INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-IAA110P-R05 1
IAA110P
Integrated Telecom Circuits
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Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
The IAA110P Multifunction Telecom switch combines
two 350V normally open (1-Form-A) relays and one
optocoupler in a single package. The relays use
optically coupled MOSFET technology to provide
3750Vrms of input to output isolation. The efficient
MOSFET switches and photovoltaic die use IXYS
Integrated Circuits Division’s patented OptoMOS
architecture while the inputs' highly efficient GaAIAs
infrared LEDs control the outputs. The IAA110P
allows telecom circuit designers to combine
three discrete functions in a single component
that occupies less space than traditional discrete
component solutions.
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1305490
• EN/IEC 60950-1 Certified Component:
TUV Certificate: B 09 07 49410 006
• 3750Vrms Input/Output Isolation
• Three Functions in One Package
• Bidirectional Current Sensing
• Bidirectional Current Switching
• FCC Compatible
• No EMI/RFI Generation
• Small 16-Pin SOIC Package (PCMCIA Compatible)
• Machine Insertable, Wave Solderable
• Tape & Reel Version Available
Form-A
IF
ILOAD
10%
90%
ton toff
Switching Characteristics
of Normally Open Devices
Parameter Rating Units
Blocking Voltage 350 VP
Load Current 100 mArms / mADC
On-Resistance (max) 35
1. (N/C)
2. + LED - Form A Relay #1
3. – LED - Form A Relay #1
4. + LED - Form A Relay #2
5. – LED - Form A Relay #2
6. Emitter - Phototransistor
7. Collector - Phototransistor
8. (N/C)
9. LED - Phototransistor +/–
10. LED - Phototransistor –/+
11. Output - Form A Relay #2
12. Common Source Relay #2
13. Output - Form A Relay #2
14. Output - Form A Relay #1
15. Common Source Relay #1
16. Output - Form A Relay #1
(N/C)
(N/C)
(Form A)
(Form A)
1
2
3
4
16
15
14
13
5
6
7
8
12
11
10
9
Part # Description
IAA110P 16-Pin SOIC (50/Tube)
IAA110PTR 16-Pin SOIC (1000/Reel)
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R05
IAA110P
Absolute Maximum Ratings @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Ratings Units
Input Control Current, Relay 50 mA
Total Package Dissipation 11W
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.67 mW / ºC
Electrical Characteristics @25ºC: Relay Section
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Blocking Voltage (Peak) IL=1AV
L- - 350 VP
Load Current
Continuous - IL- - 100 mArms / mADC
Peak t=10ms ILPK - - 350 mAP
On-Resistance IL=100mA RON --35
Off-State Leakage Current VL=350V, TJ=25ºC ILEAK --1A
Switching Speeds
Turn-On IF=5mA, VL=10V ton --3ms
Turn-Off toff --3ms
Output Capacitance VL=50V, f=1MHz COUT -25 - pF
Input Characteristics
Input Control Current to Activate IL=100mA IF--5mA
Input Control Current to Deactivate IL=1mA IF0.4 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Voltage - VR--5 V
Reverse Input Current VR=5V IR--10A
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Phototransistor Blocking Voltage IC=10ABV
CEO 20 50 - V
Phototransistor Dark Current VCE=5V, IF=0mA ICEO - 50 500 nA
Saturation Voltage IC=2mA, IF=16mA VSAT - 0.3 0.5 V
Current Transfer Ratio IF=6mA, VCE=0.5V CTR 33 - - %
Input Characteristics
Input Control Current IC=2mA, VCE=0.5V IF-26mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Input Current (Detector Must be Off) IC=1A, VCE=5V - 5 25 - A
Capacitance, Input to Output VL=50V, f=1MHz CI/O -3 -pF
Isolation, Input to Output - VI/O 3750 - - Vrms
Electrical Characteristics @25ºC: Detector Section
INTEGRATED CIRCUITS DIVISION
IAA110P
www.ixysic.com 3
R05
COMMON PERFORMANCE DATA*
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
0.9 2.1 3.3 3.90.3 1.5 2.7
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC, TA=25ºC)
0.550.350.15 0.45 0.650.250.05
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC, TA=25ºC)
35
30
25
20
15
10
5
0
19.85 22.05 24.2518.75 20.95 23.15 25.35
Device Count (N)
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=100mADC, TA=25ºC)
On-Resistance (:)
0.65 1.17 1.690.39 0.91 1.43 1.95
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=100mADC, TA=25ºC)
25
20
15
10
5
0
0.65 1.17 1.690.39 0.91 1.43 1.95
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=100mADC, TA=25ºC)
35
30
25
20
15
10
5
0
377.5 399.5 421.5 443.5388.5 410.5 432.5
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Typical Turn-On Time
vs. LED Forward Current
(IL=100mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mADC)
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
Temperature (ºC)
On-Resistance (:)
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=100mADC)
RELAY PERFORMANCE DATA*
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R05
IAA110P
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Forward Current (mA)
Normalized CTR (%)
02 4 6 8 10 12 14 16 18
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
020
Typical Normalized CTR
vs. Forward Current
(VCE=0.5V)
Normalized CTR (%)
8
7
6
5
4
3
2
1
0
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
I
F
=1mA
I
F
=2mA
I
F
=5mA
I
F
=10mA
I
F
=15mA
I
F
=20mA
Typical Normalized CTR
vs. Temperature
(VCE=0.5V)
Forward Current (mA)
Collector Current (mA)
02468 1210 14 16 18 20
12
10
8
6
4
2
0
Typical Collector Current
vs. Forward Current
(VCE=0.5V)
Turn-Off Time (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=100mADC)
Temperature (ºC)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
I
F
=20mA
I
F
=10mA
I
F
=5mA
Maximum Load Current
vs. Temperature
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
Load Voltage (V)
Load Current (mA)
100
80
60
40
20
0
-20
-40
-60
-80
-100
-2.5 -2 -1 -0.5-1.5 0 1 1.50.5 2 2.5
Typical Load Current
vs. Load Voltage
(IF=5mA, TA=25ºC)
Blocking Voltage (VP)
-40
430
425
420
415
410
405
400
395
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Temperature (ºC)
Leakage (PA)
Typical Leakage vs. Temperature
Measured Across Pins 14&16 or 11&13
Time
Load Current (A)
10Ps
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100Ps 100ms 1s
10ms 10s 100s
Energy Rating Curve
Turn-On Time (ms)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
IF=5mA
IF=10mA
IF=20mA
Temperature (ºC)
Typical Turn-On Time
vs. Temperature
(IL=100mADC)
DETECTOR PERFORMANCE DATA*
RELAY PERFORMANCE DATA (cont.)*
INTEGRATED CIRCUITS DIVISION
IAA110P
www.ixysic.com 5
R05
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
IAA110P MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
IAA110P 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
Specification: DS-IAA110P-R05
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/19/2012
For additional information please visit our website at: www.ixysic.com
6
IAA110P
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
MECHANICAL DIMENSIONS
(inches)
mm
DIMENSIONS
NOTES:
1. Coplanarity = 0.1016 (0.004) max.
2. Leadframe thickness does not include solder plating
(1000 microinch maximum).
3. Sum of package height, standoff, and coplanarity
does not exceed 2.108 (0.083).
8.890 TYP
(0.350 TYP)
0.406 TYP
(0.016 TYP)
10.160±0.381
(0.400±0.015)
7.493±0.127
(0.295±0.005)
10.363±0.127
(0.408±0.005)
1.270 TYP
(0.050 TYP)
0.635 X 45°
(0.025 X 45°)
0.254 ±0.0127
(0.010±0.0005)
1.016 TYP
(0.040 TYP)
0.508±0.1016
(0.020±0.004)
PIN 1
PIN 16
2.108 MAX
(0.083 MAX)
See Note 3
MIN: 0.0254 (0.001)
MAX: 0.102 (0.004)
Lead to Package Standoff:
1.90
(0.075)
1.27
(0.050)
9.30
(0.366)
0.60
(0.024)
PCB Land Pattern
Dimensions
mm
(inches)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K0=3.20
(0.126)
K1=2.70
(0.106)
A0=10.90
(0.429)
W=16
(0.630)
B0=10.70
(0.421)
P=12.00
(0.472)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions
listed on page 5 of EIA-481-2
IAA110P
IAA110PTR Tape & Reel
