Datashee
t
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Serial EEPROM Series Standard EEPROM
WLCSP EEPROM
BRCF016GWZ-3
General Description
BRCF016GWZ-3 is a serial EEPROM of I2C BUS Interface Method
Features
Completely conforming to the world standard I2C BUS.
All controls available by 2 ports of serial clock (SCL)
and serial data (SDA)
1.7V to 5.5V Single Power Source Operation most
suitable for battery use
1MHz action is possible(1.7V to 5.5V)
Up to 16 bytes in page write mode
Self-timed Programming Cycle
Low Current Consumption
Prevention of Write Mistake at Low Voltage
More than 1 million write cycles
More than 40 years data retention
Noise Filter Built in SCL / SDA terminal
Initial delivery state FFh
UCSP30L1 0.86mm x 0.84mm x 0.35mm
BRCF016GWZ-3
Capacity Bit Format Type Power Source Voltage Package
16Kbit 2K×8 BRCF016GWZ-3 1.7V to 5.5V UCSP30L1
Package W (Typ) x D(Typ) x H(Max)
Datasheet
2/25
BRCF016GWZ-3
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Absolute Maximum Ratings (Ta=25°C)
Parameter Symbol Rating Unit Remark
Supply Voltage VCC -0.3 to +6.5 V
Power Dissipation Pd 0.22 (UCSP30L1) W Decrease by 2.2mW/°C when operating above Ta=25°C
Storage Temperature Tstg -65 to +125 °C
Operating Temperature Topr -40 to +85 °C
Input Voltage/
Output Voltage ‐ -0.3 to Vcc+1.0 V
The Max value of Input Voltage / Output Voltage is not over 6.5V.
When the pulse width is 50ns or less, the Min value of Input Voltage
/ Output Voltage is not lower than -1.0V.
Junction Temperature Tjmax 150 °C Junction temperature at the storage condition
Electrostatic discharge
voltage(human body model) VESD -4000 to +4000 V
Memory Cell Characteristics (Ta=25℃, Vcc=1.7V to 5.5V)
Parameter
Limit
Unit
Min Typ Max
Write Cycles (1) 1,000,000 - - Times
Data Retention (1) 40 - - Years
(1)Not 100% TESTED
Recommended Operating Ratings
Parameter Symbol Rating Unit
Power Source Voltage Vcc 1.7 to 5.5
V
Input Voltage VIN 0 to Vcc
DC Characteristics
(
Unless otherwise specified, Ta=-40
℃
to +85
℃
,
Vcc=1.7V to 5.5V
)
Parameter Symbol
Limit
Unit Conditions
Min Typ Max
Input High Voltage VIH 0.7Vcc - Vcc+1.0 V 1.7V≦Vcc≦5.5V
Input Low Voltage VIL -0.3(2) - +0.3Vcc V 1.7V≦Vcc≦5.5V
Output Low Voltage1 VOL1 - - 0.4 V IOL=3.0mA, 2.5V≦Vcc≦5.5V (SDA)
Output Low Voltage2 VOL2 - - 0.2 V IOL=0.7mA, 1.7V≦Vcc＜2.5V (SDA)
Input Leakage Current ILI -1 - +1 µA VIN=0 to Vcc
Output Leakage Current ILO -1 - +1 µA VOUT=0 to Vcc (SDA)
Supply Current (Write) ICC1 - - 2.0 mA
Vcc=5.5V, fSCL=1MHz, tWR=5ms,
Byte Write, Page Write
Supply Current (Read) ICC2 - - 2.0 mA
Vcc=5.5V, fSCL=1MHz
Random Read, Current Read, Sequential
Read
Standby Current ISB - - 2.0 µA Vcc=5.5V, SDA・SCL=Vcc
(2) When the pulse width is 50ns or less, it is -1.0V.
Datasheet
3/25
BRCF016GWZ-3
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TSZ22111･15･001
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
AC Characteristics
(Unless otherwise specified, Ta=-40℃ to +85℃, Vcc=1.7V to 5.5V)
Parameter Symbol
Limi
t
s
1.7V≦Vcc≦5.5V Unit
Min Typ Max
Clock Frequency fSCL - - 1000 kHz
Data Clock High Period tHIGH 0.3 - - µs
Data Clock Low Period tLOW 0.5 - - µs
SDA and SCL Rise Time (1) t
R - - 0.12 µs
SDA and SCL (INPUT)Fall Time (1) t
F1 - - 0.12 µs
SDA(OUTPUT) Fall Time(1) t
F2 - - 0.12 µs
Start Condition Hold Time tHD:STA 0.25 - - µs
Start Condition Setup Time tSU:STA 0.20 - - µs
Input Data Hold Time tHD:DAT 0 - - ns
Input Data Setup Time tSU:DAT 50 - - ns
Output Data Delay Time tPD 0.05 - 0.45 µs
Output Data Hold Time tDH 0.05 - - µs
Stop Condition Setup Time tSU:STO 0.25 - - µs
Bus Free Time tBUF 0.5 - - µs
Write Cycle Time tWR - - 5 ms
Noise Spike Width (SDA and SCL) tI - - 0.05 µs
(1) Not 100% TESTED.
