19-2627; Rev 2; 9/05 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP Features The MAX4717/MAX4718 low-voltage, low on-resistance (RON), dual single-pole/double throw (SPDT) analog switches operate from a single +1.8V to +5.5V supply. These devices are designed for USB 1.1 and audio switching applications. The MAX4717 features two 4.5 R ON (max) SPDT switches with 1.2 flatness and 0.3 matching between channels. The MAX4718 features one 4.5 RON (max) SPDT switch and one 20 RON (max) SPDT switch. The 20 switch has a guaranteed matching and flatness of 0.4 and 1.2, respectively. These switches offer breakbefore-make switching (1ns) with tON <80ns and tOFF <40ns at +2.7V. The digital logic inputs are +1.8V logic compatible with a +2.7V to +3.6V supply. These switches are packaged in a chip-scale package (UCSPTM), significantly reducing the required PC board area. The chip occupies only a 2.0mm 1.50mm area and has a 4 3 bump array with a bump pitch of 0.5mm. These switches are also available in 10-pin MAX(R) and 10-pin TDFN packages. USB 1.1 Signal Switching Compliant (TID = 4000231) 2ns (max) Differential Skew -3dB Bandwidth: > 300MHz Low 15pF On-Channel Capacitance Single-Supply Operation from +1.8V to +5.5V 4.5 RON (max) Switches (MAX4717/MAX4718) 0.3 (max) RON Match (+3.0V Supply) 1.2 (max) Flatness (+3.0V Supply) 20 RON (max) Switch (MAX4718) 0.4 (max) RON Match (+3.0V Supply) 1.2 (max) Flatness (+3.0V Supply) Rail-to-Rail Signal Handling High Off-Isolation: -55dB (10MHz) Low Crosstalk: -80dB (10MHz) Low Distortion: 0.03% +1.8V CMOS-Logic Compatible < 0.5nA Leakage Current at +25C Applications Ordering Information USB 1.1 Signal Switching Circuits Battery-Operated Equipment PART TEMP RANGE PIN/BUMPPACKAGE -40C to +85C 10 MAX TOP MARK Audio/Video-Signal Routing Headphone Switching MAX4717EUB MAX4717ETB -40C to +85C 10 TDFN-EP* ACV Low-Voltage Data-Acquisition Systems Sample-and-Hold Circuits Cell Phones MAX4717EBC-T -40C to +85C 12 UCSP-12 ABH MAX4718EUB -40C to +85C 10 MAX MAX4718ETB -40C to +85C 10 TDFN-EP* ACW PDAs MAX4718EBC-T -40C to +85C 12 UCSP-12 ABI -- -- *EP = Exposed paddle. UCSP is a trademark of Maxim Integrated Products, Inc. MAX is a registered trademark of Maxim Integrated Products, Inc. Pin Configurations/Functional Diagrams/Truth Tables TOP VIEW (BUMP SIDE DOWN) NC1 IN1 MAX4717/MAX4718 MAX4717/MAX4718 GND C1 B1 C2 A1 A2 NC2 IN2 V+ 1 10 NO2 NO1 2 9 COM1 COM1 NO1 C3 C4 A3 B4 V+ UCSP A4 3 8 SPDT1 SPDT2 4.5 4.5 MAX4718 4.5 20 COM2 MAX4717/MAX4718 IN2 COM2 NO2 PART MAX4717 IN1 4 7 NC2 NC1 5 6 GND IN_ NO_ NC_ 0 OFF ON 1 ON OFF MAX4717/MAX4718 V+ 1 10 NO2 NO1 2 9 COM2 COM1 3 8 IN2 IN1 4 7 NC2 NC1 5 6 GND SWITCHES SHOWN FOR LOGIC "0" INPUT TDFN MAX ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. 1 MAX4717/MAX4718 General Description MAX4717/MAX4718 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP ABSOLUTE MAXIMUM RATINGS (All voltages are referenced to GND.) V+, IN_...................................................................-0.3V to +6.0V COM_, NO_, NC_ (Note 1) ...........................-0.3V to (V+ + 0.3V) Continuous Current COM_, NO_, NC_ ...........................100mA Peak Current COM_, NO_, NC_ (pulsed at 1ms, 10% duty cycle)................................200mA Continuous Power Dissipation (TA = +70C) 10-Pin MAX (derate 5.6mW/C above +70C) ...........444mW 10-Pin TDFN (derate 24.4mW/C above +70C) .......1951mW 12-Bump UCSP (derate 11.4mW/C above +70C) ....909mW ESD Method 3015.7 .............................................................>2kV Operating Temperature Range ...........................-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C Bump Temperature (soldering) Infrared (15s) ...............................................................+220C Vapor Phase (60s) .......................................................+215C Note 1: Signals on COM_, NO_, or NC_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maximum current rating. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS--Single +3V Supply (V+ = +2.7V to +3.6V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.0V, TA = +25C, unless otherwise noted.) (Notes 2, 3) PARAMETER Analog Signal Range SYMBOL CONDITIONS VCOM_, VNO_, VNC_ TA MIN TMIN to TMAX 0 TYP MAX UNITS V+ V ANALOG SWITCH (Low RON--MAX4717/MAX4718 SPDT 1) +25C On-Resistance (Note 4) RON V+ = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 1.5V RON V+ = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 1.5V 3.0 TMIN to TMAX 5 +25C On-Resistance Match Between Channels (Notes 4, 5) 0.1 TMIN to TMAX RFLAT(ON) V+ = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 1.0V, 1.5V, 2.0V NO_, NC_ Off-Leakage Current (Note 7) INO_(OFF), INC_(OFF) V+ = 3.6V, VCOM_ = 0.3V, 3.3V; VNO_ or VNC_ = 3.3V, 0.3V COM_ On-Leakage Current (Note 7) ICOM_(ON) V+ = 3.6V, VCOM_ = 0.3V, 3.3V; VNO_ or VNC_ = 0.3V, 3.3V, or floating 0.6 TMIN to TMAX +25C -0.5 -1 +25C -1 TMIN to TMAX -2 +0.01 +0.5 +1 +0.01 1.2 1.5 TMIN to TMAX 0.3 0.4 +25C On-Resistance Flatness (Note 6) 4.5 nA +1 +2 nA ANALOG SWITCH (High RON--MAX4718 SPDT 2) +25C On-Resistance (Note 4) 2 RON V+ = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 1.5V 15 TMIN to TMAX _______________________________________________________________________________________ 20 25 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP (V+ = +2.7V to +3.6V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.0V, TA = +25C, unless otherwise noted.) (Notes 2, 3) PARAMETER SYMBOL CONDITIONS TA MIN +25C On-Resistance Match Between Channels (Notes 4, 5) RON V+ = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 1.5V TYP MAX 0.15 0.4 TMIN to TMAX 0.5 +25C 0.6 On-Resistance Flatness (Note 6) RFLAT(ON) V+ = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 1.0V, 1.5V, 2.0V NO_, NC_ Off-Leakage Current (Note 7) INO_(OFF), INC_(OFF) V+ = 3.6V, VCOM_ = 0.3V, 3.3V; VNO_ or VNC_ = 3.3V, 0.3V COM_ On-Leakage Current (Note 7) ICOM_(ON) V+ = 3.6V, VCOM_ = 0.3V, 3.3V; VNO_ or VNC_ = 0.3V, 3.3V, or floating tON VNO_, VNC_ = 1.5V; RL = 300, CL = 35pF, Figure 1; VIH = 1.5V, VIL = 0V tOFF VNO_, VNC_ = 1.5V; RL = 300, CL = 35pF, Figure 1; VIH = 1.5V, VIL = 0V Break-Before-Make Time Delay (Note 7) tBBM VNO_, VNC_ = 1.5V; RL = 300, CL = 35pF, Figure 2 Skew (Note 7) tSKEW RS = 39, CL = 50pF, Figure 3 TMIN to TMAX 0.15 VGEN = 1.5V, RGEN = 0, CL = 1.0nF, Figure 4 +25C 5 TMIN to TMAX -0.5 TMIN to TMAX -1 +25C -1 TMIN to TMAX -2 +0.01 +0.5 +1 +0.01 1.2 1.5 +25C UNITS nA +1 +2 nA DYNAMIC CHARACTERISTICS Turn-On Time Turn-Off Time +25C 40 TMIN to TMAX 100 +25C 20 TMIN to TMAX Charge Injection Q Off-Isolation VISO Crosstalk (Note 8) VCT f = 10MHz; VNO_, VNC_ = 1VP-P; RL = 50, CL = 5pF, Figure 5 ns 8 ns 1 2 ns pC -55 +25C f = 1MHz; VNO_, VNC_ = 1VP-P; RL = 50, CL = 5pF, Figure 5 f = 10MHz; VNO_, VNC_ = 1VP-P; RL = 50, CL = 5pF, Figure 5 ns 40 50 +25C TMIN to TMAX 80 dB -80 -80 +25C f = 1MHz; VNO_, VNC_ = 1VP-P; RL = 50, CL = 5pF, Figure 5 dB -110 On-Channel -3dB Bandwidth BW Signal = 0dBm, RL = 50, CL = 5pF, Figure 5 +25C >300 MHz Total Harmonic Distortion THD VCOM_ = 2VP-P, RL = 600 +25C 0.03 % +25C 9 pF NO_, NC_ Off-Capacitance CNO_(OFF), f = 1MHz, Figure 6 CNC_(OFF) _______________________________________________________________________________________ 3 MAX4717/MAX4718 ELECTRICAL CHARACTERISTICS--Single +3V Supply (continued) MAX4717/MAX4718 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP ELECTRICAL CHARACTERISTICS--Single +3V Supply (continued) (V+ = +2.7V to +3.6V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.0V, TA = +25C, unless otherwise noted.) (Notes 2, 3) PARAMETER Switch On-Capacitance SYMBOL C(ON) CONDITIONS f = 1MHz, Figure 6 TA MIN +25C TYP MAX 15 UNITS pF DIGITAL I/O Input Logic High Voltage VIH TMIN to TMAX Input Logic Low Voltage VIL TMIN to TMAX Input Leakage Current IIN V+ = +3.6V, VIN_ = 0 or 5.5V 1.4 V 0.5 V TMIN to TMAX -100 +100 nA TMIN to TMAX 1.8 5.5 V 1 A POWER SUPPLY Power-Supply Range V+ Supply Current I+ V+ = +5.5V, VIN_ = 0V or V+ TMIN to TMAX ELECTRICAL CHARACTERISTICS--Single +5V Supply (V+ = +4.2V to +5.5V, VIH = +2.0V, VIL = +0.8V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +5.0V, TA = +25C, unless otherwise noted.) (Notes 2, 3) PARAMETER Analog Signal Range SYMBOL CONDITIONS VCOM_, VNO_, VNC_ TA MIN TMIN to TMAX 0 TYP MAX UNITS V+ V ANALOG SWITCH (Low RON--MAX4717/MAX4718 SPDT 1) +25C On-Resistance (Note 4) RON V+ = 4.2V, ICOM_ = 10mA; VNO_ or VNC_ = 3.5V RON V+ = 4.2V, ICOM_ = 10mA; VNO_ or VNC_ = 3.5V 1.7 TMIN to TMAX 3.5 +25C On-Resistance Match Between Channels (Notes 4, 5) 0.1 TMIN to TMAX RFLAT(ON) V+ = 4.2V, ICOM_ = 10mA; VNO_ or VNC_ = 1.0V, 2.0V, 3.5V NO_, NC_ Off-Leakage Current (Note 7) INO_(OFF), INC_(OFF) V+ = 5.5V; VCOM_ = 1.0V, 4.5V; VNO_ or VNC_ = 1.0V, 4.5V COM_ On-Leakage Current (Note 7) ICOM_(ON) V+ = 5.5V; VCOM_ = 1.0V, 4.5V; VNO_ or VNC_ = 1.0V, 4.5V, or floating 4 0.4 TMIN to TMAX +25C -0.5 -1 +25C -1 TMIN to TMAX -2 +0.01 _______________________________________________________________________________________ +0.5 +1 +0.01 1.2 1.5 TMIN to TMAX 0.3 0.4 +25C On-Resistance Flatness (Note 6) 3 nA +1 +2 nA 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP (V+ = +4.2V to +5.5V, VIH = +2.0V, VIL = +0.8V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +5.0V, TA = +25C, unless otherwise noted.) (Notes 2, 3) PARAMETER SYMBOL CONDITIONS TA MIN TYP MAX 12 20 UNITS ANALOG SWITCH (High RON--MAX4718 SPDT 2) +25C On-Resistance (Note 4) RON V+ = 4.2V, ICOM_ = 10mA; VNO_ or VNC_ = 3.5V RON V+ = 4.2V, ICOM_ = 10mA; VNO_ or VNC_ = 3.5V TMIN to TMAX 25 +25C On-Resistance Match Between Channels (Notes 4, 5) 0.15 TMIN to TMAX RFLAT(ON) V+ = 4.2V, ICOM_ = 10mA; VNO_ or VNC_ = 1.0V, 2.0V, 4.5V NO_, NC_ Off-Leakage Current (Note 7) INO_(OFF), INC_(OFF) V+ = 5.5V; VCOM_ = 1.0V, 4.5V; VNO_ or VNC_= 1.0V, 4.5V COM_ On-Leakage Current (Note 7) ICOM_(ON) V+ = 5.5V, VCOM_ = 1.0V, 4.5V; VNO_ or VNC_ = 1.0V, 4.5V, or floating tON VNO_, VNC_ = 3.0V; RL = 300, CL = 35pF, Figure 1 tOFF VNO_, VNC_ = 3.0V; RL = 300, CL = 35pF, Figure 1 Break-Before-Make Time Delay (Note 7) tBBM VNO_, VNC_ = 3.0V; RL = 300, CL = 35pF, Figure 2 Skew (Note 7) tSKEW RS = 39, CL = 50pF, Figure 3 0.4 0.5 +25C On-Resistance Flatness (Note 6) 0.4 TMIN to TMAX -0.5 TMIN to TMAX -1 +25C -1 TMIN to TMAX -2 +0.01 +0.5 +1 +0.01 1.2 1.5 +25C nA +1 +2 nA DYNAMIC CHARACTERISTICS +25C Turn-On Time 30 TMIN to TMAX 100 +25C Turn-Off Time 20 TMIN to TMAX ns 40 50 +25C TMIN to TMAX 80 ns 8 ns 1 TMIN to TMAX 0.15 2 ns DIGITAL I/O Input Logic High Voltage VIH TMIN to TMAX Input Logic Low Voltage VIL TMIN to TMAX Input Leakage Current IIN V+ = 5.5V, VIN_ = 0V or V+ TMIN to TMAX 2.0 -100 V 0.8 V +100 nA _______________________________________________________________________________________ 5 MAX4717/MAX4718 ELECTRICAL CHARACTERISTICS--Single +5V Supply (continued) ELECTRICAL CHARACTERISTICS--Single +5V Supply (continued) (V+ = +4.2V to +5.5V, VIH = +2.0V, VIL = +0.8V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +5.0V, TA = +25C, unless otherwise noted.) (Notes 2, 3) PARAMETER SYMBOL CONDITIONS TA MIN TMIN to TMAX 1.8 TYP MAX UNITS 5.5 V 1 A POWER SUPPLY Power-Supply Range V+ Supply Current I+ Note 2: Note 3: Note 4: Note 5: Note 6: Note 7: Note 8: TMIN to TMAX V+ = 5.5V, VIN_ = 0V or V+ UCSP and TDFN parts are 100% tested at +25C only, and guaranteed by design over the specified temperature range. MAX parts are 100% tested at TMAX and guaranteed by design over the specified temperature range. The algebraic convention used in this data sheet is where the most negative value is a minimum and the most positive value is a maximum. Guaranteed by design for UCSP and TDFN parts. RON = RON(MAX) - RON(MIN). Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal ranges. Guaranteed by design. Between any two switches. Typical Operating Characteristics (TA = +25C, unless otherwise noted.) ON-RESISTANCE vs. COM_ VOLTAGE V+ = 1.8V 5 RON () 6 V+ = 3V LOW RON SWITCH V+ = 2.5V V+ = 3V 4 TA = +85C TA = +25C 3 V+ = 4.2V V+ = 5V 2 2 0 1 V+ = 5V LOW RON SWITCH 4 RON () 8 ON-RESISTANCE vs. COM_ VOLTAGE 5 MAX4717/18 toc02 MAX4717/18 toc01 LOW RON SWITCH 4 6 3 TA = +25C 1 2 3 VCOM_ (V) 6 4 5 TA = +85C 2 1 TA = -40C TA = -40C 0 MAX4717/18 toc03 ON-RESISTANCE vs. COM_ VOLTAGE 10 RON () MAX4717/MAX4718 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP 0 0 0.5 1.0 1.5 VCOM_ (V) 2.0 2.5 3.0 0 1 2 3 VCOM_ (V) _______________________________________________________________________________________ 4 5 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP ON-RESISTANCE vs. COM_ VOLTAGE 12 12 12 TA = -40C 11 1 2 3 4 10 5 0 0.5 1.0 VCOM_ (V) LEAKAGE CURRENT vs. TEMPERATURE 2.5 3.0 0 COM_ ON-LEAKAGE COM_ OFF-LEAKAGE 200 V+ = 5V LOW RON SWITCH 800 100 0 600 COM_ ON-LEAKAGE COM_ OFF-LEAKAGE 400 60 85 -15 TEMPERATURE (C) LEAKAGE CURRENT vs. TEMPERATURE 10 35 60 COM_ ON-LEAKAGE COM_ OFF-LEAKAGE 100 -100 10 35 TEMPERATURE (C) -15 40 CL = 1nF V+ = 5V 30 CL = 1nF V+ = 3V 20 60 85 10 35 60 85 SUPPLY CURRENT vs. TEMPERATURE 6 5 4 V+ = 5V 3 2 V+ = 3V 1 0 -15 -40 TEMPERATURE (C) 10 -40 COM_ OFF-LEAKAGE 100 85 50 CHARGE INJECTION (pC) 700 300 COM_ ON-LEAKAGE 300 CHARGE INJECTION vs. VCOM MAX4717/18 toc10 V+ = 5V HIGH RON SWITCH 500 500 TEMPERATURE (C) 900 5 -100 -40 SUPPLY CURRENT (nA) 35 4 V+ = 3V HIGH RON SWITCH MAX4717/18 toc11 10 3 LEAKAGE CURRENT vs. TEMPERATURE 0 -15 2 700 200 -40 1 VCOM_ (V) 1000 LEAKAGE CURRENT (pA) 400 LEAKAGE CURRENT (pA) 2.0 LEAKAGE CURRENT vs. TEMPERATURE MAX4717/18 toc07 V+ = 3V LOW RON SWITCH LEAKAGE CURRENT (pA) 1.5 VCOM_ (V) 500 300 TA = +25C 10 MAX4717/18 toc12 0 11 TA = +25C TA = -40C V+ = 5V 10 TA = +85C 13 MAX4717/18 toc09 V+ = 4.2V LEAKAGE CURRENT (pA) 14 13 V+ = 5V HIGH RON SWITCH 14 RON () V+ = 2.5V MAX4717/18 toc08 16 TA = +85C 14 RON () RON () 18 V+ = 3V HIGH RON SWITCH ON-RESISTANCE vs. COM_ VOLTAGE 15 MAX4717/18 toc05 MAX4717/18 toc04 HIGH RON SWITCH V+ = 1.8V 15 MAX4717/18 toc06 ON-RESISTANCE vs. COM_ VOLTAGE 20 0 0 1 2 3 VCOM_ (V) 4 5 -40 -15 10 35 60 85 TEMPERATURE (C) _______________________________________________________________________________________ 7 MAX4717/MAX4718 Typical Operating Characteristics (continued) (TA = +25C, unless otherwise noted.) Typical Operating Characteristics (continued) (TA = +25C, unless otherwise noted.) 40 1.2 VTH0.8 60 tON 40 tOFF V+ = 3V 20 0.4 0 20 0 1 2 3 5 4 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 1.5 TURN-ON/OFF TIME vs. SUPPLY VOLTAGE TURN-ON/OFF TIME vs. TEMPERATURE TURN-ON/OFF TIME vs. TEMPERATURE LOW RON SWITCH tON 40 40 tON, V+ = 5.0V 30 20 tOFF 20 50 3.5 4.5 5.5 40 30 tOFF, V+ = 5.0V tOFF, V+ = 3.0V 10 0 2.5 tON, V+ = 5.0V 20 tOFF, V+ = 5.0V tOFF, V+ = 3.0V 10 0 HIGH RON SWITCH tON, V+ = 3.0V tON/tOFF (ns) 60 tON, V+ = 3.0V 50 5.5 60 MAX4717/18 toc17 60 tON/tOFF (ns) 80 0 -40 -15 10 35 60 85 -40 -15 10 35 85 60 SUPPLY VOLTAGE (V) TEMPERATURE (C) TEMPERATURE (C) RISE/FALL-TIME DELAY vs. SUPPLY VOLTAGE RISE/FALL-TIME DELAY vs. TEMPERATURE RISE TIME TO FALL TIME MISMATCH vs. SUPPLY VOLTAGE 1.5 RISE DELAY 1.0 0.5 FALL DELAY 0 1.0 RISE DELAY FALL DELAY 0.5 3.5 SUPPLY VOLTAGE (V) 4.5 5.5 INPUT RISE/FALL TIME = 15ns FIGURE 4, CL = 50pF LOW RON SWITCH 300 200 100 0 2.5 400 MAX4717/18 toc21 1.5 INPUT RISE/FALL TIME = 15ns FIGURE 4, CL = 50pF V+ = 4.2V LOW RON SWITCH MISMATCH (ps) 2.0 2.0 MAX4717/18 toc20 INPUT RISE/FALL TIME = 15ns FIGURE 4, CL = 50pF LOW RON SWITCH OUTPUT RISE/FALL-TIME DELAY (ns) MAX4717/18 toc19 3.0 1.5 4.5 SUPPLY VOLTAGE (V) HIGH RON SWITCH 2.5 3.5 SUPPLY VOLTAGE (V) 100 1.5 2.5 LOGIC LEVEL (V) MAX4717/18 toc16 0 tON/tOFF (ns) 80 VTH+ MAX4717/18 toc18 60 LOW RON SWITCH tON/tOFF (ns) V+ = 5V 100 MAX4717/18 toc14 1.6 LOGIC THRESHOLD (V) 80 SUPPLY CURRENT (A) 2.0 MAX4717/18 toc13 100 8 TURN-ON/OFF TIME vs. SUPPLY VOLTAGE LOGIC THRESHOLD vs. SUPPLY VOLTAGE MAX4717/18 toc15 SUPPLY CURRENT vs. LOGIC LEVEL OUTPUT RISE/FALL-TIME DELAY (ps) MAX4717/MAX4718 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP 0 -40 -15 10 35 TEMPERATURE (C) 60 85 1.5 2.5 3.5 SUPPLY VOLTAGE (V) _______________________________________________________________________________________ 4.5 5.5 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP MAX4717/18 toc23 300 150 200 100 0 100 50 0 10 35 60 85 0 1.5 2.5 TEMPERATURE (C) 3.5 5.5 4.5 20 MAX4717/18 toc25 LOW RON SWITCH V+ = 3V/5V -20 ON-LOSS (dB) -40 OFF-ISOLATION -80 -100 HIGH RON SWITCH V+ = 3V/5V 0 ON-LOSS -60 10 35 60 85 FREQUENCY RESPONSE 0 -20 -15 TEMPERATURE (C) FREQUENCY RESPONSE 20 -40 SUPPLY VOLTAGE (V) ON-LOSS -40 -60 OFF-ISOLATION -80 -100 CROSSTALK -120 -140 0.0001 0.01 1 CROSSTALK -120 -140 0.0001 100 FREQUENCY (MHz) 1 100 FREQUENCY (MHz) TOTAL HARMONIC DISTORTION vs. FREQUENCY TOTAL HARMONIC DISTORTION vs. FREQUENCY 1 MAX4717/18 toc27 1 0.01 THD (%) V+ = 3V LOW RON SWITCH RL = 600 0.1 MAX4717/18 toc28 -15 ON-LOSS (dB) -40 INPUT RISE/FALL TIME = 15ns FIGURE 4, CL = 50pF V+ = 4.2V MAX4717 ONLY MAX4717/18 toc26 50 200 SKEW (ps) 100 SKEW vs. TEMPERATURE INPUT RISE/FALL TIME = 15ns FIGURE 4, CL = 50pF MAX4717 ONLY SKEW (ps) INPUT RISE/FALL TIME = 15ns FIGURE 4, CL = 50pF V+ = 4.2V LOW RON SWITCH THD (%) MISMATCH (ps) 150 SKEW vs. SUPPLY VOLTAGE 400 MAX4717/18 toc22 200 MAX4717/18 toc24 RISE TIME TO FALL TIME MISMATCH vs. TEMPERATURE V+ = 3V HIGH RON SWITCH RL = 600 0.1 0.01 0.01 10 100 1k FREQUENCY (Hz) 10k 100k 10 100 1k 10k 100k FREQUENCY (Hz) _______________________________________________________________________________________ 9 MAX4717/MAX4718 Typical Operating Characteristics (continued) (TA = +25C, unless otherwise noted.) MAX4717/MAX4718 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP Pin Description Applications Information Digital Control Inputs PIN UCSP MAX/ TDFN NAME FUNCTION A1 7 NC2 Analog Switch 2--Normally Closed Terminal A2 8 IN2 Analog Switch 2--Digital Control Input A3 9 COM2 A4 10 NO2 Analog Switch 2--Normally Open Terminal B1 6 GND Ground. Connection. B4 1 V+ C1 5 NC1 Analog Switch 1--Normally Closed Terminal Analog Switch 1--Digital Control Input Analog Switch 2--Common Terminal Positive-Supply Voltage C2 4 IN1 C3 3 COM1 C4 2 NO1 Analog Switch 1--Normally Open Terminal -- -- EP Exposed Pad (for TDFN package only). Connect to ground. Analog Switch 1--Common Terminal Detailed Description The MAX4717/MAX4718 high-speed, low-voltage, low onresistance (RON), dual SPDT analog switches operate from a single +1.8V to +5.5V supply. The switches feature break-before-make switching operation and fast switching speeds (tON = 80ns (max), tOFF = 40ns (max)). These switches have low 15pF on-channel capacitance, which allows for 12Mbps switching of the data signals for USB 1.0/1.1 applications. The MAX4717 is designed to switch D+ and D- USB signals with a guaranteed skew of less than 2ns (see Figure 4) as measured from 50% of the input signal to 50% of the output signal. 10 The MAX4717/MAX4718 logic inputs accept up to +5.5V regardless of supply voltage. For example, with a +3.3V supply, IN_ can be driven low to GND and high to +5.5V allowing for mixing of logic levels in a system. Driving the control logic inputs rail-to-rail minimizes power consumption. For a +3V supply voltage, the logic thresholds are 0.5V (low) and 1.4V (high); for a +5V supply voltage, the logic thresholds are 0.8V (low) and 2.0V (high). Analog Signal Levels The on-resistance of the MAX4717/MAX4718 changes very little for analog input signals across the entire supply voltage range (see the Typical Operating Characteristics). The switches are bidirectional, so the NO_, NC_, and COM_ pins can be either inputs or outputs. Power-Supply Sequencing and Overvoltage Protection Caution: Do not exceed the absolute maximum ratings because stresses beyond the listed ratings may cause permanent damage to the device. Proper power-supply sequencing is recommended for all CMOS devices. Always apply V+ before applying analog signals, especially if the analog signal is not current-limited. UCSP Application Information For the latest application details on UCSP construction, dimensions, tape carrier information, printed circuit board techniques, bump-pad layout, and recommended reflow temperature profile as well as the latest information on reliability testing results, go to the Maxim web site at www.maxim-ic.com/ucsp to find the Application Note: USCP--A Wafer-Level Chip-Scale Package. Chip Information TRANSISTOR COUNT: 235 PROCESS: BiCMOS ______________________________________________________________________________________ 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP MAX4717/ MAX4718 V+ VN_ LOGIC INPUT V+ COM_ NO_ OR NC_ 50% VIL VOUT RL t OFF CL IN_ VOUT GND LOGIC INPUT SWITCH OUTPUT 0.9 x V0UT 0.9 x VOUT 0V t ON CL INCLUDES FIXTURE AND STRAY CAPACITANCE. RL VOUT = VN_ RL + RON ( t r < 5ns t f < 5ns VIH IN DEPENDS ON SWITCH CONFIGURATION; INPUT POLARITY DETERMINED BY SENSE OF SWITCH. ) Figure 1. Switching Time V+ MAX4717/ MAX4718 LOGIC INPUT V+ VN_ NC_ RL 300 IN_ LOGIC INPUT 50% VIL VOUT COM_ NO_ VIH CL 35pF GND 0.9 x VOUT VOUT tBBM CL INCLUDES FIXTURE AND STRAY CAPACITANCE. Figure 2. Break-Before-Make Interval ______________________________________________________________________________________ 11 MAX4717/MAX4718 Test Circuits/Timing Diagrams 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP MAX4717/MAX4718 Test Circuits/Timing Diagrams (continued) RS IN+ MAX4717 NC1 OR NO1 COM1 OUT+ CL RS IN- NC2 OR NO2 COM2 RISE TIME DELAY = |tINRISE - tOUTRISE| FALL TIME DELAY = |tINFALL - tOUTFALL| RISE TIME TO FALL TIME MISMATCH = |tOUTFALL - tOUTRISE| OUTCL IN1 IN2 VIL TO VIH tINFALL V+ VIN+ tINRISE 90% 90% 50% 10% 0V 10% V+ VIN- 50% 0V tOUTFALL V+ tOUTRISE 90% 90% VOUT+ 50% 10% 0V 10% V+ 50% VOUT0V tSKEW Figure 3. Output Signal Skew 12 ______________________________________________________________________________________ 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP V+ MAX4717/ MAX4718 VOUT V+ RGEN VOUT COM_ NC_ OR NO_ VOUT IN OFF CL V GEN GND OFF ON IN_ VIL TO VIH IN ON OFF OFF Q = (V OUT )(C L ) LOGIC INPUT WAVEFORMS INVERTED FOR SWITCHES THAT HAVE THE OPPOSITE LOGIC SENSE. Figure 4. Charge Injection +5V 10nF V OFF-ISOLATION = 20log OUT VIN NETWORK ANALYZER 0V OR V+ V+ IN_ NC1 MAX4717/ MAX4718 VOUT NO1* 50 50 VIN COM1 GND 50 MEAS 50 MEASUREMENTS ARE STANDARDIZED AGAINST SHORTS AT IC TERMINALS. OFF-ISOLATION IS MEASURED BETWEEN COM_ AND "OFF" NO_ OR NC_ TERMINAL ON EACH SWITCH. ON-LOSS IS MEASURED BETWEEN COM_ AND "ON" NO_ OR NC_ TERMINAL ON EACH SWITCH. CROSSTALK IS MEASURED FROM ONE CHANNEL TO THE OTHER CHANNEL. SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED. ON-LOSS = 20log REF VOUT VIN V CROSSTALK = 20log OUT VIN 50 *FOR CROSSTALK THIS PIN IS NO2. NC2 AND COM2 ARE OPEN. Figure 5. On-Loss, Off-Isolation, and Crosstalk 10nF V+ V+ COM_ MAX4717/ MAX4718 IN CAPACITANCE METER f = 1MHz VIL OR VIH NC_ or NO_ GND Figure 6. Channel Off/On-Capacitance ______________________________________________________________________________________ 13 MAX4717/MAX4718 Test Circuits/Timing Diagrams (continued) Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) 12L, UCSP 4x3.EPS MAX4717/MAX4718 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP PACKAGE OUTLINE, 4x3 UCSP 21-0104 14 ______________________________________________________________________________________ F 1 1 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP 10LUMAX.EPS e 4X S 10 10 INCHES H O0.500.1 0.60.1 1 1 0.60.1 BOTTOM VIEW TOP VIEW D2 MILLIMETERS MAX DIM MIN 0.043 A 0.006 A1 0.002 A2 0.030 0.037 0.120 D1 0.116 0.118 0.114 D2 0.116 0.120 E1 0.118 E2 0.114 0.199 H 0.187 L 0.0157 0.0275 L1 0.037 REF b 0.007 0.0106 e 0.0197 BSC c 0.0035 0.0078 0.0196 REF S 0 6 MAX MIN 1.10 0.15 0.05 0.75 0.95 3.05 2.95 3.00 2.89 3.05 2.95 2.89 3.00 4.75 5.05 0.40 0.70 0.940 REF 0.177 0.270 0.500 BSC 0.090 0.200 0.498 REF 0 6 E2 GAGE PLANE A2 c A b A1 E1 D1 FRONT VIEW L L1 SIDE VIEW PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE, 10L uMAX/uSOP APPROVAL DOCUMENT CONTROL NO. 21-0061 REV. I 1 1 ______________________________________________________________________________________ 15 MAX4717/MAX4718 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) 6, 8, &10L, DFN THIN.EPS MAX4717/MAX4718 4.5/20, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP D2 D A2 PIN 1 ID N 0.35x0.35 b PIN 1 INDEX AREA E [(N/2)-1] x e REF. E2 DETAIL A e k A1 CL CL A L L e e PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.80 mm -DRAWING NOT TO SCALE- 21-0137 G 1 2 COMMON DIMENSIONS MIN. MAX. D 0.70 2.90 0.80 3.10 E A1 2.90 0.00 3.10 0.05 L k 0.20 0.40 0.25 MIN. A2 0.20 REF. SYMBOL A PACKAGE VARIATIONS PKG. CODE N D2 E2 e JEDEC SPEC b [(N/2)-1] x e DOWNBONDS ALLOWED T633-1 6 1.500.10 2.300.10 0.95 BSC MO229 / WEEA 0.400.05 1.90 REF NO T633-2 6 1.500.10 2.300.10 0.95 BSC MO229 / WEEA 0.400.05 1.90 REF NO T833-1 8 1.500.10 2.300.10 0.65 BSC MO229 / WEEC 0.300.05 1.95 REF NO T833-2 8 1.500.10 2.300.10 0.65 BSC MO229 / WEEC 0.300.05 1.95 REF NO T833-3 8 1.500.10 2.300.10 0.65 BSC MO229 / WEEC 0.300.05 1.95 REF YES T1033-1 10 1.500.10 2.300.10 0.50 BSC MO229 / WEED-3 0.250.05 2.00 REF NO T1433-1 14 1.700.10 2.300.10 0.40 BSC ---- 0.200.05 2.40 REF YES T1433-2 14 1.700.10 2.300.10 0.40 BSC ---- 0.200.05 2.40 REF NO PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.80 mm -DRAWING NOT TO SCALE- 21-0137 G 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 16 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.