KAI-1010 IMAGE SENSOR 1008 (H) X 1018 (V) INTERLINE CCD IMAGE SENSOR JULY 13, 2012 DEVICE PERFORMANCE SPECIFICATION REVISION 1.0 PS-0021 KAI-1010 Image Sensor TABLE OF CONTENTS Summary Specification ......................................................................................................................................................................................... 5 Description .................................................................................................................................................................................................... 5 Features ......................................................................................................................................................................................................... 5 Applications .................................................................................................................................................................................................. 5 Ordering Information ............................................................................................................................................................................................ 6 Device Description ................................................................................................................................................................................................. 7 Architecture .................................................................................................................................................................................................. 7 Image Acquisition ........................................................................................................................................................................................ 7 Charge Transport ......................................................................................................................................................................................... 8 Output Structure ......................................................................................................................................................................................... 9 Electronic Shutter ..................................................................................................................................................................................... 10 Physical Description ................................................................................................................................................................................. 11 Pin Description and Device Orientation ......................................................................................................................................... 11 Imaging Performance .......................................................................................................................................................................................... 12 Electro-Optical for KAI-1010-ABA ........................................................................................................................................................ 12 Monochrome with Microlens Quantum Efficiency ........................................................................................................................... 13 Angular Quantum Efficiency .................................................................................................................................................................. 14 Frame Rates ............................................................................................................................................................................................... 15 CCD Image Specifications ....................................................................................................................................................................... 16 Output Amplifier @ VDD = 15 V, VSS = 0.0 V .................................................................................................................................... 16 General ........................................................................................................................................................................................................ 17 Defect Classification ........................................................................................................................................................................................... 19 Operation .................................................................................................................................................................................................................. 20 Absolute Maximum Range ..................................................................................................................................................................... 20 DC Operating Conditions........................................................................................................................................................................ 21 AC Clock Level Conditions ...................................................................................................................................................................... 22 AC Timing Requirements for 20 MHz Operation .............................................................................................................................. 23 Frame Timing - Single Register Readout ........................................................................................................................................ 24 Line Timing - Single Register Readout ............................................................................................................................................ 25 Pixel Timing - Single Register Readout ........................................................................................................................................... 26 Electronic Shutter Timing - Single Register Readout .................................................................................................................. 27 Frame Timing - Dual Register Readout ........................................................................................................................................... 28 Line Timing - Dual Register Readout ............................................................................................................................................... 