2SA2060
2009-12-21
1
TOSHIBA Transistor Silicon PNP Epitaxial Type
2SA2060
High-Speed Switching Applications
DC-DC Converter Applications
Strobe Applications
High DC current gain: hFE = 200 to 500 (IC = 0.3 A)
Low collector-emitter saturation voltage: VCE (sat) = 0.2 V (max)
High-speed switching: tf = 90 ns (typ.)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Collector-base voltage VCBO 50 V
Collector-emitter voltage VCEO 50 V
Emitter-base voltage VEBO 7 V
DC IC 2.0
Collector current
Pulse ICP 3.5
A
Base current IB 200 mA
t = 10 s 2.5
Collector power
dissipation DC
PC
(Note 1) 1.0
W
Junction temperature Tj 150 °C
Storage temperature range Tstg 55 to 150 °C
Note 1: Mounted on an FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm2)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Unit: mm
JEDEC
JEITA SC-62
TOSHIBA 2-5K1A
Weight: 0.05 g (typ.)
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2SA2060
2009-12-21
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Electrical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Collector cut-off current ICBO V
CB = 50 V, IE = 0 100 nA
Emitter cut-off current IEBO V
EB = 7 V, IC = 0 100 nA
Collector-emitter breakdown voltage V (BR) CEO IC = 10 mA, IB = 0 50 V
hFE (1) VCE = 2 V, IC = 0.3 A 200 500
DC current gain
hFE (2) VCE = 2 V, IC = 1.0 A 100
Collector-emitter saturation voltage VCE (sat) I
C = 1.0 A, IB = 0.033 A 0.2 V
Base-emitter saturation voltage VBE (sat) I
C = 1.0 A, IB = 0.033 A 1.1 V
Collector output capacitance Cob V
CB = 10 V, IE = 0, f = 1 MHz 20 pF
Rise time tr 60
Storage time tstg 250
Switching time
Fall time tf
See Figure 1 circuit diagram.
VCC ≈ −30 V, RL = 30 Ω
IB1 = 33 mA,IB2 = 33 mA 90
ns
Marking
Note 3: A line to the right of a Lot No. identifies the indication of product Labels.
Without a line: [[Pb]]/INCLUDES > MCV
With a line: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27
January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment.
4 G
Part No. (or abbreviation code)
Lot No.
Note 3
Figure 1 Switching Time Test Circuit &
Timin
g
Chart
IB2
IB1
20 μs
Output
Input
IB2
IB1
RL
VCC
Duty cycle < 1%
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2SA2060
2009-12-21
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Collector current IC (A)
Base-emitter saturation voltage
VBE (sat) (V)
Collector-emitter voltage VCE (V)
IC – VCE
Collector current IC (A)
Collector current IC (A)
hFE – IC
DC current gain hFE
Collector current IC (A)
VCE (sat) – IC
Collector-emitter saturation voltage
VCE (sat) (V)
Collector current IC (A)
VBE (sat) – IC
Base-emitter voltage VBE (V)
IC – VBE
Common emitter
VCE = 2 V
Single nonrepetitive pulse
Ta = 100°C 55
25
1.8
0
0 0.2 0.4 0.6 1 1.20.8
0.6
1.2
2.4
3
0
0
Common emitte
r
Ta = 25°C
Single nonrepetitive
pulse
0.8 2.41.6
60 40
30
20
10
6
IB = 2 mA
3
2.4
1.8
1.2
0.6
4
80
100
0.4 2 1.2
0.001 0.01 0.1 1 10
10
0.1
1
25
Common emitter
IC/IB = 30
Single nonrepetitive pulse
55
Ta = 100°C
1
0.001 0.01 0.1 1 10
10
100
1000
10000
Common emitter
VCE = 2 V
Single
nonrepetitive
pulse
55
Ta = 100°C
25
0.001
1
0.1
0.01
0.001 0.01 0.1 1 10
Common emitter
IC/IB = 30
Single nonrepetitive
pulse
25
55
Ta = 100°C
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2SA2060
2009-12-21
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Pulse width tw (s)
rth – tw
Transient thermal resistance
rth (°C/W)
Collector-emitter voltage VCE (V)
Safe Operating Area
Collector current IC (A)
Curves should be applied in thermal limited area.
Single nonrepetitive pulse Ta = 25°C
Mounted on an FR4 board (glass epoxy, 1.6 mm thick, Cu
area: 645 mm2)
1000
1
0.001
100
10
0.01 0.1 1 10 100 1000
10
0.01
0.1 1 10 100
0.1
1
IC max (pulsed)
DC operation *
(Ta = 25°C)
VCEO max
10 μs
100 μs 1 ms
100 ms*
10 ms
10 s*
: Single nonrepetitive pulse
Ta = 25°C
Note that the curves for 100 ms*,
10 s* and DC operation* will be
different when the devices aren’t
mounted on an FR4 board (glass
epoxy, 1.6 mm thick, Cu area:
645 mm2). These characteristic
curves must be derated linearly
with increase in temperature.
IC max (continuous)
0.5 5 50
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2SA2060
2009-12-21
5
RESTRICTIONS ON PRODUCT USE
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in this document, and related hardware, software and systems (collectively “Product”) without notice.
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all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
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Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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