Semiconductor Components Industries, LLC, 2012
January, 2012 Rev. 10
1Publication Order Number:
MBRD835L/D
MBRD835LG,
SBR835LT4G,
SBRD8835LG
Preferred Device
SWITCHMODE
Power Rectifier
DPAK Surface Mount Package
This SWITCHMODE power rectifier which uses the Schottky
Barrier principle with a proprietary barrier metal, is designed for use
as output rectifiers, free wheeling, protection and steering diodes in
switching power supplies, inverters and other inductive switching
circuits.
Features
Low Forward Voltage
150C Operating Junction Temperature
Epoxy Meets UL 94 V0 @ 0.125 in
Compact Size
Lead Formed for Surface Mount
AECQ101 Qualified and PPAP Capable
SBR and SBRD8 Prefixes for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements
All Packages are PbFree*
Mechanical Characteristics
Case: Epoxy, Molded
Weight: 0.4 Gram (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
Shipped 75 Units Per Plastic Tube
ESD Rating:
Machine Model = C (> 400 V)
Human Body Model = 3B (> 8000 V)
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping
ORDERING INFORMATION
SCHOTTKY BARRIER
RECTIFIER
8.0 AMPERES, 35 VOLTS
Preferred devices are recommended choices for future use
and best overall value.
4
1
3
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MBRD835LT4G DPAK
(PbFree)
2,500 /
Tape & Reel **
DPAK
CASE 369C
MARKING DIAGRAM
B835LG = Specific Device Number
Y = Year
WW = Work Week
G = PbFree Device
YWW
B
835LG
MBRD835LG DPAK
(PbFree)
75 Units/Rail
http://onsemi.com
SBRD8835LG DPAK
(PbFree)
75 Units/Rail
SBR835LT4G DPAK
(PbFree)
2,500 /
Tape & Reel **
SBRD8835LT4G DPAK
(PbFree)
2,500 /
Tape & Reel **
** 16 mm Tape, 13” Reel
MBRD835LG, SBR835LT4G, SBRD8835LG
http://onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
35 V
Average Rectified Forward Current
(At Rated VR, TC = 88C)
IF(AV) 8.0
A
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 kHz, TC = 80C)
IFRM 16
A
NonRepetitive Peak Surge Current
(Surge applied at rated load conditions, halfwave, single phase, 60 Hz)
IFSM 75
A
Repetitive Avalanche Current
(Current Decaying Linearly to Zero in 1 s, Frequency Limited by TJmax)
IAR 2.0
A
Storage / Operating Case Temperature Tstg 65 to +150 C
Operating Junction Temperature (Note 1) TJ65 to +150 C
Voltage Rate of Change (Rated VR) dv/dt 10,000 V/s
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The heat generated must be less than the thermal conductivity from JunctiontoAmbient: dPD/dTJ < 1/RJA.
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance JunctiontoCase RJC 2.8 C/W
Thermal Resistance JunctiontoAmbient (Note 2) RJA 80 C/W
2. Rating applies when surface mounted on the minimum pad size recommended.
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage (Note 3)
(iF = 8 Amps, TC = + 25C)
(iF = 8 Amps, TC = +125C)
VF0.51
0.41
V
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TC = + 25C)
(Rated dc Voltage, TC = +100C)
IR1.4
35
mA
3. Pulse Test: Pulse Width = 300 s, Duty Cycle 2%.
MBRD835LG, SBR835LT4G, SBRD8835LG
http://onsemi.com
3
TYPICAL CHARACTERISTICS
10
1
0.1
0 0.6
vF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1. Maximum Forward Voltage Figure 2. Typical Forward Voltage
iF, INSTANTANEOUS FORWARD CURRENT (mA)
0.01 0.1 0.2 0.3 0.4 0.5
TJ = 125C25C
10
1
0.1
0 0.6
VF, INSTANTANEOUS VOLTAGE (VOLTS)
0.01 0.1 0.2 0.3 0.4 0.5
75C
IF, INSTANTANEOUS FORWARD CURRENT (AMPS
)
25C
TJ = 125C
10
1
0.1
035
VF, REVERSE VOLTAGE (VOLTS)
Figure 3. Maximum Reverse Current Figure 4. Typical Reverse Current
0.001 5101520
TJ = 125C
25C
10
1
0.1
0
VR, REVERSE VOLTAGE (VOLTS)
0.01 5101520
TJ = 125C
75C
25C
IR, REVERSE CURRENT (mA)
IR, REVERSE CURRENT (mA)
0.01
100
1000
100
100C
100C
25 30 25 30 35
MBRD835LG, SBR835LT4G, SBRD8835LG
http://onsemi.com
4
TYPICAL CHARACTERISTICS
16
80 130
TC, CASE TEMPERATURE (C)
0
8
7
6
0 130
TA, AMBIENT TEMPERATURE (C)
0
TJ = 125C
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
14.4
12.8
11.2
9.6
8
6.4
4.8
3.2
1.6
85 90 95 100 105 110 115 120 125
dc
SQUARE WAVE IPK
IAV +5(CAPACITIVE
LOAD)
10
20
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
5
4
3
2
1
5010 20 30 40 8060 70 10090 110 120
dc
(RESISTIVE LOAD)
SQUARE WAVE
10
20
(RESISTIVE LOAD)
TJ = 125C
IPK
IAV +5(CAPACITIVE
LOAD)
RJA = 40C/W
SURFACE MOUNTED ON
MINIMUM RECOMMENDED
PAD SIZE
RJA = 6C/W
Figure 5. Maximum and Typical Capacitance
1
VR, REVERSE VOLTAGE (VOLTS)
100 10
1000
C, CAPACITANCE (pF)
TYPICAL
MAXIMUM
TJ = 25C
Figure 6. Current Derating, Infinite Heatsink Figure 7. Current Derating
4
3.5
0
TA, AMBIENT TEMPERATURE (C)
00
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
1.5 3 4.5 6
4.5
5
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
3
2.5
2
1.5
1
0.5
1305020 30 40 8060 70 10090 110 120
TJ = 125C
dc
(RESISTIVE LOAD)
SQUARE WAVE
10
20
PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATT
S
8
7
6
0
5
4
3
2
1
7.5 9 10.5 12 13.5 15
TJ = 125C
dc
(RESISTIVE LOAD)
SQUARE WAVE
10
20
IPK
IAV +5(CAPACITIVE
LOAD)
RJA = 80C/W
SURFACE MOUNTED ON
MINIMUM RECOMMENDED
PAD SIZE
IPK
IAV +5(CAPACITIVE
LOAD)
10
Figure 8. Current Derating, Free Air Figure 9. Forward Power Dissipation
MBRD835LG, SBR835LT4G, SBRD8835LG
http://onsemi.com
5
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C01
ISSUE D
b
D
E
b3
L3
L4
b2
eM
0.005 (0.13) C
c2
A
c
C
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D0.235 0.245 5.97 6.22
E0.250 0.265 6.35 6.73
A0.086 0.094 2.18 2.38
b0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61
b2 0.030 0.045 0.76 1.14
c0.018 0.024 0.46 0.61
e0.090 BSC 2.29 BSC
b3 0.180 0.215 4.57 5.46
L4 −−− 0.040 −−− 1.01
L0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
12 3
4
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
ǒmm
inchesǓ
SCALE 3:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.108 REF 2.74 REF
L2 0.020 BSC 0.51 BSC
A1
H
DETAIL A
SEATING
PLANE
A
B
C
L1
L
H
L2 GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81358171050
MBRD835L/D
LITERATURE FULFILLMENT:
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Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
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