1
Standard Products
UT63M14x MIL-STD-1553A/B Bus Transceiver
Data Sheet
Sept. 1999
FEATURES
q 5-volt only operation (+10%)
q Completely monolithic bipolar technology
q Fit and functionally compatible to industry standard
transceiver
q Idle low transmitter inputs and receiver outputs
q Dual-channel 50-mil center 24-lead Flatpack
q Dual-channel 100-mil center 36-pin DIP
q Full military operating temperature range, -55°C to +125°C,
screened to QML Q or QML V requirements
q Radiation hardened to 1.0E6 rads(Si)
q Supports MIL-STD-1760 (UT63M145) and MIL-STD-1553
(UT63M147)
q Standard Microcircuit Drawing (SMD) 5962-93226
available
INTRODUCTION
The monolithic UT63M14x Transceivers are complete
transmitter and receiver pairs for MIL-STD-1553A and 1553B
applications. Encoder and decoder interfaces are idle low.
The receiver section of the UT63M14x series accepts biphase-
modulated Manchester II bipolar data from a MIL-STD-1553
data bus and produces TTL-level signal data at its RXOUT and
RXOUT outputs. An external RXEN input enables or disables
the receiver outputs.
TXIN
RXOUT
RXEN
FROM ENCODER
TO DECODER
DRIVERS
COMPARE
F ILTER
LIMITER
and
F ILTER
TXIHB
Figure 1. Functional Block Diagram
RXIN
TXOUT
RXIN
TXOUT
RXOUT
TXIN
THRESHOLD
REFERENCE
2
The transmitter section accepts biphase TTL-level signal data
at its TXIN and TXIN and produces MIL-STD-1553 data
signals. The transmitter’s output voltage is typically
12 VPP, L-L. Activating the TXIHB input or setting both data
inputs to the same logic level disables the transmitter outputs.
The UT63M14x series offers complete transmitter and receiver
pairs packaged in a dual-channel 36-pin DIP or 24-lead flatpack
configurations designed for use in any MIL-STD-1553
application.
Legend for TYPE field:
TI = TTL input
TO = TTL output
DO = Differential output
DI = Differential input
DIO =Differential input/output
( ) = Channel designator
[ ] =24-lead flatpack
TRANSMITTER
Note:
1.The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
NAME PIN
NUMBER TYPE DESCRIPTION
TXOUT 1
(A)
TXOUT
(B)
1 [1]
10 [7]
DO
[DIO]
DO
[DIO]
Transmitter outputs: TXOUT and TXOUT are differential data
signals.
TXOUT 1
(A)
TXOUT
(B)
2 [2]
11 [8]
DO
[DIO]
DO
[DIO]
TXOUT is the half-cycle complement of TXOUT.
TXIHB
(A)
TXIHB
(B)
34 [22]
25 [16]
TI
TI
Transmitter inhibit: This is an active high input signal.
TXIN
(A)
TXIN
(B)
35 [23]
26 [17]
TI
TI
Transmitter input: TXIN and TXIN are complementary TTL-
level Manchester II encoder inputs.
TXIN
(A)
TXIN
(B)
36 [24]
27 [18]
TI
TI
TXIN is the complement of TXIN input.
3
RECEIVER
Note:
1.The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
POWER AND GROUND
NAME PIN
NUMBER TYPE DESCRIPTION
RXOUT
(A)
RXOUT
(B)
5 [4]
14 [10]
TO
TO
Receiver outputs: RXOUT and RXOUT are complementary
Manchester II decoder outputs.
RXOUT
(A)
RXOUT
(B)
8 [6]
17 [12]
TO
TO
RXOUT is the complement of RXOUT output.
RXEN
(A)
RXEN
(B)
6 [5]
15 [11]
TI
TI
Receiver enable/disable: This is an active high input signal.
RXIN 1
(A)
RXIN
(B)
29 [1]
20 [7]
DI
[DIO]
DI
[DIO]
Receiver input: RXIN and RXIN are biphase-modulated
Manchester II bipolar inputs from MIL-STD-1553 data bus.
