2010 Microchip Technology Inc. DS41284E-page 1
PIC12F609/12F615/12F617/16F610/16F616 AND
PIC12HV609/12HV615/16HV610/16HV616
1.0 DEVICE OVERVIEW
This document includes the programming
specifications for the following devices:
2.0 PROGRAMMING THE
PIC12F609/12F615/12F617/
16F610/16F616 AND
PIC12HV609/12HV615/16HV610/
16HV616 DEVICES
The PIC12F609/12F615/12F617/16F610/16F616 and
PIC12HV609/12HV615/16HV610/16HV616 devices are
programmed using a serial method. The Serial mode will
allow these devices to be programmed while in the user’s
system. These programming specifications apply to all of
the above devices in all packages.
2.1 Hardware Requirements
These devices require one power supply for VDD, see
Table 7-1 VDD, and one for VPP, see Table 7-1 VIHH.
2.2 Program/Verify Mode
The Program/Verify mode for these devices allows pro-
gramming of user program memory, user ID locations,
Calibration Word and the Configuration Word.
•PIC12F615 •PIC12HV615
•PIC12F609 •PIC12HV609
•PIC12F617 •PIC16HV616
•PIC16F616 •PIC16HV610
•PIC16F610
Note 1: All references to the PIC12F615 parts
refer to the PIC12HV615 parts as well
(unless otherwise specified).
2: All references to the PIC16F616 parts
refer to the PIC16HV616 as well (unless
otherwise specified).
3: All references to the PIC12F609 parts
refer to the PIC12HV609 as well (unless
otherwise specified).
4: All references to the PIC16F610 parts
refer to the PIC16HV610 as well (unless
otherwise specified).
5: Any references in this programming
specification to PORTA and RAn refer to
GPIO and GPn, respectively.
Flash Memory Programming Specification
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 2 2010 Microchip Technology Inc.
FIGURE 2-1: 8-PIN, 14-PIN, AND 16-PIN PROGRAMMING PINS DIAGRAM FOR PIC12F609/
12F615/12F617/16F610/16F616(1)
TABLE 2-1: PIN DESCRIPTIONS IN PROGRAM/VERIFY MODE: PIC12F609/12F615/12F617/
16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
Pin Name
During Programming
Function Pin Type Pin Description
GP1/RA1 ICSPCLK I Clock input – Schmitt Trigger input
GP0/RA0 ICSPDAT I/O Data input/output – Schmitt Trigger input
MCLR Program/Verify mode P(1) Program Mode Select
VDD VDD P Power Supply
VSS VSS PGround
Legend: I = Input, O = Output, P = Power
Note 1: In the PIC12F609/12F615/12F617/16F610/16F616 and PIC12HV609/12HV615/16HV610/16HV616, the
programming high voltage is internally generated. To activate the Program/Verify mode, voltage of VIHH
and a current of IIHH (see Table 7-1) needs to be applied to MCLR input.
8-Pin PDIP, SOIC, MSOP, DFN
PIC12F615/609
PIC12F617
VSS
VDD
GP5
GP4
GP3/MCLR/VPP
GP0/ICSPDAT
GP1/ICSPCLK
GP2
1
2
3
45
6
7
8
14-Pin PDIP, SOIC, TSSOP
PIC16F616/610
VSS
VDD
RA5
RA4
RA3/MCLR/VPP
RA0/ICSPDAT
RA1/ICSPCLK
RA2
1
2
3
411
12
13
14
5
6
7
RC5
RC4
RC3
RC0
RC1
RC2
10
9
8
1
2
3
49
10
11
12
5
6
7
8
16
15
14
13
PIC16F616/HV616
RA5
RA4
RA3/MCLR/VPP
RC5
VDD
NC
NC
VSS
RA0/ICSPDAT
RA1/ICSPCLK
RA2
RC0
RC4
RC3
RC2
RC1
16-Pin QFN
PIC16F610/HV610
Note 1: Please see specific data sheets for alternate pin functionality.
2010 Microchip Technology Inc. DS41284E-page 3
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
3.0 MEMORY DESCRIPTION
3.1 Program Memory Map
The user memory space extends from 0x0000 to
0x1FFF. In Program/Verify mode, the program memory
space extends from 0x0000 to 0x3FFF, with the first
half (0x0000-0x1FFF) being user program memory and
the second half (0x2000-0x3FFF) being configuration
memory. The Program Counter (PC) will increment
from 0x0000 to 0x1FFF and wrap to 0x0000. If the PC
is between 0x2000 to 0x3FFF it will wrap around to
0x2000 (not to 0x0000). Once in configuration memory,
the highest bit of the PC stays a ‘1’, thus always point-
ing to the configuration memory. The only way to point
to user program memory is to reset the part and re-
enter Program/Verify mode as described in
Section 4.0 “Program/Verify Mode”.
For all of the devices covered in this document, the
configuration memory space, 0x2000 to 0x2008, is
physically implemented. However, only locations
0x2000 to 0x2003, 0x2007 and 0x2008 are available.