Condition Input Data Level: VIL=0.2×Vcc VIH=0.8×Vcc
Input Data Timing Reference Level: 0.3×Vcc/0.7×Vcc
Output Data Timing Reference Level: 0.3×Vcc/0.7×Vcc
Rise/Fall Time: ≦20ns
Serial Input / Output Timing
○Input Read at the rise edge of SCL
○Data Output in sync with the fall of SCL
Figure 1-(a). Serial Input / Output Timing
Figure 1-(b). Start-Stop Bit Timing
Figure 1-(c). Write Cycle Timing
SCL
SDA
(input)
SDA
(output)
tR tF tHIGH
tSU:DAT
tLOW tHD:DAT
tDHtPD
tBUF
70%
70%
30%
70% 70%
30% 30%
70% 70%
30%
70% 70%
70%
70%
30%
30%
30%
70% 70%
tSU:STA tHD:STA
START CONDITION
tSU:STO
STOP CONDITION
30%
30%
70%
70%
SDA
(input)
SCL
D0 ACK
tWRwrite data
(n-th address) START CONDITIONSTOP CONDITION
70%
70%
SCL
SDA
(input)
Datasheet
4/25
BRCF016GWZ-3
©2015 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
www.rohm.com
23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Block Diagram
Figure 2. Block Diagram
Pin Configuration
Figure 3. Pin Configuration
(BOTTOM VIEW)
Pin Descriptions
Land No. Terminal Name Input / Output Descriptions
B2 SDA Input / Output Slave and word address
Serial data input and serial data output
B1 SCL Input Serial clock input
A2 GND - Reference voltage of all input / output
A1 VCC - Power supply
○
1
○○
B
A
○
2
B1 B2
A2
A1
SDA
GND
VCC
SCL
SDA
SCL
Vcc
8Kbit EEPROM ARRAY
ADDRESS
DECO DER
SLAVE WORD
ADDRESS REGISTER
DATA
REG IST ER
C ONTROL LO GIC
HIGH VOLTAGE GEN. VCC LEVEL DETECT
10bit
8bit
AC K
ST A R T S T O P
10bit
GND
VCC
16Kbit EEPROM ARRAY
11bit
11bit
Datasheet
5/25
BRCF016GWZ-3
©2015 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Figure 6. Output Low Voltage1
vs Output Low Current
(Vcc=2.5V)
Figure 7. Output Low Voltage2
vs Output Low Current
(Vcc=1.6V)
Figure 4. Input High Voltage
vs Supply Voltage
Figure 5. Input Low Voltage
vs Supply Voltage
Typical Performance Curv es
0
0.2
0.4
0.6
0.8
1
0123456
Output Low Current: IOL(m A)
Output Low Voltage1: V OL1 (V)
SPEC
Ta= - 40°C
Ta= 25°C
Ta= 85°C
0
0.2
0.4
0.6
0.8
1
0123456
Output Low Current: I
OL
(m A)
Output Low Voltage2: V
OL2
(V)
SPEC
Ta= - 40°C
Ta= 25°C
Ta= 85°C
0
1
2
3
4
5
6
0123456
Supply Voltage: Vcc(v)
Input Low Voltage: V
IL
(V)
SPEC
Ta=-40°C
Ta= 25°C
Ta= 85°C
0
1
2
3
4
5
6
0123456
Supply Voltage: Vcc(v)
Input High Voltage : V
IH
(V)
Ta=-40°C
Ta= 25°C
Ta= 85°C
SPEC
Datasheet
6/25
BRCF016GWZ-3
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Figure 11. Supply Current (Read) vs Supply Voltage
(fSCL=1MHz)
Figure 8. Input Leakage Current vs Supply Voltage
(SCL)
Figure 9. Output Leakage Current vs Supply Voltage
(SDA)
Figure 10. Supply Current (Write) vs Supply Voltage
(fSCL=1MHz)
Typical Performance Curv es‐continued
0
0.2
0.4
0.6
0.8
1
1.2
0123456
Supply Voltage: Vcc(V)
Input Leakage Current: I
LI
(μA)
SPEC
Ta= -40°C
Ta= 25°C
Ta= 85°C
0
0.2
0.4
0.6
0.8
1
1.2
0123456
Supply Voltage: Vcc(v)
Output Leakage Current: I
LO
(µA)
Ta=-40℃
Ta= 25℃
Ta= 85℃
SPEC
0
0.5
1
1.5
2
2.5
3
0123456
Supply Voltage : Vcc(V)
Supply Current (Write) : Icc1(mA)
Ta=-40℃
Ta= 25℃
Ta= 85℃
SPEC
0
0.5
1
1.5
2
2.5
0123456
Supply Voltage : Vcc(V)
Supply Current (Read) : I
CC2
(mA)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
Datasheet
7/25
BRCF016GWZ-3
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Figure 13. Clock Frequency vs Supply Voltage
Figure 14. Data Clock High Period vs Supply Voltage
Figure 12. Standby Current vs Supply Voltage
Figure 15. Data Clock Low Period vs Supply Voltage
Typical Performance Curv es‐continued
0
0.5
1
1.5
2
2.5
0123456
Supply Voltage: Vcc(V)
Standby Current: I
SB
(µA)
SPEC
Ta= - 40°C
Ta= 25°C
Ta= 85°C
0.1
1
10
100
1000
10000
0123456
Supply Voltage: Vcc(V)
Clock Frequency: f
SCL
(kHz)
SPEC
Ta=-40°C
Ta= 25°C
Ta= 85°C
0
0.1
0.2
0.3
0.4
0123456
Supply Voltage : Vcc(V)
Data Clock High Period : tHIGH(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.1
0.2
0.3
0.4
0.5
0.6
0123456
Supply Voltage : Vcc(V)
Data Clock Low Period : tLOW(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
Datasheet
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BRCF016GWZ-3
