www.austriamicrosystems.com Revision 1v13 12 - 157
AS3658
Data Sheet Confidential - Absolute Maximum ratings
5 Absolute Maximum ratings
Stresses beyond tho se li sted in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 13 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Tabl e 3. Absolute Maximum Ratings
Parameter Min Max Unit Note
High voltage pins (VIN_HV) -0.3 17.0 V Applicable for high voltage pins1
1. HV pins
VCHARGER, VGATE, VOFF_B, DCDC_CURR1, DCDC_CURR2, DCDC_CURR3
5V pins (VIN_MV) -0.3 7.0 V Applicable for pins 5V-pins2
2. 5V pins are
V_USB, CH_SENSE_N, CH_SENSE_P, VSUP_SW1, VSUP_SW2, VBAT_SW1, VBAT_SW2, V_BAT, SCL,
SDA, XRESET, XINT, VSUPPLY_3, CURR1_GPIO1…CURR4_GPIO4, DCDC_GATE1 , DCDC_ GATE2,
DCDC_SENSE_P1, DCDCSENSE_P2, DCDC_SENSE_N1, DCDC_SENSE_N2, DCDC_FB1, DCDC_FB2,
VCL, VCP_OUT, VCP_N, VCP_P, VCP_IN, VCP_IN, VRF1, VREF1_IN, VRF2, VRF23_IN, VRF3, VDIG1,
VDIG1_IN, VDIG2, VDIG2_IN, VDIG34_IN, VDIG_3, VDIG_4, PGATE1 VSUPPLY_1, VSUPPL Y_2, LX1, LX2,
GND_SW, VSUPPLY_4, LINE_CM, HP_CM_PWR, HP_CM, HPLx, HPRx, ALVDD, AVDD, LSP_R, BVSS,
LSP_L, AVDD, VSUPPLY_5, VSUPPLY_6
3.3V pins (VIN_LV) -0.3 5.0 V Applicable for 3.3V -Pins3
3. 3.3V pins are
ISENSEP, ISENSEN, ADC_INx, RPROGRAM, V2_5, CREF, ON, VI2S, SDIx, SCLKx, MCLKx, LRCLKx,
SDOx, SPDIF, AGND, VREF, LINL,LINR, VDAC, Q32K, XIN32, XOUT32, VBACK, MICS, MICN, MICP
Input pin current (IIN) -25 +25 mA At 25 ºC, Norm: Jedec 78
Storage Temperature Range
(Tstrg) -55 125 ºC
Humidity 5 85 % Noncondens
Electrostatic discharge 1kV (VESD) -1000 1000 V Norm: MIL 88 3 E Method 3015; Setup4
Applicable for pins: all
4. The following pins are connected to ESD setup:
VSUPPLY_1...VSUPPLY_6, VCP_IN, VRF1_IN, VRF2_IN, VCURR connected together
VDIG1_IN, VDIG2_IN, VDIG34_IN connected together
AVDD, ALVDD conne cted together
VBAT_SW1 and VBAT_SW2 connected together
VSUP_SW1 and VSUP_SW2 connected together
All VSS connected together
Total Power Dissipation 1W TA = 70ºC
0.72 W TA = 84ºC
Package Body Temperature 260 °C IPC/JEDEC J-STD-020C, reflects moisture
sensitivity level only
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Solder Profile5
5. austriamicrosystems strongly recommends to use underfill.
235 245 °CTPEAK
30 45 s DWell, above 217 °C
Moisture Sensitive Level 3 1 Represents a max. floor live time of 168h
ams AG
Technical content still valid