© 2005 Fairchild Semiconductor Corporation DS012022 www.fairchildsemi.com
January 1999
Revised June 2005
74LVT16374 • 74LVTH16374 Low Voltage 16-Bit D-Type Flip-F lop with 3-STATE Outputs
74LVT16374 74LVTH16374
Low Voltage 16-Bit D-Type Flip-Flop
with 3-STATE Outputs
General Descript ion
The LVT16374 and LVTH16374 contain sixteen non-invert-
ing D-type flip-flops with 3-STATE outputs and is intended
for bus oriented applications. The dev ice is byte controlled .
A buffered clock (CP) and Output Enable (OE) are com-
mon to each byte and can be shorted together for full 16-bit
operation.
The LVTH16374 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These flip-flops are designed for low-voltage (3.3V) VCC
applications, bu t with the capability to provide a TTL inte r-
face to a 5V envir onmen t. The LVT16374 an d LVTH16374
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining a low power dissipation.
Features
Input and output interface capability to systems at
5V VCC
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16374),
also availabl e wit ho ut bush old feat ure (74LVT16374)
Live insertion /extracti on per mitt ed
Power Up/Power Down high impedance provides
glitch-fr ee bus load i ng
Outputs source/sink
32 mA/
64 mA
Functionally compatible with the 74 series 16374
Latch-up per for man c e exce eds 500 mA
ESD performa nce :
Human-body model
!
2000V
Machine model
!
200V
Charged-device model
!
1000V
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Ordering Code:
Note 1: Order ing code “G” indicat es T r a ys.
Note 2: Device also av ailable in Tape and R eel. Specify by ap pending su ffix le tter “X” to the ordering code.
Logic Symbol
Order Num b er Packag e Num b er Packa ge Des cri pt io n
74LVT16374G
(Note 1)( Note 2) BGA54A
(Preliminary) 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVT16374MEA
(Note 2) MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVT16374MTD
(Note 2) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LVTH16374G
(Note 1)( Note 2) BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVTH16374MEA
(Note 2) MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVTH16374MTD
(Note 2) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
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74LVT16374 74LVTH16374
Connection Diagrams
Pin Assignment for SSOP and TSSOP
Pin Assignment for FBGA
(Top Thru Vi ew)
Pin Descriptions
FBGA Pin Assignments
Truth Tables
H
HIGH Voltag e Level
L
LOW Voltage Le ve l
X
Immaterial
Z
HIGH Im pedance
Oo
Previ ous Oo before HIGH to LOW of CP
Functional Description
The LVT16374 and LVTH16374 consist of sixteen
edge-triggered flip-flops with individual D-type inputs and
3-STATE true outputs. The device is byte controlled with
each byte functioning identically, but independent of the
other. The control pins can be shorted together to obtain
full 16-bit operation. Each byte has a buffered clock and
buffered Output Enable common to all flip-flops within that
byte. The description which follows applies to each byte.
Each flip-flop will store the state of their individual D-type
inputs that meet the setup and hold time requirements on
the LOW-to-HIGH Clock (CPn) transition. With the Output
Enable ( OEn) LOW, the contents of the flip-flops are avail-
able at the outputs. When OEn is HIG H, the outputs go to
the high impe dan ce state . Ope rat i on o f the OEn in put does
not affect the state of the flip-flops.
Pin Names Description
OEn Output Enable Input (Active LOW)
CPnClock Pulse Input
I0I15 Inputs
O0O15 3-STATE Outputs
NC No Connect
123456
AO0NC OE1CP1NC I0
BO2O1NC NC I1I2
CO4O3VCC VCC I3I4
DO6O5GND GND I5I6
EO8O7GND GND I7I8
FO10 O9GND GND I9I10
GO12 O11 VCC VCC I11 I12
HO14 O13 NC NC I13 I14
JO15 NC OE2CP2NC I15
Inputs Outputs
CP1OE1I0I7O0O7
LH H
LL L
LL X O
o
XH X Z
Inputs Outputs
CP2OE2I8I15 O8O15
LH H
LL L
LL X O
o
XH X Z
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74LVT16374 74LVTH16374
Logic Diagrams
Byte 1 (0:7)
Byte 2 (8:15)
Please not e t hat thes e diagrams are provided for the understanding of logic operat ion and s hould no t be us ed to estim at e propagation delays.
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74LVT16374 74LVTH16374
Absolute Maximum Ratings(Note 3)
Recommended Operating Conditions
Note 3: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyo nd those in dic ated may adver s ely affec t device rel iability. Fun c tio nal opera ti on under ab s olute maximum rated con dit ions is not implied.
Note 4: IO Absolute Maximum Rating must be observed.
DC Electrical Characteristics
Symbol Parameter Value Conditions Units
VCC Supply Voltage
0.5 to
4.6 V
VIDC Input Voltage
0.5 to
7.0 V
VODC Output Volta ge
0.5 to
7.0 Output in 3-STATE V
0.5 to
7.0 Output in High or Low State (Note 4)
IIK DC Input Diode Current
50 VI
GND mA
IOK DC Output Diode Current
50 VO
GND mA
IODC Output Current 64 VO
!
VCC Output at High State mA
128 VO
!