29 Pixel Timing - Dual Register Readout .............................................................................................................................................. 30 Fast Dump Timing - Removing Four Lines ..................................................................................................................................... 31 Binning - Two to One Line Binning .................................................................................................................................................. 32 Timing - Sample Video Waveform ................................................................................................................................................... 33 Storage and Handling .......................................................................................................................................................................................... 34 Climatic Requirements ............................................................................................................................................................................ 34 ESD ............................................................................................................................................................................................................... 34 Cover Glass Care and Cleanliness ......................................................................................................................................................... 34 Environmental Exposure ........................................................................................................................................................................ 34 Soldering Recommendations ................................................................................................................................................................ 35 Mechanical Information ..................................................................................................................................................................................... 36 Completed Assembly ............................................................................................................................................................................... 36 Cover Glass ................................................................................................................................................................................................. 38 Quality Assurance and Reliability .................................................................................................................................................................. 39 Quality and Reliability ............................................................................................................................................................................. 39 www.truesenseimaging.com Revision 1.0 PS-0021 Pg 2 KAI-1010 Image Sensor Replacement .............................................................................................................................................................................................. 39 Liability of the Supplier ........................................................................................................................................................................... 39 Liability of the Customer ........................................................................................................................................................................ 39 Test Data Retention ................................................................................................................................................................................. 39 Mechanical.................................................................................................................................................................................................. 39 Life Support Applications Policy .................................................................................................................................................................... 39 Revision Changes................................................................................................................................................................................................... 40 MTD/PS-0502 ............................................................................................................................................................................................. 40 PS-0021 ....................................................................................................................................................................................................... 41 www.truesenseimaging.com Revision 1.0 PS-0021 Pg 3 KAI-1010 Image Sensor TABLE OF FIGURES Figure 1: Functional Block Diagram ........................................................................................................................................................... 7 Figure 2: True 2 Phase CCD Cross Section ................................................................................................................................................ 8 Figure 3: Output Structure ........................................................................................................................................................................... 9 Figure 4: Pinout Diagram ............................................................................................................................................................................11 Figure 5: Nominal KAI-1010-ABA Spectral Response ..........................................................................................................................13 Figure 6: Angular Dependence of Quantum Efficiency .......................................................................................................................14 Figure 7: Frame Rate versus Horizontal Clock Frequency ..................................................................................................................15 Figure 8: Typical KAI-1010-ABA Photoresponse ...................................................................................................................................17 Figure 9: Example of Vsat versus Vsub ...................................................................................................................................................18 Figure 10: Recommended Output Structure Load Diagram ..............................................................................................................21 Figure 11: Frame Timing - Single Register Readout .............................................................................................................................24 Figure 12: Line Timing - Single Register Output ...................................................................................................................................25 Figure 13: Pixel Timing Diagram - Single Register Readout ...............................................................................................................26 Figure 14: Electronic Shutter Timing Diagram - Single Register Readout ......................................................................................27 Figure 15: Frame Timing - Dual Register Readout ................................................................................................................................28 Figure 16: Line Timing - Dual Register Output ......................................................................................................................................29 Figure 17: Pixel Timing Diagram - Dual Register Readout..................................................................................................................30 Figure 18: Fast Dump Timing - Removing Four Lines ...........................................................................................................................31 Figure 19: Binning - 2 to 1 Line Binning ...................................................................................................................................................32 Figure 20: Sample Video Waveform at 5MHz ........................................................................................................................................33 Figure 21: Completed Assembly (1 of 2) .................................................................................................................................................36 Figure 22: Completed Assembly (2 of 2) .................................................................................................................................................37 Figure 23: Glass Drawing.............................................................................................................................................................................38 TABLE OF TABLES Table 1: Electro-Optical Image Specifications KAI-1010-ABA ...........................................................................................................12 Table 2: CCD Image Specifications ...........................................................................................................................................................16 Table 3: Output Amplifier Image Specifications ...................................................................................................................................16 Table 4: General Image Specifications .....................................................................................................................................................17 Table 5: Absolute Maximum Ranges ........................................................................................................................................................20 Table 6: DC Operating Conditions ............................................................................................................................................................21 Table 7: AC Clock Level Conditions ..........................................................................................................................................................22 Table 8: AC Timing Requirements for 20 MHz Operation ..................................................................................................................23 Table 9: Climatic Requirements ................................................................................................................................................................34 www.truesenseimaging.com Revision 1.0 PS-0021 Pg 4 KAI-1010 Image Sensor Summary Specification KAI-1010 Image Sensor DESCRIPTION The KAI-1010 Image Sensor is a high-resolution monochrome charge coupled device (CCD) device whose non-interlaced architecture makes it ideally suited for video, electronic still and motion/still camera applications. The device is built using an advanced true two-phase, double-polysilicon, NMOS CCD technology. The p+npn- photodetector elements eliminate image lag and reduce image smear while providing antiblooming protection and electronic-exposure control. The total chip size is 10.15 (H) mm x 10.00 (V) mm. FEATURES Front Illuminated Interline Architecture Parameter Typical Value Architecture Interline CCD, Non-Interlaced Total Number of Pixels 1024 (H) x 1024 (V) Number of Effective Pixels 1008 (H) x 1018 (V) Number of Active Pixels 1008 (H) x 1018 (V) Number of Outputs 1 or 2 Pixel Size 9 m (H) x 9 m (V) Progressive Scan (Non-interlaced) Electronic Shutter On-Chip Dark Reference Pixels Active Image Size Low Dark Current 9.1 mm (H) x 9.2 mm (V) 12.9 mm (diagonal) Optical Fill-Factor 60% High Sensitivity Output Structure Saturation Signal >50,000 electrons Output Sensitivity 12 V/electron Dark Noise 50 electrons rms Dual Output Shift Registers Antiblooming Protection Dark Current <0.5 nA/cm2 Negligible Lag Quantum Efficiency (wavelength = 500 nm) 37% Low Smear (0.01% with microlens) Blooming Suppression >100 X Maximum Data Rate 20 MHz/Channel (2 channels) Image Lag Negligible Package CERDIP APPLICATIONS Machine Vision www.truesenseimaging.com Cover Glass AR Coated (both sides) All parameters above are specified at T = 40 C Revision 1.0 PS-0021 Pg 5 KAI-1010 Image Sensor Ordering Information Catalog Number Product Name Description 2H4115 KAI- 1010-ABA-CD-AE Monochrome, Telecentric Microlens, CERDIP Package (sidebrazed), Clear Cover Glass with AR coating (both sides), Engineering Sample KAI-1010M Serial Number 2H4614 KAI- 1010-ABA-CD-BA Monochrome, Telecentric Microlens, CERDIP Package (sidebrazed), Clear Cover Glass with AR coating (both sides), Standard Grade KAI-1010M Serial Number 2H4121 KAI- 1010-ABA-CR-AE Monochrome, Telecentric Microlens, CERDIP Package (sidebrazed), Taped Clear Cover Glass with AR coating (2 sides), Engineering Sample KAI-1010M Serial Number 2H4613 KAI- 1010-ABA-CR-BA Monochrome, Telecentric Microlens, CERDIP Package (sidebrazed), Taped Clear Cover Glass with AR coating (2 sides), Standard Grade KAI-1010M Serial Number Marking Code See Application Note Product Naming Convention for a full description of the naming convention used for Truesense Imaging image sensors. For reference documentation, including information on evaluation kits, please visit our web site at www.truesenseimaging.com. Please address all inquiries and purchase orders to: Truesense Imaging, Inc. 1964 Lake Avenue Rochester, New York 14615 Phone: (585) 784-5500 E-mail: info@truesenseimaging.com Truesense Imaging reserves the right to change any information contained herein without notice. All information furnished by Truesense Imaging is believed to be accurate. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 6 KAI-1010 Image Sensor Device Description ARCHITECTURE 4 dark lines at bottom of image V1 V1 KAI-1010 VRD R VDD VOUTA VSS/OG VDD VOUTB VSS/OG V2 10 dark columns 6 dark columns V2 Active Image Area: 1008 (H) x 1018 (V) 9.0 x9.0 m2 pixels 2 dark lines at top of image H1A H2 Horizontal Register A 2 dummies 6 dummies Horizontal Register B H1B WELL VSUB Figure 1: Functional Block Diagram The KAI-1010 consists of 1024 x 1024 photodiodes, 1024 vertical (parallel) CCD shift registers (VCCDs), and dual 1032 pixel horizontal (serial) CCD shift registers (HCCDs) with independent output structures. The device can be operated in either single or dual line mode. The advanced, progressive-scan architecture of the device allows the entire image area to be read out in a single scan. The active pixels are arranged in a 1008 (H) x 1018 (V) array with an additional 16 columns and 6 rows of light-shielded dark reference pixels. IMAGE ACQUISITION An electronic representation of an image is formed when incident photons falling on the sensor plane create electronhole pairs within the individual silicon photodiodes. These photoelectrons are collected locally by the formation of potential wells at each photosite. Below photodiode saturation, the number of photoelectrons collected at each pixel is linearly dependent on light level and exposure time and non-linearly dependent on wavelength. When the photodiode's charge capacity is reached, excess electrons are discharged into the substrate to prevent blooming. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 7 KAI-1010 Image Sensor CHARGE TRANSPORT The accumulated or integrated charge from each photodiode is transported to the output by a three step process. The charge is first transported from the photodiodes to the VCCDs by applying a large positive voltage to the phase-one vertical clock (V1). This reads out every row, or line, of photodiodes into the VCCDs. The charge is then transported from the VCCDs to the HCCDs line by line. Finally, the HCCDs transport these rows of charge packets to the output structures pixel by pixel. On each falling edge of the horizontal clock, H2, these charge packets are dumped over the output gate (OG, Figure 3) onto the floating diffusion (FDA and FDB, Figure 3). Both the horizontal and vertical shift registers use traditional two-phase complementary clocking for charge transport. Transfer to the HCCDs begins when V2 is clocked high and then low (while holding oH1A high) causing charge to be transferred from V1 to V2 and subsequently into the A HCCD. The A register can now be read out in single line mode. If it is desired to operate the device in a dual line readout mode for higher frame rates, this line is transferred into the B HCCD by clocking H1A to a low state, and H1B to a high state while holding H2 low. After H1A is returned to a high state, the next line can be transferred into the A HCCD. After this clocking sequence, both HCCDs are read out in parallel. The charge capacity of the horizontal CCDs is slightly more than twice that of the vertical CCDs. This feature allows the user to perform two-to-one line aggregation in the charge domain during V-to-H transfer. This device is also equipped with a fast dump feature that allows the user to selectively dump complete lines (or rows) of pixels at a time. This dump, or line clear, is also accomplished during the V-to-H transfer time by clocking the fast dump gate. Pixel Pn+1 Pixel Pn -V -V +V Q1 +V Q2 Direction of Transfer Figure 2: True 2 Phase CCD Cross Section www.truesenseimaging.com Revision 1.0 PS-0021 Pg 8 KAI-1010 Image Sensor OUTPUT STRUCTURE Charge packets contained in the horizontal register are dumped pixel by pixel, onto the floating diffusion output node whose potential varies linearly with the quantity of charge in each packet. The amount of potential change is determined by the expression Vfd=Q/Cfd. A three stage source-follower amplifier is used to buffer this signal voltage off chip with slightly less than unity gain. The translation from the charge domain to the voltage domain is quantified by the output sensitivity or charge to voltage conversion in terms of V/e . After the signal has been sampled off-chip, the reset clock (R) removes the charge from the floating diffusion and resets its potential to the reset-drain voltage (VRD). R RD VDD VOUTA FDA (n/c) HCCDA VSS & OG HCCDB FDB (n/c) VOUTB VWELL VSUB Figure 3: Output Structure www.truesenseimaging.com Revision 1.0 PS-0021 Pg 9 KAI-1010 Image Sensor ELECTRONIC SHUTTER The KAI-1010 provides a structure for the prevention of blooming which may be used to realize a variable exposure time as well as performing the anti-blooming function. The anti-blooming function limits the charge capacity of the photodiode by draining excess electrons vertically into the substrate (hence the name Vertical Overflow Drain or VOD). This function is controlled by applying a large potential to the device substrate (device terminal SUB). If a sufficiently large voltage pulse (VES 40V) is applied to the substrate, all photodiodes will be emptied of charge through the substrate, beginning the integration period. After returning the substrate voltage to the nominal value, charge can accumulate in the diodes and the charge packet is subsequently readout onto the VCCD at the next occurrence of the high level on V1. The integration time is then the time between the falling edges of the substrate shutter pulse and V1. This scheme allows electronic variation of the exposure time by a variation in the clock timing while maintaining a standard video frame rate. Application of the large shutter pulse must be avoided during the horizontal register readout or an image artifact will appear due to feed-through. The shutter pulse VES must be "hidden" in the horizontal retrace interval. The integration time is changed by skipping the shutter pulse from one horizontal retrace interval to another. The smear specification is not met under electronic shutter operation. Under constant light intensity and spot size, if the electronic exposure time is decreased, the smear signal will remain the same while the image signal will decrease linearly with exposure. Smear is quoted as a percentage of the image signal and so the percent smear will increase by the same factor that the integration time has decreased. This effect is basic to interline devices. Extremely bright light can potentially harm solid state imagers such as Charge-Coupled Devices (CCDs). Refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible Lighting Conditions. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 10 KAI-1010 Image Sensor PHYSICAL DESCRIPTION Pin Description and Device Orientation GND 1 24 V1R V1L 2 23 V2R V2L 3 22 WELL SUB 4 21 GND GND 5 20 GND FDG 6 19 IDHA VDD 7 18 IDHB VOUTA 8 17 H1A VSS 9 R 10 15 H1B VRD 11 14 GND VOUTB 12 13 H2 Pixel 1,1 16 GND Figure 4: Pinout Diagram PIN NAME DESCRIPTION 1,5,14,16,20,21 GND Ground 1 2, 24 V1 Vertical CCD Clock - Phase 1 2 3, 23 V2 Vertical CCD Clock - Phase 2 3 4 SUB Substrate 6 FDG Fast Dump Gate 7 VDD Output Amplifier Supply 8 VOUTA Video Output Channel A 9 VSS Output Amplifier Return & OG 10 R Reset Clock 11 VRD Reset Drain 12 VOUTB Video Output Channel B 13 H2 A & B Horizontal CCD Clock - Phase 2 15 H1B B Horizontal CCD Clock - Phase 1 17 H1A A Horizontal CCD Clock - Phase 1 18 IDHB Input Diode B Horizontal CCD 19 IDHA Input Diode A Horizontal CCD 22 WELL P-Well Notes: 1. 2. 3. Notes All GND pins should be connected to WELL (P-Well). Pins 2 and 24 must be connected together - only 1 Phase 1 clock driver is required. Pins 3 and 23 must be connected together - only 1 Phase 2 clock driver is required. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 11 KAI-1010 Image Sensor Imaging Performance All the following values were derived using nominal operating conditions using the recommended timing. Unless otherwise stated, readout time = 140 ms, integration time = 140 ms and sensor temperature = 40 C. Correlated double sampling of the output is assumed and recommended. Many units are expressed in electrons, to convert to voltage, multiply by the amplifier sensitivity. Defects are excluded from the following tests and the signal output is referenced to the dark pixels at the end of each line unless otherwise specified. ELECTRO-OPTICAL FOR KAI-1010-ABA SYMBOL PARAMETER MIN. NOM. MAX. UNITS NOTES FF Optical Fill Factor 55.0 % Esat Saturation Exposure 0.037 J/cm2 QE Peak Quantum Efficiency 37 % 2 PRNU Photoresponse Non-uniformity 10.0 %pp 3, 4 PRNL Photoresponse Non-linearity 5.0 % 1 Table 1: Electro-Optical Image Specifications KAI-1010-ABA Notes: 1. 2. 3. 4. For = 550nm wavelength, and Vsat = 350 mV. Refer to typical values from Figure 5. Under uniform illumination with output signal equal to 280 mV. Units: % Peak to Peak. A 200 by 200 sub ROI is used. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 12 KAI-1010 Image Sensor MONOCHROME WITH MICROLENS QUANTUM EFFICIENCY 0.4 0.35 Absolute Quantum Efficiency 0.3 0.25 0.2 0.15 0.1 0.05 0 400 450 500 550 600 650 700 750 800 850 900 950 1000 Wavelength (nm) Figure 5: Nominal KAI-1010-ABA Spectral Response www.truesenseimaging.com Revision 1.0 PS-0021 Pg 13 KAI-1010 Image Sensor ANGULAR QUANTUM EFFICIENCY 110 100 Quantum Efficiency (percent relative to normal incidence) Vertical 90 80 70 60 50 40 Horizontal 30 20 10 0 0 5 10 15 20 25 30 Angle from Normal Incidence (degrees) Figure 6: Angular Dependence of Quantum Efficiency For the curve marked "Horizontal", the incident light angle is varied in a plane parallel to the HCCD. For the curve marked "Vertical", the incident light angle is varied in a plane parallel to the VCCD. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 14 KAI-1010 Image Sensor FRAME RATES KAI-1010 Frame Rate versus Horizontal Clock Frequency 60 Dual Channel Estimated Frame Rate (Frames per Second) 50 40 Dual Channel 30 20 Single Channel Estimated 10 Single Channel 0 0 5 10 15 20 25 30 35 40 Horizontal Clock Frequency - (MHz) Figure 7: Frame Rate versus Horizontal Clock Frequency www.truesenseimaging.com Revision 1.0 PS-0021 Pg 15 KAI-1010 Image Sensor CCD IMAGE SPECIFICATIONS SYMBOL PARAMETER Vsat Output Saturation Voltage MIN. Id Dark Current DCDT Dark Current Doubling Temp CTE Charge Transfer Efficiency fH NOM. MAX. 350 UNITS NOTES mV 1,2,8 0.5 nA 10 C Horizontal CCD Frequency 40 MHz IL Image Lag 100 e- Xab Blooming Margin 100 Smr Vertical Smear 7 8 0.99999 2,3 0.01 4 5 6,8 % 7 Table 2: CCD Image Specifications Notes: 1. 2. 3. 4. 5. 6. 7. 8. Vsat is the green pixel mean value at saturation as measured at the output of the device with Xab=1. Vsat can be varied by adjusting Vsub. Measured at sensor output. With stray output load capacitance of CL = 10 pF between the output and AC ground. Using maximum CCD frequency and/or minimum CCD transfer times may compromise performance. This is the first field decay lag measured by strobe illuminating the device at (Hsat, Vsat), and by then measuring the subsequent frame's average pixel output in the dark. Xab represents the increase above the saturation-irradiance level (Hsat) that the device can be exposed to before blooming of the vertical shift register will occur. It should also be noted that Vout rises above Vsat for irradiance levels above Hsat, as shown in Figure 8. Measured under 10% (~ 100 lines) image height illumination with white light source and without electronic shutter operation and below Vsat. It should be noted that there is tradeoff between Xab and Vsat. OUTPUT AMPLIFIER @ VDD = 15 V, VSS = 0.0 V SYMBOL PARAMETER Vodc Output DC Offset MIN. Pd Power Dissipation f-3db Output Amplifier Bandwidth CL Off-Chip Load NOM. MAX. 7 ---- 225 ---- 140 10 UNITS NOTES V 1,2 mW 3 MHz 1,4 pF Table 3: Output Amplifier Image Specifications Notes: 1. 2. 3. 4. Measured at sensor output with constant current load of Iout = 5 mA per output. Measured with VRD = 9 V during the floating-diffusion reset interval, (R high), at the sensor output terminals. Both channels. With stray output load capacitance of CL = 10 pF between the output and AC ground. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 16 KAI-1010 Image Sensor GENERAL SYMBOL PARAMETER Vn - total Total Sensor Noise DR Dynamic Range MIN. NOM. MAX. 0.5 60 UNITS NOTES mV, rms 1 dB 2 Table 4: General Image Specifications Notes: 1. 2. Includes amplifier noise and dark current shot noise at data rates of 10 MHz. The number is based on the full bandwidth of the amplifier. It can be reduced when a low pass filter is used. Uses 20LOG(Vsat/Vn - total) where Vsat refers to the output saturation signal. 400 350 300 Output Signal - Vout - (mV) (Hsat, Vsat) 250 200 150 100 50 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Sensor Plane Irradiance - H - (arb) Figure 8: Typical KAI-1010-ABA Photoresponse www.truesenseimaging.com Revision 1.0 PS-0021 Pg 17 KAI-1010 Image Sensor 600 Vsub=8V 500 Vsub=9V Vsub=10V Output Signal - Vout - (mV) 400 Vsub=11V 300 Vsub=12V Vsub=13V 200 Vsub=14V Vsub=15V 100 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Sensor Plane Irradiance - H - (arb) Figure 9: Example of Vsat versus Vsub As Vsub is decreased, Vsat increases and anti-blooming protection decreases. As Vsub is increased, Vsat decreases and anti-blooming protection increases. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 18 KAI-1010 Image Sensor Defect Classification All values derived under nominal operating conditions at 40 C operating temperature. Number Allowed Notes Under uniform illumination with mean pixel output at 80% of Vsat, a defective pixel deviates by more than 15% from the mean value of all pixels in its section. 12 1 Bright Defect Under dark field conditions, a bright defect deviates more than 15mV from the mean value of all pixels in its section. 5 1 Cluster Defect Two or more vertically or horizontally adjacent defective pixels. 0 Defect Type Defect Definition Defective Pixel 1008,1 756,1 504,1 252,1 Sections are 252 (H) x 255 (V) pixel groups, which divide the imager into sixteen equal areas as shown below. 1,1 Notes: 1. 1,1 1008,1 1,255 1008,255 1,510 1008,510 1,765 1008,765 1008,1018 756,1018 504,1018 252,1018 1008,1018 1,1018 1,1018 Test Conditions Junction Temperature (Tj) = 40 C Integration Time (tint) = 70 msec Readout Rate (treadout) = 70 msec www.truesenseimaging.com Revision 1.0 PS-0021 Pg 19 KAI-1010 Image Sensor Operation ABSOLUTE MAXIMUM RANGE RATING DESCRIPTION Temperature (@ 10% 5%RH) Operation Without Damage Voltage (Between Pins) Current MIN. MAX. UNITS NOTES -50 +70 C 5, 6 SUB-WELL 0 +40 V 1, 7 VRD,VDD,OG&VSS-WELL 0 +15 V 2 IDHA,B & VOUTA,B - WELL 0 +15 V 2 V1 - V2 -12 +20 V 2 H1A, H1B - H2 -12 +15 V 2 H1A, H1B, H2, FDG - V2 -12 +15 V 2 H2 - OG & VSS -12 +15 V 2 R - SUB -20 0 V 1,2,4 All Clocks - WELL -12 +15 V 2 Output Bias Current (Iout) ---- 10 mA 3 Table 5: Absolute Maximum Ranges Notes: 1. 2. 3. 4. 5. 6. 7. Under normal operating conditions the substrate voltage should be above +7 V, but may be pulsed to 40 V for electronic shuttering. Care must be taken in handling so as not to create static discharge which may permanently damage the device. Per Output. Iout affects the band-width of the outputs. R should never be more positive than VSUB. The tolerance on all relative humidity values is provided due to limitations in measurement instrument accuracy. The image sensor shall continue to function but not necessarily meet the specifications of this document while operating at the specified conditions. Refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible Lighting Conditions. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 20 KAI-1010 Image Sensor DC OPERATING CONDITIONS SYMBOL DESCRIPTION VRD Reset Drain MIN. NOM. MAX. UNITS PIN IMPEDANCE6 8.5 9 9.5 V 5 pF, > 1.2 M IRD Reset Drain Current VSS Output Amplifier Return & OG 0 V ISS Output Amplifier Return Current 5 mA VDD Output Amplifier Supply Iout Output Bias Current WELL P-well GND 0.2 12 NOTES mA 30 pF, >1.2 M 15.0 15.0 V 5 10 mA 30 pF, >1.2 M ---- 0.0 ---- V Ground ----- 0.0 ---- V FDG Fast Dump Gate -7.0 -6.0 -5.5 V 20 pF, >1.2 M 2 SUB Substrate 7 Vsub 15 V 1 nF, >1.2 M 3, 8 IDHA, IDHB Input Diode A, B Horizontal CCD 12.0 15.0 15.0 V 5 pF, > 1.2 M 4 5 Common 1 1 Table 6: DC Operating Conditions Notes: 1. 2. 3. 4. 5. 6. 7. 8. The WELL and GND pins should be connected to P-well ground. The voltage level specified will disable the fast dump feature. This pin may be pulsed to Ves=40 V for electronic shuttering Electrical injection test pins. Connect to VDD power supply. Per output. Note also that Iout affects the bandwidth of the outputs. Pins shown with impedances greater than 1.2 Mohm are expected resistances. These pins are only verified to 1.2 Mohm. The operating levels are for room temperature operation. Operation at other temperatures may or may not require adjustments of these voltages. Refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible Lighting Conditions. Figure 10: Recommended Output Structure Load Diagram www.truesenseimaging.com Revision 1.0 PS-0021 Pg 21 KAI-1010 Image Sensor AC CLOCK LEVEL CONDITIONS SYMBOL V1 DESCRIPTION Vertical CCD Clock V2 Vertical CCD Clock H1A 1 Horizontal CCD A Clock H1B4 1 Horizontal CCD B Clock (single register mode) H1B4 1 Horizontal CCD B Clock (dual register mode) H2 2 Horizontal CCD Clock R Reset Clock FDG3 Fast Dump Gate Clock Level Min. NOM. MAX. UNITS Low -10.0 -9.5 -9.0 V Mid 0.0 0.2 0.4 V High 8.5 9.0 9.5 V Low -10.0 -9.5 -9.0 V High 0.0 0.2 0.4 V Low -7.5 -7.0 -6.5 V High 2.5 3.0 3.5 V Low -7.5 -7.0 -6.5 V Low -7.5 -7.0 -6.5 V High 2.5 3.0 3.5 V Low -7.5 -7.0 -6.5 V High 2.5 3.0 3.5 V Low -6.5 -6.0 -5.5 V High -0.5 0.0 0.5 V Low -7.0 -6.0 -5.5 V High 4.5 5.0 5.5 V 2 PIN IMPEDANCE 25 nF, >1.2 M 25 nF, >1.2 M 100 pF, > 1.2 M 100 pF, > 1.2 M 100 pF, > 1.2 M 125 pF, > 1.2 M 5 pF, > 1.2 M 20 pF, > 1.2 M Table 7: AC Clock Level Conditions Notes: 1. 2. 3. 4. 5. The AC and DC operating levels are for room temperature operation. Operation at other temperatures may or may not require adjustments of these voltages. Pins shown with impedances greater than 1.2 Mohm are expected resistances. These pins are only verified to 1.2 Mohm. When not used, refer to DC operating condition. For single register mode, set H1B to -7.0 volts at all times rather than clocking it. This device is suitable for a wide range of applications requiring a variety of different operating conditions. Consult Truesense Imaging in those situations in which operating conditions meet or exceed minimum or maximum levels. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 22 KAI-1010 Image Sensor AC TIMING REQUIREMENTS FOR 20 MHZ OPERATION SYMBOL DESCRIPTION tR Reset Pulse Width MIN t es Electronic Shutter Pulse Width 10 t int Integration Time 0.1 t Vh Photodiode to VCCD Transfer Pulse Width t cd NOM MAX 10 UNITS NOTES nsec 25 FIGURE Figure 10 sec Figure 11 msec 1 5 sec 2 Clamp Delay 15 nsec Figure 10 t cp Clamp Pulse Width 15 nsec Figure 10 t sd Sample Delay 35 nsec Figure 10 t sp Sample Pulse Width 15 nsec Figure 10 t rd Vertical Readout Delay 10 ---- sec Figure 8 t V V1, V2 Pulse Width 3 ---- sec Figure 9 t H Clock Frequency H1A, H1B , H2 ---- 20 MHz Figure 10 t AB Line A to Line B Transfer Pulse Width 3 sec Figure 13 t Hd Horizontal Delay 3 sec Figure 9 t Vd Vertical Delay 25 nsec Figure 9 t HVES Horizontal Delay with Electronic Shutter 1 sec Figure 11 4 ---- Figure 11 Figure 8 Table 8: AC Timing Requirements for 20 MHz Operation Notes: 1. 2. Integration time varies with shutter speed. It is to be noted that smear increases when integration time decreases below readout time (frame time). Photodiode dark current increases when integration time increases, while CCD dark current increases with readout time (frame time). Antiblooming function is off during photodiode to VCCD transfer. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 23 KAI-1010 Image Sensor Frame Timing - Single Register Readout 1 Frame = 1024 Lines Frame Time V1 2 1 0 1023 1022 t rd t Vh V1 V2 1021 1020 1019 1018 4 3 2 1 0 1023 1022 V2 1021 1022 1023 0 Figure 11: Frame Timing - Single Register Readout Note: 1. When no electronic shutter is used, the integration time is equal to the frame time. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 24 KAI-1010 Image Sensor Line Timing - Single Register Readout V1 t V t d V2 t Vd R H1B held low for single register operation Em pty Shift Register Phases Dark Referenc e Pixels 1012 1013 1014 1015 1016 1017 1018 1019 1020 1021 1022 1023 1024 1025 1026 1027 1028 1029 1030 1031 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 21 22 Line Content Photoac tive Pixels Figure 12: Line Timing - Single Register Output www.truesenseimaging.com Revision 1.0 PS-0021 Pg 25 KAI-1010 Image Sensor Pixel Timing - Single Register Readout tH= 50ns m in 1 c ount = 1 Pixel H1A H2 R tR Referenc e Signal VOUTA tc d tc p CLAMP tsp SAMPLE tsd Signal VIDEO AFTER DOUBLE CORRELATED SAMPLING (INVERTED) Referenc e Figure 13: Pixel Timing Diagram - Single Register Readout www.truesenseimaging.com Revision 1.0 PS-0021 Pg 26 KAI-1010 Image Sensor Electronic Shutter Timing - Single Register Readout Elec tronic Shutter - Fram e Tim ing V1 V2 Integration tim e tint VES (SUB) Elec tronic Shutter - Plac em ent V1 V2 H1A H2 t HVES VES (SUB) t es Elec tronic Shutter - Operating Voltages Ves VES (SUB) Referenc e Vsub Figure 14: Electronic Shutter Timing Diagram - Single Register Readout www.truesenseimaging.com Revision 1.0 PS-0021 Pg 27 KAI-1010 Image Sensor Frame Timing - Dual Register Readout 1 Frame = 512 Lines Pairs Frame Time V1 4,5 2,3 0,1 trd tVh V1 V2 1022,1023 1020,1021 1018,1019 1016,1017 1014,1015 1012,1013 8,9 6,7 4,5 2,3 0,1 1022,1023 1020,1021 V2 1018,1019 1020,1021 1022,1023 0,1 Figure 15: Frame Timing - Dual Register Readout Note: 1. When no electronic shutter is used, the integration time is equal to the frame time. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 28 KAI-1010 Image Sensor Line Timing - Dual Register Readout V1 t Vd t V t V t V t d V2 t R Em pty Shift Register Phases Dark Referenc e Pixels 1012 1013 1014 1015 1016 1017 1018 1019 1020 1021 1022 1023 1024 1025 1026 1027 1028 1029 1030 1031 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 21 22 Line Content Photoac tive Pixels Figure 16: Line Timing - Dual Register Output www.truesenseimaging.com Revision 1.0 PS-0021 Pg 29 KAI-1010 Image Sensor Pixel Timing - Dual Register Readout tH= 50ns m in 1 c ount = 1 Pixel H1A H1B H2 R tR Referenc e Signal VOUTA tc d tc p CLAMP tsp SAMPLE tsd Signal VIDEO AFTER DOUBLE CORRELATED SAMPLING (INVERTED) Referenc e Figure 17: Pixel Timing Diagram - Dual Register Readout www.truesenseimaging.com Revision 1.0 PS-0021 Pg 30 KAI-1010 Image Sensor Fast Dump Timing - Removing Four Lines V1 V2 FDG H1A H1B H2 Dumped Line #4 Valid Line V2 Valid Line Dumped Line #3 Dumped Line #2 Dumped Line #1 End of a Valid Line R V2 min 0.5 sec min 0.5 sec FDG FDG Fast Dump Rising Edge wrt V2 Falling Edge Fast Dump Falling Edge wrt V2 Falling Edge V2 max 0.1 sec FDG Fast Dump Falling Edge wrt V2 Rising Edge Figure 18: Fast Dump Timing - Removing Four Lines www.truesenseimaging.com Revision 1.0 PS-0021 Pg 31 KAI-1010 Image Sensor Binning - Two to One Line Binning V1 V2 H1A H1B H2 R tV tVd tHd Figure 19: Binning - 2 to 1 Line Binning www.truesenseimaging.com Revision 1.0 PS-0021 Pg 32 KAI-1010 Image Sensor Timing - Sample Video Waveform Figure 20: Sample Video Waveform at 5MHz www.truesenseimaging.com Revision 1.0 PS-0021 Pg 33 KAI-1010 Image Sensor Storage and Handling CLIMATIC REQUIREMENTS ITEM DESCRIPTION Operation to Specification Storage Temperature MIN. MAX. UNITS CONDITIONS NOTES -25 +40 C @ 10% 5% RH 1, 2 Humidity 10 86 %RH @ 36 2 C Temp. 1, 2 Temperature -55 +70 C @ 10% 5%RH 2, 3 Humidity ----- 95 %RH @ 49 2 C Temp. 2, 3 Table 9: Climatic Requirements Notes: 1. 2. 3. The image sensor shall meet the specifications of this document while operating at these conditions. The tolerance on all relative humidity values is provided due to limitations in measurement instrument accuracy. The image sensor shall meet the specifications of this document after storage for 15 days at the specified condition ESD 1. This device contains limited protection against Electrostatic Discharge (ESD). ESD events may cause irreparable damage to a CCD image sensor either immediately or well after the ESD event occurred. Failure to protect the sensor from electrostatic discharge may affect device performance and reliability. 2. Devices should be handled in accordance with strict ESD procedures for Class 0 (<250 V per JESD22 Human Body Model test), or Class A (<200 V JESD22 Machine Model test) devices. Devices are shipped in static-safe containers and should only be handled at static-safe workstations. 3. See Application Note Image Sensor Handling Best Practices for proper handling and grounding procedures. This application note also contains workplace recommendations to minimize electrostatic discharge. 4. Store devices in containers made of electro-conductive materials. COVER GLASS CARE AND CLEANLINESS 1. The cover glass is highly susceptible to particles and other contamination. Perform all assembly operations in a clean environment. 2. Touching the cover glass must be avoided. 3. Improper cleaning of the cover glass may damage these devices. Refer to Application Note Image Sensor Handling Best Practices. ENVIRONMENTAL EXPOSURE 1. Extremely bright light can potentially harm CCD image sensors. Do not expose to strong sunlight for long periods of time, as the color filters and/or microlenses may become discolored. In addition, long time exposures to a static high contrast scene should be avoided. Localized changes in response may occur from color filter/microlens aging. For Interline devices, refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible lighting Conditions. 2. Exposure to temperatures exceeding maximum specified levels should be avoided for storage and operation, as device performance and reliability may be affected. 3. Avoid sudden temperature changes. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 34 KAI-1010 Image Sensor 4. Exposure to excessive humidity may affect device characteristics and may alter device performance and reliability, and therefore should be avoided. 5. Avoid storage of the product in the presence of dust or corrosive agents or gases, as deterioration of lead solderability may occur. It is advised that the solderability of the device leads be assessed after an extended period of storage, over one year. SOLDERING RECOMMENDATIONS 1. The soldering iron tip temperature is not to exceed 370 C. Higher temperatures may alter device performance and reliability. 