PHOTOCOUPLER
PS2711-1
HIGH CTR
4-PIN SOP PHOTOCOUPLER −NEPOC Series−
Document No. PN10246EJ03V0DS (3rd edition)
Date Published March 2006 CP(K) The mark shows major revised points.
©
NEC Compound Semiconductor Devices, Ltd. 2000, 2006
DESCRIPTION
The PS2711-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon
phototransistor in a plastic SOP for high density applications.
The package is an SOP (Small Outline Package) type for high density mounting applications.
FEATURES
• High current transfer ratio (CTR = 200% TYP. @ IF = 1mA)
• High isolation voltage (BV = 3 750 Vr.m.s.)
• Small and thin package (4-pin SOP)
• Ordering number of tape product: PS2711-1-F3, F4
• Pb-free product
• Safety standards
• UL approved: File No. E72422
• DIN EN60747-5-2 (VDE0884 Part2) approved (Option)
APPLICATIONS
• Programmable logic controllers
• Small power supply
• Hybrid IC
• Modem/FAX
PIN CONNECTION
(Top View)
1. Anode
2. Cathode
3. Emitter
4. Collector
43
12
Data Sheet PN10246EJ03V0DS
2
PS2711-1
PACKAGE DIMENSIONS (UNIT: mm)
4±0.5
7.0±0.3
4.4
0.5±0.3
0.15
+0.10
–0.05
0.1±0.1
2.1±0.2
2.54
0.4
+0.10
–0.05
0.25 M
MARKING EXAMPLE
2711
N601
Trade Mark
Type Number
Assembly Lot
No. 1 pin Mark
N601
Week Assembled
Year Assembled
(Last 1 Digit)
CTR Rank Name
*1 Bar : Pb-Free
Remark "PS" and "-1" are omitted from original type number
*1
Data Sheet PN10246EJ03V0DS 3
PS2711-1
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification Packing Style Safety Standard
Approval Application Part
Number*1
PS2711-1 PS2711-1-A Pb-Free Magazine case 100 pcs Standard products PS2711-1
PS2711-1-F3 PS2711-1-F3-A Embossed Tape 3 500 pcs/reel (UL approved)
PS2711-1-F4 PS2711-1-F4-A
PS2711-1-V PS2711-1-V-A Magazine case 100 pcs DIN EN60747-5-2
PS2711-1-V-F3 PS2711-1-V-F3-A Embossed Tape 3 500 pcs/reel (VDE0884 Part2)
PS2711-1-V-F4 PS2711-1-V-F4-A Approved (Option)
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (Unless otherwise specified, TA = 25°C)
Parameter Symbol Ratings Unit
Diode Forward Current (DC) IF 50 mA
Reverse Voltage VR 6 V
Power Dissipation Derating
∆
PD/°C 0.8 mW/°C
Power Dissipation PD 80 mW
Peak Forward Current*1 IFP 0.5 A
Transistor Collector to Emitter Voltage VCEO 40 V
Emitter to Collector Voltage VECO 5 V
Collector Current IC 40 mA
Power Dissipation Derating
∆
PC/°C 1.5 mW/°C
Power Dissipation PC 150 mW
Isolation Voltage*2 BV 3 750 Vr.m.s.
Operating Ambient Temperature TA –55 to +100 °C
Storage Temperature Tstg –55 to +150 °C
*1 PW = 100
µ
s, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-2 shorted together, 3-4 shorted together.
Data Sheet PN10246EJ03V0DS
4
PS2711-1
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VF IF = 5 mA 1.15 1.4 V
Reverse Current IR VR = 5 V 5
µ
A
Terminal Capacitance Ct V = 0 V, f = 1 MHz 30 pF
Transistor Collector to Emitter Dark
Current ICEO IF = 0 mA, VCE = 40 V 100 nA
Coupled Current Transfer Ratio
(IC/IF)*1 CTR IF = 1 mA, VCE = 5 V 100 200 400 %
Collector Saturation Voltage VCE (sat) IF = 1 mA, IC = 0.2 mA 0.3 V
Isolation Resistance RI-O VI-O = 1 kVDC 1011 Ω
Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.4 pF
Rise Time*2 tr VCC = 5 V, IC = 2 mA, RL = 100 Ω 4
µ
s
Fall Time*2 tf 5
*1 CTR rank
N : 100 to 400 (%)
K : 200 to 400 (%)
L : 150 to 300 (%)
M : 100 to 200 (%)
*2 Test circuit for switching time
V
CC
V
OUT
I
F
R
L
= 100 Ω
50 Ω
Pulse Input
In monitor
PW = 100 s
Duty cycle = 1/10
µ
Data Sheet PN10246EJ03V0DS 5
PS2711-1
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = 25°C)
Ambient Temperature T
A
(˚C)
Diode Power Dissipation P
D
(mW)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
Ambient Temperature T
A
(˚C)
Transistor Power Dissipation P
C
(mW)
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
Forward Voltage V
F
(V)
Forward Current I
F
(mA)
FORWARD CURRENT vs.
