GE
Data Sheet
February 23, 2017 ©2016 General Electric Company. All rights reserved.
ESTW010A0A Series (Eighth-Brick) DC-DC Converter Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
STINGRAY™ SERIES
Features
Wide input voltage range: 36-75 Vdc
Monotonic startup into prebiased load
Output Voltage adjust: 80% to 110% of Vo,nom
Remote sense
Constant switching frequency
Positive remote On/Off logic
Input under/over voltage protection
Output overcurrent and overvoltage protection
Over-temperature protection
Industry standard, DOSA compliant footprint
57.9mm x 22.8mm x 8.5mm
(2.28 in x 0.9 in x 0.335 in)
Low profile height and reduced component skyline
Suitable for cold wall cooling using suitable Gap Pad applied
directly to top side of module
High efficiency: 91%
No thermal derating up to 80 °C, 1.0m/s (200 LFM)
Wide operating temperature range (-40°C to 85°C)
Compliant to RoHS EU Directive 2002/95/EC (-Z versions)
Compliant to ROHS EU Directive 2002/95/EC with lead solder
exemption (non-Z versions)
UL* 60950-1, 2nd Ed. Recognized, CSA† C22.2 No. 60950 1-
07 Certified, and VDE‡ (EN60950-1, 2nd Ed.) Licensed
CE mark meets 2006/95/EC directive§
Meets the voltage and current requirements for ETSI 300-
132-2 and complies with and licensed for Basic insulation
rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE 802.3¤
PoE standards
ISO**9001 and ISO 14001 certified manufacturing facilities
Applications
Distributed Power Architectures
Wireless Networks
Access and Optical Network Equipment
Industrial Equipment
Options
Negative Remote On/Off logic (preferred)
Over current/Over temperature/Over voltage protections
(Auto-restart) (preferred)
Heat plate version (-H)
Surface Mount version (-S)
RoHS 6/6 compliant; Lead Free (-Z)
For additional options, see Table 2 (Device Options)
under “Ordering Information” section.
Description
The ESTW010A0A, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 10A of output
current and provide a precisely regulated output voltage of 5.0V over a wide range of input voltages (VIN = 36 - 75Vdc). The
modules achieve typical full load efficiency of 91%. The open frame modules construction, available in both surface-mount and
through-hole packaging, enable designers to develop cost and space efficient solutions.
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§ This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
RoHS Compliant
GE Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress
ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the
operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the
device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage
Continuous All VIN -0.3 80 Vdc
Transient, operational (≤100 ms) All VIN,trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
I/O Isolation voltage (100% factory Hi-Pot tested) All 2250 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 36 48 75 Vdc
Maximum Input Current All IIN,max 2.0 Adc
(VIN= VIN, min to VIN, max, IO=IO, max)
Input No Load Current All IIN,No load 30 mA
(VIN = 48V, IO = 0, module enabled)
Input Stand-by Current All IIN,stand-by 5 8 mA
(VIN = 48V, module disabled)
Inrush Transient All I2t 0.5 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max,
IO= IOmax ; See Test configuration section)
All 30 mAp-p
Input Ripple Rejection (120Hz) All 50 dB
CAUTION: This power module is not internally fuse d. An input line fuse must al ways be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated
part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to
achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting
fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet
on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse
manufacturer’s data sheet for further information.
GE Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Nominal Output Voltage Set-point
VIN= 48V IO=IO, max, TA=25°C) All VO, set 4.925 5.0 5.075 Vdc
Output Voltage
All VO 4.90 5.10 Vdc
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Output Regulation
Line (VIN=VIN, min to VIN, max) All
±0.2 % VO, set
Load (IO=IO, min to IO, max) All ±0.2 % VO, set
Temperature (Tref=TA, min to TA, max) All
±1.0 % VO, set
Output Ripple and Noise
(Co=1uF,ceramic+10uF,tantalum, VIN=VIN, min to VIN, max,
IO= IO, max , TA=TA, min to TA, max)
RMS (5Hz to 20MHz bandwidth) All 25 50 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All 75 200 mVpk-pk
External Capacitance1 All CO 0 2,000 μF
Output Current All Io 0 10 Adc
Output Current Limit Inception (Hiccup Mode ) All IO, lim 105 120 130 % Io
(VO= 90% of VO, set)
Output Short-Circuit Current All IO, s/c 1.2 Arms
(VO≤250mV) ( Hiccup Mode )
