This document was generated on 12/18/2019 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736590003 Active HDM Backplane Connector System HDM Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 12 Circuits, Gold (Au) 0.76m, Pin Length 3.00mm Documents: 3D Model 3D Model (PDF) Drawing (PDF) Packaging Specification PK-70873-0819 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA UL LR19980 E29179 EU ELV Not Relevant General Product Family Series Application Comments Component Type Overview Product Name UPC Backplane Connectors 73659 Backplane Midplane Power Module, Midplane Power Module Power Header HDM Backplane Connector System HDM 800755024845 Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Net Weight Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length PCB Locator PCB Retention PCB Thickness - Recommended Packaging Type Pitch - Mating Interface Pitch - Termination Interface Plating min - Mating Plating min - Termination Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style EU RoHS China RoHS Compliant REACH SVHC Not Contained Per ED/71/2019 (16 July 2019) Halogen-Free Status Low-Halogen For more information, please visit Contact US 12 12 Black 250 No 94V-0 No None Beryllium Copper Gold Tin High Temperature Thermoplastic 1.609/g 1 Open Pin Field 3 Vertical 3.00mm No Yes 2.50mm Tube 2.00mm 2.00mm 0.762m 3.810m No Yes Yes -55 to +105C Through Hole China ROHS ELV RoHS Phthalates Green Image Not Relevant Not Contained Search Parts in this Series 73659 Series Mates With 73651 HDM Board-to-Board Daughterboard Power Module Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15.0A 1.0 Gbps 38 Yes 500V AC Solder Process Data Lead-freeProcess Capability Process Temperature max. C REFLOW 260 Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing PK-70873-0819 SDA-73659-000X This document was generated on 12/18/2019 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION