
RθJ-PIN
270
270
270
480
°C/W LED Junction-to-Pin
Luminous Ecacy [2]
Red
Amber
Green
Blue
hV200
490
530
65
lm/W Emitted Luminous Power/Emitted
Radiant Power
Thermal coecient of λd
Red
Amber
Green
Blue
0.059
0.103
0.028
0.024
nm/°C IF = 20 mA ; +25°C ≤ TJ ≤ +100°C
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/hV where IV is the luminous intensity in candelas and hV is
the luminous ecacy in lumens/watt.
3. Indicates product nal testing condition. Long term reverse bias is not recommended.
4
AlInGaP
0.0
0.2
0.4
0.6
0.8
1.0
500 550 600 650
WAVELENGTH - nm
RELATIVE INTENSITY
Amber Red
0
10
20
30
40
50
60
0 0.5 1 1.5 2 2.5 3
FORWARD CURRENT - mA
FORWARD VOLTAGE - V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 10 20 30 40 50 60
RELATIVE LUMINOUS INENSITY
(NORMALIZED AT 20mA)
FORWARD CURRENT - mA
0
10
20
30
40
50
60
0 20 40 60 80 100
MAXIMUM FORWARD CURRENT - mA
AMBIENT TEMPERATURE (°C)
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1
1.2
0 10 20 30 40 50 60
DOMINANT WAVELENGTH SHIFT - nm
FORWARD CURRENT - mA
Red
Amber
Red
Amber
RJA = 660 °C/W
RJA = 460 °C/W
Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature
Figure 5. Relative Dominant Wavelength Shift vs Forward Current
5
InGaN
0.0
0.2
0.4
0.6
0.8
1.0
380 430 480 530 580 630
WAVELENGTH - nm
RELATIVE INTENSITY
-10
-5
0
5
10
0 20 40 60 80 100
FORWARD CURRENT-mA
RELATIVE DOMINANT WAVELENGTH SHIFT
(NORMALIZED AT 20mA)
0
10
20
30
40
0 20 40 60 80 100
MAXIMUM FORWARD CURRENT - mA
AMBIENT TEMPERATURE (°C)
Blue Green
Green
Blue
Blue
Green
FORWARD VOLTAGE-V
FORWARD CURRENT-mA
0
5
10
15
20
25
30
01234
DC FORWARD CURRENT-mA
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 5 10 15 20 25 30
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
Figure 6. Relative Intensity vs Wavelength Figure 7. Forward Current vs Forward Voltage
Figure 8. Relative Intensity vs Forward Current Figure 9. Maximum Forward Current vs Ambient Temperature
Figure 10. Dominant Wavelength Shift vs Forward Current
6
0
0.2
0.4
0.6
0.8
1
-90 -60 -30 0 30 60 90
NORMALIZED INTENSITY
ANGULAR DISPLACEMENT - DEGREES
0
0.2
0.4
0.6
0.8
1
-90 -60 -30 0 30 60 90
NORMALIZED INTENSITY
ANGULAR DISPLACEMENT - DEGREES
Amber
Red
Green
Blue
Amber
Red
Green
Blue
Figure 11a. Radiation Pattern for Major Axis Figure 11b. Radiation Pattern for Minor Axis
Figure 12. Relative Intensity Shift vs Junction Temperature Figure 13. Forward Voltage Shift vs Junction Temperature
0.1
1
10
-40 -20 0 20 40 60 80 100 120
NORMALZIED INTENSITY (PHOTO)
TJ - JUNCTION TEMPERATURE (°C)
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
-40 -20 0 20 40 60 80 100 120
FORWARD VOLTAGE SHIFT - V
TJ - JUNCTION TEMPERATURE (°C)
Green
Blue
Red
Amber
Green
Blue
Red
Amber
7
Figure 14. Recommended Soldering Land Pattern
Note: Recommended stencil thickness is
0.1524mm (6 mils) minimum and above
5.2
2.1
4.0
0.7
Figure 15. Recommended Pick and Place Nozzle Tip (Urethane PAD Tip)
Figure 16. Recommended Leaded Reow Soldering Prole Figure 17. Recommended Pb- Free Reow Soldering Prole
Note: For detailed information on reow soldering of Avago Surface Mount LED, refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
240°C MAX.
20 SEC. MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
TIME
TEMPERATURE
183°C
100-150°C
-6°C/SEC.
MAX.
60-150 SEC.
3°C/SEC. MAX.
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
4.00
4.00
3.20
5.00
Pick &
Place
Nozzle
Nozzle Depth
Note:
1. Nozzle depth should be touching LED ange during pick and place.
2. Nozzle width should be able to t into LED carrier tape
LED Flange
Figure 18. Carrier Tape Dimension
4.50±0.10
2.20±0.20
2.00±0.104.00±0.10
8.00±0.10
16.00±0.30
7.50±0.10
1.75±0.10
5.90
4.10±0.10
0.50±0.10
1.80±0.20
5.20
1.55±0.10
1.60±0.10
+0.30
−0.00
+0.30
−0.00
Note:
