S11012-01CR - Hamamatsu Photonics K.K.

The S11012-01CR is a digital color sensor sensitive to red (λ=615 nm), green (λ=540 nm) and blue (λ=465 nm) regions of the

spectrum. Detected signals are serially output as 12-bit digital data. Built-in three 12-bit registers allow simultaneous measurement

of RGB three colors. Sensitivity level is adjustable in two steps to cover a wide photometric range.

Digital color sensor

S11012-01CR

12-bit digital output

www.hamamatsu.com 1

12-bit digital output

COB type

Display color adjustment

Various applications involving color detection

Simultaneous measurement of RGB three colors

2-step sensitivity switching (sensitivity ratio of 1 : 9)

Low voltage (3.3 V) operation

CMOS monolithic photo IC

No external components required

Vdd

GND

I/F

Range

Dout

Serial

converter

Timing

circuit

Gate

Feature Feature

12-bit digital output

Simultaneous measurement of RGB three colors

01 02

Light signals detected by the photodiode are ampliﬁ ed and convert-

ed into 12-bit digital signals. An ampliﬁ er is also formed for each of

the RGB photodiode elements arrayed in the mosaic pattern, allow-

ing simultaneous accurate measurement of the RGB components of

incident light.

The photodiode consists of 9 × 9 elements arrayed in a mosaic

pattern. Each element has an on-chip ﬁ lter that it sensitive to one

color of light, either red (λp=615 nm), green (λp=540 nm) or blue

(λp=465 nm).

KPICC0110EB KPICB0161EA

Block diagram Spectral response

Features Applications

Wavelength (nm)

Relative sensitivity

400 600 800 1000 1200

(Typ. Ta=25 °C)

200

0.2

0.1

0.4

0.3

0.6

0.8

0.7

0.5

0.9

Blue

Green

Red

Digital color sensor S11012-01CR

Absolute maximum ratings

Parameter Symbol Condition Value Unit

Supply voltage Vdd Ta=25 °C -0.3 to 6 V

Load current Io Ta=25 °C±10 mA

Power dissipation P Ta=25 °C 100 mW

Operating temperature Topr -20 to +80 °C

Storage temperature Tstg -20 to +85 °C

Reflow soldering conditions Tsol Peak temperature 240 °C, one time -

*1: JEDEC level 5a

Pin no. 1 side Pin no. 6 side

110

132

110

132

Pin no. 3 side

Note: Spaceing between elements is light-shielded.

Pin no. 4 side

3 × 3 elements in

low sensitivity mode

9 × 9 elements in

high sensitivity mode

Range Mode

Effective photosensitive area

High High sensitivity 9 × 9 elements

Low Low sensitivity 3 × 3 elements

* The photosensitive area of the S11012-01CR consists of 9 × 9 elements

in a mosaic pattern.

The effective photosensitive area changes depending on which sensitivity

mode is used, “high” or “low”, as explained below.

· High sensitivity mode: 9 × 9 elements

· Low sensitivity mode:

3 × 3 elements in center

Feature

2-step sensitivity switching

To enable measurement over a wide range of illuminance, the photodiode sensitivity can be selected from two setting modes (high sensitivity

mode and low sensitivity mode). The photodiode photosensitive area used to detect light differs depending on which sensitivity mode is selected

(high sensitivity mode: 9 × 9 elements, low sensitivity mode: 3 × 3 elements in center).

KPICC0124EB

Sensitivity setting

Details of photosensitive area (unit: μm)

Digital color sensor S11012-01CR

Electrical and optical characteristics

(Ta=25 °C, Vdd=5 V, Tg=100 ms, A light source, unless otherwise noted)

Parameter Symbol Condition Min. Typ. Max. Unit

Photosensitive area size - All elements (9 × 9 elements) - 1.2 × 1.2 - mm

Effective photosensitive area -

All elements (9 × 9 elements)

per 1 color, high range - 0.32 -

3 × 3 elements

per 1 color, low range - 0.036 -

Spectral response range

Blue - 400 to 540

800 to 1000 -

Green - 480 to 600

760 to 1000 -

Red - 590 to 1000 -

Supply voltage Vdd 3.0 - 5.5 V

Current consumption Idd Dark state, no load - 5 10 mA

Photo sensitivity

Sbl Blue, low range 0.21 0.3 0.39

LSB/lx

Sgl Green, low range 0.42 0.6 0.78

Srl Red, low range 0.98 1.4 1.82

Sbh Blue, high range 1.8 2.6 3.4

Sgh Green, high range 3.7 5.3 6.9

Srh Red, high range 9.0 12.9 16.8

Incident light power

(Conversion value in A light

source)

Ibl Blue, low range - - 172

klx

Igl Green, low range - - 83

Irl Red, low range - - 35

Ibh Blue, high range - - 19

Igh Green, high range - - 9.2

Irh Red, high range - - 3.9

Dark output Dark Tg=0.5 s, high range - - 1 LSB

Input high level Vih Vdd × 0.82 - - V

Input low level Vil - - Vdd × 0.18 V

Integration time Tg Refer to “Output vs. illuminance”-

Hold time

t1 4 - - μs

t2 3 - - μs

t3 3 - - μs

t4 2000 - - μs

t5 3 - - μs

Readout clock period tck 500 - - ns

Readout pulse width (positive) tw 200 - - ns

*2: Since this product has sensitivity in the infrared region, infrared light must be ﬁ ltered out as needed.

Digital color sensor S11012-01CR

Timing chart

····

···· ···· ····

···· ····

Gate

Dout

Range

12 pulses

Operating sequence

(1) Set the Gate terminal and CK terminal to “Low”.

