© Semiconductor Components Industries, LLC, 2015
August, 2017 − Rev. 2
1Publication Order Number:
MBRS3201P/D
MBRS3201P
200V, 3A Schottky
Fast Soft-Recovery
Power Rectifier
SMC Power Surface Mount Package
Features
•Lower Forward Voltage than any Ultrafast Rectifier:
VF < 0.59 V at 150°C
•Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns
•Soft Recovery Characteristics: Softness Factor (tb/ta) ≥ 1
•Highly Stable Over Temperature
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Benefits
•Significantly Reduced EMI
•Eliminates the Need of Snubber Circuits
•Low Switching and Heat Losses
•Improved Thermal Management
Applications
•Engine and Convenience Control Systems
•Motor Controls
•Battery Chargers and Switching Power Supplies
Mechanical Characteristics
•Small Compact Surface Mount Package with J-Bend Leads
•Rectangular Package for Automated Handling
•Weight: 217 mg (Approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•ESD Ratings:
♦Machine Model = A
♦Human Body Model = 1C
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
•Cathode Polarity Band
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Device Package Shipping†
ORDERING INFORMATION
SCHOTTKY RECTIFIER
3 AMPS, 200 VOLTS
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
MBRS3201PT3G SMC 2−Lead
(Pb−Free)
2500 /
Tape & Reel
B321 = Specific Device Code
A = Assembly Location*
Y = Year
WW = Work Week
G= Pb−Free Package
MARKING DIAGRAM
(Note: Microdot may be in either location)
AYWW
B3xG
G
SMC 2−LEAD
CASE 403AC
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
MBRS3201P
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2
MAXIMUM RATINGS
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
200 V
Average Rectified Forward Current (Rated VR, TC = 70°C) IF(AV) 3 A
Nonrepetitive Peak Surge Current IFSM 100 A
Operating Junction Temperature TJ−55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance, Junction−to−Lead RqJL 12 °C/W
Thermal Resistance, Junction−to−Ambient RqJA 60 °C/W
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage
(IF = 3 A, TJ = 25°C)
(IF = 3 A, TJ = 150°C)
VF0.84
0.59
V
Maximum Instantaneous Reverse Current (Rated VR)
(Rated DC Voltage, TJ = 25°C)
(Rated DC Voltage, TJ = 150°C)
IR1.0
5.0
mA
mA
Maximum Reverse Recovery Time
(IF = 1 A, di/dt = 100 A/ms, VR = 30 V)
trr 35
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
TYPICAL CHARACTERISTICS
0.1
1.0
10
100
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
VF
, INSTANTANEOUS VOLTAGE (V)
IF
, FORWARD CURRENT (A)
25°C
150°C
100°C
Figure 1. Typical Forward Voltage
0.1
1.0
10
100
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
VF
, INSTANTANEOUS VOLTAGE (V)
IF
, FORWARD CURRENT (A)
25°C
150°C
100°C
Figure 2. Maximum Forward Voltage
MBRS3201P
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3
TYPICAL CHARACTERISTICS
VR, REVERSE VOLTAGE (V)
IR, REVERSE CURRENT (A)
Figure 3. Typical Reverse Current
1E−9
1E−8
1E−7
1E−6
1E−5
1E−4
1E−3
1E−2
1E−1
0 20 40 60 80 100 120 140 160 180 200
150°C
100°C
25°C
Figure 4. Maximum Reverse Current
1.0E−06
1600 20 40 60 80 100
VR, REVERSE VOLTAGE (V)
120 140 180 200
IR, MAXIMUM REVERSE CURRENT (A)
TC = 25°C
TC = 150°C
1.0E−05
1.0E−04
1.0E−03
1.0E−02
1.0E−01
C, CAPACITANCE (pF)
1.0
10
100
1000
0 20 40 60 80 100 120 140 160 180 200
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
DC
SQUARE
VR, REVERSE VOLTAGE (V)
PFO, AVERAGE POWER DISSIPATION (W)
Figure 5. Typical Capacitance
IO, AVERAGE FORWARD CURRENT
Figure 6. Power Dissipation
0
1
2
3
4
5
6
7
80 90 100 110 120 130 140 150 160
IF
, AVERAGE FORWARD CURRENT (A)
TL, LEAD TEMPERATURE (°C)
Figure 7. Derating Curve
DC
SQUAREWAVE
MBRS3201P
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4
PACKAGE DIMENSIONS
J
SMC 2−LEAD
CASE 403AC
ISSUE B
J
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
E
b
D
c
L
A1
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD
FLASH SHALL NOT EXCEED 0.254mm PER SIDE.
4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H.
5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA
DETERMINED BY DIMENSION L.
TOP VIEW
SIDE VIEW END VIEW
H
DETAIL A
DETAIL A
SOLDERING FOOTPRINT*
8.750
0.344
3.790
0.149
2.250
0.089 ǒmm
inchesǓSCALE 4:1
DIM
A2
MIN MAX MIN
MILLIMETERS
1.90 2.41 0.075
INCHES
A1 0.05 0.20 0.002
b2.90 3.20 0.114
c0.15 0.41 0.006
D5.55 6.25 0.219
E6.60 7.15 0.260
L0.75 1.60 0.030
0.095
0.008
0.126
0.016
0.246
0.281
0.063
MAX
7.75 8.15 0.305 0.321
HE
2X
2X
E
A2
A1.95 2.61 0.077 0.103
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Phone: 81−3−5817−1050
MBRS3201P/D
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