Other locations are reserved.
3.2 User ID Locations
A user may store identification information (user ID) in
four designated locations. The user ID locations are
mapped in 0x2000 to 0x2003. It is recommended that
the user use only the seven Least Significant bits
(LSbs) of each user ID location. The user ID locations
read out normally, even after code protection is
enabled. It is recommended that ID locations are writ-
ten as ‘xx xxxx xbbb bbbb’ where ‘bbb bbbb’ is the
user ID information.
The 14 bits may be programmed, but only the 7 LSbs
are read and displayed by MPLAB® IDE.
3.3 Calibration Word
For all of the devices covered in this document, the
4/8 MHz Internal Oscillator (INTOSC) module is fac-
tory calibrated. This value is stored in the Calibration
Word (0x2008). See the applicable device data sheet
for more information.
The Calibration Word does not necessarily participate
in the erase operation unless a specific procedure is
executed. Therefore, the device can be erased without
affecting the Calibration Word. This simplifies the erase
procedure since these values do not need to be read
and restored after the device is erased.
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 4 2010 Microchip Technology Inc.
FIGURE 3-1: PIC12F615/HV615, PIC12F609/HV609, PIC16F610/HV610 PROGRAM MEMORY
MAPPING
1FFF
2000
2040
3FFF
Implemented
1 KW
Implemented
03FF
Maps to
0-3FF
Maps to
Program Memory
Configuration Memory
2000-203F
User ID Location
User ID Location
User ID Location
User ID Location
Reserved
Reserved
Device ID
Configuration Word
Calibration Word
Reserved
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009-203F
2010 Microchip Technology Inc. DS41284E-page 5
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
FIGURE 3-2: PIC12F617/PIC16F616/HV616 PROGRAM MEMORY MAPPING
1FFF
2000
2040
3FFF
Implemented
2 KW
Implemented
07FF
Maps to
0-7FF
Maps to
Program Memory
Configuration Memory
2000-203F
User ID Location
User ID Location
User ID Location
User ID Location
Reserved
Reserved
Device ID
Configuration Word
Calibration Word
Reserved
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009-203F
2070
(1)
2000-206F(1)
2009-206F(1)
Note 1: Applies to the PIC12F617 only.
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 6 2010 Microchip Technology Inc.
4.0 PROGRAM/VERIFY MODE
Two methods are available to enter Program/Verify
mode. “VPP-first” is entered by holding ICSPDAT and
ICSPCLK low while raising the MCLR pin from VIL to
VIHH (high voltage), then applying VDD and data. This
method can be used for any Configuration Word selec-
tion and must be used if the INTOSC and internal
MCLR options are selected (FOSC<2:0> = 100 or 101
and MCLRE = 0). The VPP-first entry prevents the
device from executing code prior to entering Program/
Verify mode. See the timing diagram in Figure 4-1.
The second entry method, “VDD-first”, is entered by
applying VDD, holding ICSPDAT and ICSPCLK low,
then raising MCLR pin from VIL to VIHH (high voltage),
followed by data. This method can be used for any
Configuration Word selection except when INTOSC
and internal MCLR options are selected (FOSC<2:0> =
100 or 101 and MCLRE = 0). This technique is useful
when programming the device when VDD is already
applied, for it is not necessary to disconnect VDD to
enter Program/Verify mode. See the timing diagram in
Figure 4-2.
Once in Program/Verify mode, the program memory
and configuration memory can be accessed and
programmed in serial fashion. ICSPDAT and ICSPCLK
are Schmitt Trigger inputs in this mode. RA4 is tri-state
regardless of fuse setting.
The sequence that enters the device into the Program/
Verify mode places all other logic into the Reset state
(the MCLR pin was initially at VIL). Therefore, all I/Os
are in the Reset state (high-impedance inputs) and the
PC is cleared.
To prevent a device configured with INTOSC and
internal MCLR from executing after exiting Program/
Verify mode, VDD needs to power down before VPP.
See Figure 4-3 for the timing.
FIGURE 4-1: VPP-FIRST PROGRAM/
VERIFY MODE ENTRY
FIGURE 4-2: VDD-FIRST PROGRAM/
VERIFY MODE ENTRY
FIGURE 4-3: PROGRAM/VERIFY MODE
EXIT
4.1 Program/Erase Algorithms
The PIC16F616/PIC12F617 program memory may be
written in two ways. The fastest method writes four
words at a time. However, one-word writes are also
supported for backward compatibility with previous 8-
pin and 14-pin Flash devices. The four-word algorithm
is used to program the program memory only. The one-
word algorithm can write any available memory
location (i.e., program memory, configuration memory
and calibration memory).
After writing the array, the PC may be reset and read
back to verify the write. It is not possible to verify
immediately following the write because the PC can
only increment, not decrement.
A device Reset will clear the PC and set the address to
‘0’. The Increment Address command will increment
the PC. The Load Configuration command will set the
PC to 0x2000. The available commands are shown in
Table 4-1.