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Figure 18. Start Condition Setup Time vs Supply Voltage
Figure 19. Input Data Hold Time vs Supply Voltage
(HIGH)
Figure 16. SDA (OUTPUT) Fall Time vs Supply Voltage
Figure 17. Start Condition Hold Time vs Supply Voltage
Typical Performance Curv es‐continued
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0123456
Supply Voltage : Vcc(V)
SDA (OUTPUT) Fall Time : t
F2
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
Supply Voltage : Vcc(V)
Start Condition Hold Time : t
HD:STA
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0123456
Supply Voltage : Vcc(V)
Start Condition Setup Time : t
SU:STA
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
-150
-100
-50
0
50
0123456
Supply Voltage: Vcc(V)
Input Data Hold Time : t
HD:DAT
(ns)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
Datasheet
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BRCF016GWZ-3
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Figure 20. Input Data Hold Time vs Supply Voltage
(LOW)
Figure 22. Input Data Setup Time vs Supply Voltage
(LOW)
Figure 23. Output Data Delay Time
vs Supply Voltage
(
LOW
)
Figure 21. Input Data Setup Time vs Supply Voltage
(HIGH)
Typical Performance Curv es‐continued
-150
-100
-50
0
50
0123456
Supply Voltage : Vcc(V)
Input Data Hold Time : t
HD:DAT
(ns)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
10
20
30
40
50
60
0123456
Supply Voltage : Vcc(V)
Input Data Setup Time : t
SU:DAT(ns)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
10
20
30
40
50
60
0123456
Supply Voltage : Vcc(V)
Input Data Setup Time : t
SU:DAT
(ns)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.1
0.2
0.3
0.4
0.5
0123456
Supply Voltage : Vcc(V)
Output Data Delay Time : tPD0(µs)
SPEC
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
Datasheet
10/25
BRCF016GWZ-3
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Figure 24. Output Data Delay Time
vs Supply Voltage
(
HIGH
)
Figure 25. Stop Condition Setup Time
vs Supply Voltage
Figure 26. Bus Free Time vs Supply Voltage
Figure 27. Write Cycle Time vs Supply Voltage
Typical Performance Curv es‐continued
0
0.1
0.2
0.3
0.4
0.5
0123456
Supply Voltage : Vcc(V)
Output Data Delay Time : t
PD1
(µs)
SPEC
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
Supply Voltage : Vcc(V)
Stop Condition Setup Time : t
SU:STO
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.1
0.2
0.3
0.4
0.5
0.6
0123456
Su p p l y Vo ltage : Vcc(V)
Bus Free Time : t
BUF
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
1
2
3
4
5
6
0123456
Supply Voltage : Vcc(V)
Write Cycle Time : t
WR
(ms)
Ta=-40℃
Ta= 25℃
Ta= 85℃
SPEC
Datasheet
11/25
BRCF016GWZ-3
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TSZ22111･15･001
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Figure 28. Noise Spike Width
vs Supply Voltage
(SCL HIGH)
Figure 30. Noise Spike Width
vs Supply Voltage
(SDA HIGH)
Figure 31. SDA Noise Spike Width (LOW)
vs Supply Voltage
(SDA LOW)
Figure 29. Noise Spike Width
vs Supply Voltage
(SCL LOW)
Typical Performance Curv es‐continued
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
Supply Voltage : Vcc(V)
Noise Spike Width(SCL HIGH) : tI(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
Supply Voltage : Vcc(V)
Noise Spike Width(SCL LOW) : tI(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
Supply Voltage : Vcc(V)
Noise Spike Width(SDA HIGH) : t
I
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
Supply Voltage : Vcc(V)
Noise Spike WidthI(SDA LOW) : t(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
Datasheet
12/25
BRCF016GWZ-3
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TSZ22111･15･001
www.rohm.com
23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Timing Chart
1. I2C BUS Data Communication
I2C BUS data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long,
and acknowledge is always required after each byte. I2C BUS data communication with several devices is possible by
connecting with 2 communication lines; serial data (SDA) and serial clock (SCL).
