
Multilayer Ceramic Capacitors Approval Sheet
Page 9 of 13 ASC_Middle & High Voltage_003AE Aug. 2018
Unit: pieces
10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item Test Condition Requirements
1.
Visual and
Mechanical
--- * No remarkable defect.
* Dimensions to conform to individual specification sheet.
2.
Capacitance Class I: (NP0)
Cap≤1000pF, 1.0±0.2Vrms, 1MHz±10%
Cap>1000pF, 1.0±0.2Vrms, 1KHz±10%
Class II: (X7R, Y5V)
1.0±0.2Vrms, 1kHz±10%
*Before initial measurement (Class II only): To apply de-aging
at 150°C for 1hr then set for 24±2 hrs at room temp .
* Shall not exceed the limits given in the detailed spec.
3.
Q/ D.F.
(Dissipation
Factor)
NP0: Cap≥30pF, Q≥1000; Cap<30pF, Q≥400+20C
X7R: ≤2.5%
Y5V: ≤5.0%
4.
Dielectric
Strength
* To apply voltage:
200V~300V ≥2 times VDC
400V~450V ≥1.2 times VDC
500V~999V ≥1.5 times VDC
1000V~3000V ≥1.2 times VDC
4000V ≥1.1 times VDC
* Duration: 1 to 5 sec.
* Charge & discharge current less than 50mA.
* No evidence of damage or flash over during test.
5.
Insulation
Resistance
Rated voltage:
200~630V To apply rated voltage (500V max.)
for 60 sec.
≥10GΩ or RxC≥100Ω-F whichever is smaller
Rated voltage: ≥630V To apply 500V for 60 sec.
6.
Temperature
Coefficient
With no electrical load.
T.C. Operating Temp
NP0 -55~125°C at 25°C
X7R -55~125°C at 25°C
Y5V -25~85°C at 20°C
*Before initial measurement (Class II only): To apply de-aging
at 150°C for 1hr then set for 24±2 hrs at room temp .
T.C. Capacitance Change
NP0 Within ±30ppm/°C
X7R Within ±15%
Y5V Within +30%/-80%
7.
Adhesive
Strength of
Termination
* Pressurizing force:
5N (≤0603) and 10N (>0603)
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
Vibration
Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
*Before initial measurement (Class II only): To apply de-aging
at 150°C for 1hr then set for 24±2 hrs at room temp .
*Cap./DF(Q) Measurement to be made after de-
for 1hr then set for 24±2 hrs at room temp.
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
Solderability * Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec. 95% min. coverage of all metalized area.
10.
Bending Test
* The middle part of substrate shall be pressurized by means
of the p
ressurizing rod at a rate of about 1 mm per second until
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
*Before initial measurement (Class II only): To apply de-aging
at 150°C for 1hr then set for 24±2 hrs at room temp .
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change:
NP0: within ±5.0% or ±0.5pF whichever is larger.
X7R: within ±12.5%
Y5V: within ±30%
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured before
the test.)
11.
Resistance to
Soldering Heat
* Solder temperature: 260±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before imme rse the
capacitor in a eutectic solder.
*Before initial measurement (Class II only): To apply de-aging
at 150°C for 1hr then set for 24±2 hrs at room temp .
*Cap. / DF(Q) / I.R. Measurement to be made after de-
150°C for 1hr then set for 24±2 hrs at room temp.
* No remarkable damage.
* Cap change:
NP0: within ±2.5% or ±0.25pF whichever is larger.
X7R: within ±7.5%
Y5V: within ±20%
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.