BU4081BFVE2 - ROHM SEMICONDUCTOR

Datashee

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General Purpose CMOS Logic IC

Quad 2-Input AND Gate

BU4081B BU4081BF BU4081BFV

General Description

BU4081B, BU4081BF, BU4081BFV consist of four

independent 2-input AND gates. An inverter-based buffer

is incorporated at the gate output to improve I/O

transmission characteristics, and it minimizes a variation in

the propagation time caused by an increase in the load

capacitance.

Features

 Low Power Consumption

 High Noise Immunity

 Wide Operating Suppl y Voltage Range

 High Input Impedance

 High Fan Out

 2 L-TTL Inputs or 1 LS-TTL Input can be directly driven

 All Outputs are buffered

Pin Configurations

(Top View)

Truth Table

Key Specifications

 Operating Supply Voltage Range: +3V to +16V

 Input Voltage Range: 0V to VDD

 Operating Temperature Range: -40°C to +85°C

Packages W(Typ) x D(Typ) x H(Max)

DIP14 19.40mm x 6.50mm x 7.95mm

SOP14 8.70mm x 6.20mm x 1.71mm

SSOP-B14 5.00mm x 6.40mm x 1.35mm

INPUT OUTPUT

A B O

L L L

L H L

H L L

H H H

○Product structure: Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays

DIP14

BU4081B SOP14

BU4081BF

SSOP-B14

BU4081BFV

O4 B4 B3 O3 A3A4 VDD

O2 O1 A2 B2 VSS B1 A1

Datasheet

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Pin Descriptions

Absolute Maximum Ratings

(Note 1) Reduce 9.5mW per 1°C above 25°C

(Note 2) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 4.5mW per 1°C above 25°C

(Note 3) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 7.0mW per 1°C above 25°C

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated

over the absolute maximum ratings.

Recommended Operating Conditions

Pin No. Pin Name I/O Function

1 A1 I Input1

2 B1 I Input1

3 O1 O Output1

4 O2 O Output2

5 B2 I Input2

6 A2 I Input2

7 VSS - Ground

8 A3 I Input3

9 B3 I Input3

10 O3 O Output3

11 O4 O Output4

12 B4 I Input4

13 A4 I Input4

14 VDD - Power supply

Parameter Symbol Rating Unit

Supply Voltage VDD -0.3 to +18.0 V

Input Voltage VIN -0.3 to VDD+0.3 V

Input Current IIN ±10 mA

Operating Temperature Topr -40 to +85 °C

Storage Temperature Tstg -55 to +150 °C

Maximum Junction Temperature Tjmax +150 °C

Power Dissipation Pd

DIP14 1.18

(Note 1)

W SOP14 0.56

(Note 2)

SSOP-B14 0.87 (Note 3)

Parameter Symbol Rating Unit

Supply Voltage VDD +3.0 to +16.0 V

Input Voltage VIN 0 to VDD V

Datasheet

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Electrical Characteristics

(Unless otherwise specified, VSS=0V, Ta=25°C)

DC Characteristics

Parameter Symbol Limits Unit Conditions Figure

No.

Min Typ Max VDD(V)

Input “H” voltage VIH

3.5 - -

7.0 - - 10 2

11.0 - - 15 3

Input “L” voltage VIL

- - 1.5

- - 3.0 10 2

- - 4.0 15 3

Input “H” current IIH - - 0.3

μA15 VIH=15V -

Input “L” current IIL - - -0.3

μA15 VIL=0V -

Output “H” voltage VOH

4.95 - -

IOH=0mA

9.95 - - 10 2

14.95 - - 15 3

Output “L” voltage VOL

- - 0.05

IOL=0mA

- - 0.05 10 2

- - 0.05 15 3

Output “H” current IOH

-0.16 - -

5 VOH=4.6V

4 -0.4 - - 10 VOH=9.5V

-1.2 - - 15 VOH=13.5V

Output “L” current IOL

0.44 - -

5 VOL=0.4V

1.1 - - 10 VOL=0.5V

3.0 - - 15 VOL=1.5V

Quiescent supply current IDD

- - 1

μA

VIN=VDD or VSS - - - 2 10

- - 4 15

Switching Characteristics

Parameter Symbol Limits Unit

Conditions Figure

No.