Among the devices, there should be a “master” that generates clock and control communication start and end. The rest
become “slave” which is controlled by an address peculiar to each device like this EEPROM. The device that outputs
data to the bus during data communication is called “transmitter”, and the device that receives data is called “receiver”.
2. Start Condition (S tart Bit Recogn i tion)
(1) Before executing each command, start condition (start bit) where SDA goes from 'HIGH' down to 'LOW' when SCL
is 'HIGH' is necessary.
(2) This IC always detects whether SDA and SCL are in start condition (start bit) or not, therefore, unless this condition
is satisfied, any command cannot be executed.
3. Stop Condition (Stop Bit Recognition)
(1) Each command can be ended by a stop condition (stop bit) where SDA goes from 'LOW' to 'HIGH' while SCL is
'HIGH'.
4. Acknowledge (ACK) Signal
(1) This acknowledge (ACK) signal is a software rule to show whether data transfer has been made normally or not. In
a master and slave communication, the device (Ex. µ-COM sends slave address input for write or read command
to this IC) at the transmitter (sending) side releases the bus after output of 8bit data.
(2) The device (Ex. This IC receives the slave address input for write or read command from the µ-COM) at the
receiver (receiving) side sets SDA 'LOW' during the 9th clock cycle, and outputs acknowledge signal (ACK signal)
showing that it has received the 8bit data.
(3) This IC, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ACK signal) 'LOW'.
(4) After receiving 8bit data (word address and write data) during each write operation, this IC outputs acknowledge
signal (ACK signal) 'LOW'.
(5) During read operation, this IC outputs 8bit data (read data), and detects acknowledge signal (ACK signal) 'LOW'.
When acknowledge signal (ACK signal) is detected, and stop condition is not sent from the master (µ-COM) side,
this IC continues to output data. When acknowledge signal (ACK signal) is not detected, this IC stops data transfer,
recognizes stop condition (stop bit), and ends read operation. Then this IC becomes ready for another
transmission.
5. Device Addressing
(1) Slave address comes after start condition from master.
(2) The significant 4 bits of slave address are used for recognizing a device type.
The device code of this IC is fixed to '1010'.
(3) The most insignificant bit ( W/R --- READ / WRITE ) of slave address is used for designating write or read
operation, and is as shown below.
Setting W/R to 0 ------- write (setting 0 to word address setting of random read)
Setting W/R to 1 ------- read
Type Slave Address
BRCF016GWZ-3 1 0 1 0 P2 P1 P0 R/W
――
P0~P2 are page select bits.
89 89 89
S P
condition condition
ACK STOPACKDATA DATAADDRES
S
START R/W ACK
1-7
SDA
SCL 1-7 1-7
Figure 32. Data Transfer Timing
Datasheet
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BRCF016GWZ-3
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Write Command
1. Write Cycle
(1) Arbitrary data can be written to this EEPROM. When writing only 1 byte, Byte Write is normally used, and when
writing continuous data of 2 bytes or more, simultaneous write is possible by Page Write Cycle. Up to 16 arbitrary
bytes can be written.
(2) During internal write execution, all input commands are ignored, therefore ACK is not returned.
(3) Data is written to the address designated by word address (n-th address)
(4) By issuing stop bit after 8bit data input, internal write to memory cell starts.
(5) When internal write is started, command is not accepted for tWR (5ms at maximum).
(6) Using page write cycle, writing in bulk is done as follows: When data of more than 16 bytes is sent, the byte in
excess overwrites the data already sent first.
(Refer to "Internal address increment".)
(7) As for Page Write Command, where 2 or more bytes of data is intended to be written, after page select bit
‘P0,P1,P2’ of slave address are designated arbitrarily, only the value of 4 least significant bits in the address is
incremented internally, so that data up to 16 addresses of memory only can be written.
2. Notes on Page Write Cycle
1 page=16bytes, but the page
Write Cycle Time is 5ms at maximum for 16byte bulk write.
It does not stand 5ms at maximum × 16byte=80ms(Max)
3. Internal Address Increment
Page Write Mode
P1 P2 WA
7 D7 1 1 0 0
W
R
I
T
E
S
T
A
R
T
R
/
W
S
T
O
P
WORD
ADDRESS DATA
SLAVE
ADDRESS
P0 WA
0 D0
A
C
K
SDA
LINE
A
C
K
A
C
K
Figure 33. Byte Write Cycle
Figure 34. Page Write Cycle
For example, when it is started from address 0Eh,
then, increment is made as below,
0Eh→0Fh→00h→01h･･･ please take note.
※0Eh･･･0E in hexadecimal, therefore,
00001110 becomes a binary number.
WA7 WA4 WA3 WA2 WA1 WA0
0 00000
0 00001
0 00010
0 01110
0 01111
0 00000
Increment
0Eh
Significant bit is fixed.
No digit up
W
R
I
T
E
S
T
A
R
T
R
/
W
A
C
K
S
T
O
P
WORD
ADDRESS(n) DATA(n)
SDA
LINE
A
C
K
A
C
K
DATA(n+15)
A
C
K
SLAVE
ADDRESS
1
0
0
1
P0
P1
P2
W
7
D0
D7 D0
W
0
Datasheet
14/25
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Read Command
1. Read Cycle
Read cycle is when data of EEPROM is read. Read cycle could be random read cycle or current read cycle. Random
read cycle is a command to read data by designating a specific address, and is used generally. Current read cycle is a
command to read data of internal address register without designating an address, and is used when to verify just after
write cycle. In both the read cycles, sequential read cycle is available where and the next address data can be read in
succession.
(1) In Random Read Cycle, data of designated word address can be read.
(2) When the command just before Current Read Cycle is Random Read Cycle, Current Read Cycle (each including
Sequential Read Cycle), data of incremented last read address (n)-th, i.e., data of the (n+1)-th address is output.
(3) When ACK signal 'LOW' after D0 is detected, and stop condition is not sent from master (µ-COM) side, the next
address data can be read in succession.
(4) Read cycle is ended by stop condition where 'H' is input to ACK signal after D0 and SDA signal goes from ‘L’ to ‘H’
while SCL signal is 'H' .
(5) When 'H' is not input to ACK signal after D0, sequential read gets in, and the next data is output.
Therefore, read command cycle cannot be ended. To end the read command cycle, be sure to input 'H' to ACK signal
after D0, and the stop condition where SDA goes from ‘L’ to ‘H’ while SCL signal is 'H'.
(6) Sequential Read is ended by stop condition where 'H' is input to ACK signal after arbitrary D0 and SDA is asserted
from ‘L’ to ‘H’ while SCL signal is 'H'.
Figure 35. Random Read Cycle
Figure 36. Current Read Cycle
Figure 37. Sequential Read Cycle (in the case of Current Read Cycle)
S
T
A
R
T
S
T
O
P
SDA
LINE
A
C
K
DATA(n)
A
C
K
SLAVE
ADDRESS
10 0 1 P0 P1 P2 D0 D7
R
/
W
R
E
A
D
R
E
A
D
S
T
A
R
T
R
/
W
A
C
K
S
T
O
P
DA TA
(
n
)
SD
A
LINE
A
C
K
A
C
K
DATA
(
n+x
)
A
C
K
S LAV E
ADDRESS
10 0
1P0
P1 P2 D0 D7 D0 D7
W
R
I
T
E
S
T
A
R
T
R
/
W
A
C
K
S
T
O
P
WORD
ADDRESS(n)
SDA
LINE
A
C
K
A
C
K
DATA(n)
A
C
K
SLAVE
ADDRESS
10 0 1 P0 P1 P2 WA
7 A0 D0
SLAVE
ADDRESS
10 0 1A1 A2
S
T
A
R
T
D7
R
/
W
R
E
A
D
W
A
0
Datasheet
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Sof tware Reset
Software reset is executed to avoid malfunction after power on and during command input. Software reset has several
kinds and 3 kinds of them are shown in the figure below. (Refer to Figure 38-(a), Figure 38-(b), and Figure 38-(c).) Within
the dummy clock input area, the SDA bus is released ('H' by pull up) and ACK output and read data '0' (both 'L' level) may
be output from EEPROM. Therefore, if 'H' is input forcibly, output may conflict and over current may flow, leading to
instantaneous power failure of system power source or influence upon devices.
