THIN FILM MULTI-TAP RESISTORS MSMT 117 SERIES MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.030" 0.030" x 0.030" x 0.010" (0.003") SILICON TANT ALUM NITRIDE ANTALUM 25,000 A MINIMUM GOLD; ALUMINUM OPTIONAL BARE SUBSTRA TE ST ANDARD SUBSTRATE STANDARD GOLD BACK OPTIONAL. SUIT ABLE FOR EUTECTIC DIE A TT ACH SUITABLE ATT TTACH ELECTRICAL DA TA DAT RESIST ANCE RANGE RESISTANCE TOT AL RESIST ANCE V ALUES: TOTAL RESISTANCE VALUES: 80 , 150 , 800 , 2,400 , 8,000 , 12,000 , 24,000 , 80,000 , 160,000 80, 150, 800, 2,400, 8,000, 12,000, 24,000, 80,000, 160,000 OTHER VALUES AVAILABLE, PLEASE CONSULT SALES (THE SEVEN RESISTORS BETWEEN PADS 1 AND 8 ARE EACH 12.5% OF THE TOT AL RESIST ANCE V ALUE; THE FIVE RESISTORS BETWEEN P ADS TOTAL RESISTANCE VALUE; PADS 8 AND 13 ARE EACH 2.5% OF THE TOT AL RESIST ANCE V ALUE.) TOTAL RESISTANCE VALUE.) 0.030" Rmax. MSMT 125 SERIES MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.034" x 0.034" x 0.010" (0.003") SILICON TANT ALUM NITRIDE ANTALUM 25,000 A MINIMUM GOLD; ALUMINUM OPTIONAL TE BARE SUBSTRA SUBSTRATE ACH GOLD BACK OPTIONAL. SUIT ABLE FOR EUTECTIC DIE A TT TTACH SUITABLE ATT ELECTRICAL DA DAT TA RESIST ANCE RANGE RESISTANCE THERE ARE 20 RESISTORS, WITH THE FIRST 10 RESISTORS EQUAL TO THE NOMINAL VALUE SHOWN IN THE CHART AND THE SECOND 10 RESISTORS EQUAL TO 10X THE NOMINAL VALUE. 0.034" TOT AL RESIST ANCE TOTAL RESISTANCE 1.1K 1.1K 5.5K 5.5K 27.5K 27.5K 110K 110K NOMINAL RESIST ANCE RESISTANCE 10 10 50 50 250 250 1000 1000 TOT AL RESIST ANCE TOTAL RESISTANCE 2.75K 2.75K 11K 11K 55K 55K 275K 275K NOMINAL RESIST ANCE RESISTANCE 25 25 100 100 500 500 2500 2500 OTHER VALUES AVAILABLE, PLEASE CONSULT SALES 0.034" 117 / 125 COMMON SERIES DA TA DAT Rmax. TOLERANCES T.C.R. CURRENT NOISE POWER RA TING RATING OPERA TING VOL TAGE OPERATING VOLT SHORT TERM OVERLOAD HIGH TEMP EXPOSURE THERMAL SHOCK MOISTURE RESIST ANCE RESISTANCE ST ABILITY STABILITY OPERA TING TEMP RANGE OPERATING 5%, 10% (APPLIES TO INDIVIDUAL RESISTIVE ELEMENTS) 150ppm/C ST ANDARD STANDARD -30dB MAX 250 mW MAX. (70C DERA TED LINEARL Y TO 150C) P = E 2/R DERATED LINEARLY 100V MAX 5X RA TED POWER, 25 0. RATED 25 C, 5 SEC., 0. 0.225% MAX. R/R: 0.1% MSI TYPICAL 150C, 100 HRS., 0.25% 0.25% MAX. R/R: 0. 03 % MSI TYPICAL 0.03 03% MIL-STD 202, METHOD 107F 0.25% MAX. R/R: 0.1% MSI TYPICAL 107F,, 0.25% MIL-STD 202, METHOD 106, 0. 0. 0.55% MAX. R/R: 0. 0.11% MSI TYPICAL 0.5% MAX. R/R: 0.1% MSI TYPICAL 1000 HRS., 70 C, 100% POWER 70C, POWER,, 0.5% -5 -555C TO +125C PART NUMBER DESIGNA TION DESIGNATION MINI-SYSTEMS, INC. THIN FILM DIVISION 45 FRANK MOSSBERG DRIVE, ATTLEBORO, MA 02703 508-226-2111 FAX: 508-226-2211 32 DCN TF 113-D-1198 MSMT XXX X X XXXXX X X SERIES SUBSTRA TE SUBSTRATE RESISTIVE FILM OHMIC VALUE TOLERANCE OPTION 117 125 S = Silicon T = Tantalum Nitride 5-Digit Number: 1st 4 Digits Are Significant With "R" As Decimal Point When Required. 5th Digit Represents Number of Zeros. J = 5% K = 10% E = Aluminum Bond Pads GB = Gold Backside G = Gold Bond Pads EXAMPLE: MSMT 125-11000K-G = 125 Series, 1.1K Total Res. V alue, 1.1K Value, 10% TTol., ol., Gold Bond Pads Bare Backside