Efficiency
VIN=48V, TA=25°C, IO=IO, max , VO= VO,set All η 91.0 %
Switching Frequency All fsw 350 kHz
Dynamic Load Response
(Co=1uF,ceramic+10uF,tantalum, dIo/dt=0.1A/s; VIN
= 48V; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation All Vpk 250 mV
Settling Time (Vo<10% peak deviation) All ts 200 s
1. See Note 2 under Feature Specifications.
Isolation Specifications
Parameter Device Symbol Min Typ Max Unit
Isolation Capacitance All Ciso 1000 pF
Isolation Resistance All Riso 10 MΩ
I/O Isolation Voltage (100% factory Hi-pot tested) All All 2250 Vdc
General Specifications
Parameter Device Symbo
l
Min Typ Max Unit
Calculated Reliability based upon Telcordia SR-332
Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C,
airflow = 200 lfm, 90% confidence)
All FIT 242.1 109/Hours
All MTBF 4,130,475 Hours
Weight (Open Frame) All 17
(0.60) g
(oz.)
Weight (with Heatplate) All 30
(1.06) g
(oz.)
GE Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 4
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current All Ion/off 0.15 mA
Logic Low - On/Off Voltage All Von/off -0.7 0.6 Vdc
Logic High Voltage – (Typ = Open Collector) All Von/off 2.4 15 Vdc
Logic High maximum allowable leakage current All Ion/off 25 μA
Turn-On Delay1 and Rise Times
(IO=IO, max , VIN=VIN, nom, TA = 25oC)
Case 1: Input power is applied for at least 1 second
and then the On/Off input is set from OFF to ON (Tdelay
= from instant at which On/Off signal is ON until VO =
10% of VO, set).
All Tdelay ― 20 ― msec
Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied (Tdelay from
instant at which VIN = VIN, min until Vo=10% of VO,set)
All Tdelay ― ― 150 msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set) All Trise ― 15 ― msec
Output voltage overshoot – Startup All
― 3 % VO, set
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC
Prebias Output Load Performance: All Monotonic
Output Start up characteristic
Back Bias current drawn from output (Module Enabled) All -150 mAdc
Remote Sense Range All VSENSE 10 % VO, set
Output Voltage Adjustment range All 80 110 % VO, set
Output Overvoltage Protection (Co,min=220 μF) 2 All VO, limit 6.0 7.0 Vdc
Overtemperature Protection – Hiccup Auto Restart All Tref 135 OC
Input Undervoltage Lockout All VUVLO
Turn-on Threshold 32 34.5 Vdc
Turn-off Threshold 27.5 30 Vdc
Hysteresis 1 2
Vdc
1. The module has an adaptable extended Turn-On Delay interval, Tdelay, of 20mS. The extended Tdelay will occur when the module restarts following
either: 1) the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back
to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, Tdelay,
will occur whenever a module restarts with input voltage removed from the module for the preceding 1 second.
2. The module requires a minimum of 220 μF external output capacitor to prevent shutdown during no load to full load transients and to avoid
exceeding the OVP maximum limits during startup into open loop fault conditions.
GE
Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 5
Characteristic Curves
The following figures provide typical characteristics for the module at 25
o
C. The figures are identical for either positive or
negative remote On/Off logic.
EFFICIENCY, (%)
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (2A/div) V
O
(V) (200mV/div)
OUTPUT CURRENT, I
O
(A) TIME, t (200µs/div)
Figure 1. Conv erter Efficie ncy v ersus Outpu t Current.
Figure 4. Transient Response to 0.1A/µS Dynamic
Load Change from 50% to 75% to 50% of full load,
Vin=48V.
OUTPUT VOLTAGE
V
O
(V) (20mV/div)
On/Off VOLTAGE OUTPUT VOLTAGE
V
On/Off
(V) (2V/div) V
O
(V) (2V/div)
TIME, t (2s/div) TIME, t (20ms/div)
Figur e 2. Ty p ic al ou tput ripple and no ise (V
in
=48V, I
o
=
I
o,max
). Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (V
IN
= 48V, I
o
= I
o,max
).