VPP
THLD0
ICSPDAT
ICSPCLK
VDD
TPPDP
Note: This method of entry is valid, regardless
of Configuration Word selected.
Note: The PIC12F615, PIC12F609, PIC16F610
program memories must be written in
one-word writes only.
VPP
TPPDP
ICSPDAT
ICSPCLK
VDD
THLD0
Note: This method of entry is valid if INTOSC
and internal MCLR are not selected.
VPP
ICSPDAT
ICSPCLK
VDD
THLD0
2010 Microchip Technology Inc. DS41284E-page 7
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
4.1.1 ONE-WORD PROGRAMMING
The PIC12F615, PIC12F609, PIC16F616 and
PIC16F610 program memories can be written one
word at a time to allow compatibility with other 8-pin
and 14-pin Flash PIC® devices. Configuration memory
(>0x2000) must be written one word (or byte) at a time.
The sequences for programming one word of program
memory at a time is:
1. Load a word at the current program memory
address using the Load Data For Program
Memory command.
2. Issue a Begin Programming (externally timed)
command.
3. Wait TPROG1.
4. Issue End Programming command.
5. Issue an Increment Address command.
6. Repeat this sequence as required to write
program, calibration or configuration memory.
See Figure 4-12 for more information.
4.1.2 FOUR-WORD PROGRAMMING
The PIC16F616/PIC12F617 program memory can be
written four words at a time using the four-word algo-
rithm. Configuration memory (addresses >0x2000) and
non-aligned (addresses modulo 4 not equal to zero)
starting addresses must use the one-word
programming algorithm.
This algorithm writes four sequential addresses in
program memory. The four addresses must point to a
four-word block which address modulo 4 of 0, 1, 2 and
3. For example, programming address 4 through 7 can
be programmed together. Programming addresses 2
through 5 will create an unexpected result.
The sequence for programming four words of program
memory at a time is:
1. Load a word at the current program memory
address using the Load Data For Program Mem-
ory command. This location must be address
modulo 4 equal to 0.
2. Issue an Increment Address command to point
to the next address in the block.
3. Load a word at the current program memory
address using the Load Data For Program
Memory command.
4. Issue an Increment Address command to point
to the next address in the block.
5. Load a word at the current program memory
address using the Load Data For Programming
Memory command.
6. Issue and Increment Address command to point
to the next address in the book.
7. Load a word at the current program memory
address using the Load Data For Programming
Memory command.
8. Issue a Begin Programming command
externally timed.
9. Wait TPROG1.
10. Issue End Programming.
11. Wait TDIS.
12. Issue an Increment Address command to point
to the start of the next block of addresses.
13. Repeat steps 1 through 12 as required to write
the desired range of program memory.
See Figure 4-12 for more information.
Note: Only the PIC16F616 and PIC12F617 pro-
gram memory can be written to using the
four-word programming algorithm.
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 8 2010 Microchip Technology Inc.
4.1.3 ERASE ALGORITHMS
The PIC12F609/12F615/12F617/16F610/16F616 and
PIC12HV609/12HV615/16HV610/16HV616 devices will
erase different memory locations depending on the PC
and CP
. The following sequences can be used to erase
noted memory locations. To erase the program memory
and Configuration Word (0x2007), the following sequence
must be performed. Note the Calibration Word (0x2008)
and User ID (0x2000-0x2003) will not be erased.
1. Do a Bulk Erase Program Memory command.
2. Wait TERA to complete erase.
To erase the User ID (0x2000-0x2003), Configuration
Word (0x2007) and program memory, use the following
sequence. Note that the Calibration Word (0x2008) will
not be erased.
1. Perform Load Configuration with dummy data to
point the PC to 0x2000.
2. Perform a Bulk Erase Program Memory
command.
3. Wait TERA to complete erase.
4.1.4 SERIAL PROGRAM/VERIFY
OPERATION
The ICSPCLK pin is used as a clock input and the
ICSPDAT pin is used for entering command bits and
data input/output during serial operation. To input a
command, ICSPCLK is cycled six times. Each
command bit is latched on the falling edge of the clock
with the LSb of the command being input first. The data
input onto the ICSPDAT pin is required to have a mini-
mum setup and hold time (see Table 7-1), with respect
to the falling edge of the clock. Commands that have
data associated with them (Read and Load) are
specified to have a minimum delay of 1 s between the
command and the data. After this delay, the clock pin is
cycled 16 times with the first cycle being a Start bit and
the last cycle being a Stop bit.
During a read operation, the LSb will be transmitted
onto the ICSPDAT pin on the rising edge of the second
cycle. For a load operation, the LSb will be latched on
the falling edge of the second cycle. A minimum 1 s
delay is also specified between consecutive
commands, except for the End Programming
command, which requires a 100 s (TDIS).
All commands and data words are transmitted LSb first.
Data is transmitted on the rising edge and latched on
the falling edge of the ICSPCLK. To allow for decoding
of commands and reversal of data pin configuration, a
time separation of at least 1 s (TDLY1) is required
between a command and a data word.
The commands that are available are described in
Table 4-1.
2010 Microchip Technology Inc. DS41284E-page 9
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
TABLE 4-1: COMMAND MAPPING FOR PIC12F609/12F615/12F617/16F610/16F616 AND
PIC12HV609/12HV615/16HV610/16HV616
4.1.4.1 Load Configuration
The Load Configuration command is used to access
the Configuration Word (0x2007), User ID (0x2000-
0x2003) and Calibration Word (0x2008). This
command sets the PC to address 0x2000 and loads the
data latches with one word of data.
To access the configuration memory, send the Load
Configuration command. Individual words within the
configuration memory can be accessed by sending
Increment Address commands and using load or read
data for program memory.
After the 6-bit command is input, the ICSPCLK pin is
cycled an additional 16 times for the Start bit, 14 bits of
data and the Stop bit (see Figure 4-4).
After the configuration memory is entered, the only way
to get back to the program memory is to exit the
Program/Verify mode by taking MCLR low (VIL).
FIGURE 4-4: LOAD CONFIGURATION COMMAND
Command Mapping (MSb … LSb) Data
Load Configuration xx00000, data (14), 0
Load Data for Program Memory xx00100, data (14), 0
Read Data from Program Memory xx01000, data (14), 0
Increment Address xx0110
Begin Programming x11000Externally Timed
End Programming x01010
Bulk Erase Program Memory xx1001Internally Timed
Row Erase Program Memory x10001Internally Timed
TSET1
THLD1
TDLY1
TDLY2
12 3 4 56
0000XX
12 3 4 5 15
16
strt_bit stp_bit
LSb MSb
0
ICSPCLK
ICSPDAT
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 10 2010 Microchip Technology Inc.
4.1.4.2 Load Data For Program Memory
After receiving this command, the chip will load in a
14-bit “data word” when 16 cycles are applied, as
described in Section 4.1.4.1 “Load Configuration”.
A timing diagram of this command is shown in
Figure 4-5.
FIGURE 4-5: LOAD DATA FOR PROGRAM MEMORY COMMAND
4.1.4.3 Read Data From Program Memory
After receiving this command, the chip will transmit
data bits out of the program memory (user or configu-
ration) currently accessed, starting with the second
rising edge of the clock input. The data pin will go into
Output mode on the second rising clock edge, and it
will revert to Input mode (high-impedance) after the
16th rising edge.
If the program memory is code-protected (CP = 0), the
data is read as zeros.
A timing diagram of this command is shown in Figure 4-6.
FIGURE 4-6: READ DATA FROM PROGRAM MEMORY COMMAND
TSET1
THLD1
TDLY1
TSET1
THLD1
TDLY2
12 3 4 56
0100XX
12 3 4 5 1516
strt_bit stp_bit
LSb MSb
ICSPCLK
ICSPDAT
TDLY1
TSET1
THLD1
TDLY2
12 3 4 56
1010XX
12 3 4 5 15
16
TDLY3
input output input
strt_bit stp_bit
LSb
MSb
0
ICSPCLK
ICSPDAT
2010 Microchip Technology Inc. DS41284E-page 11
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
4.1.4.4 Increment Address
The PC is incremented when this command is
received. A timing diagram of this command is shown
in Figure 4-7.
It is not possible to decrement the address counter. To
reset this counter, the user should exit and re-enter
Program/Verify mode.
FIGURE 4-7: INCREMENT ADDRESS COMMAND (PROGRAM/VERIFY)
4.1.4.5 Begin Programming (Externally
Timed)
A Load command must be given before every Begin
Programming command. Programming of the
appropriate memory (program memory, configuration or
calibration memory) will begin after this command is
received and decoded. Programming requires (TPROG)
time and is terminated using an End Programming
command. A timing diagram for this command is shown
in Figure 4-8.
The addressed locations are not erased before
programming.
FIGURE 4-8: BEGIN PROGRAMMING (EXTERNALLY TIMED)
TDLY1
TSET1
THLD1
TDLY2
12 3 4 56
011 XX
12
X0
0
Next Command
ICSPCLK
ICSPDAT
MCLR
VIHH
ICSPCLK
ICSPDAT
TSET1
THLD1
TPROG
1234 56
000 1
12
X01
End Programming Command
X
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 12 2010 Microchip Technology Inc.
4.1.4.6 End Programming
After this command is performed, the write procedure
will stop. A timing diagram of this command is shown in
Figure 4-9.
FIGURE 4-9: END PROGRAMMING (SERIAL PROGRAM/VERIFY)
4.1.4.7 Bulk Erase Program Memory
After this command is performed, the entire program
memory and Configuration Word (0x2007) is erased.
The user ID and calibration memory may also be
erased, depending on the value of the PC. See
Section 4.1.3 “Erase Algorithms” for erase
sequences. A timing diagram for this command is
shown in Figure 4-10.