(2) Select the desired sensitivity with the Range terminal.

(3) Set the Gate terminal from “Low” to “High”, to start integrating the light intensity.

(4) After the desired integration time (tg) has passed, set the Gate terminal from “High” to “Low” to end the light intensity integration.

(5) Measurement data is output from the Dout terminal by inputting 36 CK pulses to the CK terminal.

Note 1: A total of 36 CK pulses are required to read out 3-color measurement data. Red data is output by the first 12 pulses,

green data by the next 12 pulses, and blue data by the last 12 pulses. Measurement data is output from the LSB side.

Note 2: Measurement data changes at the CK pulse rising edge.

Note 3: Do not switch the Range terminal during integration time (tg).

12 pulses 12 pulses

Red output (12-bit output) Green output (12-bit output) Blue output (12-bit output)

LSB LSB LSB

MSB MSB MSB

t2 tck tw

KPICC0115EB

Low range High range

Output vs. illuminance

KPICB0162EA KPICB0163EA

Illuminance (lx)

Output (LSB)

0.1 1 10 100 100001000

(Typ. A light source, green)

0.01

10000

1000

100

1 ms

100 µs

10 ms

100 ms

1 s

10 s

Tg=100 s

Illuminance (lx)

Output (LSB)

10000

(Typ. A light source, green)

0.01 0.1

10000

1000

100

1 10 100 1000

Tg=100 s

10 s

1 s

100 ms

10 ms

1 ms

100 µs

10 µs

Digital color sensor S11012-01CR

Dimensional outline (unit: mm)

Line-up of RGB color sensors

Type no. Type

Photosensitive area size

(mm)

Package

(mm)

Peak

sensitivity

wavelength

(nm)

Photo sensitivity Photo

S9032-02

Photodiode

φ2.0

4 × 4.8 × 1.8t

6-pin

(filter 0.75t)

B 460 B 0.18 (A/W) [λ=460 nm]

G 540 G 0.23 (A/W) [λ=540 nm]

R 620 R 0.16 (A/W) [λ=620 nm]

S9702

Photodiode

1.0 × 1.0

3 × 4 × 1.3t

4-pin

(filter 0.75t)

B 460 B 0.18 (A/W) [λ=460 nm]

G 540 G 0.23 (A/W) [λ=540 nm]

R 620 R 0.16 (A/W) [λ=620 nm]

S10917-35GT

Photodiode

1.0 × 1.0

3 × 1.6 × 1.0t

COB

(on-chip filter)

B 460 B 0.2 (A/W) [λ=460 nm]

G 540 G 0.23 (A/W) [λ=540 nm]

R 620 R 0.17 (A/W) [λ=620 nm]

S10942-01CT

Photodiode

1.0 × 1.0

3 × 1.6 × 1.0t

COB

(on-chip filter)

B 0.21 (A/W) [λ=460 nm]

G 0.25 (A/W) [λ=540 nm]

R 0.45 (A/W) [λ=640 nm]

S9706 Digital

photo IC 1.2 × 1.2

4 × 4.8 × 1.8t

6-pin

(filter 0.75t)

B465

woL

0.21 (LSB/lx)

hgiH

1.9 (LSB/lx)

G540 G

0.45 (LSB/lx)

4.1 (LSB/lx)

R615 R

0.64 (LSB/lx)

5.8 (LSB/lx)

S11012-01CR

Digital

photo IC 1.2 × 1.2

3.43 × 3.8 × 1.6t

COB

(on-chip filter)

woL

0.3 (LSB/lx)

hgiH

2.6 (LSB/lx)

0.6 (LSB/lx)

5.3 (LSB/lx)

1.4 (LSB/lx)

12.9 (LSB/lx)

Refer to "Spectral response" of each datasheet.

3.8

3.43 Photosensitive area

(1.2 × 1.2)

Epoxy resin

1.2

1.0

1.6

(0.9)

1.2

0.165

0.5

Tolerance unless otherwise noted: ±0.2

Chip position accuracy with respect to package center

X, Y ≤ ±0.3

Values in parentheses indicate reference value.

Electrode

GND

Vdd

Dout

Gate

Range

KPICA0088EA

Digital color sensor S11012-01CR

Cat. No. KPIC1081E01 Dec. 2011 DN

www.hamamatsu.com

HAMAMATSU PHOTONICS K.K., Solid State Division

1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184

U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218

Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 8152-375-0, Fax: (49) 8152-265-8

France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10

United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777

North Europe: Hamamatsu Photonics Norden AB: Smidesvägen 12, SE-171 41 Solna, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01

Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1 int. 6, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741

Product specifications are subject to change without prior notice due to improvements or other reasons. Before assembly into final products, please contact

us for the delivery specification sheet to check the latest information.

Type numbers of products listed in the delivery specification sheets or supplied as samples may have a suffix "(X)" which means preliminary specifications or

a suffix "(Z)" which means developmental specifications.

The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that

one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product

use.

Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission.

Information described in this material is current as of December, 2011.

Recommended temperature proﬁ le of reﬂ ow soldering(typical example)

KPICB0164EA

Preheat time

70 to 90 s

Soldering time

40 s max.

190 °C

Time

Temperature

240 °C max.

220 °C

170 °C

· After unpacking, store this device in an environment at a temperature of 5 to 25 °C and a humidity below 60%, and perform reflow

soldering on this device within 24 hours.

· Thermal stress applied to the device during reflow soldering differs depending on the PC boards and reflow oven being used.

· When setting the reflow conditions, make sure that the reflow soldering process does not degrade device reliability. A sudden temperature

rise and cooling may be the cause of trouble, so make sure that the temperature change is within 4 °C per second.