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (2A/div) V
O
(V) (200mV/div)
INPUT VOLTAGE OUTPUT VOLTAGE
V
IN
(V) (50V/div) V
o
(V) (2V/div)
TIME, t (200µs/div) TIME, t (20ms/div)
Figure 3. Transient Response to 0.1A/µS
Dynamic
Load Change from 25% to 50% to 25% of full l oad,
V
in=48V.
Figur e 6. Typ ic al Start-u p Us ing Input Vol t a g e (V
IN
=
48V, I
o
= I
o,max
).
GE Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 6
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE
LTEST
12μH
BATTER Y
CS 220μF
E. S.R .<0 .1
@ 20 °C 10 0kHz
33-10 0μF
Vi n+
Vin-
NOTE: Measure inpu t reflected ripple current with a simulated
source indu ctance (LTE S T) of 12μH. Capacitor CS offsets
possible batt ery imp edan ce. Measure current as show n
above.
Figure 7. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be t aken a t the module
terminals, as shown above. If sockets are used th en
Kelvin connections are required at th e module te rminals
to avoid measureme nt errors due to socket contact
resistance.
V
O (+ )
V O ( – )
RESISTIVE
LOAD
SCOP E
COPPER STRIP
GROUND PLANE
10uF
1uF
Figure 8. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test Setup.
=
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
Input Filtering
The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power module.
For the test configuration in Figure 7 a 33-100μF
electrolytic capacitor (ESR<0.7 at 100kHz), mounted
close to the power module helps ensure the stability of
the unit. Consult the factory for further application
guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard, i.e.
UL60950-1, CSA C22.2 No.60950-1, and VDE0805-
1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the ac mains.
One VIN pin and one VOUT pin are to be grounded, or
both the input and output pins are to be kept floating.
The input pins of the module are not operator
accessible.
Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module), as required by the safety agencies,
to verify that under a single fault, hazardous voltages
do not appear at the module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output pins.
This may allow a non-SELV voltage to appear
between the output pins and ground.
The power module has extra-low voltage (ELV) outputs
when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the UL60950
A.2 for reduced thickness.
For input voltages exceeding 60 Vdc but less than or
equal to 75 Vdc, these converters have been evaluated to
the applicable requirements of BASIC INSULATION
between secondary DC MAINS DISTRIBUTION input
(classified as TNV-2 in Europe) and unearthed SELV
outputs.
The input to these units is to be provided with a
maximum 5 A fast-acting fuse in the ungrounded lead.
GE Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 7
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the module
off during a logic high and on during a logic low.
ON/OFF
Vin+
Vin-
Ion/off
Von/off
Vout+
TRIM
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to control
the voltage (Von/off) between the ON/OFF terminal and the
VIN(-) terminal (see Figure 10). Logic low is
0V ≤ Von/off ≤ 0.6V. The maximum Ion/off during a logic low
is 0.15mA; the switch should maintain a logic low level
whilst sinking this current.
During a logic high, the typical maximum Von/off generated
by the module is 15V, and the maximum allowable
leakage current at Von/off = 2.4V is 25μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution losses
by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between the
remote-sense pins and the output terminals must not
exceed the output voltage sense range given in the
Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
Although the output voltage can be increased by both the
remote sense and by the trim, the maximum increase for
the output voltage is not the sum of both. The maximum
increase is the larger of either the remote sense or the
trim.
The amount of power delivered by the module is defined
as the voltage at the output terminals multiplied by the
output current. When using remote sense and trim, the
output voltage of the module can be increased, which at
the same output current would increase the power output
of the module. Care should be taken to ensure that the
maximum output power of the module remains at or
below the maximum rated power (Maximum rated power
= Vo,set x Io,max).
Figure 11. Circuit Configuration for remote
sense .
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module will
only begin to operate once the input voltage is raised
above the undervoltage lockout turn-on threshold, VUV/ON.
Once operating, the module will continue to operate until
the input voltage is taken below the undervoltage turn-off
threshold, VUV/OFF.