FIGURE 4-10: BULK ERASE PROGRAM MEMORY COMMAND
MCLR
VIHH
ICSPCLK
ICSPDAT
TSET1
THLD1
1234 56
010 0
12
X0
1
Next Command
TDIS
X
TSET1
THLD1
TERA
12 3 4 56 12
X0
Next Command
11X
00 X
ICSPCLK
ICSPDAT
TSET1
THLD1
2010 Microchip Technology Inc. DS41284E-page 13
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
4.1.4.8 Row Erase Program Memory
This command erases the 16-word row of program
memory pointed to by PC<11:4>. If the program mem-
ory array is protected (CP = 0) or the PC points to the
configuration memory (>0x2000), the command is
ignored.
To perform a Row Erase Program Memory, the
following sequence must be performed.
1. Execute a Row Erase Program Memory
command.
2. Wait TERA to complete a row erase.
FIGURE 4-11: ROW ERASE PROGRAM MEMORY COMMAND
TERA
12 34 56 12
x0
Next Command
11
00
ICSPCLK
ICSPDAT
x
0
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 14 2010 Microchip Technology Inc.
FIGURE 4-12: ONE-WORD PROGRAMMING FLOWCHART (PIC12F61X/16F61X AND
PIC12F609)
Start
Program Cycle
Read Data
Program Memory
Data Correct?
Report
Programming
Failure
All Locations
Done?
Wait TDIS
Program Cycle
No
No
Increment
Address
Command
from
Bulk Erase
Program
Load Data
for
Program Memory
Yes
Begin
Programming
Wait TPROG
Command
(Externally timed)
End
Programming
One-word
Memory(1,2)
Done
Yes
Program
User ID/Config. bits
Note 1: This step is optional if the device has already been erased or has not been previously programmed.
2: If the device is code-protected or must be completely erased, then Bulk Erase the device per Figure 4-15.
Read and Store
Calibration Memory
Values
(Figure 4-16)
Read and Verify
Calibration Memory
Values
(Figure 4-16)
2010 Microchip Technology Inc. DS41284E-page 15
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
FIGURE 4-13: FOUR-WORD PROGRAMMING FLOWCHART (PIC12F617/PIC16F616)
Start
All Locations
Done?
Program Cycle
No
Increment
Address
Command
Load Data
for
Program Memory
Wait TPROG
End
Programming
Wait TDIS
Load Data
for
Program Memory
Increment
Address
Command
Load Data
for
Program Memory
Increment
Address
Command
Load Data
for
Program Memory
Increment
Address
Command
Four-word
Program Cycle
Bulk Erase
Program
Memory(1), (2)
Done
Program
User ID/Config. bits
Yes
Note 1: This step is optional if the device is erased or not previously programmed.
2: If the device is code-protected or must be completely erased, then Bulk Erase the device per Figure 4-15.
Begin
Programming
Command
(Externally timed)
Read and Store
Calibration Memory
Values
(Figure 4-16)
Read and Verify
Calibration Memory
Values
(Figure 4-16)
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 16 2010 Microchip Technology Inc.
FIGURE 4-14: PROGRAM FLOWCHART – CONFIGURATION MEMORY
Start
Load
Configuration
Program Cycle
Read Data
Memory Command
Data Correct?
Report
Programming
Failure
Address =
0x2004?
Data Correct?
Report
Programming
Failure
Yes
No
Yes
Yes
No
Increment
Address
Command
No Increment
Address
Command
Done
One-word
One-word
Program Cycle
(Config. bits)
Wait TDIS
PROGRAM CYCLE
Load Data
for
Program Memory
Wait TPROG
End
Programming
Increment
Address
Command
Increment
Address
Command
(User ID)
From Program
Read Data
Memory Command
From Program
Begin
Programming
Command
(Externally timed)
2010 Microchip Technology Inc. DS41284E-page 17
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
FIGURE 4-15: PROGRAM FLOWCHART – ERASE FLASH DEVICE
Note 1: See Section 4.1.4.7 “Bulk Erase Program Memory” for more information on the Bulk Erase procedure.
Start
Load Configuration
Done
Bulk Erase(1)
Program Memory
Read and Store
Calibration Memory
Values
(Figure 4-16)
Read and Verify
Calibration Memory
Values
(Figure 4-16)
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 18 2010 Microchip Technology Inc.
FIGURE 4-16: CALIBRATION WORD VERIFICATION FLOWCHART
Start
Increment Address
Read and Store
Calibration
No
No
Yes
Yes
Done
Command
Address =
0x2008?
Calibration Word
Word
is Valid?(1,2)
Fail
Load Configuration
Note 1: This step is not required for the Read and Store Calibration Memory Values procedure.
2: The device should not be used if verification of the Calibration Word locations fails. This information
should be reported to the user through the user interface of the device programmer.
2010 Microchip Technology Inc. DS41284E-page 19
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
5.0 CONFIGURATION WORD
The PIC12F609/12F615/12F617/16F610/16F616 and
PIC12HV609/12HV615/16HV610/16HV616 devices
have several Configuration bits. These bits can be
programmed (reads ‘0’) or left unchanged (reads ‘1’), to
select various device configurations.
REGISTER 5-1: CONFIG: CONFIGURATION WORD (ADDRESS: 2007h)
U-1 U-1 U-1 U-1 R/P-1 R/P-1 R/P-1
———— BOREN1 BOREN0 IOSCFS
bit 13
R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0
bit 6
Legend: x = Bit is unknown P = Programmable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 13-10 Unimplemented: Read as ‘1’
bit 9-8 BOREN<1:0>: Brown-out Reset Enable bits
11 = BOR enabled
10 = BOR enabled while running and disabled in Sleep
0x = BOR disabled
bit 7 IOSCFS: Internal Oscillator Frequency Select bit
1 = 8 MHz
0 = 4 MHz
bit 6 CP: Code Protection bit
1 = Program memory is not code-protected
0 = Program memory is external read and write-protected
bit 5 MCLRE: MCLR Pin Function Select bit
1 = MCLR pin is MCLR function and weak internal pull-up is enabled
0 = MCLR pin is alternate function, MCLR function is internally disabled
bit 4 PWRTE: Power-up Timer Enable bit(1)
1 = PWRT disabled
0 = PWRT enabled
bit 3 WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 2-0 FOSC<2:0>: Oscillator Selection bits
000 = LP oscillator: Low-power crystal on RA5/GP5 and RA4/GP4
001 = XT oscillator: Crystal/resonator on RA5/GP5 and RA4/GP4
010 = HS oscillator: High-speed crystal/resonator on RA5/GP5 and RA4/GP4
011 = EC: I/O function on RA4/GP4, CLKIN on RA5/GP5
100 = INTOSCIO oscillator: I/O function on RA4/GP4, I/O function on RA5/GP5
101 = INTOSC oscillator: CLKOUT function on RA4/GP4, I/O function on RA5/GP5
110 = EXTRCIO oscillator: I/O function on RA4/GP4, RC on RA5/GP5
111 = EXTRC oscillator: CLKOUT function on RA4/GP4, RC on RA5/GP5
Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 20 2010 Microchip Technology Inc.
REGISTER 5-2: CONFIG: CONFIGURATION WORD (ADDRESS: 2007h) FOR PIC12F617 ONLY
U-1 U-1 U-1 U-1 R/P-1 R/P-1 R/P-1
—— WRT1 WRT0 BOREN1 BOREN0 IOSCFS
bit 13
R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0
bit 6
Legend: x = Bit is unknown P = Programmable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 13-12 Unimplemented: Read as ‘1’
bit 11-10 WRT<1:0>: Flash Program Memory Self Write Enable bit
11 =Write protection off
10 =000h to 1FFh write-protected, 200h to 7FFh may be modified by PMCON1 control
01 =000h to 3FFh write-protected, 400h to 7FFh may be modified by PMCON1 control
00 =000h to 7FFh write-protected, entire program memory is write-protected
bit 9-8 BOREN<1:0>: Brown-out Reset Enable bit
11 =BOR enabled
10 =BOR disabled during Sleep and enabled during operation
0X =BOR disabled
bit 7 IOSCFS: Internal Oscillator Frequency Select
1 =8 MHz
0 =4 MHz
bit 6 CP: Code Protection
1 = Program memory is not code-protected
0 = Program memory is external read and write-protected
bit 5 MCLRE: MCLR Pin Function Select
1 =MCLR
pin is MCLR function and weak internal pull-up is enabled
0 =MCLR
pin is alternate function, MCLR function is internally disabled
bit 4 PWRTE: Power-up Timer Enable bit(1)
1 = PWRT disabled
0 = PWRT enabled
bit 3 WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer (PWRT).
2010 Microchip Technology Inc. DS41284E-page 21
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
5.1 Device ID Word
The device ID word for the PIC12F609/12F615/
12F617/16F610/16F616 and PIC12HV609/12HV615/
16HV610/16HV616 is loaded at 2006h. This location
can not be erased.
TABLE 5-1: DEVICE ID VALUES
bit 2-0 FOSC<2:0>: Oscillator Selection bits
000 = LP oscillator: Low-power crystal on RA5/T1CKI/OSC1/CLKIN and
RA4/AN3/T1G/OSC2/CLKOUT
001 = XT oscillator: Crystal/resonator on RA5/T1CKI/OSC1/CLKIN and
RA4/AN3/T1G/OSC2/CLKOUT
010 = HS oscillator: High-speed crystal/resonator on RA5/T1CKI/OSC1/CLKIN and
RA4/AN3/T1G/OSC2/CLKOUT
011 = EC: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, CLKIN on RA5/T1CKI/OSC1/CLKIN
100 = INTOSCIO oscillator: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, I/O function on
RA5/T1CKI/OSC1/CLKIN
101 = INTOSC oscillator: CLKOUT function on RA4/AN3/T1G/OSC2/CLKOUT, I/O function on
RA5/T1CKI/OSC1/CLKIN
110 = EXTRCIO oscillator: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, RC on
RA5/T1CKI/OSC1/CLKIN
111 = EXTRC oscillator: CLKOUT function on RA4/AN3/T1G/OSC2/CLKOUT, RC on
RA5/T1CKI/OSC1/CLKIN
REGISTER 5-2: CONFIG: CONFIGURATION WORD (ADDRESS: 2007h) (CONTINUED)FOR
Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer (PWRT).
Device
Device ID Values
Dev Rev
PIC12F615 10 0001 100 x xxxx
PIC12HV615 10 0001 101 x xxxx
PIC12F617 01 0011 011 x xxxx
PIC16F616 01 0010 010 x xxxx
PIC16HV616 01 0010 011 x xxxx
PIC12F609 10 0010 010 x xxxx
PIC12HV609 10 0010 100 x xxxx
PIC16F610 10 0010 011 x xxxx
PIC16HV610 10 0010 101 x xxxx
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 22 2010 Microchip Technology Inc.
6.0 CODE PROTECTION
For PIC12F609/12F615/12F617/16F610/16F616 and
PIC12HV609/12HV615/16HV610/16HV616, once the
CP bit is programmed to ‘0’, all program memory locations
read all ‘0’s. The user ID locations and the Configuration
Word read out in an unprotected fashion. Further
programming is disabled for the entire program memory.
The user ID locations and the Configuration Word can
be programmed regardless of the state of the CP bit.
6.1 Disabling Code Protection
It is recommended to use the procedure in Figure 4-15
to disable code protection of the device. This sequence
will erase the program memory, Configuration Word
(0x2007) and user ID locations (0x2000-0x2003). The
Calibration Word (0x2008) will not be erased.
6.2 Embedding Configuration Word
and User ID Information in the Hex
File
To allow portability of code, the programmer is required
to read the Configuration Word and user ID locations
from the hex file when loading the hex file. If Configura-
tion Word information was not present in the hex file, a
simple warning message may be issued. Similarly,
while saving a hex file, Configuration Word and user ID
information must be included. An option to not include
this information may be provided.
Microchip Technology Incorporated feels strongly that
this feature is important for the benefit of the end
customer.
6.3 Checksum Computation
6.3.1 CHECKSUM
Checksum is calculated by reading the contents of the
program memory locations and adding up the opcodes
up to the maximum user addressable location (e.g.,
0x7FF for the PIC16F616). Any carry bits exceeding 16
bits are neglected. Finally, the Configuration Word
(appropriately masked) is added to the checksum. The
checksum computation for the PIC12F609/12F615/
12F617/16F610/16F616 and PIC12HV609/12HV615/
16HV610/16HV616 devices is shown in Table 6-1.
The checksum is calculated by summing the following:
• The contents of all program memory locations
• The Configuration Word, appropriately masked
• Masked user ID locations (when applicable)
The Least Significant 16 bits of this sum is the
checksum.
Table 6-1 describes how to calculate the checksum for
each device. Note that the checksum calculation differs
depending on the code-protect setting. Since the
program memory locations read out zeroes when code-
protected, the table describes how to manipulate the
actual program memory values to simulate values that
would be read from a protected device. When calculat-
ing a checksum by reading a device, the entire program
memory can simply be read and summed. The
Configuration Word and user ID locations can always
be read regardless of code-protect setting.
Note: Some older devices have an additional
value added in the checksum. This is to
maintain compatibility with older device
programmer checksums.
2010 Microchip Technology Inc. DS41284E-page 23
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
TABLE 6-1: CHECKSUM COMPUTATIONS
Device Code
Protect Checksum* Blank
Value
0x25E6 at 0
and Max.
Address
PIC12F615/HV615 CP = 1SUM[0x000:0x03FF] + (CFGW & 0x03FF) 0xFFFF 0xCBCD
CP = 0(CFGW & 0x03FF) + SUM_ID 0x03BE 0xCF8C
PIC12F617 CP = 1SUM[0x000:0x07FF] + (CFGW & 0x03FF) 0xFBFF 0xC7CD
CP = 0(CFGW & 0x03FF) + SUM_ID 0x03BE 0xCF8C
PIC12F609/HV609 CP = 1SUM[0x000:0x03FF] + (CFGW & 0x03FF) 0xFFFF 0xCBCD
CP = 0(CFGW &0x03FF) + SUM_ID 0x03BE 0xCF8C
PIC16F610/HV610 CP = 1SUM[0x000:0x03FF] + (CFGW & 0x03FF) 0xFFFF 0xCBCD
CP = 0(CFGW & 0x03FF) + SUM_ID 0x03BE 0xCF8C
PIC16F616/HV616 CP = 1 SUM[0x000:0x07FF] + (CFGW & 0x03FF) 0xFBFF 0xC7CD
CP = 0(CFGW & 0x03FF) + SUM_ID 0x03BE 0xCF8C
Legend: CFGW = Configuration Word. Example calculations assume Configuration Word is erased (all ‘1’s).
SUM[a:b] = [Sum of locations a to b inclusive]
SUM_ID = User ID locations masked by 0xF then made into a 16-bit value with ID0 as the Most Significant
nibble. For example, ID0 = 0x1, ID1 = 0x2, ID3 = 0x3, ID4 = 0x4, then SUM_ID = 0x1234. The 4 LSb’s of
the unprotected checksum is used for the example calculations.
*Checksum = [Sum of all the individual expressions] MODULO [0xFFFF]
+ = Addition
& = Bitwise AND
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 24 2010 Microchip Technology Inc.
7.0 PROGRAM/VERIFY MODE ELECTRICAL CHARACTERISTICS
TABLE 7-1: AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/VERIFY
MODE
AC/DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +85°C
Operating Voltage 4.5V VDD 5.5V
Sym. Characteristics Min. Typ. Max. Units Conditions/Comments
General
VDD VDD level for read/write operations,
program and data memory
2.0 — 5.5 V PIC16F616/F610,
PIC12F615/F617/F609
2.0 — 4.7(1) V PIC16HV616/HV610,
PIC12HV615/HV609
2.0 — 5.25(2) V PIC16HV616/HV610,
PIC12HV615/HV609
VDD level for Bulk Erase operations,
program and data memory
4.5 — 5.5 V PIC16F616/F610,
PIC12F615/F617/F609
4.5 — 4.7(1) V PIC16HV616/HV610,
PIC12HV615/HV609
4.5 — 5.25(2) V PIC16HV616/HV610,
PIC12HV615/HV609
VIHH High voltage on MCLR for
Program/Verify mode entry
10 — 13 V
IIHH MCLR current during programming — 300 1000 A
TVHHR MCLR rise time (VSS to VHH) for
Program/Verify mode entry
——1.0s
TPPDP Hold time after VPPchanges 5 — — s
VIH1 (ICSPCLK, ICSPDAT) input high level 0.8 VDD —— V
VIL1 (ICSPCLK, ICSPDAT) input low level 0.2 VDD —— V
TSET0 ICSPCLK, ICSPDAT setup time
before MCLR (Program/Verify mode
selection pattern setup time)
100 — — ns
THLD0 Hold time after VDD changes 5 — — s
Serial Program/Verify
T
SET1 Data in setup time before clock100 — — ns
THLD1 Data in hold time after clock100 — — ns
TDLY1 Data input not driven to next clock
input (delay required between
command/data or command/
command)
1.0 — — s
TDLY2 Delay between clockto clockof
next command or data
1.0 — — s
TDLY3Clock to data out valid (during a
Read Data command)
——80ns
T
ERA Erase cycle time — 5 6 ms
TPROG Programming cycle time 3 — — ms 10°C TA +40°C
TDIS Time delay from program to compare
(HV discharge time)
100 — — s
Note 1: Maximum VDD voltage when programming the device without a current limiting series resistor. Voltages above this level
will cause the shunt regulator to draw excessive current and damage the device.
2: Limiting the current through the shunt regulator to within max shunt current (device electrical characteristic SR02) with
either a series resistor or with a current limited supply.
2010 Microchip Technology Inc. DS41284E-page 25
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
APPENDIX A: REVISION HISTORY
Revision A (2/06)
Original release.
Revision B (11/06)
Section 1.0 “Device Overview”Added devices.
Section 2.1 “Hardware Requirements”Reworded.
Section 2.2 “Program/Verify Mode”Deleted data
memory.
Figure 2-1 Added 16 pin and note 1.
Figure 2-1 Reworded Note 1.
Section 3.3 “Calibration Word”Changed to 8 MHz.
Figure 3-1 Changed title.
Section 4.1 “Program/Erase Algorithms”Added text
under note.
Section 4.1.3 “Erase Algorithms”Moved One word
programming to section 4.1.1.
Figure 4-12 Changed title.
Figure 4-13 Changed title.
Register Added GP4 and GP5, added note.
Register 5.1 Bit 13 and bits 5-0 changed to unim-
plemented read as “1”.
Section 6.3.1 “Checksum”Changed Lease to Least.
Changed CARRY to lowercase.
Revision C (05/07)
Changed device family name
Section 2.1 Revised Section 2.1
Section 3.1 Changed 0x000 to 0x0000
Table 6-1 Changed 1FFF to 0x03FF
Table 7-1 Revised VDD section
Revised Note 1 and Added Note 2
Revision D (12/09)
Updated sections 2.2, 3.3, 4.1.3, 4.1.4.1; Updated
Figures 4-11, 4-12, 4-13, 4-14; Added Figure 4-15.
Revision E (04/10)
Added PIC12F617 part number; minor edits.
This document replaces DS41396.
PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616
DS41284E-page 26 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41284E-page 27
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-165-9
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS41284E-page 28 2010 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
WORLDWIDE SALES AND SERVICE
01/05/10