Min Typ Max VDD(V)

Output rising time tTLH

- 180 -

CL=50pF 6 - 90 - 10

- 65 - 15

Output falling time tTHL

- 100 -

CL=50pF 7 - 50 - 10

- 40 - 15

“L” to ”H”

Propagation delay time tPLH

- 160 -

CL=50pF 8 - 65 - 10

- 50 - 15

“H” to ”L”

Propagation delay time tPHL

- 160 -

CL=50pF 9 - 65 - 10

- 50 - 15

Input capacitance CIN - 5 - pF - - -

Datasheet

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Test Circuits (one AND circuit only)

VOH

1 . V IH

VIL

VOL

2.VIL

VOH

3 . V OH

VIL

4.VOL

IH IOH

5 . I OH

VIL

6.IOL

VOH

VOL

+ +

90%

50%

10%

90%

50%

10%

20ns 20ns

tTLH tTHL

tPLH tPHL

INPUT

OUTPUT

CL=50pF

7. tTLH, tTHL, tPLH, tPHL

INPUT

OUTPUT

Description of Symbols

tPHL : Time from 50% of the rise edge of input waveform to 50% of

the rise edge of output waveform

tPLH : Time from 50% of the fall edge of input waveform to 50% of

the fall edge of output waveform

tTHL : Time from 90% to 10% of rise edge of output waveform

tTLH : Time from 10% to 90% of fall edge of output waveform

Datasheet

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Typical Performance Curves

-50

-40

-30

-20

-10

05101520

Ou tput Vo lt ag e [V]

Outp ut "H" Current [mA]

051015

Input Voltage [V]

Output Voltage [V]

0123456

Input Voltag e [V]

Output Vo ltage [V]

Figure 1. Output Voltage vs Input voltage

（VDD=5V / VSS=0V） Figure 2. Output Voltage vs Input voltage

（VDD=10V / VSS=0V）

Figure 3. Output Voltage vs Input voltage

（VDD=15V / VSS=0V） Figure 4. Output “H” current vs Output voltage

85℃ 25℃ -40℃

85℃

25℃

-40℃

VDD=10V

VDD=5V

VDD=15V

85℃

25℃

-40℃

85℃

25℃

-40℃

024681012

In put Vol tage [V ]

Out put Vol t age [ V ]

85℃ 25℃ -40℃

Datasheet

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Typical Performance Curves - continued

100

150

200

-50-250 255075100

Ambient Temperature [°C]

Prop agation Dela y Ti me [ns ]

100

150

200

-50 -25 0 25 50 75 100

Ambient Temperature [°C]

Output Fall Time [ns]

100

150

200

-50 -25 0 25 50 75 100

Ambient Temperature [°C]

Output Rise Time [ns]

05101520

Output Voltage [V]

Output "L " Current [mA]

Figure 5. Output “L” current vs Output voltage Figure 6. Output rising time tTLH

-40℃

85℃

25℃

℃

=15V

VDD=5V

85℃

25℃

-40℃ VDD=10V

85℃

25℃

Operating Temperature Range

VDD=3V

VDD=5V

VDD=18V

VDD=10V

VDD=3V

VDD=5V

VDD=18V

VDD=10V

Operating Temperature Range

VDD=3V

VDD=5V

VDD=18V

VDD=10V

Operating Temperature Range

Figure 7. Output falling time tTHL Figure 8. ”L” to ”H” Propagation delay time tPLH

Datasheet

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Typical Performance Curves - continued

Power Dissipation

Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25°C(normal temperature). IC is heated

when it consumed po wer, and the temperature of IC chip becomes higher than am bient temperature. The temperature that

can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.

Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal

resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum

value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead

frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called

thermal resistance, represented by the symbol θja (°C/W).The temperature of IC inside the package can be estimated by

this thermal resistance. Figure 10 shows the model of thermal resistance of the package. Thermal resistance θja, ambient

temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below:

θja = (Tjmax-Ta) / Pd (°C/W)

Derating curve in Figure 11 indicates power that can be consum ed by IC with reference to ambient temperature. Po wer that

can be consumed by IC with reference to ambient tem perature. Power that can be consumed by IC begins to attenuate at

certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on

chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of

package is used. Thermal reduction curve indicates a reference value measured at a specified condition.

100

150

200

-50 -25 0 25 50 75 100

Ambient Temperature [°C]

Prop agation Dela y Ti me [ns ]

Figure 9. “H” to ”L” Propagation delay time tPHL

VDD=3V

VDD=5V

VDD=18V

VDD=10V

Operating Temperature Range

Figure 11. Derating Curve

Figure 10. Thermal resistance

周囲温度 Ta [℃]

チップ表面温度 Tj [℃]

消費電力 P [ W]

Ambient temperature Ta (℃)

Chip sur face tem perature Tj (℃)

Power dissipation Pd (W)

θja=(Tjmax-Ta)/Pd (°C/W)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0 25 50 75 100 125 150

Ambient Temperature [℃]

Powe r Dis s ip at ion [W]

BU4081B (DIP14)

BU4081BF (SOP14)

BU4081BFV(SSOP-B14)

Datasheet

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I/O Equivalence Circuit

Port

Number Input Ports Output Ports

1,2,5,6,8,9,12,13 3,4,10,11

Equivalence

Circuit

Operational Notes

1. Reverse Connection of Pow er Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-si gnal and large-current ground traces, the t wo ground traces s hould be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as pos sible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of excee ding this absolute maximum rating,

increase the board size and copper area to prevent exceeding the Pd ratin g.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be appro ximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush c urrent may flo w

instantaneously due to the internal powering sequence and del ays, especially if the IC has more tha n o ne power supply.

Therefore, give special consideratio n to power coupling capacitanc e, power wiring, width of ground wiring, and routing

of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

VDD

GND

VDD

GND

VDD VDD

GND GND

VSS VSS VSS VSS

VDD VDD

Datasheet

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Operational Notes - conti nued

9. Testing on Application Boards

When testing the IC on an applicati on board, connecting a capacitor directly to a lo w-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembl y and use simil ar precautio ns during transport and

storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting th e IC on the PCB. Incorrect mounting may result i n

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input terminals of an IC are often connected to the gate of a MO S transistor. T he gate has extremely high impedance

and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground lin e.

12. Regarding the Input Pin of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors . The operation

of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.

Therefore, conditions which cause thes e parasitic elements to operate, such as applyi ng a voltage to an input pin l ower

than the ground voltage should be avoided. F urthermore, do not apply a voltage to the input terminals when no power

supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have

voltages within the values specified in the electrical characteristics of this IC.

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nomi nal capacitance due to DC bias and others.

Datasheet

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Ordering Information

B U 4 0 8 1 B x x - E 2

Part Number. Package

None : DIP14

F : SOP14

FV : SSOP-B14

Packaging and forming specific ation

None : Tube

E2 : Embossed tape and reel

Marking Diagrams

SOP14(TOP VIEW)

BU4081BF

Part Number Marking

LOT Number

1PIN MARK

DIP14 (TOP VIEW)

BU4081B

Part Number Marking

LOT Numbe

SSOP-B14(TOP VIEW)

4081B

Part Number Marking

LOT Numbe

1PIN MARK

Datasheet

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Physical Dimensions Tape and Reel Information

Package Name DIP14

Datasheet

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Physical Dimension, Tape and Reel Information – continued

Package Name SOP14

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

()

Direction of feed

Reel 1pin

(UNIT : mm)

PKG : SOP14

Drawing No. : EX113-5001

(Max 9.05 (include.BURR))

Datasheet

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Physical Dimension, Tape and Reel Information – continued

Package Name SSOP-B14

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

()

Direction of feed

Reel 1pin

Datasheet

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Revision History

Date Revision Changes

21.Aug.2013 001

New Release

Datasheet

Notice - GE Rev.002

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice - GE Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.