Overt e m p eratu re Pr o t ec t i o n
To provide protection under certain fault temperature
conditions, the unit is equipped with a thermal shutdown
circuit. The unit will shutdown if any of the thermal
reference points identified in Figures 13 & 14, exceed the
stated trip points (typical). However, the thermal
shutdown is not intended as a guarantee that the unit will
survive temperatures beyond its rating. The module can
be restarted by cycling the dc input power for at least one
second or by toggling the remote on/off signal for at least
one second. If the auto-restart option (4) is ordered, the
module will automatically restart upon cool-down to a
safe temperature.
Output Overvoltage Protection
The output over voltage protection scheme of the
modules has an independent over voltage loop to prevent
single point of failure. This protection feature latches in
the event of over voltage across the output. Cycling the
on/off pin or input voltage resets the latching protection
feature. If the auto-restart option (4) is ordered, the
module will automatically restart upon an internally
programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can be
restarted by cycling the dc input power for at least one
second or by toggling the remote on/off signal for at least
one second.
VO(+)
SENSE(+)
SENSE(–)
VO(–)
VI(+)
VI(-)
IOLOAD
CONTACT AND
DISTRIBUTION LOSS
E
SUPPLY II
CONTACT
RESISTANCE
GE Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 8
Feature Description (continued)
If the unit is configured with the auto-restart option (4), it
will remain in the hiccup mode as long as the overcurrent
condition exists; it operates normally, once the output
current is brought back into its specified range. The
average output current during hiccup is 10% IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin.
VO(+)
VOTRIM
VO(-)
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figure 12. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between the
TRIM pin and the VO(-) (or Sense(-)) pin decreases the
output voltage set point. To maintain set point accuracy,
the trim resistor tolerance should be ±1.0%.
The following equation determines the required external
resistor value to obtain a percentage output voltage
change of ∆%
22.10
%
511
downtrim
R
Where 100% ,
,
seto
desiredseto V
VV
For example, to trim-down the output voltage of the
module by 8% to 11.04V, Rtrim-down is calculated as
follows:
8%
22.10
8
511
downtrim
R
655.53
downtrim
R
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases the
output voltage set point. The following equation
determines the required external resistor value to obtain
a percentage output voltage change of ∆%:
22.10
%
511
%225.1
%)100(11.5 ,seto
uptrim V
R
Where 100% ,
,
seto
setodesired
V
VV
For example, to trim-up the output voltage of the module
by 5% to 12.6V, Rtrim-up is calculated is as follows:
5%
22.10
5
511
5225.1 )5100(0.1211.5
uptrim
R
8.938
uptrim
R
The voltage between the VO(+) and VO(–) terminals must
not exceed the minimum output overvoltage protection
value shown in the Feature Specifications table. This limit
includes any increase in voltage due to remote-sense
compensation and output voltage set-point adjustment
trim.
Although the output voltage can be increased by both the
remote sense and by the trim, the maximum increase for
the output voltage is not the sum of both. The maximum
increase is the larger of either the remote sense or the
trim. The amount of power delivered by the module is
defined as the voltage at the output terminals multiplied
by the output current. When using remote sense and
trim, the output voltage of the module can be increased,
which at the same output current would increase the
power output of the module. Care should be taken to
ensure that the maximum output power of the module
remains at or below the maximum rated power
(Maximum rated power = VO,set x IO,max).
GE
Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 9
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference points, T
ref1
and
T
ref2
, used in the
specifications for open frame modules are shown in
Figure 13. For reliable operation these temperatures
should not exceed 110
o
C and 125
o
C respectively.
Figure 13. T
ref 1 &
T
ref2
Temperature Measurement
Locations for Open Frame Module.
The thermal reference point, T
ref
,
used in the
specifications for modules with heatplate is shown in
Figure 14. For reliable operation this temperature should
not exceed 110
o
C.
Figure 14. T
ref
Temperature Measurement Location
for Module w ith Heatplate .
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (T
A
)
for natural convection and up to 1m/s (200 ft./min) forced
airflow are shown in Figure 15.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
OUTPUT CURRENT, I
O
(A)
AMBIENT TEMEPERATURE, T
A
(
o
C
)
Figure 15. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
OUTPUT CURRENT, I
O
(A)
AMBIENT TEMEPERATURE, T
A
(
o
C
)
Figure 16. Output Current Derating for the Module
with Heatplate; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
OUTPUT CURRENT, I
O
(A)
AMBIENT TEMEPERATURE, T
A
(
o
C
)
Figure 17. Output Current Derating for the Open
Frame Module with Heatplat e and 0.25” Heatsink;
Airflow in the Transverse Direction from Vout(+) to
Vout(-); Vin =48V.
