© 2005 Fairchild Semiconductor Corporation DS012022 www.fairchildsemi.com
January 1999
Revised June 2005
74LVT16374 • 74LVTH16374 Low Voltage 16-Bit D-Type Flip-F lop with 3-STATE Outputs
74LVT16374 • 74LVTH16374
Low Voltage 16-Bit D-Type Flip-Flop
with 3-STATE Outputs
General Descript ion
The LVT16374 and LVTH16374 contain sixteen non-invert-
ing D-type flip-flops with 3-STATE outputs and is intended
for bus oriented applications. The dev ice is byte controlled .
A buffered clock (CP) and Output Enable (OE) are com-
mon to each byte and can be shorted together for full 16-bit
operation.
The LVTH16374 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These flip-flops are designed for low-voltage (3.3V) VCC
applications, bu t with the capability to provide a TTL inte r-
face to a 5V envir onmen t. The LVT16374 an d LVTH16374
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining a low power dissipation.
Features
■Input and output interface capability to systems at
5V VCC
■Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16374),
also availabl e wit ho ut bush old feat ure (74LVT16374)
■Live insertion /extracti on per mitt ed
■Power Up/Power Down high impedance provides
glitch-fr ee bus load i ng
■Outputs source/sink
32 mA/
64 mA
■Functionally compatible with the 74 series 16374
■Latch-up per for man c e exce eds 500 mA
■ESD performa nce :
Human-body model
!
2000V
Machine model
!
200V
Charged-device model
!
1000V
■Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Ordering Code:
Note 1: Order ing code “G” indicat es T r a ys.
Note 2: Device also av ailable in Tape and R eel. Specify by ap pending su ffix le tter “X” to the ordering code.
Logic Symbol
Order Num b er Packag e Num b er Packa ge Des cri pt io n
74LVT16374G
(Note 1)( Note 2) BGA54A
(Preliminary) 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVT16374MEA
(Note 2) MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVT16374MTD
(Note 2) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LVTH16374G
(Note 1)( Note 2) BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVTH16374MEA
(Note 2) MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVTH16374MTD
(Note 2) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide