General Description
The MAX4717/MAX4718 low-voltage, low on-resistance
(RON), dual single-pole/double throw (SPDT) analog
switches operate from a single +1.8V to +5.5V supply.
These devices are designed for USB 1.1 and audio
switching applications.
The MAX4717 features two 4.5ΩRON (max) SPDT
switches with 1.2Ωflatness and 0.3Ωmatching between
channels. The MAX4718 features one 4.5ΩRON (max)
SPDT switch and one 20ΩRON (max) SPDT switch. The
20Ωswitch has a guaranteed matching and flatness of
0.4Ωand 1.2Ω, respectively. These switches offer break-
before-make switching (1ns) with tON <80ns and tOFF
<40ns at +2.7V. The digital logic inputs are +1.8V logic
compatible with a +2.7V to +3.6V supply.
These switches are packaged in a chip-scale package
(UCSP™), significantly reducing the required PC board
area. The chip occupies only a 2.0mm ✕1.50mm area
and has a 4 ✕3 bump array with a bump pitch of 0.5mm.
These switches are also available in 10-pin µMAX®and
10-pin TDFN packages.
Applications
USB 1.1 Signal Switching Circuits
Battery-Operated Equipment
Audio/Video-Signal Routing
Headphone Switching
Low-Voltage Data-Acquisition Systems
Sample-and-Hold Circuits
Cell Phones
PDAs
Features
♦USB 1.1 Signal Switching Compliant
(TID = 4000231)
♦2ns (max) Differential Skew
♦-3dB Bandwidth: > 300MHz
♦Low 15pF On-Channel Capacitance
♦Single-Supply Operation from +1.8V to +5.5V
♦4.5ΩRON (max) Switches (MAX4717/MAX4718)
0.3Ω(max) RON Match (+3.0V Supply)
1.2Ω(max) Flatness (+3.0V Supply)
♦20ΩRON (max) Switch (MAX4718)
0.4Ω(max) RON Match (+3.0V Supply)
1.2Ω(max) Flatness (+3.0V Supply)
♦Rail-to-Rail Signal Handling
♦High Off-Isolation: -55dB (10MHz)
♦Low Crosstalk: -80dB (10MHz)
♦Low Distortion: 0.03%
♦+1.8V CMOS-Logic Compatible
♦< 0.5nA Leakage Current at +25°C
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
19-2627; Rev 2; 9/05
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
PART TEMP RANGE PIN/BUMP-
PACKAGE
TOP
MARK
MAX4717EUB -40°C to +85°C 10 µMAX —
MAX4717ETB -40°C to +85°C 10 TDFN-EP* ACV
MAX4717EBC-T -40°C to +85°C 12 UCSP-12 ABH
MAX4718EUB -40°C to +85°C 10 µMAX —
MAX4718ETB -40°C to +85°C 10 TDFN-EP* ACW
MAX4718EBC-T -40°C to +85°C 12 UCSP-12 ABI
COM2COM1
NO2NO1
NC2
IN2IN1
NC1
GND
V+
IN_
0
1
NO_
MAX4717/MAX4718
OFF
ON
NC_
ON
SWITCHES SHOWN FOR LOGIC "0" INPUT
OFF
PART
MAX4717
MAX4718
SPDT1
4.5Ω
4.5Ω
4.5Ω
20Ω
SPDT2
UCSP
MAX4717/MAX4718
MAX4717/MAX4718
NC2
IN1
GND
NC1
2
3
9
8
COM2
IN2
COM1
NO1
110 NO2
V+
4
5
7
6
µMAX
C1
C2
C3
C4 B4 A4
A3
A2
A1B1
TOP VIEW
(BUMP SIDE DOWN)
COM1
IN1
NC1
NO1
V+
TDFN
MAX4717/MAX4718
IN2
NC2
GND
COM2
NO2
1
2
3
4
5
10
9
8
7
6
Pin Configurations/Functional Diagrams/Truth Tables
UCSP is a trademark of Maxim Integrated Products, Inc.
µMAX is a registered trademark of Maxim Integrated Products, Inc.
*EP = Exposed paddle.
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS—Single +3V Supply
(V+ = +2.7V to +3.6V, VIH = +1.4V, VIL = +0.5V, TA= TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.0V,
TA= +25°C, unless otherwise noted.) (Notes 2, 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages are referenced to GND.)
V+, IN_...................................................................-0.3V to +6.0V
COM_, NO_, NC_ (Note 1) ...........................-0.3V to (V+ + 0.3V)
Continuous Current COM_, NO_, NC_ ...........................±100mA
Peak Current COM_, NO_, NC_
(pulsed at 1ms, 10% duty cycle)................................±200mA
Continuous Power Dissipation (TA= +70°C)
10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW
10-Pin TDFN (derate 24.4mW/°C above +70°C) .......1951mW
12-Bump UCSP (derate 11.4mW/°C above +70°C) ....909mW
ESD Method 3015.7 .............................................................>2kV
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
Note 1: Signals on COM_, NO_, or NC_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to
maximum current rating.
PARAMETER SYMBOL CONDITIONS TAMIN TYP MAX UNITS
Analog Signal Range VCOM_,
VNO_, VNC_
TMIN to
TMAX 0V+V
ANALOG SWITCH (Low RON—MAX4717/MAX4718 SPDT 1)
+25°C 3.0 4.5
On-Resistance
(Note 4) RON V+ = 2.7V, ICOM_ = 10mA;
VNO_ or VNC_ = 1.5V TMIN to
TMAX 5Ω
+25°C 0.1 0.3
On-Resistance Match Between
Channels (Notes 4, 5) ∆RON V+ = 2.7V, ICOM_ = 10mA;
VNO_ or VNC_ = 1.5V TMIN to
TMAX 0.4 Ω
+25°C 0.6 1.2
On-Resistance Flatness
(Note 6) RFLAT
(
ON
)
V+ = 2.7V, ICOM_ = 10mA;
VNO_ or VNC_ = 1.0V, 1.5V, 2.0V TMIN to
TMAX 1.5 Ω
+25°C -0.5 +0.01 +0.5
NO_, NC_ Off-Leakage Current
(Note 7)
INO_
(
OFF
),
INC_
(
OFF
)
V+ = 3.6V, VCOM_ = 0.3V, 3.3V;
VNO_ or VNC_ = 3.3V, 0.3V TMIN to
TMAX -1 +1 nA
+25°C -1 +0.01 +1
COM_ On-Leakage Current
(Note 7) ICOM_
(
ON
)
V+ = 3.6V, VCOM_ = 0.3V, 3.3V;
VNO_ or VNC_ = 0.3V, 3.3V, or
floating
TMIN to
TMAX -2 +2 nA
ANALOG SWITCH (High RON—MAX4718 SPDT 2)
+25°C 15 20
On-Resistance (Note 4) RON V+ = 2.7V, ICOM_ = 10mA;
VNO_ or VNC_ = 1.5V TMIN to
TMAX 25 Ω
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS—Single +3V Supply (continued)
(V+ = +2.7V to +3.6V, VIH = +1.4V, VIL = +0.5V, TA= TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.0V,
TA= +25°C, unless otherwise noted.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS TAMIN TYP MAX UNITS
+25°C 0.15 0.4
On-Resistance Match Between
Channels (Notes 4, 5) ∆RON V+ = 2.7V, ICOM_ = 10mA;
VNO_ or VNC_ = 1.5V TMIN to
TMAX 0.5 Ω
+25°C 0.6 1.2
On-Resistance Flatness
(Note 6) RFLAT
(
ON
)
V+ = 2.7V, ICOM_ = 10mA;
VNO_ or VNC_ = 1.0V, 1.5V, 2.0V TMIN to
TMAX 1.5 Ω
+25°C -0.5 +0.01 +0.5
NO_, NC_ Off-Leakage Current
(Note 7)
INO_
(
OFF
),
INC_
(
OFF
)
V+ = 3.6V, VCOM_ = 0.3V, 3.3V;
VNO_ or VNC_ = 3.3V, 0.3V TMIN to
TMAX -1 +1 nA
+25°C -1 +0.01 +1
COM_ On-Leakage Current
(Note 7) ICOM_
(
ON
)
V+ = 3.6V, VCOM_ = 0.3V, 3.3V;
VNO_ or VNC_ = 0.3V, 3.3V, or
floating
TMIN to
TMAX -2 +2 nA
DYNAMIC CHARACTERISTICS
+25°C 40 80
Turn-On Time tON
VNO_, VNC_ = 1.5V;
RL = 300Ω, CL = 35pF, Figure 1;
VIH = 1.5V, VIL = 0V
TMIN to
TMAX 100 ns
+25°C 20 40
Turn-Off Time tOFF
VNO_, VNC_ = 1.5V;
RL = 300Ω, CL = 35pF, Figure 1;
VIH = 1.5V, VIL = 0V
TMIN to
TMAX 50 ns
+25°C 8
Break-Before-Make Time Delay
(Note 7) tBBM VNO_, VNC_ = 1.5V;
RL = 300Ω, CL = 35pF, Figure 2 TMIN to
TMAX 1ns
Skew (Note 7) tSKEW RS = 39Ω, CL = 50pF, Figure 3 TMIN to
TMAX 0.15 2 ns
Charge Injection Q VGEN = 1.5V, RGEN = 0Ω,
CL = 1.0nF, Figure 4 +25°C 5 pC
f = 10MHz; VNO_, VNC_ = 1VP-P;
RL = 50Ω, CL = 5pF, Figure 5 -55
Off-Isolation VISO f = 1MHz; VNO_, VNC_ = 1VP-P;
RL = 50Ω, CL = 5pF, Figure 5
+25°C
-80
dB
f = 10MHz; VNO_, VNC_ = 1VP-P;
RL = 50Ω, CL = 5pF, Figure 5 -80
Crosstalk (Note 8) VCT f = 1MHz; VNO_, VNC_ = 1VP-P;
RL = 50Ω, CL = 5pF, Figure 5
+25°C
-110
dB
On-Channel -3dB Bandwidth BW Signal = 0dBm, RL = 50Ω,
CL = 5pF, Figure 5 +25°C >300 MHz
Total Harmonic Distortion THD VCOM_ = 2VP-P, RL = 600Ω+25°C 0.03 %
NO_, NC_ Off-Capacitance CNO_
(
OFF
),
CNC_
(
OFF
)
f = 1MHz, Figure 6 +25°C 9 pF
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS—Single +3V Supply (continued)
(V+ = +2.7V to +3.6V, VIH = +1.4V, VIL = +0.5V, TA= TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.0V,
TA= +25°C, unless otherwise noted.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS TAMIN TYP MAX UNITS
Switch On-Capacitance C(ON) f = 1MHz, Figure 6 +25°C 15 pF
DIGITAL I/O
Input Logic High Voltage VIH TMIN to
TMAX 1.4 V
Input Logic Low Voltage VIL TMIN to
TMAX 0.5 V
Input Leakage Current IIN V+ = +3.6V, VIN_ = 0 or 5.5V TMIN to
TMAX -100 +100 nA
POWER SUPPLY
Power-Supply Range V+ TMIN to
TMAX 1.8 5.5 V
Supply Current I+ V+ = +5.5V, VIN_ = 0V or V+ TMIN to
TMAX 1µA
ELECTRICAL CHARACTERISTICS—Single +5V Supply
(V+ = +4.2V to +5.5V, VIH = +2.0V, VIL = +0.8V, TA= TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +5.0V,
TA= +25°C, unless otherwise noted.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS TAMIN TYP MAX UNITS
Analog Signal Range VCOM_,
VNO_, VNC_
TMIN to
TMAX 0V+V
ANALOG SWITCH (Low RON—MAX4717/MAX4718 SPDT 1)
+25°C 1.7 3
On-Resistance (Note 4) RON V+ = 4.2V, ICOM_ = 10mA;
VNO_ or VNC_ = 3.5V TMIN to
TMAX 3.5 Ω
+25°C 0.1 0.3
On-Resistance Match Between
Channels (Notes 4, 5) ∆RON V+ = 4.2V, ICOM_ = 10mA;
VNO_ or VNC_ = 3.5V TMIN to
TMAX 0.4 Ω
+25°C 0.4 1.2
On-Resistance Flatness
(Note 6) RFLAT
(
ON
)
V+ = 4.2V, ICOM_ = 10mA;
VNO_ or VNC_ = 1.0V, 2.0V, 3.5V TMIN to
TMAX 1.5 Ω
+25°C -0.5 +0.01 +0.5
NO_, NC_ Off-Leakage Current
(Note 7)
INO_
(
OFF
),
INC_
(
OFF
)
V+ = 5.5V; VCOM_ = 1.0V, 4.5V;
VNO_ or VNC_ = 1.0V, 4.5V TMIN to
TMAX -1 +1 nA
+25°C -1 +0.01 +1
COM_ On-Leakage Current
(Note 7) ICOM_
(
ON
)
V+ = 5.5V; VCOM_ = 1.0V, 4.5V;
VNO_ or VNC_ = 1.0V, 4.5V, or
floating
TMIN to
TMAX -2 +2 nA
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
_______________________________________________________________________________________ 5
ELECTRICAL CHARACTERISTICS—Single +5V Supply (continued)
(V+ = +4.2V to +5.5V, VIH = +2.0V, VIL = +0.8V, TA= TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +5.0V,
TA= +25°C, unless otherwise noted.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS TAMIN TYP MAX UNITS
ANALOG SWITCH (High RON—MAX4718 SPDT 2)
+25°C 12 20
On-Resistance (Note 4) RON V+ = 4.2V, ICOM_ = 10mA;
VNO_ or VNC_ = 3.5V TMIN to
TMAX 25 Ω
+25°C 0.15 0.4
On-Resistance Match Between
Channels (Notes 4, 5) ∆RON V+ = 4.2V, ICOM_ = 10mA;
VNO_ or VNC_ = 3.5V TMIN to
TMAX 0.5 Ω
+25°C 0.4 1.2
On-Resistance Flatness
(Note 6) RFLAT
(
ON
)
V+ = 4.2V, ICOM_ = 10mA;
VNO_ or VNC_ = 1.0V, 2.0V, 4.5V TMIN to
TMAX 1.5 Ω
+25°C -0.5 +0.01 +0.5
NO_, NC_ Off-Leakage Current
(Note 7)
INO_
(
OFF
),
INC_
(
OFF
)
V+ = 5.5V; VCOM_ = 1.0V, 4.5V;
VNO_ or VNC_= 1.0V, 4.5V TMIN to
TMAX -1 +1 nA
+25°C -1 +0.01 +1
COM_ On-Leakage Current
(Note 7) ICOM_
(
ON
)
V+ = 5.5V, VCOM_ = 1.0V, 4.5V;
VNO_ or VNC_ = 1.0V, 4.5V, or
floating
TMIN to
TMAX -2 +2 nA
DYNAMIC CHARACTERISTICS
+25°C 30 80
Turn-On Time tON VNO_, VNC_ = 3.0V;
RL = 300Ω, CL = 35pF, Figure 1 TMIN to
TMAX 100 ns
+25°C 20 40
Turn-Off Time tOFF VNO_, VNC_ = 3.0V;
RL = 300Ω, CL = 35pF, Figure 1 TMIN to
TMAX 50 ns
+25°C 8
Break-Before-Make Time Delay
(Note 7) tBBM VNO_, VNC_ = 3.0V;
RL = 300Ω, CL = 35pF, Figure 2 TMIN to
TMAX 1ns
Skew (Note 7) tSKEW RS = 39Ω, CL = 50pF, Figure 3 TMIN to
TMAX 0.15 2 ns
DIGITAL I/O
Input Logic High Voltage VIH TMIN to
TMAX 2.0 V
Input Logic Low Voltage VIL TMIN to
TMAX 0.8 V
Input Leakage Current IIN V+ = 5.5V, VIN_ = 0V or V+ TMIN to
TMAX -100 +100 nA
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
6 _______________________________________________________________________________________
Note 2: UCSP and TDFN parts are 100% tested at +25°C only, and guaranteed by design over the specified temperature range.
µMAX parts are 100% tested at TMAX and guaranteed by design over the specified temperature range.
Note 3: The algebraic convention used in this data sheet is where the most negative value is a minimum and the most positive
value is a maximum.
Note 4: Guaranteed by design for UCSP and TDFN parts.
Note 5: ∆RON = RON(MAX) - RON(MIN).
Note 6: Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the
specified analog signal ranges.
Note 7: Guaranteed by design.
Note 8: Between any two switches.
ELECTRICAL CHARACTERISTICS—Single +5V Supply (continued)
(V+ = +4.2V to +5.5V, VIH = +2.0V, VIL = +0.8V, TA= TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +5.0V,
TA= +25°C, unless otherwise noted.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS TAMIN TYP MAX UNITS
POWER SUPPLY
Power-Supply Range V+ TMIN to
TMAX 1.8 5.5 V
Supply Current I+ V+ = 5.5V, VIN_ = 0V or V+ TMIN to
TMAX 1µA
ON-RESISTANCE vs. COM_ VOLTAGE
MAX4717/18 toc01
VCOM_ (V)
RON (Ω)
4321
2
4
6
8
10
0
05
V+ = 1.8V
V+ = 2.5V
V+ = 3V V+ = 4.2V
V+ = 5V
LOW RON SWITCH
ON-RESISTANCE vs. COM_ VOLTAGE
MAX4717/18 toc02
VCOM_ (V)
RON (Ω)
2.52.01.51.00.5
2
3
4
5
6
1
03.0
TA = +85°C
TA = +25°C
TA = -40°C
V+ = 3V
LOW RON SWITCH
ON-RESISTANCE vs. COM_ VOLTAGE
MAX4717/18 toc03
VCOM_ (V)
RON (Ω)
4321
1
2
3
4
5
0
05
V+ = 5V
TA = +85°C
TA = -40°C
TA = +25°C
LOW RON SWITCH
Typical Operating Characteristics
(TA = +25°C, unless otherwise noted.)
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
_______________________________________________________________________________________ 7
ON-RESISTANCE vs. COM_ VOLTAGE
MAX4717/18 toc04
VCOM_ (V)
RON (Ω)
4321
12
14
16
18
20
10
05
V+ = 1.8V
V+ = 2.5V
V+ = 4.2V
V+ = 5V
HIGH RON SWITCH
ON-RESISTANCE vs. COM_ VOLTAGE
MAX4717/18 toc05
VCOM_ (V)
RON (Ω)
2.52.01.51.00.5
11
12
13
14
15
10
0 3.0
TA = +85°C
TA = +25°C
TA = -40°C
V+ = 3V
HIGH RON SWITCH
ON-RESISTANCE vs. COM_ VOLTAGE
MAX4717/18 toc06
VCOM_ (V)
RON (Ω)
4321
11
12
13
14
15
10
05
V+ = 5V
TA = +85°C
TA = -40°CTA = +25°C
HIGH RON SWITCH
LEAKAGE CURRENT vs. TEMPERATURE
MAX4717/18 toc07
TEMPERATURE (°C)
LEAKAGE CURRENT (pA)
603510-15
100
200
300
400
500
0
-40 85
V+ = 3V
LOW RON SWITCH
COM_ ON-LEAKAGE
COM_ OFF-LEAKAGE
LEAKAGE CURRENT vs. TEMPERATURE
MAX4717/18 toc08
TEMPERATURE (°C)
LEAKAGE CURRENT (pA)
603510-15
200
400
600
800
1000
0
-40 85
V+ = 5V
LOW RON SWITCH
COM_ ON-LEAKAGE
COM_ OFF-LEAKAGE
LEAKAGE CURRENT vs. TEMPERATURE
MAX4717/18 toc09
TEMPERATURE (°C)
LEAKAGE CURRENT (pA)
603510-15
100
300
500
700
-100
-40 85
V+ = 3V
HIGH RON SWITCH
COM_ ON-LEAKAGE
COM_ OFF-LEAKAGE
LEAKAGE CURRENT vs. TEMPERATURE
MAX4717/18 toc10
TEMPERATURE (°C)
LEAKAGE CURRENT (pA)
603510-15
100
300
500
700
900
-100
-40 85
V+ = 5V
HIGH RON SWITCH
COM_ ON-LEAKAGE
COM_ OFF-LEAKAGE
CHARGE INJECTION vs. VCOM
MAX4717/18 toc11
VCOM_ (V)
CHARGE INJECTION (pC)
4321
10
20
30
40
50
0
05
CL = 1nF
V+ = 5V
CL = 1nF
V+ = 3V
SUPPLY CURRENT vs. TEMPERATURE
MAX4717/18 toc12
TEMPERATURE (°C)
SUPPLY CURRENT (nA)
603510-15
1
2
3
4
5
6
0
-40 85
V+ = 5V
V+ = 3V
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
8 _______________________________________________________________________________________
SUPPLY CURRENT vs. LOGIC LEVEL
MAX4717/18 toc13
LOGIC LEVEL (V)
SUPPLY CURRENT (µA)
4321
20
40
60
80
100
0
05
V+ = 5V
V+ = 3V
LOGIC THRESHOLD vs. SUPPLY VOLTAGE
MAX4717/18 toc14
SUPPLY VOLTAGE (V)
LOGIC THRESHOLD (V)
5.04.54.03.53.02.52.0
0.4
0.8
1.2
1.6
2.0
0
1.5 5.5
VTH+
VTH-
TURN-ON/OFF TIME
vs. SUPPLY VOLTAGE
MAX4717/18 toc15
SUPPLY VOLTAGE (V)
tON/tOFF (ns)
4.53.52.5
20
40
60
80
100
0
1.5 5.5
LOW RON SWITCH
tON
tOFF
TURN-ON/OFF TIME
vs. SUPPLY VOLTAGE
MAX4717/18 toc16
SUPPLY VOLTAGE (V)
tON/tOFF (ns)
4.53.52.5
20
40
60
80
100
0
1.5 5.5
HIGH RON SWITCH
tON
tOFF
TURN-ON/OFF TIME
vs. TEMPERATURE
MAX4717/18 toc17
TEMPERATURE (°C)
tON/tOFF (ns)
603510-15
10
20
40
30
50
60
0
-40 85
LOW RON SWITCH
tON, V+ = 3.0V
tON, V+ = 5.0V
tOFF, V+ = 3.0V
tOFF, V+ = 5.0V
TURN-ON/OFF TIME
vs. TEMPERATURE
MAX4717/18 toc18
TEMPERATURE (°C)
tON/tOFF (ns)
603510-15
10
20
30
40
50
60
0
-40 85
HIGH RON SWITCH
tON, V+ = 3.0V
tON, V+ = 5.0V
tOFF, V+ = 3.0V tOFF, V+ = 5.0V
RISE/FALL-TIME DELAY
vs. SUPPLY VOLTAGE
MAX4717/18 toc19
SUPPLY VOLTAGE (V)
OUTPUT RISE/FALL-TIME DELAY (ps)
4.53.52.5
0.5
1.0
1.5
2.0
2.5
3.0
0
1.5 5.5
INPUT RISE/FALL TIME = 15ns
FIGURE 4, CL = 50pF
LOW RON SWITCH
RISE DELAY
FALL DELAY
RISE/FALL-TIME DELAY
vs. TEMPERATURE
MAX4717/18 toc20
TEMPERATURE (°C)
OUTPUT RISE/FALL-TIME DELAY (ns)
603510-15
0.5
1.0
1.5
2.0
0
-40 85
INPUT RISE/FALL TIME = 15ns
FIGURE 4, CL = 50pF
V+ = 4.2V
LOW RON SWITCH
RISE DELAY FALL DELAY
RISE TIME TO FALL TIME MISMATCH
vs. SUPPLY VOLTAGE
MAX4717/18 toc21
SUPPLY VOLTAGE (V)
MISMATCH (ps)
4.53.52.5
100
200
300
400
0
1.5 5.5
INPUT RISE/FALL TIME = 15ns
FIGURE 4, CL = 50pF
LOW RON SWITCH
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
_______________________________________________________________________________________ 9
RISE TIME TO FALL TIME MISMATCH
vs. TEMPERATURE
MAX4717/18 toc22
TEMPERATURE (°C)
MISMATCH (ps)
603510-15
50
100
150
200
0
-40 85
INPUT RISE/FALL TIME = 15ns
FIGURE 4, CL = 50pF
V+ = 4.2V
LOW RON SWITCH
SKEW vs. SUPPLY VOLTAGE
MAX4717/18 toc23
SUPPLY VOLTAGE (V)
SKEW (ps)
4.53.52.5
100
200
300
400
0
1.5 5.5
INPUT RISE/FALL TIME = 15ns
FIGURE 4, CL = 50pF
MAX4717 ONLY
SKEW vs. TEMPERATURE
MAX4717/18 toc24
TEMPERATURE (°C)
SKEW (ps)
603510-15
50
100
150
200
0
-40 85
INPUT RISE/FALL TIME = 15ns
FIGURE 4, CL = 50pF
V+ = 4.2V
MAX4717 ONLY
FREQUENCY RESPONSE
MAX4717/18 toc25
FREQUENCY (MHz)
ON-LOSS (dB)
10.01
-120
-100
-80
-60
-40
-20
0
20
-140
0.0001 100
V+ = 3V/5V LOW RON SWITCH
ON-LOSS
OFF-ISOLATION
CROSSTALK
FREQUENCY RESPONSE
MAX4717/18 toc26
FREQUENCY (MHz)
ON-LOSS (dB)
10.01
-120
-100
-80
-60
-40
-20
0
20
-140
0.0001 100
V+ = 3V/5V HIGH RON SWITCH
ON-LOSS
OFF-ISOLATION
CROSSTALK
TOTAL HARMONIC DISTORTION
vs. FREQUENCY
MAX4717/18 toc27
FREQUENCY (Hz)
THD (%)
10k1k100
0.1
10 100k
1
0.01
V+ = 3V
LOW RON SWITCH
RL = 600Ω
TOTAL HARMONIC DISTORTION
vs. FREQUENCY
MAX4717/18 toc28
FREQUENCY (Hz)
THD (%)
10k1k100
0.1
10 100k
1
0.01
V+ = 3V
HIGH RON SWITCH
RL = 600Ω
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
MAX4717/MAX4718
Detailed Description
The MAX4717/MAX4718 high-speed, low-voltage, low on-
resistance (RON), dual SPDT analog switches operate
from a single +1.8V to +5.5V supply. The switches feature
break-before-make switching operation and fast switch-
ing speeds (tON = 80ns (max), tOFF = 40ns (max)).
These switches have low 15pF on-channel capaci-
tance, which allows for 12Mbps switching of the data
signals for USB 1.0/1.1 applications. The MAX4717 is
designed to switch D+ and D- USB signals with a guar-
anteed skew of less than 2ns (see Figure 4) as mea-
sured from 50% of the input signal to 50% of the output
signal.
Applications Information
Digital Control Inputs
The MAX4717/MAX4718 logic inputs accept up to
+5.5V regardless of supply voltage. For example, with
a +3.3V supply, IN_ can be driven low to GND and high
to +5.5V allowing for mixing of logic levels in a system.
Driving the control logic inputs rail-to-rail minimizes
power consumption. For a +3V supply voltage, the
logic thresholds are 0.5V (low) and 1.4V (high); for a
+5V supply voltage, the logic thresholds are 0.8V (low)
and 2.0V (high).
Analog Signal Levels
The on-resistance of the MAX4717/MAX4718 changes
very little for analog input signals across the entire supply
voltage range (see the Typical Operating Characteristics).
The switches are bidirectional, so the NO_, NC_, and
COM_ pins can be either inputs or outputs.
Power-Supply Sequencing and
Overvoltage Protection
Caution: Do not exceed the absolute maximum rat-
ings because stresses beyond the listed ratings
may cause permanent damage to the device.
Proper power-supply sequencing is recommended for
all CMOS devices. Always apply V+ before applying
analog signals, especially if the analog signal is not
current-limited.
UCSP Application Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit
board techniques, bump-pad layout, and recommend-
ed reflow temperature profile as well as the latest infor-
mation on reliability testing results, go to the Maxim
web site at www.maxim-ic.com/ucsp to find the
Application Note: USCP—A Wafer-Level Chip-Scale
Package.
Chip Information
TRANSISTOR COUNT: 235
PROCESS: BiCMOS
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
10 ______________________________________________________________________________________
PIN
UCSP µMAX/
TDFN
NAME FUNCTION
A1 7 NC2 Analog Switch 2—Normally Closed
Terminal
A2 8 IN2 Analog Switch 2—Digital Control
Input
A3 9 COM2 Analog Switch 2—Common
Terminal
A4 10 NO2 Analog Switch 2—Normally Open
Terminal
B1 6 GND Ground. Connection.
B4 1 V+ Positive-Supply Voltage
C1 5 NC1 Analog Switch 1—Normally Closed
Terminal
C2 4 IN1 Analog Switch 1—Digital Control
Input
C3 3 COM1 Analog Switch 1—Common
Terminal
C4 2 NO1 Analog Switch 1—Normally Open
Terminal
——EP
Exposed Pad (for TDFN package
only). Connect to ground.
Pin Description
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
______________________________________________________________________________________ 11
Test Circuits/Timing Diagrams
tr < 5ns
tf < 5ns
50%
VIL
LOGIC
INPUT
RL
COM_
GND
IN_
CL INCLUDES FIXTURE AND STRAY CAPACITANCE.
VOUT = VN_ ( RL )
RL + RON
VN_
VIH
tOFF
0V
NO_
OR NC_
0.9 x V0UT 0.9 x VOUT
tON
VOUT
SWITCH
OUTPUT
LOGIC
INPUT
IN DEPENDS ON SWITCH CONFIGURATION;
INPUT POLARITY DETERMINED BY SENSE OF SWITCH.
V+
CL
V+
VOUT
MAX4717/
MAX4718
Figure 1. Switching Time
50%
VIH
VIL
LOGIC
INPUT
VOUT 0.9 x VOUT
tBBM
LOGIC
INPUT
RL
300Ω
GND
CL INCLUDES FIXTURE AND STRAY CAPACITANCE.
NO_
IN_
NC_ VOUT
V+
V+
CL
35pF
VN_ COM_
MAX4717/
MAX4718
Figure 2. Break-Before-Make Interval
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
12 ______________________________________________________________________________________
IN+
IN-
IN1 IN2
CL
CL
OUT+
OUT-
VIN+
VIN-
VOUT+
VOUT-
NC1 OR
NO1
NC2 OR
NO2
COM1
COM2
0V
V+
0V
V+
0V
V+
0V
V+
tSKEW
tINFALL tINRISE
tOUTFALL tOUTRISE
RISE TIME DELAY = |tINRISE - tOUTRISE|
FALL TIME DELAY = |tINFALL - tOUTFALL|
RISE TIME TO FALL TIME MISMATCH = |tOUTFALL - tOUTRISE|
50%
50%
50%
50%
90%
10%
90%
10%
90%
10%
90%
10%
MAX4717
RS
RS
VIL TO VIH
Figure 3. Output Signal Skew
Test Circuits/Timing Diagrams (continued)
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
______________________________________________________________________________________ 13
VGEN GND
COM_
CL
VOUT
V+ VOUT
IN
OFF ON OFF
∆VOUT
Q = (∆VOUT)(CL)
NC_
LOGIC INPUT WAVEFORMS INVERTED FOR SWITCHES
THAT HAVE THE OPPOSITE LOGIC SENSE.
OFF ON OFF
IN
VIL TO VIH
V+
RGEN
IN_
MAX4717/
MAX4718
OR NO_
Figure 4. Charge Injection
MEASUREMENTS ARE STANDARDIZED AGAINST SHORTS AT IC TERMINALS.
OFF-ISOLATION IS MEASURED BETWEEN COM_ AND "OFF" NO_ OR NC_ TERMINAL ON EACH SWITCH.
ON-LOSS IS MEASURED BETWEEN COM_ AND "ON" NO_ OR NC_ TERMINAL ON EACH SWITCH.
CROSSTALK IS MEASURED FROM ONE CHANNEL TO THE OTHER CHANNEL.
SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED.
+5V
VOUT
V+
IN_
NC1
COM1
NO1*
VIN
MAX4717/
MAX4718
OFF-ISOLATION = 20log VOUT
VIN
ON-LOSS = 20log VOUT
VIN
CROSSTALK = 20log VOUT
VIN
NETWORK
ANALYZER
50Ω
50Ω50Ω
50Ω
MEAS REF
10nF
0V OR V+
50Ω
GND
*FOR CROSSTALK THIS PIN IS NO2.
NC2 AND COM2 ARE OPEN.
Figure 5. On-Loss, Off-Isolation, and Crosstalk
CAPACITANCE
METER NC_ or
NO_
COM_
GND
IN VIL OR VIH
10nF V+
f = 1MHz
V+
MAX4717/
MAX4718
Figure 6. Channel Off/On-Capacitance
Test Circuits/Timing Diagrams (continued)
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
14 ______________________________________________________________________________________
12L, UCSP 4x3.EPS
F11
21-0104
PACKAGE OUTLINE, 4x3 UCSP
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
______________________________________________________________________________________ 15
10LUMAX.EPS
PACKAGE OUTLINE, 10L uMAX/uSOP
1
1
21-0061 I
REV.DOCUMENT CONTROL NO.APPROVAL
PROPRIETARY INFORMATION
TITLE:
TOP VIEW
FRONT VIEW
1
0.498 REF
0.0196 REF
S6°
SIDE VIEW
α
BOTTOM VIEW
0° 0° 6°
0.037 REF
0.0078
MAX
0.006
0.043
0.118
0.120
0.199
0.0275
0.118
0.0106
0.120
0.0197 BSC
INCHES
1
10
L1
0.0035
0.007
e
c
b
0.187
0.0157
0.114
H
L
E2
DIM
0.116
0.114
0.116
0.002
D2
E1
A1
D1
MIN
-A
0.940 REF
0.500 BSC
0.090
0.177
4.75
2.89
0.40
0.200
0.270
5.05
0.70
3.00
MILLIMETERS
0.05
2.89
2.95
2.95
-
MIN
3.00
3.05
0.15
3.05
MAX
1.10
10
0.6±0.1
0.6±0.1
Ø0.50±0.1
H
4X S
e
D2
D1
b
A2 A
E2
E1 L
L1
c
α
GAGE PLANE
A2 0.030 0.037 0.75 0.95
A1
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
MAX4717/MAX4718
4.5
Ω
/20
Ω
, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
16 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
6, 8, &10L, DFN THIN.EPS
L
CL
C
PIN 1
INDEX
AREA
D
E
L
e
L
A
e
E2
N
G
12
21-0137
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
-DRAWING NOT TO SCALE-
k
e
[(N/2)-1] x e
REF.
PIN 1 ID
0.35x0.35
DETAIL A
b
D2
A2
A1
COMMON DIMENSIONS
SYMBOL MIN. MAX.
A0.70 0.80
D2.90 3.10
E2.90 3.10
A1 0.00 0.05
L0.20 0.40
PKG. CODE ND2 E2 eJEDEC SPEC b[(N/2)-1] x e
PACKAGE VARIATIONS
0.25 MIN.k
A2 0.20 REF.
2.30±0.101.50±0.106T633-1 0.95 BSC MO229 / WEEA 1.90 REF0.40±0.05
1.95 REF0.30±0.05
0.65 BSC
2.30±0.108T833-1
2.00 REF0.25±0.05
0.50 BSC
2.30±0.1010T1033-1
2.40 REF0.20±0.05- - - -
0.40 BSC
1.70±0.10 2.30±0.1014T1433-1
1.50±0.10
1.50±0.10
MO229 / WEEC
MO229 / WEED-3
0.40 BSC - - - - 0.20±0.05 2.40 REFT1433-2 14 2.30±0.101.70±0.10
T633-2 6 1.50±0.10 2.30±0.10 0.95 BSC MO229 / WEEA 0.40±0.05 1.90 REF
T833-2 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF
T833-3 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF
-DRAWING NOT TO SCALE-
G22
21-0137
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
DOWNBONDS
ALLOWED
NO
NO
NO
NO
YES
NO
YES
NO
