AP561-F
0.7-2.9 GHz 8W HBT Power Amplifier
Datasheet: Rev B 09-17-13 - 8 of 17 - Disclaimer: Sub
ect to change without notice
© 2013 TriQuint www.triquint.com
Bill of Material – AP561-PCB2350
Reference Des. Value Description Manuf. Part Number
N/A N/A Printed Circuit Board – FR4
U1 N/A 0.7-2.9 GHz 8W Power Amplifier TriQuint AP561-F
C1, C7, C18 22 pF Cap, Chip, 0603, 50V, 5%, NPO various
C5 100 pF Cap, Chip, 0603, 50V, 5%, NPO various
C4, C11 1000 pF Cap, Chip, 0603, 50V, 5%, NPO various
C12 0.1 uF Cap, Chip, 0603, 50V, 5%, NPO various
C13 10 uF Cap, Tantalum, 6032, 35V, 10% various
R2 10 KΩ Resistor, Chip, 0603, 5%, 1/16W various
R7 280 Ω Resistor, Chip, 0603, 1%, 1/16W various
R1 200 Ω Resistor, Chip, 0805, 1%, 1/16W various
FB1 N/A Ferrite Bead, 100 MHz various
C22 3.0 pF Cap, Chip, 0603, 50V, +/-0.05pF AVX 06035J3R0ABSTR
C21 5.6 pF Cap, Chip, 0603, 50V, +/-0.05pF AVX 06035J5R6ABSTR
C23 1.0 pF Cap, Chip, 0603, 50V, +/-0.05pF AVX 06035J1R0ABSTR
C20 2.0 pF Cap, Chip, 0603, 50V, +/-0.05pF AVX 06035J2R0ABSTR
L1 18 nH Ind, Chip, 0805, 5%, Ceramic Coilcraft 0805HQ-18NXJC
R8 51 Ω Resistor, Chip, 0603, 1%, 1/16W various
D1 N/A TVS Diode Array, 5V, SOT23, 2Ch On-Semiconductor SM05T1G
D2 N/A Diode TVS, 33V, 400W, 5% SMA On-Semiconductor 1SMA33AT3G
AP561-PCB2350 Evaluation Board (2300−2400 MHz)
C20
C22 L1
C23
R7
FB1
C18
R1
1
2
3
4
5
6
7
U
1
14
13
12
11
10
9
8
C7
22 pF
J3
RF
Output
C5
100 pF
R2
10K
R7
280
D1
SM05T1G C13
10 uF
6032
C4
1000 pF
R1
200
D2
SMAJ33
Backside
Paddle
Ground
AP561
C12
0.1 uF
C20
2.0 pF
C23
1.0 pF
C22
3.0 pF
C21
5.6 pF
FB1
C11
1000 pF
C18
22 pF
J2
RF
Input
C1
22 pF
R8
51
L1
18 nH
(0805)
Notes:
1. See Evaluation Board PCB Information section for material and stack-up.
2. All components are of 0603 size unless stated on the schematic.
3. The right edge of C20 is placed at 123 mil from the AP561 RFin pin.
4. The right edge of C21 is placed at 45 mil from the AP561 RFin pin.
5. The left edge of C22 is placed at 30 mil from the AP561 RFout pin.
6. The left edge of C23 is placed at 280 mil from the AP561 RFout pin.
7. Do not exceed 5.5V on Vpd or damage to D1 will occur. Do not exceed 13V on Vcc or damage to D2 will occur.
8. The primary RF microstrip line is 50 . The RF trace is cut at component C21 for this particular reference design.