RXIN 1
(A)
RXIN
(B)
30 [2]
21 [8]
DI
[DIO]
DI
[DIO]
RXIN is the half-cycle complement of RXIN input.
NAME PIN
NUMBER TYPE DESCRIPTION
VCC
(A)
VCC
(B)
33 [20]
24 [14]
PWR
PWR
+5 VDC power (±10%)
GND
(A)
GND
(B)
3, 7, 31
[3,19,21]
12, 16, 22
[9,13,15]
GND
GND
Ground reference
4
36
26
10
11
13
14
15
17
18
16
27
28
35
34
33
32
31
30
29
25
24
23
22
21
20
19
1
2
3
4
5
6
7
8
9
12
TXOUT
RXOUT
TXOUT
GND
NC
RXOUT
RXEN
GND
NC
TXOUT
RXOUT
TXOUT
GND
NC
RXOUT
RXEN
GND
NC
TXIN
RXIN
VCC
TXIN
TXIHB
NC
GND
RXIN
NC
TXIN
RXIN
VCC
TXIN
TXIHB
NC
GND
RXIN
NC
CHANNEL A
CHANNEL B
Figure 2a. Functional Pin Diagram -- Dual Channel (36)
24
17
7
8
10
11
12
18
23
22
21
20
19
16
15
14
13
1
2
3
4
5
6
9
CHA
CHA
GND
RXOUT
RXEN
CHB
CHB
GND
RXOUT
RXEN
TXIN
VCC
TXIN
TXIHB
GND
TXIN
VCC
TXIN
TXIHB
GND
CHANNEL A
CHANNEL B
Figure 2b. Functional Pin Diagram -- Dual Channel (24) 1
RXOUT
RXOUT
GND
GND
Note:
1.The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
5
TRANSMITTER
The transmitter section accepts Manchester II biphase TTL data
and converts this data into differential phase-modulated current
drive. Transmitter current drivers are coupled to a MIL-STD-
1553 data bus via a transformer driven from the TXOUT and
TXOUT terminals. Transmitter output terminals’ non-
transmitting state is enabled by asserting TXIHB (logic “1”), or
by placing both TXIN and TXIN at the same logic level. Table
1, Transmit Operating Mode, lists the functions for the output
data in reference to the state of TXIHB. Figure 3 shows typical
transmitter waveforms.
RECEIVER
The receiver section accepts biphase differential data from a
MIL-STD-1553 data bus at its RXIN and RXIN inputs. The
receiver converts input data to biphase Manchester II TTL
format and is available for decoding at the RXOUT and RXOUT
terminals. The outputs RXOUT and RXOUT represent positive
and negative excursions (respectively) of the inputs RXIN and
RXIN. Figure 4 shows typical receiver output waveforms.
Table 1. Transmit Operating Mode
Notes:
1.x = Don’t care.
2.Transmitter output terminals are in the non-transmitting mode during
Off-time.
3.Transmitter output terminals are in the non-transmitting mode during
Off-time, independent of TXIHB status.
Figure 3. Typical Transmitter
Wave
Figure 4. Typical Receiver Waveforms
TXIN TXIN TXIHB TXOUT
x1x 1
0 0 x
0 1 0
1 0 0
1 1 x
90%
10%
TXOUT, TXOUT
TXIN
TXIN
LINE-TO-LINE
DIFFERENTIAL
OUTPUT
TXIN
TXIHB
TXIN
tTXDD
BOTH HIGH
OR
BOTH LOW
RXOUT
RXOUT
RXOUT
RXOUT
LINE-TO-LINE
DIFFERENTIAL
INPUT
tRXDD
Note:
Off2
Off3
Off3
On
On
6
DATA BUS INTERFACE 1
The designer can connect the UT63M14x to the data bus via a
short-stub (direct-coupling) connection or a long-stub
(transformer-coupling) connection. Use a short-stub connection
when the distance from the isolation transformer to the data bus
does not exceed a one-foot maximum. Use a long-stub
connection when the distance from the isolation transformer
exceeds the one-foot maximum and is less than twenty feet.
Figure 5 shows various examples of bus coupling
configurations. The UT63M14x series transceivers are designed
to function with MIL-STD-1553A and 1553B compatible
transformers.
Note:
1.The 24-lead flatpack internally connects TXOUT to RXIN and TXOUT to
RXIN for each channel.
RECOMMENDED THERMAL PROTECTION
All packages should mount to or contact a heat removal rail
located in the printed circuit board. To insure proper heat transfer
between the package and the heat removal rail, use a thermally-
conductive material between the package and the heat removal
rail. Use a material such as Mereco XLN-589 or equivalent to
insure heat transfer between the package and heat removal rail.
Figure 8. Transceiver Test Circuit MIL-STD-1553B
Figure 5. Bus Coupling Configuration
55 OHMS
55 OHMS
20 FT MAX 1:1.4
Note:
ZO defined per MIL-STD-1553B, Section 4.5.1.5.2.1.
ZO
ZO
+5V DC OPERATION
1:1.79
1:2.5
SHORT-STUB
DIRECT COUPLING
1 FT. MAX.
LONG-STUB
TRANSFORMER COUPLING
.75 ZO
.75 ZO
TXOUT
RXIN
RXIN
TXOUT
7
RL =
15 pF
15 pF
55 OHMS
55 OHMS
35 OHMS A
RECEIVER
TRANSMITTER
TP
TP
*
RXIN
RXEN
RXOUT
Figure 6. Direct Coupled Transceiver with Load
55 OHMS
55 OHMS
35 OHMS
TXOUT
TXIN
RXIN RXOUT
TXIN
TXIHB
TXOUT
2KOHMS 2KOHMS
2.5:1
1:2.5
Notes:
1.TP = Test point.
2.RL removed for terminal
input impedance test.
3.TXOUT and RXIN tied together.
TXOUT and RXIN tied together.
Vin
VCC
1:1.4
15 pF
15 pF
RECEIVER
TP
TP
TRANSMITTER
35 OHMS
A B
RXEN
1.79:1
1.4:1 RXOUT
V
*
CC
1:1.79
RXIN
RXIN
TXIN
TXIN
TXIHB
TXOUT
TXOUT
RXOUT
2KOHMS 2KOHMS
Notes:
1.TP = Test point.
2.RL removed for terminal impedance test.
3.TXOUT and RXIN tied together.
TXOUT and RXIN tied together.
Figure 7. Transformer Coupled Transceiver with Load
.75 ZO
.75 ZO
Vin
8
ABSOLUTE MAXIMUM RATINGS 1
Notes:
1.Stress outside the listed absolute maximum rating may cause permanent damage to the devices. This is a stress rating only, and functional operation of the device
at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2.Mounting per MIL-STD-883, Method 1012.
RECOMMENDED OPERATING CONDITIONS
PARAMETER LIMITS UNIT
VCC -0.3 to +7.0 V
Input voltage range (receiver) 10 VPP, L-L
Logic input voltage range -0.3 to +5.5 V
Power dissipation 100% duty cycle (per channel) 3.6 W
Thermal impedance junction to case26.0 °C/W
Maximum junction temperature +175 °C
Storage temperature -65 to +150 °C
Receiver common mode input voltage range -5.0 to +5.0 V
PARAMETER LIMITS UNIT
Supply voltage range +4.50 to +5.50 V
Logic input voltage range 0 to +5.0 V
Receiver differential voltage 8.0 VP-P
Receiver common mode voltage range +4.0 V
Driver peak output current 600 mA
Serial data rate 0.3 to 1 MHz
Case operating temperature range (TC)-55 to +125 °C
A
TERMINAL
Notes:
1.Transformer Coupled Stub:
Terminal is defined as transceiver plus isolation transformer. Point A is defined in figure 7.
2.Direct Coupled Stub:
Terminal is defined as transceiver plus isolation transformer and fault resistors. Point A is defined in figure 6.
RL
TXOUT
TXOUT
Figure 8. Transceiver Test Circuit MIL-STD-1553
9
DC ELECTRICAL CHARACTERISTICS 1
VCC = 5.0V ±10%
-55°C < TC < +125°C
Note:
1.All tests guaranteed per test figure 6.
2.Guaranteed but not tested.
SYMBOL PARAMETER MINIMUM MAXIMUM UNIT CONDITION
VIL Input low voltage 0.8 VRXEN, TXIHB, TXIN, TXIN
VIH Input high voltage 2.0 VRXEN, TXIHB, TXIN, TXIN
IIL Input low current -0.1 mA VIL = 0.4V; RXEN, TXIHB, TXIN,
TXIN
IIH Input high current -40 40 µA VIH = 2.7V; RXEN, TXIHB, TXIN,
TXIN
VOL Output low voltage .55 VIOL = 4mA; RXOUT, RXOUT
VOH Output high voltage 2.4 VIOH = 0.4mA; RXOUT, RXOUT
ICC VCC supply current 22
200
380
650
740
mA
mA
mA
mA
mA
0% duty cycle (non-transmitting)
25% duty cycle (ƒ = 1MHz)
50% duty cycle (ƒ = 1MHz)
87.5% duty cycle (ƒ = 1MHz)
100% duty cycle (ƒ = 1MHz)2
10
RECEIVER ELECTRICAL CHARACTERISTICS 1
VCC = 5.0V ±10%
-55°C < TC < +125°C
Notes:
1.All tests guaranteed per test figure 6.
2.Capacitance is measured only for initial qualification and after any process or design changes which may affect input or output capacitance.
3.Pass/fail criteria per the test method described in MIL-HDBK-1553 Appendix A, RT Validation Test Plan, Section 5.1.2.2, Common Mode Rejection.
4. Guaranteed by design.
5. Guaranteed to the limits specified if not tested.
SYMBOL PARAMETER MINIMUM MAXIMUM UNIT CONDITION
CIN 2Input capacitance 15 pF RXEN; input ƒ = 1MHz @ 0V
COUT2Output capacitance 20 pF RXOUT, RXOUT; ƒ = 1MHz @ 0V
VIC 5Common mode input
voltage -5 5VDirect-coupled stub; input 1.2 VPP,
200ns rise/fall time ±25ns,
ƒ = 1MHz
VTH Input threshold
voltage4 (no response)
Input threshold voltage
(no response)
Input threshold
voltage4 (response)
Input threshold voltage
(response)
0.86
1.20
0.20
0.28
14.0
20.02
VPP,L-L
VPP,L-L
VPP,L-L
VPP,L-L
Transformer-coupled stub; input at
ƒ = 1MHz, rise/fall time 200ns at
(Receiver output 0 → 1 transition)
Direct-coupled stub; input at ƒ = 1MHz,
rise/fall time 200ns at (Receiver output
0 → 1 transition)
Transformer-coupled stub; input at
ƒ = 1MHz, rise/fall time 200ns at
(Receiver output 0 → 1 transition)
Direct-coupled stub; input at ƒ = 1MHz,
rise/fall time 200ns at (Receiver output
0 → 1 transition)
CMRR5Common mode
rejection ratio Pass/Fail 3N/A
11
TRANSMITTER ELECTRICAL CHARACTERISTICS 1
VCC = 5.0V ±10%
-55°C < TC < +125°C
Notes:
1.All tests guaranteed per test figure 6.
2.Guaranteed by device characterization. Capacitance is measured only for initial qualification and after any process or design changes which may affect
input or output capacitance.
3. For MIL-STD-1760, 22 Vp-p, L-L min.
4. Test in accordance with the method described in MIL-STD-1553B output symmetry, section 4.5.2.1.1.4.
5. Guaranteed to the limits specified if not tested.
SYMBOL PARAMETER MINIMUM MAXIMUM UNIT CONDITION
VO Output voltage swing per
MIL-STD-1553B 3, 5
(see figure 9)
per MIL-STD-1553B
(see figure 9)
per MIL-STD-1553A 5
(see figure 9)
18
6.0
6.0
27
9.0
20
VPP,L-L
VPP,L-L
VPP,L-L
Transformer-coupled stub, Figure 8,
Point A; input ƒ = 1MHz,
RL = 70 ohms
Direct-coupled stub, Figure 8, Point
A; input ƒ = 1MHz,
RL = 35 ohms
Figure 7, Point A; input
ƒ = 1MHz, RL = 35 ohms
VNS2Output noise voltage
differential (see figure 9) 14
5
mV-RMS L-L
mV-RMS L-L
Transformer-coupled stub, Figure 8,
Point A; input ƒ = DC to 10MHz, RL
= 70 ohms
Direct-coupled stub, Figure 8, Point
A; input ƒ = DC to 10MHz,
RL = 35 ohms
VOS4Output symmetry -250
-90
+250
+90
mVPP,L-L
mVPP,L-L
Transformer-coupled stub, Figure 8,
Point A; RL = 140 ohms,
measurement taken 2.5µs after end
of transmission
Direct-coupled stub, Figure 8, Point
A; RL = 35 ohms, measurement
taken 2.5µs after end of transmission
VDIS Output voltage
distortion (overshoot or
ring) (see figure 9)
-900
-300
+900
+300
mVpeak,L-L
mVpeak,L-L
Transformer-coupled stub, Figure 8,
Point A; RL = 70 ohms
Direct-coupled stub, Figure 8, Point
A; RL = 35 ohms
CIN 2Input capacitance 15 pF RXEN, TXIHB, TXIN, TXIN; input
ƒ = 1MHz @ 0V
TIZ 5Terminal input
impedance 1
2
Kohm
Kohm
Transformer-coupled stub, Figure 7,
Point A; input ƒ = 75KHz to 1MHZ
(power on or power off; non-
transmitting, RL removed from
circuit).
Direct-coupled stub, Figure 6, Point
A; input ƒ = 75KHz to 1MHZ (power
on or power off; non-transmitting,
RL removed from circuit).
12
AC ELECTRICAL CHARACTERISTICS 1
VCC = 5.0V ±10%
-55°C < TC < +125°C
Notes:
1.All tests guaranteed per test figure 6.
2.Guaranteed by device characterization.
3.Supplied as a design limit but not guaranteed or tested.
4.Delay time from transmit inhibit (1.5V) rising to transmit off (280mV).
5.Delay time from not transmit inhibit (1.5V) falling to transmit off (1.2V).
SYMBOL PARAMETER MINIMUM MAXIMUM UNIT CONDITION
tR, tFTransmitter output rise/
fall time (see figure 10) 100 300 ns Input ƒ = 1MHz 50% duty cycle:
direct-coupled RL = 35 ohms output
at 10% through 90% points TXOUT,
TXOUT. Figure 10.
tRXDD RXOUT delay -200 200 ns RXOUT to RXOUT, Figure 4.
tTXDD 3TXIN skew -25 25 ns TXIN to TXIN, Figure 3.
tRZCD Zero crossing distortion
(see figure 11) -150 150 ns Direct-coupled stub; input ƒ = 1MHz,
3 VPP (skew INPUT ±150ns), rise/fall
time 200ns.
tTZCS Zero crossing stability
(see figure 11) -25 25 ns Input TXIN and TXIN should create
Transmitter output zero crossings at
500ns, 1000ns, 1500ns, and 2000ns.
These zero crossings should not
deviate more than ±25ns.
tRDXOFF3,4 Transmitter off; delay
from inhibit active 100 ns TXIN and TXIN toggling @ 1MHz;
TXIHB transitions from logic zero to
one, see figure 12.
tDXON 3,5 Transmitter on; delay
from inhibit inactive 150 ns TXIN and TXIN toggling @ 1MHz;
TXIHB transitions from logic one to
zero, see figure 13.
tRCVOFF 3Receiver off 50 ns Receiver turn off time, see figure 13.
tRCVON 3Receiver on 50 ns Receiver turn on time, see figure 13.
tRCVPD 3Receiver propagation 450 ns Receiver propagation delay, see
figure 13.
tXMITPD 3Transmitter
propagation 200 ns Transmitter propagation delay, see
figure 12.