1. Nozzle depth should be touching LED ange during pick and place.
2. Nozzle width should be able to t into LED carrier tape.
8
Figure 19. Reel Dimension
Figure 20. Unit Orientation from reel
Anode
EIAJ.RRM.16.Dc
0.8
0.6
0.4
0.2
LT-W16-HIPS
1.50 MIN
∅ 330.00 ± 2.00
∅ 80.00 ± 0.50
17.65 ± 0.20
13.00 ± 0.20
9
Intensity Bin Limit Table (1.2:1 Iv bin ratio)
Bin
Intensity (mcd) at 20 mA
Min Max
S 660 800
T 800 960
U 960 1150
V 1150 1380
W 1380 1660
X 1660 1990
Y 1990 2400
Z 2400 2900
1 2900 3500
2 3500 4200
3 4200 5040
4 5040 6050
Tolerance for each bin limit is ± 15%
VF Bin Table (V at 20 mA) for Red & Amber
Bin ID Min Max
VD 1.8 2.0
VA 2.0 2.2
VB 2.2 2.4
Tolerance for each bin limit is ± 0.05V
Red Color Range
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
618.0 630.0 0.6872 0.3126 0.6890 0.2943
0.6690 0.3149 0.7080 0.2920
Tolerance for each bin limit is ± 0.5 nm
Amber Color Range
Bin
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 584.5 587.0 0.5420 0.4580 0.5530 0.4400
0.5370 0.4550 0.5570 0.4420
2 587.0 589.5 0.5570 0.4420 0.5670 0.4250
0.5530 0.4400 0.5720 0.4270
4 589.5 592.0 0.5720 0.4270 0.5820 0.4110
0.5670 0.4250 0.5870 0.4130
6 592.0 594.5 0.5870 0.4130 0.5950 0.3980
0.5820 0.4110 0.6000 0.3990
Tolerance for each bin limit is ± 0.5 nm
Green Color Range
Bin
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 519.0 523.0 0.0667 0.8323 0.1450 0.7319
0.1200 0.7375 0.0979 0.8316
2 523.0 527.0 0.0979 0.8316 0.1711 0.7218
0.1450 0.7319 0.1305 0.8189
3 527.0 531.0 0.1305 0.8189 0.1967 0.7077
0.1711 0.7218 0.1625 0.8012
4 531.0 535.0 0.1625 0.8012 0.2210 0.6920
0.1967 0.7077 0.1929 0.7816
5 535.0 539.0 0.1929 0.7816 0.2445 0.6747
0.2210 0.6920 0.2233 0.7600
Tolerance for each bin limit is ± 0.5 nm
Blue Color Range
Bin
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 460.0 464.0 0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
2 464.0 468.0 0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
3 468.0 472.0 0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
4 472.0 476.0 0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
5 476.0 480.0 0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
Tolerance for each bin limit is ± 0.5 nm
10
Note: Acronyms and Denition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but with-
out VF bin OR part number with VF bins and no color
bin)
(ii) Color bin incorporated with VF bin
Applicable for part number that have both color bin
and VF bin
Example:
a. Color bin only or VF bin only
BIN: 4 (represent color bin 4 only)
BIN: VA (represent VF bin “VA” only)
b. Color bin incorporate with VF bin
BIN: 4 VA
VA: VF bin “VA”
4: Color bin 4 only
Packing Label
(i) Mother Label (Available on MBB bag)
(ii) Baby Label (Available on Plastic Reel)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: OEAT01
Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e4 Max Temp 260C MSL 2a
(1P) PART #: Part Number
(1T) Lot #: Lot Number
(9D)MFG Date: Manufacturing Date
C/0: Country of Origin
(1T) TAPE DATE: Taping Date
(Q) QTY: Quantity
(9D) Date Code: Date Code
BABY LABEL COSBOO1B V0.0
CAT Intensity Bin
BIN Refer to Below information
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved.
AV02-4541EN - September 8, 2014
DISCLAIMER: Avago’s products and software are not specically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
C. Control for unnished tape and reel parts
• Unused LEDs must be stored in a sealed MBB with a
desiccant or desiccator at < 5% RH.
D. Control of assembled boards
• If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB needs
to be stored in a sealed MBB with desiccant or
desiccator at < 5% RH to ensure that all LEDs have
not exceeded their oor life of 672 hours
E. Baking is required if:
• The HIC indicator is not BROWN at 10% and is AZURE
at 5%
• The LEDs are exposed to a condition of > 30 ° C/60%
RH at any time.
• The LED oor life exceeded 672 hours.
The recommended baking condition is: 60 ± 5 °C for 20
hours.
Handling of Moisture Sensitive Device
This product has a Moisture Sensitive Level 2a rating
per JEDEC J-STD-020. Refer to Avago Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
A. Storage before use
• An unopened moisture barrier bag (MBB) can be
stored at < 40 °C/90% RH for 12 months. If the actual
shelf life has exceeded 12 months and the humidity
indicator card (HIC) indicates that baking is not
required then it is safe to reow solder the LEDs per
the original MSL rating.
• It is recommended that the MBB not be opened
prior to assembly (e.g., for IQC).
B. Control after opening the MBB
• The humidity indicator card (HIC) shall be read
immediately upon opening of the MBB.
• The LEDs must be kept at < 30 °C/60% RH at all
times, and all high temperature related processes
including soldering, curing or rework need to be
completed within 672 hours.