VCC Output at Low State
ICC DC Supply Current per Supply Pin
r
64 mA
IGND DC Ground Current per Ground Pin
r
128 mA
TSTG Storage Temperature
65 to
150
q
C
Symbol Parameter Min Max Units
VCC Supply Voltage 2.7 3.6 V
VIInput Voltage 0 5.5 V
IOH High-Level Output Current
32 mA
IOL Low-Level Output Current 64 mA
TAFree-Air Operating Temperature
40 85
q
C
'
t/
'
V Input Edge Rate, VIN
0.8V2.0V, VCC
3.0V 0 10 ns/V
Symbol Parameter VCC T A
40
q
C to
85
q
CUnits Conditions
(V) Min Max
VIK Input Clamp Diode Voltage 2.7
1.2 V II
18 m A
VIH Input HIGH Voltage 2.73.6 2.0 VVO
d
0.1V or
VIL Input LOW Voltage 2.73.6 0.8 VO
t
VCC
0.1V
VOH Output HIGH Voltage 2.73.6 VCC
0.2 VIOH
100
P
A
2.7 2.4 IOH
8 mA
3.0 2.0 IOH
32 mA
VOL Output LOW Voltage 2 .7 0.2
V
IOL
100
P
A
2.7 0.5 IOL
24 mA
3.0 0.4 IOL
16 mA
3.0 0.5 IOL
32 mA
3.0 0.55 IOL
64 mA
II(HOLD) Bushold Input Minimum Drive 3.0 75
P
AVI
0.8V
(Note 5)
75 VI
2.0V
II(OD) Bushold Input Over-Drive 3.0 500
P
A(Note 6)
(Note 5) Current to Change State
500 (Note 7)
IIInput Current 3.6 10
P
A
VI
5.5V
Control Pins 3.6
r
1V
I
0V or VCC
Data Pins 3.6
5V
I
0V
1V
I
VCC
IOFF Power Off Leakage Current 0
r
100
P
A0V
d
VI or VO
d
5.5V
IPU/PD Power Up/Down 3-STATE 01.5V
r
100
P
AVO
0.5V to 3.0V
Output Current VI
GND or VCC
IOZL 3-STATE Output Leakage Current 3.6
5
P
AV
O
0.5V
IOZH 3-STATE Output Leakage Current 3.6 5
P
AV
O
3.0V
IOZH
3-STATE Output Leakage Current 3.6 10
P
AV
CC
VO
d
5.5V
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74LVT16374 74LVTH16374
DC Electrical Characteristics (Continued)
Note 5: Applies to bus hold versions only (74LVTH16374).
Note 6: An external driver must source at least the specified current to switch from LOW-to-HIGH.
Note 7: An external driver mus t s ink at least the s pec if ied current to switc h f rom HIG H -t o-LOW.
Note 8: This is the incr eas e in sup ply c urrent for eac h input tha t is at t he specified voltage lev el rather th an VCC or GND.
Dynamic Switching Characteristics (Note 9)
Note 9: Characterized in SSOP packa ge. Guaranteed parameter, but not te sted.
Note 10: M ax number of out put s d ef ined as (n). n
1 data inp uts are driven 0V to 3V. Output under tes t held LOW.
AC Electrical Characteristics
Note 11: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to- LOW (tOSHL) or LOW- to -H I GH (t OSLH).
Capacitance (Note 12)
Note 12: C apacitanc e is m easured at fr equency f
1 MHz, per MIL-STD -883, M et hod 3012.
Symbol Parameter VCC T A
40
q
C to
85
q
CUnits Conditions
(V) Min Max
ICCH Power Supply Current 3.6 0.19 mA Outputs HIGH
ICCL Power Supply Current 3.6 5 mA Outputs LOW
ICCZ Power Supply Current 3.6 0.19 mA Outputs Disabled
ICCZ
Power Supply Current 3.6 0.19 mA VCC
d
VO
d
5.5V,
Outputs Disabled
'
ICC Increase in Power Supply Current 3.6 0.2 mA One Input at VCC
0.6V
(Note 8) Other Inputs at VCC or GND
Symbol Parameter VCC TA
25
q
CUnits Conditions
(V) Min Typ Max CL
50 pF, RL
500
:
VOLP Quiet Output Maximum Dynamic VOL 3.3 0.8 V (Note 10)
VOLV Quiet Output Minimum Dynamic VOL 3.3
0.8 V (Note 10)
Symbol Parameter
TA
40
q
C to
85
q
C, CL
50 pF, RL
500
:
UnitsVCC
3.3V
r
0.3V VCC
2.7V
Min Max Min Max
fMAX Maximum Clock Frequency 160 160 MHz
tPHL Propagation Delay 1.9 4.3 1.9 4.6 ns
tPLH CP to On1.6 4.5 1.6 5.2
tPZL Output Enable Time 1.3 4.4 1.3 5.0 ns
tPZH 1.0 4.5 1.0 5.4
tPLZ Output Disable Time 1.5 4.6 1.5 4.8 ns
tPHZ 2.0 5.0 2.0 5.4
tSSetup Time 1.8 2.0 ns
tHHold Time 0.8 0.1 ns
tWPulse W idth 3.0 3.0 ns
tOSHL Output to Output Skew (Note 11) 1.0 1.0 ns
tOSLH 1.0 1.0
Symbol Parameter Conditions Typical Units
CIN Input Capaci tance VCC
Open, VI
0V or VCC 4pF
COUT Output Capacitance VCC
3.0V, VO
0V or VCC 8pF
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74LVT16374 74LVTH16374
Physical Dimensions inches (millimeters) unless otherwise noted
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
Packag e Num b er BGA5 4A
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74LVT16374 74LVTH16374
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
Package Number MS48A
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74LVT16374 74LVTH16374 Low Volt age 16-Bit D-Type Flip-Flop with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD48
Fairchild does no t assume any responsibility for use of any circui try described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life suppor t de vices o r systems a re devices or syste ms
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical compon ent i n any compon ent of a lif e supp ort
device or system whose failure to perform can be rea-
sonabl y ex pect ed to cause the fa ilu re of the li fe su pp ort
device or system, or to affect its safety or effectiveness.
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