Table 2. Transformer Requirements
COUPLING TECHNIQUE ± 5VDC
DIRECT-COUPLED:
Isolation Transformer Ratio 2.5:1
TRANSFORMER-COUPLED:
Isolation Transformer Ratio 1.79:1
Coupling Transformer Ratio 1:1.4
13
Figure 9. Transmitter Output Characteristics (VDIS, VNS, VO)
Figure 10. Transmitter Output Zero Crossing Stability, Rise Time, Fall Time (tTZCS, tR, tF)
Figure 11. Receiver Input Zero Crossing Distortion (tRZCD)
0 Volts 0 Volts
VDIS (Ring) VDIS (Overshoot)
VOVNS
90%
10%10%
90%
VO
tR
tF
tTZCS
tRZCD
VIN
14
10%
50%
50%
50%
zero crossing
tDXON
tXMITPD
tDXOFF
TX OUTPUT
INHIBIT
TX IN
and
TX IN
Figure 12. Transmitter Timing
50%
50% 50% 50%
50%
tRCVPD
tRCVON
tRCVOFF
zero crossing RX INPUT
RXEN
RX OUT
and
RX OUT
RXEN
Figure 13. Receiving Timing
10%
Figure 14. 36-Pin Side-Brazed DIP, Dual Cavity
Notes:
1.Package material: opaque ceramic.
2.All package finishes are per MIL-PRF-38535.
3.It is recommended that package ceramic be mounted on a heat removal
rail in the printed circuit board. A thermally conductive material should
be used.
LEAD 1
INDICATOR
0.005 MIN.
.610 MAX.
.570 MIN.
.015 MAX.
.008 MIN.
.620 MAX.
.590 MIN.
(AT SEATING PLANE)
1.89 MAX.
0.001 MIN.
.023 MAX.
.014 MIN.
0.155
MAX.
0.150
MIN.
0.100
16
Figure 15. 24-Lead Flatpack, Dual Cavity
(50-mil lead spacing)
Notes:
1.Package material: opaque ceramic.
2.All package plating finishes are per MIL-PRF-38535.
3.It is recommended that package ceramic be mounted to a heat removal rail located in the
printed circuit board. A thermally conductive material should be used.
.810 MAX.
.600 MAX.
.400 MIN.
LEAD 1 INDICATOR
0.130 MAX.
0.070 ±0.010
(AT CERAMIC BODY)
.050
0.016 ±.002
.010 + .002 - .001
17
ORDERING INFORMATION
UT63M Monolithic Transceiver, 5V Operation: SMD
Lead Finish:
(A) = Solder
(C) =Gold
(X) =Optional
Case Outline:
(X) =36 pin DIP
(Z) =24 pin FP
Class Designator:
(Q) =Class Q
(V) = Class V
Device Type
(03) =Idle low
(04) =1760, Idle low
Drawing Number: 93226
Total Dose:
(H) = 1E6 rads(Si)
(G) = 5E5 ads(Si)
(F) = 3E5 rads(Si)
(R) = 1E5rads(Si)
(-) = None
Federal Stock Class Designator: No options
5962 * 93226 * * * *
Notes:
1. Lead finish (A, C, or X) must be specified.
2. If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold).
3. Total dose must be specified for all QML Q and QML V devices.
4. Neutron irradiation limits will be added when available.
18
UT63M Monolithic Transceiver, 5V Operation
Total Dose:
() =None
Lead Finish:
(A) =Solder
(C) =Gold
(X) =Optional
Screening:
(C) = Military Temperature
(P) =Prototype
Package Type:
(B) =36-pin DIP
(C) =24-pin FP
Device Type Modifier:
147 = Idle Low Transceiver
145 = 1760, Idle Low Transceiver
UT63M- * * * *
Notes:
1. Lead finish (A, C, or X) must be specified.
2. If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold).
3. Military Temperature range devices are burned-in and tested at -55°C, room temperature, and 125°C. Radiation characteristics are neither tested nor
guaranteed and may not be specified.
4. Devices have prototype assembly and are tested at 25°C only. Radiation characteristics are neither tested nor guaranteed and may not be specified.
Lead finish is GOLD only.