AIRFLOW
GE
Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 10
Thermal Considerations
(continued)
OUTPUT CURRENT, I
O
(A)
AMBIENT TEMEPERATURE, T
A
(
o
C
)
Figure 18. Output Current Derating for the Module
with Heatplate with Heatplate and 0.50” Heatsink;
Airflow in the Transverse Direction from Vout(+) to
Vout(-); Vin =48V.
Heat Transfer via Conduction
The module can also be used in a sealed environment
with cooling via conduction from the module’s top surface
through a gap pad material to a cold wall, as shown in
Figure 19. This capability is achieved by insuring the top
side component skyline profile achieves no more than
1mm height difference between the tallest and the
shortest power train part that benefits from contact with
the gap pad material. The output current derating versus
cold wall temperature, when using a gap pad such as
Bergquist GP2500S20, is shown in Figure 20.
Figure 19. Cold Wall Mounting
OUTPUT CURRENT, I
O
(A)
COLDPLATE TEMEPERATURE, T
C
(
o
C)
Figure 20. Derated Output Current versus Cold Wall
Temperature with local ambient temperature around
module at 85C ; Vin=48V.
GE
Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 11
Surface Mount Information
Pick and Place
The modules use an open frame construction and are
designed for a fully automated assembly process. The
modules are fitted with a label designed to provide a
large surface area for pick and place operations. The
label meets all the requirements for surface mount
processing, as well as safety standards, and is able to
withstand reflow temperatures of up to 300
o
C. The label
also carries product information such as product code,
serial number and the location of manufacture.
Figure 21. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have
a relatively large mass when compared to conventional
SMT components. Variables such as nozzle size, tip
style, vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is
6mm. The maximum nozzle outer diameter, which will
safely fit within the allowable component spacing, is 9
mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The power modules are lead free modules and can be
soldered either in a lead-free solder process or in a
conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions
must be observed when soldering these units. Failure to
observe these instructions may result in the failure of or
cause damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235
o
C.
Typically, the eutectic solder melts at 183
o
C, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on the
connection to ensure a reliable solder joint. There are
several types of SMT reflow technologies currently used
in the industry. These surface mount power modules can
be reliably soldered using natural forced convection, IR
(radiant infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
REFLOW TEMP (C)
REFLOW TIME (S)
Figure 22. Reflow Profile for Tin/Lead (Sn/Pb)
process.
MAX TEMP SOLDER (C)
Figure 23. Time Limit Curve Above 205
o
C for
Tin/Lead (Sn/Pb) pro cess
Lead Free Soldering
The –Z version of the modules are lead-free (Pb-free)
and RoHS compliant and are both forward and backward
compatible in a Pb-free and a SnPb soldering process.
Failure to observe the instructions below may result in
the failure of or cause damage to the modules and can
adversely affect long-term reliability.
Reflow Soldering Information
The surface mountable modules in the family use our
newest SMT technology called “Column Pin” (CP)
connectors. Figure 24 shows the new CP connector
before and after reflow soldering onto the end-board
assembly.
0
50
10 0
15 0
200
250
300
Preheat zone
max 4
o
Cs
-1
Soak zone
30-240s
Heat zone
max 4
o
Cs
-1
Peak Temp 235
o
C
Co o ling
zo ne
1- 4
o
Cs
-1
T
lim
above
205
o
C
200
205
210
215
220
225
230
235
240
0 10 203040 5060
GE
Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 12
Surface Mount Information
(continued)
ESTW Board
Insulator
Solder Ball
End assembly PCB
Figure 24. Column Pin Connecto r Be fore and Aft er
Reflow Soldering .
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn
63
/Pb
37
) solder for non-Z codes, or
Sn/Ag
3.8
/Cu
0.7
(SAC) solder for –Z codes. The CP
connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable SMT
solder joint. Typically, the eutectic solder melts at 183
o
C
(Sn/Pb solder) or 217-218
o
C (SAC solder), wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on the
connection to ensure a reliable solder joint. There are
several types of SMT reflow technologies currently used
in the industry. These surface mount power modules can
be reliably soldered using natural forced convection, IR
(radiant infrared), or a combination of convection/IR.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the volume
and thickness of the package (table 4-2). The suggested
Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu solder
is shown in Figure 25.
