SN54AHC132, SN74AHC132
QUADRUPLE POSITIVE-NAND GATES
WITH SCHMITT-TRIGGER INPUTS
SCLS365G – MAY 1997 – REVISED SEPTEMBER 2002
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Operating Range 2-V to 5.5-V VCC
D
Operation From Very Slow Input
Transitions
D
Temperature-Compensated Threshold
Levels
D
High Noise Immunity
D
Same Pinouts as ’AHC00
D
Latch-Up Performance Exceeds 250 mA Per
JESD 17
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN54AHC132 ...J OR W PACKAGE
SN74AHC132 . . . D, DB, DGV, N, NS,
OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
1B
1A
NC
3Y
3A V
4B
2Y
GND
NC
SN54AHC132 . . . FK PACKAGE
(TOP VIEW)
CC
NC – No internal connection
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1B
1Y
2A
2B
2Y
GND
VCC
4B
4A
4Y
3B
3A
3Y
4A
NC
4Y
NC
3B
1Y
NC
2A
NC
2B
SN74AHC132 . . . RGY PACKAGE
(TOP VIEW)
114
78
2
3
4
5
6
13
12
11
10
9
4B
4A
4Y
3B
3A
1B
1Y
2A
2B
2Y
1A
3Y V
GND
CC
description/ordering information
The ’AHC132 devices are quadruple positive-NAND gates designed for 2-V to 5.5-V VCC operation.
These devices perform the Boolean function Y = A • B or Y = A + B in positive logic.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
QFN – RGY Tape and reel SN74AHC132RGYR HA132
PDIP – N Tube SN74AHC132N SN74AHC132N
SOIC – D
Tube SN74AHC132D
AHC132
–40
°
Cto85
°
C
SOIC
–
D
Tape and reel SN74AHC132DR
AHC132
–
40°C
to
85°C
SOP – NS Tape and reel SN74AHC132NSR AHC132
SSOP – DB Tape and reel SN74AHC132DBR HA132
TSSOP – PW Tape and reel SN74AHC132PWR HA132
TVSOP – DGV Tape and reel SN74AHC132DGVR HA132
CDIP – J Tube SNJ54AHC132J SNJ54AHC132J
–55°C to 125°CCFP – W Tube SNJ54AHC132W SNJ54AHC132W
LCCC – FK Tube SNJ54AHC132FK SNJ54AHC132FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Copyright 2002, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SN54AHC132, SN74AHC132
QUADRUPLE POSITIVE-NAND GATES
WITH SCHMITT-TRIGGER INPUTS
SCLS365G – MAY 1997 – REVISED SEPTEMBER 2002
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
Each circuit functions as a NAND gate, but because of the Schmitt action, it has different input threshold levels
for positive- and negative-going signals.
These circuits are temperature compensated and can be triggered from the slowest of input ramps and still give
clean jitter-free output signals.
FUNCTION TABLE
(each gate)
INPUTS OUTPUT
A B Y
H H L
LXH
X L H
logic diagram, each gate (positive logic)
A
B
Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) –20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DGV package 127°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): RGY package 47°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
SN54AHC132, SN74AHC132
QUADRUPLE POSITIVE-NAND GATES
WITH SCHMITT-TRIGGER INPUTS
SCLS365G – MAY 1997 – REVISED SEPTEMBER 2002
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 4)
SN54AHC132 SN74AHC132
UNIT
MIN MAX MIN MAX
UNIT
VCC Supply voltage 2 5.5 2 5.5 V
VIInput voltage 0 5.5 0 5.5 V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V –50 –50
m
A
IOH High-level output current VCC = 3.3 V ± 0.3 V –4–4
mA
VCC = 5 V ±0.5 V –8–8
mA
VCC = 2 V 50 50
m
A
IOL Low-level output current VCC = 3.3 V ±0.3 V 4 4
mA
VCC = 5 V ±0.5 V 8 8
mA
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54AHC132 SN74AHC132
UNIT
PARAMETER
TEST
CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
VT+
3 V 1.2 2.2 1.2 2.2 1.2 2.2
VT+
Positive-going 4.5 V 1.75 3.15 1.75 3.15 1.75 3.15 V
input threshold voltage 5.5 V 2.15 3.85 2.15 3.85 2.15 3.85
VT–
3 V 0.9 1.9 0.9 1.9 0.9 1.9
VT
–
Negative-going 4.5 V 1.35 2.75 1.35 2.75 1.35 2.75 V
input threshold voltage 5.5 V 1.65 3.35 1.65 3.35 1.65 3.35
∆V
3 V 0.3 1.2 0.3 1.2 0.3 1.2
∆VT
Hysteresis (VT+
–
VT)
4.5 V 0.4 1.4 0.4 1.4 0.4 1.4 V
Hysteresis
(VT
+ –
VT
–
)
5.5 V 0.5 1.6 0.5 1.6 0.5 1.6
2 V 1.9 2 1.9 1.9
IOH = –50
m
A3 V 2.9 3 2.9 2.9
VOH 4.5 V 4.4 4.5 4.4 4.4 V
IOH = –4 mA 3 V 2.58 2.48 2.48
IOH = –8 mA 4.5 V 3.94 3.8 3.8
2 V 0.1 0.1 0.1
IOL = 50
m
A3 V 0.1 0.1 0.1
VOL 4.5 V 0.1 0.1 0.1 V
IOL = 4 mA 3 V 0.36 0.5 0.44
IOL = 8 mA 4.5 V 0.36 0.5 0.44
IIVI = 5.5 V or GND 0 V to 5.5 V ±0.1 ±1* ±1
m
A
ICC VI = VCC or GND, IO = 0 5.5 V 2 20 20
m
A
CiVI = VCC or GND 5 V 1.9 10 10 pF