FORWARD VOLTAGE
Collector to Emitter Voltage V
CE
(V)
Collector Current I
C
(mA)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
Ambient Temperature T
A
(˚C)
Collector to Emitter Dark Current I
CEO
(nA)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
Collector Saturation Voltage V
CE(sat)
(V)
Collector Current I
C
(mA)
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
100
10
1
0.1
0.01
0.0 0.5 1.0 1.5 2.0
0˚C
–25˚C
–50˚C
+60˚C
+25˚C
T
A
= +100˚C
200
150
100
50
025 50 75 100
6842010
25
20
15
10
5
I
F
= 10 mA
5 mA
2 mA
1 mA
0.5 mA
–25 025 50 75 100
1
10
100
1 000
10 000
V
CE
= 40 V
20 V
10 V
0.1
1
10
100
0.0 0.2 0.4 0.6 0.8 1.0
2 mA
5 mA
10 mA
1 mA
I
F
= 0.5mA
100
40
60
20
025 50 75 100
80
Remark The graphs indicate nominal characteristics.
Data Sheet PN10246EJ03V0DS
6
PS2711-1
FREQUENCY RESPONSE
Frequency f (kHz)
Normalized Gain Gv
LONG TERM CTR DEGRADATION
Time (Hr)
CTR (Relative Value)
Forward Current I
F
(mA)
Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
Normalized to 1.0
at T
A
= 25˚C,
I
F
= 1 mA, V
CE
= 5 V
Ambient Temperature T
A
(˚C)
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
Switching Time t ( s)
µ
Load Resistance R
L
(kΩ)
SWITCHING TIME vs.
LOAD RESISTANCE
Load Resistance R
L
(kΩ)
SWITCHING TIME vs.
LOAD RESISTANCE
Switching Time t ( s)
µ
100
10
1
0.1 10 k
1 k
10010
I
C
= 2 mA,
V
CC
= 5 V,
CTR = 200%
0
–5
–10
–15
–20
–25
0.1 110 100 1 000
100 Ω
300 Ω
R
L
= 1 kΩ
1.2
1.0
0.8
0.6
0.4
0.2
010
2
10
3
10
4
10
5
10
6
10
T
A
= 25˚C
T
A
= 60˚C
I
F
= 1 mA
t
f
t
r
t
d
t
s
0.1
1
10
100
1 000 I
F
= 1 mA,
V
CC
= 5 V,
CTR = 200%
100 1k 10 k 100 k
t
f
t
s
t
r
t
d
1.2
1.4
–50
1.0
0.8
0.6
0.4
0.2
0.0 –25 025
50 75 100 0.1 110 100
0
100
200
300
400
500 V
CE
= 5 V,
n = 3
1.6
0.01
Remark The graphs indicate nominal characteristics.
Data Sheet PN10246EJ03V0DS 7
PS2711-1
TAPING SPECIFICATIONS (in millimeters)
Tape Direction
Outline and Dimension (Reel)
Packing: 3 500 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±1.0
φ
2.0±0.5
11.9 to 15.4
Outer edge of
flange
17.5±1.0
13.5±1.0
13.0±0.2
φ
PS2711-1-F3 PS2711-1-F4
1.55±0.1
2.0±0.05
4.0±0.1
1.75±0.1
4.6±0.1
2.9 MAX.
0.3
8.0±0.1
Outline and Dimensions (Tape)
2.4±0.1
1.5
+0.1
–0
7.4±0.1
5.5±0.05
12.0±0.2
Data Sheet PN10246EJ03V0DS
8
PS2711-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10246EJ03V0DS 9
PS2711-1
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according
to product.
When using products other than at the specified forward current, the characteristics curves may differ from the
standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual
operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10246EJ03V0DS
10
PS2711-1
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority
having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
M8E 00. 4 - 0110
The information in this document is current as of March, 2006. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
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to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
•
•
•
•
•
•
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
TEL: +852-3107-7303
TEL: +886-2-8712-0478
TEL: +82-2-558-2120
FAX: +852-3107-7309
FAX: +886-2-2545-3859
FAX: +82-2-558-5209
NEC Electronics (Europe) GmbH http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc. http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
0504
NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579
For further information, please contact
PS2711-1
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