Figure 25. Recommended linear reflow profile using
Sn/Ag/Cu solder.
MSL Rating
The modules have a MSL rating of 2A.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture barrier bags (MBB)
with desiccant are required for MSL ratings of 2 or
greater. These sealed packages should not be broken
until time of use. Once the original package is broken,
the floor life of the product at conditions of 30°C and
60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT
packages will be a minimum of 12 months from the bag
seal date, when stored at the following conditions: < 40°
C, < 90% relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power Board
Mounted Power Modules: Soldering and C leaning
Application Note (AN04-001).
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have a RoHS-compliant finish that is compatible with
both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210C. For Pb
solder, the recommended pot temperature is 260C,
while the Pb-free solder pot is 270C max. Not all RoHS-
compliant through-hole products can be processed with
paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please consult with your
Lineage Power representative for more details.
GE
Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 13
EMC Con s ideratio n s
The circuit and plots in Figure 26 show a suggested configuration to meet the conducted emission limits of EN55022 Class
B.
Note: Customer is ultimately responsible for the proper layout, component selection, rating and verification of the suggeted
parts based on end application.
LISN connected to L Line LISN connected to N Line
Figure 26. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
GE Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 14
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View*
*Top side label includes Lineage Power name, product designation and date code.
Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
Bottom
View
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
GE Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 15
Mechanical Outline for Surface Mo unt Module (-S Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
* Top side label includes Lineage Power name, product designation and date code.
VI-
ON/OFF
VI+
VO-
TRIM
VO+
SENSE-
SENSE+
Top
View
Side
View
Bottom
View*
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
GE
Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 16
Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View
Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
Bottom
View*
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
GE
Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 17
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
SMT Recommended Pad Layout (Component Side View)
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER
FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER
TH Recommended Pad Layout (Component Side View)
GE Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 18
Packaging Details
The surface mount versions of the ESTW010A0A (suffix –
S) are supplied as standard in the plastic trays shown in
Figure 27.
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 1012/sq
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1 box of 4 full trays + 1
empty top tray)
Each tray contains a total of 12 power modules. The trays
are self-stacking and each shipping box for the surface
mount module (suffix –S) will contain 4 full trays plus one
empty hold down tray giving a total number of 48 power
modules.
Figure 27. Surfac e M ount Pack a ging Tray
GE Data Sheet
ESTW010A0A Series Ei
g
hth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
Contact Us
For more information, call us at
USA/Canada:
+1 877 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
www.ge.com/powerelectronics
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no
liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s)
or information.
February 23, 2017 ©2012 General Electric Company. All rights reserved. Version 1.1
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 1 Device Codes
Product Codes Input Voltage Output
Voltage
Output
Current
On/Off
Logic
Connector
Type Comcodes
ESTW010A0A41Z 48V (36-75Vdc) 5.0V 10A Negative Through hole CC109163481
ESTW010A0A41-HZ 48V (36-75Vdc) 5.0V 10A Negative Through hole CC109169553
ESTW010A0A41-SZ 48V (36-75Vdc) 5.0V 10A Negative Surface mount CC109168877
Table 2. Device Options
Characteristic Definition
Form Factor E E = Eighth Brick
Family Designator ST ST = STINGRAY Series
Input Voltage W W = Wide Range, 36V-75V
Output Current 010A0 010A0 = 010.0 amps maximum
Output Voltage A A = 5.0V nominal
Omit = Default Pin Length shown in Mechanical Outline Figures
66 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)
88 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)
Omit = Latching Mode
44 = Auto-restart following shutdown
(Overcurrent/Overvoltage/Overtermperature)
Omit = Positive Logic
11 = Negative Logic
Customer Specific XY XY = Customer Specific Modified Code, Omit for Standard Code
Mechanical Features Omit = Standard open Frame Module
H H = Heat plate, for use with heat sinks or cold walls
S S = Surface mount connections
Omit = RoHS 5/6, Lead Based Solder Used
ZZ = RoHS 6/6 Compliant, Lead free
Character and Position
RatingsOptions
Pin Length
Action following
Protective Shutdown
On/Off Logic
RoHS