2. Flow soldering method is not recommended. Solder dipping can cause damage to the glass and harm the imaging capability of the device. Recommended method is by partial heating using a grounded 30 W soldering iron. Heat each pin for less than 2 seconds duration. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 35 KAI-1010 Image Sensor Mechanical Information COMPLETED ASSEMBLY Figure 21: Completed Assembly (1 of 2) Notes: 1. Cover glass is manually placed and visually aligned over die - location accuracy is not guaranteed. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 36 KAI-1010 Image Sensor Figure 22: Completed Assembly (2 of 2) Notes: 1. 2. Center of image area is offset from center of package by (-0.02, -0.06) mm nominal. Die is aligned within +/- 2 degree of any package cavity edge. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 37 KAI-1010 Image Sensor COVER GLASS Figure 23: Glass Drawing Notes: 1. 2. 3. 4. DUST/SCRATCH COUNT - 20 MICRON MAX. (ZONE-A) EPOXY: NCO-110SZ THICKNESS: 0.002" - 0.007" GLASS: SCHOTT D263 eco or equivalent DOUBLE-SIDED AR COATING REFLECTANCE a. 420nm - 435nm < 2.0% b. 435nm - 630nm < 0.8% c. 630nm - 680nm < 2.0% www.truesenseimaging.com Revision 1.0 PS-0021 Pg 38 KAI-1010 Image Sensor Quality Assurance and Reliability QUALITY AND RELIABILITY All image sensors conform to the specifications stated in this document. This is accomplished through a combination of statistical process control and visual inspection and electrical testing at key points of the manufacturing process, using industry standard methods. Information concerning the quality assurance and reliability testing procedures and results are available from Truesense Imaging upon request. For further information refer to Application Note Quality and Reliability. REPLACEMENT All devices are warranted against failure in accordance with the Terms of Sale. Devices that fail due to mechanical and electrical damage caused by the customer will not be replaced. LIABILITY OF THE SUPPLIER A reject is defined as an image sensor that does not meet all of the specifications in this document upon receipt by the customer. Product liability is limited to the cost of the defective item, as defined in the Terms of Sale. LIABILITY OF THE CUSTOMER Damage from mishandling (scratches or breakage), electrostatic discharge (ESD), or other electrical misuse of the device beyond the stated operating or storage limits, which occurred after receipt of the sensor by the customer, shall be the responsibility of the customer. TEST DATA RETENTION Image sensors shall have an identifying number traceable to a test data file. Test data shall be kept for a period of 2 years after date of delivery. MECHANICAL The device assembly drawing is provided as a reference. Truesense Imaging reserves the right to change any information contained herein without notice. All information furnished by Truesense Imaging is believed to be accurate. Life Support Applications Policy Truesense Imaging image sensors are not authorized for and should not be used within Life Support Systems without the specific written consent of Truesense Imaging, Inc. www.truesenseimaging.com Revision 1.0 PS-0021 Pg 39 KAI-1010 Image Sensor Revision Changes MTD/PS-0502 Revision Number Description of Revision 0.0 Revision 0 is the original version of the document 1.0 Revision 1.0 changes name from KAI-1001C to KAI-1001 series and includes data on all series imagers 2.0 Entire spec revised 3.0 Entire spec revised 4.0 Changed from KAI-1001 series to KAI-1010. Added cluster closeness specification, 4 good pixels between cluster defects. 5.0 Changed defect and grades. Added frame rate table and angle QE. 6.0 Added Web and e-mail references to footers. Added pixel 1,1 locator to figure 7, Pinout diagram. Corrected missing reference to figure 16 in Electro-Optical for KAI-1010CM note 2. Removed reference to KAI-1001 from both color and mono QE curves. Removed boxes around vertical and horizontal labels on angle QE figure. Removed boxes around labels on frame rate figure, added arrows from labels to curves. Corrected figure 21 Vsat versus Vsub plot to properly position labels. Added Web and e-mail references in section 4.3 ordering information. Corrected repeat table 4 entry. Corrected frame rate versus horizontal clock frequency figure. Data for dual mode was incorrect. 7.0 Changed figure 6 label from Device Drawing #6 Die Placement to Device Drawing - Die Placement. Added figure 16, Fast Dump Timing. Added figure 17, Binning - 2 to 1 line binning. Added figure 18, Sample Video Waveform at 5MHz. In Appendix 1, Part Numbers, changed references from taped on glass to snap-on lid. 8.0 Updated page layout. Color version of part updated to use improved material. Naming of color part changed from KAI-1010CM to KAI-1011CM. Page 13 - Added cautions pertaining to ESD and glass cleaning. Page 26 - Color PRNU value changed from 5 to 15. Units clarified to % Peak to Peak. Page 28 - Monochrome PRNU value changed from 5 to 10. Units clarified to % Peak to Peak. Page 27 - Updated color quantum efficiency graph to new KAI-1011CM. Page 35 - Updated quality Assurance and Reliability section. Page 36 - Appendix 1 replaced with Available Part Configurations. 9.0 Page 8 - Figure 5 - CFA Pattern - corrected pattern. First active line is blue/green. Previous versions on the specification incorrectly had the first active line as green/red. Note: the color filter pattern has not been physically changed on the device. Page 35 - Update Storage and Handling Section. Page 36 - Updated Quality Assurance and Reliability section. 10.0 Page 37 - removed KAI-1010 monochrome sealed quartz glass configuration. This configuration has been obsoleted. 11.0 12.0 Obsoleted KAI-1011-CBA and KAI-1010-AAA products 13.0 Added the note "Refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible Lighting Conditions" to the following sections o Electronic Shutter o Absolute Maximum Ratings o DC Operating Conditions o Storage and Handling Changed cover glass material to D263T eco or equivalent Updated format Updated Summary Specification Updated completed assembly drawing Added cover glass drawing Updated ordering information www.truesenseimaging.com Revision 1.0 PS-0021 Pg 40 KAI-1010 Image Sensor PS-0021 Revision Number 1.0 Description of Changes Initial release with new document number, updated branding and document template Updated Storage and Handling and Quality Assurance and Reliability sections www.truesenseimaging.com (c)Truesense Imaging Inc., 2012. TRUESENSE is a registered trademark of Truesense Imaging, Inc. Revision 1.0 PS-0021 Pg 41