Acknowledge Polling
During internal write execution, all input commands are ignored, therefore ACK is not returned. During internal automatic
write execution after write cycle input, next command (slave address) is sent. If the first ACK signal sends back 'L', then it
means end of write operation, else 'H' is returned, which means writing is still in progress. By the use of acknowledge
polling, next command can be executed without waiting for tWR = 5ms.
To write continuously, W/R = 0, then to carry out current read cycle after write, slave address with W/R = 1 is sent, and if
ACK signal sends back 'L', then execute word address input and data output and so forth.
1 2 13 14
SCL
Dummy clock×14 Start×2
SCL
Figure 38-(a). The case of dummy clock×14 + START+START+ command input
※Start command from START input.
2 1 8 9
Dummy clock×9 Start
Figure 38-(b). The case of START + dummy clock×9 + START + command input
Start
Normal command
Normal command
Normal command
Normal command
Start×9
SDA
SDA
SCL 1 2 3 8 9 7
Figure 38-(c). START×9 + command input
Normal command
Normal command
SDA
Slave
Address
Word
Address
…
…
S
T
A
R
T
First Write Command
A
C
K
H
A
C
K
L
Slave
Address
Slave
Address
Slave
Address Data
Write Command
During Internal Write,
ACK = HIGH is returned.
After completion of internal write,
ACK=LOW is sent back, so input
next word address and data in
succession.
tWR
tWR
Second write command
S
T
A
R
T
S
T
A
R
T
S
T
A
R
T
S
T
A
R
T
S
T
O
P
S
T
O
P
A
C
K
H
A
C
K
H
A
C
K
L
A
C
K
L
Figure 39. Case of continuous write by Acknowledge Polling
Datasheet
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TSZ02201-0929AG100010-1-2
Command Cancel by Start Condition and Stop Condition
During command input, by continuously inputting start condition and stop condition, command can be cancelled. (Figure 40)
However, within ACK output area and during data read, SDA bus may output 'L'. In this case, start condition and stop
condition cannot be input, so reset is not available. Therefore, execute software reset. When command is cancelled by start,
stop condition, during random read cycle, sequential read cycle, or current read cycle, internal setting address is not
determined. Therefore, it is not possible to carry out current read cycle in succession. To carry out read cycle in succession,
carry out random read cycle.
SCL
SDA 1 1 0 0
Start condition Stop condition
Figure 40. Case of cancel by start, stop condition during Slave Address Input
Datasheet
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TSZ02201-0929AG100010-1-2
I/O Peripheral Circuit
1. Pull-up Resistance of SDA terminal
SDA is NMOS open drain, so it requires a pull up resistor. As for this resistance value (RPU), select an appropriate value
from microcontroller VIL, IL, and VOL-IOL characteristics of this IC. If RPU is large, operating frequency is limited. The smaller
the RPU, the larger is the supply current (Read).
2. Maximum Value of RPU
The maximum value of RPU is determined by the following factors.
(1) SDA rise time to be determined by the capacitance (CBUS) of bus line and RPU of SDA should be tR or lower.
Furthermore, AC timing should be satisfied even when SDA rise time is slow.
(2)The bus electric potential ○
A to be determined by the input current leak total (IL) of the device connected to the bus
with output of 'H' to the SDA line and RPU should sufficiently secure the input 'H' level (VIH) of microcontroller and
EEPROM including recommended noise margin of 0.2Vcc.
VCC-ILRPU-0.2 VCC ≧ V
IH
Ex.) Vcc =3V IL=10µA VIH=0.7 Vcc
From(2)
≦ 30 [kΩ]
3. Minimum Value of RPU
The minimum value of RPU is determined by the following factors:
(1)When IC outputs LOW, it should be satisfied that VOLMAX=0.4V and IOLMAX=3mA.
(2)VOLMAX=0.4V should secure the input 'L' level (VIL) of microcontroller and EEPROM
including the recommended noise margin of 0.1Vcc.
VOLMAX ≦ VIL-0.1 VCC
Ex.) VCC =3V, VOL=0.4V, IOL=3mA, microcontroller, EEPROM VIL=0.3Vcc
from(1)
≧ 867[Ω]
And V
OL=0.4［V］
VIL=0.3×3
=0.9［V］
Therefore, the condition (2) is satisfied.
4. Pull-up Resistance of SCL Terminal
When SCL control is made at the CMOS output port, there is no need for a pull up resistor. But when there is a time
where SCL becomes 'Hi-Z', add a pull up resistor. As for the pull up resistor value, one of several kΩ to several ten kΩ
is recommended in consideration of drive performance of output port of microcontroller.
Figure 41. I/O Circuit Diagram
Microcontroller
RPU
A SDA terminal
IL IL
Bus line
Capacity
CBUS
BRCB008GWZ-3
∴ R
PU≦ 0.8Vcc-VIH
IL
RPU≦ 0.8×3-0.7×3
10×10-6
∴ RPU≧
Vcc-VOL
R
PU
≦IOL
Vcc-VOL
IOL
RPU≧ 3-0.4
3×10-3
Datasheet
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TSZ02201-0929AG100010-1-2
Cautions on Microcontroller Connection
1. RS
In I2C BUS, it is recommended that SDA port is of open drain input/output. However, when using CMOS input / output of
tri state to SDA port, insert a series resistance Rs between the pull up resistor Rpu and the SDA terminal of EEPROM.
This is to control over current that may occur when PMOS of the microcontroller and NMOS of EEPROM are turned ON
simultaneously. RS also plays the role of protecting the SDA terminal against surge. Therefore, even when SDA port is
open drain input/output, RS can be used.
2. Maximum Value of RS
The maximum value of Rs is determined by the following relations.
(1) SDA rise time to be determined by the capacitance (CBUS) of bus line and RPU of SDA should be tR or lower.
Furthermore, AC timing should be satisfied even when SDA rise time is slow.
(2) The bus electric potential ○
A to be determined by RPU and RS the moment when EEPROM outputs 'L' to SDA bus
should sufficiently secure the input 'L' level (VIL) of microcontroller including recommended noise margin of 0.1Vcc.
Ex)VCC=3V VIL=0.3VCC VOL=0.4V RPU=20kΩ
3. Minimum Value of RS
The minimum value of RS is determined by over current at bus collision. When over current flows, noises in power source
line and instantaneous power failure of power source may occur. When allowable over current is defined as I, the
following relation must be satisfied. Determine the allowable current in consideration of the impedance of power source
line in set and so forth. Set the over current to EEPROM at 10mA or lower.
EX) VCC=3V I=10mA
(Vcc-VOL)×RS
RPU+RS
RPU
Microcontroller
RS
EEPROM
Figure 42. I/O Circuit Diagram Figure 43. Input / Output Collision Timing
A
CK
'L' output of EEPROM
'H' output of microcontroller
Over current flows to SDA line by 'H'
output of microcontroller and 'L'
output of EEPROM.
SCL
SDA
Microcontroller EEPROM
'L'output
R
S
R
PU
'H' output
Over current I
Figure 45. I/O Circuit Diagram
Figure 44. I/O Circuit Diagram
RPU
Micro controller
RS
EEPROM
IOL
A
Bus line
capacity
CBUS
VOL
VCC
VIL
+VOL+0.1Vcc≦VIL
∴ R
S≦ ×RPU
VIL-VOL-0.1Vcc
1.1Vcc-VIL
≦1.67[kΩ]
RS≦ 0.3×3-0.4-0.1×3
1.1×3-0.3×3 ×20×103
RS≧ 3
10×10-3
≧300[Ω]
Vcc
RS ≦I
∴ R
S≧ Vcc
I
Datasheet
19/25
BRCF016GWZ-3
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
I/O Equivalence Circuit
1. Input (SCL)
2. Input / Output (SDA)
Figure 46. Input Pin Circuit Diagram
Figure 47. Input / Output Pin Circuit Diagram
Datasheet
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TSZ02201-0929AG100010-1-2
Power-Up/Do wn Conditions
At power on, the IC’s internal circuit may go through unstable low voltage area as the Vcc rises, making the IC’s internal
logic circuit not completely reset, hence, malfunction may occur. To prevent this, the IC is equipped with POR circuit and
LVCC circuit. To assure the operation, observe the following conditions at power on.
1. Set SDA = 'H' and SCL ='L' or 'H’
2. Start power source so as to satisfy the recommended conditions of tR, tOFF, and Vbot for operating POR circuit.
tOFF
tR
Vbot
0
VCC
3. Set SDA and SCL so as not to become 'Hi-Z'.
When the above conditions 1 and 2 cannot be observed, take the following countermeasures.
(1) In the case when the above condition 1 cannot be observed such that SDA becomes 'L' at power on.
→Control SCL and SDA as shown below, to make SCL and SDA, 'H' and 'H'.
(2) In the case when the above condition 2 cannot be observed.
→After power source becomes stable, execute software reset(Page 15).
(3) In the case when the above conditions 1 and 2 cannot be observed.
→Carry out (1), and then carry out (2).
Low Voltage Malfunction Prev ention Function
LVCC circuit prevents data rewrite operation at low power and prevents write error. At LVCC voltage (Typ =1.2V) or below,
data rewrite is prevented.
Noise Countermeasures
1. Bypass Capacitor
When noise or surge gets in the power source line, malfunction may occur, therefore, it is recommended to connect a
bypass capacitor (0.1µF) between the IC’s Vcc and GND. Connect the capacitor as close to the IC as possible. In
addition, it is also recommended to connect a bypass capacitor between the board’s Vcc and GND.
Recommended conditions of tR, tOFF,Vbot
tR t
OFF V
bot
10ms or below 10ms or larger 0.3V or below
100ms or below 10ms or larger 0.2V or below
tLOW
tSU:DAT
tDH
A
fter Vcc becomes stable
SCL
V
CC
SDA
tSU:DAT
A
fter Vcc becomes stable
Figure 48. Rise Waveform Diagram
Figure 49. When SCL= 'H' and SDA= 'L' Figure 50. When SCL='L' and SDA='L'
Datasheet
21/25
BRCF016GWZ-3
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Operational Notes
1. Described numeric values and data are design representative values only and the values are not guaranteed.
2. We believe that the application circuit examples in this document are recommendable. However, in actual use, confirm
characteristics further sufficiently. If changing the fixed number of external parts is desired, make your decision with
sufficient margin in consideration of static characteristics, transient characteristics, and fluctuations of external parts
and our LSI.
3. Absolute maximum ratings
If the absolute maximum ratings such as supply voltage, operating temperature range and so on are exceeded, LSI
may be destroyed. Do not supply voltage or subject the IC to temperature exceeding the absolute maximum ratings. In
the case of fear of exceeding the absolute maximum ratings, take physical safety countermeasures such as adding
fuses, and see to it that conditions exceeding the absolute maximum ratings should not be supplied to the LSI.
4. GND electric potential
Set the voltage of GND terminal lowest at any operating condition. Make sure that each terminal voltage is not lower
than that of GND terminal.
5. Thermal design
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions.
6. Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
7. Operating the IC in the presence of strong electromagnetic field may cause malfunction, therefore, evaluate design
sufficiently.
Datasheet
22/25
BRCF016GWZ-3
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Part Numbering
B R C F 0 1 6 G W Z - 3 E 2
Revision
Capacity
016=16K
BUS type
C：I2C
Package
GWZ：UCSP30L1
Process Code
Packaging and forming sp ecificatio n
E2：: Embossed tape and reel
Datasheet
23/25
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©2015 ROHM Co., Ltd. All rights reserved.
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www.rohm.com
23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Physical Dimensions Tape and Reel Information
1PIN MARK
0.94±0.05
0.94±0.050.33MAX
0.06
S
B
B
A
12
A
0.4 0.27±0.05
P = 0.4× 10.27±0.05
S
0.06
4-φ0.20±0.05
A
0.05
B
1 2
SCL SDA
(top view)
(bottom view)
SCL SDA
Vcc GND
GNDVcc
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
E2
()
Direction of feed
Reel 1pin
3000pcs
0.84±0.05
0.86
±
0.05
0.35MAX
0.08±0.05
0.08
0.22±0.05
0.23±0.05
Datasheet
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23.Sep.2015 Rev.001
TSZ02201-0929AG100010-1-2
Marking Diagram
1PIN MARK
Part Number Marking
LOT NO.
J C
UCSP30L1(TOP VIEW)
Datasheet
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TSZ02201-0929AG100010-1-2
Revision History
Date Revision Changes
23.Sep.2015 001 New Release
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinar y el ec tronic equip ments (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your o wn responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissip ation (Pd) depe nding o n Ambient temper ature (Ta). When us ed in se aled area, confirm the actual
ambient temperature.
8. Confirm that operation temperat ure is within the specified range descr ibed in the product specification.
9. ROHM shall not be in any way r esponsible or liable for failure induced under dev iant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlor ine, bromine, etc.) flux is used, the residue of flux may negatively affect prod uct
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall no t be in any way responsib le or liable f or an y damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered conn ections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is grante d hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companie s or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Datasheet
Part Number brcf016gwz-3
Package UCSP30L1
Unit Quantity 3000
Minimum Package Quantity 3000
Packing Type Taping
Constitution Materials List inquiry
RoHS Yes
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Distribution Inventory
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