General Specifications
Surface Mount Terminations
16 Watts, 50
Model RFP-250250-4Z50-2
Resistive Element: Thick film
Substrate: Beryllium oxide ceramic
Terminals: Thick film silver
Outline Drawing
.040
.175
.037
.065 .120
.070
.030
.250
.250
RF PAD
50
Z
RFP
HATCHED AREA INDICATES
LOCATION OF PROTECTIVE COATING
SIDE VIEW BOTTOM VIEW TOP VIEW
Notes: Tolerance is ±.010, unless otherwise specified. Operating
temperature is -55°C to +125°C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value: 50 ohms, ±2%
Frequency Range: DC - 3.0 GHz
Power: 16 Watts
V.S.W.R.: 1.25:1
Surface Mount Terminations
Features
•DC - 3.0 GHz
•16 Watts
•BeO Ceramic
•Non-Nichrome Resistive
Element
•Low VSWR
•100% Tested
Ω
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Available on Tape and Reel for Pick and Place Manufacturing.
VER. 12/5/01
1251007550
100
75
50
25
0
25
% OF RATED POWER
P.C.B. SOLDER INTERFACE TEMPERATURE °C
Surface Mount Terminations
Model RFP-250250-4Z50-2
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating Suggested Mounting Procedures
Available on Tape and Reel for Pick and Place Manufacturing.
(2 PLS.)
SCREW
SOLDER
PASTE
PC BOARD
HEATSINK
SOLDER
FILLED VIA
1. Solder part in place using 60/40 type solder with controlled
temperature iron (700°F).
2. Drill thermal vias through PCB and fill with solder, such as
60/40 type.
3. To ensure good thermal connectivity to heat sink, drill and
tap heatsink and mount PCB board to heat sink using
screws.