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54AHC132, SN74AHC132
QUADRUPLE POSITIVE-NAND GATES
WITH SCHMITT-TRIGGER INPUTS
SCLS365G – MAY 1997 – REVISED SEPTEMBER 2002
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ±0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO LOAD TA = 25°C SN54AHC132 SN74AHC132
UNIT
PARAMETER
(INPUT) (OUTPUT) CAPACITANCE MIN TYP MAX MIN MAX MIN MAX
UNIT
tPLH
CL=15
p
F
5.6* 11.9* 1* 14* 1 14
ns
tPHL
C
L =
15
pF
5.6* 11.9* 1* 14* 1 14
ns
tPLH
CL=50
p
F
7.6 15.4 1 17.5 1 17.5
ns
tPHL
C
L =
50
pF
7.6 15.4 1 17.5 1 17.5
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ±0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO LOAD TA = 25°C SN54AHC132 SN74AHC132
UNIT
PARAMETER
(INPUT) (OUTPUT) CAPACITANCE MIN TYP MAX MIN MAX MIN MAX
UNIT
tPLH
CL=15
p
F
3.9* 7.7* 1* 9* 1 9
ns
tPHL
C
L =
15
pF
3.9* 7.7* 1* 9* 1 9
ns
tPLH
CL=50
p
F
5.3 9.7 1 11 111
ns
tPHL
C
L =
50
pF
5.3 9.7 1 11 111
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 5)
PARAMETER
SN74AHC132
UNIT
PARAMETER
MIN TYP MAX
UNIT
VOL(P) Quiet output, maximum dynamic VOL 0.45 0.8 V
VOL(V) Quiet output, minimum dynamic VOL –0.35 –0.8 V
VOH(V) Quiet output, minimum dynamic VOH 4.8 V
VIH(D) High-level dynamic input voltage 3.5 V
VIL(D) Low-level dynamic input voltage 1.5 V
NOTE 5: Characteristics are for surface-mount packages only.
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load, f = 1 MHz 11 pF
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54AHC132, SN74AHC132
QUADRUPLE POSITIVE-NAND GATES
WITH SCHMITT-TRIGGER INPUTS
SCLS365G – MAY 1997 – REVISED SEPTEMBER 2002
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
50% VCC
VCC
VCC
0 V
0 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Data Input
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VCC
0 V
50% VCC
50% VCC
Input
Out-of-Phase
Output
In-Phase
Output
Timing Input
50% VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Control
Output
W aveform 1
S1 at VCC
(see Note B)
Output
W aveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
≈VCC
0 V
50% VCC VOL + 0.3 V
50% VCC ≈0 V
VCC
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
TEST S1
VCC
0 V
50% VCC
tw
VOLTAGE WAVEFORMS
PULSE DURATION
Input
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
From Output
Under Test CL
(see Note A)
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
S1 VCC
RL = 1 kΩGND
From Output
Under Test CL
(see Note A)
Test
Point
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Open
50% VCC
50% VCC 50% VCC
50% VCC
50% VCC 50% VCC
50% VCC 50% VCC
VOH – 0.3 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 23-May-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74AHC132D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132DBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132DGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132DGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132DGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74AHC132NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74AHC132NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132PW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 23-May-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74AHC132PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132PWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC132RGYR ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74AHC132RGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 23-May-2011
Addendum-Page 3
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74AHC132DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74AHC132DGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74AHC132DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74AHC132NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74AHC132PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74AHC132RGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74AHC132DBR SSOP DB 14 2000 367.0 367.0 38.0
SN74AHC132DGVR TVSOP DGV 14 2000 367.0 367.0 35.0
SN74AHC132DR SOIC D 14 2500 367.0 367.0 38.0
SN74AHC132NSR SO NS 14 2000 367.0 367.0 38.0
SN74AHC132PWR TSSOP PW 14 2000 367.0 367.0 35.0
SN74AHC132RGYR VQFN RGY 14 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated